CN1138637C - Manufacture and structure of hot-bubble ink-jetting print head - Google Patents
Manufacture and structure of hot-bubble ink-jetting print head Download PDFInfo
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- CN1138637C CN1138637C CNB011000287A CN01100028A CN1138637C CN 1138637 C CN1138637 C CN 1138637C CN B011000287 A CNB011000287 A CN B011000287A CN 01100028 A CN01100028 A CN 01100028A CN 1138637 C CN1138637 C CN 1138637C
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- ink
- print head
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- integrated hot
- bubble
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Abstract
The present invention relates to a manufacture method and a structure of an ink jet print head with hot oxygen bubbles, which is integrated with a single stone. Elements of an ink jet print with hot oxygen bubbles, such as an ink passage, an ink inlet groove, an energy conversion body and a jet hole sheet, are formed and completed on the same base plate, wherein the ink passage is formed by etching the upper surface of the base plate in a non-isotropic way; the ink inlet groove is formed by etching the lower surface of the base plate in a non-isotropic way; the energy conversion body and the jet hole sheet are orderly formed above the ink passage by utilizing filming and etching techniques. The method is especially favorable for batch operation, and thus, can greatly raise the production efficiency and reduce the production cost.
Description
The present invention relates to a kind of hot-bubble ink-jetting print head manufacture method and structure thereof, the manufacture method and the structure thereof of the hot-bubble ink-jetting print head that particularly a kind of single stone is integrated.
Known hot oxygen bubble ink jet printing head structure, as Hewlett Packard company (U.S. Patent No. 4,490,728,4,809,428), Canon company (U.S. Patent No. 4,596,994,4,723,129) or Xerox company (U.S. Patent No. 4,774,530,4,863,560) ink-jet printing head of being developed is broadly divided into as Figure 1A, lateral spray type shown in the 1B (Side shooting) and as Fig. 2 A, upper-spraying type shown in the 2B (Roof Shooting) two classes, wherein this Figure 1B is an A-A cutaway view among this Figure 1A, and this Fig. 2 B then is a B-B cutaway view among this Fig. 2 A.The basic structure of these two kinds of known hot-bubble ink-jetting print heads includes: ink channel 1: spray orifice (nozzle) 2 and the spray nozzle sheet (orifice plate) 3 of the ejection of ink supply water; Be formed at a substrate 4, be used for electric energy is changeed the energy transfer medium (energy transducer) 10 of heat energy, this energy transfer medium 10 can be made of the thermal resistance film 5 and the lead 6 of suitable layout; And be formed at the protective layer 7,8 of this energy transfer medium about in the of 10.The operation principle of this hot bubble type ink jet print head adopts the energy transfer medium 10 of resistance heated to come ink in the heating ink passage 1 to reach the purpose of ink-jet.In the time will printing, ink-jet printing head is accepted by the current impulse (currentpulse) that printer provided, and this current impulse is sent to this energy transfer medium 10 through this lead 6.So this energy transfer medium 10 produces rapid high temperature with this ink vaporization, the rapid expanding of ink steam provides a pressure source that ink droplet is sprayed by this spray orifice 2.
The manufacture method of general known hot-bubble ink-jetting print head is growth one deck thermal insulation layer on silicon wafer mostly, as silica (SiO
2); again thermal resistance material and conductor material sputter-deposited (Sputtering) are got on; utilize the ic manufacturing technology of standard then; as light shield exposure projection etching etc.; form the electric heating energy transfer medium and connect lead; add other the ink runner that protective layer and dry film constituted afterwards, last and to aim at a spray nozzle sheet bonding and form ink-jetting member.Another kind of known method as Xerox company, then is that the ink runner is produced on (with this different silicon wafer in film thermal resistance place) on another silicon wafer, again two wafer is aimed at joint (bonding) and gets up.Yet above-mentioned known method, ink-jet printing head must be divided into several different parts is made up again, the for example wafer at thermal resistance place, spray nozzle sheet and the material etc. that constitutes the ink runner, and then each machine parts'precise aimed at bonding, thereby increase the production cost of many ink-jet printing heads.
