CN113853056A

CN113853056A - Packaging module, board-to-board connection structure, manufacturing method of board-to-board connection structure and terminal

Info

Publication number: CN113853056A
Application number: CN202110984355.9A
Authority: CN
Inventors: 刘鹏; 盛明; 李梦园
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-08-25
Filing date: 2021-08-25
Publication date: 2021-12-28
Anticipated expiration: 2041-08-25
Also published as: CN113853056B

Abstract

The application provides a package module, includes: the packaging substrate comprises a substrate, a first circuit layer, an electronic component electrically connected with the first circuit layer and a first packaging layer which is positioned on the substrate and packages the electronic component and the first circuit layer; the electric connection layer is arranged on the surface of the first packaging layer and is electrically connected with the first circuit layer; the connecting pads are arranged on the surface of the electric connection layer deviating from the first packaging layer and are electrically connected with the electric connection layer. The application also provides a board-to-board connection structure and a terminal applying the packaging module, and a preparation method of the packaging module and the board-to-board connection structure. The thickness of the packaging module can be greatly reduced by arranging the electric connection layer and the connection pad on the surface of the packaging substrate, so that the light, thin, short and small structure of a board-to-board connection structure and a terminal is facilitated.

Description

Packaging module, board-to-board connection structure, manufacturing method of board-to-board connection structure and terminal

Technical Field

The application relates to a packaging module capable of reducing the total thickness, a preparation method of the packaging module, a board-to-board connection structure applying the packaging module, a preparation method of the board-to-board connection structure and a terminal.

Background

With the wide application of circuit boards in the electronic field, in order to perform multiple functions of electronic products, two or more circuit boards with different functions are generally required to be integrated together in a connection manner.

However, as electronic products are increasingly developed to be light, thin, small and small, the problem of excessive total thickness needs to be considered after the conventional circuit board is connected with the circuit board.

Disclosure of Invention

The first aspect of the embodiment of the application provides a package module, which comprises a package base body, an electric connection layer and a connection pad, wherein the package base body comprises a substrate, a first circuit layer arranged on the substrate, an electronic component arranged on the substrate and electrically connected with the first circuit layer, and a first package layer which is positioned on the substrate and packages the electronic component and the first circuit layer, the first package layer comprises a first surface arranged close to the substrate, a second surface arranged away from the first surface, and a side surface for connecting the first surface and the second surface; the electric connection layer is arranged on the second surface and/or the side surface and is electrically connected with the first circuit layer; the connecting pad is arranged on the surface of the electric connecting layer, which is deviated from the first packaging layer, and the connecting pad is electrically connected with the electric connecting layer.

According to the packaging module, the electric connection layer is arranged on the surface of the first packaging layer, and the connection pad is led out of the electric connection layer, so that the size of the packaging module can be reduced, the thickness of the packaging module is reduced, the area of a board-to-board connector arranged on a packaging substrate is saved, the weight of the packaging module is obviously reduced, the electric connection layer and the connection pad are simple in preparation process, easy to realize and mass production, low in cost and beneficial to light, thin, short and small electronic products; in addition, the structural form of the existing packaging substrate does not need to be changed, and the adaptability is strong.

In some embodiments, the electrical connection layer is disposed on the second surface, the package substrate further includes a through hole disposed through the first surface and the second surface, a conductor is disposed in the through hole, one end of the conductor is electrically connected to the first circuit layer, and the other end of the conductor is exposed on the second surface and electrically connected to the electrical connection layer.

The mode of vertical punching is adopted, so that the conductor is embedded in the first packaging layer without occupying the space outside the packaging base body, thereby improving the space utilization rate of the packaging base body, being beneficial to reducing the volume of the packaging module, and particularly reducing the thickness of the packaging module.

In some embodiments, the first encapsulation layer includes an encapsulation region encapsulating the electronic component and an edge region located at a periphery of the encapsulation region, and the via and the conductor are located at the edge region.

