CN113900542B - Touch panel and preparation method thereof - Google Patents
Touch panel and preparation method thereof Download PDFInfo
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- CN113900542B CN113900542B CN202111171763.9A CN202111171763A CN113900542B CN 113900542 B CN113900542 B CN 113900542B CN 202111171763 A CN202111171763 A CN 202111171763A CN 113900542 B CN113900542 B CN 113900542B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Position Input By Displaying (AREA)
Abstract
The application provides a touch panel and a preparation method thereof. The touch panel comprises a display module, a first metal layer, an insulating layer and a second metal layer, wherein the display module comprises steps, each step comprises an upper step surface, a step slope surface and a lower step surface, and the step slope surface is connected with the upper step surface and the lower step surface; the first metal layer is arranged on the display module, wherein the first metal layer is respectively disconnected at the upper step surface and the lower step surface to form a first part, a second part and a third part, and the second part is used for forming a heightening block; the insulating layer is arranged on one side of the first metal layer, which is far away from the display module; and the second metal layer is arranged on one side of the insulating layer far away from the first metal layer. According to the application, the thickness of the insulating layer is not required to be increased, and the second part is utilized to heighten the lower step surface, so that the height difference can be slowed down, the risk that adjacent wires are short-circuited due to the fact that wires of the second metal layer are easy to remain at the step is reduced, meanwhile, the cost is saved, and the manufacturing process of the touch panel is simplified.
Description
Technical Field
The application relates to the technical field of touch panels, in particular to a touch panel and a preparation method thereof.
Background
Currently, in the process of manufacturing a touch panel, after the display module is manufactured, a metal layer is generally manufactured on the display module as a touch electrode, so as to form a metal trace through patterning. The wires of the metal layer can be converged to the frame of the touch panel and led out to the pad area of the touch panel. However, on the path from the trace of the metal layer to the pad area of the touch panel, the step of the display module is poor, so that the trace of the metal layer is easy to remain at the step, and an adjacent trace is short-circuited.
Disclosure of Invention
In view of the above, the present application provides a touch panel and a method for manufacturing the same, so as to solve the problem that the traces of the metal layer are easy to remain at the step to cause short circuit of adjacent traces.
A first aspect of the present application provides a touch panel. The touch panel comprises a display module, a first metal layer, an insulating layer and a second metal layer, wherein the display module comprises steps, each step comprises an upper step surface, a step slope surface and a lower step surface, and the step slope surface is connected with the upper step surface and the lower step surface; the first metal layer is arranged on the display module, wherein the first metal layer is respectively disconnected at the upper step surface and the lower step surface to form a first part, a second part and a third part, and the second part is used for forming a heightening block; the insulating layer is arranged on one side of the first metal layer, which is far away from the display module; and the second metal layer is arranged on one side of the insulating layer far away from the first metal layer.
In one embodiment of the application, the second portion includes a lower planar segment that covers a surface of the lower step surface on a side of the step slope surface and is in contact with the step slope surface.
In an embodiment of the application, the second portion further includes an upper flat section and a climbing section, the climbing section covers the step slope, and the upper flat section covers a surface of the upper step surface near one side of the step slope.
In an embodiment of the present application, a thickness of the first metal layer is smaller than a thickness of the insulating layer along a stacking direction, and the stacking direction is a direction in which the display module, the first metal layer, the insulating layer, and the second metal layer are stacked in order.
In an embodiment of the present application, the thickness of the insulating layer is 1.01 to 1.5 times the thickness of the first metal layer.
In an embodiment of the present application, a first included angle between the step slope and the lower step surface is smaller than a second included angle between a first surface of the insulating layer and a second surface of the insulating layer, wherein the first surface is opposite to the step slope, the second surface is opposite to the lower step surface, and the first surface is connected with the second surface.
In an embodiment of the present application, the second included angle is smaller than a third included angle between a third surface of the second metal layer and a fourth surface of the second metal layer, the third surface is opposite to the first surface, the fourth surface is opposite to the second surface, and the third surface is connected to the fourth surface.
In an embodiment of the application, a first via hole and a second via hole are arranged on the insulating layer, the first via hole extends to the surface of the first part far away from one side of the display module, and the second via hole extends to the surface of the third part far away from one side of the display module; the second metal layer is electrically connected with the first part through the first via hole, and the second metal layer is electrically connected with the third part through the second via hole.
