CN113900542A - Touch panel and preparation method thereof - Google Patents
Touch panel and preparation method thereof Download PDFInfo
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- CN113900542A CN113900542A CN202111171763.9A CN202111171763A CN113900542A CN 113900542 A CN113900542 A CN 113900542A CN 202111171763 A CN202111171763 A CN 202111171763A CN 113900542 A CN113900542 A CN 113900542A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
The application provides a touch panel and a preparation method thereof. The touch panel comprises a display module, a first metal layer, an insulating layer and a second metal layer, wherein the display module comprises a step, the step comprises an upper step surface, a step slope surface and a lower step surface, and the step slope surface is connected with the upper step surface and the lower step surface; the display module comprises a display module, a first metal layer, a second metal layer and a third metal layer, wherein the first metal layer is arranged on the display module, the first metal layer is respectively disconnected at an upper step surface and a lower step surface to form a first part, a second part and a third part, and the second part is used for forming a padding block; the insulating layer is arranged on one side of the first metal layer, which is far away from the display module; and the second metal layer is arranged on one side of the insulating layer far away from the first metal layer. Need not to increase the thickness of insulating layer in this application, utilize second part bed hedgehopping lower step face to can slow down the difference in height, reduce the line of second metal level and produce easily in step department and remain and cause the risk of adjacent line short circuit of walking, practice thrift the cost simultaneously, and simplify touch panel's preparation technology.
Description
Technical Field
The application relates to the technical field of touch panels, in particular to a touch panel and a preparation method thereof.
Background
At present, in the process of manufacturing a touch panel, after a display module is manufactured, a metal layer is usually manufactured on the display module as a touch electrode, so as to form metal traces by patterning. The routing of the metal layer can be gathered to the frame of the touch panel and led out to the pad area of the touch panel. However, on the path where the trace of the metal layer is led out to the pad area of the touch panel, the trace of the metal layer is easy to remain at the step due to the step difference of the metal layer at the step of the display module, thereby causing the short circuit of the adjacent trace.
Disclosure of Invention
In view of this, the present application provides a touch panel and a method for manufacturing the same, so as to solve the problem that the traces of the metal layer are easy to remain at the step to cause short circuit of the adjacent traces.
A first aspect of the present application provides a touch panel. The touch panel comprises a display module, a first metal layer, an insulating layer and a second metal layer, wherein the display module comprises a step, the step comprises an upper step surface, a step slope surface and a lower step surface, and the step slope surface is connected with the upper step surface and the lower step surface; the first metal layer is arranged on the display module, wherein the first metal layer is respectively disconnected at the upper step surface and the lower step surface to form a first part, a second part and a third part, and the second part is used for forming a padding block; the insulating layer is arranged on one side of the first metal layer, which is far away from the display module; and the second metal layer is arranged on one side of the insulating layer far away from the first metal layer.
In an embodiment of the application, the second portion includes a lower flat section covering a surface of the lower step surface on a side close to the step slope surface and contacting the step slope surface.
In an embodiment of the application, the second portion further includes an upper leveling section and a climbing section, the climbing section covers the step slope, and the upper leveling section covers a surface of the upper step surface on a side close to the step slope.
In an embodiment of the application, in a stacking direction, a thickness of the first metal layer is smaller than a thickness of the insulating layer, and the stacking direction is a direction in which the display module, the first metal layer, the insulating layer, and the second metal layer are stacked in sequence.
In an embodiment of the present application, the thickness of the insulating layer is 1.01 to 1.5 times of the thickness of the first metal layer.
In an embodiment of the application, a first included angle between the step slope surface and the lower step surface is smaller than a second included angle between a first surface of the insulating layer and a second surface of the insulating layer, wherein the first surface is opposite to the step slope surface, the second surface is opposite to the lower step surface, and the first surface is connected to the second surface.
In an embodiment of the application, the second included angle is smaller than a third included angle between a third surface of the second metal layer and a fourth surface of the second metal layer, the third surface is disposed opposite to the first surface, the fourth surface is disposed opposite to the second surface, and the third surface is connected to the fourth surface.