In order to improve above-mentioned shortcoming, Eastman Kodax company is in U.S. Patent No. 5,463,411,5,760, mention the method for making the ink runner to etched (110) silicon wafer in 804 with non-grade, fluid channel wherein runs through entire wafer by the crystalline substance back of the body, though can be used for forming the integrated ink jet printing head structure of single stone, but must make the throttling seam (throttle slit) that the control ink refluxes to foil (metal foil) at the brilliant back side, and this method can produce bubble on this fluid channel wall when carrying out anisotropic etching, cause the stability of processing procedure and qualification rate wayward.
In sum, still have the manufacture method that needs a kind of new hot-bubble ink-jetting print head of development and structure thereof to address the above problem.
In view of the above, the object of the present invention is to provide the manufacture method and the structure of the integrated ink-jet printing head of a kind of single stone, can reach the requirement of simplifying processing procedure, reducing production costs.
According to above-mentioned purpose, the present invention utilizes the manufacture of semiconductor technology, each element of a hot-bubble ink-jetting print head will be formed, for example, ink channel (Ink Channel) ink feeds groove (Ink Slot) energy transfer medium (energy transducer) spray nozzle sheet (orifice plate) etc., all finishes in same substrate.The manufacture method of this kind hot-bubble ink-jetting print head, be particularly conducive to the operating type (All Batch process) that carries out batch processing and spray nozzle sheet fine registration step for adhering that needn't traditional ink-jet printing head processing procedure, thereby can significantly promote production efficiency, reduce production costs.
The manufacture method of the hot-bubble ink-jetting print head that a kind of single stone according to the present invention is integrated is finished each structure of forming this ink-jet printing head on same substrate, comprise the following step at least:
Upper surface at this substrate forms one first protective layer, and etching forms ink channel between this first protective layer and this substrate;
On this first protective layer, position that should ink channel is formed energy transfer medium (energytransducer) and suitable lead, and protected with an insulating barrier;
Ink at least one this ink channel of connection of this substrate back etching feeds groove (InkSlot);
The spray orifice that forms suitable electric connection pad (pad) and be communicated with this ink channel in the front-side etch of this substrate;
Form a spray nozzle sheet (Orifice Plate) in this substrate front side.
Wherein the upper surface at this substrate forms one first protective layer, and etching forms the step of ink channel between this first protective layer and this substrate, comprises the following steps:
Form a patterned sacrificial layers at this upper surface, to define the figure of ink channel.
On this upper surface and this sacrifice layer, form this first protective layer, and this first protective layer on this sacrifice layer is left mesh (mesh); With this upper surface of this sacrifice layer of anisotropic etching technology etching and this substrate to form ink channel (ink channel); And on this first protective layer, form a planarization insulating layer to fill up this mesh.
Wherein the material of this sacrifice layer is compound crystal silicon (Poly silicon).
Wherein the material of this sacrifice layer is non-crystalline silicon (Amorphous silicon).
Wherein the material of this sacrifice layer is an aluminium.
The structure of the integrated hot-bubble ink-jetting print head of a kind of single stone, at least comprise: a substrate, its front has a upper surface, and the back side has a lower surface, allow upper surface have several recessed ink channels, this ink channel and this substrate are level, and its a lower surface then is formed with at least one ink and feeds groove, and this ink feeds rough this substrate of vertical perforation of groove and is connected with this ink channel and gives this ink channel with the supply ink;
One protective layer is coated on this substrate front side, and this ink channel is covered in down;
Several energy transfer mediums are formed on this planarization insulating layer, corresponding this ink channel of each this energy transfer medium;
One insulating barrier is coated on this protective layer and this energy transfer medium;
One spray nozzle sheet is formed on this insulating barrier, and
Several spray nozzle sheets; rough this spray nozzle sheet that vertically runs through, this insulating barrier and this protective layer, each this spray orifice is connected with corresponding this ink channel; with the pipeline as the ink ejection, the position of this spray orifice and this ink feeding groove is divided into the both sides of this energy transfer medium.
According to the integrated ink jet printing head structure of single stone of said method manufacturing, be not subjected to the low-res restriction of dry film material in the known processing procedure and electroforming spray nozzle sheet (Nozzle Plate by Electroforming); Can further this ink channel and spray orifice be dwindled,, help to improve spray orifice density and hole and dwindle,, help to improve spray orifice density and printing resolution (Dot Per Inch:DPI) to dwindle the volume of ejection ink droplet to dwindle the volume of ejection ink droplet.And the structure of should list stone integrated ink-jet printing head also is easier to be extended to page width formula seal head (page-wideprinthead) on making.
