CN109930179A - A kind of production method and its product of extra thin copper foil - Google Patents
A kind of production method and its product of extra thin copper foil Download PDFInfo
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- CN109930179A CN109930179A CN201910257883.7A CN201910257883A CN109930179A CN 109930179 A CN109930179 A CN 109930179A CN 201910257883 A CN201910257883 A CN 201910257883A CN 109930179 A CN109930179 A CN 109930179A
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- copper foil
- steel disc
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- extra thin
- carrying
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 179
- 239000011889 copper foil Substances 0.000 title claims abstract description 140
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 74
- 239000010959 steel Substances 0.000 claims abstract description 74
- 239000010949 copper Substances 0.000 claims abstract description 38
- 229910052802 copper Inorganic materials 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 26
- 230000008569 process Effects 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 68
- 239000000243 solution Substances 0.000 claims description 25
- 238000007747 plating Methods 0.000 claims description 23
- 230000007704 transition Effects 0.000 claims description 16
- 238000003756 stirring Methods 0.000 claims description 15
- 238000009713 electroplating Methods 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000003973 paint Substances 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 239000000571 coke Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 claims description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 3
- 239000000908 ammonium hydroxide Substances 0.000 claims description 3
- 238000005868 electrolysis reaction Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims 1
- 230000006872 improvement Effects 0.000 description 10
- 238000007788 roughening Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Abstract
The invention discloses a kind of production methods of extra thin copper foil, comprising the following steps: (1) prepares the carrying steel disc of gauge thickness；(2) electro copper foil on carrying one surface of steel disc, forms copper foil layer；(3) it will be electroplate with carrying steel disc production slabbing or the package of copper foil on demand；(4) factory's following process；(5) removing carrying steel disc.The production method and its product of extra thin copper foil provided by the invention, copper foil can adhere to process processing after progress on carrying steel disc, machinability is not influenced by copper thickness, carrying steel disc can be removed again after subsequent handling processing, thus, copper foil can be made very thin and smooth, and conducive to extra thin copper foil is made, and the yield of subsequent production and efficiency are also greatly improved.
Description
Technical field
The present invention relates to copper foil preparation process more particularly to the production methods and its product of a kind of extra thin copper foil.
Background technique
Electrolytic copper foil is the important former material of PCB industry and novel battery product.With the upgrading of electronic technology, product tends to
High precision, light, thin etc. are integrated.Therefore also require thinner to the copper foil base material for forming circuit, roughness is smaller, convenient for fine
The processing of route；The control of copper foil former material roughness is also an important ring for high-frequency high-speed circuit.Especially 5G product needs to surpass
Thin, surface is smooth copper foil supports.
Traditional electrolytic copper foil manufacture is manufacturing enterprise's production in profession, and copper foil is directly removed after plating is formed, passed through
It crosses roughening treatment and packaging is wrapped again.The technique has several drawbacks in that: 1) thickness of copper foil can not be made very thin；2) specification of copper foil is thick
Degree is limited by processing producer, is difficult meet the needs of medium-sized and small enterprises Diversified Products；3) ultra-thin copper foil is after factory when process
Easily fold influences quality and yield；4) the copper foil roughness by roughening increases, and influences on the transmission of the signal of high-frequency high-speed aobvious
It writes and increases.
Summary of the invention
In view of the above deficiencies, the purpose of the present invention is to provide a kind of production method of extra thin copper foil and its product, copper foils
It can adhere on carrying steel disc process after carrying out to process, machinability is not influenced by copper thickness, and carrying steel disc can be subsequent
It is removed again after process processing, copper foil can be made very thin and smooth as a result, conducive to extra thin copper foil is made, and subsequent production
Yield and efficiency are also greatly improved.
The technical scheme adopted by the invention to achieve the purpose is as follows:
A kind of production method of extra thin copper foil, comprising the following steps:
(1) prepare the carrying steel disc of gauge thickness；
(2) electro copper foil on carrying one surface of steel disc, forms copper foil layer；
(3) it will be electroplate with carrying steel disc production slabbing or the package of copper foil on demand；
(4) factory's following process；
(5) removing carrying steel disc.
