CN113889839A - Laser device - Google Patents

Laser device Download PDF

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Publication number
CN113889839A
CN113889839A CN202111025826.XA CN202111025826A CN113889839A CN 113889839 A CN113889839 A CN 113889839A CN 202111025826 A CN202111025826 A CN 202111025826A CN 113889839 A CN113889839 A CN 113889839A
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CN
China
Prior art keywords
light emitting
light
laser
emitting chips
emitting chip
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Pending
Application number
CN202111025826.XA
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Chinese (zh)
Inventor
周子楠
卢瑶
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Qingdao Hisense Laser Display Co Ltd
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Qingdao Hisense Laser Display Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Qingdao Hisense Laser Display Co Ltd filed Critical Qingdao Hisense Laser Display Co Ltd
Priority to CN202111025826.XA priority Critical patent/CN113889839A/en
Publication of CN113889839A publication Critical patent/CN113889839A/en
Priority to PCT/CN2022/116368 priority patent/WO2023030419A1/en
Priority to CN202280059727.XA priority patent/CN117916659A/en
Priority to US18/476,085 priority patent/US20240022696A1/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/023Mount members, e.g. sub-mount members
    • H01S5/0232Lead-frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0225Out-coupling of light
    • H01S5/02253Out-coupling of light using lenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/023Mount members, e.g. sub-mount members
    • H01S5/02325Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0233Mounting configuration of laser chips
    • H01S5/02335Up-side up mountings, e.g. epi-side up mountings or junction up mountings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0239Combinations of electrical or optical elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/026Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

The application discloses a laser device, relates to the technical field of laser equipment, and is used for solving the problem that laser emitted by the existing three-color laser device can cause the phenomenon of uneven colors such as color spots, color blocks and the like on the picture of a display end. The laser comprises a substrate, and a first reflecting prism, a first light-emitting chip, a second reflecting prism and a second light-emitting chip which are arranged on the substrate. The first reflection prism has a first reflection surface, and the second reflection prism has a second reflection surface. Along a first direction, the first reflection prism is located on one side of the first light emitting chip, and the first light emitting chip is configured to emit red laser light toward the first reflection surface. The second reflection prism is located at one side of a second light emitting chip along a second direction, and the second light emitting chip is configured to emit blue laser light or green laser light toward a second reflection surface. Wherein the first direction is perpendicular to the second direction. The laser is used for laser projection.

Description

Laser device
Technical Field
The application relates to the technical field of laser equipment, in particular to a laser.
Background
With the rapid development of the laser projection industry, the technology of the laser is mature day by day. Monochromatic lasers such as red, green and blue lasers have been mass produced. A three-color laser is a laser that has been further developed on the basis of a monochromatic laser. The three-color laser comprises a red light emitting chip, a blue light emitting chip and a green light emitting chip, and has the advantages of color fidelity, high color gamut and the like.
However, the polarization direction of the red laser emitted by the red light emitting chip is different from the polarization directions of the lasers emitted by the other two light emitting chips, so that when the lasers are projected to a display end, the display image has uneven color such as color spots and color blocks.
Disclosure of Invention
The application provides a laser, which solves the problem that laser emitted by the existing three-color laser can cause the phenomenon of uneven color such as color spots, color blocks and the like on the picture of a display end.
In order to achieve the purpose, the technical scheme is as follows:
the application provides a laser, comprising a substrate; the first reflecting prism is arranged on the substrate and is provided with a first reflecting surface; the first light-emitting chip is arranged on the substrate, and the first reflecting prism is positioned on one side of the first light-emitting chip along a first direction; the first light emitting chip is configured to emit red laser light toward the first reflection surface; the second reflecting prism is arranged on the substrate and is provided with a second reflecting surface; the second light-emitting chip is arranged on the substrate, and the second reflecting prism is positioned on one side of the second light-emitting chip along the second direction; the second light emitting chip is configured to emit blue laser light or green laser light toward the second reflective surface; wherein the first direction is perpendicular to the second direction.
