CN113867504A - Server air guide heat dissipation device and heat dissipation method thereof - Google Patents

Server air guide heat dissipation device and heat dissipation method thereof Download PDF

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Publication number
CN113867504A
CN113867504A CN202111079268.5A CN202111079268A CN113867504A CN 113867504 A CN113867504 A CN 113867504A CN 202111079268 A CN202111079268 A CN 202111079268A CN 113867504 A CN113867504 A CN 113867504A
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wind
heat dissipation
server
deflector
air
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CN113867504B (en
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郭秀云
刘鹏
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Suzhou Inspur Intelligent Technology Co Ltd
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Suzhou Inspur Intelligent Technology Co Ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Human Computer Interaction (AREA)
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  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a server wind-guiding heat-dissipating device and a heat-dissipating method thereof, wherein the wind-guiding heat-dissipating device comprises a wind deflector, a wind shield and a wind-guiding cover; the heat dissipation method comprises the following steps: s1, dismantling the CPU which is not needed according to the actual requirement; s2, removing the corresponding fan according to the position of the removed CPU; and S3, mounting the wind guide heat dissipation device at the position needing heat dissipation according to the position of the removed CPU and the removed fan. The air guide heat dissipation device changes the flow direction of the cold air path, so that the cold air path is fully distributed in the places where the CPU and other components need to dissipate heat, and the heat dissipation efficiency is greatly improved; when the server is switched, a user can change the configuration of the air guide heat dissipation device and update the configuration of the air guide heat dissipation device according to the requirements of specific application scenes, a customized heat dissipation scheme of the server is provided for the user, the heat dissipation problem when the server is switched is effectively solved, the cost of the server is reduced, and the competitiveness of products is improved.

Description

Server air guide heat dissipation device and heat dissipation method thereof
Technical Field
The invention relates to the technical field of server heat dissipation, in particular to a server air guide heat dissipation device and a heat dissipation method thereof.
Background
Under the condition that the current data processing is developed in a blowout mode, the server is applied to various fields, and the requirements of various clients on the server are more and more differentiated. The demands of different clients on the server are different, and therefore, the development and design of the server are more challenging.
Among them, the research of the heat dissipation problem has become an important issue in the server. The heat dissipation is an important factor for restricting the development of the server, how to effectively solve the heat dissipation problem of various products, and the optimization of benefits is achieved, so that the problem of the server industry is solved. For the customized requirements of some customers, the number of CPUs required by different products is different, sometimes only one CPU (one-way server) is needed, and sometimes two CPUs (two-way server) or four CPUs (four-way server) are needed. The one-way server and the two-way server and the four-way server are required to be flexibly switched at times without changing the overall structure of the whole machine, so that the customized heat dissipation device and the heat dissipation method of the server are provided for different customer requirements, which is a problem to be solved urgently.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides a server wind-guiding heat-dissipating device and a heat-dissipating method thereof, which can provide a customized solution for a server, improve the heat-dissipating efficiency of the server, and reduce the cost of the server.
In order to achieve the above object, the present application proposes a first technical solution:
the utility model provides a server wind-guiding heat abstractor, includes the aviation baffle, the bottom both ends of aviation baffle all are provided with the lock and attach the structure, the DIMM groove looks joint on lock attaches the structure and the server, the top of aviation baffle is provided with the cylinder, be provided with the slot on the cylinder, detachably installs the wind-blocking piece in the slot.
In one embodiment of the present invention, the plurality of slots are provided on the cylinder, and the plurality of slots are provided at different angles with respect to the axis of the cylinder.
In an embodiment of the invention, after the wind deflector is mounted on the wind deflector, the bottommost end of the wind deflector is not lower than the topmost end of the component below the wind deflector.
In one embodiment of the invention, both sides of the air deflector are provided with a plurality of vent holes.
In one embodiment of the invention, a wind blocking groove is formed in the hollow air deflector, and a wind blocking plate is detachably mounted in the wind blocking groove.
In an embodiment of the invention, the wind guide device further comprises a wind guide cover, a protrusion is formed at the top of the wind guide plate, a clamping groove is formed in the wind guide cover, and the protrusion is clamped with the clamping groove.
In one embodiment of the invention, the bottom of the air deflector is arranged in a hollow part between the two locking mechanisms.