The peripheral vacant area of the first packaging layer can be fully utilized, a plurality of connecting pads can be led out, a plurality of circuit boards can be connected in the plate-to-plate connection process of the follow-up plate, and the space outside the packaging base body is not occupied, so that the space utilization rate of the packaging base body is improved, and the size of the packaging module is favorably reduced; moreover, the through holes are arranged in the edge region where the electronic component is not arranged, so that the connection reliability of the electronic component and the substrate is not influenced; in addition, the structure form of the existing packaging module is not required to be changed, the conductor can be embedded by arranging the through hole in the edge region of the first packaging layer in the existing packaging module, the process can be simplified, the laminated plate is reduced, and the applicability is provided.

In some embodiments, the electrical connection layer includes a second circuit layer and a dielectric layer, the second circuit layer is embedded in the dielectric layer, the second circuit layer includes a first conductive wire and a second conductive wire, two ends of the first conductive wire are electrically connected to the conductor and the second conductive wire respectively, and one end of the second conductive wire, which is away from the first conductive wire, is exposed on a surface of the dielectric layer, which is away from the package substrate, and is electrically connected to the connection pad.

The rewiring technology can enlarge the space between the conductors with higher distribution density, so that the connection pads are more reasonably distributed, and the subsequent connection of the circuit board is facilitated.

In some embodiments, the substrate includes a substrate surface disposed close to the first package layer, the first circuit layer is disposed on the substrate surface, the substrate is disposed beyond the side surface of the first package layer, the side surface and the substrate surface together define an accommodation space, the first circuit layer extends to the accommodation space, and the electrical connection layer is disposed on the side surface and accommodated in the accommodation space.

The electric connection layer is arranged on the side surface of the first packaging layer, the thickness of the packaging base body is not required to be increased, the side space of the packaging base body can be fully utilized, the space utilization rate of the packaging module is improved, the thickness of the packaging module is reduced, the light, thin, short and small electronic products are facilitated, the electric connection layer is arranged on the side surface of the first packaging layer, and the flexibility of the structural design of the packaging module is improved.

In some embodiments, the electrical connection layer includes a second circuit layer, a third circuit layer disposed on a side of the second circuit layer close to the substrate, and a dielectric layer, the second circuit layer is embedded in the dielectric layer, the third circuit layer is electrically connected to the first circuit layer, and the second circuit layer is electrically connected to the third circuit layer.

The electric connection layer can be realized by adopting a forming process of the circuit board, the process is mature, the cost is reduced, the structure of the packaging base body does not need to be changed, and the adaptability is strong.

In some embodiments, the second circuit layer includes a first conductive line and a second conductive line, the second conductive line is electrically connected to the third circuit layer and the first conductive line, respectively, and an end of the first conductive line away from the second conductive line is exposed from a surface of the dielectric layer away from the first package layer and is electrically connected to the connection pad.

The first lead is led out from the side face of the electric connection layer and then electrically connected with the connecting pad, so that the structure is simple and easy to realize.

In some embodiments, the number of the electrical connection layers is at least two, one electrical connection layer is disposed on the second surface, the package substrate further includes a through hole disposed through the first surface and the second surface, a conductor is disposed in the through hole, one end of the conductor is electrically connected to the first circuit layer, and the other end of the conductor is exposed on the second surface and electrically connected to the electrical connection layer; the side surface is provided with another electric connection layer, the substrate comprises a substrate surface which is close to the first packaging layer, the first circuit layer is arranged on the substrate surface, the substrate is arranged beyond the side surface of the first packaging layer, the side surface and the substrate surface jointly enclose an accommodating space, the first circuit layer extends to the accommodating space, and the other electric connection layer is arranged on the side surface and accommodated in the accommodating space.

Through set up different electric connection layers at second surface and at least one side surface, can realize leading out the purpose that the circuit set up the connection pad at arbitrary surface of encapsulation base member according to actual need, be favorable to promoting the flexibility of encapsulation module structural design.

In some embodiments, the package module further comprises a second package layer encapsulating the first package layer and the electrical connection layer.

The second packaging layer covers the first packaging layer and the electric connection layer to form a whole, so that the binding force between the electric connection layer and the first packaging layer is improved, the stability of electric connection between the electric connection layer and the packaging substrate is improved, and the reliability is improved.

A second aspect of the embodiments of the present application provides a board-to-board connection structure, the board-to-board connection structure includes as described above, a package module and a first functional module, the first functional module is located on the connection pad, and passes through the connection pad with the electrical connection layer with package substrate electric connection.

