CN113629068A - Display panel and preparation method thereof - Google Patents
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- CN113629068A CN113629068A CN202110805346.9A CN202110805346A CN113629068A CN 113629068 A CN113629068 A CN 113629068A CN 202110805346 A CN202110805346 A CN 202110805346A CN 113629068 A CN113629068 A CN 113629068A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Abstract
The application discloses display panel and preparation method thereof, display panel include the display area and center on the non-display area of display area, the non-display area has crackle prevention district, display panel includes base plate, functional structure layer, luminescent device layer, slotted hole and film packaging layer. Polyimide with low elasticity modulus in the packaging layer is sequentially filled in the slotted holes with different depths in the functional structure layer, so that the bending stress can be released well, and the fracture of a signal line caused by repeated bending stress on the panel is avoided.
Description
Technical Field
The application relates to the technical field of display panels, in particular to a display panel and a preparation method thereof.
Background
Active Matrix Organic Light Emitting Diodes (AMOLEDs) are expected to replace liquid crystal as the mainstream choice of next generation displays due to the characteristics of high contrast, wide viewing angle, fast response speed, flexibility and the like.
The current folding mobile phone panel technology is rapidly developed, when the panel is subjected to bending reliability test, the panel is subjected to repeated bending stress to break a signal line, so that abnormal display is caused, and at present, in order to prevent the signal line from breaking, a scheme that an inorganic layer is excavated and the hole is filled with the organic layer is usually adopted.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a display panel 10 provided in the prior art, the display panel 10 includes a substrate layer 1, an inorganic layer 2, an organic layer 3, a light emitting layer 4, and an encapsulation layer 5, a slot 6 is disposed in the inorganic layer 2, and the slot 6 is filled with the organic layer 3. At present, the effect of the display panel for preventing the signal lines from being broken is not ideal, because the elastic modulus of the organic layer is not much different from that of the inorganic layer, so that the bending stress cannot be released well, and the path of the crack extending from the outside to the inside of the display panel is insufficient, so that the crack cannot be prevented from extending inwards well.
Therefore, there is a need to develop a new display panel to overcome the drawbacks of the prior art.
Disclosure of Invention
An object of the present invention is to provide a display panel capable of solving a problem in the prior art that a signal line is broken due to repeated bending stress applied to the display panel.
To achieve the above object, the present invention provides a display panel including a display area and a non-display area surrounding the display area, the non-display area having a crack prevention area, the display panel including a substrate; the functional structure layer is arranged on the substrate; the light-emitting device layer is arranged on the functional structure layer; a slot hole disposed in the crack prevention region, the slot hole being disposed in the functional structure layer; the film packaging layer is used for packaging the functional structure layer, an organic layer is arranged in the film packaging layer, the organic layer is arranged in the display area and extends to the crack prevention area and is filled in the slotted hole, at least one organic film layer is arranged in the functional structure layer, and the elastic modulus of the organic layer in the film packaging layer is lower than that of the organic film layer in the functional structure layer.
The organic layer with low elasticity modulus in the packaging layer is filled in the slotted hole in the functional structure layer, so that the bending stress can be released well, and the fracture of a signal line caused by the repeated bending stress of the panel is avoided.
Further, in other embodiments, the functional structure layer includes an active layer; the first metal insulating layer is arranged on the active layer and wraps the active layer; the first metal layer is arranged on the first metal insulating layer; the second metal insulating layer is arranged on the first metal layer and wraps the first metal layer; the second metal layer is arranged on the second metal insulating layer; the interlayer dielectric layer is arranged on the second metal layer; the source drain layer is arranged on the surface of the interlayer dielectric layer and is connected with the active layer; and the flat layer is arranged on the source drain layer. The elastic modulus of the organic layer in the film packaging layer is lower than that of the flat layer in the functional structure layer, so that the bending stress can be well released.
Further, in other embodiments, the slots include slots with different depths, and the slots with different depths extend to different film layers in the functional structure layer.
The organic layer with low elastic modulus is filled in the slotted holes with different depths in the functional structure layer, so that the bending stress can be further released.
