CN113860753A - Glass hole opening method - Google Patents
Glass hole opening method Download PDFInfo
- Publication number
- CN113860753A CN113860753A CN202111149069.7A CN202111149069A CN113860753A CN 113860753 A CN113860753 A CN 113860753A CN 202111149069 A CN202111149069 A CN 202111149069A CN 113860753 A CN113860753 A CN 113860753A
- Authority
- CN
- China
- Prior art keywords
- glass
- hole
- preset
- etching
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
Abstract
The invention relates to a glass hole opening method. The method mainly forms a target hole on the surface of the glass by a method of matching laser drilling with alkaline solution etching. In the hole forming method, preset holes are formed in the glass through laser drilling to obtain preset glass, and hole position distribution meeting design requirements can be formed on the glass at the moment. And then, etching the preset glass by using an alkaline solution of a sodium hydroxide solution and/or a potassium hydroxide solution, wherein the alkaline solution can penetrate through the whole preset hole to etch the inner layer of the glass, and the etching degrees of different positions of the inner layer of the glass have good consistency, so that the straightness of the hole wall of the target hole can be effectively improved.
Description
Technical Field
The invention relates to the technical field of glass processing, in particular to a glass hole forming method.
Background
Silicon material is a common interposer material in the fabrication of three-dimensional integrated circuits. Through processing through holes or blind holes on a silicon material, and then filling conductors in the through holes, the conduction between chips and between wafers is realized. Silicon material has good properties as an interposer and has long been a large proportion of the material in the interposer. But as the frequency of circuit signals continues to increase, short plates of silicon material are also gradually emerging. In particular, in high frequency applications, carriers around the hole can move freely under the action of an electric field or a magnetic field, and influence on adjacent signals, so that the problem of high frequency loss is easily caused.
Because the silicon material has a certain short plate in high-frequency application, the trend of replacing the silicon material with glass is more obvious at present, the problem of high-frequency loss caused by the silicon material can be effectively avoided by replacing the silicon material with the glass, and the transmission stability of high-frequency signals is improved.
However, when the glass is perforated by conventional drilling or etching, the hole wall is less straight, which may adversely affect the signal transmission.
Disclosure of Invention
Accordingly, there is a need for a method of forming a hole in a glass that is effective in improving the straightness of the hole wall.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a method of forming a hole in glass, comprising the steps of:
forming a preset hole in the glass by laser drilling to obtain preset glass;
etching the preset glass by using an alkali solution to form a target hole by using the preset hole;
the alkali solution is at least one of a sodium hydroxide solution and a potassium hydroxide solution.
In one embodiment, the mass concentration of the alkali in the alkali solution is 50-75%.
In one embodiment, the temperature of the base solution is greater than or equal to 90 ℃.
In one embodiment, the etching treatment time is 90min to 300 min.
In one embodiment, the predetermined holes have a diameter of 2 μm to 5 μm.
In one embodiment, the predetermined glass is etched with an alkali solution under ultrasonic conditions.
In one embodiment, the ultrasonic frequency of the ultrasonic condition is 20KHz to 40 KHz.
In one embodiment, the predetermined holes are through holes or blind holes.
In one embodiment, the method further comprises the following steps after the preset glass is etched by using the alkali solution:
and carrying out ultrasonic cleaning treatment on the preset glass after the etching treatment.
In one embodiment, the pH value of the cleaning liquid after ultrasonic cleaning treatment is 7-9.
The glass hole forming method is mainly characterized in that a target hole is formed on the surface of glass by a method of matching laser drilling with alkaline solution etching. In the hole forming method, preset holes are formed in the glass through laser drilling to obtain preset glass, and hole position distribution meeting design requirements can be formed on the glass at the moment. And then, etching the preset glass by using an alkaline solution of a sodium hydroxide solution and/or a potassium hydroxide solution, wherein the alkaline solution can penetrate through the whole preset hole to etch the inner layer of the glass, and the etching degrees of different positions of the inner layer of the glass have good consistency, so that the straightness of the hole wall of the target hole can be effectively improved.