In addition, in the integrated ink jetting structure of this list stone, this ink feeds groove and this energy and changes the not coplanar that body and this spray orifice are arranged at this substrate respectively, and this energy transfer medium and this spray orifice be at diverse location, like this on the configuration ability of raising spray orifice density also more known structure be good.
Describe preferred embodiment of the present invention in detail below in conjunction with accompanying drawing, so that to purpose of the present invention, the special little and function of structure has further understanding.Wherein:
Figure 1A, 1B are the structural profile schematic diagram of known a kind of lateral spray type hot-bubble ink-jetting print head;
Fig. 2 A, 2B are the structural profile schematic diagram of known a kind of upper-spraying type hot-bubble ink-jetting print head;
Fig. 3 A～3M is the flow process profile according to the manufacture method of a kind of hot-bubble ink-jetting print head of the present invention;
Fig. 4 A is the top perspective view of a kind of hot-bubble ink-jetting print head of finishing of the method according to this invention;
Fig. 4 B is the face upwarding stereogram of a kind of hot oxygen bubble ink-jet printing head finished of the method according to this invention;
Fig. 5 A represents a kind of ink channel structure of hot-bubble ink-jetting print head, and this ink channel bottom is formed with an island barrier structure;
Fig. 5 B represents the ink channel structure of another kind of hot-bubble ink-jetting print head, and this ink channel two side forms a neck shape barrier structure.
Disclose the flow process profile of the manufacture method of the integrated thermal China ink of a kind of single stone according to the present invention seal head with reference to figure 3A～3M.
At first as shown in Figure 3A, provide a substrate 20, for example, the front (top side) of this substrate 20 of a silicon wafer (siliconwafer) has a upper surface 21, and its behind (backside) has a lower surface 22.
Then, shown in Fig. 3 B, on this upper surface 21, for example, in the mode of chemical vapor deposition, deposit a sacrifice layer 23, this sacrifice layer 23 can be materials such as polysilicon, non-crystalline silicon or aluminium.
Then, shown in Fig. 3 C, with etching mode, for example, dry-etching (dry Etch) is with this sacrifice layer 23 patterning in addition, to define the figure of ink channel (Ink Channel).
Then, shown in Fig. 3 D, deposit one first protective layer 24 on this upper surface 21 and this sacrifice layer 23 of this substrate 20, and also deposit one second protective layer 25 at this lower surface 22 of this substrate 20.Wherein the material of this first protective layer 24 can be SiC, Sin
x, Sio
2, Sio
xN
yDeng, the material of this second assurance 25 then can be SiC, Sin
xSiO
2SiO
xN
yDeng.
Then, shown in Fig. 3 E, leave mesh (mesh) 26 on this first protective layer 24 on this sacrifice layer 23, this mesh hole size is 1～9 μ m
2About.In addition, can be simultaneously this second protective layer 25 of this base lower surface 22 be carried out etching, to define the size of ink entry 27.
Then, shown in Fig. 3 F, with the anisotropic etching technology, (for example utilize this mesh 26 as etching solution, KOH) window of down carving utilizes this upper surface 21 of this sacrifice layer 23 and this substrate 20, and forms ink channel 40 (InkChannels) at this upper surface 21 of this substrate 20.Simultaneously also can etch Yue Li and this ink channel 40 groove at these ink entry 27 places of this base lower surface 22 with even depth.
After the etching of finishing this ink channel 40, then shown in Fig. 3 G, deposition one planarization insulating layer 28 fills up this mesh 26 on this first protective layer 24, makes to reach having an even surface.This planarization insulating layer 28 can be single or the multiple film layer structure, and its material can be SiNx, SiC, SiO
XN
Y, Ta
2O
5, Sio
2Deng.
Then, shown in Fig. 3 H, on this planarization insulating layer 28, for example, with film sputter and etching technique, finish suitable thermal resistance rete 29 and lead 30 layouts, and form the energy transfer medium (energy transducer) 35 of electric heating conversion in the position of corresponding each this ink channel 40.In this embodiment, though this energy transfer medium is example with the electrothermal conversion body,, also can be the energy transfer medium of other form not as limit.