As a further improvement of the present invention, the step (2) is further comprising the steps of: on carrying another surface of steel disc
Electro copper foil forms two-sided copper foil layer.
As a further improvement of the present invention, the step (2) is further comprising the steps of: a bonding is coated on copper foil layer
Layer.
As a further improvement of the present invention, the step (2) is further comprising the steps of: a transition is formed on copper foil layer
Layer.
As a further improvement of the present invention, the transition zone is the copper face bonding organic film being formed on copper foil layer, copper
The forming step of face bonding organic film are as follows: the carrying steel disc for being electroplate with copper foil is placed in the copper face key that concentration is 8~12mL/L
In mixture solution, and 35 DEG C~45 DEG C at a temperature of, impregnate 10~110s, take out, blot and/or dry, in copper foil surface
One copper face of upper formation is bonded organic film.
As a further improvement of the present invention, the transition zone is the electrophoretic paint layer being formed on copper foil layer.
As a further improvement of the present invention, in the step (2), the copper foil layer with a thickness of 0.5~20um, institute
State carrying steel disc with a thickness of 5~300um.
As a further improvement of the present invention, the step (2) specifically includes the following steps:
(2.1) plating solution configures:
The pure water of (2.1.1) injection 2/3 is heated to 45~55 DEG C in preparation slot；
250~300g/L potassium pyrophosphate is added in (2.1.2), and stirring makes it completely dissolved；
300~50g/L cupric pyrophosphate is added in (2.1.3), and stirring is until be completely dissolved；
1~3mL/L hydrogen peroxide is added in (2.1.4), is first diluted before being added with water, and 1.5~2.5h is inflated in stirring；
2~4g/L of activated carbon is added in (2.1.5), stirs 1~4h, is then allowed to stand 8~12h, forms plating solution；
(2.1.6) uses filter pump, and plating solution is filtered in electroplating bath；
Dilute sulfuric acid is added in (2.1.7), and pH value is adjusted to 8.6；
(2.1.8) with wavy false cathode with the low current density continuous electrolysis 1 of 0.1~0.4 ampere/square decimeter~
4h；
Ammonium hydroxide, 2~3mL/L coke copper open cylinder agent and the 0.2~0.3mL/L coke copper brightener of 2~3mL/L is added in (2.1.9)
Afterwards, it stirs evenly, plating solution needed for being obtained in electroplating bath；
(2.2) carrying steel disc is put into the plating solution of electroplating bath, under conditions of 50~55 DEG C of temperature, 3~12V voltage
Plating, so that forming copper foil layer on carrying steel disc surface, which is burnt copper.
Implement the extra thin copper foil that the above method is prepared, including carrying steel disc and is plated on carrying one surface of steel disc
One copper foil layer.
As a further improvement of the present invention, the electro copper foil on another surface of the carrying steel disc, forms two-sided copper foil
Layer.
It as a further improvement of the present invention, further include coated on the adhesive layer in copper foil layer surface.
It as a further improvement of the present invention, further include the transition zone taken shape in copper foil layer surface, which is
Copper face is bonded organic film or electrophoretic paint layer.
The invention has the benefit that
(1) using carrying steel disc as carrying tablet, before carrying out factory's following process, carrying steel disc is not first removed, and
It is that copper foil and carrying steel disc are made into slabbing or package as a whole, carries out factory's following process, finally remove and hold again
Steel disc is carried, i.e. copper foil can be attached on carrying steel disc process processing after progress, by the booster action of carrying steel disc, so that whole
Thickness thickens, enhanced strength, and therefore, the machinability of subsequent handling is not influenced by copper thickness, and carrying steel disc can be according to need
It to be removed after pressing or after other processes, copper foil can be made very thin and smooth as a result, realize copper foil ultrathin；
(2) conventional equipment of PCB manufacturing enterprise is used, plating line manually or automatically can produce the copper of any thickness
Foil can meet the needs of medium-sized and small enterprises Diversified Products without being limited by processing producer；
(3) when processing subsequent to extra thin copper foil, due to carrying the effect of steel disc, extra thin copper foil is not wrinkled, technique
Convenient and simple, the yield and efficiency of subsequent production are also greatly improved, entire preparation process environmental protection, and production cost reduces；
(4) one layer of adhesive layer is coated in the non-peel-away face of copper foil and replace traditional roughening process, can be effectively improved copper foil
Finish reduces the influence of the signal transmission to high-frequency high-speed；Moreover, significantly improving the combination of copper foil layer and other structures
Power, meanwhile, when being subsequently applied on pcb board, roughening copper foil is no longer needed to, without binder is further added by, to the processing of pcb board
Production brings convenience.
