CN113873759A - PCB back drilling processing method and PCB - Google Patents
PCB back drilling processing method and PCB Download PDFInfo
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- CN113873759A CN113873759A CN202111008658.3A CN202111008658A CN113873759A CN 113873759 A CN113873759 A CN 113873759A CN 202111008658 A CN202111008658 A CN 202111008658A CN 113873759 A CN113873759 A CN 113873759A
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- 238000005553 drilling Methods 0.000 title claims abstract description 187
- 238000003672 processing method Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 52
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- 230000008569 process Effects 0.000 claims abstract description 26
- 238000009713 electroplating Methods 0.000 claims abstract description 11
- 230000008021 deposition Effects 0.000 claims abstract description 7
- 238000005530 etching Methods 0.000 claims description 26
- 238000003475 lamination Methods 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000013461 design Methods 0.000 claims description 6
- 230000008602 contraction Effects 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 abstract description 7
- 238000005299 abrasion Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 28
- 230000000694 effects Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000007547 defect Effects 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000004506 ultrasonic cleaning Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000000605 extraction Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
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- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The application relates to a PCB back drilling processing method. The method comprises the following steps: forming a through hole at a preset position of the PCB; carrying out copper deposition on the through hole by using a pulse electroplating process to obtain uniform hole copper; and step-by-step back drilling is carried out on the through hole by using a back drilling tool with a slotted structure, and the step-by-step back drilling is to obtain a back drilling hole by N times of drilling. The uniform hole copper can ensure that the back drilling tool is uniformly stressed in the drilling process, the drilling deviation caused by the deviation can not occur, and reasonable hole copper thickness can be obtained through pulse electroplating so as to ensure that the back drilling tool is reduced in abrasion and the blocking degree is reduced in the drilling process; meanwhile, the back drilling tool with the belt groove structure is adopted for back drilling step by step, after each step of drilling is finished, copper scraps in the back drilling hole can be effectively taken out of the hole, and the occurrence of hole blocking is avoided.
Description
Technical Field
The application relates to the technical field of PCB preparation, in particular to a PCB back drilling processing method and a PCB.
Background
Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component as a support for electronic components. The via stub (stub) has serious influence to signal transmission in the PCB, mainly reduces the influence of via stub through the back drilling mode at present.
Along with the continuous evolution of the CPU, the processing difficulty of the PCB for installing the CPU is increased, which mainly reflects that the pins of the position for installing the CPU on the PCB are denser, the transmission line is shortened and the PCB is designed by a hole clamp double-line, the loss requirement of the transmission line is higher, and the position is required to be designed by a back hole for reducing the loss.
When the existing back drilling method is adopted to carry out back drilling on the position, the defects of hole blocking, back drilling offset, hole wall dislocation and the like can occur, and the production requirement cannot be met.
Disclosure of Invention
In order to overcome the problems in the related art, the PCB back drilling processing method can avoid the defects of back drilling and meet the production requirements.
The application provides a PCB back drilling processing method in a first aspect, which comprises the following steps:
forming a through hole at a preset position of the PCB;
carrying out copper deposition on the through hole by using a pulse electroplating process to obtain uniform hole copper;
and carrying out step-by-step back drilling on the through hole by using a back drilling tool with a slotted structure, wherein the step-by-step back drilling is to obtain a back drilling hole by drilling for N times, the N is determined according to the depth of the back drilling hole, and the N is an integer greater than or equal to 1.
In one embodiment, the step back drilling the through hole by using a back drill with a tape and groove structure comprises:
acquiring the thickness of the preset position;
classifying the through holes in the preset positions according to the thickness;
according to the classification result, matching the through holes with corresponding back drilling cutters with belt groove structures;
and carrying out step-by-step back drilling on the through hole by using the back drilling tool.
In one embodiment, each of the N boreholes is of equal depth.
In an embodiment, before the forming the through hole at the preset position of the PCB, the method further includes:
the circuit design of inner plate specifically includes: carrying out dynamic compensation design on a sparse area and a dense area of a circuit of the inner plate;
and carrying out line etching on the inner-layer plate by adopting a vacuum etching process.
