CN113881982A - Preparation method of alloy copper wire - Google Patents
Preparation method of alloy copper wire Download PDFInfo
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- CN113881982A CN113881982A CN202111250474.8A CN202111250474A CN113881982A CN 113881982 A CN113881982 A CN 113881982A CN 202111250474 A CN202111250474 A CN 202111250474A CN 113881982 A CN113881982 A CN 113881982A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 101
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 43
- 239000000956 alloy Substances 0.000 title claims abstract description 43
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 238000009713 electroplating Methods 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 21
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 claims abstract description 20
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 18
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 14
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims abstract description 14
- 235000011130 ammonium sulphate Nutrition 0.000 claims abstract description 14
- 238000002844 melting Methods 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 13
- 229910000428 cobalt oxide Inorganic materials 0.000 claims abstract description 12
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000004140 cleaning Methods 0.000 claims abstract description 10
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 10
- 235000010265 sodium sulphite Nutrition 0.000 claims abstract description 10
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims abstract description 9
- 239000001632 sodium acetate Substances 0.000 claims abstract description 9
- 235000017281 sodium acetate Nutrition 0.000 claims abstract description 9
- 238000005282 brightening Methods 0.000 claims abstract description 8
- 238000007747 plating Methods 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 7
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 7
- WWNBZGLDODTKEM-UHFFFAOYSA-N sulfanylidenenickel Chemical compound [Ni]=S WWNBZGLDODTKEM-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 6
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002253 acid Substances 0.000 claims abstract description 5
- 238000003756 stirring Methods 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract description 4
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 4
- 238000005406 washing Methods 0.000 claims abstract description 4
- 238000005498 polishing Methods 0.000 claims description 20
- PVNIIMVLHYAWGP-UHFFFAOYSA-N Niacin Chemical compound OC(=O)C1=CC=CN=C1 PVNIIMVLHYAWGP-UHFFFAOYSA-N 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 9
- 239000002202 Polyethylene glycol Substances 0.000 claims description 7
- 239000006004 Quartz sand Substances 0.000 claims description 7
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 claims description 7
- 229960003512 nicotinic acid Drugs 0.000 claims description 7
- 235000001968 nicotinic acid Nutrition 0.000 claims description 7
- 239000011664 nicotinic acid Substances 0.000 claims description 7
- 229920001223 polyethylene glycol Polymers 0.000 claims description 7
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 claims description 7
- 238000000280 densification Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229910052708 sodium Inorganic materials 0.000 claims description 6
- 239000011734 sodium Substances 0.000 claims description 6
- -1 sodium alkylsulfonate Chemical class 0.000 claims description 6
- 238000005554 pickling Methods 0.000 claims description 5
- 238000007517 polishing process Methods 0.000 claims description 5
- 239000001509 sodium citrate Substances 0.000 claims description 5
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 239000012467 final product Substances 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 239000007788 liquid Substances 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000007731 hot pressing Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910001453 nickel ion Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 229930003270 Vitamin B Natural products 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- JVBXVOWTABLYPX-UHFFFAOYSA-L sodium dithionite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])=O JVBXVOWTABLYPX-UHFFFAOYSA-L 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 235000019156 vitamin B Nutrition 0.000 description 1
- 239000011720 vitamin B Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a preparation method of an alloy copper wire, which comprises the following steps: 1) putting 10-15 parts of nickel, 10-15 parts of aluminum and 10-15 parts of cerium into a melting furnace, melting until liquefaction and stirring to obtain mixed molten metal; 2) 65-85 parts of copper core is uniformly mixed with molten metal and then dried after the surface of the copper core is covered with the molten metal to obtain an alloy copper core; 3) sequentially carrying out drawing-polishing-acid washing processes on an alloy copper core to obtain a copper wire, placing the copper wire in an electroplating pool, and electroplating at the temperature of 55-75 ℃, wherein the electroplating solution comprises 10-15 parts of sodium acetate, 5-10 parts of sodium sulfite, 5-10 parts of a brightening agent, 55-65 parts of nickel sulfide, 10-15 parts of cobalt oxide, 5-15 parts of ammonium sulfate, 10-15 parts of silicon dioxide and 10-15 parts of dilute sulfuric acid, and is taken out after preset time; 4) and (3) placing the electroplated copper wire into an ultrasonic cleaning water tank for cleaning for 3-5min at normal temperature, and drying and taking up the copper wire after cleaning. The ammonium sulfate is matched with sodium sulfite to accelerate the plating speed of nickel.