Drawings
FIG. 1 is a schematic cross-sectional view of a through-hole formed in glass in example 1 of the present invention;
FIG. 2 is a schematic cross-sectional view of a through-hole formed in glass in example 4 of the present invention;
FIG. 3 is a schematic cross-sectional view of a through-hole formed in glass in example 6 of the present invention;
FIG. 4 is a schematic view showing the measurement of a through hole formed in glass in example 6 of the present invention;
FIG. 5 is a schematic cross-sectional view of a through-hole formed in glass in comparative example 1 of the present invention;
FIG. 6 is a schematic sectional view of a through-hole formed in glass in comparative example 2 of the present invention;
FIG. 7 is a schematic view of a cross section and measurement of a through-hole formed in glass in comparative example 3 of the present invention;
FIG. 8 is a schematic view of a cross section and measurement of a through-hole formed in glass in comparative example 4 of the present invention;
FIG. 9 is a schematic view showing a cross section and measurement of a blind hole formed in glass in comparative example 5 of the present invention.
Detailed Description
The present invention will be described in detail with reference to the following embodiments in order to make the aforementioned objects, features and advantages of the invention more comprehensible. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
One embodiment of the invention provides a glass hole opening method. The glass hole opening method comprises the following steps: forming a preset hole in the glass by laser drilling to obtain preset glass; etching the preset glass by using an alkali solution to form a target hole by using the preset hole; the alkali solution is at least one of a sodium hydroxide solution and a potassium hydroxide solution.
In the hole forming method of the embodiment, the preset holes are formed in the glass through laser drilling, and at this time, hole site distribution meeting design requirements can be formed on the glass. And then, etching the preset glass by adopting an alkali solution, wherein the alkali solution can penetrate through the whole preset hole to etch the inner layer of the glass, and the etching degrees of different positions of the inner layer of the glass have good consistency, so that the straightness of the hole wall of the target hole can be effectively improved.
Further, when the preset glass is etched by using the alkali solution, the preset glass is immersed in the alkali solution for etching. Further, when the predetermined glass is immersed in the alkali solution, the predetermined hole to be etched is immersed in the alkali solution.
In the etching treatment of the hole-opening method in this embodiment, after the alkali solution enters the predetermined holes, silicate, such as sodium silicate (Na), is formed inside the glass2SiO3) Or potassium silicate (K)2SiO3) And then, transversely etching the hole wall of the preset hole by using the alkali solution to form uniform etching degree in the direction of expanding the hole diameter of the preset hole, so that the hole wall of the target hole has good straight degree.
In a specific example, the mass concentration of the alkali in the alkali solution is 50% to 75%. When the concentration of alkali in the alkali solution is too low, the etching temperature is too slow, and an effective etching effect is difficult to be quickly formed. When the mass concentration of alkali in the alkali solution is too high, the etching process is easy to be controlled, so that the problem of over-etching is caused, and the glass can be greatly influenced. Alternatively, the intermediate mass concentration of the alkaline solution is 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59%, 60%, 61%, 62%, 63%, 64%, 65%, 66%, 67%, 68%, 69%, 70%, 71%, 72%, 73%, 74%, or 75%. Optionally, the mass concentration of the alkali in the alkali solution is 50-70%.
Further, the temperature of the alkali solution is greater than or equal to 90 ℃. When the temperature of the alkali solution is lower than 90 ℃, the etching speed is too slow, and an effective etching effect is difficult to be rapidly formed. It is understood that, when the temperature of the alkali solution is controlled, the maximum temperature of the alkali solution is not higher than the boiling point of the alkali solution. That is, the alkali solution is controlled so as not to boil during the etching treatment. Optionally, the temperature of the alkaline solution is from 90 ℃ to 99 ℃. For example, the temperature of the alkaline solution can be, but is not limited to, 90 deg.C, 91 deg.C, 92 deg.C, 93 deg.C, 94 deg.C, 95 deg.C, 96 deg.C, 97 deg.C, 98 deg.C or 99 deg.C.
Furthermore, the time of the etching treatment is 90min to 300 min. It can be understood that, in the glass hole opening method of the present embodiment, when the predetermined glass is etched with the alkali solution, the etching time has a certain influence on the shape of the target hole and the shape of the glass. If the etching treatment time is too short, it is difficult to obtain a satisfactory etching effect, and if the etching effect is too long, there is a possibility that the glass is excessively etched, so that the aperture of the target hole is excessively large. And may result in excessive thinning of the glass. Optionally, the time of the etching treatment is 90min, 100min, 110min, 120min, 140min, 150min, 160min, 175min, 180min, 200min, 210min, 230min, 240min, 250min, 270min, or 300 min.
