CN113900545A - Display module, manufacturing method thereof and electronic equipment - Google Patents

Abstract

The embodiment of the application discloses a display module, a manufacturing method thereof and electronic equipment, wherein the display module comprises a first substrate, a second substrate, a conductive connecting part and a switching circuit board, wherein the first substrate is provided with a first circuit and is used for realizing the touch function of the display module; the second substrate and the first substrate are arranged in a stacked mode and provided with a second circuit used for achieving the display function of the display module; the conductive connecting part is electrically connected with the first circuit and the second circuit and used for switching the first circuit to the second circuit; the switching circuit board is bound on the second substrate and electrically connected with the second circuit so as to switch the first circuit and the second circuit to the mainboard of the electronic equipment.

Description

Display module, manufacturing method thereof and electronic equipment

Technical Field

The application relates to the technical field of electronics, in particular to a display module, a manufacturing method of the display module and electronic equipment.

Background

With the development of electronic devices, the screen display effect of users on the electronic devices is higher and higher. However, the screen occupation ratio of the display screen in the related art has yet to be further improved.

Disclosure of Invention

The embodiment of the application provides a display module capable of improving screen occupation ratio, a manufacturing method thereof and electronic equipment.

The display module assembly of the embodiment of the application for electronic equipment, display module assembly includes:

the first substrate is provided with a first circuit and is used for realizing the touch function of the display module;

the second substrate is stacked with the first substrate and provided with a second circuit for realizing the display function of the display module;

the conductive connecting part is electrically connected with the first circuit and the second circuit and used for switching the first circuit to the second circuit; and

and the switching circuit board is bound on the second substrate and is electrically connected with the second circuit so as to switch the first circuit and the second circuit to the mainboard of the electronic equipment.

According to some embodiments of the present application, the conductive connection portion includes a bonding wire having both ends electrically connected to the first and second lines, respectively.

According to some embodiments of the present disclosure, the first substrate includes a first bonding region, the first bonding region is located at an edge of the first substrate close to the second substrate, the first substrate is further provided with a first pad electrically connected to the first line, and the first pad is located in the first bonding region;

the second substrate comprises a second binding region, the second binding region is positioned at the edge of the second substrate close to the first substrate and corresponds to the first binding region, a second bonding pad electrically connected with the second circuit is further arranged on the second substrate, and the second bonding pad is arranged in the second binding region;

and two ends of the bonding wire are respectively welded to the first bonding pad and the second bonding pad.

According to some embodiments of the present application, the display module further includes a chip, the chip is bonded on the second substrate and electrically connected to the second line, and is configured to drive the first line and the second line.

According to some embodiments of the present application, the adapter circuit board includes a first circuit board and a second circuit board electrically connected to each other, two ends of the first circuit board are respectively bound to the second substrate and the second circuit board, and the second circuit board is electrically connected to the main board;

the display module further comprises a chip, wherein the chip is bound on the first circuit board and used for driving the first circuit and the second circuit.

According to some embodiments of the present application, the first wiring board is bound to the second substrate through an anisotropic conductive film.

According to some embodiments of the present application, the first wiring board and the second wiring board are bonded by an anisotropic conductive adhesive film.

According to some embodiments of the present application, the display module further includes a glue layer, and the glue layer covers at a joint of the conductive connection portion and the first line and the second line.

The electronic equipment of this application embodiment, electronic equipment includes the mainboard, and above-mentioned arbitrary display module assembly.

The manufacturing method of the display module in the embodiment of the application comprises the following steps:

providing a first substrate, wherein the first substrate is provided with a first circuit and is used for realizing the touch function of the display module;

providing a second substrate, wherein the second substrate and the first substrate are arranged in a stacked mode and are provided with second lines for achieving the display function of the display module;

electrically connecting the first line and the second line with a conductive connection to switch the first line to the second line;

and providing a switching circuit board which is bound on the second substrate and is electrically connected with the second circuit so as to switch the first circuit and the second circuit to a mainboard of an electronic device.