In an embodiment of the application, the touch panel further includes a first insulating block and a second insulating block. The first insulating block is filled in the gap between the first part and the second part; the second insulating block is filled in the gap between the second portion and the third portion.
The second aspect of the application provides a method for manufacturing a touch panel. The manufacturing method of the touch panel comprises the steps that a display module is provided, wherein the display module comprises steps, each step comprises an upper step surface, a step slope surface and a lower step surface, and the step slope surface is connected with the upper step surface and the lower step surface; forming a first metal layer on the display module, wherein the first metal layer is respectively disconnected at the upper step surface and the lower step surface to form a first part, a second part and a third part, and the second part is used for forming a heightening block; forming an insulating layer on one side of the first metal layer far away from the display module; a second metal layer is formed on a side of the insulating layer away from the first metal layer.
According to the technical scheme provided by the embodiment of the application, the first metal layer is disconnected at the upper step surface and the lower step surface, and the first part, the second part and the third part are formed, and the second part is used for forming the heightening block, so that the second part is directly padded on the surface of the lower step surface, which is close to one side of the step slope, without increasing the thickness of the insulating layer, the lower step surface is heightened by the second part, and further, the risk that adjacent routing short circuits are caused due to the fact that the routing of the second metal layer is easy to remain at the step is reduced, meanwhile, the cost is saved, and the preparation process of the touch panel is simplified.
Drawings
Fig. 1A is a schematic top view of a touch panel.
Fig. 1B is a schematic cross-sectional structure of a touch panel.
Fig. 1C is a schematic cross-sectional structure of another touch panel.
Fig. 2A is a schematic cross-sectional view of a touch panel according to a first embodiment of the application.
Fig. 2B is a schematic top view of a touch panel according to a first embodiment of the application.
Fig. 3A is a schematic cross-sectional view of a touch panel according to a second embodiment of the application.
Fig. 3B is a schematic top view of a touch panel according to a second embodiment of the application.
Fig. 4 is a schematic cross-sectional view of a touch panel according to a third embodiment of the application.
Fig. 5 is a schematic cross-sectional view of a touch panel according to a fourth embodiment of the application.
Fig. 6 is a schematic flow chart of a method for manufacturing a touch panel according to an embodiment of the application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the process of manufacturing the touch panel, a first metal layer, an insulating layer and a second metal layer which are stacked and arranged are generally manufactured on the display module, wherein the wires of the first metal layer and the second metal layer are easy to remain at the step to cause adjacent wire short circuit, and even if the insulating layer is thickened, the insulating layer is adopted to raise the step, the wires of the second metal layer are easy to remain at the step to cause adjacent wire short circuit. The applicant has found that the cause of this problem is the following: when the insulating layer is adopted to raise the step, the thickening treatment is needed to be carried out on the insulating layer, and the thickening treatment is difficult to accurately control the increased thickness of the insulating layer, so that more steps are generated (for example, new steps are possibly generated at any surface of the thickening treatment, the number of the new steps is 3, 5 or more and countless), and then the traces of the second metal layer are left at the steps, so that adjacent trace short circuits are caused. In order to solve the above problems, the applicant has found that, by breaking the first metal layer at the upper step surface and the lower step surface and forming the first portion, the second portion and the third portion, the second portion at least covers the surface of the lower step surface close to the step slope surface side, so that the second portion can be directly padded on the surface of the lower step surface close to the step slope surface side without increasing the thickness of the insulating layer, the height of the step required to be covered by the second metal layer is reduced by using the second portion, the risk that the trace of the second metal layer remains at the step to cause an adjacent trace short circuit is reduced, and meanwhile, the manufacturing process of the touch panel is simplified.
Fig. 1A is a schematic top view of a touch panel. Fig. 1B is a schematic cross-sectional structure of a touch panel. Fig. 1C is a schematic cross-sectional structure of another touch panel.