In a specific example, the predetermined pore has a pore diameter of 2 μm to 5 μm. Namely, laser drilling is adopted to form preset holes with the hole diameter of 2-5 mu m on the glass. For example, laser drilling is used to form a predetermined hole with a hole diameter of 2 μm in the glass, or laser drilling is used to form a predetermined hole with a hole diameter of 3 μm in the glass, or laser drilling is used to form a predetermined hole with a hole diameter of 4 μm in the glass, or laser drilling is used to form a predetermined hole with a hole diameter of 5 μm in the glass.
It is understood that when the preset holes are formed in the glass by laser drilling, the preset holes having a regular distribution can be formed as required. For example, a plurality of predetermined holes may be formed on the glass by laser drilling in an array or concentrically.
Alternatively, the laser drilling employs a picosecond laser or a femtosecond laser. Further, the laser drilling is single pulse laser drilling. The single-pulse laser has higher pulse energy, is easier to focus and not disperse, is more favorable for penetrating into the glass, and the formed preset holes are more uniform and have higher quality.
Further, the aperture of the target hole is 10 μm to 30 μm. The depth of the target hole is 0.1 mm-8 mm. When the method in the embodiment is adopted to open the holes in the glass, the target holes with high depth-diameter ratio can be obtained. For example, the pore size of the target pores may be, but is not limited to, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 22 μm, 25 μm, 28 μm, or 30 μm. The hole depth of the targeting hole can be, but is not limited to, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.8mm, 1mm, 1.2mm, 1.5mm, 1.8mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm, 5mm, 5.5mm, 6mm, 6.5mm, 7mm, 7.5mm, or 8 mm. It will be appreciated that the hole depth of the target hole may be adapted to the thickness of the glass, and when making the through hole, the hole depth is equal to the glass thickness. Furthermore, in this embodiment, target holes with small aperture can be obtained, and the hole density can reach 60000/cm by setting the target holes with 20 μm aperture and 20 μm spacing2The above.
In addition, when the conventional method is used to open holes in glass, for example, when the glass is provided with through holes, it is difficult to obtain through holes meeting the requirements in the conventional method when the thickness of the glass is large. For example, when the thickness of the glass is greater than 0.5mm, HF hardly invades into the glass when the conventional HF etching is adopted, and a through hole meeting the requirement is difficult to form, and the wall of the formed through hole has a large taper. When the hole opening method in the embodiment is adopted, the alkali solution can smoothly enter the glass, the etching texture of the transverse etching can be formed in the glass, and the through hole with the straight hole wall can be formed. In addition, when the traditional HF etching is adopted, etching lines are easy to be left on the surface of the glass, and the appearance of the glass product is adversely affected. When the hole opening method in the embodiment is adopted, the surface of the obtained glass product is smoother and smoother, and obvious etching grains cannot appear.
In a specific example, the predetermined glass is subjected to an etching treatment with an alkali solution under ultrasonic conditions. The alkaline solution is subjected to ultrasonic treatment, so that the discharge of reaction products after the alkaline solution reacts with the glass can be promoted, and the reaction products are prevented from remaining on the hole wall. Therefore, the smoothness of the hole wall can be improved on the basis of improving the straightness of the hole wall. Meanwhile, the reaction rate can be improved and the hole opening efficiency can be improved by carrying out ultrasonic treatment on the alkali solution.
Optionally, the ultrasonic frequency of the ultrasonic condition is 20KHz to 40 KHz. For example, the ultrasonic frequency of the ultrasonic treatment may be, but is not limited to, 20KHz, 22KHz, 25KHz, 28KHz, 30KHz, 32KHz, 35KHz, 38KHz, or 40 KHz. Further, the ultrasonic frequency of the ultrasonic treatment may be set according to the thickness of the glass and/or the hole depth of the target hole, and the thicker the glass and/or the deeper the hole depth of the target hole, the larger the ultrasonic frequency may be used.
Specifically, the ultrasonic treatment of the alkali solution comprises the following steps: the preset glass is placed in a container filled with an alkali solution, and the container is placed in an ultrasonic device for ultrasonic treatment.
In a specific example, the predetermined hole is a through hole or a blind hole. Through the glass hole forming method, through holes or blind holes can be formed in the surface of glass according to requirements, and diversified designs of the glass connecting plate can be well met.