In order to achieve the above object, the present application further provides a second technical solution:
a heat dissipation method of a server wind-guiding heat dissipation device comprises the following steps:
s1, dismantling the CPU which is not needed according to the actual requirement;
s2, removing the corresponding fan according to the position of the removed CPU;
and S3, mounting the air guide heat dissipation device at the position needing heat dissipation according to the position of the removed CPU and the removed fan.
In an embodiment of the present invention, step S3 specifically includes:
s3.1, installing the air deflector into the DIMM groove according to actual heat dissipation requirements;
s3.2, mounting the wind shield sheet on the air deflector according to actual heat dissipation requirements;
s3.3, adjusting the angle of the wind shield according to actual heat dissipation requirements;
and S3.4, installing the air guide cover on the air guide plate according to actual heat dissipation requirements.
In one embodiment of the invention, the determination of whether to use the wind deflector is based on actual heat dissipation requirements.
Compared with the prior art, the technical scheme of the invention has the following advantages:
the server wind-guiding heat-dissipating device comprises a wind deflector, a wind-blocking sheet and a wind-guiding cover, wherein the different configurations of the wind deflector, the wind-blocking sheet and the wind-guiding cover change the flow direction of a cold wind path, so that the cold wind path is fully distributed at the places where a CPU and other components need to dissipate heat, and the heat-dissipating efficiency is greatly improved; when the server is switched, a user can change the configuration of the air guide heat dissipation device and update the configuration of the air guide heat dissipation device according to the requirements of specific application scenes, so that a customized heat dissipation scheme of the server is provided for the user, the heat dissipation problem when the server is switched is effectively solved, the cost of the server is reduced, and the competitiveness of products is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic perspective view of a heat dissipation device according to a first embodiment of the invention;
FIG. 2 is a schematic view of a portion of the enlarged structure at A in FIG. 1;
fig. 3 is a top view of a heat dissipation device according to a first embodiment of the invention;
FIG. 4 is a schematic view of an installation structure of the wind scooper and the wind deflector according to the first embodiment of the present invention;
fig. 5 is a schematic diagram illustrating a switching from a two-way server to a one-way server in the third embodiment of the present invention;
fig. 6 is a schematic diagram illustrating a four-way server switching to a two-way server in the fourth embodiment of the present invention;
FIG. 7 is a flowchart of a heat dissipation method according to a second embodiment of the present invention;
fig. 8 is a structural diagram of the matching method in the fifth embodiment of the present invention.
The specification reference numbers indicate:
1. an air deflector; 2. a locking structure; 3. a cylinder; 4. a slot; 5. a wind-shielding sheet; 6. a vent hole; 7. a wind shield groove; 8. a wind deflector; 9. a wind scooper; 10. bulging; 11. a clamping groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1 to 4, the server air guide heat dissipation device of the present invention includes an air guide plate 1, both ends of the bottom of the air guide plate 1 are provided with locking structures 2, and the locking structures 2 are clamped with Dual-Inline-Memory-Modules (DIMM-i.e., Memory bank slots) slots on the server. The memory bar on the server can be directly clamped in the DIMM groove, so that the locking structure 2 at the bottom of the air deflector 1 is consistent with the locking structure 2 at the bottom of the memory bar, and the air deflector 1 can be directly clamped in the DIMM groove like the memory bar and can be assembled when needed and disassembled when not needed. In the use of the server, the number of used CPUs needs to be changed, so that the heat dissipation structure needs to be changed, and at this time, the air duct of cold air needs to be changed by the air deflector 1, so that the changed heat dissipation air duct can adapt to the specific use condition of the CPUs. The top of aviation baffle 1 is provided with cylinder 3, is provided with slot 4 on the cylinder 3, and detachably installs windshield 5 in the slot 4. If the direction of the cold air path needs to be changed, the wind shielding sheet 5 can be installed on the cylinder 3 at the top of the air deflector 1, and the flowing direction of the cold air path can be changed through the wind shielding sheet 5. The two cylinders 3 can be arranged on the air deflector 1, and the two cylinders 3 can be respectively arranged at two ends of the air deflector 1, so that the two ends of the air deflector 1 can change the flow direction of the cold air path by arranging the wind blocking sheets 5. The air guide plate 1 can be divided into two types, one type is an air guide plate with a vent hole 6, and the other type is an air guide plate without a vent hole 6, and the air guide plate can be selected for use according to specific heat dissipation conditions.