In an embodiment of the application, a first via hole and a second via hole are formed in the insulating layer, the first via hole extends to the surface of the first portion on the side away from the display module, and the second via hole extends to the surface of the third portion on the side away from the display module; the second metal layer is electrically connected with the first part through the first via hole, and the second metal layer is electrically connected with the third part through the second via hole.
In an embodiment of the present application, the touch panel further includes a first insulating block and a second insulating block. The first insulating block is filled in the gap between the first part and the second part; the second insulating block is filled in a gap between the second portion and the third portion.
A second aspect of the present application provides a method for manufacturing a touch panel. The manufacturing method of the touch panel comprises the steps of providing a display module, wherein the display module comprises steps, each step comprises an upper step surface, a step slope surface and a lower step surface, and the step slope surfaces are connected with the upper step surfaces and the lower step surfaces; forming a first metal layer on the display module, wherein the first metal layer is broken at the upper step surface and the lower step surface respectively to form a first part, a second part and a third part, and the second part is used for forming a padding block; forming an insulating layer on one side of the first metal layer, which is far away from the display module; and forming a second metal layer on one side of the insulating layer far away from the first metal layer.
According to the technical scheme provided by the embodiment of the application, the first metal layer is disconnected at the upper step surface and the lower step surface to form the first part, the second part and the third part, the second part is used for forming the heightening block, so that the second part is directly padded on the surface of the lower step surface close to one side of the slope surface of the step, the thickness of the insulating layer is not required to be increased, the lower step surface is heightened by utilizing the second part, the risk that the wiring of the second metal layer is easy to remain at the step position to cause short circuit of the adjacent wiring is reduced, the cost is saved, and the preparation process of the touch panel is simplified.
Drawings
Fig. 1A is a schematic top view of a touch panel.
Fig. 1B is a schematic cross-sectional structure diagram of a touch panel.
Fig. 1C is a schematic cross-sectional structure diagram of another touch panel.
Fig. 2A is a schematic cross-sectional structure diagram of a touch panel according to a first embodiment of the present application.
Fig. 2B is a schematic top view of a touch panel according to a first embodiment of the present disclosure.
Fig. 3A is a schematic cross-sectional structure diagram of a touch panel according to a second embodiment of the present application.
Fig. 3B is a schematic top view of a touch panel according to a second embodiment of the present disclosure.
Fig. 4 is a schematic cross-sectional structure view of a touch panel according to a third embodiment of the present application.
Fig. 5 is a schematic cross-sectional structure view of a touch panel according to a fourth embodiment of the present disclosure.
Fig. 6 is a schematic flow chart illustrating a manufacturing method of a touch panel according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the process of manufacturing the touch panel, the first metal layer, the insulating layer and the second metal layer are usually manufactured on the display module in a stacked manner, wherein the traces of the first metal layer and the second metal layer are easy to remain at the step to cause the adjacent trace short circuit. The applicant has found, through research, that the reasons for this problem are as follows: when the insulating layer is adopted to heighten the step, thickening processing is needed to be carried out on the insulating layer, and the thickening processing is difficult to accurately control the thickness increased by the insulating layer, so that more steps are generated (if any surface of the thickening processing is likely to generate new steps, the number of the new steps is less than 3 and 5, and more than a plurality of steps are generated), and further, the wiring of the second metal layer is left at the step, so that the adjacent wiring short circuit is caused. In order to solve the above problems, the applicant researches and discovers that the first metal layer is disconnected at the upper step surface and the lower step surface to form a first portion, a second portion and a third portion, and the second portion at least covers the surface of the lower step surface close to the step slope surface, so that the second portion can be directly padded on the surface of the lower step surface close to the step slope surface without increasing the thickness of an insulating layer, the height of the step to be covered by the second metal layer is reduced by using the second portion, the risk that the wiring of the second metal layer is remained at the step to cause short circuit of adjacent wirings is reduced, and meanwhile, the preparation process of the touch panel is simplified.
Fig. 1A is a schematic top view of a touch panel. Fig. 1B is a schematic cross-sectional structure diagram of a touch panel. Fig. 1C is a schematic cross-sectional structure diagram of another touch panel.