Further, in other embodiments, the depth of the slot near the display area is greater than the depth of the slot far from the display area. This arrangement allows maximum release of the bending stress.
Further, in other embodiments, wherein the substrate comprises a substrate layer; the buffer layer is arranged on the substrate layer; the active layer is arranged on the buffer layer, and part of the buffer layer is exposed in the first slot hole.
Further, in other embodiments, the light emitting device layer includes a pixel defining layer disposed on the planarization layer, and the pixel defining layer has an opening; the anode layer is arranged in the opening and is connected with the source drain electrode; an OLED layer disposed on the anode layer; a cathode layer disposed on the OLED layer.
Further, in other embodiments, the thin film encapsulation layer comprises a first inorganic layer disposed on the cathode layer of the display area; a first organic layer disposed on the first inorganic layer of the display region and the functional structure layer of the crack prevention region and filled in the groove hole, wherein an elastic modulus of the first organic layer is lower than an elastic modulus of the planarization layer; and a second inorganic layer disposed on the first organic layer and extending from the display region to the crack prevention region. The elastic modulus of the first organic layer in the film packaging layer is lower than that of the flat layer in the functional structure layer, so that the bending stress can be well released.
Further, in other embodiments, the material of the first organic layer is polyimide. Polyimide with low elasticity modulus in the packaging layer is sequentially filled in the slotted holes with different depths in the functional structure layer, so that the bending stress can be released well, and the fracture of a signal line caused by repeated bending stress on the panel is avoided.
Further, in other embodiments, the planarization layer has a protrusion in the crack-preventing region, the protrusion includes a first protrusion and a second protrusion, the second protrusion is located on a side of the first protrusion away from the display region, the first protrusion is in contact with the first organic layer, and the second protrusion is in contact with the second inorganic layer. The design of providing the convex part of the flat layer in the crack prevention region at the edge position can prevent cracks by connecting the convex part with the second inorganic layer, and the convex part in the shape of the dam can play a role of preventing overflow of ink-jet printing, thereby further increasing the path of the inward extension of the cracks.
Further, in other embodiments, the slot is formed between the first protrusion and the second protrusion, so that the crack extension path is increased, and the crack is prevented from propagating to the display area.
Further, in other embodiments, the height of the second protrusion is greater than the height of the first protrusion. The protrusions of different heights further increase the crack extension path, preventing cracks from propagating toward the display area.
Further, in other embodiments, the display panel includes a bending region including the crack prevention region in a region of the non-display region. Through set up the slotted hole in the crackle prevents the district to fill the organic layer of low elastic modulus in the slotted hole, avoid the panel of bending zone to receive the fracture of the signal line that repeated bending stress appears.
In order to achieve the above object, the present invention further provides a manufacturing method for manufacturing the display panel according to the present invention, the manufacturing method including the steps of: preparing a substrate; preparing a functional structure layer on the substrate; preparing a light-emitting device layer on the functional structure layer; preparing a slotted hole in the crack prevention area, wherein the slotted hole is formed in the functional structure layer; preparing a film packaging layer for packaging the functional structure layer, wherein the film packaging layer is provided with an organic layer, the organic layer is arranged in the display area, extends to the crack prevention area and is filled in the slotted hole, the functional structure layer is provided with at least one organic film layer, and the elastic modulus of the organic layer in the film packaging layer is lower than that of the organic film layer in the functional structure layer.
In order to achieve the above object, the present invention further provides a display device including the display panel according to the present invention.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a display panel and a preparation method thereof.A functional structure layer is sequentially filled with polyimide with low elasticity modulus in a packaging layer in slotted holes with different depths, so that bending stress can be released better, and the breakage of a signal wire caused by repeated bending stress of the panel is avoided; in addition, the design of providing the projection of the flat layer in the second crack prevention region at the edge position can prevent cracks, and the projection of the dam shape can also play a role in preventing overflow of ink jet printing, thereby further increasing the path along which the cracks extend inward.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a display panel in the prior art;
fig. 2 is a schematic top view of a display panel according to an embodiment of the present invention;
fig. 3 is a schematic cross-sectional structural diagram of a display panel according to an embodiment of the present invention;
fig. 4 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention.