As shown in fig. 1A, the touch panel 100 includes a display area 10, a frame area 20, and a pad area 30. The display area 10 is provided therein with a first electrode 110, a second electrode 120, and a connection bridge 130 for electrically connecting segments of the second electrode 120 separated by the first electrode 110. The frame region 20 and the pad region 30 may have a first wire 140 connected to the first electrode 110 and a second wire 150 connected to the second electrode 120 disposed therein, and the frame region 20 includes a lower frame 21. The first and second wires 140 and 150 are converged to the lower frame 21 of the touch panel 100 and led out to the pad region 30.
It should be understood that the arrangement of the first trace 140 and the second trace 150 in fig. 1A is merely exemplary, and the present application is not limited thereto.
Fig. 1B may be an enlarged schematic cross-sectional view of the touch panel shown in fig. 1A along line AA' in the area B. As shown in fig. 1B, the touch panel 100 includes a display module 160 and a touch module 170, and the touch panel 100 is divided into a first routing area 100a, a step area 100B and a second routing area 100c. The display module 160 includes a first film layer 161 (e.g., a display film layer) and a second film layer 162 (e.g., a package layer) stacked together, a step 1 is formed by the first film layer 161 and the second film layer 162, and the step 1 is located in the step area 100 b. The touch module 170 includes a first metal layer 171, an insulating layer 172, and a second metal layer 173 that are stacked.
The first film layer 161 protrudes from the second film layer 162 in a direction perpendicular to the lamination direction DD' to form a step 1 in the step region 100 b. The first film layer 161 and the second film layer 162 may each include one or more film layers, which are not particularly limited in the present application.
It should be appreciated that in the display region 10, the connection bridge 130 may be disposed in the first metal layer 171, and the first and second electrodes 110 and 120 may be disposed in the second metal layer 173. In the region B, the first wire 140 may be disposed in the first metal layer 171. In the region C, the second wire 150 may be disposed in the first metal layer 171. The step 1 is located in the step area 100b, and the step area 100b may be any area including the step 1 on the touch panel 100, and the step area 100b may also be referred to as a step area, which is not particularly limited in the present application.
Fig. 1B is a schematic cross-sectional view of a touch panel in an ideal state. As shown in fig. 1B, the first metal layer 171 in the step region 100B is generally etched completely, so that the first metal layer 171 is divided into two parts, and the etched region is filled with an insulating layer 172, and the second metal layer 173 is electrically connected to the two parts of the first metal layer 171 through a first via hole 172a and a second via hole 172B on the insulating layer 172, so as to solve the problem that the traces of the first metal layer 171 are easy to remain at the step 1 and cause adjacent traces to be shorted. Ideally, after filling the insulating layer 172, the surface of the insulating layer 172 away from the first metal layer 171 is flat.
However, referring to FIG. 1C, in practice, filling the etched region with insulating layer 172 requires that the thickness of the insulating layer in the stepped region 100b be reduced from H 1 Increase to H 2 And the thickness of the insulating layer also needs to be increased in the second wiring region 100c. The thickness of the insulating layer is increased by setting the thickness of the insulating layer to H 2 The insulating layer is etched at a thicker location in such a way that it is difficult to control the etching process at a high level. Another way to increase the thickness of the insulating layer is to set the thickness of the insulating layer to H 1 Then, the insulating layer in the step region 160b is shielded by a mask (mask) to have a thickness from H 1 Increase to H 2 In this way, the mask is required to be completely attached to the surface of the display module, otherwise, when the coating is deposited, the material of the insulating layer can enter from the gap between the mask and the surface of the display module, so that the periphery of the step areaThe thickness of the region being between H 1 And H 2 And when the mask is used for coating, an insulating layer can be plated on the mask, so that the mask fails. Because the etching heights needed at different positions are different, the two modes all need to be etched for multiple times, the operation complexity is high, the thickness of the insulating layer is difficult to accurately control, the surface of the insulating layer, which is far away from one side of the display module, is uneven, more new steps are generated, short circuit risks are easy to exist in the wiring in the second metal layer, and the realizability is low.