Description
Technical Field
The invention relates to the technical field of copper wire manufacturing, in particular to a preparation method of an alloy copper wire.
Background
In life, practical copper wires are used as leads. The conductive performance is good, and the conductive material is widely used for manufacturing wires, cables, brushes and the like; the heat conductivity is good, and the magnetic instrument and the instrument which need antimagnetic interference, such as a compass, an aviation instrument and the like, are commonly manufactured; has excellent plasticity, is easy to be processed by hot pressing and cold pressing, and can be made into copper materials such as pipes, bars, wires, strips, belts, plates, foils and the like.
With the rapid development of global economy, the demand for plated wire materials in the fields of transportation, energy, power, electronics and the like has been on a steep increase. The alloy copper wire is more favored by users because of better corrosion resistance, wear resistance, lubricity, hardness, conductivity and good appearance performance. Because the alloy has better corrosion resistance and high temperature resistance, the alloy is easy to passivate in the air, can resist strong alkali and has slower action with hydrochloric acid and sulfuric acid.
Disclosure of Invention
The invention provides a preparation method of an alloy copper wire to overcome the defects in the prior art.
In order to solve the technical problems, the invention adopts the following technical scheme: a preparation method of an alloy copper wire comprises the following steps:
1) putting 10-15 parts of nickel, 10-15 parts of aluminum and 10-15 parts of cerium into a melting furnace, melting until liquefaction and stirring to obtain mixed molten metal;
2) 65-85 parts of copper core is uniformly mixed with molten metal and then dried after the surface of the copper core is covered with the molten metal to obtain an alloy copper core;
3) sequentially carrying out drawing-polishing-acid washing processes on an alloy copper core to obtain a copper wire, placing the copper wire in an electroplating pool, and electroplating at the temperature of 55-75 ℃, wherein the electroplating solution comprises 10-15 parts of sodium acetate, 5-10 parts of sodium sulfite, 5-10 parts of a brightening agent, 55-65 parts of nickel sulfide, 10-15 parts of cobalt oxide, 5-15 parts of ammonium sulfate, 10-15 parts of silicon dioxide and 10-15 parts of dilute sulfuric acid, and is taken out after preset time;
cobalt oxide is the most stable chemical state of cobalt, cobalt oxide has high hardness, the wear resistance and corrosion resistance of a copper wire can be improved, cobalt oxide can also be used as a dye to dye the surface of the copper wire, silicon dioxide has high hardness, part of the cobalt oxide can react with cobalt oxide to form the dye, ammonium sulfate is an inert substance and is not easy to react with an active substance, the ammonium sulfate is extremely good in solubility and can form a high-salt environment, nickel ions are in an alkaline condition, Ni is extremely easy to form alkaline precipitation with smaller solubility product with alkali, the ammonium sulfate is matched with sodium hydrosulfite to accelerate the plating speed of nickel, the ammonium sulfate can be used as an accelerator, the activation energy of reduction of the nickel ions at low temperature is reduced, and a mixed ligand complex beneficial to electronic conduction can be formed together by matching with sodium acetate, the grain size of a plating layer is reduced, and the corrosivity of the plating layer is improved.
4) And (3) placing the electroplated copper wire into an ultrasonic cleaning water tank for cleaning for 3-5min at normal temperature, and drying and taking up the copper wire after cleaning.
Preferably, in the step 2, the obtained alloy copper core is placed in a heat treatment furnace under the vacuum condition, the temperature is raised to 250-350 ℃, the alloy copper core is continuously hot-pressed for 3-5 times under the pressure of 20-35 MPa, tissue densification treatment is carried out, gaps in the alloy copper core structure are reduced, the gaps among ions are small during electroplating, the ion activation energy is increased, and the hot-pressed alloy copper is subjected to drawing-polishing-pickling processes in sequence to obtain a copper wire which is a final product.
Preferably, the pH value of the electroplating solution is 4-5, the cathode current density is 2.5-3.5A/dm2, and the electroplating time is 2-3 min.