In one embodiment, after the performing the line design of the inner layer and before the performing the line etching on the inner layer by using the vacuum etching process, the method further includes:
and transferring the circuit image to the inner layer plate by a Laser Direct Imaging (LDI) technology.
In one embodiment, after the wire etching the inner layer board by using the vacuum etching process, the method further includes:
and (3) pressing, specifically comprising: performing lamination and lamination by adopting a PIN-LAM positioning system;
measuring the expansion and contraction value among layers;
and adjusting the control parameters of the pressing according to the measurement result so that the expansion and contraction values between the layers are equal.
In one embodiment, after the step back drilling of the through hole by using the back drilling tool with the tape and groove structure, the method further comprises the following steps:
and cleaning the copper scraps in the back drilling hole by using ultrasonic waves.
A second aspect of the present application provides a PCB manufactured by any one of the PCB back-drilling methods provided in the first aspect.
The technical scheme provided by the application can comprise the following beneficial effects:
according to the scheme, through holes are formed in preset positions of the PCB; carrying out copper deposition on the through hole by using a pulse electroplating process to obtain uniform hole copper; and step-by-step back drilling is carried out on the through hole by using a back drilling tool with a slotted structure, and the step-by-step back drilling is to obtain a back drilling hole by N times of drilling. The uniform hole copper can ensure that the back drilling tool is uniformly stressed in the drilling process, the drilling deviation caused by the deviation can not occur, and reasonable hole copper thickness can be obtained through pulse electroplating so as to ensure that the back drilling tool is reduced in abrasion and the blocking degree is reduced in the drilling process; meanwhile, the back drilling tool with the belt groove structure is adopted for back drilling step by step, after each step of drilling is finished, copper scraps in the back drilling hole can be effectively taken out of the hole, and the occurrence of hole blocking is avoided.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The above and other objects, features and advantages of the present application will become more apparent by describing in more detail exemplary embodiments thereof with reference to the attached drawings.
Fig. 1 is a schematic flow chart of a PCB back drilling processing method according to an embodiment of the present application;
fig. 2 is another schematic flow chart of a PCB back drilling processing method according to an embodiment of the present application.
Detailed Description
Preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
When the existing back drilling method is adopted to back drill the position on the PCB for installing the CPU, the defects of hole blocking, back drilling offset, hole wall dislocation and the like can occur, and the production requirement can not be met.
In view of the above problems, the embodiment of the application provides a method for processing a PCB back drill, which can avoid the occurrence of defects of the back drill and can meet the production requirements.
The technical solutions of the embodiments of the present application are described in detail below with reference to the accompanying drawings.
Example one
Fig. 1 is a schematic flow chart of a PCB back drilling processing method according to an embodiment of the present application.
Referring to fig. 1, the PCB back drilling processing method specifically includes:
101. forming a through hole at a preset position of the PCB;
the back drilling is to drill a non-conducting through hole with a certain depth on some plated through holes by using a drill with a larger diameter by using the depth control function of a mechanical drilling machine so as to remove partial hole copper. The preset position is the position where back drilling is required. In this step, a via drilling operation, referred to as "one drill" for short, is performed at a corresponding location on the PCB where backdrilling is required. One drill was positioned with 4 targets.
102. Carrying out copper deposition on the through hole by using a pulse electroplating process to obtain uniform hole copper;
pulse plating is a plating method in which a plating circuit is periodically turned on and off, or a pulse having a certain waveform is superimposed on a fixed direct current. Compared with common electroplating, the method has the advantages of flat and compact plating layer, good adhesiveness, high current efficiency, good environmental protection performance and the like, and pulse modes used by pulse electroplating can be divided into a unidirectional pulse mode and a bidirectional pulse mode in general research and application. The pulse waves used are mainly rectangular waves and sine waves.
