CN113894699A - Polishing device and polishing method - Google Patents
Polishing device and polishing method Download PDFInfo
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- CN113894699A CN113894699A CN202111293024.7A CN202111293024A CN113894699A CN 113894699 A CN113894699 A CN 113894699A CN 202111293024 A CN202111293024 A CN 202111293024A CN 113894699 A CN113894699 A CN 113894699A
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- abrading
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- 238000000034 method Methods 0.000 title claims abstract description 20
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- 238000012545 processing Methods 0.000 abstract description 2
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- 238000005266 casting Methods 0.000 description 3
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- 238000001746 injection moulding Methods 0.000 description 3
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- 239000002699 waste material Substances 0.000 description 2
- 208000019462 Occupational injury Diseases 0.000 description 1
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- 229910045601 alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- 238000005242 forging Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
- B24B49/165—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load for grinding tyres
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The application relates to the field of production and processing, and discloses a polishing device and a polishing method, wherein the polishing device comprises a rack; a sanding module coupled to the frame and configured to move relative to the frame; a floating constant force output part connected with the frame and configured to be connected with the polishing module and to adjust a position of the polishing module relative to the frame; spacing subassembly, spacing subassembly and frame are connected to the removal of constructing the module of polishing carries on spacingly, and this application grinding device realizes accurate ration and polishes, has reduced the rejection rate, has improved production efficiency.
Description
Technical Field
The application relates to the field of production and processing, in particular to a polishing device and a polishing method.
Background
The polishing and deburring operation is high-time industrial injury and high-risk work, the polishing operation is accompanied by high-frequency vibration, noise, dust, toxic and harmful gas generated by high friction temperature, flammability, explosiveness and other risks and occupational injury, and the polishing operation can generate injury to nerves, hearing, respiratory tracts and lungs of a human body after being carried out for a long time. The dust produced by the grinding operation, especially the aluminum powder, the alloy powder or the combustible powder, has higher explosion risk. Meanwhile, enterprises also face the problems that grinders are difficult to recruit and the environment is protected. However, the automatic modification for polishing is a direction which seems to be simple and difficult, and the programming of the polishing path, the polishing precision, the protection of the abrasive material or the cutter, the quality requirement on the operators and the like are all industrial difficulties.
The inventor finds that the existing polishing scheme is open-loop polishing, namely the removal amount cannot be accurately controlled in the polishing process, the polishing can only be carried out through experience, the size detection is carried out afterwards, and the process is repeated until the grinding amount meets the process requirements. If the over-cut occurs in the process, the over-cut cannot be remedied, and the workpiece is scrapped. Meanwhile, if large waste materials are attached to the area to be polished, the waste materials are not easy to polish clean or cause excessive cutting of other areas. The polishing method is not strict and accurate enough, and meanwhile, the abrasive material loss is nonlinear or cannot be estimated due to the batch difference of the abrasive materials, the batch difference of the workpieces and the individual difference, so that the phenomena of high debugging difficulty, unstable polishing quality and the like are caused due to the difficulty in establishing a compensation model.
Disclosure of Invention
The application aims to provide a polishing device and a polishing method.
In order to solve the above technical problem, a first aspect of the present application provides a polishing device, including: a frame; a sanding module coupled to the frame and configured to move relative to the frame; a floating constant force output connected to the frame and configured to connect to the sanding module and to adjust a position of the sanding module relative to the frame; and the limiting assembly is connected with the rack and is configured to limit the movement of the polishing module.
In an embodiment of the first aspect, the stop assembly comprises a drive device and a stop portion, the stop portion being fixed to the frame and adjustable in position relative to the frame, the drive device being configured to adjust the position of the stop portion relative to the frame.
In an embodiment of the first aspect, the limiting portion includes a limiting support portion and a quantitative contact head, the limiting support portion is fixedly connected with the driving device, and the quantitative contact head is fixedly connected with the limiting support portion and extends away from the limiting support portion.
In an embodiment of the first aspect, the sanding module comprises a tool holding fixture connected to the frame, the tool holding fixture being configured for holding a sanding tool.
In an embodiment of the first aspect, the grinding module further comprises a grinding tool, and the grinding tool is fixed to the tool fixing tool.
In an embodiment of the first aspect, the polishing tool includes a driving portion and a polishing portion, the driving portion is fixed to the tool fixing tool, the polishing portion is detachably connected to the driving portion, and the driving portion is configured to drive the polishing portion.