The electric connection layer and the connecting pad are designed in the packaging module to realize the electric connection with the first functional module, and compared with the method of directly welding the board-to-board connector on the packaging base body, the method completely saves the layout area of the board-to-board connector, obviously reduces the weight, and is favorable for lightening, thinning and shortening the electronic product. And the electric connection layer and the connection pad have simple structures, are easy to form, do not need to change the structural form of the packaging substrate, have low cost and are convenient for mass production.

In some embodiments, a connection layer is disposed between the connection pad and the first functional module, and the connection layer includes anisotropic conductive paste or solder paste.

The mode through pasting incorgruous conducting resin or soldering tin realizes the electric connection of first functional module and connection pad, the operation of being convenient for, and the incorgruous conducting resin or the thickness of tin cream are all thinner, can not occupy too big space, are favorable to reducing the total thickness of board to board connection structure. Moreover, the connection stability is high, and the problem of reliability reduction can not occur when the plate-to-plate connection structure is bent or shaken. In addition, the process of pasting the anisotropic conductive adhesive or soldering tin is simple, the efficiency is high, and the cost is low.

In some embodiments, the board-to-board connection structure further includes a functional module disposed on a side of the substrate away from the electronic component, and the functional module is electrically connected to the package base.

The second functional module can be designed according to actual needs, and the multifunctional electronic product is favorably realized.

A third aspect of the embodiments of the present application provides a terminal, where the terminal includes a housing and a board-to-board connection structure housed in the housing, where the board-to-board connection structure is the board-to-board connection structure described above.

Structural design through the encapsulation module can contract the volume of platelet to board connection structure, especially the total thickness of board to board connection structure, is favorable to the frivolous short and small change at terminal.

A fourth aspect of the embodiments of the present application provides a method for manufacturing a package module, where the method includes: providing a packaging base body, wherein the packaging base body comprises a substrate, a first circuit layer arranged on the substrate, an electronic component arranged on the substrate and electrically connected with the first circuit layer, and a first packaging layer which is positioned on the substrate and packages the electronic component and the first circuit layer, and the first packaging layer comprises a first surface arranged close to the substrate, a second surface arranged away from the first surface, and a side surface connecting the first surface and the second surface; forming an electrical connection layer on the second surface and/or the side surface, wherein the electrical connection layer is electrically connected with the first circuit layer; and arranging a connecting pad on the surface of the electric connecting layer, which is deviated from the first packaging layer, wherein the connecting pad is electrically connected with the electric connecting layer, so that the packaging module is obtained.

The preparation method of the packaging module is simple in process, easy to implement, low in cost and convenient for mass production.

In some embodiments, the first encapsulation layer includes an encapsulation region encapsulating the electronic component and an edge region located at a periphery of the encapsulation region. Before forming the electrical connection layer, the preparation method further includes the steps of: punching the edge area to form a through hole, wherein the through hole penetrates through the first surface and the second surface; and forming a conductor in the through hole, wherein the conductor is electrically connected with the first circuit layer, and one end of the conductor, which is deviated from the first circuit layer, is exposed from the second surface. After the conductor is formed, the preparation method of the electric connection layer comprises the following steps: forming a second circuit layer on the second surface, wherein the second circuit layer comprises a first conducting wire and a second conducting wire, and two ends of the first conducting wire are respectively electrically connected with the conductor and the second conducting wire; and forming a dielectric layer on the second surface, embedding the second circuit layer in the dielectric layer, and exposing one end of the second wire, which is far away from the first wire, from the surface of the dielectric layer so as to obtain the electric connection layer.

The forming method of the through hole and the conductor is simple, easy to realize, low in cost and easy for mass production.

The electric connection layer is additionally arranged on the side surface of the first packaging layer, the connection mode of the electric connection layer and the packaging base body is simple, the realization is easy, the structure of the existing packaging base body is not required to be changed, the cost is low, and the mass production is convenient.

In some embodiments, after forming the electrical connection layer, the method of making further comprises: and forming a second packaging layer on the surface of the substrate, so that the first packaging layer and the electric connection layer are embedded in the second packaging layer.

The shaping of second encapsulated layer is simple, and the second encapsulated layer covers first encapsulated layer and electric connection layer and forms a whole, is convenient for improve the cohesion of electric connection layer and first encapsulated layer, improves electric connection layer and encapsulation base member electric connection's stability, provides the reliability.