The copper deposition is to plate a layer of copper on the drilled hole wall base material which is not conductive.
In order to avoid that when the back drilling tool drills a back drilling hole due to the fact that the thick part of the hole copper part is thin, all parts are stressed unevenly to generate deviation, and further the drilled back drilling hole deviates, in the embodiment, a pulse electroplating process is adopted to plate a layer of uniform hole copper on the through hole obtained in the step 101. The pulse plating density was controlled to 15ASF or less, and the empty barrel was controlled to 30 μm or less for a long time of plating.
103. Step-by-step back drilling is carried out on the through hole by using a back drilling tool with a belt groove structure;
the back drill tool with the sub-groove structure, namely the back drill tool, is provided with a chip removal space, and copper chips generated by drilling can be discharged through the chip removal space in the drilling process.
And step-by-step back drilling, namely, drilling N times by using a back drilling tool to obtain a back drilling hole, wherein the back drilling tool can withdraw from the back drilling once after each time of drilling is finished, so that copper scraps generated by each time of drilling can be effectively brought out of the hole by the back drilling tool. And the step back drilling can prolong the service life of the back drilling tool and ensure the performance stability of the PCB, because the temperature of the back drilling tool and the back drilling accessory can be sharply increased due to frictional heat generation in the drilling process, the temperature increase can influence the inner copper and the back drilling tool, and the step back drilling is adopted, the back drilling tool exits from the back drilling hole and enters again after finishing one-step drilling, so that the back drilling tool and the back drilling hole can be rapidly cooled after exiting from the back drilling hole, and heat accumulation can not be formed. N is determined according to the depth of the back drilling hole and the type of the back drilling cutter, and the specific determination process is a process of continuously testing the cutter: the back drilling method comprises the steps of drilling back drilling holes with different depths on the same PCB by using back drilling cutters of the same model, recording drilling effects of different drilling depths, continuously adjusting the drilling depth until the optimal drilling depth capable of achieving the optimal drilling effect is found by using an infinite approximation method, and taking the optimal drilling depth as the maximum drilling depth of each drilling in step back drilling, wherein the optimal drilling effect can be understood as non-deviated drilling and no residual copper scraps in the holes.
Preferably, the step of back drilling the through hole by using a back drilling tool with a sub-groove structure can be optimized as follows: acquiring the thickness of a preset position; classifying the through holes in the preset positions according to the thickness; according to the classification result, matching the through holes with corresponding back drilling cutters with the belt groove structures; and carrying out step-by-step back drilling on the through hole by using the back drilling tool. Because each process flow for manufacturing the PCB generates certain errors, certain differences exist in the thickness of each area of the PCB due to certain errors, and the actual depth of the back drilling hole is directly influenced by different thicknesses, in order to drill the back drilling hole with better quality, a method for drilling holes by adopting different back drilling cutters through different thicknesses is needed, and the error of the back drilling hole caused by the influence factor of the thickness of the PCB is eliminated. The different back drills are mainly back drills with different service lives, because the service life of the back drill determines the drilling capacity of the back drill, and the required drilling times with thick thickness are more, so the drilling capacity is stronger, and the required drilling capacity with thin thickness is weaker.
Further, each of the N boreholes has an equal depth. According to the foregoing, it can be seen that N is equal to the back drilling depth divided by the optimal drilling depth, and that one bit of back drilling is automatically performed every decimal to obtain an integer, so that the situation that the depth of the last bit of each back drilling is smaller than the optimal drilling depth, and the drilling depths are different, which may lead to an increase in the complexity of control, is that the optimization of one bit is performed, the back drilling depth is first divided by the optimal drilling depth, the corresponding N is obtained every decimal, and then the actual drilling depth is obtained every time by dividing the back drilling depth by the N. Therefore, the drilling depth of each cutter is equal, and the optimal drilling effect can be achieved.