In a specific example, the etching treatment of the predetermined glass with the alkali solution further comprises the following steps: and carrying out ultrasonic cleaning treatment on the preset glass after the etching treatment. Further, the pH value of the cleaning liquid subjected to ultrasonic cleaning treatment is 7-9. The alkalescent cleaning solution is adopted to be beneficial to improving the cleaning effect of ultrasonic cleaning.
Further, the ultrasonic cleaning treatment of the preset glass after the etching treatment further comprises the following steps: and cleaning the preset glass subjected to the ultrasonic cleaning treatment by using deionized water.
In a specific example, with regard to the selection of the alkali solution, when a sodium hydroxide solution and a potassium hydroxide solution are selected, a target well having a well wall straight to a high degree can be obtained. Except that when a potassium hydroxide solution was used as the alkali solution, the glass surface after opening the hole was slightly blue, and the color of the glass surface was different from that when sodium hydroxide was used as the alkali solution.
The following are specific examples.
Example 1
The thickness of the glass in this embodiment is 0.5mm, and through holes are formed in the glass in this embodiment.
The method for opening the hole in the glass comprises the following steps:
s101: and forming a preset hole on the glass by adopting laser drilling to obtain the preset glass. The laser drilling adopts a femtosecond laser, is single pulse laser drilling, and forms preset holes distributed in a matrix on the glass through the laser drilling. The preset holes are through holes. The aperture of the preset hole is 2-3 μm.
S102: the preset glass is placed in a container filled with alkali solution for etching treatment, and the container is placed in an ultrasonic device for ultrasonic treatment. Wherein the alkali solution is 50% sodium hydroxide solution, the temperature of the alkali solution is 95 ℃, the ultrasonic frequency of ultrasonic treatment is 20KHz, and the etching treatment is carried out for 240min under the ultrasonic action.
S103: and after the etching treatment, carrying out ultrasonic cleaning treatment on the glass subjected to the etching treatment to remove impurities remained on the surface and in the holes of the glass, wherein the pH value of the ultrasonic cleaning liquid is 7-9.
S104: and after ultrasonic cleaning treatment, deionized water cleaning is carried out on the glass, and the glass is cleaned.
Example 2
The thickness of the glass in this embodiment is 0.5mm, and through holes are formed in the glass in this embodiment.
The method for opening the hole in the glass comprises the following steps:
s101: and forming a preset hole on the glass by adopting laser drilling to obtain the preset glass. The laser drilling adopts a femtosecond laser, is single pulse laser drilling, and forms preset holes distributed in a matrix on the glass through the laser drilling. The preset holes are through holes. The aperture of the preset hole is 2-3 μm.
S102: the preset glass is placed in a container filled with alkali solution for etching treatment, and the container is placed in an ultrasonic device for ultrasonic treatment. Wherein the alkali solution is 60% sodium hydroxide solution, the temperature of the alkali solution is 95 ℃, the ultrasonic frequency of ultrasonic treatment is 20KHz, and the etching treatment is carried out for 210min under the ultrasonic action.
S103: and after the etching treatment, carrying out ultrasonic cleaning treatment on the glass subjected to the etching treatment to remove impurities remained on the surface and in the holes of the glass, wherein the pH value of the ultrasonic cleaning liquid is 7-9.
S104: and after ultrasonic cleaning treatment, deionized water cleaning is carried out on the glass, and the glass is cleaned.
Example 3
The thickness of the glass in this embodiment is 0.5mm, and through holes are formed in the glass in this embodiment.
The method for opening the hole in the glass comprises the following steps:
s101: and forming a preset hole on the glass by adopting laser drilling to obtain the preset glass. The laser drilling adopts a femtosecond laser, is single pulse laser drilling, and forms preset holes distributed in a matrix on the glass through the laser drilling. The preset holes are through holes. The aperture of the preset hole is 2-3 μm.
S102: the preset glass is placed in a container filled with alkali solution for etching treatment, and the container is placed in an ultrasonic device for ultrasonic treatment. Wherein the alkali solution is sodium hydroxide solution with mass concentration of 67%, the temperature of the alkali solution is 95 ℃, the ultrasonic frequency of ultrasonic treatment is 20KHz, and the etching treatment is carried out for 175min under the ultrasonic action.
S103: and after the etching treatment, carrying out ultrasonic cleaning treatment on the glass subjected to the etching treatment to remove impurities remained on the surface and in the holes of the glass, wherein the pH value of the ultrasonic cleaning liquid is 7-9.