A fifth aspect of the embodiments of the present application provides a method for manufacturing a board-to-board connection structure, where the method for manufacturing a board-to-board connection structure includes: providing the packaging module; forming a connection layer on the connection pad; and providing a circuit board, and arranging the circuit board on the connecting layer, thereby obtaining the board-to-board connecting structure.

The preparation method of the plate-to-plate connection structure is simple in process, easy to implement, low in cost and convenient for mass production.

In some embodiments, the connection layer comprises anisotropic conductive paste or solder paste.

The electrical connection between the circuit board and the connecting pad is realized by pasting the anisotropic conductive adhesive or soldering tin, the process is simple, the operation is convenient, the efficiency is high, and the cost is low.

In some embodiments, the method of making further comprises: and arranging a second functional module on one side of the substrate, which is far away from the first circuit layer, wherein the second functional module is electrically connected with the first circuit layer.

The second functional module is simple in connection mode and convenient to operate, can be designed according to actual needs, and is beneficial to achieving the multi-functionalization of electronic products.

Drawings

Fig. 1 is a schematic structural view of a plate-to-plate connecting structure according to an embodiment of the present application.

Fig. 2 is a photograph of a conventional board-to-board connector.

Fig. 3 is a schematic structural diagram of a package module according to an embodiment of the present application.

Fig. 4 is a top view of a package module according to an embodiment of the present application.

FIG. 5 is a schematic view showing the distribution of connection pads in a package module according to an alternative embodiment.

Fig. 6 is a schematic structural view of a plate-to-plate connecting structure according to another embodiment of the present application.

Fig. 7 is a schematic structural diagram of a package module according to another embodiment of the present application.

Fig. 8 is a schematic structural diagram of an electrical connection layer according to another embodiment of the present application.

FIG. 9 is a side view of an electrical connection layer provided with connection pads according to another embodiment of the present application.

Fig. 10 is a structural view of a plate-to-plate connecting structure according to still another embodiment of the present application.

Fig. 11 is a schematic structural diagram of a package substrate according to an embodiment of the present application.

Fig. 12 is a schematic diagram of a structure in which a via is formed in the first encapsulation layer provided in fig. 11.

Fig. 13 is a schematic diagram of a structure for forming a conductor in the via hole provided in fig. 12.

Fig. 14 is a schematic structural view of a second circuit layer formed on the second surface provided in fig. 13.

Fig. 15 is a schematic structural view of a dielectric layer formed on the second surface provided in fig. 14.

Fig. 16 is a schematic structural diagram of a package substrate according to another embodiment of the present application.

Fig. 17 is a schematic structural view illustrating an electrical connection layer formed on a side surface of the package substrate provided in fig. 16.

Description of the main elements

Board-to-

board connection

100, 200, 300

Package module

10, 20, 30

Package substrates

1a, 1b, 1c

Substrate 11

Substrate surface 111

Electronic component 12

First encapsulation layer 13

First surface 131

Second surface 132

Side surface 133

First circuit layer 14

Through hole 15

Conductor 16

Electrical connection layer

2, 6

Second circuit layers 21, 61

First

conductive lines

211, 611

Second

conductive line

212, 612

Dielectric layers

22, 64

Third wiring layer 62

Fourth wiring layer 63

Connecting pad 3

Solder ball 4

Second encapsulation layer 5

First function module 40

Functional module 50

Detailed Description

The embodiments of the present application will be described below with reference to the drawings.

As shown in fig. 1, a board-to-board connection 100 is provided. The board-to-board connection structure 100 may be provided in a housing of a terminal. The terminal can be an electronic device such as a mobile phone, a notebook computer, a tablet computer and the like.