In the embodiment, through holes are formed in the preset positions of the PCB; carrying out copper deposition on the through hole by using a pulse electroplating process to obtain uniform hole copper; and step-by-step back drilling is carried out on the through hole by using a back drilling tool with a slotted structure, and the step-by-step back drilling is to obtain a back drilling hole by N times of drilling. Even hole copper can guarantee the drilling in-process, and the back drilling sword atress is even, can not take place the skew and lead to the drilling skew, adopts the back drilling sword of belt groove structure to carry out the back drilling step by step simultaneously, and each step is drilled the end, and outside the hole can be effectively taken to copper scraps in the back drilling, the emergence of avoiding the stifled hole.
Example two
The embodiment provides a method for processing a PCB back drill, and compared with the previous embodiment, the embodiment further optimizes the process before PCB lamination to create a better foundation for the back drill, as shown in fig. 2, specifically includes:
201. designing a circuit of the inner-layer plate;
the method specifically comprises the following steps: and dynamically compensating and designing sparse areas and dense areas of the lines of the inner-layer board.
The circuit design mainly comprises the layout of external connection, the layout of internal electronic elements, and the layout of metal connecting wires and through holes. Take Eagle stream platform as an example, the distance between the line widths of the two lines in the 10z inner layer: 3.5/4/3.5, back drilling is required at a 4mil spacing, resulting in a low fault tolerance of the back drilling — as long as the back drilling tool is deviated or misplaced, the circuit drills on both sides of the back drilling hole may be cut off during drilling, eventually affecting the performance of the entire PCB. In order to improve the fault-tolerant rate of back drilling, when the lines of the inner-layer board are designed, the line secret region and the line sparse region are dynamically compensated, the line spacing of the sparse region is properly reduced, and the line spacing of the dense region is properly increased. The line spacing of the dense line region is increased, and the probability of circuit defects of inner lines of the PCB caused by back drilling is greatly reduced.
202. Transferring a line image to the inner-layer plate by a Laser Direct Imaging (LDI) technology;
LDI is to directly form a circuit image on a PCB by a laser scanning method, the image is finer, the time and the cost for loading and unloading the negative are saved due to the omission of the negative working procedure in the exposure process, and the deviation caused by the expansion and shrinkage of the negative is reduced. The deviation can lead to the intersection of the inner-layer circuit and the back drilling hole area, so that the inner-layer circuit is drilled by the back drilling cutter during back drilling, and the drilling probability of the back drilling cutter to the inner-layer circuit is reduced due to the reduction of the expansion and contraction deviation.
203. Performing line etching on the inner-layer plate by adopting a vacuum etching process;
the water pool effect occurs when the PCB is etched: when the PCB is horizontally conveyed, the etching solution is easy to flow away and exchange new etching solution and old etching solution at the lower part of the board and the upper part of the board close to the edge part; the center of the plate is easy to form a 'water pool', and the flow of the etching solution is limited; the middle line on the upper surface of the PCB may be etched less effectively than other locations. In order to prevent the "pool effect" from occurring, the fluidity of the etching liquid at the upper portion of the plate surface is improved by sucking the used etching liquid, and this method is called vacuum etching. The realization principle of vacuum etching is as follows: nozzles are installed in the etching section, and an air extraction unit is also installed at a position where the relative distance between the nozzles and the surface of the circuit board is short. The air suction unit enables the operation area to form negative pressure which is just enough to prevent the etching solution from generating low suction force of water pool effect. By comparison, the etching effect of the upward portion and the downward portion of the plate is substantially the same. And the thickness distribution of copper obtained by etching the inner layer circuit by adopting vacuum etching is uniform.