(5) organic film or electrophoretic paint layer are bonded as the transition zone between copper foil layer and other structures by using copper face,
The binding force of copper foil layer and other structures is significantly improved, meanwhile, when being subsequently applied on pcb board, roughening copper foil is no longer needed to,
Convenience is brought to the processing of pcb board.Moreover, copper face bonding agent solution is corrosion-free to copper, it is coarse copper foil can be reduced
Degree, copper-clad surface cleanliness is high, avoids copper-clad surface adsorption of foreign matter that photoresist is caused to paste phenomena such as bad；
(6) since carrying steel disc has certain thickness, intensity, there is preferable carrying effect, therefore can carry
One layer of copper foil layer is all electroplated in steel disc upper and lower surfaces, forms two-sided copper foil layer, then same carries steel disc, after final removing
It can get two pieces of extra thin copper foils, thus significantly improve production efficiency and production capacity.
(7) carrying steel disc can reduce resources costs with recycling and reusing.
Above-mentioned is the general introduction of inventive technique scheme, below in conjunction with attached drawing and specific embodiment, is done further to the present invention
Explanation.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the embodiment of the present invention one；
Fig. 2 is the structural schematic diagram of the embodiment of the present invention two；
Fig. 3 is the structural schematic diagram of the embodiment of the present invention three；
Fig. 4 is a structural schematic diagram of the embodiment of the present invention four；
Fig. 5 is another structural schematic diagram of the embodiment of the present invention four；
Fig. 6 is the another structural schematic diagram of the embodiment of the present invention four.
Specific embodiment
Further to illustrate the present invention to reach the technical means and efficacy that predetermined purpose is taken, below in conjunction with attached drawing
And preferred embodiment, detailed description of specific embodiments of the present invention.
Embodiment one:
The present embodiment provides a kind of production methods of extra thin copper foil, comprising the following steps:
(1) prepare the carrying steel disc of gauge thickness；
(2) electro copper foil on carrying one surface of steel disc, forms copper foil layer；
(3) it will be electroplate with carrying steel disc production slabbing or the package of copper foil on demand；
(4) factory's following process, specific processing include drilling, cutting, pressing etc.；
(5) removing carrying steel disc, the carrying steel disc after removing are reusable.
In the step (2), the copper foil layer with a thickness of 0.5~20um, the carrying steel disc with a thickness of 5~
300um。
In the step (1), the carrying steel disc is specifically as follows stainless steel plate, and carrying steel disc can be conductive, there is one
Fixed bearing capacity is able to achieve the roll-to-roll production of batch.The present embodiment steel disc is most preferably, to deposit according to other metals
In certain drawbacks, such as aluminium flake, aluminium flake easily forms oxide layer on surface, and easily reacts with acid-base solution, readily soluble to take off.And
In the manufacturing process of extra thin copper foil, in order to adjust or improve the binding force between each layer structure, need carrying tablet or plating
There is the carrying tablet of copper foil to be soaked in corresponding acid-base solution, makees according to the metal that aluminium flake etc. easily reacts with acid-base solution
It for carrying tablet, then will necessarily be dissolved, be unfavorable for carrying tablet and the carrying of copper foil is acted on, still cannot achieve copper foil ultrathin
Purpose.
