CN113878866B - Three-dimensional film forming method based on electric field regulation and control - Google Patents
Three-dimensional film forming method based on electric field regulation and control Download PDFInfo
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- CN113878866B CN113878866B CN202111052065.7A CN202111052065A CN113878866B CN 113878866 B CN113878866 B CN 113878866B CN 202111052065 A CN202111052065 A CN 202111052065A CN 113878866 B CN113878866 B CN 113878866B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/255—Enclosures for the building material, e.g. powder containers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/005—Projectors using an electronic spatial light modulator but not peculiar thereto
- G03B21/008—Projectors using an electronic spatial light modulator but not peculiar thereto using micromirror devices
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Abstract
The application provides a three-dimensional film forming method based on electric field regulation and control.A light source generates light rays to irradiate a digital micromirror array, the light reflected from the digital micromirror array has a specific pattern, and the light rays vertically irradiate a light guide material layer after passing through a series of lenses, so that a virtual electrode shape with the specific pattern is formed, and further the three-dimensional shape of the film is controlled. The method can be used for preparing the three-dimensional shape which is difficult to prepare by the traditional photoetching, the cost is far lower than that of processing methods such as photoetching, physical etching and the like, and the processing efficiency is also improved. The material is not limited to the photocurable material, but a material capable of being thermally cured can be prepared.
Description
Technical Field
The application relates to the technical field of film forming, in particular to a three-dimensional film forming method based on electric field regulation.
Background
Thin film materials are playing an increasingly important role in various fields, where the geometry of the thin film is one of the main parameters controlling the properties of the thin film material. The existing geometric shape control modes of the film material comprise photoetching, photocuring 3D printing and the like. The photolithography method is most commonly used for preparing a two-dimensional geometric structure, and a technology for preparing a three-dimensional shape by a gray level photolithography method is also available, but the requirements on equipment and processes are extremely strict, and the yield is low. The three-dimensional configuration of the film can be conveniently prepared by 3D printing, but the general precision is lower, the precision of the photocuring 3D printing on the market is about 20 micrometers at present, higher precision needs specific equipment and mostly stays in a laboratory stage, and the processed film material has to have better photocuring property. The invention provides a method and a process for preparing a three-dimensional film material configuration by controlling the oil-water interface shape by using an electric field, and the prepared film has high geometric precision of the shape, low equipment cost and low requirement on the photocuring performance of the material.
The existing preparation method of the three-dimensional shape of the film material comprises the following steps:
1) Gray scale lithography: photolithography is most commonly used to produce two-dimensional film features, but if the mask in the photolithography process is a gray pattern, i.e., the light transmitted through the mask has uneven intensity distribution due to the different transmittances of the mask, the degree of curing of the photoresist is different. The photoresist with high curing degree is not easy to dissolve in the developing process, and the photoresist with low curing degree is easy to dissolve, so that the heights of the photoresists at different positions are different under the same developing time, and corresponding three-dimensional shapes are formed.
2) 3D printing technology: the 3D printing technology is used for layering the geometric model, building two-dimensional graphs layer by layer and accumulating the two-dimensional graphs into a three-dimensional shape.
3) Physical etching technology: the physical etching is essentially to evaporate the water phase on the surface of the material by high-energy-density energy flow such as laser, ion number, electron beams and the like, and realize the etching depths of different positions on the surface of the material by controlling the beam intensity and the etching time, thereby forming the three-dimensional appearance.
The prior art has the following disadvantages:
1) Gray scale lithography: compared with the common photoetching process, the requirements on equipment performance and the photoetching process are stricter, the baking parameters, the exposure parameters and the developing parameters need to be strictly controlled according to the material characteristics, and the overall process cost is very high.
2) 3D printing technology: the highest precision of the photocuring 3D printing technology on the market is about 20 microns, the precision of hundreds of nanometers can be achieved through the laser direct writing 3D printing technology in a laboratory, but the equipment cost is high, and the processing efficiency is low.
3) Physical etching technology: the physical etching technology also needs special equipment for support, the etching efficiency is extremely low, the general etched morphological characteristics are in a nanometer level, and the cost is higher than that of photoetching.