Fig. 2A is a schematic cross-sectional view of a touch panel according to a first embodiment of the application. Fig. 2B is a schematic top view of a touch panel according to a first embodiment of the application. As shown in fig. 2, the touch panel 200 includes a display module 210, a first metal layer 220, an insulating layer 230, and a second metal layer 240. The display module 210 includes a step 2, the step 2 includes an upper step surface 2a, a step slope surface 2b, and a lower step surface 2c, and the step slope surface 2b connects the upper step surface 2a and the lower step surface 2c. The first metal layer 220 is disposed on the display module 210, the first metal layer 220 is broken at the upper step surface 2a and the lower step surface 2c to form a first portion 2201, a second portion 2202 and a third portion 2203, respectively, and the second portion 2202 is used to form a lifting block. The insulating layer 230 is disposed on a side of the first metal layer 220 away from the display module 210. The second metal layer 240 is disposed on a side of the insulating layer 230 remote from the first metal layer 220.
It should be understood that the first metal layer 220 is broken at the upper step surface 2a and the lower step surface 2c, and a gap 3 exists between any two adjacent portions of the first portion 2201, the second portion 2202 and the third portion 2203, and the gap 3 may be filled with no other material, or may be filled with another material that can prevent any two adjacent portions from being electrically connected, such as an insulating material, etc., which is not limited in particular. The region between the side surface of the first portion 2201 adjacent to the second portion 2202 and the side surface of the third portion 2203 adjacent to the second portion 2202 may form a step region 210a, the step 2 being located within the step region 210a, the second portion 2202 also being located within the step region 210 a.
The step 2 may be a step generated at any position in the display module 210, which is not particularly limited in the present application. The display module 210 may be in direct contact with the first metal layer 220, or may be in indirect contact with the first metal layer 220, for example, other film layers such as a substrate layer may be disposed between the display module 210 and the first metal layer 220, which is not limited in this disclosure. The material of the substrate layer may be transparent and insulating, including but not limited to rigid or flexible materials such as polyethylene, polymethyl methacrylate, polyethylene terephthalate, or glass. The substrate layer can also be filled on the lower step surface, so that the metal residue risk of the first metal layer in the step area is reduced, and no more steps can be generated because the height of the substrate layer can be accurately controlled.
The second metal layer 240 may be electrically connected to the first portion 2201 and the third portion 2203, thereby performing a touch function. The second portion 2202 is used to form a raised block, so that the second portion 2202 has no conducting function, that is, the wires of the second portion 2202 are not electrically connected with the wires of the first portion 2201, the third portion 2203 and the second metal layer 240, so that the second portion 2202 can be utilized to raise the lower step surface 2c, and the problem that the wires of the first metal layer 220 and the second metal layer 240 are easy to remain at the step to cause adjacent wire short circuit is avoided.
The insulating layer 230 and the second metal layer 240 may be a uniform film formed by one process, and may be prepared by deposition, evaporation, spin coating, or the like. Thickness H of first metal layer 220 3 May be less than the thickness H of the insulating layer 230 4 May also be greater than the thickness H of the insulating layer 230 4 May also be equal to the thickness H of the insulating layer 230 4 The present application is not particularly limited thereto. The insulating layer 230 will preferentially cover the surface of the bare drain in the gap 3 at the position of the gap 3 and then be stacked in the stacking direction, so that when the second metal layer 240 is provided on the insulating layer 230, even if the thickness H of the first metal layer 220 3 Lower than or equal to the thickness H of the insulating layer 230 4 At the gap 3, there is also an insulating layer 230 between the second metal layer 240 and the first metal layer 220, and the second metal layer 240 and the first metal layer 220 are not in direct contact, so that it is possible to maintainThe second portion 2202 is not electrically connected to the first portion 2201, the third portion 2203 and the second metal layer 240.
According to the technical scheme provided by the embodiment of the application, the first metal layer is disconnected at the upper step surface and the lower step surface, the first part, the second part and the third part are formed, and the second part is used for forming the heightening block, so that the insulating layer is not required to be additionally adopted for heightening, the lower step surface is heightened by the second part, the cost is saved, and the risk that the adjacent wiring is short-circuited due to the fact that the wiring of the second metal layer is easy to remain at the step is reduced. In addition, as the second part is formed simultaneously with the first part and the third part, and the second part is used for forming the heightening block, the insulating layer is not required to be thickened additionally, so that more steps on the surface of the insulating layer far away from one side of the display module due to the fact that the thickness of the insulating layer is increased and is difficult to control accurately are avoided, and meanwhile, the manufacturing process of the touch panel is simplified.
