CN113856985A - Vacuum glue pouring device - Google Patents

Vacuum glue pouring device Download PDF

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Publication number
CN113856985A
CN113856985A CN202111165491.1A CN202111165491A CN113856985A CN 113856985 A CN113856985 A CN 113856985A CN 202111165491 A CN202111165491 A CN 202111165491A CN 113856985 A CN113856985 A CN 113856985A
Authority
CN
China
Prior art keywords
encapsulating
pump body
vacuum
glue
glue filling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111165491.1A
Other languages
Chinese (zh)
Inventor
王坤
郁晋军
张寅�
董欣
马建
刘敏强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hefei Yuchi Vacuum Technology Co ltd
Original Assignee
Hefei Yuchi Vacuum Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hefei Yuchi Vacuum Technology Co ltd filed Critical Hefei Yuchi Vacuum Technology Co ltd
Priority to CN202111165491.1A priority Critical patent/CN113856985A/en
Publication of CN113856985A publication Critical patent/CN113856985A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/002Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02Means for manipulating or holding work, e.g. for separate articles for particular articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C15/00Enclosures for apparatus; Booths

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  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)

Abstract

The utility model relates to a vacuum glue filling device, which comprises a glue filling platform, a glue filling pressure ring and a glue filling mandrel; the vacuum glue filling platform is provided with a vacuum glue filling chamber and a vacuum pump, the vacuum pump is used for vacuumizing the vacuum glue filling chamber, a supporting bottom plate is arranged at the bottom of the vacuum glue filling chamber, and the supporting bottom plate is used for placing a pump body to be filled with glue; the encapsulating clamping ring sets up the top of the pump body, the encapsulating dabber wears to establish the bottom of the pump body, the encapsulating clamping ring the encapsulating dabber with the pump body mutually supports and forms the encapsulating space. The utility model provides a vacuum encapsulating device assembles encapsulating clamping ring and encapsulating dabber to the pump body through setting up the encapsulating dabber before the pump body carries out the encapsulating to predetermine the encapsulating space of the pump body, after the encapsulating is accomplished will encapsulating clamping ring and encapsulating dabber carry out the drawing of patterns can, improved encapsulating efficiency, shortened the encapsulating time, guaranteed the homogeneity of encapsulating.