Description of the drawings in the background art:
a display panel-10;
a substrate-1; an inorganic layer-2;
organic layer-3; a light-emitting layer-4;
an encapsulation layer-5; a slot-6;
description of the figures in the detailed description:
a display panel-100; display area-101;
non-display area-102; crack-prevention zone-103;
a first crack prevention zone-1031; a second crack prevention region-1032;
a substrate-110; functional structural layer-120;
a light emitting device layer-130; a slot-140;
film encapsulation layer-150; a substrate layer-111;
a buffer layer-112; an active layer-121;
a first metal layer-123; a first metal insulating layer-122;
a second metal layer-125; a second metal insulating layer-124;
interlayer dielectric layer-126; a source drain layer-127;
a planarization layer-128; a first slot-141;
a second slot-142; a third slot-143;
pixel definition layer-131; anode layer-132;
an OLED layer-133; a cathode layer-134;
a substrate layer-111; an insulating layer-112;
a first inorganic layer-151; a first organic layer-152;
a second inorganic layer-153; a projection-129;
a first projection-1291; a second projection-1292.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
An embodiment of the present invention provides a display device, which includes a display panel 100, please refer to fig. 2, and fig. 2 is a schematic top view structure diagram of the display panel 100 according to the embodiment of the present invention, in which the display panel 100 includes a display area 101 and a non-display area 102 surrounding the display area 101, the non-display area 102 has a crack prevention area 103, an area within a dotted line is a bending area, and the bending area includes the crack prevention area 103 in the area of the non-display area 102, and the crack prevention area 103 is provided in this application to prevent a signal line from being broken due to repeated bending stress applied to the panel.
Referring to fig. 3, fig. 3 is a schematic cross-sectional structural view of the display panel 100 according to an embodiment of the present invention, in which the crack prevention region 103 includes a first crack prevention region 1031 and a second crack prevention region 1032, and the second crack prevention region 1032 is located on a side of the first crack prevention region 1031 away from the display region. The display panel 100 includes a substrate 110, a functional structure layer 120, a light emitting device layer 130, a slot 140, and a thin film encapsulation layer 150.
The substrate 110 extends from the display region to the crack prevention region 103, and includes a substrate layer 111 and a buffer layer 112 disposed on the substrate layer 111.
The functional structure layer 120 is disposed on the buffer layer 112, the functional structure layer 120 extends from the display region 101 to the crack prevention region 103, and the functional structure layer 120 includes an active layer 121, a first metal insulating layer 122, a first metal layer 123, a second metal insulating layer 124, a second metal layer 125, an interlayer dielectric layer 126, a source/drain layer 127, and a planarization layer 128. Wherein the active layer 121 is disposed on the buffer layer 112; the first metal insulating layer 122 is disposed on the active layer 121 and covers the active layer 121; the first metal layer 123 is disposed on the first metal insulation layer 122; the second metal insulation layer 124 is disposed on the first metal layer 123 and covers the first metal layer 123; the second metal layer 125 is disposed on the second metal insulation layer 124; an interlayer dielectric layer 126 is disposed on the second metal layer 125; the source drain layer 127 is arranged on the surface of the interlayer dielectric layer 126 and is connected with the active layer 121; a planarization layer 128 is disposed on source drain layer 127.
The light emitting device layer 130 is disposed on the functional structure layer 120; the light emitting device layer 130 includes a pixel defining layer 131, an anode layer 132, an OLED layer 133, and a cathode layer 134. Wherein the pixel defining layer 131 is disposed on the planarization layer 128, and the pixel defining layer 131 has an opening; the anode layer 132 is disposed in the opening and connected to the source/drain layer 127; an OLED layer 133 disposed on anode layer 132; cathode layer 134 is disposed on OLED layer 133.