Preferably, the brightening agent comprises polyethylene glycol and nicotinic acid in a mass ratio of 1:1, the polyethylene glycol has excellent lubricity, moisture retention, dispersibility and adhesive, the nicotinic acid belongs to vitamin B group and can increase the brightness, the polyethylene glycol can change the tissue structure, and the clearance between molecules during electroplating is reduced while the brightness of the copper wire is increased by matching with the nicotinic acid.
Preferably, in step 4, the polishing process includes spraying a polishing agent on the surface of the alloy copper core like after drawing at a high speed, and the pressure of a nozzle is 7 pa.
Preferably, the polishing agent comprises 40-55 parts of quartz sand, 10-15 parts of sodium citrate, 15-20 parts of trichloroethylene and 8-13 parts of sodium alkyl sulfonate.
The high-efficiency metal cleaning agent has the advantages that the quartz sand is high in hardness and wear-resistant, the copper wire is polished by high-pressure impact, the trichloroethylene has strong emulsifying and cleaning effects, rust, oxide skin, grease and other stains on the surface of metal can be efficiently cleaned, the sodium alkylsulfonate has a high-strength cleaning function, and residues on the copper wire are cleaned while the copper wire is polished by matching with the quartz sand and the trichloroethylene.
Preferably, the pressing pressure is 20-35 MPa.
Compared with the prior art, the invention has the beneficial effects that: 1. the ammonium sulfate is matched with sodium sulfite, so that the plating speed of nickel can be accelerated; 2. the ammonium sulfate and the sodium sulfite are matched with sodium acetate to form a mixed ligand complex which is favorable for electronic conduction, so that the grain size of the coating is reduced, and the corrosivity of the coating is improved.
Detailed Description
The present invention will be described in detail with reference to examples.
Example 1
The invention provides a preparation method of an alloy copper wire, which comprises the following steps:
1) putting 10 parts of nickel, 10 parts of aluminum and 10 parts of cerium into a melting furnace, melting until liquefaction and stirring to obtain mixed molten metal;
2) 65 parts of copper core penetrates through mixed molten metal at a constant speed, and the surface of the copper core is coated with molten metal and then dried to obtain an alloy copper core;
3) placing the alloy copper core obtained in the step 2 in a heat treatment furnace under the vacuum condition, heating to 250 ℃, continuously hot-pressing the alloy copper core for 3-5 times at 20MPa for tissue densification, sequentially carrying out drawing-polishing (polishing copper wire by using a polishing machine) and acid pickling processes on the hot-pressed alloy copper to obtain a copper wire, placing the copper wire in an electroplating pool, electroplating at 55 ℃, wherein the pH value of the electroplating solution is 4, the cathode current density is 2.5A/dm2, the electroplating time is 2min, the electroplating solution comprises 10 parts of sodium acetate, 5 parts of sodium sulfite, 5 parts of brightening agents (polyethylene glycol and nicotinic acid with the mass ratio of 1: 1), 55 parts of nickel sulfide, 10 parts of cobalt oxide, 5 parts of ammonium sulfate, 10 parts of silicon dioxide and 10 parts of dilute sulfuric acid, and the electroplating solution is taken out after the preset time;
4) and (3) placing the electroplated copper wire into an ultrasonic cleaning water tank for cleaning for 3-5min at normal temperature, and drying and taking up the copper wire after cleaning.