Description

Vacuum glue pouring device
Technical Field
The utility model relates to a encapsulating technical field especially relates to a vacuum encapsulating device.
Background
The vacuum glue-pouring machine is also called AB glue-pouring machine, and is an automatic machine specially used for controlling the glue and dripping, covering and encapsulating the glue on the surface of the product or in the product, and can improve the insulation grade, waterproof grade, electric property and mechanical property of the product and reduce the temperature rise. The vacuum glue-pouring machine is an improvement on the basis of a common glue-pouring machine, particularly, air is pumped in a pipeline pump body to prevent foaming, and the vacuum glue-pouring machine is mainly applied to industries such as automobile manufacturing, motor coil glue-pouring, capacitor glue-pouring and the like.
The prior art mainly is that parts such as stators that need the encapsulating through artifical or equipment encapsulating, assembly again after the drawing of patterns, it is consuming time hard, embedment inefficiency, and the embedment uniformity is difficult for guaranteeing, can cause the influence to follow-up assembly.
Disclosure of Invention
In order to solve the technical problem or at least partially solve the technical problem, the present disclosure provides a vacuum glue filling device.
The utility model provides a vacuum glue filling device, which comprises a glue filling platform, a glue filling pressure ring and a glue filling mandrel;
the vacuum glue filling platform is provided with a vacuum glue filling chamber and a vacuum pump, the vacuum pump is used for vacuumizing the vacuum glue filling chamber, a supporting bottom plate is arranged at the bottom of the vacuum glue filling chamber, and the supporting bottom plate is used for placing a pump body to be filled with glue;
the encapsulating clamping ring sets up the top of the pump body, the encapsulating dabber wears to establish the bottom of the pump body, the encapsulating clamping ring the encapsulating dabber with the pump body mutually supports and forms the encapsulating space.
Optionally, the glue filling mandrel comprises a mandrel main body and an end cover;
the end cover is arranged at the end part of the mandrel main body, the mandrel main body extends into the shaft hole of the pump body, the end cover is positioned on the end surface of the bottom of the pump body, a fixing hole is formed in the end cover, and the glue pouring mandrel is fixed on the pump body through the fixing hole by a bolt; the one end that the fixed orifices kept away from the pump body is equipped with the concave station, the encapsulating dabber is fixed back on the pump body, the head of bolt stretches into completely the concave station.
Optionally, the pump body includes a housing, a magnetic bearing, a spacer ring, a motor stator, and a radial transmission spacer ring;
the magnetic bearing, the spacer ring, the motor stator and the radial transmission spacer ring are all arranged in the glue filling space and are connected with each other through glue filled.
Optionally, the end cover is further provided with a threaded hole, and the threaded hole corresponds to the end face of the bottom of the pump body; and after the glue filling is finished, the demoulding bolt is matched with the threaded hole, so that the glue filling mandrel is separated from the pump body.
Optionally, the end cover orientation dabber main part one side is equipped with annular positioning groove, annular positioning groove is the loop configuration, pump body terminal surface is located in the annular positioning groove, still be equipped with sealed the pad on the annular positioning groove.
Optionally, the vacuum glue filling device further comprises an avoiding pipe, wherein the end cover faces one side of the mandrel main body and is provided with an avoiding hole, the avoiding pipe penetrates through the inner cavity of the pump body and is inserted into the avoiding hole, a threading channel is reserved for the pump body, and the avoiding hole is formed in the inner side of the annular positioning groove.
Optionally, the number of the fixing holes and the number of the threaded holes are multiple, and the fixing holes and the threaded holes are arranged at intervals.
Optionally, the bottom of the end cover is further provided with a positioning hole, the supporting base plate is provided with a plurality of positioning columns matched with the positioning hole, the positioning columns are arranged at intervals, and the distance between the positioning columns is larger than the outer diameter of the pump body, so that the plurality of pump bodies are arranged on the supporting base plate at the same time.
Optionally, the vacuum glue filling chamber includes two supports that set up relatively, two the support sets up supporting baseplate's both sides, two be equipped with the connecting rod between the support, the connecting rod slidable sets up on the support, and encapsulating mouth slidable sets up on the connecting rod.
Optionally, a slide rail and a driving unit are arranged on the glue filling platform, the supporting base plate is slidably arranged on the slide rail and can slide to the outside of the vacuum glue filling chamber, and the driving unit drives the supporting base plate to slide on the slide rail.
Compared with the prior art, the technical scheme provided by the embodiment of the disclosure has the following advantages:
the utility model provides a vacuum encapsulating device assembles encapsulating clamping ring and encapsulating dabber to the pump body through setting up the encapsulating dabber before the pump body carries out the encapsulating to predetermine the encapsulating space of the pump body, after the encapsulating is accomplished will encapsulating clamping ring and encapsulating dabber carry out the drawing of patterns can, improved encapsulating efficiency, shortened the encapsulating time, guaranteed the homogeneity of encapsulating.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic structural view of a vacuum glue pouring device according to an embodiment of the disclosure;
fig. 2 is a schematic structural view of the potting adhesive mandrel and the potting adhesive compression ring according to the embodiment of the present disclosure when the potting adhesive mandrel and the potting adhesive compression ring are mounted on a pump body;
fig. 3 is a schematic structural view of the bottom of an end cover of the glue filling mandrel according to the embodiment of the disclosure;
FIG. 4 is a side view of the glue mandrel and the glue collar of the embodiment of the present disclosure as mounted on a pump body;
FIG. 5 is a cross-sectional view of the glue filling mandrel and the glue filling compression ring installed on the pump body according to the embodiment of the present disclosure;
FIG. 6 is an enlarged view of FIG. 5 at A in accordance with an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a fixing hole on the glue filling mandrel in the position B in fig. 3 according to the embodiment of the disclosure.
10, a glue pouring platform; 11. a vacuum glue filling chamber; 111. a support; 112. a connecting rod; 113. pouring a glue opening; 12. a support base plate; 121. a positioning column; 13. a slide rail; 20. filling glue and pressing a ring; 30. a glue filling mandrel; 31. a mandrel body; 32. an end cap; 321. a fixing hole; 322. a concave platform; 323. a threaded hole; 324. an annular positioning groove; 325. a gasket; 326. avoiding holes; 327. positioning holes; 40. a pump body; 41. a housing; 42. a magnetic bearing; 43. a spacer ring; 44. a motor stator; 45. a radial transmission spacer ring; 50. an avoidance tube.
Detailed Description
In order that the above objects, features and advantages of the present disclosure may be more clearly understood, aspects of the present disclosure will be further described below. It should be noted that the embodiments and features of the embodiments of the present disclosure may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may be practiced in other ways than those described herein; it is to be understood that the embodiments disclosed in the specification are only a few embodiments of the present disclosure, and not all embodiments.
In this embodiment, a molecular pump is exemplified, and in other embodiments, other pump devices may be used.
The present disclosure provides a vacuum glue filling device, as shown in fig. 1-6, including a glue filling platform 10, a glue filling compression ring 20 and a glue filling mandrel 30, wherein the glue filling platform 10 is provided with a vacuum glue filling chamber 11 and a vacuum pump (not shown in the figure), the vacuum pump is used for evacuating the vacuum glue filling chamber 11, the bottom of the vacuum glue filling chamber 11 is provided with a supporting bottom plate 12, and the supporting bottom plate 12 is used for placing a pump body 40 to be filled with glue.
As shown in fig. 1, the vacuum pump may be specifically disposed in the accommodating box at the lower portion of the glue filling platform 10, so that the space structure of the glue filling platform 10 is fully utilized, and the glue filling platform 10 occupies a smaller space and has a more beautiful appearance. The specific type and size of the vacuum pump can be set according to actual needs, and this embodiment is not particularly limited.
The glue filling press ring 20 is arranged at the top of the pump body 40, the glue filling mandrel 30 is arranged at the bottom of the pump body 40, the glue filling press ring 20 and the glue filling mandrel 30 form axial positioning for the pump body 40, and the glue filling press ring 20, the glue filling mandrel 30 and the pump body 40 are matched with each other to form a glue filling space.
As shown in fig. 5, the pump body 40 includes a housing 41, a magnetic bearing 42, a spacer 43, a motor stator 44, and a radial transmission spacer 45, wherein the housing 41 is a cylindrical structure with openings at both ends, and fixing holes 321 are disposed on both upper and lower end surfaces of the housing 41. Before the glue filling, the magnetic bearing 42, the spacer ring 43, the motor stator 44 and the radial transmission spacer ring 45 are assembled into the shell 41 according to the actual structure of the molecular pump, and then the glue filling pressure ring 20 and the glue filling mandrel 30 are fixed on the pump body 40. At this time, the magnetic bearing 42, the spacer ring 43, the motor stator 44 and the radial transmission spacer ring 45 are located in a glue filling space formed by the glue filling pressure ring 20, the glue filling mandrel 30 and the pump body 40, then glue filling is performed, and demoulding is performed on the glue filling pressure ring 20 and the glue filling mandrel 30 after the glue filling is completed. At this time, the magnetic bearing 42, the spacer 43, the motor stator 44, and the radial spacer 45 are connected to each other by the filled rubber. Therefore, the process of assembling and then pouring the glue is realized, the components such as the disposable glue pouring magnetic bearing 42, the spacer ring 43, the motor stator 44 and the radial transmission spacer ring 45 are adopted, the subsequent assembly is not influenced after the glue pouring, the glue pouring efficiency is improved, the glue pouring time is shortened, and the subsequent assembly is not influenced.