One embodiment of the above application has at least the following advantages or benefits:

the display module assembly of this application embodiment is through adopting the first circuit of electrically conductive connecting part with the first base plate and the second circuit connection of second base plate to and the technical means that the switching circuit board is bound at the second base plate and is connected with the second circuit electricity, makes first circuit can pass through electrically conductive connecting part and connects to the second circuit, and rethread switching circuit board connects first circuit and second circuit switching to electronic equipment's mainboard. Because the display module assembly of this application embodiment adopts the mode that the flexible circuit board was replaced to the electrically conductive connecting portion electricity respectively to the mode of first circuit and second circuit, owing to saved the flexible circuit board on the one hand, still saved twice and bound the technology on the basis of practicing thrift material cost, on the other hand also need not to buckle the flexible circuit board to the back of panel again, and avoid appearing the regional problem that increases the black limit distance of screen of buckling, finally reach the efficiency that improves the screen and account for the ratio.

Drawings

Fig. 1 is a schematic diagram illustrating an embodiment of a display module in the related art.

Fig. 2 is a schematic diagram illustrating another embodiment of a display module in the related art.

Fig. 3 is a schematic diagram illustrating a touch flexible printed circuit and a main flexible printed circuit of a display module in the related art when the touch flexible printed circuit and the main flexible printed circuit are bent to the back of a lower glass substrate.

Fig. 4 is a schematic diagram illustrating an embodiment of a display module according to the present application.

Fig. 5 is a schematic view illustrating the adapting circuit board of the display module according to the embodiment of the present application when being bent to the back of the second substrate.

Fig. 6 shows a partial enlarged view at K in fig. 4.

Fig. 7 is a schematic view illustrating another embodiment of a display module according to the present application.

Fig. 8 is a schematic view illustrating a first circuit board and a second circuit board of a display module according to an embodiment of the present application when the first circuit board and the second circuit board are bent to a back surface of a second substrate.

Wherein the reference numerals are as follows:

100. first substrate

101. First bonding pad

110. First binding region

200. Second substrate

201. Second bonding pad

210. Second binding region

300. Conductive connection part

310. Bonding wire

400. Switching circuit board

401. Lead wire

410. First circuit board

420. Second circuit board

500. Chip and method for manufacturing the same

600. Glue layer

710. Upper glass substrate

720. Lower glass substrate

730. Touch flexible circuit board

740. Main flexible circuit board

750. Integrated circuit chip

760. Flexible circuit board

800. Cover plate

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.

First, the basic structure of the display screen is described. Generally, the basic structure of the screen is divided into three layers from top to bottom, including a glass cover, a touch layer and a display panel, such as a conventional G/G, GFF screen.

The glass cover plate plays a role in protection. The touch layer comprises an ITO touch film and an ITO glass substrate. The display panel is further subdivided into three layers from top to bottom, including an upper glass substrate, a liquid crystal layer, and a lower glass substrate.

In order to meet the requirements of users On increasingly light and thin screens, an OGS screen, an In Cell screen and an On Cell screen appear In the related art, the screens adopt a structure of a glass cover plate layer and a display panel layer, and compared with the traditional screen structure, one touch layer is omitted, so that the screen is lighter and thinner.

Further, an OGS screen, an In Cell screen and an On Cell screen are distinguished according to the specific position of the integration of the touch layer, namely the OGS screen integrates the glass cover plate layer and the touch layer, and the In Cell screen and the On Cell screen integrate the touch layer and the display panel together.

Further, as mentioned above, the touch layer includes an ITO touch film and an ITO glass substrate. The In Cell screen and the On Cell screen are distinguished according to the specific position of the ITO touch film embedded into the display panel, namely the On Cell screen places the ITO touch film On the upper glass substrate of the display panel, and the In Cell screen places the ITO touch film under the lower glass substrate of the display panel.

As shown in fig. 1, fig. 1 is a schematic view illustrating an embodiment of a display module in the related art. The display module of the present embodiment has an On Cell screen structure, and an Integrated Circuit (IC) Chip 750 is bonded On a lower Glass substrate 720 (Chip On Glass, COG).