Disclosure of Invention
The present application is directed to solving, at least in part, one of the technical problems in the related art.
Aiming at the current situations of high cost and low efficiency of common processing modes of three-dimensional shapes of thin film materials, the invention provides a preparation process of the thin film materials, which realizes the three-dimensional shapes by controlling the deformation of an oil-water interface through electric field force, namely a three-dimensional thin film forming method based on electric field regulation and control, wherein a liquid pool, a digital micromirror array, a lens and a light source are adopted, and the bottom of the liquid pool is provided with a dielectric layer, a photoconductive material layer and a transparent conducting layer which are tightly attached from top to bottom in sequence; the molding method comprises the following steps:
step A, firstly putting nonpolar liquid into a liquid pool, and then putting polar liquid into the liquid pool, wherein one pole of a power supply is electrically connected with the transparent conducting layer, the other pole of the power supply is electrically connected into the polar liquid, and the power supply is in a power-off state;
b, irradiating light rays generated by a light source onto the digital micromirror array, wherein the light rays reflected from the digital micromirror array have specific patterns, and vertically irradiating the light guide material layer after passing through the lens and penetrating through the transparent conducting layer to form a virtual electrode shape with the same patterns as the digital micromirror array;
step C, the power supply is in a power-on state, the interface of the polar liquid and the non-polar liquid deforms under the action of an electric field force, the polar liquid or the non-polar liquid deforms at the interface along with the increase of power-on time, and the liquid film forms a three-dimensional form which is the same as the horizontal distribution of the digital micromirror array pattern but has section change in thickness;
and D, after the interface form is stable, solidifying the liquid film, and cleaning after the solidification is completed to obtain the three-dimensional solid film which has the same horizontal distribution with the digital micromirror array pattern but has a section change in thickness.
In some embodiments, in the step C, the voltage of the power supply is changed, and the deformation degree of the interface is changed accordingly, and the larger the voltage is, the larger the deformation degree is, and the liquid films with different deformation degrees are formed.
In some embodiments, in step D, the curing manner is photo-curing or thermal curing.
In some embodiments, the light curing is performed by ultraviolet light.
In some embodiments, the heat curing is performed by attaching a heating sheet to the outer wall of the liquid pool or by heat radiation.
In some embodiments, the lens is a convex lens or a fresnel lens that acts as a convex lens.
In some embodiments, the lens is provided in plurality to form a lens group capable of directing light reflected by the digital micromirror array perpendicularly to the light guide material layer.
In some embodiments, the photoconductive material layer is hydrogenated amorphous silicon.
In some embodiments, the transparent conductive layer is an ITO conductive layer.
In some embodiments, the digital micromirror array is in the form of a DMD chip and employs a high resolution DMD chip.
The method provided by the embodiment of the application can be used for preparing the three-dimensional shape which is difficult to prepare by traditional photoetching, the cost is far lower than that of processing methods such as photoetching and physical etching, and the processing efficiency is also improved. The material is not limited to the photocurable material, but a material capable of being thermally cured may be prepared.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments taken in conjunction with the accompanying drawings,
FIG. 1-2 is a schematic diagram of the deformation of an oil-water interface controlled by an electric field;
FIGS. 3-4 are schematic views of a three-dimensional film forming method in an embodiment of the present application;
wherein:
FIG. 1 is a diagram showing the state of an oil-water interface at the moment of applying an electric field;
FIG. 2 is a state diagram of the oil-water interface after interface stabilization.
FIG. 3 is a schematic diagram of three-dimensional film formation in an embodiment of the present application;
FIG. 4 is a schematic diagram of the thin film of FIG. 3 at different voltages;
reference numerals:
1-a polar liquid; 2-a non-polar liquid; 3-a dielectric layer; 4-an electrode substrate; 5-a power supply; 6-a layer of light-guiding material; 7-a transparent conductive layer; 8-a lens; 9-a light source; 10-digital micromirror array; 11-ultraviolet light; 12-liquid pool.