S104: and after ultrasonic cleaning treatment, deionized water cleaning is carried out on the glass, and the glass is cleaned.
Example 4
The thickness of the glass in this embodiment is 0.5mm, and through holes are formed in the glass in this embodiment.
The method for opening the hole in the glass comprises the following steps:
s101: and forming a preset hole on the glass by adopting laser drilling to obtain the preset glass. The laser drilling adopts a femtosecond laser, is single pulse laser drilling, and forms preset holes distributed in a matrix on the glass through the laser drilling. The preset holes are through holes. The aperture of the preset hole is 2-3 μm.
S102: the preset glass is placed in a container filled with alkali solution for etching treatment, and the container is placed in an ultrasonic device for ultrasonic treatment. Wherein the alkali solution is 60% sodium hydroxide solution, the temperature of the alkali solution is 98 deg.C, the ultrasonic frequency of the ultrasonic treatment is 20KHz, and the etching treatment is carried out for 210min under the action of ultrasonic.
S103: and after the etching treatment, carrying out ultrasonic cleaning treatment on the glass subjected to the etching treatment to remove impurities remained on the surface and in the holes of the glass, wherein the pH value of the ultrasonic cleaning liquid is 7-9.
S104: and after ultrasonic cleaning treatment, deionized water cleaning is carried out on the glass, and the glass is cleaned.
Example 5
The thickness of the glass in this embodiment is 0.5mm, and through holes are formed in the glass in this embodiment.
The method for opening the hole in the glass comprises the following steps:
s101: and forming a preset hole on the glass by adopting laser drilling to obtain the preset glass. The laser drilling adopts a femtosecond laser, is single pulse laser drilling, and forms preset holes distributed in a matrix on the glass through the laser drilling. The preset holes are through holes. The aperture of the preset hole is 2-3 μm.
S102: the preset glass is placed in a container filled with alkali solution for etching treatment, and the container is placed in an ultrasonic device for ultrasonic treatment. Wherein the alkali solution is sodium hydroxide solution with mass concentration of 67%, the temperature of the alkali solution is 98 ℃, the ultrasonic frequency of ultrasonic treatment is 20KHz, and the etching treatment is carried out for 240min under the ultrasonic action.
S103: and after the etching treatment, carrying out ultrasonic cleaning treatment on the glass subjected to the etching treatment to remove impurities remained on the surface and in the holes of the glass, wherein the pH value of the ultrasonic cleaning liquid is 7-9.
S104: and after ultrasonic cleaning treatment, deionized water cleaning is carried out on the glass, and the glass is cleaned.
Example 6
The thickness of the glass in this embodiment is 0.5mm, and through holes are formed in the glass in this embodiment.
The method for opening the hole in the glass comprises the following steps:
s101: and forming a preset hole on the glass by adopting laser drilling to obtain the preset glass. The laser drilling adopts a femtosecond laser, is single pulse laser drilling, and forms preset holes distributed in a matrix on the glass through the laser drilling. The preset holes are through holes. The aperture of the preset hole is 2-3 μm.
S102: the preset glass is placed in a container filled with alkali solution for etching treatment, and the container is placed in an ultrasonic device for ultrasonic treatment. Wherein the alkali solution is sodium hydroxide solution with mass concentration of 67%, the temperature of the alkali solution is 98 ℃, the ultrasonic frequency of ultrasonic treatment is 20KHz, and the etching treatment is carried out for 300min under the ultrasonic action.
S103: and after the etching treatment, carrying out ultrasonic cleaning treatment on the glass subjected to the etching treatment to remove impurities remained on the surface and in the holes of the glass, wherein the pH value of the ultrasonic cleaning liquid is 7-9.
S104: and after ultrasonic cleaning treatment, deionized water cleaning is carried out on the glass, and the glass is cleaned.
Comparative example 1
The thickness of the glass in this comparative example was 0.5mm, and through holes were formed in the glass in this example.
The method for opening the hole in the glass comprises the following steps:
s101: and forming a preset hole on the glass by adopting laser drilling to obtain the preset glass. The laser drilling adopts a femtosecond laser, is single pulse laser drilling, and forms preset holes distributed in a matrix on the glass through the laser drilling. The preset holes are through holes. The aperture of the preset hole is 2-3 μm.