In an embodiment of the first aspect, the grinding section includes a grinding head and a grinding head connecting portion detachably connected to the driving section, and the driving section is configured to drive the grinding head to rotate.
In an embodiment of the first aspect, the fixed-amount contact heads are spaced apart from the grinding-head support frame by a preset distance in a direction in which the grinding section moves relative to the frame to control the grinding amount.
In an embodiment of the first aspect, the tool fixing tool is provided with a grinding section support frame configured to support the grinding section.
In an embodiment of the first aspect, the limiting portion is provided with a torque sensor.
A second aspect of the present application provides a polishing system comprising the above polishing device, and a control system for controlling the polishing device to act.
A second aspect of the present application provides a polishing method applied to a polishing system, the polishing system comprising a polishing device and a control system, the polishing device comprising a frame; a sanding module coupled to the frame and configured to move relative to the frame; a floating constant force output connected to the frame and configured to connect to the sanding module and to adjust a position of the sanding module relative to the frame; a limiting assembly connected with the frame and configured to limit movement of the polishing module; the control system is used for controlling the grinding device to act;
the grinding method comprises the following steps: reading point location information of a position to be polished through the control system; moving the rack according to the point location information to enable the polishing module to move to a position to be polished; the floating constant force output part outputs power to enable the polishing module to be tightly attached to the position to be polished to form constant jacking force; setting a preset limit stroke of the limit assembly according to a preset grinding amount; when the limiting assembly is ground to abut against the preset position of the limiting assembly, grinding of the position to be ground is completed.
Compared with the prior art, the data closed loop grinding device has the advantages that the grinding amount is set through the limiting assemblies to realize the closed loop of the grinding process data, the grinding amount is monitored in real time, accurate quantitative grinding is realized, excessive grinding damage to workpieces is prevented, the rejection rate is reduced, and the production efficiency is improved.
Drawings
Fig. 1 is a schematic structural view of a polishing apparatus according to a first embodiment of the present application;
FIG. 2 is a perspective view of a grinding apparatus according to a second embodiment of the present application;
FIG. 3 shows a perspective view of a grinding apparatus according to a second embodiment of the present application;
FIG. 4 shows a left side view of a grinding apparatus according to a second embodiment of the present application;
FIG. 5 shows a right side view of a grinding apparatus according to a second embodiment of the present application;
FIG. 6 shows a side view of a grinding apparatus that is a second embodiment of the present application;
FIG. 7 shows a perspective view of a grinding apparatus including a workpiece according to a second embodiment of the present application;
FIG. 8 shows a side view of a grinding apparatus including a workpiece according to a second embodiment of the present application;
FIG. 9 shows a close-up view of position A in FIG. 8;
fig. 10 is a schematic flow chart of a polishing method according to a fourth embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application is provided by way of specific examples, and other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure herein. The present application is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present application. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
Embodiments of the present application will be described in detail below with reference to the accompanying drawings so that those skilled in the art to which the present application pertains can easily carry out the present application. The present application may be embodied in many different forms and is not limited to the embodiments described herein.
In order to clearly explain the present application, components that are not related to the description are omitted, and the same reference numerals are given to the same or similar components throughout the specification.
Throughout the specification, when a device is referred to as being "connected" to another device, this includes not only the case of being "directly connected" but also the case of being "indirectly connected" with another element interposed therebetween. In addition, when a device "includes" a certain component, unless otherwise stated, the device does not exclude other components, but may include other components.
When a device is said to be "on" another device, this may be directly on the other device, but may also be accompanied by other devices in between. When a device is said to be "directly on" another device, there are no other devices in between.
Although the terms first, second, etc. may be used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first interface and the second interface, etc. are described. Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" include plural forms as long as the words do not expressly indicate a contrary meaning. The term "comprises/comprising" when used in this specification is taken to specify the presence of stated features, regions, integers, steps, operations, elements, and/or components, but does not exclude the presence or addition of other features, regions, integers, steps, operations, elements, and/or components.
Terms representing relative spatial terms such as "lower", "upper", and the like may be used to more readily describe one element's relationship to another element as illustrated in the figures. Such terms are intended to include not only the meanings indicated in the drawings, but also other meanings or operations of the device in use. For example, if the device in the figures is turned over, elements described as "below" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "under" and "beneath" all include above and below. The device may be rotated 90 or other angles and the terminology representing relative space is also to be interpreted accordingly.