The present embodiment, as carrying tablet, before carrying out factory's following process, does not remove carrying steel first using carrying steel disc
Piece, but copper foil and carrying steel disc are made into slabbing or package as a whole, factory's following process is carried out, is finally shelled again
From carrying steel disc, i.e. copper foil can be attached on carrying steel disc process processing after progress, by the booster action of carrying steel disc, so that
Integral thickness thickens, enhanced strength, and therefore, the machinability of subsequent handling is not influenced by copper thickness, and carrying steel disc can root
According to needing to remove after pressing or after other processes, copper foil can be made very thin as a result, realize copper foil ultrathin.
Meanwhile manufacture craft and the subsequent processing to extra thin copper foil are more convenient simple, and it is more environmentally friendly, production cost is reduced,
The yield and efficiency of subsequent production are also greatly improved.
The extra thin copper foil prepared by the present embodiment production method, as shown in Figure 1, including a carrying steel disc 1 and being plated on
Carry the copper foil layer 2 on 1 surface of steel disc.Extra thin copper foil provided in this embodiment, when process is processed after progress, copper foil layer 2
It is attached on carrying steel disc 1, by the booster action of carrying steel disc 1, so that integral thickness thickens, enhanced strength, therefore, subsequent work
The machinability of sequence is not influenced by copper thickness, and carrying steel disc 1 can be removed after pressing or after other processes as needed, by
This, copper foil can be made very thin and smooth, realize copper foil ultrathin, and extra thin copper foil, can be widely applied to pcb board and lithium electricity
It manufactures in pond.
Embodiment two:
The present embodiment and the main distinction of embodiment one are: the step (2) is further comprising the steps of: on copper foil layer
Coat an adhesive layer 3.
The extra thin copper foil prepared by the present embodiment production method, as shown in Fig. 2, further including being coated on 2 surface of copper foil layer
On adhesive layer 3.
The present embodiment significantly improves the combination of copper foil layer 2 and other structures by coating adhesive layer 3 on copper foil layer 2
Power, meanwhile, when being subsequently applied on pcb board, roughening copper foil is no longer needed to, without binder is further added by, to the processing of pcb board
Production brings convenience.
Embodiment three:
The present embodiment and the main distinction of embodiment one are: the step (2) is further comprising the steps of: on copper foil layer
Form a transition zone.In the present embodiment, the transition zone is the copper face bonding organic film or electrophoretic paint being formed on copper foil layer
Layer.Specifically, copper face bonding organic film forming step are as follows: by the carrying steel disc for being electroplate with copper foil be placed in concentration be 8~
12mL/L copper face bonding agent solution in, and 35 DEG C~45 DEG C at a temperature of, impregnate 10~110s, take out, blot and/or dry
It is dry, copper face bonding organic film is formed on surfaces of the copper foil.
The extra thin copper foil prepared by the present embodiment production method, as shown in figure 3, further including taking shape in 2 surface of copper foil layer
On transition zone 4, which is that copper face is bonded organic film or electrophoretic paint layer.
Organic film or electrophoretic paint layer are bonded as the transition zone between copper foil layer and other structures, significantly by using copper face
The binding force of copper foil layer and other structures is improved, meanwhile, when being subsequently applied on pcb board, roughening copper foil is no longer needed to, is given
The processing of pcb board brings convenience.Moreover, copper face bonding agent solution is corrosion-free to copper, copper foil roughness can be reduced,
Copper-clad surface cleanliness is high, avoids copper-clad surface adsorption of foreign matter that photoresist is caused to paste phenomena such as bad.
Example IV:
The main distinction of any embodiment into embodiment three is the present embodiment with embodiment one: the step (2) is also
The following steps are included: the electro copper foil on carrying another surface of steel disc, forms two-sided copper foil layer.
Specifically, as shown in figure 4, carrying steel disc lower surface when the electro copper foil on carrying another surface of steel disc
Increase one layer of lower copper foil layer 2'.And when coating adhesive layer 3 on copper foil layer, then correspondingly, in the lower surface lower copper foil layer 2'
One layer of lower adhesive layer 3' is increased, as shown in Figure 5.And when the shaped transition layer 4 on copper foil layer, then correspondingly, in lower copper foil
The lower surface layer 2' increases one layer of lower transition zone 4', as shown in Figure 6.