The utility model provides a vacuum encapsulating device assembles encapsulating clamping ring 20 and encapsulating dabber 30 on the pump body 40 through setting up encapsulating dabber 30 before the pump body 40 carries out the encapsulating to predetermine the encapsulating space of pump body 40, after the encapsulating is accomplished with encapsulating clamping ring 20 and encapsulating dabber 30 the drawing of patterns can, improved encapsulating efficiency, shortened the encapsulating time, guaranteed the homogeneity of encapsulating.
Further, a through hole matched with the fixing hole of the upper end face of the casing 41 is formed in the glue filling pressure ring 20, a bolt (not shown in the figure) penetrates through the through hole to be fixed to the fixing hole, the glue filling pressure ring 20 is fixed to the upper end face of the casing 41 through the bolt, and meanwhile, components inside the casing 41 can be compressed and fixed. Through mutually supporting of encapsulating clamping ring 20 and encapsulating dabber 30, make the inside subassembly of pump body 40 fix, also restricted the position of encapsulating simultaneously, make pump body 40 carry out the encapsulating in predetermined position.
Optionally, the glue filling mandrel 30 has a T-shaped structure, the glue filling mandrel 30 includes a mandrel main body 31 and an end cover 32, the end cover 32 has a disc-shaped structure, the mandrel main body 31 has a cylindrical structure, and the diameter of the mandrel main body 31 is smaller than the inner diameter of the magnetic bearing 42, so that the magnetic bearing 42 can be inserted into the mandrel main body 31, and the size of the diameter of the specific mandrel main body 31 can be determined according to the actual glue filling requirement. After the glue filling mandrel 30 is installed at the bottom of the pump body 40, the mandrel body 31 extends into the pump body 40 and extends to the upper end of the casing 41, and the end cover 32 abuts against the end face of the bottom of the casing 41.
The end cap 32 is provided with a fixing hole 321, the end face of the bottom of the housing 41 is provided with a hole matching with the fixing hole 321, and the end cap 32 is fixed on the end face of the bottom of the housing 41 by passing a bolt through the fixing hole 321, so as to fix the glue filling mandrel 30 on the housing 41.
Further, as shown in fig. 7, a concave 322 is disposed on a side of the fixing hole 321 away from the pump body 40, and after the bolt is fixed in the fixing hole 321, the bolt head is completely located in the concave 322, so that flatness of the side of the end cover 32 away from the pump body 40 is ensured, and after the pump body 40 is placed on the supporting bottom plate 12, the pump body 40 can be in a horizontal and stable state, so that a subsequent glue filling procedure can be performed normally.
The specific shape of the concave platform 322 can be determined according to the shape of the bolt head, and when the bolt head is round, the concave platform 322 is a round concave platform 322; when the bolt head is hexagonal, the recess 322 is also a hexagonal recess 322. In this embodiment, the bolt head is circular, so the recess 322 is a circular recess 322.
Preferably, as shown in fig. 3, the number of the fixing holes 321 is multiple, the fixing holes 321 are arranged at annular intervals, holes corresponding to the fixing holes 321 are formed in the lower end surface of the casing 41 one to one, and by arranging the fixing holes 321, the sealing performance between the pouring mandrel and the casing 41 is ensured, the leakage of the glue in the glue pouring process is prevented, and meanwhile, the inside of the pump body 40 can have a higher vacuum degree.
Furthermore, the end cap 32 is further provided with a threaded hole 323, and the threaded hole 323 corresponds to an end surface of the housing 41. When the pump body 40 needs to be demolded after the potting process is finished, the potting core shaft 30 is separated from the pump body 40, and at the moment, the demolding bolt (not shown in the figure) is matched with the threaded hole 323, so that the demolding bolt continuously rotates in the threaded hole 323, thrust is applied to the end face of the shell 41, and the potting core shaft 30 is gradually separated from the contact with the pump body 40.
Further, the threaded holes 323 are provided in plural numbers, and the plural threaded holes 323 are provided at annular intervals on the end face. When demolding is needed, the demolding bolts are arranged in the threaded holes 323 respectively, and are pushed to move towards the shell 41 continuously, so that demolding speed can be increased, and damage to the mold body in the demolding process due to uneven force application can be prevented.
Further, as shown in fig. 6, an annular positioning groove 324 is formed in one side, facing the mandrel main body 31, of the end cover 32, the annular positioning groove 324 is used for being matched with the lower end face of the casing 41, so that the lower end face is located in the annular positioning groove 324, a sealing gasket 325 is further arranged at the bottom of the annular positioning groove 324, and the sealing gasket 325 is of an annular structure, so that the space between the casing 41 and the glue filling mandrel 30 is sealed, the lower end face of the inner cavity of the pump body 40 is in a sealing state through sealing, and the vacuum pumping of the body is facilitated.