In one embodiment of the present application, the second portion 2202 includes a lower flat portion 2202a, and the lower flat portion 2202a covers a surface of the lower step surface 2c on a side close to the step slope surface 2b and contacts the step slope surface 2 b.
It should be understood that the lower flat section 2202a is a portion of the second portion 2202 covering the surface of the lower step surface 2c on the side close to the step slope surface 2b, and the lower flat section 2202a covers the portion of the step slope surface 2b while covering the surface of the lower step surface 2c on the side close to the step slope surface 2b, and thus contacts the step slope surface 2 b. The height of the step 2 can be understood as the vertical distance between two parallel surfaces corresponding to the upper step surface 2a and the lower step surface 2c, and the height of the step 2 can also be referred to as the height of the step.
In the embodiment of the application, the second part comprises the lower leveling section, so that the second part is utilized to heighten the lower step surface, and when the second metal layer is arranged, the height of the step is reduced by the height corresponding to the lower leveling section (the height is equal to the thickness of the first metal layer), thereby reducing the risk that the wires of the second metal layer are easy to remain at the step to cause adjacent wire short circuit.
Fig. 3A is a schematic cross-sectional view of a touch panel according to a second embodiment of the application. Fig. 3B is a schematic top view of a touch panel according to a second embodiment of the application. The embodiment shown in fig. 3A and 3B is an example of the embodiment shown in fig. 2A and 2B. As shown in fig. 3A and 3B, the second portion 2202 is different from the embodiment shown in fig. 2A in that the second portion 2202 further includes an upper flat section 2202B and a climbing section 2202c, the climbing section 2202c covering the step slope 2B, and the upper flat section 4 covering a surface of the upper step face 2A on a side close to the step slope 2B.
The upper flat section 2202b is a portion of the second portion 2202 covering the surface of the upper step surface 2a on the side close to the step slope surface 2b, and the climbing section 2202c is a portion of the second portion 2202 covering the surface of the step slope surface 2 b. The division of the lower flat section 2202a, the upper flat section 2202b, and the climbing section 2202c may be different according to habits of different users, and the present application is not particularly limited thereto.
In some embodiments, the display module 210 may include a first film layer 211 and a second film layer 212, and the step 2 may be formed of the first film layer 211 and the second film layer 212. In some embodiments, the first film 211 may be a display film and the second film 212 may be an encapsulation film. The encapsulation layer may be composed of one film layer or may be composed of a plurality of organic layers and/or inorganic layers, which is not particularly limited in the present application. The first film layer 211 includes, but is not limited to, a display film layer, and the second film layer 212 includes, but is not limited to, an encapsulation layer, as long as the first film layer 211 and the second film layer 212 can form a step, which is not particularly limited in the present application. The steps are formed by the first film layer 211 and the second film layer 212, so that more parts can be arranged on the surface of the first film layer 211 extending out of the second film layer 212, which is beneficial to the thinning of the touch panel.
According to the technical scheme provided by the embodiment of the application, the second part further comprises the upper leveling section and the climbing section, so that the second part can cover the step slope surface and the lower step surface simultaneously. Meanwhile, the upper leveling section and the climbing section can fill the upper parts of the step slope surface and the lower step surface, so that the recess of the insulating layer at the upper leveling section and the climbing section is avoided, and the risk of short circuit of the second metal layer at the step is further reduced.
In an embodiment of the present application, the insulating layer 230 is provided with a first via 230a and a second via 230b, the first via 230a extends to a surface of the first portion 2201 on a side far away from the display module 210, and the second via 230b extends to a surface of the third portion 2203 on a side far away from the display module 210; the second metal layer 240 is electrically connected to the first portion 2201 through the first via 230a, and the second metal layer 240 is electrically connected to the third portion 2203 through the second via 230 b.
For example, after the insulating layer 230 is patterned, a first via 230a and a second via 230b may be formed on the insulating layer 230, and the first via 230a and the second via 230b penetrate through the insulating layer 230.
In the embodiment of the application, the first via hole and the second via hole are arranged on the insulating layer, so that the second metal layer is electrically connected with the first part through the first via hole and is electrically connected with the third part through the second via hole, and the touch function is realized.