The laser provided by the embodiment of the application, because first reflection prism and first luminescence chip arrange along first direction, second reflection prism and second luminescence chip arrange along the second direction, first direction is perpendicular with the second direction for first luminescence chip and second luminescence chip phase difference 90 degrees set up on the base plate, and the direction of the red laser that first luminescence chip sent also phase difference 90 degrees with the direction of the blue laser or the green laser that the second luminescence chip sent promptly. Since the polarization direction of the red laser beam is different from the polarization directions of the blue laser beam and the green laser beam by 90 degrees, the red laser beam is spatially inverted by 90 degrees with respect to the same coordinate system after being reflected by the reflection surface of the first reflection prism, so that the polarization direction of the red laser beam is inverted by 90 degrees and becomes the same as the polarization direction of the blue laser beam or the green laser beam. Therefore, the conversion of the polarization direction of the red laser is completed, so that the lasers of three colors can be emitted in the same polarization direction, and the problem of uneven color phenomena such as color spots, color blocks and the like at the display end is finally solved.
In one possible implementation manner, the number of the first light emitting chips is multiple, the multiple first light emitting chips are arranged in multiple rows along the first direction, and each row is provided with multiple first light emitting chips along the second direction; the number of the second light emitting chips is multiple, the second light emitting chips are arrayed in multiple rows along the second direction, and the second light emitting chips are arranged in each row along the first direction.
In one possible implementation, the plurality of rows of first light emitting chips includes at least one row of first forward light emitting chips and at least one row of first reverse light emitting chips; the light emitting direction of the first forward light emitting chip is opposite to that of the first reverse light emitting chip.
In one possible implementation manner, the at least one row of first forward light emitting chips includes two rows of first forward light emitting chips, and the two rows of first forward light emitting chips are arranged in a staggered manner along the first direction; the at least one row of first reverse light-emitting chips comprises two rows of first reverse light-emitting chips, and the two rows of first reverse light-emitting chips are arranged in a staggered mode along the first direction.
In a possible implementation manner, the number of the first reflecting prisms is two, and one first reflecting prism is located on one side of the first forward light-emitting chip away from the center of the substrate and reflects red laser light emitted by the plurality of first forward light-emitting chips; the other first reflection prism is positioned on one side of the first reverse light-emitting chip far away from the center of the substrate and reflects the red laser light emitted by the first reverse light-emitting chips.
In one possible implementation, the plurality of second light emitting chips includes: a plurality of second blue light emitting chips arranged in at least one row along a second direction; and the second green light-emitting chips are at least arranged in a column along the second direction.
In one possible implementation manner, the light emitting direction of the second blue light emitting chip is opposite to the light emitting direction of the second green light emitting chip.
In one possible implementation manner, the plurality of second blue light-emitting chips are arranged in two rows along the second direction, and the two rows of second blue light-emitting chips are arranged in a staggered manner along the second direction; the plurality of second green light emitting chips are arranged in two rows along the second direction, and the two rows of second green light emitting chips are arranged in a staggered mode along the second direction.
In one possible implementation manner, the number of the second reflecting prisms is two, one second reflecting prism is located on one side of the second blue light emitting chip far away from the center of the substrate, and the second reflecting prism reflects blue laser light emitted by the plurality of second blue light emitting chips; the other second reflection prism is positioned on one side of the second green light emitting chip far away from the center of the substrate and reflects green laser emitted by the second green light emitting chips.
In one possible implementation, the ratio of the number of the first light emitting chips, the second blue light emitting chips and the second green light emitting chips is 2: 1: 1.
drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic diagram of a three-color laser in the prior art;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a schematic diagram of two linear polarization directions;
fig. 4 is a schematic structural diagram of a laser according to an embodiment of the present disclosure;
fig. 5 is a side view of a relative position relationship between a first reflection prism and a first light-emitting chip in a laser according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a laser according to an embodiment of the present disclosure;
fig. 7 is a schematic view of another structure of a laser according to an embodiment of the present disclosure;
fig. 8 is a schematic diagram of a connection relationship between a plurality of first light emitting chips and a plurality of second light emitting chips of the laser shown in fig. 4.
Reference numerals:
01-a substrate; 02-pipe shell; 03-a light emitting chip; 04-reflection prism; 041-reflecting surface; 05-heat sink; 06-pin;
1-a substrate; 2-a first reflecting prism; 21-a first reflective surface; 3-a first light emitting chip; 31-a first forward light emitting chip; 32-a first reverse light emitting chip; 4-a second reflective prism; 41-a second reflective surface; 5-a second light emitting chip; 51-a second blue light emitting chip; 52-a second green light emitting chip; 6-pin; 7-heat sink; 8-gold wire; 9-switching table.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the term "connected" is to be understood in a broad sense, e.g. fixedly, detachably or integrally connected. They may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In the embodiments of the present application, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the embodiments of the present application, words such as "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present concepts related in a concrete fashion.