Detailed Description
The principle is as follows: as shown in fig. 1-2, the oil-water interface is deformed by the action of the electric field force when in the electric field, and the received electric field force is perpendicular to the oil-water interface. The polar liquid 1, the non-polar liquid 2, the dielectric layer 3 and the electrode substrate 4 are arranged as shown in fig. 1, and the polar liquid 1 and the electrode substrate 4 are respectively connected with two poles of a power supply 5. At the moment of electrifying, the electric field distribution in the nonpolar liquid 2 is as the curve in fig. 1, the electric field distribution is in a non-uniform state, the electric field intensity at the position close to the electrode substrate 4 is larger, and therefore the oil-water interface at the position receives larger electric field force vertical to the oil-water interface. Electric field force direction and dielectric constant epsilon of liquid on two sides of interface 1 And epsilon 2 The direction of the electric field force is directed toward the side where the dielectric constant is small, regardless of the direction of the electric field lines. Dielectric constant ε of polar liquid 1 in FIG. 1 1 Larger than the dielectric constant epsilon of the nonpolar liquid 2 2 The electric field force is directed towards the non-polar liquid 2. The electric field is unevenly distributed, the magnitude of the electric field force received by the oil-water interface is different, and the electric field force received by the liquid interface close to the electrode substrate 4 is the largest, so that the interface at the position moves towards the direction of one side of the non-polar liquid 2 at a higher speed than the interfaces at other positions, the electric field force received by the interfaces at other positions is smaller, and the interface can move downwards if the space is not limited. But because the compressibility of the liquid is poor, the interface position with small electric field force can be extruded by the liquid to move in the opposite direction by following the mass conservation principle. Interfacial tension F in the process σ Electric field force F σ And the pressure P in the non-polar liquid film, and each position F on the interface of the equilibrium state E ＝P+F σ . The morphology of the liquid interface after equilibration and the corresponding electric field distribution are shown in figure 2. The deformation degree of the interface is positively correlated with the electric field intensity, so that the dielectric layer is increased along with the increase of the voltageReduction of thickness, dielectric constant epsilon 3 The degree of deformation of the interface increases.
According to the principle, the shape of the electrode can be changed in the film shape preparation process, and the thickness of the film at different positions can be directly controlled by the voltage to form the geometric shape of the three-dimensional shape. On the basis, the electrode substrate 4 is replaced by a photoinduced conductive material, namely the photoconductive material layer 6, the local conductivity of the photoinduced conductive layer is changed in a pattern projection mode, and a virtual electrode with a special two-dimensional shape is formed, so that the deformation of an oil-water interface is controlled, and a three-dimensional shape is formed.
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.
A three-dimensional thin film forming method based on electric field regulation according to an embodiment of the present application is described below with reference to fig. 3 to 4, and includes the following steps, using a liquid pool 12, a digital micromirror array 10, a lens 8 and a light source 9:
step A, firstly putting the nonpolar liquid 2 into the liquid pool 12, controlling the liquid amount of the nonpolar liquid to form a liquid film, wherein the thickness is generally 10 um-2 mm, and then putting the polar liquid 1, and the thickness of the polar liquid layer is not limited. As shown in fig. 3, the bottom of the liquid pool 12 is formed by a dielectric layer 3, a light guide material layer 6 and a transparent conductive layer 7 which are tightly attached from top to bottom in sequence, and the manner of tight attachment is a conventional means in the art, such as a physical deposition or chemical deposition method, and is not described herein again. The wall of the liquid pool 12 is made of insulating materials, such as glass, plastics and the like. The positive electrode of the power supply 5 is electrically connected to the transparent conductive layer 7, the negative electrode of the power supply 5 is electrically connected to the polar liquid 1, and the power supply 5 is in a power-off state. As the polarity of the power supply does not influence the deformation of the interface, only one stage of the power supply is connected with the electrode, and the other stage of the power supply is connected with the polar liquid.
It is noted that the non-polar liquid 2 is introduced first, because the non-polar liquid 2 needs to be closer to the electrodes, whereas the photoconductive material layer 6 corresponds to the virtual electrodes.
And step B, irradiating the light generated by the light source 9 onto the digital micromirror array 10, wherein the light reflected from the digital micromirror array 10 has a specific pattern, passes through the lens 8 and penetrates through the transparent conducting layer 7, and then is vertically irradiated onto the light guide material layer 6, so that a virtual electrode shape with the same pattern as the digital micromirror array 10 is formed.