As shown in fig. 1A, the touch panel 100 includes a display area 10, a bezel area 20, and a pad area 30. The display region 10 is provided with a first electrode 110, a second electrode 120, and a connecting bridge 130 for electrically connecting the segments of the second electrode 120 separated by the first electrode 110. A first trace 140 connecting the first electrode 110 and a second trace 150 connecting the second electrode 120 may be disposed in the bezel region 20 and the pad region 30, and the bezel region 20 includes a lower bezel 21. The first trace 140 and the second trace 150 are gathered to the lower frame 21 of the touch panel 100 and led out to the pad area 30.
It should be understood that the arrangement of the first trace 140 and the second trace 150 in fig. 1A is only an example, and the present application is not limited thereto.
Fig. 1B is an enlarged cross-sectional view of the touch panel shown in fig. 1A along AA' in an area B. As shown in fig. 1B, the touch panel 100 includes a display module 160 and a touch module 170, and the touch panel 100 is divided into a first routing area 100a, a step area 100B and a second routing area 100 c. The display module 160 includes a first film layer 161 (e.g., a display film layer) and a second film layer 162 (e.g., an encapsulation layer) stacked together, wherein a step 1 is formed by the first film layer 161 and the second film layer 162, and the step 1 is located in the step area 100 b. The touch module 170 includes a first metal layer 171, an insulating layer 172, and a second metal layer 173 stacked on each other.
The first film layer 161 protrudes beyond the second film layer 162 in a direction perpendicular to the stacking direction DD' to form a step 1 in the step region 100 b. Each of the first film 161 and the second film 162 may include one or more films, which is not particularly limited in this application.
It is to be understood that the connection bridge 130 may be disposed in the first metal layer 171 and the first and second electrodes 110 and 120 may be disposed in the second metal layer 173 in the display region 10. In the region B, the first trace 140 may be disposed in the first metal layer 171. In the region C, the second trace 150 may be disposed in the first metal layer 171. The step 1 is located in the step area 100b, the step area 100b may be any area on the touch panel 100 that includes the step 1, and the step area 100b may also be referred to as a segment difference area, which is not specifically limited in this application.
Fig. 1B is a schematic cross-sectional view of a touch panel in an ideal state. As shown in fig. 1B, the first metal layer 171 in the step area 100B is usually completely etched away, so that the first metal layer 171 is divided into two parts, and the etched area is filled with the insulating layer 172, and the second metal layer 173 is electrically connected to the two parts of the first metal layer 171 through the first via 172a and the second via 172B on the insulating layer 172, respectively, so as to solve the problem that the trace of the first metal layer 171 is easy to remain at the step 1 to cause a short circuit of the adjacent traces. Ideally, after the insulating layer 172 is filled, the surface of the insulating layer 172 away from the first metal layer 171 is flat.
However,referring to FIG. 1C, in practical operation, filling the etched region with the insulating layer 172 requires that the insulating layer in the step region 100b has a thickness H1Increase to H2And the thickness of the insulating layer in the second routing area 100c also needs to be increased. The thickness of the insulating layer is increased by setting the thickness of the insulating layer to H2And then the insulating layer at the thicker position is etched, and in this way, the height of the etching process is difficult to control accurately. Another way to increase the thickness of the insulating layer is to set the thickness of the insulating layer to H first1Then, the thickness of the insulating layer in the step region 160b is adjusted from H by masking (mask)1Increase to H2This approach requires the mask to be completely attached to the surface of the display module, otherwise, during the deposition of the coating, the material of the insulating layer may enter from the gap between the mask and the surface of the display module, so that the thickness of the peripheral region of the step region is between H and H1And H2Moreover, when the mask is used for coating, the insulating layer can be coated on the mask, and the mask fails. Because the height that different positions department required etching is different, therefore all need etch many times in these two kinds of modes, the operation complexity is high, and the thickness of insulating layer all hardly carries out accurate control, consequently also can make the insulating layer keep away from the surface of display module assembly one side and be unevenness, also can produce more new steps, and then lead to the line of walking in the second metal level to have the short circuit risk easily, and realizability is not strong.