Fig. 4 is a schematic cross-sectional view of a touch panel according to a third embodiment of the application. The embodiment shown in fig. 4 is an example of the embodiment shown in fig. 3A. As shown in fig. 4, the difference from the embodiment shown in fig. 3A is that the thickness H of the first metal layer 220 in the lamination direction DD' is 3 Less than the thickness H of the insulating layer 230 4 . The lamination direction is a direction in which the display module 210, the first metal layer 220, the insulating layer 230, and the second metal layer 240 are sequentially laminated.
It should be understood that the technical features of the embodiment shown in fig. 4 may be combined with the technical features of the embodiment shown in fig. 2A, and will not be described again here.
According to the technical scheme provided by the embodiment of the application, the thickness H of the first metal layer is set 3 Less than the thickness H of the insulating layer 4 Thereby the insulating layer can fill up the gap between the first part and the second part and the gap between the second part and the third part, the second metal layer at the gap can be further prevented from being electrically connected with the first metal layer, and the wiring of the second metal layer is reducedAnd short circuit risk improves the realizability.
In an embodiment of the application, the thickness H of the insulating layer 230 4 Thickness H of the first metal layer 220 3 1.01 to 1.5 times of the total weight of the composition.
It should be understood that the thickness of the insulating layer 230 may be 1.01 times, 1.13 times, 1.2 times, 1.35 times, 1.5 times, etc. the thickness of the first metal layer 220, which is not particularly limited in the present application.
In the embodiment of the application, the thickness of the insulating layer is 1.01-1.5 times of that of the first metal layer, so that the insulating layer can fill the gap between the first part and the second part and the gap between the second part and the third part, the height of a new step generated at the gap is controlled in a smaller range, and the risk of short circuit of the second metal layer caused by the height of the step generated at the gap is reduced.
In one embodiment of the application, a first included angle alpha is formed between the step slope surface 2b and the lower step surface 2c 1 Smaller than the first surface S of the insulating layer 230 1 And a second surface S of the insulating layer 230 2 A second included angle alpha between 2 Wherein the first surface S 1 A second surface S arranged opposite to the step slope 2b 2 Opposite to the lower step surface 2c, a first surface S 1 And a second surface S 2 Is connected with each other.
In some embodiments, since the first metal layer 220 and the insulating layer 230 have the step 2 in the step region 210a when the first metal layer 220 and the insulating layer 230 are formed in the step region 210a, the materials of the first metal layer 220 and the insulating layer 230 are more likely to be in a 1 Thus, without thickening the first metal layer 220 and the insulating layer 230, naturally causes alpha while forming the first metal layer 220 and the insulating layer 230 2 Will be greater than alpha 1 . In other embodiments, the material of the first metal layer 220 or the insulating layer 230 may be added at the step, and the formation time of the first metal layer 220 and the insulating layer 230 may be prolonged at the step, so that α 2 Greater than alpha 1 . In addition, due to the arrangement of alpha 2 Greater than alpha 1 Is easier to control and thus has stronger realizability.
In the embodiment of the application, alpha is set 1 Less than alpha 2 Thereby making alpha 2 Relative to alpha 1 The second metal layer is formed on one side of the insulating layer far away from the display module, so that the wiring of the second metal layer can be further reduced in alpha 2 And risk of short-circuiting at the corresponding location.
In one embodiment of the present application, the second included angle alpha 2 Third surface S smaller than second metal layer 240 3 And a fourth surface S of the second metal layer 4 Third included angle alpha between 3 Third surface S 3 And the first surface S 1 Oppositely arranged, fourth surface S 4 And a second surface S 2 Oppositely arranged, a third surface S 3 And a fourth surface S 4 Is connected with each other.
In some embodiments, free stacking is possible such that α 3 Greater than alpha 2 Thus, the insulating layer 230 and the second metal layer 240 are formed while naturally making α without thickening the insulating layer 230 and the second metal layer 240 3 Will be greater than alpha 2 (i.e. alpha 2 Less than alpha 3 ). In other embodiments, the material of the insulating layer 230 or the second metal layer 240 may be added at the step, and the formation time of the insulating layer 230 and the second metal layer 240 may be prolonged at the step, so that α 2 Less than alpha 3 。
In the embodiment of the application, alpha is set 2 Less than alpha 3 Thereby making alpha 3 Relative to alpha 2 The wiring of the second metal layer is more gentle and can be further reduced in alpha 2 And risk of short-circuiting at the corresponding location. In addition, due to alpha 1 Less than alpha 2 ，α 2 Less than alpha 3 When a layer of film is added on each step, the corresponding included angle at the step is gradually reduced, namely the corresponding gradient at the step is gradually slowed down, and alpha is arranged 1 Less than alpha 2 ，α 2 Less than alpha 3 Is easier to control and thus has stronger realizability.