S102: the preset glass is placed in a container filled with alkali solution for etching treatment, and the container is placed in an ultrasonic device for ultrasonic treatment. Wherein the alkali solution is 50% sodium hydroxide solution, the temperature of the alkali solution is 50 ℃, the ultrasonic frequency of ultrasonic treatment is 20KHz, and the etching treatment is carried out for 300min under the ultrasonic action.
S103: and after the etching treatment, carrying out ultrasonic cleaning treatment on the glass subjected to the etching treatment to remove impurities remained on the surface and in the holes of the glass, wherein the pH value of the ultrasonic cleaning liquid is 7-9.
S104: and after ultrasonic cleaning treatment, deionized water cleaning is carried out on the glass, and the glass is cleaned.
Comparative example 2
The thickness of the glass in this comparative example was 0.5mm, and through holes were formed in the glass in this example.
The method for opening the hole in the glass comprises the following steps:
s101: and forming a preset hole on the glass by adopting laser drilling to obtain the preset glass. The laser drilling adopts a femtosecond laser, is single pulse laser drilling, and forms preset holes distributed in a matrix on the glass through the laser drilling. The preset holes are through holes. The aperture of the preset hole is 2-3 μm.
S102: the preset glass is placed in a container filled with alkali solution for etching treatment, and the container is placed in an ultrasonic device for ultrasonic treatment. Wherein the alkali solution is 60% sodium hydroxide solution, the temperature of the alkali solution is 95 ℃, the ultrasonic frequency of ultrasonic treatment is 20KHz, and the etching treatment is carried out for 80min under the ultrasonic action.
S103: and after the etching treatment, carrying out ultrasonic cleaning treatment on the glass subjected to the etching treatment to remove impurities remained on the surface and in the holes of the glass, wherein the pH value of the ultrasonic cleaning liquid is 7-9.
S104: and after ultrasonic cleaning treatment, deionized water cleaning is carried out on the glass, and the glass is cleaned.
Comparative example 3
The thickness of the glass in this comparative example was 0.5mm, and through holes were formed in the glass in this example.
The method for opening the hole in the glass comprises the following steps:
s101: and forming a preset hole on the glass by adopting laser drilling to obtain the preset glass. The laser drilling adopts a femtosecond laser, is single pulse laser drilling, and forms preset holes distributed in a matrix on the glass through the laser drilling. The preset holes are through holes.
S102: will preserve the glassPlacing the container in a container filled with acidic etching solution for etching treatment, and placing the container in an ultrasonic device for ultrasonic treatment. Wherein the mass concentration of HF in the acidic etching solution is 1.8%, and NH4The mass concentration of F is 0.5%, the temperature of the acid etching solution is 35 ℃, the ultrasonic frequency of ultrasonic treatment is 20KHz, and etching treatment is carried out for 18min under the ultrasonic action.
S103: and after the etching treatment, carrying out ultrasonic cleaning treatment on the glass subjected to the etching treatment to remove impurities remained on the surface and in the holes of the glass, wherein the pH value of the ultrasonic cleaning liquid is 8-10.
S104: and after ultrasonic cleaning treatment, deionized water cleaning is carried out on the glass, and the glass is cleaned.
Comparative example 4
The thickness of the glass in this comparative example was 0.5mm, and through holes were formed in the glass in this example.
The method for opening the hole in the glass comprises the following steps:
s101: and forming a preset hole on the glass by adopting laser drilling to obtain the preset glass. The laser drilling adopts a femtosecond laser, is single pulse laser drilling, and forms preset holes distributed in a matrix on the glass through the laser drilling. The preset holes are through holes.
S102: and (3) placing the preset glass in a container filled with an acidic etching solution for etching treatment, and placing the container in ultrasonic equipment for ultrasonic treatment. Wherein the mass concentration of HF in the acidic etching solution is 2.1 percent and NH is added4The mass concentration of F is 0.7%, the temperature of the acid etching solution is 35 ℃, the ultrasonic frequency of ultrasonic treatment is 20KHz, and etching treatment is carried out for 20min under the action of ultrasonic.
S103: and after the etching treatment, carrying out ultrasonic cleaning treatment on the glass subjected to the etching treatment to remove impurities remained on the surface and in the holes of the glass, wherein the pH value of the ultrasonic cleaning liquid is 8-10.
Comparative example 5
The difference from comparative example 3 is that, in the etching treatment, one surface of the glass was sealed with an acid-resistant protective oil, and only one surface was etched to form a single-tapered through hole.
