CN113885142A - Alignment method, system and device for side-standing chip and lens - Google Patents
Alignment method, system and device for side-standing chip and lens Download PDFInfo
- Publication number
- CN113885142A CN113885142A CN202111044158.5A CN202111044158A CN113885142A CN 113885142 A CN113885142 A CN 113885142A CN 202111044158 A CN202111044158 A CN 202111044158A CN 113885142 A CN113885142 A CN 113885142A
- Authority
- CN
- China
- Prior art keywords
- lens
- substrate
- chip
- mirror
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
- G02B6/4222—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera by observing back-reflected light
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Lens Barrels (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
Abstract
The invention relates to the technical field of light path alignment, in particular to an alignment method, a system and a device for a side-standing chip and a lens, wherein the alignment method comprises the following steps: imaging the photosensitive surface of the side stand chip onto a surface parallel to the substrate through a mirror assembly; adjusting the position of the side standing chip to align the central line of the photosensitive surface image with the marking line on the substrate, and removing the mirror assembly; the lens is placed on the substrate and the center line of the lens is aligned with the mark line on the substrate. The photosensitive surface of the side standing chip can be imaged on a surface parallel to the substrate through the mirror assembly, and the position of the side standing chip on the substrate is determined by aligning the central line and the marking line of the imaging of the photosensitive surface; after removing the mirror assembly, aligning the centerline of the lens with the marking line of the substrate may determine the position of the lens on the substrate; the alignment of the side standing chip and the lens can be realized only by using the mirror assembly without using an external light source, so that the alignment cost is effectively reduced, and the alignment efficiency is improved.
Description
Technical Field
The invention relates to the technical field of light path alignment, in particular to an alignment method, system and device for a side-standing chip and a lens.
Background
At present, the side-standing chip and the optical path alignment have two main modes: firstly, fixing the optical path, and then finding the optimal position by adopting an active coupling side-standing chip; the other method is that the side-standing chip is fixed firstly, and then the optimal position is found through the active coupling of the optical component; the two modes need to be aligned through an external light source, and the alignment cost is high and the alignment time is long.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
The present invention is directed to provide an alignment method, system and apparatus for a side-standing chip and a lens to solve the problems of high cost and long alignment time of the side-standing chip and the optical path alignment.
The technical scheme adopted by the invention for solving the technical problems is as follows: there is provided an alignment method for a side standing chip and a lens, comprising the steps of:
step A, imaging a photosensitive surface of the side stand chip onto a surface parallel to the substrate through a mirror assembly;
b, adjusting the position of the side-standing chip to align the central line of the photosensitive surface image with the marking line on the substrate, and then removing the mirror assembly;
and D, placing the lens on the substrate, and adjusting the center line of the lens to be aligned with the marking line on the substrate.
Further preferred embodiments of the present invention are: the mirror assembly comprises a first mirror and a second mirror which are arranged at a certain included angle, the first mirror is parallel to the substrate, and the second mirror reflects the photosensitive surface of the side-standing chip to the first mirror for imaging.
Further preferred embodiments of the present invention are: the step D further comprises the steps of:
and adjusting the distance between the lens and the side standing chip according to the specification of the lens.
Further preferred embodiments of the present invention are: the alignment method further comprises the steps of:
c, fixing the side-standing chip by a patch;
and E, pasting and fixing the lens.
Further preferred embodiments of the present invention are: the step A comprises the following steps:
step A1, defining a surface which passes through the marking line and is vertical to the substrate as a reference surface;
step A2, defining the surface where the center line of the first mirror and the center line of the second mirror are located as the alignment surface;
step A3, placing the mirror assembly on the substrate and adjusting the position of the mirror assembly until the alignment surface is parallel to or coincident with the reference surface;
step a4, placing the edge standing chip on the substrate, and imaging the light-sensitive surface of the edge standing chip on the first mirror by reflection from the second mirror.
Further preferred embodiments of the present invention are: the step of adjusting the position of the mirror assembly in the step a3 specifically includes: the side edges of the mirror assembly and the side edges of the base plate are aligned such that the alignment plane is parallel to or coincides with the reference plane.