As shown in fig. 2 or fig. 4, the vacuum glue-pouring device further includes an avoiding tube 50, one end of the avoiding tube 50 is open, and the other end is in a sealed state. The end cover 32 is provided with an avoiding hole 326 on one side facing the mandrel main body 31, the avoiding hole 326 is located on the inner side of the annular positioning groove 324, the avoiding hole 326 is a blind hole, and the inner diameter of the avoiding hole 326 is larger than the outer diameter of the avoiding pipe 50. As shown in fig. 5, when the vacuum glue filling is performed, the avoiding pipe 50 penetrates the housing 41 from the upper end of the pump body 40 to insert the sealed end into the avoiding hole 326, and the other end is located at the opening at the upper end of the pump body 40, so as to avoid the upper opening of the avoiding pipe 50 during the glue filling, and prevent the glue from entering the avoiding pipe 50 from the upper opening of the avoiding pipe 50, thereby reserving a threading channel for the pump body 40 and providing an installation space for the subsequent assembly of the pump body 40. One end of the avoiding pipe 50 inserted into the avoiding hole 326 is set to be a sealing structure to prevent the glue from entering the avoiding pipe 50 in the glue filling process.
Preferably, in order to facilitate the subsequent demolding of the avoiding tube 50, the avoiding tube 50 may be set to be a tapered structure, one end of the avoiding tube 50 sealed is the end with the smaller diameter, and the other end is the end with the larger diameter.
Preferably, the bottom of the end cover 32 is further provided with two positioning holes 327 on a side away from the mandrel main body 31, in this embodiment, a connecting line between the two positioning holes 327 passes through the center of the end cover 32, and rectangles of the positioning holes 327 away from the center of the end cover 32 are equal.
In other embodiments, the number of the positioning holes 327 may be set to be 1 or more than two, which is determined according to actual requirements.
The supporting base plate 12 is provided with a positioning post 121 matching with the positioning hole 327, and when the pump body 40 is placed on the supporting base plate 12 of the vacuum infusion chamber after being assembled, the positioning post 121 is inserted into the positioning hole 327 of the end cap 32, so that the pump body 40 is positioned to a predetermined position.
Can place a plurality of pump bodies 40 simultaneously on the supporting baseplate 12 in this embodiment, the reference column 121 on the supporting baseplate 12 sets up quantity also for the multiunit, and multiunit reference column 121 interval sets up, and the distance between the multiunit reference column 121 is greater than the external diameter of the pump body 40 to can not take place mutual interference when making a plurality of pump bodies 40 place on supporting baseplate 12, the influence is put. The vacuum glue filling chamber 11 can fill a plurality of pump bodies 40 with glue at a time. In the embodiment, the single plate is provided with 9 groups of positions, the positions are divided into 3 rows, and each row is provided with three groups, so that the pump groups are arranged in a nine-grid form, and the vacuum glue filling chamber 11 is convenient to fill glue into the pump groups.
Furthermore, the vacuum glue filling chamber 11 is of a transparent structure, and an operator can observe and control the glue filling state in the vacuum glue filling chamber 11 at any time. One side of the vacuum glue filling chamber 11 is provided with a placing opening, a cover plate capable of being opened and closed is arranged on the placing opening, the pump body 40 is placed into the vacuum chamber through the placing opening, and the pump body 40 is taken out from the placing opening after glue filling is completed.
The glue filling platform 10 is provided with a slide rail 13 and a driving unit (not shown in the figure), the support base plate 12 is slidably arranged on the slide rail 13 and can slide between the inside of the vacuum glue filling chamber 11 and the outside of the vacuum glue filling chamber 11 in a reciprocating manner, and the driving unit drives the support base plate 12 to slide on the slide rail 13.
Slide rail 13 includes first slide rail and second slide rail, and first slide rail setting is in the vacuum encapsulating room 11, and the second slide rail setting is outside the vacuum encapsulating room 11, and first slide rail and second slide rail syntropy interval set up, can regard the second slide rail as the extension of first slide rail, and set up first slide rail and second slide rail interval in order to avoid the mouth of placing of vacuum encapsulating room 11, guarantees that the apron lid closes when placing the mouth, and the vacuum encapsulating room 11 is complete encapsulated situation.
The vacuum glue filling chamber 11 includes two brackets 111 disposed oppositely, and a connecting rod 112 slidably disposed on the brackets 111. Two brackets 111 are arranged on two sides of the support base plate 12, a connecting rod 112 is arranged on the top of the brackets 111, a guide rail is arranged on the top of the brackets 111, and the connecting rod 112 is arranged on the guide rail in a sliding manner. The connecting rod 112 is connected with a first glue filling pipe and a second glue filling pipe, the first glue filling pipe and the second glue filling pipe are combined into a whole on the connecting rod 112 to form a glue filling opening 113 for filling glue into the pump body 40, and the glue filling opening 113 is arranged on the connecting rod 112 in a sliding mode. When encapsulating like this, encapsulating mouth 113 both can carry out lateral shifting along connecting rod 112, also can carry out longitudinal movement along support 111, can carry out the encapsulating operation to a plurality of pump bodies 40 simultaneously, has further improved the efficiency of encapsulating.