Specifically, the display module shown in fig. 1 includes an upper glass substrate 710, a lower glass substrate 720, a touch flexible circuit board 730, a main flexible circuit board 740, and an integrated circuit chip 750. The upper glass substrate 710 has touch lines (not shown), and the lower glass substrate 720 has display driving circuits (not shown). The integrated circuit chip 750 is bonded on the lower glass substrate 720 and electrically connected to the display driving circuit. One end of the touch flexible circuit board 730 is bonded to the upper glass substrate 710 and electrically connected to the touch circuit, and the other end of the touch flexible circuit board 730 is bonded to the main flexible circuit board 740. The main flexible wiring board 740 is bonded to the lower glass substrate 720 and electrically connected to the display driving circuit.

In the embodiment shown in fig. 1, the touch circuit of the upper glass substrate 710 is first connected to the main flexible circuit board 740 through the touch flexible circuit board 730, and then connected to the main board (not shown) of the device through the connector (not shown) of the main flexible circuit board 740.

As shown in fig. 2, fig. 2 is a schematic view illustrating another embodiment of a display module in the related art. The display module of the present embodiment has an On Cell screen structure, and an Integrated Circuit (IC) Chip 750 is bonded to a flexible Circuit board 760 (Chip On FPC, COF).

Specifically, the display module shown in fig. 1 includes an upper glass substrate 710, a lower glass substrate 720, a touch flexible circuit board 730, a main flexible circuit board 740, a flexible circuit board 760 and an integrated circuit chip 750. The upper glass substrate 710 has touch lines (not shown), and the lower glass substrate 720 has display driving circuits (not shown). One end of the flexible wiring board 760 is bound to the lower glass substrate 720, and the other end is bound to the main flexible wiring board 740. The integrated circuit chip 750 is bonded to the flex circuit board 760. One end of the touch flexible circuit board 730 is bonded to the upper glass substrate 710 and electrically connected to the touch circuit, and the other end of the touch flexible circuit board 730 is bonded to the main flexible circuit board 740.

Referring to fig. 1 and 2, the touch lines in the COG structure and the COF structure are first connected to the main flexible printed circuit board 740 through the touch flexible printed circuit board 730 and then connected to the device motherboard through the main flexible printed circuit board 740, and the differences are as follows: the integrated circuit chip 750 is bound to a different position, that is, the integrated circuit chip 750 in the COG structure is bound to the lower glass substrate 720, and the integrated circuit chip 750 in the COF structure is bound to the flexible circuit board 760.

Therefore, for the display modules with the COG structure and the COF structure in the related art, a touch flexible circuit board 730 is separately disposed, and the touch circuit on the upper glass substrate 710 can be connected through two additional bonding processes, which results in higher cost and complex structure.

In addition, as shown in fig. 3, fig. 3 is a schematic diagram illustrating the touch flexible wiring board 730 and the main flexible wiring board 740 of the display module in the related art when they are bent to the back of the lower glass substrate 720. Since the touch flexible printed circuit 730 is disposed in the display module shown in fig. 3, when the main flexible printed circuit 740 and the touch flexible printed circuit 730 are bent to the back of the lower glass substrate 720, the thickness of the touch flexible printed circuit 730 further increases the black edge distance D1 of the display screen. Under the design background of the full-face screen, the increase of the black edge distance reduces the screen occupation ratio, and further influences the visual effect of a user.

Based on this, the embodiment of the application provides a display module, a manufacturing method thereof and an electronic device.

As shown in fig. 4, fig. 4 is a schematic view of an embodiment of a display module according to the present application. The display module of the embodiment of the present application is an On Cell screen structure, and an Integrated Circuit (IC) chip 500 is bonded On a lower glass substrate (COG structure).

The display module of the embodiment of the application includes a first substrate 100, a second substrate 200, a conductive connecting portion 300 and an adapting circuit board 400. The first substrate 100 has a first circuit (not shown) for realizing a touch function of the display module. The second substrate 200 is stacked on the first substrate 100 and has a second circuit (not shown) for implementing a display function of the display module; the conductive connection part 300 is electrically connected to the first line and the second line to transfer the first line to the second lower line; the adapting circuit board 400 is bound to the second substrate 200 and electrically connected to the second circuit, so as to adapt the first circuit and the second circuit to a motherboard of an electronic device.