Fig. 2A is a schematic cross-sectional structure diagram of a touch panel according to a first embodiment of the present application. Fig. 2B is a schematic top view of a touch panel according to a first embodiment of the present disclosure. As shown in fig. 2, the touch panel 200 includes a display module 210, a first metal layer 220, an insulating layer 230, and a second metal layer 240. The display module 210 includes a step 2, the step 2 includes an upper step surface 2a, a step slope surface 2b and a lower step surface 2c, and the step slope surface 2b connects the upper step surface 2a and the lower step surface 2 c. The first metal layer 220 is disposed on the display module 210, the first metal layer 220 is broken at the upper step surface 2a and the lower step surface 2c to form a first portion 2201, a second portion 2202, and a third portion 2203, and the second portion 2202 is used to form a block for pad-up. The insulating layer 230 is disposed on a side of the first metal layer 220 away from the display module 210. The second metal layer 240 is disposed on a side of the insulating layer 230 away from the first metal layer 220.
It should be understood that the first metal layer 220 is broken at the upper step surface 2a and the lower step surface 2c, and a gap 3 exists between any two adjacent portions of the first portion 2201, the second portion 2202 and the third portion 2203, and the gap 3 may be not filled with other materials, or may be filled with other materials, such as insulating materials, which can prevent any two adjacent portions from being electrically connected, and this is not particularly limited in this application. An area between a side surface of the first portion 2201 near the second portion 2202 and a side surface of the third portion 2203 near the second portion 2202 may form a stepped region 210a, with a step 2 located within the stepped region 210a and the second portion 2202 also located within the stepped region 210 a.
The step 2 may be a step generated at any position in the display module 210, which is not specifically limited in this application. The display module 210 and the first metal layer 220 may be in direct contact or indirect contact, for example, other film layers such as a substrate layer may be disposed between the display module 210 and the first metal layer 220, which is not specifically limited in this application. The material of the substrate layer may be transparent and insulating, including but not limited to rigid or flexible materials such as polyethylene, polymethylmethacrylate, polyethylene terephthalate, or glass. The substrate layer can also be filled on the lower step surface, so that the metal residue risk of the first metal layer in the step area is reduced, and more steps can not be generated due to the fact that the height of the substrate layer can be accurately controlled.
The second metal layer 240 may be electrically connected to the first portion 2201 and the third portion 2203, thereby performing a touch function. The second portion 2202 is used to form a step-up block, so that the second portion 2202 has no conduction function, that is, the trace of the second portion 2202 is not electrically connected to the traces of the first portion 2201, the third portion 2203 and the second metal layer 240, so that the step-up lower surface 2c of the second portion 2202 can be used to avoid the adjacent traces from being short-circuited due to the fact that the traces of the first metal layer 220 and the second metal layer 240 are easy to remain at the step.
The insulating layer 230 and the second metal layer 240 may be a uniform film formed by a single process, and may be formed by deposition, evaporation, or spin coating. Thickness H of first metal layer 2203May be less than the thickness H of the insulating layer 2304Or may be larger than the thickness H of the insulating layer 2304And may also be equal to the thickness H of the insulating layer 2304This is not a specific limitation of the present application. The insulating layer 230 at the position of the gap 3 preferentially covers the surface of the bare drain in the gap 3 and then is stacked in the stacking direction, so that when the second metal layer 240 is provided on the insulating layer 230, even if the thickness H of the first metal layer 220 is large3Is less than or equal to the thickness H of the insulating layer 2304In the gap 3, the insulating layer 230 is also disposed between the second metal layer 240 and the first metal layer 220, and the second metal layer 240 does not directly contact with the first metal layer 220, so that the second portion 2202 is not electrically connected to the first portion 2201, the third portion 2203 and the second metal layer 240.
According to the technical scheme provided by the embodiment of the application, the first metal layer is arranged to be disconnected at the upper step surface and the lower step surface and form the first part, the second part and the third part, the second part is used for forming the padding block, so that the padding of the insulating layer is not needed to be additionally adopted, the lower step surface is padded by the second part, the cost is saved, and the risk that the adjacent routing short circuit is caused because the routing of the second metal layer is easy to remain at the step is reduced. In addition, the second part is formed simultaneously with the first part and the third part, the second part is adopted to form the heightening block, and the insulating layer does not need to be additionally thickened, so that the phenomenon that more steps are generated on the surface of the insulating layer far away from the display module due to the fact that the thickness of the insulating layer is increased and accurate control is difficult to perform is avoided, and meanwhile, the preparation process of the touch panel is simplified.