And step C, the power supply 9 is in a power-on state, the interface of the polar liquid 1 and the non-polar liquid 2 deforms under the action of an electric field force, the polar liquid 1 or the non-polar liquid 2 deforms at the interface along with the increase of power-on time, and the liquid film forms a three-dimensional shape which is the same as the horizontal distribution of the digital micromirror array 10 pattern but has a section changing in the thickness direction.
It is emphasized that film formation is a matter of which liquid can be cured, if the polar liquid 1 can be cured, the polar liquid 1 is a film, and if the non-polar liquid 2 can be cured, the non-polar liquid 2 is a film. The thickness of the liquid to be cured affects the curing time, i.e. the larger the thickness, the longer the curing time. The thickness is microscopic, and the thickness of the liquid added at the beginning is in micron order, and the thickness after curing and film forming is only slightly changed.
In selecting the polar liquid 1 and the non-polar liquid 2, it is necessary to consider that only one of the two liquids can be cured in a certain manner (photo-curing or thermal curing) to finally prepare the finished three-dimensional film. When selecting the material of the film to be prepared, whether the material can be solidified or not is considered, and then the other phase of liquid is matched, so long as the two liquids are incompatible and have different dielectric constants.
In the case where two immiscible liquids are selected and cured in different ways, for example one can be cured thermally and the other photo-cured, then only one of the final curing modes is selected and only one of the liquids is cured to form a film, as is also the case.
And D, after the interface form is stable, solidifying the liquid film, and cleaning after complete solidification to obtain a three-dimensional solid film which has the same horizontal distribution with the digital micromirror array 10 pattern but has a variable section in the thickness direction. And finishing the preparation of the three-dimensional film.
In some embodiments, in the step C, the voltage of the power supply 5 is changed, and the deformation degree of the interface is changed, and the larger the voltage is, the larger the deformation degree is, and the liquid films with different deformation degrees are formed.
In some embodiments, in the step D, the curing is performed by photo-curing or thermal-curing.
In some embodiments, the light curing is performed by using ultraviolet light 11.
In some embodiments, the heat curing is performed by applying heat patches or high power density light-generated thermal radiation to the outer wall of the liquid bath 12. The heating sheet may be a resistance wire heating sheet. It should be noted that the liquid material is generally selected to be heated to several tens of degrees to complete the thermal curing, and the liquid bath 12 is not deformed or damaged by the high temperature. The thermal conductivity of the material selected for the liquid pool 12 is not problematic, and the thermal conductivity of common vessel materials such as beakers and culture vessels can meet the requirement.
In some embodiments, the lens 8 is a convex lens or a fresnel lens that acts as a convex lens. May be a series of optical lenses.
In some embodiments, the lens 8 is provided in plurality to form a lens group capable of directing the light reflected by the digital micromirror array 10 to the light guide material layer 6.
In some embodiments, the photoconductive material layer 6 is made of hydrogenated amorphous silicon by magnetron sputtering or chemical deposition.
In some embodiments, the transparent conductive layer 7 is an ITO conductive layer.
In some embodiments, the thickness of the dielectric layer 3 is 1-100 um, and the thickness is properly adjusted according to the voltage, so that the dielectric layer is required to have good insulating property and not to be easily broken down. The dielectric layer 3 may be a polymer dielectric layer prepared by spin-coating a liquid material and curing, or a dielectric layer of an inorganic material such as an oxide prepared by physical chemical deposition.
In some embodiments, the digital micromirror array 10 is in the form of a DMD chip. The digital micromirror array 10 can control the output of the pattern by a computer and a display system, and theoretically, the shape of the two-dimensional pattern is not limited, and the precision thereof is determined by the resolution of the DMD chip and the pixel size.
With the improvement of the illumination intensity and the sensitivity of the photoconductive material, the conductivity of the photoconductive material is increased, and the difference between the conductivities of the illuminated position and the non-illuminated position is increased, so that the deformation degree of the oil-water interface is increased.