In one embodiment, the plurality of slots 4 are provided on the cylinder 3, and the plurality of slots 4 are arranged at different angles with respect to the axis of the cylinder 3. Because different directions of the cold air path are set according to different CPU use conditions, the wind shielding piece 5 can be arranged in the slot 4 with the corresponding angle on the cylinder 3 according to the direction of the cold air path, and the flowing direction of the cold air path can be changed by utilizing the wind shielding piece 5.
In one embodiment, after the wind deflector 5 is mounted on the wind deflector 1, the lowermost end of the wind deflector 5 is not lower than the uppermost end of the component below the wind deflector. The wind shielding sheet 5 plays a role in changing the flowing direction of the wind path, when the wind shielding sheet 5 is installed on the cylinder 3 to change the trend of the cold wind path, the wind shielding sheet 5 cannot interfere with components below the wind shielding sheet 5, so that the bottom end of the wind shielding sheet 5 is not lower than the top end of the component below the wind shielding sheet, the components below the wind shielding sheet 5 are prevented from being damaged in the using process of the wind shielding sheet 5, and the server cannot be normally used.
In one embodiment, the air deflector 1 is provided with a plurality of vent holes 6 on both sides. The heat dissipation mechanism of server need design according to specific demand, sometimes electronic components and parts of aviation baffle 1 opposite side also need the heat dissipation demand, but the heat dissipation demand of this electronic components side is not very high, therefore when aviation baffle 1 was installed in the DIMM groove, set up ventilation hole 6 in aviation baffle 1's both sides, and the ventilation hole 6 of aviation baffle 1 both sides aligns one by one, some cold wind can flow to one side of aviation baffle 1 through ventilation hole 6 like this, one side of aviation baffle 1 can dispel the heat to CPU like this, the opposite side also can dispel the heat to corresponding components and parts. The size and the number parameters of the ventilation holes 6 can be formulated according to heat dissipation requirements, and the ventilation holes 6 can also be selected according to the required specific heat dissipation effect, so that flexible switching is realized. The shape of the ventilation holes 6 can be chosen to be circular, so that the aerodynamic performance is better.
In one embodiment, a wind shielding groove 7 is formed in the wind deflector 1 in a hollow manner, and a wind shielding plate 8 is detachably mounted in the wind shielding groove 7. When needs transform heat radiation structure, only need dispel the heat to the CPU of aviation baffle 1 one side in some times, the opposite side need not dispel the heat, and ventilation hole 6 can lead to the loss of cold wind, consequently in alright with in installing wind shield 8 in wind shield groove 7, wind shield 8 this moment blocks cold wind, make cold wind can not flow the opposite side of aviation baffle 1 through ventilation hole 6, just so can make radiating effect better, heat abstractor's commonality has been improved, consequently, can dispose corresponding heat dissipation wind path according to specific actual conditions.
In one embodiment, the wind guide device further comprises a wind scooper 9, a protrusion 10 is formed at the top of the wind guide plate 1, a clamping groove 11 is formed in the wind scooper 9, and the protrusion 10 is clamped with the clamping groove 11. After cold air is gathered by the air guide plate 1, the wind power is large, the air guide plate 1 is supported only by the bottom locking mechanism 2, shaking possibly occurs to a certain degree, and the situation of reliability reduction can occur after the air guide plate is used for a period of time. Consequently, the outstanding part at aviation baffle 1 needs to carry out the adaptation joint with draw-in groove 11 of wind scooper 9, and wind scooper 9 has played reinforced effect to aviation baffle 1 like this for the aviation baffle 1 that is located the cold wind both sides when cold wind flows through is more stable, can form the runner of cold wind between wind scooper 9 and two aviation baffles 1 moreover, can make the difficult loss of cold wind like this, can be to the abundant heat dissipation of CPU. According to different requirements, the air deflector 1 is placed in different DIMM slots, so in order to improve the versatility of the air guiding cover 9, a plurality of slots 11 on the air guiding cover 9 can be arranged to adapt to the air deflector 1 in different positions, and the installation structure of the air guiding cover 9 and the air deflector 1 is shown in fig. 4. The hollow part in the middle of the wind scooper 9 is used for avoiding the CPU, and the wind scooper 9 is prevented from contacting the CPU to influence the use or heat dissipation effect of the CPU.