The related art provides a three-color laser, as shown in fig. 1, which includes a substrate 01, a package 02, a plurality of light emitting chips 03, and a plurality of reflecting prisms 04. The package 02 is disposed on one side of the substrate 01 around the substrate 01, and the plurality of light emitting chips 03 and the plurality of reflection prisms 04 are disposed on the substrate 01.
In the laser shown in fig. 1, the light emitting chips 03 correspond to the reflecting prisms 04 one by one, that is, the number of the light emitting chips 03 is equal to the number of the reflecting prisms 04, and one reflecting prism 04 corresponds to one light emitting chip 03. As shown in fig. 2, the reflection prism 04 has one inclined reflection surface 041, and the light-emitting chip 03 emits laser light toward the inclined reflection surface 041, and the reflected laser light is emitted in a direction away from the substrate 01. Wherein, the light emitting chip 03 is disposed on the heat sink 05, and the heat sink 05 is disposed on the substrate 01.
It should be noted that the three-color laser further includes a connection frame (not shown in fig. 1), the connection frame is connected to a side of the package 02 away from the substrate 01, and a sealing glass (not shown in fig. 1) is fixedly connected to a middle of the connection frame. This sealed glass, connection frame, tube 02 and base plate 01 form the encapsulated space jointly, and light-emitting chip 03 is arranged in this encapsulated space, and this encapsulated space can play the guard action to light-emitting chip 03. Wherein, the sealing glass is positioned in the light-emitting path of the light-emitting chip 03. In addition, the laser also comprises a collimating lens which is positioned on the side of the sealing glass far away from the substrate 01. The laser light reflected by the reflecting surface 041 passes through the sealing glass and then is collimated by the collimating lens. The aim of collimating the laser is to converge the laser light, so that the divergence angle of the light is reduced and the light is closer to parallel light.
In addition, this three-colour laser still is equipped with a plurality of pins 06, and pin 06 is connected with emitting chip 03 electricity to transmit external power source to emitting chip 03, and then arouse emitting chip 03 emission laser.
It should be noted that the light-emitting chip 03 includes a red light-emitting chip capable of emitting red laser light, a blue light-emitting chip capable of emitting blue laser light, and a green light-emitting chip capable of emitting green laser light, and the materials and the optical path characteristics selected for the three are different.
As shown in fig. 1, the light emitting chips 03 of the three-color laser are arranged on the substrate 01 in the same manner, and the three kinds of laser beams are emitted in the same direction. Although the laser light emitted by the three light emitting chips is linearly polarized light. However, due to the different materials and unique properties of the light path of the red light emitting chip, the polarization direction of the red laser light emitted by the red light emitting chip is different from the polarization directions of the blue laser light and the green laser light emitted by the other two chips, and the polarization direction is different by 90 degrees. When arranged in the manner shown in fig. 1, the finally emitted laser light has two polarization states with different directions. As shown in fig. 3, the polarization directions of S-polarized light and P-polarized light are schematically shown. In this example, the red laser light is P-polarized light, and the blue laser light and the green laser light are S-polarized light.
When the three lasers are projected to the display end, the display end has different transmittances and reflectivities for the lasers in different polarization states, so that the display image has non-uniform colors such as color spots and color blocks.
In order to solve the above problem, an embodiment of the present application provides a laser, as shown in fig. 4, including a substrate 1, a first reflecting prism 2, a first light emitting chip 3, a second reflecting prism 4, and a second light emitting chip 5.
The first reflection prism 2 and the first light emitting chip 3 are both disposed on the substrate 1, and the first reflection prism 2 has a first reflection surface 21. The first reflection prism 2 is located at one side of the first light emitting chip 3 in the first direction X. Wherein the first light emitting chip 3 is configured to emit red laser light toward the first reflection surface 21 so that the red laser light is emitted toward a direction away from the substrate 1.
The second reflecting prism 4 and the second light emitting chip 5 are both located on the substrate 1, and the second reflecting prism 4 has a second reflecting surface 41. The second reflection prism 4 is located at one side of the second light emitting chip 5 in the second direction Y. The second light emitting chip 5 is configured to emit blue laser light or green laser light toward the second reflection surface 41. The first direction X and the second direction Y are perpendicular to each other.