In an embodiment of the present application, the second portion 2202 includes a lower flat section 2202a, and the lower flat section 2202a covers a surface of the lower step surface 2c on a side close to the step slope surface 2b and is in contact with the step slope surface 2 b.
It should be understood that the lower flat section 2202a is a portion of the second portion 2202 that covers the surface of the lower step surface 2c on the side close to the step slope 2b, and the lower flat section 2202a covers the surface of the lower step surface 2c on the side close to the step slope 2b, and also covers a portion of the step slope 2b, and thus comes into contact with the step slope 2 b. The height of the step 2 can be understood as the vertical distance between two parallel surfaces corresponding to the upper step surface 2b and the lower step surface 2c, and the height of the step 2 can also be referred to as the height of the level difference.
In the embodiment of the application, the second part comprises the lower leveling section, so that the second part is used for heightening the lower step surface, and when the second metal layer is arranged, the height of the step is reduced by the height corresponding to the lower leveling section (the height is equal to the thickness of the first metal layer), so that the risk that the wiring of the second metal layer is easy to remain at the step to cause the short circuit of the adjacent wiring is reduced.
Fig. 3A is a schematic cross-sectional structure diagram of a touch panel according to a second embodiment of the present application. Fig. 3B is a schematic top view of a touch panel according to a second embodiment of the present disclosure. The embodiment shown in fig. 3A and 3B is an example of the embodiment shown in fig. 2A and 2B. As shown in fig. 3A and 3B, the difference from the embodiment shown in fig. 2A is that the second portion 2202 further includes an upper flat section 2202B and a climbing section 2202c, the climbing section 2202c covers the step slope 2B, and the upper flat section 4 covers a surface of the upper step surface 2A on a side close to the step slope 2B.
The upper flat section 2202b is a portion of the second portion 2202 that covers a surface of the upper step surface 2a on a side close to the step slope 2b, and the climbing section 2202c is a portion of the second portion 2202 that covers a surface of the step slope 2 b. The division of the lower leveling section 2202a, the upper leveling section 2202b, and the climbing section 2202c may be different according to habits of different users, which is not specifically limited in the present application.
In some embodiments, the display module 210 may include a first film layer 211 and a second film layer 212, and the step 2 may be formed by the first film layer 211 and the second film layer 212. In some embodiments, the first film layer 211 may be a display film layer and the second film layer 212 may be an encapsulation layer. The encapsulation layer may be composed of a film layer, or may be composed of a plurality of organic layers and/or inorganic layers, which is not specifically limited in this application. The first film 211 includes, but is not limited to, a display film, and the second film 212 includes, but is not limited to, an encapsulation film, as long as the first film 211 and the second film 212 can form a step, which is not particularly limited in this application. The first film layer 211 and the second film layer 212 form a step, so that more parts can be arranged on the surface of the first film layer 211 extending out of the second film layer 212, which is beneficial to thinning of the touch panel.
According to the technical scheme provided by the embodiment of the application, the second part further comprises an upper leveling section and a climbing section, so that the second part can cover the step slope surface and the lower step surface simultaneously. Meanwhile, the upper leveling section and the climbing section can also fill the slope surface of the step and the upper part of the lower step surface, so that the depression of the insulating layer at the upper leveling section and the climbing section is avoided, and the risk of short circuit of the second metal layer at the step is further reduced.
In an embodiment of the present application, the insulating layer 230 is provided with a first via 230a and a second via 230b, the first via 230a extends to a surface of the first portion 2201 on a side away from the display module 210, and the second via 230b extends to a surface of the third portion 2203 on a side away from the display module 210; the second metal layer 240 is electrically connected to the first portion 2201 through the first via 230a, and the second metal layer 240 is electrically connected to the third portion 2203 through the second via 230 b.
For example, after the insulating layer 230 is patterned, the first via hole 230a and the second via hole 230b are formed on the insulating layer 230, and the first via hole 230a and the second via hole 230b penetrate the entire insulating layer 230.
In the embodiment of the application, the first via hole and the second via hole are formed in the insulating layer, so that the second metal layer is electrically connected with the first part through the first via hole and electrically connected with the third part through the second via hole, and a touch function is realized.