In one embodiment, the bottom of the air deflector 1 is arranged in the hollow part between the two locking mechanisms 2. When the air deflector 1 is inserted into the DIMM groove, only the locking mechanisms 2 at two sides of the air deflector 1 are inserted into the DIMM groove, and as the middle part of the two locking mechanisms 2 is arranged in a hollow way, other structures cannot be inserted into the middle part of the DIMM groove, so that the abrasion of the inner structure of the DIMM groove can be reduced, and the service life of the DIMM groove can be prolonged.
Example two:
as shown in fig. 7, fig. 7 is a flowchart of a heat dissipation method of the server wind-guiding heat dissipation device. The heat dissipation method comprises the following steps:
s1, dismantling the CPU which is not needed according to the actual requirement;
according to the actual heat dissipation requirement, the CPU in which places on the server needs to be removed needs to be determined, and after the position of the CPU needing to be removed is determined, the CPU is directly removed from the server.
S2, removing the corresponding fan according to the position of the removed CPU;
after the CPU which needs to be dismounted is dismounted according to the actual heat dissipation requirement, only a few CPUs are in operation, redundant fans can appear, and the fans only waste more power resources.
And S3, mounting the wind guide heat dissipation device at the position needing heat dissipation according to the position of the removed CPU and the removed fan.
After the CPU and the fans are removed, in order to enable the remaining fans on the server to sufficiently dissipate heat of the CPU, corresponding air guiding and heat dissipating devices need to be installed, so as to perform corresponding heat dissipation configurations for different numbers of CPUs.
The method specifically comprises the following steps:
s3.1, installing the air deflector 1 into the DIMM groove according to actual heat dissipation requirements. After the CPU is detached, the residual CPU in the server needs to be changed into a corresponding cold air path so as to radiate heat according to specific conditions, and therefore the radiating efficiency of actual conditions can be improved.
And S3.2, mounting the wind shield 5 on the air deflector 1 according to actual heat dissipation requirements. In order to improve the heat dissipation efficiency, the flow direction of the cold air path needs to be changed in some places, and at this time, the wind blocking sheet 5 needs to be installed on the air deflector 1 so as to change the flow direction of the cold air path.
S3.3, adjusting the angle of the wind shield 5 according to actual heat dissipation requirements; the angle of the wind shield 5 is adjusted, so that the flow direction of the cold wind path is accurately adjusted.
And S3.4, installing an air guide cover 9 on the air guide plate 1 according to actual heat dissipation requirements. In some application scenarios, the air deflector 1 may shake under the action of the cold air flow, and the air deflector 9 may be mounted on the air deflector 1 according to an actual heat dissipation evaluation result, so that the air deflector 9 may increase the stability of the air deflector 1 under the cold air flow.
In addition, in some application scenarios, the air deflector 1 with the vent hole 6 is used in the past, because some components on one side of the air deflector 1 need to be subjected to corresponding heat dissipation processing, if the components on one side of the air deflector 1 do not need to be subjected to heat dissipation after the CPU is switched, the air deflector 8 can be inserted into the air blocking groove 7, so that cold air flow cannot pass through the vent hole 6 to dissipate heat of the components on one side of the air deflector 1.
Example three:
the two-way server is switched to the single-way server, namely, the use of the double CPUs is switched to the use of the single CPU.
When the dual CPU is switched to the single CPU, as shown in fig. 5, since the CPU2 is eliminated and the heat dissipation mechanism corresponding thereto needs to be changed in order to reduce the cost, the fan five and the fan six are also eliminated or switched to the fan dummy module. When the fan is reduced, the cool air passing through the fan flows into the gap on the CPU2 side when it encounters an obstacle such as a CPU, and this causes the cool air not to be collected, and thus the heat dissipation efficiency is low. At this time, the air guide heat dissipation device needs to be arranged at a corresponding position to improve the heat dissipation efficiency of the server. Therefore, as shown in fig. 5, the air deflector 1 is inserted into the DIMM slot on the left side of the CPU2, so that the air deflector 1 controls the cool air passage on the left side thereof, thereby reducing the flow of the cool air passage to the CPU2 side and improving the heat dissipation efficiency. The two ends of the air deflector 1 can be provided with the wind-shielding sheets 5, and the angles of the wind-shielding sheets 5 can be flexibly adjusted according to actual conditions, so that cold air can flow to the positions near other components needing heat dissipation, and the heat dissipation efficiency is greatly improved. In addition, after the cold air passes through the CPU1, the lower right PSU (Power supply unit) also needs to dissipate heat, so the wind shielding sheet 5 of the wind deflector 1 near the PSU can be set to an angle toward the PSU to facilitate the heat dissipation of the PSU.