Test example
The cross section and the hole diameter of the through hole were measured by using a kiren VK laser microscope for the glass treated in examples 1 to 6 and comparative examples 1 to 5. Wherein, a schematic cross-sectional view of a through-hole formed on glass in example 1 is shown in fig. 1, a schematic cross-sectional view of a through-hole formed on glass in example 4 is shown in fig. 2, a schematic cross-sectional view of a through-hole formed on glass in example 6 is shown in fig. 3, a schematic measurement view of a through-hole formed on glass in example 6 is shown in fig. 4, a schematic cross-sectional view of a through-hole formed on glass in comparative example 1 is shown in fig. 5, a schematic cross-sectional view of a through-hole formed on glass in comparative example 2 is shown in fig. 6, a schematic cross-sectional view and a schematic measurement view of a through-hole formed on glass in comparative example 3 is shown in fig. 7, a schematic cross-sectional view and a schematic measurement view of a through-hole formed on glass in comparative example 4 is shown in fig. 8, and a schematic cross-sectional view and a schematic measurement view of a single-tapered through-hole formed on glass in comparative example 5 is shown in fig. 9.
The pore diameters of the through holes in examples 1 to 6 and comparative examples 1 to 5 are shown in the following table.
As can be seen from fig. 1 to 9, the through holes formed in examples 1, 4 and 6 are less straight and have a significant taper compared to comparative examples 3 to 5. Meanwhile, the aperture of the through holes in the embodiments 1 to 6 is obviously smaller than that in the comparative examples 3 to 5. In addition, as can be seen from fig. 7 and 8, the glass surfaces of comparative example 3 and comparative example 4 had relatively marked grinding marks and had inferior surface smoothness to examples 1, 4 and 6.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims, and the description and the drawings can be used for explaining the contents of the claims.
Claims (10)
1. A glass hole opening method is characterized by comprising the following steps:
forming a preset hole in the glass by laser drilling to obtain preset glass;
etching the preset glass by using an alkali solution to form a target hole by using the preset hole;
the alkali solution is at least one of a sodium hydroxide solution and a potassium hydroxide solution.
2. The method of claim 1, wherein the alkali concentration in the alkali solution is between 50% and 75% by mass.
3. The method of claim 1, wherein the temperature of the alkali solution is greater than or equal to 90 ℃.
4. The method of claim 1, wherein the etching process is performed for a time period of 90min to 300 min.
5. The glass tapping method according to any one of claims 1 to 4, wherein the predetermined holes have a hole diameter of 2 μm to 5 μm.
6. The glass tapping method according to any one of claims 1 to 4, wherein the predetermined glass is subjected to an etching treatment with an alkali solution under ultrasonic conditions.
7. The glass tapping method of claim 6 wherein said ultrasonic conditions have an ultrasonic frequency of 20KHz to 40 KHz.
8. The glass tapping method according to any one of claims 1 to 4 wherein the predetermined holes are through holes or blind holes.
9. The method of any of claims 1 to 4, further comprising, after etching the predetermined glass with the alkali solution:
and carrying out ultrasonic cleaning treatment on the preset glass after the etching treatment.
10. The glass pore opening method according to claim 9, wherein the pH of the cleaning liquid of the ultrasonic cleaning treatment is 7 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111149069.7A CN113860753A (en) | 2021-09-29 | 2021-09-29 | Glass hole opening method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111149069.7A CN113860753A (en) | 2021-09-29 | 2021-09-29 | Glass hole opening method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113860753A true CN113860753A (en) | 2021-12-31 |
Family
ID=78992441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111149069.7A Pending CN113860753A (en) | 2021-09-29 | 2021-09-29 | Glass hole opening method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113860753A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114671623A (en) * | 2022-03-28 | 2022-06-28 | 广东工业大学 | Method for processing TGVs with different apertures on single panel and etching device thereof |
| CN114702246A (en) * | 2022-04-29 | 2022-07-05 | 广东工业大学 | Method and system for processing glass hole based on magnetic field and ultrasonic pulse in cooperation and application |