The laser provided by the embodiment of the application, because first reflection prism 2 and first luminescent chip 3 arrange along first direction X, second reflection prism 4 and second luminescent chip 5 arrange along second direction Y, first direction X is perpendicular with second direction Y for first luminescent chip 3 and second luminescent chip 5 phase difference 90 degrees set up on base plate 1, and the direction of the red laser that first luminescent chip 3 sent also phase difference 90 degrees with the direction of the blue laser or the green laser that second luminescent chip 5 sent. Since the polarization direction of the red laser beam is different from the polarization directions of the blue laser beam and the green laser beam by 90 degrees, the red laser beam is spatially inverted by 90 degrees with respect to the same coordinate system after being reflected by the reflection surface 11 of the first reflection prism 2, so that the polarization direction of the red laser beam is inverted by 90 degrees and becomes the same as the polarization direction of the blue laser beam or the green laser beam. Therefore, the conversion of the polarization direction of the red laser is completed, the lasers of three colors can be emitted in the same mode, and the problem that the display end has uneven color such as color spots and color blocks is finally solved.
The laser provided by the embodiment of the application realizes the unification of the polarization directions of the laser with three different colors by changing the arrangement modes of the first reflecting prism 2, the first light-emitting chip 3, the second reflecting prism 4 and the second light-emitting chip 5, so that the additional cost is not required to be increased, and the volume and the assembly difficulty of the laser are not increased.
Further, as shown in fig. 5, the first light emitting chip 3 may be disposed on the heat sink 7, and then the heat sink 7 is attached to the substrate 1 (the substrate 1 shown in fig. 4). Likewise, the second light emitting chip 5 may also be disposed on the heat sink 7. Due to the heat dissipation effect of the heat sink 7, the temperature of the first light emitting chip 3 and the second light emitting chip 5 during working can be reduced, and the stable operation of the laser can be ensured. The material of the heat sink 7 may be selected from aluminum nitride or silicon carbide.
In the laser provided in the embodiment of the present application, the substrate 1 may be made of copper.
In some embodiments, as shown in fig. 4, the number of the first light emitting chips 3 is plural, the plural first light emitting chips 3 are arranged in plural rows along the first direction X, and each row arranges the plural first light emitting chips 3 along the second direction Y.
The number of the second light emitting chips 5 is plural, the plural second light emitting chips 5 are arranged in plural rows along the second direction Y, and the plural second light emitting chips 5 are disposed along the first direction X in each row.
Through the arrangement mode, the first light-emitting chips 3 and the second light-emitting chips 5 emit laser with different colors, so that the light-emitting efficiency of the laser is ensured, and the polarization directions of red laser light emitted by the first light-emitting chips 3 and blue laser light or green laser light emitted by the second light-emitting chips 5 are also ensured to be the same. The first light-emitting chips 3 and the second light-emitting chips 5 are arranged in order and the space distribution is reasonable.
Wherein, the distance between two adjacent first light emitting chips 3 of each row and two adjacent second light emitting chips 5 of each column may be between 1mm and 3.5 mm. For example, the pitch may be 1mm, 2mm or 3.5 mm. The smaller the distance between two adjacent first light-emitting chips 3 or second light-emitting chips 5 is, the worse the heat dissipation will be, resulting in higher temperatures of the first light-emitting chips 3 and the second light-emitting chips 5, which affects the service life. Meanwhile, if the distance is too large, the size of the substrate 1 needs to be increased, resulting in the overall size of the entire laser.
As an example, as shown in fig. 4, the plurality of first light emitting chips 3 are arranged in two rows in the first direction X, and three first light emitting chips 3 are arranged in each row. The two rows of first light emitting chips 3 are distributed on both upper and lower sides of the center of the substrate 1. Likewise, the second light emitting chips 5 are arranged in two rows along the second direction Y, each row having three second light emitting chips 5, and the two rows of second light emitting chips 5 are distributed on the left and right sides of the center of the substrate 1. Of course, other arrangements are possible, and fig. 4 is only an example, as long as the first light emitting chip 3 and the second light emitting chip 5 are ensured to be 90 degrees apart, and the first reflection prism 2 and the second reflection prism 4 are correspondingly arranged, so that the polarization direction of the red laser light after being reflected by the first reflection surface 21 can be ensured to be consistent with the polarization direction of the blue laser light and the green laser light.