Further preferred embodiments of the present invention are: the step D comprises the following steps:
d1, acquiring the relative position of the central line of the lens and the marking line of the substrate and the distance between the lens and the side standing chip by the CCD camera;
step D2, moving the lens by the moving device to align the center line of the lens with the mark line of the substrate;
and D3, determining the coupling distance between the lens and the side standing chip according to the specification of the lens, determining the coupling position, and moving the lens to the coupling position by the moving device.
The present invention also provides an alignment system for a side standing chip and lens, comprising:
the imaging module is used for imaging the photosensitive surface of the side stand chip onto a surface parallel to the substrate through the mirror assembly;
the side-standing chip alignment module is used for adjusting the position of the side-standing chip to align the central line of the photosensitive surface image with the marking line on the substrate;
a mirror assembly removing module for removing the mirror assembly;
and the lens alignment module is used for placing the lens on the substrate, adjusting the center line of the lens to be aligned with the marking line on the substrate, and adjusting the distance between the lens and the side-standing chip according to the specification of the lens.
Further preferred embodiments of the present invention are: the alignment system further comprises:
the side-standing chip fixing module is used for fixing a side-standing chip by pasting;
and the lens fixing module is used for fixing the lens by the patch.
The present invention also provides an alignment apparatus for a side standing chip and a lens, comprising:
the CCD camera is used for acquiring the position information of the side standing chip, the position information of the marking line on the substrate and the position information of the lens;
the moving device is used for clamping, moving and adjusting the position of the side standing chip and adjusting the position of the lens;
the mirror assembly is used for imaging the photosensitive surface of the side stand chip onto a surface parallel to the substrate;
and the patch fixing mechanism is used for fixing the side chip and the lens by the patch.
The invention has the advantages that the photosensitive surface of the side standing chip can be imaged on the surface parallel to the substrate through the mirror assembly, and then the position of the side standing chip on the substrate is determined by aligning the central line and the marking line of the photosensitive surface imaging; after removing the mirror assembly, continuing to align the centerline of the lens with the mark line of the substrate may determine the position of the lens on the substrate; the alignment of the side standing chip and the lens can be realized only by using the mirror assembly without using an external light source, so that the alignment cost is effectively reduced, and the alignment efficiency is improved.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a flow chart of an alignment method for a side-standing chip and lens of the present invention;
FIG. 2 is a flow chart of step S100 of the present invention;
FIG. 3 is a flow chart of step S400 of the present invention;
FIG. 4 is a block diagram of the alignment system for the edge-standing chip and lens of the present invention;
FIG. 5 is a schematic diagram of the side-up chip alignment of the present invention;
FIG. 6 is a schematic diagram of lens alignment according to the present invention.
Detailed Description
The invention provides an alignment method, system and device for a side standing chip and a lens, and in order to make the purpose, technical scheme and effect of the invention clearer and clearer, the invention is further described in detail by referring to the attached drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 to 6 together, the alignment method for the side chip and the lens according to the preferred embodiment of the present invention includes the steps of:
step S100, imaging the photosensitive surface of the side stand chip to a surface parallel to the substrate through a mirror assembly;
s200, adjusting the position of the side-standing chip to align the central line of the photosensitive surface image with the marking line on the substrate, and then removing the mirror assembly;
step S400, placing the lens on the substrate, and adjusting the center line of the lens to be aligned with the mark line on the substrate.
The structure of the side-standing chip is complex, and the position of the photosensitive surface of the side-standing chip can be deviated due to errors of processing precision or assembly precision; therefore, the position of the side standing chip cannot be determined by directly aligning the center line of the side standing chip and the mark line of the substrate; the lens is simple in structure, machining accuracy is guaranteed, and the position can be determined directly through the mode that the central line is aligned with the mark line of the substrate.
The embodiment can image the photosensitive surface of the side standing chip onto a surface parallel to the substrate through the mirror assembly, and then determine the position of the side standing chip on the substrate by aligning the central line and the marking line of the imaging of the photosensitive surface; after removing the mirror assembly, continuing to align the centerline of the lens with the mark line of the substrate may determine the position of the lens on the substrate; the alignment of the side standing chip and the lens can be realized only by using the mirror assembly without additionally adding an external light source, the alignment cost is effectively reduced, and the alignment efficiency is improved.