The present embodiment is by forming two-sided copper foil layer, due to holding in carrying steel disc upper and lower surfaces all electro copper foils
Carrying steel disc has certain thickness, intensity, has preferable carrying effect, and therefore, same carries steel disc, can after final removing
Two pieces of extra thin copper foils are obtained, production efficiency and production capacity are thus significantly improved.
Embodiment five:
The present embodiment and the main distinction of embodiment one are:
The step (2) specifically includes the following steps:
(2.1) plating solution configures:
The pure water of (2.1.1) injection 2/3 is heated to 45~55 DEG C in preparation slot；
250~300g/L potassium pyrophosphate is added in (2.1.2), and stirring makes it completely dissolved；
300~50g/L cupric pyrophosphate is added in (2.1.3), and stirring is until be completely dissolved；
1~3mL/L hydrogen peroxide is added in (2.1.4), is first diluted before being added with water, and 1.5~2.5h is inflated in stirring；
2~4g/L of activated carbon is added in (2.1.5), stirs 1~4h, is then allowed to stand 8~12h, forms plating solution；
(2.1.6) uses filter pump, and plating solution is filtered in electroplating bath；
Dilute sulfuric acid is added in (2.1.7), and pH value is adjusted to 8.6；
(2.1.8) with wavy false cathode with the low current density continuous electrolysis 1 of 0.1~0.4 ampere/square decimeter~
4h；
Ammonium hydroxide, 2~3mL/L coke copper open cylinder agent and the 0.2~0.3mL/L coke copper brightener of 2~3mL/L is added in (2.1.9)
Afterwards, it stirs evenly, plating solution needed for being obtained in electroplating bath；
(2.2) carrying steel disc is put into the plating solution of electroplating bath, under conditions of 50~55 DEG C of temperature, 3~12V voltage
Plating, so that forming copper foil layer on carrying steel disc surface, which is burnt copper.
The present embodiment uses cupric pyrophosphate electroplating technology electro copper foil, has the advantage that
(1) plating solution is in alkalescent, and has splendid covering power, especially suitable for complex-shaped die casting
(2) plating solution is free of harmful cyanide；
(3) coating is bright smooth, and current density range is broad；
(4) there is good dispersibility；
(5) the coating ductility formed is good, good toughness, spreadability is wide, leveling ability is high, and plated layer compact is non-porous, will not
There is the pin-hole phenomena that sour copper occurs.
The above described is only a preferred embodiment of the present invention, be not intended to limit the scope of the present invention,
Therefore technical characteristic same as or similar to the above embodiments of the present invention is used, and obtained other structures, in guarantor of the invention
Within the scope of shield.
Claims (12)
1. a kind of production method of extra thin copper foil, which comprises the following steps:
(1) prepare the carrying steel disc of gauge thickness；
(2) electro copper foil on carrying one surface of steel disc, forms copper foil layer；
(3) it will be electroplate with carrying steel disc production slabbing or the package of copper foil on demand；
(4) factory's following process；
(5) removing carrying steel disc.
2. the production method of extra thin copper foil according to claim 1, which is characterized in that the step (2) further includes following
Step: the electro copper foil on carrying another surface of steel disc forms two-sided copper foil layer.
3. the production method of extra thin copper foil according to claim 1 or 2, which is characterized in that the step (2) further include with
Lower step: an adhesive layer is coated on copper foil layer.
4. the production method of extra thin copper foil according to claim 1 or 2, which is characterized in that the step (2) further include with
Lower step: a transition zone is formed on copper foil layer.
5. the production method of extra thin copper foil according to claim 4, which is characterized in that the transition zone is to be formed in copper foil
Copper face on layer is bonded organic film, and copper face is bonded the forming step of organic film are as follows: is placed in the carrying steel disc for being electroplate with copper foil
Concentration be 8~12mL/L copper face be bonded agent solution in, and 35 DEG C~45 DEG C at a temperature of, impregnate 10~110s, take out, inhale
Dry and/or drying forms copper face bonding organic film on surfaces of the copper foil.