Fig. 4 is a schematic cross-sectional structure view of a touch panel according to a third embodiment of the present application. The embodiment shown in fig. 4 is an example of the embodiment shown in fig. 3A. As shown in fig. 4, unlike the embodiment shown in fig. 3AIn that the thickness H of the first metal layer 220 in the stacking direction DD' is3Is less than the thickness H of the insulating layer 2304. The stacking direction is a direction in which the display module 210, the first metal layer 220, the insulating layer 230, and the second metal layer 240 are sequentially stacked.
It should be understood that the technical features of the embodiment shown in fig. 4 can also be combined with the technical features of the embodiment shown in fig. 2A, and are not described herein again.
According to the technical scheme provided by the embodiment of the application, the thickness H of the first metal layer is set3Less than the thickness H of the insulating layer4Therefore, the insulating layer can fill the gap between the first part and the second part and the gap between the second part and the third part, the second metal layer at the gap can be further prevented from being electrically connected with the first metal layer, the risk of short circuit of the wiring of the second metal layer is reduced, and the realizability is improved.
In an embodiment of the present application, the thickness H of the insulating layer 2304Is the thickness H of the first metal layer 22031.01 to 1.5 times of the total weight of the composition.
It should be understood that the thickness of the insulating layer 230 may be 1.01 times, 1.13 times, 1.2 times, 1.35 times, 1.5 times, etc. the thickness of the first metal layer 220, which is not particularly limited in this application.
In the embodiment of the application, the thickness of the insulating layer is 1.01-1.5 times of that of the first metal layer, so that the insulating layer can fill the gap between the first part and the second part and the gap between the second part and the third part, and meanwhile, the height of a new step generated at the gap is controlled in a smaller range, and the risk of short circuit of the second metal layer caused by the height of the step generated at the gap is reduced.
In an embodiment of the present application, a first included angle α between the step slope surface 2b and the lower step surface 2c1Smaller than the first surface S of the insulating layer 2301And the second surface S of the insulating layer 2302Second included angle alpha therebetween2Wherein the first surface S1Arranged opposite to the step slope 2b, a second surface S2A first surface S arranged opposite to the lower step surface 2c1And the second surface S2Are connected.
In some embodiments, since the first metal layer 220 and the insulating layer 230 have the step 2 in the stepped region 210a when the first metal layer 220 and the insulating layer 230 are formed in the stepped region 210a, the materials of the first metal layer 220 and the insulating layer 230 are more easily formed at α1Thus, the first metal layer 220 and the insulating layer 230 are naturally formed while alpha is naturally generated without thickening the first metal layer 220 and the insulating layer 2302Will be greater than alpha1. In other embodiments, the material of the first metal layer 220 or the insulating layer 230 may be increased at the step, and the forming time of the first metal layer 220 and the insulating layer 230 may be prolonged at the step, so that α2Greater than alpha1. In addition, since α is set2Greater than alpha1Easy to control, and thus has strong realizability.
In the embodiment of the application, alpha is set1Less than alpha2Thereby making alpha2Relative to alpha1More gently, when the second metal layer is formed on the side of the insulating layer far away from the display module, the wiring of the second metal layer can be further reduced at alpha2The risk of short circuits occurring at the corresponding locations.
In an embodiment of the present application, the second included angle α2A third surface S smaller than the second metal layer 2403And the fourth surface S of the second metal layer4Third included angle alpha therebetween3Third surface S3And the first surface S1Oppositely arranged, fourth surface S4And the second surface S2Oppositely arranged, a third surface S3And the fourth surface S4Are connected.
In some embodiments, free packing is possible, such that α3Greater than alpha2Therefore, the insulating layer 230 and the second metal layer 240 do not need to be thickened, and alpha is naturally generated while the insulating layer 230 and the second metal layer 240 are formed3Will be greater than alpha2(i.e.. alpha.)2Less than alpha3). In other embodiments, the material of the insulating layer 230 or the second metal layer 240 may be added at the step, and the insulating layer may be extended at the stepFormation time of the insulating layer 230 and the second metal layer 240 so that α2Less than alpha3。
In the embodiment of the application, alpha is set2Less than alpha3Thereby making alpha3Relative to alpha2More gradually, the trace of the second metal layer at alpha can be further reduced2The risk of short circuits occurring at the corresponding locations. In addition, due to alpha1Less than alpha2，α2Less than alpha3Therefore, when each layer of film layer is added on the step, the included angle corresponding to the step is gradually reduced, namely the gradient corresponding to the step is gradually reduced, and the alpha is arranged1Less than alpha2，α2Less than alpha3Easy to control, and thus has strong realizability.