The mirror assembly comprises a first mirror and a second mirror which are arranged at a certain included angle, the first mirror is parallel to the substrate, and the second mirror reflects the photosensitive surface of the side-standing chip to the first mirror for imaging. The photosensitive surface of the side standing chip can be imaged on a surface parallel to the substrate (namely, on the first mirror) through the matching of the first mirror and the second mirror. In this embodiment, the alignment can be performed by only ensuring that the photosensitive surface can image on the first mirror without limiting the size of the included angle between the first mirror and the second mirror. Of course, in order to align the center line of the image of the photosensitive surface with the marking line on the substrate conveniently, the inclination angle of the second mirror can be adjusted according to the height of the photosensitive surface and the size of the first mirror, so that the image of the photosensitive surface is positioned on the edge of the first mirror, and the image of the photosensitive surface is aligned with the marking line conveniently.
Further, the step 400 further includes the steps of: and adjusting the distance between the lens and the side standing chip according to the specification of the lens. The coupling distances of the lenses with different specifications are different, and the embodiment can ensure the coupling effect by adjusting the distance between the lens and the side-standing chip according to the specifications of the lenses, so that the coupling efficiency is improved.
Further, referring to fig. 1, the alignment method further includes the steps of:
step S300, fixing a side-standing chip by a patch;
step S500, fixing the lens by pasting.
In this embodiment, the side chip, lens all adopt the mode of paster to fix, and fixed effectual, and fixed mode is simple convenient.
Further, referring to fig. 1 and fig. 2, the step S100 includes the steps of:
step S110, defining a surface which passes through the marking line and is vertical to the substrate as a reference surface;
step S120, defining the surface where the center line of the first mirror and the center line of the second mirror are positioned as an alignment surface;
step S130, placing the mirror assembly on the substrate and adjusting the position of the mirror assembly until the alignment surface is parallel to or coincident with the reference surface;
step S140, the side chip is placed on the substrate, and the photosensitive surface of the side chip is imaged on the first mirror through the reflection of the second mirror.
In the implementation, the positioning of the side standing chip is mainly carried out by aligning the central line of the imaging of the photosensitive surface with the marking line on the substrate; therefore, the orientation of the mirror assembly needs to be ensured, the orientation of the second mirror needs to be opposite to the side-standing chip, and the situation that the normal alignment of the side-standing chip is influenced due to the fact that the center line of the second mirror after imaging the photosensitive surface and the marking line form a certain angle due to the fact that the second mirror inclines towards two sides is avoided.
Further, the step of adjusting the position of the mirror assembly in step S130 specifically includes: the side edges of the mirror assembly and the side edges of the base plate are aligned such that the alignment plane is parallel to or coincides with the reference plane. The orientation of the mirror assembly can be adjusted by aligning the side edge of the mirror assembly and the side edge of the substrate, and the positioning cost is low. Certainly, in other implementations, the mirror assembly and the substrate can be aligned by adopting a tool, so that the alignment efficiency can be effectively improved, and the alignment efficiency of the side-standing chip and the lens can be improved.
Further, referring to fig. 1 and fig. 3, the step S400 includes the steps of:
step S410, acquiring the relative position of the central line of the lens and the marking line of the substrate through the CCD camera, and acquiring the distance between the lens and the side standing chip;
step S420, moving the lens through the moving device to align the central line of the lens with the marking line of the substrate;
and step S430, determining the coupling distance between the lens and the side standing chip according to the specification of the lens, determining the coupling position, and moving the lens to the coupling position through the moving device.
The CDD camera is used for measuring and acquiring the distance between the central line and the marking line of the substrate and the distance between the lens and the side standing chip, and the measuring precision is high; then the moving device moves the lens according to the measuring result of the CDD camera, firstly adjusts the central line of the lens to be aligned with the marking line of the substrate, and then adjusts the distance between the lens and the side standing chip to be the target distance, thus completing the adjustment of the position of the lens, being convenient and fast and having high positioning precision. The moving device may be a clamping moving device or a suction moving device.
The present invention also provides a preferred embodiment of an alignment system for a side-standing chip and lens.