204. Performing lamination and lamination by adopting a PIN-LAM positioning system;
the manufacturing process of the PIN-LAM comprises the following steps: starting up the machine to set a superposition mode, namely selecting specifications and quantity of PIN nails and steel plates according to plate thickness, makeup size and batch, setting an automatic mode, and lifting a cover plate; positioning the chassis, moving the chassis to the middle with the PIN nails, inserting 4 PIN nails, jacking the chassis, aligning the 4 PIN nails, spacing 18 pieces of new kraft paper, and covering a steel plate; 1-aligning 4 PIN nails on a PCB (printed circuit board) combination to lay upper and lower layers of cleaned copper foils, PP sheets and chips, and checking whether the PIN is long enough or not according to the PIN positions of the flat chip groove; 2-aligning 4 PIN nails on the PCB PIN combination, laying an upper copper foil, cleaning, covering a steel plate, turning a switch, and lifting the PIN PINs to a height of 3-4mm from the board surface; and circulating the second layer and the third layer until finishing, namely, arranging a kraft paper twist switch at intervals, slowly covering the cover plate in the direction and in alignment with the PIN, wherein the PIN nail must be inserted into the cover plate by 3-5mm in length, and is forbidden to be higher than the cover plate. The interlayer deviation can be controlled within 4mil by adopting the LDI and PIN-LAM production, and the probability of inner layer circuit failure caused by back drilling can be effectively reduced.
Optimally, the expansion and shrinkage values between the layers are measured after lamination, and then the control parameters of lamination are adjusted according to the measurement result to ensure that the expansion and shrinkage values between the layers are equal
205. Forming a through hole, depositing copper and back drilling step by step;
the content of this step is similar to that of step 101-103 in the embodiment, and is not described herein, it should be noted that each drilling of the step back drilling is performed by CDD automatic alignment, and meanwhile, the aluminum sheet is provided with a CDD positioning window in advance, so as to avoid positioning offset caused by the mushroom head striking the surface of the aluminum sheet when the aluminum sheet is placed on the top surface. The service life of the back drilling tool is controlled to be less than 200.
206. Cleaning copper scraps in the back drilled hole by using ultrasonic waves;
ultrasonic cleaning (ultrasonic cleaning) is to disperse, emulsify and peel off a dirt layer to achieve the purpose of cleaning by utilizing the direct and indirect actions of cavitation action, acceleration action and direct current action of ultrasonic waves in liquid on liquid and the dirt. In the currently used ultrasonic cleaning machines, cavitation and straight-through flow are more applied.
And after the back drilling is finished, the PCB is subjected to ultrasonic and high-pressure washing, the back drilling surface is downward, the machine passing speed needs to be controlled within 2m/min, and the hole inspection light transmission state is 100%.
The implementation improves the fault-tolerant rate of back drilling by dynamically compensating the sparse area and the dense area of the circuit of the inner plate; the LDI and the PIN-LAM are combined for use, so that the interlayer deviation is controlled in a small range, and the drilling probability of a back drilling tool for an inner layer circuit is reduced; and cleaning the back drilled hole by ultrasonic waves to remove the copper scraps possibly remaining in the back drilled hole. Meanwhile, a plurality of processes are adjusted and optimized, so that the defects of hole blocking, deviation, hole wall dislocation and the like of back drilling are avoided, and the production requirement is met.
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems and methods according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
Having described embodiments of the present application, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (8)
1. A PCB back drilling processing method is characterized by comprising the following steps:
forming a through hole at a preset position of the PCB;
carrying out copper deposition on the through hole by using a pulse electroplating process to obtain uniform hole copper;
and carrying out step-by-step back drilling on the through hole by using a back drilling tool with a slotted structure, wherein the step-by-step back drilling is to obtain a back drilling hole by drilling for N times, the N is determined according to the depth of the back drilling hole, and the N is an integer greater than or equal to 1.
2. The PCB backdrilling method of claim 1, wherein the step backdrilling the through hole by using the backdrilling tool with a tape and groove structure comprises the following steps:
acquiring the thickness of the preset position;
classifying the through holes in the preset positions according to the thickness;
according to the classification result, matching the through holes with corresponding back drilling cutters with belt groove structures;
and carrying out step-by-step back drilling on the through hole by using the back drilling tool.