6. the production method of extra thin copper foil according to claim 4, which is characterized in that the transition zone is to be formed in copper foil
Electrophoretic paint layer on layer.
7. the production method of extra thin copper foil according to claim 1, which is characterized in that in the step (2), the copper
Layers of foil with a thickness of 0.5~20um, the carrying steel disc with a thickness of 5~300um.
8. the production method of extra thin copper foil according to claim 1, which is characterized in that the step (2) specifically include with
Lower step:
(2.1) plating solution configures:
The pure water of (2.1.1) injection 2/3 is heated to 45~55 DEG C in preparation slot；
250~300g/L potassium pyrophosphate is added in (2.1.2), and stirring makes it completely dissolved；
300~50g/L cupric pyrophosphate is added in (2.1.3), and stirring is until be completely dissolved；
1~3mL/L hydrogen peroxide is added in (2.1.4), is first diluted before being added with water, and 1.5~2.5h is inflated in stirring；
2~4g/L of activated carbon is added in (2.1.5), stirs 1~4h, is then allowed to stand 8~12h, forms plating solution；
(2.1.6) uses filter pump, and plating solution is filtered in electroplating bath；
Dilute sulfuric acid is added in (2.1.7), and pH value is adjusted to 8.6；
(2.1.8) is with wavy false cathode with 1~4h of low current density continuous electrolysis of 0.1~0.4 ampere/square decimeter；
After the ammonium hydroxide, 2~3mL/L coke copper open cylinder agent and 0.2~0.3mL/L coke copper brightener of 2~3mL/L is added in (2.1.9), stir
It mixes uniformly, plating solution needed for being obtained in electroplating bath；
(2.2) carrying steel disc is put into the plating solution of electroplating bath, it is electric under conditions of 50~55 DEG C of temperature, 3~12V voltage
Plating, so that forming copper foil layer on carrying steel disc surface, which is burnt copper.
9. implementing the extra thin copper foil that claim 1 the method is prepared, which is characterized in that including carrying steel disc and be plated on
Carry the copper foil layer on one surface of steel disc.
10. extra thin copper foil according to claim 9, which is characterized in that the electro-coppering on another surface of the carrying steel disc
Foil forms two-sided copper foil layer.
11. extra thin copper foil according to claim 9 or 10, which is characterized in that further include being coated in copper foil layer surface
One adhesive layer.
12. extra thin copper foil according to claim 9 or 10, which is characterized in that further include taking shape in copper foil layer surface
One transition zone, the transition zone are that copper face is bonded organic film or electrophoretic paint layer.
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| CN201910257883.7A CN109930179A (en) | 2019-04-01 | 2019-04-01 | A kind of production method and its product of extra thin copper foil |
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| CN201910257883.7A CN109930179A (en) | 2019-04-01 | 2019-04-01 | A kind of production method and its product of extra thin copper foil |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116180166A (en) * | 2023-03-01 | 2023-05-30 | 安徽华创新材料股份有限公司 | Production method of 3.5-4 mu m double-sided light copper foil |
| CN116180166B (en) * | 2023-03-01 | 2024-05-03 | 安徽华创新材料股份有限公司 | Production method of 3.5-4 mu m double-sided light copper foil |
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| CN106757181A (en) * | 2016-11-16 | 2017-05-31 | 山东金宝电子股份有限公司 | A kind of preparation method of ultra-thin carrier copper foil |
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| US20050048306A1 (en) * | 2003-09-01 | 2005-03-03 | Yuuji Suzuki | Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116180166A (en) * | 2023-03-01 | 2023-05-30 | 安徽华创新材料股份有限公司 | Production method of 3.5-4 mu m double-sided light copper foil |
| CN116180166B (en) * | 2023-03-01 | 2024-05-03 | 安徽华创新材料股份有限公司 | Production method of 3.5-4 mu m double-sided light copper foil |
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Application publication date: 20190625 |