Referring to fig. 4, the alignment system for the side chip and the lens includes:
an imaging module 10 for imaging the photosensitive surface of the side stand chip onto a surface parallel to the substrate by a mirror assembly;
the side-standing chip alignment module 20 is used for adjusting the position of the side-standing chip to align the central line of the photosensitive surface image with the marking line on the substrate;
a mirror assembly removing module 30 for removing the mirror assembly;
and the lens alignment module 40 is used for placing the lens on the substrate, adjusting the center line of the lens to be aligned with the marking line on the substrate, and adjusting the distance between the lens and the side-standing chip according to the specification of the lens.
The position of the mirror component on the substrate can be adjusted through the imaging module 10, so that the photosensitive surface of the side-standing chip is imaged on a surface parallel to the substrate; the center line and the marking line of the imaging of the photosensitive surface can be aligned through the side-standing chip alignment module 20, and the position of the side-standing chip on the substrate is determined; the mirror assembly can be removed after determining the side stand chip position by the mirror assembly removal module 30; the lens alignment module 40 is used for adjusting the center line of the lens to be aligned with the mark line on the substrate, and adjusting the distance between the lens and the side-standing chip according to the specification of the lens, so that the position of the lens can be determined. This an alignment system for standing on one's side chip and lens only needs to use the mirror subassembly can realize the alignment of standing on one's side chip and lens, need not additionally to increase external light source, and effectual reduction is aimed at the cost, improves and aims at efficiency.
Further, the alignment system further comprises:
the side-standing chip fixing module 50 is used for fixing a side-standing chip by pasting;
and a lens fixing module 60 for fixing the lens by the patch.
The side chip and the lens can be respectively fixed by the side chip fixing module 50 and the lens fixing module 60 in a surface mounting manner, so that the fixing effect is good, and the fixing mode is simple and convenient.
The present invention also provides a preferred embodiment of an alignment apparatus for a side standing chip and lens.
Referring to fig. 5 and 6, the aligning apparatus for the side chip and the lens includes;
a CCD camera (not shown in the figure) for acquiring position information of the side-standing chip 100, position information of the mark line 210 on the substrate 200, and position information of the lens 300;
a moving device (not shown in the figure) for clamping and moving the position of the adjustment side standing chip 100 and the position of the adjustment lens 300;
a mirror assembly 400 for imaging the photosensitive surface of the side stand chip 100 onto a plane parallel to the substrate 200;
a patch fixing mechanism (not shown) for patch-fixing the side stand chip 100 and the lens 300.
The mirror assembly 400 is a first mirror 410 and a second mirror 420 arranged at a certain included angle, the first mirror 410 is parallel to the substrate 200, and the second mirror 420 reflects the photosensitive surface of the side-standing chip 100 onto the first mirror 410 for imaging. The photosensitive surface of the side-standing chip 100 can be imaged onto a plane parallel to the substrate 200 (i.e., on the first mirror) by the cooperation of the first mirror 410 and the second mirror 420.
This an alignment device for standing on one's side chip 100 and lens 300 can image the photosensitive surface of standing on one's side chip 100 to the face parallel with base plate 200 through mirror subassembly 400, and the location of standing on one's side chip can be realized to the central line that the rethread aligns photosensitive surface and the mark line 210 on the base plate 200, need not additionally to increase external light source, and effectual reduction is aimed at the cost, improves and aims at efficiency. The CCD camera can be used for measuring the position information of the side-standing chip, the marking line on the substrate and the lens; the moving device can be used for moving the side standing chip and the lens to complete position adjustment; the patch fixing mechanism is used for dispensing and fixing the side standing chip and the lens.
It should be understood that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; and all such modifications and alterations are intended to fall within the scope of the appended claims.
Claims (10)
1. An alignment method for a side standing chip and a lens, comprising the steps of:
step A, imaging a photosensitive surface of the side stand chip onto a surface parallel to the substrate through a mirror assembly;
b, adjusting the position of the side-standing chip to align the central line of the photosensitive surface image with the marking line on the substrate, and then removing the mirror assembly;
and D, placing the lens on the substrate, and adjusting the center line of the lens to be aligned with the marking line on the substrate.