The slot 140 is disposed in the crack preventing region 103, the slot 140 includes a first slot 141, a second slot 142 and a third slot 143, the depth of the first slot 141 is greater than that of the second slot 142, and the depth of the second slot 142 is greater than that of the third slot 143. The first slot 141 is disposed in the first crack-preventing region 1031, penetrates through the functional structure layer 120 from the surface of the planarization layer 128 away from the substrate 110 and extends to the surface of the substrate 110, and a portion of the buffer layer 112 is exposed in the first slot 141; the second slot 142 is disposed in the first crack-preventing region 1031, and extends from a surface of the planarization layer 128 away from the substrate 110 to a surface of the first metal insulation layer 122, and a portion of the first metal insulation layer 122 is exposed in the second slot 142; the third slot 143 is disposed in the second crack-prevention region 1032, and extends from a surface of the planarization layer 128 away from the substrate 110 to a surface of the second metal insulation layer 124, and a portion of the second metal insulation layer 124 is exposed in the third slot 143.
The thin film encapsulation layer 150 is used for encapsulating the functional structure layer 120, and the thin film encapsulation layer 150 includes a first inorganic layer 151, a first organic layer 152 and a second inorganic layer 153. The first inorganic layer 151 is disposed on the cathode layer 134 of the display region; the first organic layer 152 is disposed on the first inorganic layer 151 of the display region and the functional structure layer 120 of the crack prevention region 103, and is filled in the first slot 141, the second slot 142, and the third slot 143; the second inorganic layer 153 is disposed on the first organic layer 152, extending from the display region 101 to the second crack prevention region 1032.
The buffer layer 112 is connected to the first organic layer 152 through the first slot 141, the first metal insulation layer 122 is connected to the first organic layer 152 through the second slot 142, the second metal insulation layer 124 is connected to the first organic layer 152 through the third slot 143, and the elastic modulus of the first organic layer 152 is lower than that of the planarization layer 128.
Please refer to the following table, which shows different film materials in the functional layer structure layer and the film encapsulation layer and their corresponding elastic moduli.
Polyimide is used as the material of the first organic layer 152. Polyimide with low elasticity modulus in the packaging layer is sequentially filled in the slotted holes with different depths in the functional structure layer 120, so that the bending stress can be released well, and the fracture of a signal line caused by repeated bending stress on the panel is avoided.
The planarization layer 128 has a protrusion 129 within the second crack prevention region 1032, the protrusion 129 includes a first protrusion 1291 and a second protrusion 1292, the second protrusion 1292 is located at a side of the first protrusion 1291 away from the display region 101, the first protrusion 1291 is contiguous with the first organic layer 152, and the second protrusion 1292 is contiguous with the second inorganic layer 153. The design of providing the projections of the planarization layer 128 in the second crack prevention region 1032 at the edge position can prevent both the cracks and the dam-shaped projections from overflowing in the inkjet printing, and further increase the path along which the cracks extend inward.
The third slit hole 143 between the first protrusion 1291 and the second protrusion 1292 increases a crack extension path, preventing a crack from propagating toward the display region.
Wherein the height of the second protrusion 1292 is greater than the height of the first protrusion 1291, the protrusions with different heights further increase the crack extension path, preventing the crack from propagating toward the display region.
Referring to fig. 4, fig. 4 is a flowchart illustrating a method for manufacturing a display panel 100 according to an embodiment of the present invention, where the method includes the following steps 1-5.
Step 1: a substrate 110 is prepared, the substrate 110 extending from the display region 101 to the non-display region 102.
Specifically, step 1 includes steps 11 to 12;
step 11: providing a glass substrate, preparing a substrate layer 111 on the glass substrate, wherein the substrate layer 111 extends from the display area 101 to the non-display area 102;
step 12: a buffer layer 112 is formed on the substrate layer 111, and the buffer layer 112 extends from the display region 101 to the non-display region 102.
Step 2: the functional structure layer 120 is prepared on the substrate 110, and the functional structure layer 120 extends from the display region 101 to the non-display region 102.