Fig. 5 is a schematic cross-sectional view of a touch panel according to a fourth embodiment of the application. The embodiment shown in fig. 5 is a modification of the embodiment shown in fig. 2A to 4. The difference from the embodiment shown in fig. 2A to 4 is that the touch panel 500 further includes a first insulating block 510 and a second insulating block 520. The first insulating block 510 fills in the gap between the first portion 2201 and the second portion 2202. The second insulating block 520 fills in the gap between the second portion 2202 and the third portion 2203.
A first insulating block 510 filled in a gap between the first portion 2201 and the second portion 2202 for blocking the first portion 2201 from being electrically connected to the second portion 2202; the second insulating block 520 is filled in the gap between the second portion 2202 and the third portion 2203, and is used for blocking the second portion 2202 from being electrically connected with the third portion 2203.
It should be appreciated that the material of the first insulating block 510 may be any material that can block the electrical connection between the first portion 2201 and the second portion 2202, the material of the second insulating block 520 may block the electrical connection between the second portion 2202 and the third portion 2203, and the materials of the first insulating block 510 and the second insulating block 520 may be the same or different, which is not particularly limited in the present application.
According to the technical scheme provided by the embodiment of the application, the first insulating block is utilized to enable the first part and the second part to be electrically connected, and the second insulating block is utilized to enable the second part and the third part to be electrically connected. In addition, because the first insulating block or the second insulating block is filled, when other film layers such as an insulating layer and a second metal layer are arranged on the first metal layer, the other film layers cannot be sunken at the position of the gap, so that steps generated by the gap are reduced, and short circuits of adjacent wires in the second metal layer at the gap are reduced. Furthermore, since the heights of the first insulating block and the second insulating block are controllable, it is also advantageous to keep the thicknesses of the first insulating block and the second insulating block consistent with the thickness of the insulating layer.
Fig. 6 is a schematic flow chart of a method for manufacturing a touch panel according to an embodiment of the application. As shown in fig. 6, the method for manufacturing the touch panel includes the following steps.
S110: the display module comprises a step, wherein the step comprises an upper step surface, a step slope surface and a lower step surface, and the step slope surface is connected with the upper step surface and the lower step surface.
S120: and forming a first metal layer on the display module, wherein the first metal layer is disconnected at the upper step surface and the lower step surface respectively to form a first part, a second part and a third part, and the second part is used for forming a heightening block.
Specifically, the first metal layer may be formed on the display module by deposition, vapor deposition, or the like, as long as the first metal layer having a uniform height can be formed.
It should be understood that the first metal layer may be subjected to a patterning process in step S120, and may be broken at the upper step surface and the lower step surface by etching or the like. The patterning process etches all of the first metal layer in the gaps between the first and second portions and the gaps between the second and third portions, so that the first metal layer can be broken into the first, second and third portions, and the realizability is greater since there is no need to control the height of the first metal layer that needs to be etched at the two gaps.
Before step S120 is performed, other film layers such as a substrate layer may be further formed between the display module and the first metal layer.
S130: and forming an insulating layer on one side of the first metal layer far away from the display module.
It should be understood that an insulating layer can be uniformly formed on the side of the first metal layer away from the display module, that is, the insulating layer is formed by only one process without performing thickness increasing treatment on the insulating layer.
S140: a second metal layer is formed on a side of the insulating layer away from the first metal layer.
After performing step S140, a protective layer may also be formed on a side of the second metal layer remote from the insulating layer. The protective layer can protect the second metal layer on one hand, and can planarize the surface of the second metal layer far away from one side of the insulating layer on the other hand.
It should be understood that the manufacturing method of the touch panel may also be appropriately adjusted according to the structure of the touch panel in the embodiment shown in fig. 2A to 5, which is not particularly limited in the present application.