Fig. 5 is a schematic cross-sectional structure view of a touch panel according to a fourth embodiment of the present disclosure. The embodiment shown in fig. 5 is a modification of the embodiment shown in fig. 2A to 4. The difference from the embodiment shown in fig. 2A to 4 is that the touch panel 500 further includes a first insulating block 510 and a second insulating block 520. The first insulation block 510 is filled in a gap between the first portion 2201 and the second portion 2202. The second insulation block 520 is filled in a gap between the second portion 2202 and the third portion 2203.
A first insulation block 510 filled in a gap between the first portion 2201 and the second portion 2202 for blocking the first portion 2201 and the second portion 2202 from being electrically connected; and a second insulation block 520 filled in a gap between the second portion 2202 and the third portion 2203 for blocking the second portion 2202 and the third portion 2203 from being electrically connected.
It should be understood that the material of the first insulating block 510 may be any material that can block the electrical connection between the first portion 2201 and the second portion 2202, the material of the second insulating block 520 may block the electrical connection between the second portion 2202 and the third portion 2203, and the material of the first insulating block 510 and the material of the second insulating block 520 may be the same or different, which is not specifically limited in this application.
According to the technical scheme provided by the embodiment of the application, the first insulating block is utilized to enable the first part and the second part to be electrically connected, and the second insulating block is utilized to enable the second part and the third part to be electrically connected. In addition, because the first insulating block or the second insulating block is filled, other film layers such as the insulating layer and the second metal layer are arranged on the first metal layer, the other film layers cannot be sunken at the position of the gap, the steps generated by the gap are reduced, and the short circuit of the adjacent wires in the second metal layer at the gap is reduced. And, because the height of first insulating piece and second insulating piece is controllable, also be favorable to keeping the thickness of first insulating piece and second insulating piece to unanimous with the thickness of insulating layer.
Fig. 6 is a schematic flow chart illustrating a manufacturing method of a touch panel according to an embodiment of the present disclosure. As shown in fig. 6, the method for manufacturing a touch panel includes the following steps.
S110: the display module comprises a step, wherein the step comprises an upper step surface, a step slope surface and a lower step surface, and the step slope surface is connected with the upper step surface and the lower step surface.
S120: and forming a first metal layer on the display module, wherein the first metal layer is respectively disconnected at the upper step surface and the lower step surface to form a first part, a second part and a third part, and the second part is used for forming the heightening block.
Specifically, the first metal layer may be formed on the display module by deposition, evaporation, or the like, as long as the first metal layer having a uniform height can be formed.
It should be understood that the first metal layer may be patterned in step S120, and the first metal layer may be disconnected at the upper and lower step surfaces by etching or the like. The patterning process etches all of the first metal layer in the gap between the first portion and the second portion and the gap between the second portion and the third portion, so that the first metal layer can be broken into the first portion, the second portion, and the third portion, and the realizability is greater since there is no need to control the height of the first metal layer to be etched at the two gaps.
Before step S120 is performed, other film layers, such as a substrate layer, may also be formed between the display module and the first metal layer.
S130: and forming an insulating layer on one side of the first metal layer, which is far away from the display module.
It should be understood that an insulating layer can be uniformly formed on the side of the first metal layer away from the display module, that is, the insulating layer does not need to be subjected to thickness increasing treatment, and only one process is needed to form the insulating layer.
S140: and forming a second metal layer on one side of the insulating layer far away from the first metal layer.
After step S140 is performed, a protective layer may be further formed on the side of the second metal layer away from the insulating layer. The protective layer can protect the second metal layer on one hand, and can also planarize the surface of the second metal layer on the side away from the insulating layer on the other hand.