3. The PCB back-drilling processing method of claim 1, wherein each drilling depth of the N drilling holes is equal.
4. The method of claim 1, wherein before the forming the through hole at the predetermined position of the PCB, the method further comprises:
the circuit design of inner plate specifically includes: carrying out dynamic compensation design on a sparse area and a dense area of the circuit of the inner-layer plate;
and carrying out line etching on the inner-layer plate by adopting a vacuum etching process.
5. The PCB backdrilling processing method of claim 4, wherein after the designing the inner layer circuit and before the etching the inner layer circuit by using the vacuum etching process, the PCB backdrilling processing method further comprises:
and transferring the circuit image to the inner layer plate by a Laser Direct Imaging (LDI) technology.
6. The PCB backdrilling processing method of claim 4, wherein after the vacuum etching process is adopted to etch the circuit of the inner plate, the PCB backdrilling processing method further comprises the following steps:
and (3) pressing, specifically comprising: performing lamination and lamination by adopting a PIN-LAM positioning system;
measuring the expansion and contraction value among layers;
and adjusting the control parameters of the pressing according to the measurement result so that the expansion and contraction values between the layers are equal.
7. The PCB back-drilling processing method of claim 1, wherein after the step back-drilling of the through holes by using the back-drilling tool with the tape and groove structure, the method further comprises the following steps:
and cleaning the copper scraps in the back drilling hole by using ultrasonic waves.
8. A PCB manufactured by the PCB back-drilling method of any one of claims 1 to 7.
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| CN202111008658.3A CN113873759A (en) | 2021-08-31 | 2021-08-31 | PCB back drilling processing method and PCB |
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| CN202111008658.3A CN113873759A (en) | 2021-08-31 | 2021-08-31 | PCB back drilling processing method and PCB |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114559070A (en) * | 2022-04-08 | 2022-05-31 | 深圳市大族数控科技股份有限公司 | Drilling method based on numerical control drilling machine and numerical control drilling machine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030075450A1 (en) * | 2001-10-15 | 2003-04-24 | Taylor E. Jennings | Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields |
| CN101861058A (en) * | 2010-06-04 | 2010-10-13 | 深南电路有限公司 | Method of PCB board processing technology |
| CN103298273A (en) * | 2013-05-07 | 2013-09-11 | 深圳崇达多层线路板有限公司 | Method for preventing bottom holes of circuit board from being blocked in copper plating |
| CN108391387A (en) * | 2018-04-03 | 2018-08-10 | 广德今腾电子科技有限公司 | A kind of processing technology of printed circuit board electroplating finger |
| CN112055481A (en) * | 2020-08-11 | 2020-12-08 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of common-blind co-plating PCB with high thickness-diameter ratio |
-
2021
- 2021-08-31 CN CN202111008658.3A patent/CN113873759A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030075450A1 (en) * | 2001-10-15 | 2003-04-24 | Taylor E. Jennings | Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields |
| CN101861058A (en) * | 2010-06-04 | 2010-10-13 | 深南电路有限公司 | Method of PCB board processing technology |
| CN103298273A (en) * | 2013-05-07 | 2013-09-11 | 深圳崇达多层线路板有限公司 | Method for preventing bottom holes of circuit board from being blocked in copper plating |
| CN108391387A (en) * | 2018-04-03 | 2018-08-10 | 广德今腾电子科技有限公司 | A kind of processing technology of printed circuit board electroplating finger |
| CN112055481A (en) * | 2020-08-11 | 2020-12-08 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of common-blind co-plating PCB with high thickness-diameter ratio |
Non-Patent Citations (1)
| Title |
|---|
| 严启罡等: "《电子封装工艺与装备技术基础教程》", 武汉：湖北科学技术出版社, pages: 194 - 199 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114559070A (en) * | 2022-04-08 | 2022-05-31 | 深圳市大族数控科技股份有限公司 | Drilling method based on numerical control drilling machine and numerical control drilling machine |
| CN114559070B (en) * | 2022-04-08 | 2024-03-22 | 深圳市大族数控科技股份有限公司 | Drilling method based on numerical control drilling machine and numerical control drilling machine |
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