According to the technical scheme provided by the embodiment of the application, the first metal layer is formed on the display module, and the first metal layer is disconnected at the upper step surface and the lower step surface to form the first part, the second part and the third part, so that the wires in the second part are not electrically connected with the wires in the first part and the third part respectively, namely the second part has no conduction effect. Because the second part has no conduction effect, the short circuit of adjacent wires caused by the fact that the wires of the first metal layer and the second metal layer are easy to remain at the step is avoided. The second part is used for forming the heightening block, so that the second part can be utilized for heightening the lower step surface, the thickness of the insulating layer in the step area is not required to be increased, and the second part is not required to be etched, thereby realizing the purpose of avoiding adjacent wiring short circuits caused by easy residue of the wiring of the second metal layer at the step, saving the cost and simplifying the preparation process of the touch panel.
The combination of the features of the present application is not limited to the combination described in the claims or the combination described in the specific embodiments, and all the features described in the present application may be freely combined or combined in any manner unless contradiction occurs between them.
The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is to be construed as including any modifications, equivalents, and alternatives falling within the spirit and principles of the application.
Claims (8)
1. A touch panel, comprising:
the display module comprises a step, wherein the step comprises an upper step surface, a step slope surface and a lower step surface, and the step slope surface is connected with the upper step surface and the lower step surface;
the first metal layer is arranged on the display module, wherein the first metal layer is respectively disconnected at the upper step surface and the lower step surface to form a first part, a second part and a third part, and the second part is used for forming a heightening block;
the insulating layer is arranged on one side of the first metal layer, which is far away from the display module; and
the second metal layer is arranged on one side of the insulating layer away from the first metal layer;
the second part comprises a lower leveling section, an upper leveling section and a climbing section, wherein the lower leveling section covers the surface of the lower step surface, which is close to one side of the step slope, and is in contact with the step slope, the climbing section covers the step slope, and the upper leveling section covers the surface of the upper step surface, which is close to one side of the step slope.
2. The touch panel according to claim 1, wherein,
and in the lamination direction, the thickness of the first metal layer is smaller than that of the insulating layer, and the lamination direction is the direction in which the display module, the first metal layer, the insulating layer and the second metal layer are laminated in sequence.
3. The touch panel according to claim 2, wherein,
the thickness of the insulating layer is 1.01-1.5 times of the thickness of the first metal layer.
4. The touch panel according to claim 1, wherein,
the first included angle between the step slope surface and the lower step surface is smaller than the second included angle between the first surface of the insulating layer and the second surface of the insulating layer, wherein the first surface and the step slope surface are oppositely arranged, the second surface and the lower step surface are oppositely arranged, and the first surface is connected with the second surface.
5. The touch panel according to claim 4, wherein,
the second included angle is smaller than a third included angle between a third surface of the second metal layer and a fourth surface of the second metal layer, the third surface is opposite to the first surface, the fourth surface is opposite to the second surface, and the third surface is connected with the fourth surface.
6. The touch panel according to claim 1, wherein,
the insulating layer is provided with a first via hole and a second via hole, the first via hole extends to the surface of the first part far away from one side of the display module, and the second via hole extends to the surface of the third part far away from one side of the display module; the second metal layer is electrically connected with the first part through the first via hole, and the second metal layer is electrically connected with the third part through the second via hole.
7. The touch panel of claim 1, further comprising:
a first insulating block filled in a gap between the first portion and the second portion;
and a second insulating block filled in a gap between the second portion and the third portion.
8. The preparation method of the touch panel is characterized by comprising the following steps of:
providing a display module, wherein the display module comprises a step, the step comprises an upper step surface, a step slope surface and a lower step surface, and the step slope surface is connected with the upper step surface and the lower step surface;
forming a first metal layer on the display module, wherein the first metal layer is respectively disconnected at the upper step surface and the lower step surface to form a first part, a second part and a third part, and the second part is used for forming a heightening block; the second part is divided into a lower leveling section, an upper leveling section and a climbing section, wherein the lower leveling section covers the surface of the lower step surface, which is close to one side of the step slope, and is in contact with the step slope, the climbing section covers the step slope, and the upper leveling section covers the surface of the upper step surface, which is close to one side of the step slope;
forming an insulating layer on one side of the first metal layer far away from the display module;
and forming a second metal layer on one side of the insulating layer away from the first metal layer.
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