Example 2
A preparation method of an alloy copper wire comprises the following steps:
1) putting 12 parts of nickel, 12 parts of aluminum and 12 parts of cerium into a melting furnace, melting until the materials are liquefied and stirred to obtain mixed molten metal;
2) 70 parts of copper core penetrates through mixed molten metal at a constant speed, and the surface of the copper core is coated with molten metal and then dried to obtain an alloy copper core;
3) placing the alloy copper core obtained in the step 2 in a heat treatment furnace under the vacuum condition, raising the temperature to 300 ℃, continuously hot-pressing the alloy copper core for 4 times under the pressure of 30MPa, performing tissue densification treatment, sequentially performing drawing-polishing (polishing and pickling on the copper wire by using a polishing machine) on the hot-pressed alloy copper to obtain a copper wire, placing the copper wire in an electroplating pool, electroplating at the temperature of 70 ℃, wherein the pH value of the electroplating solution is 4.5, the cathode current density is 3A/dm2, the electroplating time is 2.5min, and the electroplating solution comprises 12 parts of sodium acetate, 7 parts of sodium sulfite, 7 parts of brightening agent (polyethylene glycol and nicotinic acid with the mass ratio of 1: 1), 60 parts of nickel sulfide, 12 parts of cobalt oxide, 12 parts of ammonium sulfate, 12 parts of silicon dioxide and 12 parts of dilute sulfuric acid, and taking out after a preset time;
4) at normal temperature, the electroplated copper wire is placed into an ultrasonic clean water pool to be cleaned for 4min, and the wire is dried and taken up after being cleaned
Example 3
A preparation method of an alloy copper wire comprises the following steps:
1) putting 15 parts of nickel, 15 parts of aluminum and 15 parts of cerium into a melting furnace, melting until liquefaction and stirring to obtain mixed molten metal;
2) 85 parts of copper core is uniformly mixed with molten metal, and the surface of the copper core is coated with the molten metal and then dried to obtain an alloy copper core;
3) placing the alloy copper core obtained in the step 2 in a heat treatment furnace under the vacuum condition, raising the temperature to 350 ℃, continuously hot-pressing the alloy copper core for 5 times under the pressure of 35MPa, performing tissue densification treatment, sequentially performing drawing-polishing (polishing and pickling on a copper wire by using a polishing machine) on the hot-pressed alloy copper to obtain a copper wire, placing the copper wire in an electroplating pool, electroplating at the temperature of 75 ℃, wherein the pH value of the electroplating solution is 5, the cathode current density is 3.5A/dm2, the electroplating time is 3min, and the electroplating solution comprises 15 parts of sodium acetate, 10 parts of sodium sulfite, 10 parts of brightening agents (polyethylene glycol and nicotinic acid with the mass ratio of 1: 1), 65 parts of nickel sulfide, 15 parts of cobalt oxide, 15 parts of ammonium sulfate, 15 parts of silicon dioxide and 15 parts of dilute sulfuric acid, and taking out after a preset time;
4) at normal temperature, the electroplated copper wire is placed into an ultrasonic clean water pool to be cleaned for 5min, and the wire is dried and taken up after being cleaned
Comparative example 1
15 parts of nickel, 15 parts of aluminum and 59 parts of copper are placed into a melting furnace to be melted until liquefied and stirred to obtain mixed metal liquid, the mixed metal liquid is cast to obtain a copper core, the copper core is sequentially subjected to drawing-polishing-acid washing processes to obtain a copper wire, the copper wire is placed into electroplating liquid to be electroplated at the temperature of 60 ℃, the pH value of the electroplating liquid is 3, the electroplating time is 4min, and the electroplating liquid comprises 55 parts of nickel sulfide, 10 parts of sodium hypophosphite, 10 parts of magnesium oxide and 7 parts of sodium sulfite.
The copper wires prepared by the preparation methods of the embodiment 1, the embodiment 2, the embodiment 3 and the comparative embodiment 1 are respectively subjected to test comparison, and the specific data are shown in the table 1;
TABLE 1
As can be seen from table 1, example 3 is the most preferable embodiment, and comparative example 1 (without ammonium sulfate, cobalt oxide and sodium acetate) has lower corrosion current density and tensile strength than those of the examples of the present invention in order to perform the hot press treatment of the copper core and the structure densification treatment before the plating.
Example 4
This embodiment is substantially the same as embodiment 3 except that:
the polishing process comprises the step of spraying a polishing agent on the surface of the alloy copper core after drawing at a high speed, wherein the pressure of a nozzle is 7pa, and the polishing agent comprises 40 parts of quartz sand, 10 parts of sodium citrate, 15 parts of trichloroethylene and 8-13 parts of sodium alkyl sulfonate.
Example 5
This embodiment is substantially the same as embodiment 3 except that:
the polishing process comprises the step of spraying a polishing agent on the surface of the alloy copper core after drawing at a high speed, wherein the pressure of a nozzle is 7pa, and the polishing agent comprises 45 parts of quartz sand, 12 parts of sodium citrate, 16 parts of trichloroethylene and 8-13 parts of sodium alkylsulfonate.