Specifically, step 2 includes steps 21 to 28;
step 21: depositing polycrystalline silicon on the buffer layer 112, and preparing a semiconductor layer pattern through a photolithography process to form an active layer 121; the active layer 121 has a thickness of
Step 22: preparing a first metal insulating layer 122 on the active layer 121 and covering the active layer 121;
step 23: preparing a first metal layer 123 on the first metal insulation layer 122;
step 24: preparing a second metal insulation layer 124 on the first metal layer 123 and coating the first metal layer 123;
step 25: preparing a second metal layer 125 on the second metal insulation layer 124;
step 26: preparing an interlayer dielectric layer 126 on the second metal layer 125, and forming an interlayer dielectric hole by utilizing photoetching and dry etching;
step 27: depositing a source and a drain on the surface of the interlayer dielectric layer 126, connecting the source and the drain with the active layer 121 through the interlayer dielectric hole, and preparing a source and drain pattern by photoetching and wet etching to form a source and drain layer 127;
step 28: a planarization layer 128 is fabricated on the source drain layer 127.
And step 3: a light emitting device layer 130 is prepared on the functional structure layer 120.
Specifically, step 3 includes steps 31 to 34;
step 31: depositing ITO/Ag/ITO on the source drain layer to form an anode layer 132;
step 32: preparing a pixel defining layer 131 on the planarization layer 128, wherein the pixel defining layer 131 has an opening, and the anode layer 132 is located in the opening;
step 33: preparing an OLED layer 133 on the anode layer 132;
step 34: a cathode layer 134 is prepared on the OLED layer 133.
And 4, step 4: the slot 140 is formed in the crack-preventing region, and the slot 140 extends from the side of the functional structure layer 120 away from the substrate 110 to the functional structure layer 120.
Specifically, step 4 includes steps 41-43;
step 41: preparing a first slot 141 in the first crack prevention region 1031, extending from the side of the planarization layer 128 away from the substrate 110 to the surface of the substrate 110 through the functional structure layer 120, and exposing a portion of the buffer layer 112 in the first slot 141;
step 42: preparing a second slot 142 in the first crack-preventing region 1031, extending from a surface of the planarization layer 128 away from the substrate 110 to a surface of the first metal insulation layer 122, wherein a portion of the first metal insulation layer 122 is exposed in the second slot 142;
step 43: a third trench 143 is formed in the second crack-preventing region 1032, extending from a surface of the planarization layer 128 away from the substrate 110 to a surface of the second metal insulation layer 124, and a portion of the second metal insulation layer 124 is exposed in the third trench 143.
And 5: the film encapsulation layer 150 is prepared to encapsulate the functional structure layer 120, and at least one layer of encapsulation layer is disposed in the display region, extends to the crack prevention region, and is filled in the slot hole, and the modulus of the encapsulation layer is lower than that of the functional structure layer 120.
Specifically, step 5 includes steps 51-53;
step 51: preparing a first inorganic layer 151 on the cathode layer 134 of the display region;
step 52: preparing a first organic layer 152 on the first inorganic layer 151 of the display region and the functional structure layer 120 of the crack prevention region 103 by using an inkjet printing process, and filling the first, second and third slots 141, 142 and 143 with the first organic layer 152, wherein the elastic modulus of the first organic layer 152 is lower than that of the functional structure layer 120;
step 53: a second inorganic layer 153 is prepared to extend from the display region 101 to the second crack prevention region 1032, provided on the first organic layer 152.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a display panel, a preparation method thereof and a display device.A functional structural layer is sequentially filled with low-elasticity-modulus polyimide in a packaging layer in slotted holes with different depths, so that bending stress can be released better, and the breakage of a signal wire caused by repeated bending stress on the panel is avoided; in addition, the design of providing the projection of the flat layer in the second crack prevention region at the edge position can prevent cracks, and the projection of the dam shape can also play a role in preventing overflow of ink jet printing, thereby further increasing the path along which the cracks extend inward.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The display panel, the manufacturing method thereof, and the display device provided in the embodiments of the present application are described in detail above, and specific examples are applied in the description to explain the principle and the implementation of the present application, and the description of the embodiments above is only used to help understanding the technical solution and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. A display panel comprising a display area and a non-display area surrounding the display area, the non-display area having a crack prevention area, characterized in that the display panel comprises
A substrate;
the functional structure layer is arranged on the substrate;
the light-emitting device layer is arranged on the functional structure layer;
a slot hole disposed in the crack prevention region, the slot hole being disposed in the functional structure layer;
the film packaging layer is used for packaging the functional structure layer, an organic layer is arranged in the film packaging layer, the organic layer is arranged in the display area and extends to the crack prevention area and is filled in the slotted hole, at least one organic film layer is arranged in the functional structure layer, and the elastic modulus of the organic layer in the film packaging layer is lower than that of the organic film layer in the functional structure layer.