Compared with the technical scheme that a plurality of flexible circuit boards are arranged to connect the first circuit with the second circuit and are connected to the equipment mainboard in the related technology, the display module in the embodiment of the application adopts the mode that the conductive connecting parts 300 are respectively and electrically connected with the first circuit and the second circuit, so that the number of the flexible circuit boards is reduced, and the flexible circuit boards are reduced, so that the two-time binding process is omitted on the basis of material cost reduction.

In addition, as shown in fig. 5, fig. 5 is a schematic view illustrating the adapting circuit board 400 of the display module according to the embodiment of the present application when being bent to the back surface of the second substrate 200. Since the display module shown in fig. 5 does not have a touch flexible circuit board, when the adapting circuit board 400 is bent to the back of the second substrate 200, the thickness of the touch flexible circuit board does not increase the black edge distance of the display screen.

In detail, as shown in fig. 1 or fig. 2, the display module in the related art includes an upper glass substrate 710, a lower glass substrate 720, a touch flexible circuit board 730, and a main flexible circuit board 740. One end of the touch flexible circuit board 730 is bonded to the upper glass substrate 710, and the other end is bonded to the main flexible circuit board 740. The main flexible wiring board 740 is bonded to the lower glass substrate 720. Since the touch flexible printed circuit 730 is bonded to the main flexible printed circuit 740, the touch flexible printed circuit 730 and the main flexible printed circuit 740 are overlapped in the thickness direction of the touch flexible printed circuit 730 and the main flexible printed circuit 740. In other words, the touch flexible wiring board 730 is disposed above the main flexible wiring board 740. When the touch flexible printed circuit board 730 and the main flexible printed circuit board 740 are bent together to the back side of the display module (i.e. to the side of the lower glass substrate 720 away from the upper glass substrate 710), the sum of the thicknesses of the touch flexible printed circuit board 730 and the main flexible printed circuit board 740 affects the black edge distance of the screen, i.e. D1 in fig. 3. Referring to the present application, as shown in fig. 5, since the touch flexible circuit board is not present in the display module according to the embodiment of the present application, when the adapting circuit board 400 is bent to the back surface of the module, only the thickness of the adapting circuit board 400 affects the black edge distance of the screen. That is to say, D1-D2 should be equal to the thickness of the touch flexible circuit board, that is, the reduced black edge distance of the display module is equal to the thickness of the touch flexible circuit board. As an example, the thickness of the touch flexible circuit board is about 0.2 mm. Therefore, compare black margin distance D1 in the display module assembly that fig. 3 shows, black margin distance D2 in the display module assembly of this application embodiment is littleer, has further increased the screen and has accounted for the ratio, has promoted user's visual effect.

It is understood that the first substrate 100 and the second substrate 200 of the embodiment of the present application may be the upper glass substrate and the lower glass substrate, respectively, described above. The first circuit of the first substrate 100 is a touch circuit, and the second circuit of the second substrate 200 is a display driving circuit.

The touch control circuit is arranged in a mode of etching the touch control circuit by glass. The touch line may include a plurality of conductive lines crossing each other, a plurality of polygonal meshes with irregular shapes formed by the plurality of conductive lines crossing each other, and a plurality of nodes respectively located at the intersections of the plurality of conductive lines, where each node is a hollow ring structure, but not limited thereto.

The adapting Circuit board 400 may be a Flexible Printed Circuit (FPC).

As shown in fig. 4, the display module according to the embodiment of the present application further includes a chip 500, and the chip 500 is bound on the second substrate 200 and electrically connected to the second line for driving the first line and the second line. In the present embodiment, the chip 500 is bonded on the second substrate 200, that is, the display module of the present embodiment forms a COG structure.

As described above, the first circuit may be a touch circuit, the second circuit may be a display driving circuit, and the chip 500 drives the first circuit and the second circuit. In other words, in the present embodiment, the Display Driver and the touch Driver are integrated to realize a tddi (touch and Display Driver integration) driving manner, i.e., one chip is used to drive the touch lines and the Display Driver lines. Due to the integration of touch control and display driving, the number of chips is reduced, and the material cost is further reduced.