2. The method of claim 1, wherein the mirror assembly comprises a first mirror and a second mirror disposed at an angle, the first mirror being parallel to the substrate, the second mirror reflecting the light sensitive surface of the edge chip onto the first mirror for imaging.
3. The alignment method for a side standing chip and lens as claimed in claim 1, wherein said step D further comprises the steps of:
and adjusting the distance between the lens and the side standing chip according to the specification of the lens.
4. The alignment method for a side standing chip and lens as claimed in claim 1, further comprising the steps of:
c, fixing the side-standing chip by a patch;
and E, pasting and fixing the lens.
5. The alignment method for a side standing chip and lens according to claim 1, wherein the step a comprises the steps of:
step A1, defining a surface which passes through the marking line and is vertical to the substrate as a reference surface;
step A2, defining the surface where the center line of the first mirror and the center line of the second mirror are located as the alignment surface;
step A3, placing the mirror assembly on the substrate and adjusting the position of the mirror assembly until the alignment surface is parallel to or coincident with the reference surface;
step a4, placing the edge standing chip on the substrate, and imaging the light-sensitive surface of the edge standing chip on the first mirror by reflection from the second mirror.
6. The alignment method for the edge standing chip and the lens as claimed in claim 5, wherein the step of adjusting the position of the mirror assembly in the step A3 is specifically as follows: the side edges of the mirror assembly and the side edges of the base plate are aligned such that the alignment plane is parallel to or coincides with the reference plane.
7. The alignment method for a side stand chip and lens according to claim 3, wherein said step D comprises the steps of:
d1, acquiring the relative position of the central line of the lens and the marking line of the substrate and the distance between the lens and the side standing chip by the CCD camera;
step D2, moving the lens by the moving device to align the center line of the lens with the mark line of the substrate;
and D3, determining the coupling distance between the lens and the side standing chip according to the specification of the lens, determining the coupling position, and moving the lens to the coupling position by the moving device.
8. An alignment system for a side-standing chip and lens, comprising:
the imaging module is used for imaging the photosensitive surface of the side stand chip onto a surface parallel to the substrate through the mirror assembly;
the side-standing chip alignment module is used for adjusting the position of the side-standing chip to align the central line of the photosensitive surface image with the marking line on the substrate;
a mirror assembly removing module for removing the mirror assembly;
and the lens alignment module is used for placing the lens on the substrate, adjusting the center line of the lens to be aligned with the marking line on the substrate, and adjusting the distance between the lens and the side-standing chip according to the specification of the lens.
9. The alignment system for a side standing chip and lens of claim 8, further comprising:
the side-standing chip fixing module is used for fixing a side-standing chip by pasting;
and the lens fixing module is used for fixing the lens by the patch.
10. An alignment apparatus for a side-standing chip and lens, comprising;
the CCD camera is used for acquiring the position information of the side standing chip, the position information of the marking line on the substrate and the position information of the lens;
the moving device is used for clamping, moving and adjusting the position of the side standing chip and adjusting the position of the lens;
the mirror assembly is used for imaging the photosensitive surface of the side stand chip onto a surface parallel to the substrate;
and the patch fixing mechanism is used for fixing the side chip and the lens by the patch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111044158.5A CN113885142B (en) | 2021-09-07 | 2021-09-07 | Alignment method, system and device for side-standing chip and lens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111044158.5A CN113885142B (en) | 2021-09-07 | 2021-09-07 | Alignment method, system and device for side-standing chip and lens |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113885142A true CN113885142A (en) | 2022-01-04 |
| CN113885142B CN113885142B (en) | 2023-04-14 |
Family