2. The display panel of claim 1, wherein the functional structure layer comprises
An active layer;
the first metal insulating layer is arranged on the active layer and wraps the active layer;
the first metal layer is arranged on the first metal insulating layer;
the second metal insulating layer is arranged on the first metal layer and wraps the first metal layer;
the second metal layer is arranged on the second metal insulating layer;
the interlayer dielectric layer is arranged on the second metal layer;
the source drain layer is arranged on the surface of the interlayer dielectric layer and is connected with the active layer;
and the flat layer is arranged on the source drain layer.
3. The display panel of claim 2, wherein the slots comprise slots of different depths, the slots of different depths extending to different layers in the functional structure layer.
4. The display panel of claim 3, wherein a depth of the slot proximate to the display area is greater than a depth of the slot distal to the display area.
5. The display panel of claim 2, wherein the thin film encapsulation layer comprises
A first inorganic layer disposed on the light emitting device layer of the display region;
a first organic layer disposed on the first inorganic layer of the display region and the functional structure layer of the crack prevention region and filled in the groove hole, wherein an elastic modulus of the first organic layer is lower than an elastic modulus of the planarization layer;
and a second inorganic layer disposed on the first organic layer and extending from the display region to the crack prevention region.
6. The display panel of claim 5,
the flat layer has a protrusion in the crack-preventing region, the protrusion including a first protrusion and a second protrusion, the second protrusion being located on a side of the first protrusion away from the display region, the first protrusion being in contact with the first organic layer, and the second protrusion being in contact with the second inorganic layer.
7. The display panel of claim 6, wherein the first protrusion and the second protrusion have a slot therebetween.
8. The display panel according to claim 7, wherein a height of the second projection is larger than a height of the first projection.
9. The display panel of claim 1,
the display panel includes a bending region including the crack prevention region in a region of the non-display region.
10. A manufacturing method for manufacturing the display panel according to claim 1, comprising the steps of:
preparing a substrate;
preparing a functional structure layer on the substrate;
preparing a light emitting device layer on the functional structure layer;
preparing a slotted hole in the crack prevention area, wherein the slotted hole is formed in the functional structure layer;
preparing a film packaging layer for packaging the functional structure layer, wherein the film packaging layer is provided with an organic layer, the organic layer is arranged in the display area, extends to the crack prevention area and is filled in the slotted hole, the functional structure layer is provided with at least one organic film layer, and the elastic modulus of the organic layer in the film packaging layer is lower than that of the organic film layer in the functional structure layer.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106449702A (en) * | 2016-09-20 | 2017-02-22 | 上海天马微电子有限公司 | Organic light emitting display panel and manufacturing method |
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| CN112038356A (en) * | 2020-08-31 | 2020-12-04 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel |
| CN112420896A (en) * | 2020-11-10 | 2021-02-26 | 武汉华星光电半导体显示技术有限公司 | Flexible display module, display device and manufacturing method of display device |
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| CN106449702A (en) * | 2016-09-20 | 2017-02-22 | 上海天马微电子有限公司 | Organic light emitting display panel and manufacturing method |
| CN108963103A (en) * | 2018-06-28 | 2018-12-07 | 武汉华星光电半导体显示技术有限公司 | OLED display panel |
| CN109860266A (en) * | 2019-03-12 | 2019-06-07 | 武汉华星光电半导体显示技术有限公司 | A kind of display panel and display device |
| CN112038356A (en) * | 2020-08-31 | 2020-12-04 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel |
| CN112420896A (en) * | 2020-11-10 | 2021-02-26 | 武汉华星光电半导体显示技术有限公司 | Flexible display module, display device and manufacturing method of display device |
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