Of course, it is understood that the first line and the second line may be driven by two chips, respectively.

As shown in fig. 6, fig. 6 is a partially enlarged view at K in fig. 4. The conductive connection portion 300 includes a bonding wire 310, and two ends of the bonding wire 310 are electrically connected to the first circuit and the second circuit, respectively.

The first substrate 100 includes a first bonding region 110, the first bonding region 110 is located at an edge of the first substrate 100 close to the second substrate 200, the first substrate 100 is further provided with a first pad 101 electrically connected to the first line, and the first pad 101 is located in the first bonding region 110.

The second substrate 200 includes a second bonding region 210, the second bonding region 210 is located at an edge of the second substrate 200 close to the first substrate 100 and corresponds to the first bonding region 110, a second pad 201 electrically connected to a second line is further disposed on the second substrate 200, and the second pad 201 is disposed in the second bonding region 210.

Both ends of the bonding wire 310 are respectively bonded to the first pad 101 and the second pad 201.

The bonding wire 310 may be a gold wire, which has high conductivity, good corrosion resistance, good toughness and good oxidation resistance, and is favorable for reliability of electrical connection. Of course, other conductive materials, such as conductive films, can be selected according to actual needs.

In this embodiment, the two ends of the bonding wire 310 are respectively welded to the first bonding pad 101 and the second bonding pad 201, so that the first circuit and the second circuit are connected, that is, the bonding wire 310 welding mode replaces a twice binding mode, so that the effect of saving the touch flexible circuit board is achieved, and on one hand, the material cost is saved, and the space occupied by the touch flexible circuit board in the whole machine is also reduced; on the other hand, the process flow is reduced, and the process cost is saved.

It should be noted that the adapting circuit board 400 of the embodiment of the present application may be bound on the second substrate 200 through an Anisotropic Conductive Film (ACF), and electrically connected to the second circuit of the second substrate 200. Specifically, the relay board 400 may be electrically connected to the second pad 201 of the second line through a lead 401.

The adapting circuit board 400 and the second substrate 200 are bound by the anisotropic conductive film, and the anisotropic conductive film heated and pressurized for a certain time can form a stable structure which is vertically conducted and transversely insulated, so that the adapting circuit board 400 and the second substrate 200 can be stably electrically connected, and the requirement that the welding process of the display module cannot adopt high-temperature lead-tin welding is met. In addition, the anisotropic conductive film has the advantages of high temperature stability, low thermal expansion and hygroscopicity, and the like, and can be well adapted to the use environment of the display module.

As shown in fig. 7, fig. 7 is a schematic view of another embodiment of the display module of the present application. The display module of the present embodiment has an On Cell screen structure, and an Integrated Circuit (IC) Chip 500 is bonded to a flexible Circuit board (Chip On FPC, COF).

Specifically, the display module of the embodiment of the present application is not repeated in the same place as the display module of the previous embodiment, and the difference therebetween is as follows: the adapting circuit board 400 includes a first circuit board 410 and a second circuit board 420 electrically connected to each other, two ends of the first circuit board 410 are respectively bound to the second substrate 200 and the second circuit board 420, and the second circuit board 420 is electrically connected to a main board of the electronic device. . The chip 500 is bonded to the first circuit board 410.

The first circuit board 410 may be bound to the second substrate 200 by an anisotropic conductive film. The first circuit board 410 and the second circuit board 420 may be bonded by an anisotropic conductive adhesive film.

Referring to fig. 4 and 7, in fig. 4, the chip 500 is bonded to the second substrate 200, the interposer fabric 400 is bonded to the second substrate 200, and a bonding area of the interposer fabric 400 bonded to the second substrate 200 is disposed adjacent to the chip 500. After the adapting circuit board 400 is bent to the back surface of the second substrate 200, the frame distance of the display module is determined by the chip 500 and the binding area between the adapting circuit board 400 and the second substrate 200. Referring to fig. 7, one end of the first circuit board 410 is bonded to the second substrate 200, and the chip 500 is bonded to the first circuit board 410. That is, only the bonding area between the first circuit board 410 and the second substrate 200 exists on the second substrate 200, and the chip 500 does not exist. After the second circuit board 420 is bent to the back surface of the second substrate 200, the first circuit board 410 and the chip 500 can also be bent to the back surface of the second substrate 200 together. Thus, the second substrate 200 in fig. 7 can omit the width for bonding the chip 500, and only reserve the width for bonding the first circuit board 410, thereby reducing the size of the second substrate 200 and narrowing the frame of the display module.