It should be understood that the method for manufacturing the touch panel may also be appropriately adjusted according to the structures of the touch panel in the embodiments shown in fig. 2A to fig. 5, which is not specifically limited in this application.
According to the technical scheme provided by the embodiment of the application, the first metal layer is formed on the display module, and the first metal layer is arranged at the upper step surface and the lower step surface to be disconnected so as to form the first part, the second part and the third part, so that the wires in the second part are respectively in no electrical connection with the wires in the first part and the third part, namely, the second part has no conduction effect. Because the second part has no conduction function, the short circuit of the adjacent wires caused by the fact that the wires of the first metal layer and the second metal layer are easy to remain at the step can be avoided. The second part is arranged to form the padding block, so that the lower step surface can be padded by the second part without increasing the thickness of the insulating layer in the step area and etching the second part, thereby avoiding the phenomenon that the wiring of the second metal layer is easy to generate residue at the step to cause short circuit of the adjacent wiring, saving the cost and simplifying the preparation process of the touch panel.
It should be noted that the combination of the features in the present application is not limited to the combination described in the claims of the present application or the combination described in the specific embodiments, and all the features described in the present application may be freely combined or combined in any manner unless contradicted by each other.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modifications, equivalents and the like that are within the spirit and principle of the present application should be included in the scope of the present application.
Claims (10)
1. A touch panel, comprising:
the display module comprises a step, the step comprises an upper step surface, a step slope surface and a lower step surface, and the step slope surface is connected with the upper step surface and the lower step surface;
the display module comprises a display module, a first metal layer and a second metal layer, wherein the first metal layer is arranged on the display module, and is respectively disconnected at the upper step surface and the lower step surface to form a first part, a second part and a third part, and the second part is used for forming an elevating block;
the insulating layer is arranged on one side, far away from the display module, of the first metal layer; and
and the second metal layer is arranged on one side of the insulating layer, which is far away from the first metal layer.
2. The touch panel of claim 1,
the second portion includes: and the lower leveling section covers the surface of one side, close to the step slope surface, of the lower step surface and is in contact with the step slope surface.
3. The touch panel of claim 2,
the second portion further comprises: go up level and smooth section and slope section, the slope section covers the step is domatic, go up level and smooth section cover go up the step face and be close to the surface of step domatic one side.
4. The touch panel of claim 1,
in the stacking direction, the thickness of the first metal layer is smaller than that of the insulating layer, and the stacking direction is a direction in which the display module, the first metal layer, the insulating layer and the second metal layer are stacked in sequence.
5. The touch panel of claim 4,
the thickness of the insulating layer is 1.01-1.5 times of that of the first metal layer.
6. The touch panel of claim 1,
a first included angle between the step slope surface and the lower step surface is smaller than a second included angle between a first surface of the insulating layer and a second surface of the insulating layer, wherein the first surface is opposite to the step slope surface, the second surface is opposite to the lower step surface, and the first surface is connected with the second surface.
7. The touch panel of claim 6,
the second included angle is smaller than a third included angle between a third surface of the second metal layer and a fourth surface of the second metal layer, the third surface is opposite to the first surface, the fourth surface is opposite to the second surface, and the third surface is connected with the fourth surface.
8. The touch panel of claim 1,
a first through hole and a second through hole are formed in the insulating layer, the first through hole extends to the surface of the first part on the side far away from the display module, and the second through hole extends to the surface of the third part on the side far away from the display module; the second metal layer is electrically connected with the first part through the first via hole, and the second metal layer is electrically connected with the third part through the second via hole.
9. The touch panel according to claim 1, further comprising:
a first insulating block filled in a gap between the first portion and the second portion;
a second insulating block filled in a gap between the second portion and the third portion.
10. A method for manufacturing a touch panel includes:
providing a display module, wherein the display module comprises a step, the step comprises an upper step surface, a step slope surface and a lower step surface, and the step slope surface is connected with the upper step surface and the lower step surface;
forming a first metal layer on the display module, wherein the first metal layer is broken at the upper step surface and the lower step surface respectively to form a first part, a second part and a third part, and the second part is used for forming a padding block;
forming an insulating layer on one side of the first metal layer, which is far away from the display module;
and forming a second metal layer on one side of the insulating layer far away from the first metal layer.
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