The glue filling platform 10 is also provided with a vacuum gauge and a display module, the vacuum gauge is used for detecting the vacuum degree in the vacuum glue filling chamber 11, and an operator can conveniently judge whether the vacuum degree in the vacuum glue filling chamber 11 meets the glue filling requirement. The display module is used for displaying the real-time state in the vacuum glue filling chamber 11.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present disclosure, which enable those skilled in the art to understand or practice the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A vacuum glue pouring device is characterized by comprising a glue pouring platform (10), a glue pouring pressure ring (20) and a glue pouring mandrel (30);
the glue pouring platform (10) is provided with a vacuum glue pouring chamber (11) and a vacuum pump, the vacuum pump is used for vacuumizing the vacuum glue pouring chamber (11), the bottom of the vacuum glue pouring chamber (11) is provided with a supporting bottom plate (12), and the supporting bottom plate (12) is used for placing a pump body (40) to be glue poured;
encapsulating clamping ring (20) set up the top of pump body (40), encapsulating dabber (30) are worn to establish the bottom of pump body (40), encapsulating clamping ring (20) encapsulating dabber (30) with pump body (40) mutually support and form the encapsulating space.
2. The vacuum potting device of claim 1, wherein the potting mandrel (30) comprises a mandrel body (31) and an end cap (32);
the end cover (32) is arranged at the end part of the mandrel main body (31), the mandrel main body (31) extends into the shaft hole of the pump body (40), the end cover (32) is positioned on the end surface of the bottom of the pump body (40), the end cover (32) is provided with a fixing hole (321), and a bolt fixes the glue filling mandrel (30) on the pump body (40) through the fixing hole (321);
the one end that fixed orifices (321) kept away from pump body (40) is equipped with concave station (322), encapsulating dabber (30) are fixed back on the pump body (40), the head of bolt stretches into completely concave station (322).
3. The vacuum potting device of claim 2, wherein the pump body comprises a housing (41), a magnetic bearing (42), a spacer ring (43), a motor stator (44), and a radial spacer ring (45);
the magnetic bearing (42), the spacer ring (43), the motor stator (44) and the radial transmission spacer ring (45) are all arranged in the glue filling space and are connected with each other through glue after glue filling.
4. The vacuum glue pouring device according to claim 2, characterized in that the end cap (32) is further provided with a threaded hole (323), and the threaded hole (323) corresponds to an end face of the bottom of the pump body (40); after the glue filling is finished, the demoulding bolt is matched with the threaded hole (323), so that the glue filling core shaft (30) is separated from the pump body (40).
5. The vacuum glue pouring device according to claim 2, characterized in that an annular positioning groove (324) is formed in a side of the end cover (32) facing the mandrel main body (31), the annular positioning groove (324) is of an annular structure, an end surface of the pump body (40) is located in the annular positioning groove (324), and a sealing gasket (325) is further arranged on the annular positioning groove (324).
6. The vacuum glue filling device according to claim 5, characterized in that, the vacuum glue filling device further comprises an avoiding pipe (50), one side of the end cover (32) facing the mandrel main body (31) is provided with an avoiding hole (326), the avoiding pipe (50) penetrates through the inner cavity of the pump body (40) and is inserted into the avoiding hole (326), a threading channel is reserved for the pump body (40), and the avoiding hole (326) is arranged on the inner side of the annular positioning groove (324).
7. The vacuum glue pouring device according to claim 4, characterized in that the number of the fixing holes (321) and the threaded holes (323) is multiple, and the plurality of fixing holes (321) and the plurality of threaded holes (323) are arranged at intervals.
8. The vacuum glue filling device according to claim 2, wherein a positioning hole (327) is further formed in the bottom of the end cap (32), a plurality of positioning columns (121) matched with the positioning hole (327) are arranged on the supporting base plate (12), the plurality of positioning columns (121) are arranged at intervals, and the distance between the positioning columns (121) is greater than the outer diameter of the pump body (40), so that the plurality of pump bodies (40) are arranged on the supporting base plate (12) at the same time.
9. The vacuum glue pouring device according to claim 1, characterized in that the vacuum glue pouring chamber (11) comprises two opposite brackets (111), the two brackets (111) are arranged on two sides of the supporting base plate (12), a connecting rod (112) is arranged between the two brackets (111), the connecting rod (112) is slidably arranged on the brackets (111), and the glue pouring port (113) is slidably arranged on the connecting rod (112).
10. The vacuum glue-pouring device according to claim 1, characterized in that the glue-pouring platform (10) is provided with a slide rail (13) and a driving unit, the supporting base plate (12) is slidably arranged on the slide rail (13) and can slide out of the vacuum glue-pouring chamber (11), and the driving unit drives the supporting base plate (12) to slide on the slide rail (13).
CN202111165491.1A 2021-09-30 2021-09-30 Vacuum glue pouring device Pending CN113856985A (en)