It is understood that the first wiring board 410 and the second wiring board 420 may be both flexible wiring boards.

In this embodiment, the first circuit is connected to the second circuit, and is switched to the main board of the device through the first circuit board 410 and the second circuit board 420.

As shown in fig. 4 and 7, one or more bonding regions 310 may be disposed between the first substrate 100 and the second substrate 200 according to design requirements. Specifically, the bonding area of the bonding wires 310 of the display module shown in fig. 4 is one, and the bonding area of the bonding wires 310 of the display module shown in fig. 7 is two. Wherein, the plurality of positions means two or more positions.

As shown in fig. 8, fig. 8 is a schematic view illustrating the first circuit board 410 and the second circuit board 420 of the display module of the embodiment of the present application when they are bent to the back of the second substrate 200. The display module further includes an adhesive layer 600, and the adhesive layer 600 covers the connection portion of the conductive connection portion 300 and the first and second lines.

In this embodiment, after the cover plate 800 is attached to the display module, the adhesive layer 600 is disposed on the end surface of the display module, and the adhesive layer 600 covers the connecting portion between the conductive connecting portion 300 and the first circuit and the second circuit, so as to further improve the reliability of the connection between the conductive connecting portion 300 and the first circuit and the second circuit. In addition, the glue layer 600 can also improve the waterproof performance of the display module.

It should be noted that the adhesive layer 600 in fig. 8 is applied to the display module shown in fig. 7, that is, the display module in fig. 8 is a COF structure. Of course, the adhesive layer 600 may also be applied to the display module with the COG structure in fig. 4, and will not be described herein again.

On the other hand of the embodiments of the present application, an electronic device is further provided, which includes the display module according to any of the embodiments. The electronic device according to the embodiment of the present application has all the advantages and benefits of any of the above embodiments, and therefore, the display module according to any of the above embodiments is not described herein again.

It is understood that the electronic device in the embodiments of the present application may be a mobile phone or a smart phone (e.g., an iPhone-based phone, Android-based phone), a Portable game device (e.g., Nintendo DS, PlayStation Portable, game Advance, iPhone), a laptop, a PDA, a Portable internet device, a music player, and a data storage device, other handheld devices, and a Head Mounted Device (HMD) such as a watch, a headset, a pendant, a headset, etc., and may also be other wearable devices (e.g., a Head Mounted Device (HMD) such as an electronic necklace, an electronic garment, an electronic bracelet, an electronic necklace, an electronic tattoo, an electronic device, or a smart watch).

The electronic device may also be any of a number of electronic devices including, but not limited to, cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controllers, pagers, laptop computers, desktop computers, printers, netbook computers, Personal Digital Assistants (PDAs), Portable Multimedia Players (PMPs), moving picture experts group (MPEG-1 or MPEG-2) audio layer (MP3) players, portable medical devices, and digital cameras, and combinations thereof.

In another aspect of the embodiments of the present application, a method for manufacturing a display module is further provided, including: providing a first substrate 100, wherein the first substrate 100 is provided with a first circuit, and the first circuit is used for realizing the touch function of the display module; providing a second substrate 200, wherein the second substrate 200 is stacked with the first substrate 100 and has a second circuit, and the second circuit is used for realizing the display function of the display module; electrically connecting the first line and the second line using the conductive connection part 300 to transfer the first line to the second line; a patch circuit board 400 is provided, which is bonded to the second substrate 200 and electrically connected to the second circuit, so as to patch the first circuit and the second circuit to a motherboard of an electronic device.