In some embodiments, as shown in fig. 4, the plurality of rows of first light emitting chips 3 includes at least one row of first forward light emitting chips 31 and at least one row of first reverse light emitting chips 32. The light emitting direction of the first forward light emitting chip 31 is opposite to the light emitting direction of the first backward light emitting chip 32.
As shown in fig. 4, in the first direction X, the first forward light-emitting chip 31 emits red laser light in a direction away from the center of the substrate 1, and the first reverse light-emitting chip 32 emits red laser light in a direction away from the center of the substrate 1, both emitting light in opposite directions. After the red laser emitted by the first forward light emitting chip 31 and the first backward light emitting chip 32 is reflected by the first reflecting prism 2, the polarization directions thereof are both turned by 90 degrees and changed from the P polarization direction to the S polarization direction, so that the laser emitted by the laser device has only one polarization direction for the laser of different colors.
Of course, as shown in fig. 6, the first forward light-emitting chip 31 and the first reverse light-emitting chip 32 may also emit light in opposite directions, that is, the first forward light-emitting chip 31 and the first reverse light-emitting chip 32 both emit red laser light in a direction close to the center of the substrate 1, and the same effect can be achieved.
In some embodiments, as shown in fig. 7, the first forward light emitting chips 31 are in two rows, and the two rows of the first forward light emitting chips 31 are arranged in a staggered manner along the first direction X. The first reverse light emitting chips 32 are arranged in two rows, and the two rows of the first reverse light emitting chips 32 are arranged in a staggered manner along the first direction X.
As shown in fig. 7, the light emitting directions of the two rows of first forward light emitting chips 31 are directed away from the center of the substrate 1. From the edge of the substrate 1 to the center of the substrate 1, the first forward light emitting chips 31 of the first row are arranged at intervals, and each first forward light emitting chip 31 of the second row is arranged at a position corresponding to the interval between two adjacent first forward light emitting chips 31 in the first row. Thus, the red laser light emitted from the first forward light-emitting chip 31 of the second row is not affected by the first forward light-emitting chip 31 of the first row.
In this regard, for example, as shown in fig. 7, the number of the first reflection prisms 2 is two, and one first reflection prism 2 is located on one side of the first forward light emitting chip 31 away from the center of the substrate 1, and reflects the red laser light emitted by the plurality of first forward light emitting chips 31. The other first reflecting prism 2 is located on one side of the first backward light-emitting chips 32 far away from the center of the substrate 1, and reflects the red laser light emitted by the plurality of first backward light-emitting chips 32. The plurality of first forward light emitting chips 31 are all the first forward light emitting chips 31, and the plurality of first reverse light emitting chips 32 are all the first reverse light emitting chips 32.
As shown in fig. 4 and 7, two first reflection prisms 2 are respectively disposed at positions away from the center of the substrate 1, and the first reflection prisms 2 are long prisms capable of reflecting red laser light emitted from the plurality of first forward light emitting chips 31. By adopting the long reflecting prism 1, the number of the first reflecting prisms 2 on the substrate 1 can be reduced, and the space can be saved to a certain extent. Of course, as shown in fig. 6, a one-to-one correspondence manner between the first reflection prisms 2 and the first light emitting chips 3 may be selected, that is, the number of the first reflection prisms 2 is the same as that of the first light emitting chips 3, and the reflection surface 11 of one first reflection prism 2 correspondingly reflects the red laser light emitted by one first light emitting chip 3. In this case, the first reflecting prism 2 is a short prism.
In some embodiments, as shown in fig. 4, the plurality of second light emitting chips 5 includes a plurality of second blue light emitting chips 51 and a plurality of second green light emitting chips 52. The plurality of second blue light-emitting chips 51 are arranged at least in a line along the second direction Y, and the plurality of second green light-emitting chips 52 are arranged at least in a line along the second direction Y. The second blue light emitting chip 51 emits blue laser light, and the second green light emitting chip 52 emits green laser light.
Illustratively, as shown in fig. 4, the second blue light-emitting chips 51 and the second green light-emitting chips 52 are respectively arranged in a row and are positioned at the left and right sides of the center of the substrate 1. Wherein three second blue light-emitting chips 51 or second green light-emitting chips 52 are arranged per column.