Although not defined differently, including technical and scientific terms used herein, all terms have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. Terms defined in commonly used dictionaries are to be additionally interpreted as having meanings consistent with those of related art documents and the contents of the present prompts, and must not be excessively interpreted as having ideal or very formulaic meanings unless defined.
The following describes a first embodiment of the present application with reference to the drawings, and as shown in fig. 1, the polishing apparatus of the embodiment of the present application includes a frame 1, a floating constant force output part 2, a polishing module 3, and a limiting component 4, wherein the floating constant force output part 2 is connected with the frame 1 and connected with the polishing module 3, so that the polishing module 3 can move relative to the frame, thereby adjusting the position of the polishing module 3 relative to the frame 1. The sanding module 3 is connected to the frame 1 and can be moved relative to the frame 1. Spacing subassembly 4 is connected with frame 1 to can carry out spacingly to the removal of polishing module 3, limit polishing feed amount promptly.
Specifically, the floating constant force output part 2 may be a floating constant force cylinder, and a cylinder barrel of the cylinder is fixed on the frame 1. The piston rod of the cylinder is connected with the polishing module 3, and can push or pull back the polishing module 3 to move relative to the frame 1, so that the polishing feeding amount of the polishing module 3 for polishing operation is controlled. In some embodiments, the polishing module 3 is connected with the rack 1 in a sliding manner to realize relative movement, for example, the polishing module can be arranged on a linear slide rail on the rack 1, thrust is generated through a cylinder, the size of the thrust of the cylinder can be adjusted as required, a proper thrust size can be set according to specific conditions, and the service life of abrasive materials can be prolonged. The limiting component 4 of the embodiment can limit the movement of the grinding module 3, and realizes grinding quantification by controlling the distance between the limiting component and the grinding module 3. The limiting distance of the limiting assembly 4 can be adjusted manually or by a driving device. The embodiment of the application is suitable for the polishing and deburring operation of mould forming workpieces such as castings, forged parts and injection molding, the polishing precision can be guaranteed by limiting the movement of the polishing module through the limiting assembly, excessive grinding is avoided, the rejection rate is reduced, and the production efficiency is improved.
A second embodiment of the present application relates to a polishing apparatus. The second embodiment specifically provides an implementation of a grinding device. As shown in fig. 2 to 5, the polishing apparatus of the present embodiment includes a frame 1, a floating constant force output part 2, a polishing module 3, and a limiting assembly 4, wherein the size and shape of the frame 1 may be set as required as long as the floating constant force output part 2, the polishing module 3, and the limiting assembly 4 can be supported, and there is no particular limitation. The floating constant force output part 2 can be a floating constant force cylinder, and a cylinder barrel of the cylinder is fixed on the frame 1. The piston rod of the cylinder is connected with the polishing module 3 and can push or pull back the polishing module 3 to move relative to the frame 1. The air cylinder is controlled by a proportional valve, the proportional valve generates air pressure controlled by a program, the pressing force can be controlled by changing the pressure in real time, and the pressing force is adjustable, so that the service life of the polishing head is prolonged. The limiting assembly 4 comprises a driving device 40 and a limiting part 41, wherein the driving device 40 is arranged to adjust the position of the limiting part 41 relative to the frame 1. For example, the driving device 40 may be a servo motor as shown in fig. 2, and an output rod of the servo motor is provided with a transmission device, through which a rotation amount output by the servo motor can be converted into a displacement amount in a Y-axis direction (where the Y-axis direction is a horizontal direction shown in the figure). The position limiting portion 41 may be slidably connected to the frame 1 such that the position limiting portion 41 moves forward or backward in the Y-axis direction with respect to the frame 1. The position limiting part 41 can be directly connected with the frame 1 only, and can also be slidably connected with the polishing module 3 through a transmission device, and the polishing module 3 is slidably connected with the frame 1, and the position of the position limiting part 41 relative to the frame 1 can be adjusted through the driving device 40. The stopper 41 may move forward or backward in other directions with respect to the frame 1, and is not limited to the Y-axis direction. The driving device 40 may be other driving sources, and is not limited to the servo motor.