To sum up, the display module and the manufacturing method thereof, and the electronic device of the embodiment of the application have the advantages and beneficial effects that:

the display module according to the embodiment of the application adopts the technical means that the first circuit of the first substrate 100 is connected with the second circuit of the second substrate 200 by the conductive connecting part 300, and the switching circuit board 400 is bound on the second substrate 200 and is electrically connected with the second circuit, so that the first circuit and the second circuit can be switched out through the switching circuit board 400. Because the touch flexible circuit board does not need to be arranged independently, on one hand, the cost is saved, and on the other hand, the two-time binding process is also saved.

In addition, black border distance D2 among the display module assembly of this application embodiment is littleer, has further increased the screen and has accounted for the ratio, has promoted user's visual effect.

In the application examples, the terms "first", "second", "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless expressly limited otherwise. The terms "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. The specific meanings of the above terms in the examples of the application can be understood by those skilled in the art according to specific situations.

In the description of the embodiments of the present application, it is to be understood that the terms "upper", "lower", "left", "right", "front", "rear", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present application and simplifying the description, but do not indicate or imply that the referred devices or units must have a specific direction, be configured and operated in a specific orientation, and thus, should not be construed as limiting the embodiments of the present application.

In the description herein, reference to the term "one embodiment," "some embodiments," "a specific embodiment," or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application embodiment. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only a preferred embodiment of the claimed embodiments and is not intended to limit the claimed embodiments, and various modifications and changes may be made to the claimed embodiments by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the applied embodiment shall be included in the protection scope of the applied embodiment.

Claims (10)

1. The utility model provides a display module assembly for electronic equipment, its characterized in that, display module assembly includes:

the first substrate is provided with a first circuit and is used for realizing the touch function of the display module;

the second substrate is stacked with the first substrate and provided with a second circuit for realizing the display function of the display module;

the conductive connecting part is electrically connected with the first circuit and the second circuit and used for switching the first circuit to the second circuit; and

and the switching circuit board is bound on the second substrate and is electrically connected with the second circuit so as to switch the first circuit and the second circuit to the mainboard of the electronic equipment.

2. The display module of claim 1, wherein the conductive connection portion comprises a bonding wire, and two ends of the bonding wire are electrically connected to the first circuit and the second circuit, respectively.

3. The display module assembly according to claim 2, wherein the first substrate includes a first bonding region, the first bonding region is located at an edge of the first substrate close to the second substrate, the first substrate is further provided with a first pad electrically connected to the first line, and the first pad is located in the first bonding region;

the second substrate comprises a second binding region, the second binding region is positioned at the edge of the second substrate close to the first substrate and corresponds to the first binding region, a second bonding pad electrically connected with the second circuit is further arranged on the second substrate, and the second bonding pad is arranged in the second binding region;

and two ends of the bonding wire are respectively welded to the first bonding pad and the second bonding pad.

4. The display module according to claim 1, further comprising a chip bonded to the second substrate and electrically connected to the second line for driving the first line and the second line.

5. The display module assembly according to claim 1, wherein the adapting circuit board comprises a first circuit board and a second circuit board electrically connected to each other, two ends of the first circuit board are respectively bonded to the second substrate and the second circuit board, and the second circuit board is electrically connected to the main board;

the display module further comprises a chip, wherein the chip is bound on the first circuit board and used for driving the first circuit and the second circuit.

6. The display module of claim 5, wherein the first circuit board is bonded to the second substrate by an anisotropic conductive film.

7. The display module of claim 5, wherein the first circuit board and the second circuit board are bonded together by an anisotropic conductive film.

8. The display module according to claim 1, further comprising a glue layer covering a joint of the conductive connecting portion and the first and second lines.

9. An electronic device, comprising a main board and the display module according to any one of claims 1 to 8.

10. A manufacturing method of a display module is characterized by comprising the following steps:

providing a first substrate, wherein the first substrate is provided with a first circuit and is used for realizing the touch function of the display module;

providing a second substrate, wherein the second substrate and the first substrate are arranged in a stacked mode and are provided with second lines for achieving the display function of the display module;

electrically connecting the first line and the second line with a conductive connection to switch the first line to the second line;

and providing a switching circuit board which is bound on the second substrate and is electrically connected with the second circuit so as to switch the first circuit and the second circuit to a mainboard of an electronic device.

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