As shown in fig. 4, the ratio of the numbers of the first light emitting chips 3, the second blue light emitting chips 51, and the second green light emitting chips 52 may be 2: 1: 1. the laser under this quantity proportion has better display effect. In the laser provided in the embodiment of the present application, the first light emitting chips 3 are disposed on the upper and lower sides of the center of the substrate 1, and the second blue light emitting chips 51 and the second green light emitting chips 52 are disposed on the left and right sides, so that the above ratio is satisfied if the number of the light emitting chips arranged in each row and each column is the same.
Also, as shown in fig. 4, the light emitting direction of the second blue light emitting chip 51 and the light emitting direction of the second green light emitting chip 52 may be opposite. Thus, as shown in fig. 4 and 7, the light emitting directions of the first and second light emitting chips 3 and 5 are both directed away from the center of the substrate 1. Therefore, the mutual interference of the laser emitted by the first light-emitting chip 3 and the second light-emitting chip 5 can be avoided, and the light-emitting effect of the laser can be prevented from being influenced. Meanwhile, emitting laser light toward the center direction away from the substrate 1 makes it more convenient to arrange the first and second reflecting prisms 2 and 4 at the side away from the substrate 1.
In some embodiments, as shown in fig. 7, the plurality of second blue light emitting chips 51 are arranged in two rows along the second direction Y, and the two rows of second blue light emitting chips 51 are arranged in a staggered manner along the second direction Y. The plurality of second green light emitting chips 52 are arranged in two rows along the second direction Y, and the two rows of second green light emitting chips 52 are arranged in a staggered manner along the second direction Y. Thus, the number of the second blue light emitting chips 51 and the second green light emitting chips 52 can be increased without increasing the size of the laser, and the emission efficiency of the entire laser can be improved. The staggered arrangement is the same as the staggered arrangement of the two rows of the first forward light-emitting chips 31, that is, each second blue light-emitting chip 51 in the second column is located at a position corresponding to the interval between two adjacent second blue light-emitting chips 51 in the first column.
In some embodiments, as shown in fig. 7, the number of the second reflection prisms 4 may be two. One second reflecting prism 4 is positioned at a side of the second blue light emitting chip 51 away from the center of the substrate 1, and the other second reflecting prism 4 is positioned at a side of the second green light emitting chip 52 away from the center of the substrate 1. Like the first light emitting chip 3, the plurality of second blue light emitting chips 51 may share one second reflecting prism 4, and the plurality of second green light emitting chips 52 may share one second reflecting prism 4, so that the number of the second reflecting prisms 4 may be reduced, and the structure of the laser may be simplified.
The first reflecting prism 2 and the second reflecting prism 4 may be fixed to the substrate 1 by means of gluing.
As shown in fig. 8, a plurality of pins 6 are provided to electrically connect the first light-emitting chip 3 and the second light-emitting chip 5. For example, the first light emitting chips 3 of each row or the second light emitting chips 5 of each column may be connected in series with each other and then connected to the leads 6. Corresponding to the arrangement of the first light emitting chips 3 and the second light emitting chips 5 in the embodiment of the present application, two pins 6 are respectively disposed at four corners of the substrate 1 of the laser provided in the embodiment of the present application to electrically connect the rows of the first light emitting chips 3 and the columns of the second light emitting chips 5.
The wiring manner of the upper row of the plurality of first light emitting chips 3 in fig. 8 is taken as an example. The first light-emitting chips 3 are connected in series through gold wires 8. Wherein, the first light-emitting chip 3 and the heat sink 7 are provided with corresponding wiring points. The first light emitting chip 3 is a cathode, and the heat sink 7 is an anode. After the first light emitting chips 3 are connected in series, one end is connected to the upper left positive electrode pin 6, and the other end is connected to the upper right one negative electrode pin 6. And finishing the row of the plurality of first light-emitting chips. The other plural first light-emitting chips 3 and second light-emitting chips 5 are connected as shown in fig. 8.
Wherein, the outer diameter of the gold thread 8 can be between 23um to 50 um. For example, the gold wire 8 may have an outer diameter of 23um, 40um, or 50 um. As long as the reliability of the gold wire 8 can be ensured.