After the CPU2 is cancelled and the wind shield 8 is added, the part on the right side of the CPU2 may have a heat dissipation requirement, the specific requirement is based on the heat dissipation assessment conclusion, in order to meet the heat dissipation requirement on the right side of the CPU2, the wind shield 1 with the vent holes 6 (the size and specific number of the vent holes 6 are determined according to the requirement) may be adopted, cold air is diffused to the right side of the CPU2 through the vent holes 6, meanwhile, the heat dissipation on the right side of the CPU2 is not necessarily a hundred percent requirement, therefore, the wind shield 8 may be used according to the specific use condition, so as to meet the heat dissipation requirements under different requirements, and flexible switching may be performed.
In order to clearly show the heat sink arrangement, the wind scooper 9 is not shown in fig. 5. In fig. 5, the thin arrows indicate the main air path of the cool air path, i.e., the air path for dissipating heat to the CPU; the large arrow indicates an auxiliary air path on the other side of the air deflector 1, which needs to dissipate heat for other components, i.e. an air path through which cold air passes through the vent 6.
TABLE 1 comparison table before and after heat dissipation accessories of two-way server switched to one-way server
Figure BDA0003263279520000081
Table 1 is a comparison table before and after improvement of heat dissipation parts required after switching the two-way server to the one-way server, and this table compares the scheme of applying the device with the scheme of the prior art. As can be seen from table 1, after the two-way server is switched to the one-way server, the number of fans is reduced in the heat dissipation scheme of the prior art, and different air scoops 9 are replaced, in such a heat dissipation configuration, when cold air passing through the fans meets obstacles such as a CPU, the cold air flows to a gap on the side of the CPU2, which may result in that the cold air cannot be collected; in the heat dissipation device of the present application, the provision of the air deflector 1 and the wind shielding sheet 5 controls the cool air passage to the left side thereof, thereby reducing the flow of the cool air passage to the CPU2 side and improving the heat dissipation efficiency. The normalization of the wind scooper 9 in table 1 means that a plurality of slots 11 are provided on the wind scooper 9, so as to improve the versatility of the wind scooper 9. The air deflectors 1 used in table 1 are all air deflectors 1 provided with vent holes 6.
Example four:
the four-way server is switched to the two-way server, namely, the four-CPU use is switched to the double-CPU use.
When the four-way server is switched to the two-way server, as shown in fig. 6. The CPU3 and the CPU4 are eliminated, and the heat dissipation mechanisms corresponding to the CPU3 and the CPU4 need to be changed in order to reduce the cost, so that the first fan and the sixth fan are also eliminated or switched to fan dummy modules correspondingly. After the cold air passes through the fan, because the front CPU3 and the front CPU4 are cancelled, the cold air can not be gathered when reaching the CPU3 and the CPU4, the cold air is disordered, and the cold air flows everywhere, so that the heat dissipation efficiency is gathered and reduced. At this time, the air guide device needs to be arranged at a corresponding position to improve the heat dissipation efficiency of the server. As shown in fig. 6, the air guide devices are respectively added on the right side of the CPU3, the left side of the CPU4, the right side of the CPU2 and the left side of the CPU1, the placement position of the air guide device and the direction of the wind-blocking sheet 5 thereof need to be adjusted according to the number and the position of the fan cutouts, and in addition, in order to improve the stability of the air guide device, an air guide cover 9 can be installed on the top of the air guide plate 1, so that the stability of the air guide device is improved. After the air guide device is additionally arranged, cold air forms a cold air flow channel by depending on the structure of the air guide device, and after the cold air is gathered in the cold air flow channel, the cold air can fully flow through the four CPUs, so that the effect of fully guiding the air is achieved, and the heat dissipation efficiency is greatly improved. And after the cold air passes through the CPU, the direction of the wind-shielding sheet 5 can be flexibly adjusted according to the specific requirements of the components, so that the heat dissipation requirements of the components at all positions are met.