Then, shown in Fig. 3 I, avoid the erosion of external environment to protect this lead 30 and this electrothermal conversion body 35 at these substrate 20 positive deposition one insulating barriers 31.This insulating barrier 31 can be single or the multiple film layer structure, and its material can be SiN
x, SiC, SiO
xN
y, Ta
2O
5Or SiO
2Any combination Deng rete.Then, this ink entry place at these substrate 20 back sides certainly, in the anisotropic etching mode, this substrate 20 of eating thrown is to form at least one ink feeding groove (Inkslot) 36 that is connected with this ink channel 40.Preferable, interlink near the front end 41 of this ink feeding groove 36 and this ink channel 40.
Then, shown in Fig. 3 J, form a seed metal layer (SeedLayer) 32 on this insulating barrier 31, this seed metal 32 can single or multiple film layer structure, and its material can be any combination of Ta, Cr, Au, Ni, Al, Cu, Pd, Pt, Ti, Tiw etc.
Then, shown in Fig. 3 K, this seed metal layer 32 of etching is to define the zone of spray orifice position and electric connection pad (Pad).
Then, shown in Fig. 3 L, the spray orifice 34 that etches suitable electric connection pad (Pad) 33 and be communicated with this ink channel 40 by this substrate front side with etching mode.Preferable, be connected near the tail end 42 of this spray orifice 34 and this ink channel 40.
Then, shown in Fig. 3 M, on this seed metal 32, form a metal spray nozzle sheet 37 with plating mode.
Though the above embodiments form this spray nozzle sheet 37 with plating mode, yet the present invention is not as qualification, this spray nozzle sheet can also other method form, and for example, forms the plastics spray nozzle sheet with method of spin coating (Spincoating) or pressing method (lamination).If form the plastics spray nozzle sheet, then need not form this seed metal layer 32 with these two kinds of methods.
The stereochemical structure of representing the integrated ink-jet printing head of a kind of single stone finished according to said method with reference to figure 4A, 4B.Fig. 4 A is the vertical view of this ink jet printing head structure, wherein is found in this substrate 20 positive these spray nozzle sheets 37 that form, and several spray orifices 34 on this spray nozzle sheet 37.The front of this substrate 20 also exposes several this contact mats 33.Fig. 4 B then is the upward view of this ink jet printing head structure, and wherein two these inks at visible these substrate 20 back sides feed groove 36.
Can be provided with the resistance mark structure that increases ink backflow impedance in each aforesaid ink channel 40, its position feeds between groove 36 and this energy transfer medium 35 between this ink.This barrier structure can be the structure of known throttle structure (throttle) or a kind of ink channel shown in Fig. 5 A, and island resistance mark structure (Island) 38 is formed on these ink channel 40 bottoms.The structure of the another kind of ink channel shown in Fig. 5 B and for example, this ink channel two side form neck shape resistance mark structure (Neck) 39.
The above only is the present invention's preferred embodiment wherein, is not to be used for limiting practical range of the present invention, and promptly all equalizations of being done according to the present patent application claim change and modify, and are all claim scope of the present invention and cover.
Claims (26)
1. integrated hot-bubble ink-jetting print head manufacture method of single stone is finished each structure of this ink-jet printing head on same substrate, comprise the following step at least:
Upper surface at this substrate forms one first protective layer, and etching forms ink channel between this first protective layer and this substrate;
On this first protective layer, position that should ink channel is formed energy transfer medium and suitable lead, and protected with an insulating barrier;
Ink at least one this ink channel of connection of this substrate back etching feeds groove;
At the front-side etch formation electric connection pad of this substrate and the spray orifice that is communicated with this ink channel;
Form a spray nozzle sheet in this substrate front side.
2. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 1, wherein the upper surface at this substrate forms one first protective layer, and etching forms the step of ink channel between this first protective layer and this substrate, comprises the following steps:
Form a patterned sacrificial layers at this upper surface, to define the figure of ink channel;
On this upper surface and this sacrifice layer, form this first protective layer, and this first protective layer on this sacrifice layer is left mesh; With this upper surface of this sacrifice layer of anisotropic etching technology etching and this substrate to form ink channel; And on this first protective layer, form a planarization insulating layer to fill up this mesh.
3. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 2, wherein the material of this sacrifice layer is a compound crystal silicon.
4. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 2, wherein the material of this sacrifice layer is a non-crystalline silicon.
5. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 2, wherein the material of this sacrifice layer is an aluminium.
6. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 2, wherein the hole size of this mesh is 1～9 μ m
2
7. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 2, wherein this planarization insulating layer is selected from SiN
x, SiC, SiOxNy, Ta
2O
5, SiO
2Any single or multiple film layer structure in the group that rete is formed.
8. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 1, wherein this spray nozzle sheet system is with the formed plastics spray nozzle sheet of method of spin coating.
9. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 1, wherein this spray nozzle sheet system is with the formed plastics spray nozzle sheet of pressing method.
10. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 1, wherein this spray nozzle sheet is with the formed metal spray nozzle sheet of plating mode.
11. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 10 wherein before etching this electric connection pad and this spray orifice, also is included in the step that forms a seed metal layer on this insulating barrier.
12. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 11, wherein this seed metal is selected from any single or multiple film layer structure in the group that Ta, Cr, Au, Ni, Al, Cu, Pd, Pt, Ti, Tiw rete formed.
13. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 1, wherein this substrate is a silicon substrate.
14. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 1, wherein this first protective layer is selected from SiC, SiNx, SiO
2, SiO
xN
yAny single or multiple film layer structure in the group that rete is formed.
15. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 1, a lower surface that more is included in this substrate forms the step of one second protective layer.
16. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 15, wherein this second protective layer is selected from SiC, SiN
x, SiO
2, SiO
xN
yAny single or multiple film layer structure in the group that rete is formed.
17. the manufacture method of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 1, wherein this insulating barrier is selected from SiN
x, SiC, SiO
xN
y, Ta
2O
5, SiO
2Any one single or multiple film layer structure of the group that rete is formed.
18. the structure of the integrated hot-bubble ink-jetting print head of single stone comprises at least:
One substrate, its front has a upper surface, and the back side has a lower surface, allow upper surface have several recessed ink channels, this ink channel and this substrate are level, its a lower surface then is formed with at least one ink and feeds groove, and this ink feeds rough this substrate of vertical perforation of groove and is connected with this ink channel and gives this ink channel in order to the supply ink;
One protective layer is coated on this substrate front side, and this ink channel is covered in down;
Several energy transfer mediums are formed on this planarization insulating layer, corresponding this ink channel of each this energy transfer medium;
One insulating barrier is coated on this protective layer and this energy transfer medium;
One spray nozzle sheet is formed on this insulating barrier, and
Several spray nozzle sheets; rough this spray nozzle sheet that vertically runs through, this insulating barrier and this protective layer, each this spray orifice is connected with corresponding this ink channel; with the pipeline that goes out as ink, the position of this spray orifice and this ink feeding groove is divided into the both sides of this energy transfer medium.
19. the structure of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 18, wherein this substrate is a silicon substrate.
20. the structure of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 18, wherein this ink channel and this ink feed groove and directly are formed at this substrate with etching mode.
21. the structure of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 18, wherein this spray nozzle sheet is the metal spray nozzle sheet.
22. the structure of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 18, wherein this spray nozzle sheet is the plastics spray nozzle sheet.
23. the structure of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 18 wherein is provided with a barrier structure that increases ink backflow impedance in each this ink channel, its position is between between this energy transfer medium and this ink feeding groove.
24. the structure of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 23, wherein this backflow resistance mark structure is the island resistance mark structure that is formed at the bottom of this ink channel.
25. the structure of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 23 should the backflow barrier structure be the neck shape barrier structure that is formed at this ink channel two side wherein.
26. the structure of the integrated hot-bubble ink-jetting print head of single stone as claimed in claim 18, wherein serve as reasons the thermal resistance rete of suitable layout and the electric heating energy transfer medium that lead is formed of this energy transfer medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011000287A CN1138637C (en) | 2001-01-04 | 2001-01-04 | Manufacture and structure of hot-bubble ink-jetting print head |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011000287A CN1138637C (en) | 2001-01-04 | 2001-01-04 | Manufacture and structure of hot-bubble ink-jetting print head |
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| CN1138637C true CN1138637C (en) | 2004-02-18 |
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| CN1317736C (en) * | 2003-08-14 | 2007-05-23 | 明基电通股份有限公司 | Method for preparing monolithic fluid spraying appratus |
| CN1314542C (en) * | 2003-10-21 | 2007-05-09 | 财团法人工业技术研究院 | Hydrojet chip structure |
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