Meanwhile, the too long length of the single gold wire 8 can affect the passing of current. Therefore, a plurality of transfer stations 9 are arranged on the substrate 1 to reduce the length of a single gold wire 8, thereby ensuring the normal current in the gold wire 8. As shown in fig. 8, each lead 6 is connected to one of the pads 9 by a gold wire 8. Through setting up switching platform 9 for the length of single gold thread 8 can be shorter relatively, reduces the influence of gold thread 8 itself to the electric current.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A laser, comprising:
a substrate;
the first reflecting prism is arranged on the substrate and is provided with a first reflecting surface;
the first light-emitting chip is arranged on the substrate, and the first reflecting prism is positioned on one side of the first light-emitting chip along a first direction; the first light emitting chip is configured to emit red laser light toward the first reflection surface;
the second reflecting prism is arranged on the substrate and is provided with a second reflecting surface;
the second light-emitting chip is arranged on the substrate, and the second reflecting prism is positioned on one side of the second light-emitting chip along a second direction; the second light emitting chip is configured to emit blue laser light or green laser light toward the second reflective surface;
wherein the first direction is perpendicular to the second direction.
2. The laser of claim 1, wherein the number of the first light emitting chips is plural, the plural first light emitting chips are arranged in plural rows along the first direction, and each row is provided with plural first light emitting chips along the second direction;
the number of the second light emitting chips is multiple, the second light emitting chips are arrayed in multiple rows along the second direction, and the second light emitting chips are arranged in the first direction in each row.
3. The laser of claim 2, wherein the plurality of rows of first light emitting chips comprises at least one row of first forward light emitting chips and at least one row of first reverse light emitting chips; the light emitting direction of the first forward light emitting chip is opposite to that of the first reverse light emitting chip.
4. The laser of claim 3, wherein the at least one row of first forward light emitting chips comprises two rows of first forward light emitting chips, the two rows of first forward light emitting chips being staggered along the first direction; the at least one row of first reverse light-emitting chips comprises two rows of first reverse light-emitting chips, and the two rows of first reverse light-emitting chips are arranged in a staggered mode along the first direction.
5. The laser device according to claim 4, wherein the number of the first reflecting prisms is two, one first reflecting prism is located on one side of the first forward light emitting chip away from the center of the substrate, and reflects the red laser light emitted by the first forward light emitting chips;
the other first reflection prism is positioned on one side of the first reverse light-emitting chip far away from the center of the substrate and reflects the red laser emitted by the first reverse light-emitting chips.
6. The laser according to any one of claims 2 to 5, wherein the plurality of second light emitting chips comprise:
a plurality of second blue light emitting chips arranged in at least one column along the second direction;
a plurality of second green light emitting chips arranged in at least one column along the second direction.
7. The laser as claimed in claim 6, wherein the light emitting direction of the second blue light emitting chip is opposite to the light emitting direction of the second green light emitting chip.
8. The laser of claim 7,
the plurality of second blue light-emitting chips are arranged in two rows along the second direction, and the two rows of second blue light-emitting chips are arranged in a staggered manner along the second direction;
the plurality of second green light emitting chips are arranged in two rows along the second direction, and the two rows of the second green light emitting chips are arranged in a staggered mode along the second direction.
9. The laser device according to claim 7, wherein the number of the second reflecting prisms is two, one second reflecting prism is located on one side of the second blue light emitting chip away from the center of the substrate, and reflects the blue laser light emitted by the plurality of second blue light emitting chips;
the other second reflection prism is positioned on one side of the second green light emitting chip far away from the center of the substrate and reflects the green laser emitted by the second green light emitting chips.
10. The laser of claim 6, wherein a ratio of the number of the first light emitting chips, the second blue light emitting chips, and the second green light emitting chips is 2: 1: 1.
CN202111025826.XA 2021-09-02 2021-09-02 Laser device Pending CN113889839A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202111025826.XA CN113889839A (en) 2021-09-02 2021-09-02 Laser device
PCT/CN2022/116368 WO2023030419A1 (en) 2021-09-02 2022-08-31 Laser projection apparatus
CN202280059727.XA CN117916659A (en) 2021-09-02 2022-08-31 Laser projection device
US18/476,085 US20240022696A1 (en) 2021-09-02 2023-09-27 Laser projection apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111025826.XA CN113889839A (en) 2021-09-02 2021-09-02 Laser device

Publications (1)

Publication Number Publication Date
CN113889839A true CN113889839A (en) 2022-01-04

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CN202111025826.XA Pending CN113889839A (en) 2021-09-02 2021-09-02 Laser device

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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023030419A1 (en) * 2021-09-02 2023-03-09 青岛海信激光显示股份有限公司 Laser projection apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023030419A1 (en) * 2021-09-02 2023-03-09 青岛海信激光显示股份有限公司 Laser projection apparatus

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