As shown in fig. 4, for the same illumination condition, changing the voltage also changes the deformation degree of the oil-water interface, so as to regulate and control the three-dimensional shape of the film, the voltages from U1 to U4 are gradually increased, the deformation degree of the oil-water interface is increased, and different oil film three-dimensional shapes are formed.
The dimension and accuracy in the thickness direction of the film are controlled by voltage and light intensity, and the accuracy in the horizontal direction is controlled by the accuracy of the dummy electrodes, and the accuracy of the dummy electrodes can be improved by using a high-resolution DMD chip, such as 1080P,2K,4K, the higher the resolution of the DMD chip, the higher the accuracy of the dummy electrodes. Or the pattern projected by the DMD is reduced by an optical lens and then projected onto the photoconductive material layer 6, which can further improve the electrode accuracy but reduce the film production efficiency.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being permanently connected, detachably connected, or integral; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the second feature or the first and second features may be indirectly contacting each other through intervening media. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the present disclosure, the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" and the like mean that a specific feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without being mutually inconsistent.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (8)
1. A three-dimensional film forming method based on electric field regulation and control is characterized in that a liquid pool, a digital micromirror array, a lens and a light source are adopted, and a dielectric layer, a photoconductive material layer and a transparent conducting layer which are tightly attached from top to bottom are arranged at the bottom of the liquid pool; the lenses are provided with a plurality of lenses, and a lens group capable of enabling light reflected by the digital micromirror array to vertically irradiate the light guide material layer is formed; the molding method comprises the following steps:
step A, firstly putting nonpolar liquid and then putting polar liquid into a liquid pool, wherein one pole of a power supply is electrically connected with the transparent conducting layer, the other pole of the power supply is electrically connected into the polar liquid, and the power supply is in a power-off state;
b, irradiating light rays generated by the light source onto the digital micromirror array, wherein the light reflected from the digital micromirror array has a specific pattern, and vertically irradiating the light guide material layer after passing through the lens group and penetrating through the transparent conducting layer to form a virtual electrode shape with the same pattern as the digital micromirror array;
step C, the power supply is in a power-on state, the interface of the polar liquid and the non-polar liquid deforms under the action of an electric field force, the polar liquid or the non-polar liquid deforms at the interface along with the increase of power-on time, and the liquid film forms a three-dimensional form which is the same as the horizontal distribution of the digital micromirror array pattern but has a variable cross section in the thickness direction; the voltage of the power supply changes, the deformation degree of the interface changes, and liquid films with different deformation degrees are formed;
and D, after the interface form is stable, solidifying the liquid film, and cleaning after the solidification is completed to obtain the three-dimensional solid film which has the same horizontal distribution with the digital micromirror array pattern but has the changed section in the thickness direction.
2. The method for forming the three-dimensional film based on the electric field regulation as claimed in claim 1, wherein in the step D, the curing manner is photo-curing or thermal curing.
3. The electric field regulation-based three-dimensional film forming method according to claim 2, wherein the light curing mode is ultraviolet light curing.
4. The method for forming the three-dimensional film based on the electric field regulation and control of claim 2, wherein the heat curing is performed by attaching a heating sheet to the outer wall of the liquid pool or by heat radiation.
5. The three-dimensional film forming method based on electric field regulation and control as claimed in claim 1, wherein the lens is a convex lens or a Fresnel lens with a convex lens effect.
6. The electric field regulation-based three-dimensional thin film forming method according to claim 1, wherein the photoconductive material layer is made of hydrogenated amorphous silicon.
7. The method for forming the three-dimensional film based on the electric field regulation and control of claim 1, wherein the transparent conductive layer is an ITO conductive layer.
8. The method for forming the three-dimensional film based on the electric field regulation and control of any one of claims 1-7, wherein the digital micromirror array is in the form of a DMD chip and adopts a high-resolution DMD chip.
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| CN106104358A (en) * | 2014-01-28 | 2016-11-09 | 阿达普蒂卡有限责任公司 | Deformable lens structure for adaptive optics |
| CN112519371A (en) * | 2020-11-19 | 2021-03-19 | 太仓龙益塑业有限公司 | Novel high-thermoplasticity PP (polypropylene) super-thick plate and processing method thereof |
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