ID=79008444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111044158.5A Active CN113885142B (en) | 2021-09-07 | 2021-09-07 | Alignment method, system and device for side-standing chip and lens |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113885142B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB605485A (en) * | 1943-01-19 | 1948-07-23 | Kodak Ltd | Improvements in or relating to range finders |
| CN101915560A (en) * | 2010-06-25 | 2010-12-15 | 北京市普锐科创科技有限责任公司 | Device for measuring straightness/coaxiality by applying laser |
| CN203198410U (en) * | 2013-02-25 | 2013-09-18 | 伊欧激光科技（苏州）有限公司 | Laser mark device |
| CN105259623A (en) * | 2015-10-30 | 2016-01-20 | 武汉电信器件有限公司 | Laser and grating coupler packaging structure and method |
| CN106568578A (en) * | 2016-10-12 | 2017-04-19 | 中国电子科技集团公司第五十研究所 | Aligning detector of off-axis reflection type terahertz imaging system and aligning method thereof |
| US20210199943A1 (en) * | 2019-12-26 | 2021-07-01 | David Kessler | Scanning microscope with enhanced fov and na |
-
2021
- 2021-09-07 CN CN202111044158.5A patent/CN113885142B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB605485A (en) * | 1943-01-19 | 1948-07-23 | Kodak Ltd | Improvements in or relating to range finders |
| CN101915560A (en) * | 2010-06-25 | 2010-12-15 | 北京市普锐科创科技有限责任公司 | Device for measuring straightness/coaxiality by applying laser |
| CN203198410U (en) * | 2013-02-25 | 2013-09-18 | 伊欧激光科技（苏州）有限公司 | Laser mark device |
| CN105259623A (en) * | 2015-10-30 | 2016-01-20 | 武汉电信器件有限公司 | Laser and grating coupler packaging structure and method |
| CN106568578A (en) * | 2016-10-12 | 2017-04-19 | 中国电子科技集团公司第五十研究所 | Aligning detector of off-axis reflection type terahertz imaging system and aligning method thereof |
| US20210199943A1 (en) * | 2019-12-26 | 2021-07-01 | David Kessler | Scanning microscope with enhanced fov and na |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113885142B (en) | 2023-04-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101205522B1 (en) | Exposure apparatus | |
| KR102048301B1 (en) | Pre-alignment device and method for wafer | |
| JPH04317316A (en) | Projection aligner | |
| CN1707363A (en) | Radiation system, lithographic apparatus, device manufacturing method and device manufactured thereby | |
| CN111106053B (en) | Silicon wafer prealignment device and method | |
| US10175041B2 (en) | Measuring head and eccentricity measuring device including the same | |
| FR2536873A1 (en) | EXPOSURE APPARATUS AND METHOD | |
| CN102087483A (en) | Optical system for focal plane detection in projection lithography | |
| WO2017167260A1 (en) | Coaxial mask alignment device, photolithography apparatus and alignment method | |
| US7197176B2 (en) | Mark position detecting apparatus and mark position detecting method | |
| JPH10153866A (en) | Illuminator and exposure device provided with it | |
| CN113885142B (en) | Alignment method, system and device for side-standing chip and lens | |
| US11283978B1 (en) | Aligning lens elements in a lens module relative to an image sensor | |
| CN103576467B (en) | A kind of alignment device and alignment methods | |
| US5721079A (en) | Process for positioning a mask relative to a workpiece and device executing the process | |
| CN101364051A (en) | Exposure equipment, exposure method, and manufacturing method for a semiconductor device | |
| IE51237B1 (en) | Improved step-and-repeat projection alignment and exposure system with auxiliary optical unit | |
| JP2019194553A (en) | Position detection device and position detection method | |
| JP2009121920A (en) | Transparent substrate position measuring apparatus, exposure apparatus provided with the position measuring apparatus, substrate measuring method, and prealignment apparatus | |
| CN105807571B (en) | A kind of litho machine focusing and leveling system and its focusing and leveling method | |
| TWI301562B (en) | Reticle focus measurement system and method using multiple interferometric beams | |
| US11644757B2 (en) | Method to achieve tilted patterning with a through resist thickness using projection optics | |
| CN114942506B (en) | Calibration method of assembly system for periscope type camera module based on collimator | |
| JP4197680B2 (en) | Mounting method of light emitting element | |
| JP2007042858A (en) | Projection aligner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 518000 No. 35, Cuijing Road, Pingshan New District, Shenzhen, Guangdong Applicant after: Ona Technology (Shenzhen) Group Co.,Ltd. Address before: 518000 No. 35, Cuijing Road, Pingshan New District, Shenzhen, Guangdong Applicant before: O-NET COMMUNICATIONS (SHENZHEN) Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |