CN113867504B

CN113867504B - Server air guide heat dissipation device and heat dissipation method thereof

Info

Publication number: CN113867504B
Application number: CN202111079268.5A
Authority: CN
Inventors: 郭秀云; 刘鹏
Original assignee: Suzhou Inspur Intelligent Technology Co Ltd
Current assignee: Suzhou Inspur Intelligent Technology Co Ltd
Priority date: 2021-09-15
Filing date: 2021-09-15
Publication date: 2023-07-14
Anticipated expiration: 2041-09-15
Also published as: CN113867504A

Abstract

The invention relates to a server wind-guiding heat-dissipating device and a heat-dissipating method thereof, wherein the wind-guiding heat-dissipating device comprises a wind deflector, a wind shield and a wind shield; the heat dissipation method comprises the following steps: s1, dismantling unnecessary CPUs according to actual requirements; s2, dismantling the corresponding fans according to the dismantled CPU positions; s3, installing the air guide heat dissipation device to a position needing heat dissipation according to the positions of the removed CPU and the removed fan. The air guide and heat dissipation device changes the flow direction of the cold air flow path, so that the cold air flow path is fully distributed at the places where the CPU and other components need to dissipate heat, and the heat dissipation efficiency is greatly improved; when the server is switched, a user can change the configuration of the air guide heat dissipation device according to the requirements of specific application scenes, and the configuration of the air guide heat dissipation device is updated, so that a customized heat dissipation scheme of the server is provided for the user, the heat dissipation problem during the switching of the server is effectively solved, the cost of the server is reduced, and the competitiveness of products is improved.

Description

Server air guide heat dissipation device and heat dissipation method thereof

Technical Field

The invention relates to the technical field of server heat dissipation, in particular to a server air guide heat dissipation device and a heat dissipation method thereof.

Background

In the case of the current development of data processing in blowout, servers are applied to various fields, and the demands of various clients on the servers are also increasingly differentiated. The demands of different clients on the server are different, and thus the development design of the server presents more challenges.

Among them, the study of heat dissipation problem has become an important issue in the server. The heat dissipation is an important factor for restricting the development of the server, and how to effectively solve the heat dissipation problem of various different products, and meanwhile, the optimization of benefits is achieved, so that the heat dissipation is a difficult problem in the server industry. The number of CPUs required for different products varies according to the requirements of customization of some clients, and sometimes only one CPU (single-path server) is required, and sometimes two CPUs (two-path server) or four CPUs (four-path server) are required. The whole structure of the whole server is not changed, and meanwhile, a single-path server and a two-path server and flexible switching between the two-path server and a four-path server are sometimes required to be realized, so that the problem to be solved is to provide a customized heat dissipation device and a heat dissipation method of the server aiming at different client requirements.

Disclosure of Invention

In order to solve the technical problems, the invention provides the air guide heat dissipation device and the heat dissipation method of the server, which can provide a customized scheme of the server, improve the heat dissipation efficiency of the server and reduce the cost of the server.

To achieve the above object, the present application proposes a first technical solution:

the utility model provides a server wind-guiding heat abstractor, includes the aviation baffle, the bottom both ends of aviation baffle all are provided with the lock and attach the structure, lock attaches the structure and the DIMM groove looks joint on the server, the top of aviation baffle is provided with the cylinder, be provided with the slot on the cylinder, detachably installs the windshield in the slot.

In one embodiment of the present invention, a plurality of slots are provided on the cylinder, and the plurality of slots are provided at different angles with respect to the axis of the cylinder.

In one embodiment of the invention, after the wind shield is installed on the wind deflector, the bottommost end of the wind shield is not lower than the topmost end of the components below the wind shield.

In one embodiment of the invention, a plurality of ventilation holes are arranged on two sides of the air deflector.

In one embodiment of the invention, a wind shielding groove is formed in the air deflector in a hollow mode, and a wind shielding plate is detachably arranged in the wind shielding groove.

In one embodiment of the invention, the air guide device further comprises an air guide cover, wherein a protrusion is formed at the top of the air guide plate, a clamping groove is formed in the air guide cover, and the protrusion is clamped with the clamping groove.

In one embodiment of the invention, the bottom of the air deflector is arranged in a hollow part in the middle of the two locking structures.

In order to achieve the above object, the present application further proposes a second technical solution:

a method for dissipating heat from an air-guiding heat dissipating device of a server, the method comprising the steps of:

s1, dismantling unnecessary CPUs according to actual requirements;

s2, dismantling the corresponding fans according to the dismantled CPU positions;

s3, installing the air guide heat dissipation device to a position needing heat dissipation according to the positions of the removed CPU and the removed fan.

In one embodiment of the present invention, step S3 specifically includes:

s3.1, installing the air deflector into a DIMM groove according to actual heat dissipation requirements;

s3.2, mounting the wind shield on the air deflector according to actual heat dissipation requirements;

s3.3, adjusting the angle of the wind shield according to the actual heat dissipation requirement;

and S3.4, installing the air guide cover on the air guide plate according to actual heat dissipation requirements.

In one embodiment of the invention, it is determined whether to use the wind deflector according to the actual heat dissipation requirements.

Compared with the prior art, the technical scheme of the invention has the following advantages:

the invention relates to a server wind-guiding heat dissipating device and a heat dissipating method thereof, wherein the heat dissipating device comprises an air deflector, a wind shield and a wind guide cover, and the different configurations of the air deflector, the wind shield and the wind guide cover change the flow direction of a cold wind path, so that the cold wind path is fully distributed in a place where a CPU and other components need to dissipate heat, and the heat dissipating efficiency is greatly improved; when the server is switched, a user can change the configuration of the air guide heat dissipation device and update the configuration of the air guide heat dissipation device according to the requirements of specific application scenes, so that a customized heat dissipation scheme of the server is provided for the user, the heat dissipation problem during the switching of the server is effectively solved, the cost of the server is reduced, and the competitiveness of products is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic perspective view of a heat dissipating device according to a first embodiment of the present invention;

FIG. 2 is a schematic view of a partial enlarged structure at A in FIG. 1;

FIG. 3 is a top view of a heat dissipating device according to a first embodiment of the present invention;

FIG. 4 is a schematic view of a mounting structure of a wind scooper and a wind deflector according to a first embodiment of the present invention;

FIG. 5 is a schematic diagram illustrating a two-way server switching to a one-way server according to a third embodiment of the present invention;

FIG. 6 is a diagram illustrating a four-way server switching to a two-way server according to a fourth embodiment of the present invention;

FIG. 7 is a flow chart of a heat dissipation method in a second embodiment of the invention;

fig. 8 is a block diagram of an optional method in a fifth embodiment of the present invention.

Description of the specification reference numerals:

1. an air deflector; 2. a locking structure; 3. a cylinder; 4. a slot; 5. a wind shielding sheet; 6. a vent hole; 7. a wind shielding groove; 8. a wind deflector; 9. a wind scooper; 10. protruding; 11. a clamping groove.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

Embodiment one:

referring to fig. 1 to 4, the air guiding and radiating device of a server of the present invention includes an air guiding plate 1, wherein both ends of the bottom of the air guiding plate 1 are provided with locking structures 2, and the locking structures 2 are clamped with DIMM (Dual-Inline-Memory-Modules) slots on the server, i.e. Memory bank slots. The memory bar on the server can be directly clamped in the DIMM groove, so that the locking structure 2 at the bottom of the air deflector 1 is consistent with the locking structure 2 at the bottom of the memory bar, the air deflector 1 can be directly clamped in the DIMM groove like the memory bar, can be assembled when needed, and can be disassembled when not needed. In the use of the server, the number of CPUs needs to be changed sometimes, so that the heat dissipation structure needs to be changed, and the cold air flow path needs to be changed by using the air deflector 1 at this time, so that the changed heat dissipation air flow path can adapt to the specific use condition of the CPUs. The top of aviation baffle 1 is provided with cylinder 3, is provided with slot 4 on the cylinder 3, and slot 4 is interior detachably to install windshield 5. If the direction of the cold air passage needs to be changed, the wind shielding plate 5 can be arranged on the cylinder 3 at the top of the air deflector 1, and the flowing direction of the cold air passage can be changed through the wind shielding plate 5. The two cylinders 3 can be arranged on the air deflector 1, and the two cylinders 3 can be respectively arranged at the two ends of the air deflector 1, so that the two ends of the air deflector 1 can change the flow direction of a cold air passage by arranging the wind shielding pieces 5. The air deflector 1 can be divided into two types, one is an air deflector with a vent hole 6, and the other is an air deflector without a vent hole 6, and the air deflector can be selected according to specific heat dissipation conditions.

In one embodiment, a plurality of slots 4 are provided on the cylinder 3, and the plurality of slots 4 are arranged at different angles with respect to the axis of the cylinder 3. Because different cold air passage trend is required to be set according to different CPU service conditions, the wind shield 5 can be installed in the slot 4 with a corresponding angle on the cylinder 3 according to the trend of the cold air passage, and thus the flowing direction of the cold air passage can be changed by utilizing the wind shield 5.

In one embodiment, after the wind shielding plate 5 is mounted on the wind deflector 1, the bottommost end of the wind shielding plate 5 is not lower than the topmost end of the components below it. The wind shielding piece 5 plays a role in changing the flowing direction of the air path, when the wind shielding piece 5 is arranged on the cylinder 3 to change the trend of the cold air path, the wind shielding piece 5 cannot interfere with the components below the wind shielding piece, so that the bottommost end of the wind shielding piece 5 is not lower than the top end of the components below the wind shielding piece 5, and the wind shielding piece 5 is prevented from damaging the components below the wind shielding piece in the using process, so that the server cannot be used normally.

In one embodiment, a plurality of vent holes 6 are provided on both sides of the air deflector 1. The cooling mechanism of server needs to design according to specific demand, and sometimes the electronic components etc. of aviation baffle 1 opposite side also need the heat dissipation demand, but the heat dissipation demand of this electronic components side is not very high, therefore when aviation baffle 1 installs the DIMM groove, set up ventilation hole 6 in the both sides of aviation baffle 1, and ventilation hole 6 one-to-one of aviation baffle 1 both sides aligns, like this have some cold wind can flow to one side of aviation baffle 1 through ventilation hole 6, and one side of aviation baffle 1 can dispel the heat to the CPU like this, and the opposite side also can dispel the heat to corresponding components and parts. The size and the number parameters of the vent holes 6 can be formulated according to the heat dissipation requirement, and the vent holes 6 can be selected and flexibly switched according to the specific heat dissipation effect required. The shape of the vent 6 may be selected to be circular, which provides better aerodynamic performance.

In one embodiment, a wind shielding groove 7 is formed in the air deflector 1, and a wind shielding plate 8 is detachably installed in the wind shielding groove 7. When the heat radiation structure needs to be changed, sometimes, only the CPU on one side of the air deflector 1 is required to radiate heat, the other side does not need to radiate heat, and the ventilation holes 6 can lead to the loss of cold air, so that the wind deflector 8 can be installed in the wind deflector 7, the cold air is blocked by the wind deflector 8 at the moment, the cold air can not flow to the other side of the air deflector 1 through the ventilation holes 6, the heat radiation effect is better, the universality of the heat radiation device is improved, and the corresponding heat radiation air path can be configured according to specific practical conditions.

In one embodiment, the wind deflector further comprises a wind scooper 9, a protrusion 10 is formed at the top of the wind deflector 1, a clamping groove 11 is formed in the wind scooper 9, and the protrusion 10 is clamped with the clamping groove 11. After cold air is gathered by the air deflector 1, the wind force is larger, the air deflector 1 is supported by the bottom locking structure 2 only, a certain degree of shaking can possibly occur, and the situation of reliability reduction can occur after a period of use. Therefore, the protruding part of the air deflector 1 needs to be in fit and clamping connection with the clamping groove 11 of the air deflector 9, so that the air deflector 9 plays a reinforcing role on the air deflector 1, the air deflector 1 positioned at two sides of cold air is more stable when cold air flows through, and cold air flow channels can be formed between the air deflector 9 and the two air deflectors 1, so that cold air is not easy to run off, and the CPU can be fully radiated. According to different demands, the air deflector 1 can be placed in different DIMM grooves, so that in order to improve the universality of the air deflector 9, a plurality of clamping grooves 11 on the air deflector 9 can be arranged to adapt to the air deflector 1 at different positions, and the mounting structures of the air deflector 9 and the air deflector 1 are shown in fig. 4. The hollow part in the middle of the wind scooper 9 is used for avoiding the CPU, so that the wind scooper 9 is prevented from being contacted with the CPU, and the use or the heat dissipation effect of the CPU is prevented.

In one embodiment, the bottom of the air deflector 1 is hollow in the middle of the two locking structures 2. When the air deflector 1 is inserted into the DIMM groove, only the locking structures 2 on two sides of the air deflector 1 are inserted into the DIMM groove, and as the middle parts of the two locking structures 2 are arranged in a hollow mode, other structures cannot be inserted into the middle of the DIMM groove, abrasion of the internal structure of the DIMM groove can be reduced, and the service life of the DIMM groove can be prolonged.

Embodiment two:

as shown in fig. 7, fig. 7 is a flowchart of a heat dissipation method of the server air guiding heat dissipation device. The heat dissipation method comprises the following steps:

s1, dismantling unnecessary CPUs according to actual requirements;

according to the actual heat dissipation requirement, determining which places on the server need to be dismantled, and directly dismantling the CPU from the server after determining the position of the dismantled CPU.

after the CPU to be dismantled is dismantled according to the actual heat dissipation requirement, only a few CPUs are working, redundant fans can appear, and the fans only waste more power resources, so that after the CPU is dismantled, the fans corresponding to the CPUs are dismantled, and the rest fans continue to dissipate heat for the rest CPUs, so that the dismantled fans reduce the waste of the power resources.

After the CPU and the fan are removed, in order to enable the remaining fan on the server to sufficiently dissipate heat of the CPU, a corresponding air guiding and dissipating device needs to be installed so as to perform corresponding heat dissipation configuration for different numbers of CPUs.

The method specifically comprises the following steps:

and S3.1, installing the air deflector 1 into the DIMM groove according to the actual heat dissipation requirement. After the CPU is removed, the corresponding cold air flow paths are changed for the remaining CPUs in the server to dissipate heat according to specific situations, so that the heat dissipation efficiency of the actual situations can be improved.

And S3.2, the wind shield 5 is mounted on the wind deflector 1 according to actual heat dissipation requirements. In order to improve the heat dissipation efficiency, there are places where it is necessary to change the flow direction of the cool air passage, and at this time, it is necessary to install the wind shielding plate 5 to the wind deflector 1 so as to change the flow direction of the cool air passage.

S3.3, adjusting the angle of the wind shield 5 according to the actual heat dissipation requirement; the angle of the wind shielding piece 5 is adjusted, so that the direction of the cold air flow path is accurately adjusted.

S3.4, installing a wind scooper 9 on the wind deflector 1 according to actual heat dissipation requirements. In some application scenarios, the air deflector 1 may shake under the effect of the cold air flow, and according to the actual heat dissipation evaluation result, the air deflector 1 may be provided with the air deflector 9, so that the stability of the air deflector 1 under the cold air flow may be increased by the air deflector 9.

In addition, in some application scenarios, the air deflector 1 with the vent hole 6 is used before, because some components on one side of the air deflector 1 need to perform corresponding heat dissipation treatment, if the components on one side of the air deflector 1 need not perform heat dissipation after switching the CPU, the wind deflector 8 can be inserted into the wind deflector 7, so that cold air flow cannot pass through the vent hole 6 to dissipate heat of the components on one side of the air deflector 1.

Embodiment III:

the two-way server is switched to the one-way server, that is, the dual CPU use is switched to the single CPU use.

When the dual CPU is switched to the single CPU, as shown in fig. 5, since the CPU2 is eliminated and the corresponding heat dissipation mechanism is also required to be changed in order to reduce the cost, the fifth fan and the sixth fan are also eliminated or switched to the false fan module accordingly. After the fan is reduced, cold air passing through the fan flows to a gap on the side of the CPU2 when encountering obstacles such as the CPU, and the cold air cannot be gathered, so that the heat dissipation efficiency is low. At this time, an air guiding and heat dissipating device needs to be arranged at a corresponding position so as to improve the heat dissipating efficiency of the server. Therefore, as shown in fig. 5, the air deflector 1 is inserted into the DIMM slot at the left side of the CPU2, so that the air deflector 1 controls the cool air passage at the left side thereof, thereby reducing the flow of the cool air passage to the CPU2 side and improving the heat dissipation efficiency. The wind deflector 1 can be provided with wind shields 5 at both ends, and the angle of the wind shields 5 can be flexibly adjusted according to actual conditions, so that cold air can flow to the vicinity of other parts needing heat dissipation, and the heat dissipation efficiency is greatly improved. In addition, the PSU (Power supply unit ) at the lower right side of the cold air passing through the CPU1 also needs to dissipate heat, so the wind shielding plate 5 of the air deflector 1 near the PSU side may be set at an angle toward the PSU to facilitate heat dissipation of the PSU.

After the CPU2 is removed and the wind screen 8 is added, the parts on the right side of the CPU2 may have heat dissipation requirements, the specific requirements are based on the heat dissipation evaluation conclusion, in order to meet the heat dissipation requirements on the right side of the CPU2, the wind screen 1 with the vent holes 6 (the size and specific number of the vent holes 6 are based on the requirements) may be adopted, and cold air is diffused to the right side of the CPU2 through the vent holes 6, meanwhile, the heat dissipation on the right side of the CPU2 is not necessarily hundred percent, so that the wind screen 8 can be used according to specific use conditions, so as to meet the heat dissipation requirements under different requirements, and the switching can be flexibly performed.

In order to clearly show the heat sink arrangement, the air guide cover 9 is not shown in fig. 5. In fig. 5, thin arrows indicate the main air path of the cool air path, i.e., the air path for radiating heat to the CPU; the large arrow indicates an auxiliary air path on the other side of the air deflector 1, which needs to radiate heat to other components, namely an air path for cold air to pass through the vent hole 6.

Table 1 comparison table before and after improving the heat radiation fittings of two-way server to single-way server

Table 1 is a comparison table of heat dissipation fittings required before and after improvement after switching the two-way server to the one-way server, and the table compares the scheme applying the device with the prior art scheme before and after. As can be seen from table 1, after the two-way server is switched to the one-way server, the number of fans is reduced in the prior art heat dissipation scheme, and a different air guide cover 9 is replaced, in such a heat dissipation configuration, when the cold air passing through the fans encounters an obstacle such as a CPU, the cold air flows into a gap on the CPU2 side, which causes the cold air to be unable to gather; in the heat dissipation device, the air guide plate 1 and the wind shield 5 are arranged to control the cold air flow path on the left side of the heat dissipation device, so that the flow of the cold air flow path to the CPU2 side is reduced, and the heat dissipation efficiency is improved. Normalization of the wind scooper 9 in table 1 means that a plurality of clamping grooves 11 are provided on the wind scooper 9 so as to improve versatility of the wind scooper 9. The air guide plates 1 used in table 1 are air guide plates 1 each provided with a vent hole 6.

Embodiment four:

the four-way server is switched to the two-way server, namely, the four-CPU use is switched to the double-CPU use.

When the four-way server is switched to the two-way server, as shown in fig. 6. CPU3 and CPU4 are eliminated, and the corresponding heat dissipation mechanisms are also required to be changed for cost reduction, so that fan one and fan six are also eliminated or switched to a fan false module. When the cold air passes through the fan, the front CPU3 and the front CPU4 are canceled, so that the cold air can not be gathered at the position where the cold air reaches the CPU3 and the CPU4, confusion occurs, the cold air flows everywhere, and the heat dissipation efficiency is gathered and reduced. At this time, an air guide device needs to be arranged at a corresponding position so as to improve the heat dissipation efficiency of the server. As shown in fig. 6, the air guiding devices are respectively added on the right side of the CPU3, the left side of the CPU4, the right side of the CPU2 and the left side of the CPU1, the placement position of the air guiding devices and the direction of the wind shielding plates 5 thereof need to be adjusted according to the number and the positions of the fans which are reduced, in addition, in order to improve the stability of the air guiding devices, the air guiding cover 9 can be arranged on the top of the air guiding plate 1, so that the stability of the air guiding devices is improved. After the air guide device is additionally arranged, cold air forms a cold air flow channel by virtue of the structure of the air guide device, and after the cold air is gathered in the cold air flow channel, the cold air can fully flow through the four CPUs, so that the effect of fully guiding air is achieved, and the heat dissipation efficiency is greatly improved. And after the cold air passes through the CPU, the direction of the wind shielding plate 5 can be flexibly adjusted according to the specific requirements of components, so that the heat dissipation requirements of the components at all positions are met.

Also, components on the left side of CPU1, the right side of CPU2, the right side of CPU3, and the left side of CPU4 may have heat dissipation requirements, and the specific requirements are based on the heat dissipation evaluation conclusion. Therefore, in order to meet the heat dissipation requirements of the components on the left side of the CPU1, the right side of the CPU2, the right side of the CPU3 and the left side of the CPU4, the air deflector 1 with the vent holes 6 (the specific number is determined according to the requirements) can be adopted, and cold air is diffused to the left side of the CPU1, the right side of the CPU2, the right side of the CPU3 and the left side of the CPU4 through the vent holes 6, so that the heat dissipation effect on the components corresponding to the places is achieved, and meanwhile, the heat dissipation of the places is not always a hundred percent requirement, so that the wind deflector 8 can be used according to specific use conditions to meet the heat dissipation requirements under different requirements, and the flexible switching can be realized. In addition, the PSU (Power supply unit ) at the lower right side of the cold air passing through the CPU2 also needs to dissipate heat, so the wind shielding plate 5 of the wind deflector 1 near the PSU side may be set at an angle toward the PSU to facilitate heat dissipation of the PSU. Normalization of the wind scooper 9 in table 2 means that a plurality of clamping grooves 11 are provided on the wind scooper 9 so as to improve the versatility of the wind scooper 9.

In order to clearly show the heat sink arrangement, the air guide cover 9 is not shown in fig. 6. In fig. 6, thin arrows indicate the main air path of the cool air path, i.e., the air path for radiating heat to the CPU; the large arrow indicates an auxiliary air path on the other side of the air deflector 1, which needs to radiate heat to other components, namely an air path for cold air to pass through the vent hole 6.

Table 2 comparison table before and after improving heat dissipation accessory for switching four-way server to two-way server

Table 2 is a comparison table of heat dissipation fittings required before and after improvement after switching the four-way server to the two-way server, and the table compares the scheme applying the device with the prior art scheme before and after. As can be seen from table 2, after the four-way server is switched to the two-way server, the number of fans is reduced in the prior art heat dissipation scheme, and a different air guide cover 9 is replaced, in such a heat dissipation configuration, since the front CPU3 and CPU4 are eliminated, cold air reaches the CPU3 and CPU4 and cannot be gathered; in the heat dissipation device, the air guide plate 1 and the wind shield 5 are arranged, so that the air path of cold air is controlled in the air guide plate 1, and the cold air can fully flow through four CPUs, thereby achieving the effect of fully guiding the air and greatly improving the heat dissipation efficiency. The air deflectors 1 used in table 2 were each provided with vent holes 6.