Similarly, heat dissipation requirements may exist for components on the left side of the CPU1, the right side of the CPU2, the right side of the CPU3, and the left side of the CPU4, and the specific requirements are subject to the evaluation conclusion of heat dissipation. Therefore, in order to meet the heat dissipation requirements of components on the left side of the CPU1, the right side of the CPU2, the right side of the CPU3 and the left side of the CPU4, the air deflector 1 with the vent holes 6 (the specific quantity is determined according to the requirements) can be adopted, and cold air is diffused to the left side of the CPU1, the right side of the CPU2, the right side of the CPU3 and the left side of the CPU4 through the vent holes 6, so that the heat dissipation effect on the corresponding components in the places is achieved, meanwhile, the heat dissipation in the places is not always required by one hundred percent, and therefore, the air deflector 8 can be used according to specific use conditions to meet the heat dissipation requirements under different requirements and can be flexibly switched. In addition, after the cold air passes through the CPU2, the lower right PSU (Power supply unit) also needs to dissipate heat, so the wind shielding sheet 5 of the wind deflector 1 near the PSU can be set to an angle toward the PSU to facilitate the heat dissipation of the PSU. The normalization of the wind scooper 9 in table 2 means that a plurality of slots 11 are provided on the wind scooper 9, so as to improve the versatility of the wind scooper 9.
In order to clearly show the heat sink arrangement, the wind scoops 9 are not shown in fig. 6. In fig. 6, the thin arrows indicate the main air path of the cool air path, i.e., the air path for dissipating heat to the CPU; the large arrow indicates an auxiliary air path on the other side of the air deflector 1, which needs to dissipate heat for other components, i.e. an air path through which cold air passes through the vent 6.
TABLE 2 comparison table before and after heat dissipation accessory improvement for switching four-way server to two-way server
Figure BDA0003263279520000091
Table 2 is a comparison table before and after the improvement of the heat dissipation accessories required after the four-way server is switched to the two-way server, and the table compares the scheme to which the device is applied with the scheme of the prior art. As can be seen from table 2, after the four-way server is switched to the two-way server, the number of fans is reduced in the heat dissipation scheme of the prior art, and the different wind scoops 9 are replaced, in such a heat dissipation configuration, since the front CPU3 and the front CPU4 are eliminated, the cold wind reaching the CPUs 3 and 4 cannot be collected; in the heat dissipation device of the present application, the air duct of the cold air is controlled inside the air deflector 1 by the arrangement of the air deflector 1 and the wind shielding sheet 5, so that the cold air can sufficiently flow through the four CPUs, thereby achieving the effect of sufficient air guiding and greatly improving the heat dissipation efficiency. The air deflectors 1 used in table 2 are all air deflectors 1 provided with vent holes 6.
Example five:
as shown in fig. 8, fig. 8 is a flowchart of an assembling method of the server wind-guiding heat dissipation device.
The matching method comprises the following steps:
s10, the user places a demand order according to the heat dissipation requirement of the server;
a user places orders through a corresponding website or mobile phone software according to the heat dissipation requirement of a server required by the user, namely a requirement order, wherein the requirement order comprises a matching scheme, and the matching scheme at least comprises a CPU, a fan and an air guide device. Before step S10, the supplier will make a corresponding matching solution according to the needs of the market users, the matching solution at least includes the most basic heat dissipation configuration needs of the users, and the supplier can continuously refine the matching solution according to the research of the market demand situation, so that the matching solution can cover different needs of the users as much as possible.
S20, automatically selecting and matching a heat dissipation configuration list according to the requirement order of the user;
when a user submits a server-related matching scheme, the matching system can automatically select a related heat dissipation accessory list according to a demand order of the user. Different heat dissipation configuration lists exist in different matching schemes, so that after a user determines the matching scheme, the matching system can automatically select a related heat dissipation accessory list according to a demand order of the user, and automatic configuration of the heat dissipation accessory list of the server is achieved.
S30, automatically generating a production order according to the demand order and the heat dissipation configuration list of the user;
the user's demand order will contain relevant user information including at least the user name, contact information, and thus the production order will include the user information and the detailed heat dissipation configuration list required by the user server.
And S40, producing the heat dissipation accessories of the user according to the production order.
And manufacturing and processing the heat dissipation accessories according to the detailed heat dissipation configuration list of the production order.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (10)

1. The utility model provides a server wind-guiding heat abstractor which characterized in that: the wind-proof and wind-proof structure is characterized by comprising a wind deflector (1), locking structures (2) are arranged at two ends of the bottom of the wind deflector (1), the locking structures (2) are clamped with DIMM grooves on a server, a cylinder (3) is arranged at the top of the wind deflector (1), a slot (4) is formed in the cylinder (3), and a wind-proof sheet (5) is detachably arranged in the slot (4).