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Application Number Priority Date Filing Date Title
CN202111165491.1A CN113856985A (en) 2021-09-30 2021-09-30 Vacuum glue pouring device

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Application Number Priority Date Filing Date Title
CN202111165491.1A CN113856985A (en) 2021-09-30 2021-09-30 Vacuum glue pouring device

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CN113856985A true CN113856985A (en) 2021-12-31

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CN202111165491.1A Pending CN113856985A (en) 2021-09-30 2021-09-30 Vacuum glue pouring device

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Citations (5)

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DE102017202761A1 (en) * 2017-02-21 2018-08-23 Homag Gmbh Device for receiving an adhesive application unit and method
CN110052366A (en) * 2019-05-13 2019-07-26 成都金士力科技有限公司 One kind is for high/low temperature vacuum stepper motor rotation adhesive injection device and glue-pouring method
CN213529421U (en) * 2020-10-22 2021-06-25 江苏玺泽祥智能科技有限公司 Multi-station vacuum glue pouring machine
CN113426634A (en) * 2021-08-24 2021-09-24 常州铭赛机器人科技股份有限公司 Vacuum glue pouring device compatible with single component and double components

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CN213529421U (en) * 2020-10-22 2021-06-25 江苏玺泽祥智能科技有限公司 Multi-station vacuum glue pouring machine
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Application publication date: 20211231