As shown in fig. 8 and 9, the position-limiting portion 41 includes a position-limiting support portion 410 and a quantitative contact head 411, the position-limiting support portion 410 is fixedly connected to the driving device 40, and the quantitative contact head 411 is fixedly connected to the position-limiting support portion 410 and extends away from the position-limiting support portion 410. Specifically, the driving device 40 may push the position limiting support 410 to move relative to the frame 1 to adjust its position relative to the frame 1. The quantitative contact head 411 is used for tightly adhering to the workpiece 5, and the distance between the quantitative contact head 411 and the grinding module 3 can control the grinding amount of grinding so as to prevent over-grinding. The polishing module 3 comprises a tool fixing tool 30, and the tool fixing tool 30 is used for fixing a polishing tool 31 and is connected with the frame 1. The tool fixing tool 30 can stably fix the polishing tool 31 according to the appearance of the polishing tool 31 through design such as profiling and locking, and the polishing tool is prevented from shaking. The grinding tool 31 may be an electric motor or other grinding tools. In some embodiments the sharpening module 3 comprises a sharpening tool 31, in other embodiments the sharpening module 3 does not comprise a sharpening tool 31, but can be adapted to different sharpening tools as required.
The grinding tool 31 includes a driving part 310 and a grinding part 311, the grinding part 311 includes a grinding head 312 and a grinding head connecting part 313, wherein the grinding head connecting part 313 is detachably connected with the driving part 310 to facilitate replacement of the grinding part 311, and the driving part 310 is used for driving the grinding head 312 to rotate. As shown in fig. 9, the grinding amount of grinding can be controlled using the distance between the fixed-amount contact 411 and the grinding head connecting portion 313 (distance between double arrows) as a reference feature.
In some embodiments, the tool fixing tool 30 is further provided with a grinding part support frame 32, and the grinding part support frame 32 is used for supporting the grinding part 311. Specifically, since some features of the workpiece require a relatively long tool, the grinding head connecting portion 313 may be set relatively long, which may be bent during machining, and the grinding portion support frame 32 may reduce the degree of bending of the grinding head connecting portion 313 at this time, thereby reducing the amplitude of the shaking of the grinding head 312, thereby ensuring accurate grinding.
In some embodiments, the quantitative contact head 411 may be provided with a torque sensor 412 for monitoring whether the quantitative contact head 411 is attached to the workpiece 5 in real time, and if a large burr to be ground is encountered, the system may wait for a torque sensor signal until the grinding is sufficient, so as to realize a data closed loop in the grinding process, and avoid the influence caused by individual difference of the workpiece.
This application embodiment is applicable to mould forming work piece such as casting, forging, injection molding polish, burring operation, and this application embodiment is polished for traditional swing, has realized that the invariable power of the accurate control volume of polishing is polished, and the precision of polishing is higher, avoids the grinding excessive, reduces the rejection rate, improves production efficiency.
A third embodiment of the present application is directed to a sanding system. The grinding system of the second embodiment comprises the grinding device of the embodiment and a control system, wherein the control system is used for controlling the action of the grinding device, controlling the grinding process, ensuring the grinding precision, avoiding excessive grinding, reducing the rejection rate and improving the production efficiency.
The fourth embodiment of the application relates to a polishing method, which is applied to the polishing system of the embodiment, and comprises a polishing device and a control system, wherein the polishing device comprises a rack, a polishing module, a floating constant force output part and a limiting assembly; the grinding module is connected with the frame and is configured to move relative to the frame; the floating constant force output part is connected with the frame and is constructed to be connected with the grinding module and can adjust the position of the grinding module relative to the frame; the limiting assembly is connected with the rack and is configured to limit the movement of the polishing module; the control system is used for controlling the grinding device to act. The limiting assembly comprises a driving device and a limiting part. The spacing portion comprises a spacing support portion and a quantitative contact head. The quantitative contact head is provided with a torque sensor.
The polishing method provided by the embodiment of the application specifically comprises the following steps:
and 101, reading point location information of a position to be polished through a control system.
Specifically, after the polishing system is started, the polishing device is ready to read point location information of a position to be polished. The point location information can be set during the programming of the grinding track, and comprises a path for controlling the robot and the stroke of the limiting assembly.
And 102, moving the rack according to the point location information to enable the polishing module to move to the position to be polished.
Specifically, according to the read point location information, the control system controls the rack to move to drive the polishing module to move until the polishing head of the polishing module moves to the position to be polished.
And 103, outputting power by the floating constant force output part to enable the polishing module to be tightly attached to the position to be polished to form constant jacking force.
Specifically, the floating constant force output part starts to be enabled at the moment, and certain constant jacking force is formed, so that the polishing head of the polishing module is tightly attached to the position to be polished.