| WO2024068290A1 (en) * | 2022-09-27 | 2024-04-04 | Schott Ag | Glass wafer and method for producing same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019055888A (en) * | 2017-09-20 | 2019-04-11 | 日本電気硝子株式会社 | Glass substrate for laser assisted etching, and method for manufacturing perforated glass substrate using same |
| WO2020149040A1 (en) * | 2019-01-17 | 2020-07-23 | 日本板硝子株式会社 | Microstructured glass substrate and method for manufacturing microstructured glass substrate |
| CN112375570A (en) * | 2020-11-09 | 2021-02-19 | 泰极微技术(无锡)有限公司 | Etching solution for etching through hole or depression on substrate and preparation method and application thereof |
| CN113045209A (en) * | 2021-03-02 | 2021-06-29 | 广东芯华微电子技术有限公司 | Glass through hole machining method |
-
2021
- 2021-09-29 CN CN202111149069.7A patent/CN113860753A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019055888A (en) * | 2017-09-20 | 2019-04-11 | 日本電気硝子株式会社 | Glass substrate for laser assisted etching, and method for manufacturing perforated glass substrate using same |
| WO2020149040A1 (en) * | 2019-01-17 | 2020-07-23 | 日本板硝子株式会社 | Microstructured glass substrate and method for manufacturing microstructured glass substrate |
| CN112375570A (en) * | 2020-11-09 | 2021-02-19 | 泰极微技术(无锡)有限公司 | Etching solution for etching through hole or depression on substrate and preparation method and application thereof |
| CN113045209A (en) * | 2021-03-02 | 2021-06-29 | 广东芯华微电子技术有限公司 | Glass through hole machining method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114671623A (en) * | 2022-03-28 | 2022-06-28 | 广东工业大学 | Method for processing TGVs with different apertures on single panel and etching device thereof |
| CN114702246A (en) * | 2022-04-29 | 2022-07-05 | 广东工业大学 | Method and system for processing glass hole based on magnetic field and ultrasonic pulse in cooperation and application |
| WO2024068290A1 (en) * | 2022-09-27 | 2024-04-04 | Schott Ag | Glass wafer and method for producing same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113860753A (en) | Glass hole opening method | |
| EP3510002B1 (en) | Articles having holes with morphology attributes and methods for fabricating the same | |
| CN103237771B (en) | The method forming high density hole array in glass | |
| KR102157750B1 (en) | Methods of fabricating glass articles by laser damage and etching | |
| EP3049213A1 (en) | Methods for forming vias in glass substrates | |
| WO2016137488A1 (en) | Methods of fabricating channels in glass articles by laser damage and etching and articles made therefrom | |
| CN113045209A (en) | Glass through hole machining method | |
| CN101722367A (en) | Method for drilling holes on printed circuit board | |
| CN110446350A (en) | A method of making filling holes with resin on PCB | |
| CN105934097A (en) | Method for processing semi-hole plate | |
| CN105208781A (en) | Etching method for external layer of thick copper plate | |
| CN112375570B (en) | Etching solution for etching through hole or depression on substrate and preparation method and application thereof | |
| CN105887206B (en) | Monocrystalline silicon wire cutting fragment cleaning treatment method | |
| CN110586568A (en) | Cleaning method for sapphire substrate slice after grinding of boron carbide | |
| CN103522732A (en) | Semi-submerged etching laser plate making method | |
| CN105188282B (en) | The heavy copper manufacture craft of high aspect ratio pcb board | |
| CN113766747A (en) | PCB (printed Circuit Board) micro-etching process for fine circuit and circuit board | |
| CN106507591B (en) | Foreign matter processing method in a kind of gong half bore hole | |
| CN105407646A (en) | Process for improving residual copper of stepped groove | |
| JP2009105242A (en) | Method of manufacturing electrode foil for electrolytic capacitor | |
| CN113441836A (en) | Base material with high surface binding force and preparation method thereof | |
| CN114650656A (en) | Method for manufacturing printed circuit board with step groove | |
| CN103639914A (en) | Superhard grinding tool and manufacturing method thereof | |
| CN108601246A (en) | The production method that high-frequency microwave prints HDI wiring boards | |
| CN117817136A (en) | Micro-groove processing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 437300 Zhonghuo Optical Valley Industrial Park, Chibi Economic Development Zone, Xianning City, Hubei Province Applicant after: Weidali Technology Co.,Ltd. Applicant after: Wanjin Industrial (Chibi) Co.,Ltd. Address before: 437300 Zhonghuo Optical Valley Industrial Park, Chibi Economic Development Zone, Xianning City, Hubei Province Applicant before: WEIDALI INDUSTRY (CHIBI) CO.,LTD. Applicant before: Wanjin Industrial (Chibi) Co.,Ltd. |
|
| CB02 | Change of applicant information |