Example 6
This embodiment is substantially the same as embodiment 3 except that:
the polishing process comprises the step of spraying a polishing agent on the surface of the alloy copper core after drawing at a high speed, wherein the pressure of a nozzle is 7pa, and the polishing agent comprises 55 parts of quartz sand, 15 parts of sodium citrate, 20 parts of trichloroethylene and 13 parts of sodium alkyl sulfonate.
Comparing the copper wires polished in the embodiments 3, 4, 5 and 6, respectively, and observing the surface of the copper wires, it can be seen that the surface of the copper wires is rough and remains stains in the embodiment 3 because the copper wires are directly polished by a polishing machine, while the copper wires polished in the embodiments 4, 5 and 6 have the surface gloss and roughness lower than those of the embodiment 3 and have no obvious stains on the surface.
The above additional technical features can be freely combined and used in superposition by those skilled in the art without conflict.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the patent and protection scope of the present invention should be subject to the appended claims.
Claims (7)
1. The preparation method of the alloy copper wire is characterized by comprising the following steps of:
1) putting 10-15 parts of nickel, 10-15 parts of aluminum and 10-15 parts of cerium into a melting furnace, melting until liquefaction and stirring to obtain mixed molten metal;
2) 65-85 parts of copper core is uniformly mixed with molten metal and then dried after the surface of the copper core is covered with the molten metal to obtain an alloy copper core;
3) sequentially carrying out drawing-polishing-acid washing processes on an alloy copper core to obtain a copper wire, placing the copper wire in an electroplating pool, and electroplating at the temperature of 55-75 ℃, wherein the electroplating solution comprises 10-15 parts of sodium acetate, 5-10 parts of sodium sulfite, 5-10 parts of a brightening agent, 55-65 parts of nickel sulfide, 10-15 parts of cobalt oxide, 5-15 parts of ammonium sulfate, 10-15 parts of silicon dioxide and 10-15 parts of dilute sulfuric acid, and is taken out after preset time;
4) and (3) placing the electroplated copper wire into an ultrasonic cleaning water tank for cleaning for 3-5min at normal temperature, and drying and taking up the copper wire after cleaning.
2. The method as claimed in claim 1, wherein in step 2, the obtained copper alloy core is placed in a heat treatment furnace under vacuum condition, the temperature is raised to 350 ℃ and the copper alloy core is continuously hot pressed for 3-5 times to perform structure densification treatment, and the hot pressed copper alloy is sequentially subjected to drawing-polishing-pickling processes to obtain the copper wire, which is the final product.
3. The method of claim 2, wherein the pH of the plating solution is 4 to 5, the cathode current density is 2.5 to 3.5A/dm2, and the plating time is 2 to 3 min.
4. The method of claim 2, wherein the brightening agent comprises polyethylene glycol and nicotinic acid in a mass ratio of 1: 1.
5. The method for preparing an alloy copper wire according to claim 4, wherein in the step 4, the polishing process comprises high-speed spraying of a polishing agent on the surface of the alloy copper core after drawing, and the pressure of the nozzle is 7 pa.
6. The method for preparing the alloy copper wire according to claim 5, wherein the polishing agent comprises 40-55 parts of quartz sand, 10-15 parts of sodium citrate, 15-20 parts of trichloroethylene and 8-13 parts of sodium alkylsulfonate.
7. The method for preparing the alloy copper wire according to claim 2, wherein the pressing pressure is 20-35 MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111250474.8A CN113881982A (en) | 2021-10-26 | 2021-10-26 | Preparation method of alloy copper wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111250474.8A CN113881982A (en) | 2021-10-26 | 2021-10-26 | Preparation method of alloy copper wire |
Publications (1)
| Publication Number | Publication Date |
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| CN113881982A true CN113881982A (en) | 2022-01-04 |
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Non-Patent Citations (3)
| Title |
|---|
| C.B.吉尔: "《有色金属提取冶金》", 冶金工业出版社 * |
| 陈朝华 等: "《立德粉、硫酸锌生产与应用技术问答》", 31 July 2000, 化学工业出版社 * |
| 黄惠 等: "《导电聚苯胺基复合阳极材料的制备》", 31 January 2016, 冶金工业出版社 * |
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