Referring to fig. 1 and fig. 3, the board-to-board connection structure 100 includes a package module 10 and a first functional module 40 electrically connected to the package module 10. The Package module 10 includes a Package substrate 1a, where the Package substrate 1a may be a System In a Package (SIP) module or a Package On Package (POP) module, and In this embodiment, the Package substrate 1a is an SIP module. The first functional module 40 may be a Printed Circuit Board (PCB), a Flexible Printed Circuit Board (FPC), or other functional devices, such as an SIP module or a POP module, in this embodiment, the first functional module 40 may be an FPC, as shown in fig. 1. In order to realize the electrical connection and signal transmission between the package base 1a (specifically, the SIP module) and the first functional module 40, a Board-to-Board connector (BTB) as shown in fig. 2 is usually required, that is, a male socket a and a female socket b of the BTB are respectively soldered on the package base 1a and the first functional module 40, and the electrical connection and the signal connection between the two parts are realized through mechanical fastening. However, when the board-to-board interconnection is implemented, a large number of BTBs are required, which reduces the layout area of the package substrate 1a, and a single BTB has a large volume, especially a large size along the thickness direction of the package substrate 1a, which increases the total thickness of the package substrate 1a and the first functional module 40 after connection, and thus cannot meet the development trend of light, thin and small electronic products; moreover, after the package base 1a and the first functional module 40 are connected by BTB, there is a problem that connection reliability is reduced when bending or shaking occurs; in addition, BTB is costly, increasing the production cost of electronic products. With the trend of miniaturization of consumer electronics, a board-to-board connection technology with small layout area, flexible architecture, low cost and high production efficiency is urgently needed. Therefore, this application be in the upper surface of encapsulation base member 1a set up with encapsulation base member 1a electric connection's electric connection layer 2, through a plurality of connection pads 3 are drawn forth to electric connection layer 2, first functional module 40 with 3 electric connection of connection pads, thereby realize encapsulation base member 1a with the electric connection of first functional module 40. The thicknesses of the electrical connection layer 2 and the connection pad 3 can be designed according to actual needs, so that the total thickness of the integrated board-to-board connection structure 100 can be effectively reduced, and the terminal is light, thin, short and small.

As shown in fig. 3, the package base 1a includes a substrate 11, an electronic component 12 disposed on the substrate 11, and a first package layer 13 located on the substrate 11 and encapsulating the electronic component 12.

The surface of the substrate 11 close to the electronic component 12 is provided with a first circuit layer 14, and the electronic component 12 is electrically connected with the first circuit layer 14.

The electronic components 12 may include one or more passive devices including, but not limited to, resistors, capacitors, inductors, filters, couplers, and the like. The electronic components 12 may also include one or more active devices, such as active chips, including but not limited to power chips, digital chips, radio frequency chips, and the like. The electronic components 12 are roughly packaged in the middle of the substrate 11 in a concentrated manner, and the first packaging layer 13 completely covers the electronic components 12.

The first encapsulation layer 13 includes a first surface 131 adjacent to the substrate 11 and a second surface 132 disposed away from the first surface 131. In addition, the first encapsulation layer 13 is divided into an encapsulation area a for encapsulating the electronic component 12 and an edge area B located at the periphery of the encapsulation area a according to the distribution position of the electronic component 12, where the edge area B is not provided with the electronic component 12. The package substrate 1a further includes a plurality of through holes 15 disposed in the edge region B, and the plurality of through holes 15 are disposed through the first surface 131 and the second surface 132. A conductor 16 is disposed in the through hole 15, one end of the conductor 16 is electrically connected to the first circuit layer 14 on the substrate 11, and the other end of the conductor 16 is exposed from the second surface 132 and electrically connected to the electrical connection layer 2, so as to electrically connect the electrical connection layer 2 and the package substrate 1. In this embodiment, the conductor 16 is embedded in the edge region B of the first encapsulation layer 13, so that the peripheral free area of the encapsulation region a can be fully utilized, and a space outside the encapsulation base 1a does not need to be occupied, thereby improving the space utilization rate of the encapsulation base 1a and reducing the volume of the board-to-board connection structure 100. Moreover, the through hole 15 is provided in the edge region B where the electronic component 12 is not provided, so that the connection reliability between the electronic component 12 and the substrate 11 is not affected. In addition, the embedding of the conductor 16 can be realized by arranging the through hole 15 in the edge region B of the conventional package substrate 1a without changing the structural form of the conventional package substrate 1a (for example, an SIP module), so that the process can be simplified, the cost can be reduced, and the applicability is high.