And 104, setting a preset limit stroke of the limit component according to the preset grinding amount.
Specifically, the driving device is used for setting the stroke of the limiting assembly, for example, the driving device is a servo motor, the servo motor is started, the rotation amount of the servo motor is adjusted according to the preset grinding amount, and the limiting assembly reaches the preset limiting stroke.
And 105, finishing polishing of the position to be polished when the limiting assembly abuts against the preset position of the limiting assembly.
Specifically, after the limiting assembly reaches a preset limiting stroke, the workpiece is polished by the polishing module, the numerical value of the torque sensor is read in real time, and polishing of the point position is stopped when the quantitative contact head is detected to reach the contact characteristic of the workpiece. And at the moment, if the next point position is needed to be polished, the steps can be repeated to polish until the workpiece is completely polished.
The polishing method is suitable for polishing and deburring of mold forming workpieces such as castings, forged parts and injection molding parts, the polishing precision can be guaranteed by limiting the movement of the polishing module through the limiting assembly, excessive grinding is avoided, the rejection rate is reduced, and the production efficiency is improved.
The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.
Claims (12)
1. An abrading device, comprising:
a frame;
a sanding module coupled to the frame and configured to move relative to the frame;
a floating constant force output connected to the frame and configured to connect to the sanding module and to adjust a position of the sanding module relative to the frame;
and the limiting assembly is connected with the rack and is configured to limit the movement of the polishing module.
2. The sharpening device of claim 1 wherein the limiting assembly includes a drive device and a limiting portion, the limiting portion being fixed to the frame and adjustable in position relative to the frame, the drive device being configured to adjust the position of the limiting portion relative to the frame.
3. The polishing device as recited in claim 2 wherein the spacing portion comprises a spacing support portion and a fixed-amount contact head, the spacing support portion being fixedly connected to the drive device, the fixed-amount contact head being fixedly connected to the spacing support portion and extending away from the spacing support portion.
4. The abrading device of claim 3, wherein the abrading module comprises a tool holding fixture, the tool holding fixture being coupled to the frame, the tool holding fixture being configured to hold an abrading tool.
5. The abrading device of claim 4, wherein the abrading module further comprises an abrading tool secured to the tool securing fixture.
6. The polishing apparatus as set forth in claim 5, wherein the polishing tool includes a driving portion and a polishing portion, the driving portion is fixed to the tool fixing tool, the polishing portion is detachably connected to the driving portion, and the driving portion is configured to drive the polishing portion.
7. The polishing apparatus as recited in claim 6, wherein the polishing section includes a polishing head and a polishing head connecting portion detachably connected to the driving section, the driving section being configured to drive the polishing head to rotate.
8. The grinding device of claim 7, wherein the fixed-amount contact head is spaced apart from the grinding-head support frame by a preset distance in a direction in which the grinding part moves relative to the frame to control an amount of grinding.
9. The abrading device of claim 4, wherein the tool holding fixture is provided with an abrading portion support frame configured to support the abrading portion.
10. A sanding device as defined in claim 2, characterized in that the limiting portion is provided with a torque sensor.
11. An abrading system, comprising: the abrading device of claims 1-10, and a control system for controlling the action of the abrading device.
12. The grinding method is characterized by being applied to a grinding system, wherein the grinding system comprises a grinding device and a control system, and the grinding device comprises a machine frame; a sanding module coupled to the frame and configured to move relative to the frame; a floating constant force output connected to the frame and configured to connect to the sanding module and to adjust a position of the sanding module relative to the frame; a limiting assembly connected with the frame and configured to limit movement of the polishing module; the control system is used for controlling the grinding device to act;
the grinding method comprises the following steps:
reading point location information of a position to be polished through the control system;
moving the rack according to the point location information to enable the polishing module to move to a position to be polished;
the floating constant force output part outputs power to enable the polishing module to be tightly attached to the position to be polished to form constant jacking force;
setting a preset limit stroke of the limit assembly according to a preset grinding amount;
when the limiting assembly is ground to abut against the preset position of the limiting assembly, grinding of the position to be ground is completed.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111293024.7A CN113894699A (en) | 2021-11-03 | 2021-11-03 | Polishing device and polishing method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111293024.7A CN113894699A (en) | 2021-11-03 | 2021-11-03 | Polishing device and polishing method |
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Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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Application publication date: 20220107 |