Fifth embodiment:

as shown in fig. 8, fig. 8 is a flowchart of an optional method for the air guiding and heat dissipating device of the server.

The matching method comprises the following steps:

s10, a user places a demand order according to the heat dissipation requirement of the server;

the user places orders through corresponding websites or mobile phone software according to the heat dissipation requirements of the required servers, namely the requirement orders comprise a selection scheme, and the selection scheme at least comprises a CPU, a fan and an air guiding device. Before step S10, the provider may formulate a corresponding matching scheme according to the needs of the market user, where the matching scheme at least includes the most basic heat dissipation configuration needs of the user, and the provider may continuously perfect the matching scheme according to the investigation of the market needs, so that the matching scheme can cover different needs of the user as much as possible.

S20, automatically selecting a heat radiation configuration list according to the requirement order of the user;

when a user submits a server-related option, the option system automatically selects a related heat dissipation accessory list according to the user's requirement order. Different matching schemes have different heat radiation configuration lists, so after a user determines the matching scheme, a matching system can automatically select a related heat radiation accessory list according to a user's demand order, and automatic configuration of the heat radiation accessory list of the server is realized.

S30, automatically generating a production order according to the demand order and the heat dissipation configuration list of the user;

the user's demand order will contain relevant user information including at least user name, contact, so the production order will include user information and a list of detailed heat sink configurations required by the user server.

S40, producing the heat dissipation fitting of the user according to the production order.

And manufacturing and processing the heat radiation fittings according to the detailed heat radiation configuration list of the production order.

Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.

Claims

1. The utility model provides a server wind-guiding heat abstractor which characterized in that: the intelligent air conditioner comprises an air deflector (1), wherein locking structures (2) are arranged at two ends of the bottom of the air deflector (1), the locking structures (2) are clamped with DIMM grooves on a server, a cylinder (3) is arranged at the top of the air deflector (1), a slot (4) is formed in the cylinder (3), and a wind shield (5) is detachably arranged in the slot (4); a plurality of slots (4) are formed in the cylinder (3), and the slots (4) are arranged at different angles on the axis of the cylinder (3); after the wind shielding piece (5) is arranged on the wind deflector (1), the bottommost end of the wind shielding piece (5) is not lower than the topmost end of the components below the wind shielding piece; the bottoms of the air deflectors (1) are arranged in a hollow mode at the middle of the two locking structures (2).

2. The server wind-guiding heat sink of claim 1, wherein: a plurality of ventilation holes (6) are formed in two sides of the air deflector (1).

3. The server wind-guiding heat sink of claim 2, wherein: the wind deflector (1) is internally hollow and is provided with a wind shielding groove (7), and a wind shielding plate (8) is detachably arranged in the wind shielding groove (7).

4. The server wind-guiding heat sink of claim 1, wherein: the air deflector is characterized by further comprising an air deflector cover (9), wherein a protrusion (10) is formed at the top of the air deflector (1), a clamping groove (11) is formed in the air deflector cover (9), and the protrusion (10) is clamped with the clamping groove (11).

5. A heat dissipation method using the server wind-guiding heat dissipation device according to any one of claims 1 to 4, characterized in that: the method comprises the following steps:

s1, dismantling unnecessary CPUs according to actual requirements;

6. The heat dissipation method of the server air guiding heat dissipation device according to claim 5, wherein: the step S3 specifically comprises the following steps:

s3.1, installing the air deflector (1) into a DIMM groove according to actual heat dissipation requirements;

s3.2, mounting the wind shielding plate (5) on the wind deflector (1) according to actual heat dissipation requirements;

s3.3, adjusting the angle of the wind shielding plate (5) according to the actual heat dissipation requirement;

s3.4, installing the wind scooper (9) on the wind deflector (1) according to actual heat dissipation requirements.

7. The heat dissipation method of the server air guiding heat dissipation device according to claim 6, wherein: and determining whether to use the wind shield (8) according to actual heat dissipation requirements.