2. The server wind-guiding heat-dissipating device according to claim 1, wherein: the slots (4) are arranged on the cylinder (3) in a plurality, and the slots (4) are arranged at different angles along the axis of the cylinder (3).
3. The server wind-guiding heat-dissipating device according to claim 1, wherein: after the wind shield sheet (5) is arranged on the air deflector (1), the bottommost end of the wind shield sheet (5) is not lower than the topmost end of the component below the wind shield sheet.
4. The server wind-guiding heat-dissipating device according to claim 1, wherein: both sides of the air deflector (1) are provided with a plurality of ventilation holes (6).
5. The server wind-guiding heat-dissipating device according to claim 4, wherein: the wind deflector is characterized in that a wind blocking groove (7) is formed in the hollow part of the wind deflector (1), and a wind blocking plate (8) is detachably mounted in the wind blocking groove (7).
6. The server wind-guiding heat-dissipating device according to claim 1, wherein: the wind guide plate is characterized by further comprising a wind scooper (9), a protrusion (10) is formed at the top of the wind guide plate (1), a clamping groove (11) is formed in the wind scooper (9), and the protrusion (10) is clamped with the clamping groove (11).
7. The server wind-guiding heat-dissipating device according to claim 1, wherein: the bottom of the air deflector (1) is positioned in the hollow part between the two locking mechanisms (2).
8. A heat dissipation method using the wind-guiding heat dissipation device of any one of claims 1 to 7, characterized in that: the method comprises the following steps:
s1, dismantling the CPU which is not needed according to the actual requirement;
s2, removing the corresponding fan according to the position of the removed CPU;
and S3, mounting the air guide heat dissipation device at the position needing heat dissipation according to the position of the removed CPU and the removed fan.
9. The heat dissipation method for server wind-guiding heat dissipation device as defined in claim 8, wherein: step S3 specifically includes:
s3.1, installing the air deflector (1) into a DIMM groove according to actual heat dissipation requirements;
s3.2, mounting the wind shield sheet (5) on the air deflector (1) according to actual heat dissipation requirements;
s3.3, adjusting the angle of the wind shield sheet (5) according to actual heat dissipation requirements;
and S3.4, installing the air guide cover (9) on the air guide plate (1) according to actual heat dissipation requirements.
10. The heat dissipation method for server wind-guiding heat dissipation device as defined in claim 9, wherein: and determining whether the wind deflector (8) is used or not according to the actual heat dissipation requirement.
CN202111079268.5A 2021-09-15 2021-09-15 Server air guide heat dissipation device and heat dissipation method thereof Active CN113867504B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206147499U (en) * 2016-10-14 2017-05-03 郑州云海信息技术有限公司 Fix simple and easy wind scooper on memory slot
CN206805403U (en) * 2017-05-12 2017-12-26 郑州云海信息技术有限公司 A kind of server wind shielding structure of adjustable angle applied to 4U servers
CN209015043U (en) * 2018-09-30 2019-06-21 浙江东方职业技术学院(浙江东方专修学院) A kind of wind deflector convenient for computer heat dissipation
CN111692109A (en) * 2020-04-22 2020-09-22 嘉兴宏欣汽车零部件有限公司 Air deflector for radiator fan
CN214148945U (en) * 2020-11-19 2021-09-07 徐州创科工程机械有限公司 Angle-adjustable wind scooper for cooling fan

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206147499U (en) * 2016-10-14 2017-05-03 郑州云海信息技术有限公司 Fix simple and easy wind scooper on memory slot
CN206805403U (en) * 2017-05-12 2017-12-26 郑州云海信息技术有限公司 A kind of server wind shielding structure of adjustable angle applied to 4U servers
CN209015043U (en) * 2018-09-30 2019-06-21 浙江东方职业技术学院(浙江东方专修学院) A kind of wind deflector convenient for computer heat dissipation
CN111692109A (en) * 2020-04-22 2020-09-22 嘉兴宏欣汽车零部件有限公司 Air deflector for radiator fan
CN214148945U (en) * 2020-11-19 2021-09-07 徐州创科工程机械有限公司 Angle-adjustable wind scooper for cooling fan

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