The material of the first encapsulant layer 13 may be one selected from epoxy resin (epoxy resin), Prepreg (PP), BT resin, Polyphenylene Oxide (PPO), Polyimide (PI), Polyethylene Terephthalate (PET), Polyethylene Naphthalate (PEN), and the like. Specifically, in this embodiment, the first encapsulant layer 13 is a prepreg.

The through holes 15 are formed by laser drilling or mechanical drilling. The through holes 15 penetrating through the first surface 131 and the second surface 132 of the first encapsulation layer 13 are formed by a conventional punching manner, which is simple and easy to implement and has low cost.

The conductor 16 is formed by electroplating copper in the through hole 15, and the conductor 16 is formed in an electroplating mode, so that the connection stability of the conductor 16 and the first circuit layer 14 can be improved, the process is simple, the implementation is convenient, and the cost is low; in addition, the conductor 16 can be arranged at a required position according to actual requirements in an electroplating mode, and the structural form of the conductor 16 can be designed according to requirements, so that the limitation is small. In other embodiments, the conductor 16 may also be formed by filling and curing a conductive paste in the through hole 15, and the conductor 16 is formed by filling and curing a conductive paste, which is simple in process, convenient to operate, and low in cost.

As shown in fig. 3 and fig. 4, referring to fig. 1, the through holes 15 may be regularly distributed in the edge region B and surround the periphery of the package region a, and further, the conductors 16 are disposed around the plurality of electronic components 12, and then the plurality of connection pads 3 are led out to interconnect the plurality of first functional modules 40 and the plurality of electronic components 12. In other embodiments, the through hole 15 may also be disposed at a position where a line needs to be led out from the edge region B according to actual needs. The shape of the through hole 15 is not limited, and may be a circular through hole, and may also be other shapes, such as a rectangle, a triangle, or other irregular shapes.

The end of the conductor 16 away from the substrate 11 is partially polished by polishing the first encapsulation layer 13, so that the end face of the conductor 16 is completely exposed from the second surface 132, and the subsequent line leading-out is facilitated to form the electrical connection layer 2.

As shown in fig. 3 and 4, the electrical connection Layer 2 is a Redistribution Layer formed by using Redistribution Layer (RDL) technology, and the pitch of the conductor 16 with high distribution density can be enlarged by using RDL technology. Specifically, the electrical connection layer 2 includes a second circuit layer 21 and a dielectric layer 22, the second circuit layer 21 is embedded in the dielectric layer 22, the second circuit layer 21 includes a plurality of first conductive lines 211 and second conductive lines 212 disposed substantially perpendicular to the first conductive lines 211, wherein the first conductive lines 211 are disposed substantially parallel to the second surface 132, and the second conductive lines 212 are disposed substantially perpendicular to the second surface 132. Each of the first conductive lines 211 has one end electrically connected to one of the conductors 16 and the other end electrically connected to one of the second conductive lines 212. One end of the second conductive line 212, which is away from the first conductive line 211, is exposed from the dielectric layer 22, and the connecting pad 3 is electroplated on the end surface of the second conductive line 212, which is exposed from the dielectric layer 22. Through the rewiring design of the electrical connection layer 2, the plurality of conductors 16 which are vertically distributed in a high density are led out through the plurality of connection pads 3 which are uniformly distributed on the surface of the dielectric layer 22, so that the electrical connection with the first functional module 40 is facilitated. In addition, the thickness of the electrical connection layer 2 formed by the RDL technique is relatively thin, the second circuit layer 21 is formed by a conventional circuit forming method, the circuit thickness is usually in the micron order, the connection pad 3 is plated on the second conductive line 212 by means of copper plating, and the thickness can be designed to be very thin according to actual needs, so as to greatly reduce the total thickness of the integrated board-to-board connection structure 100, as shown in fig. 1.

The material of the dielectric layer 22 may be one of epoxy resin (epoxy resin), Prepreg (pre, PP), BT resin, Polyphenylene Oxide (PPO), Polyimide (PI), Polyethylene Terephthalate (PET), Polyethylene Naphthalate (PEN), and the like. Specifically, in this embodiment, the dielectric layer 22 is a prepreg.

As shown in fig. 3, the electrical connection layer 2 is disposed on the upper surface of the package substrate 1a (i.e., the second surface 132 of the first package layer 13), and the electrical connection layer 2 is disposed on the upper surface of the package substrate 1, so that the through hole 15 can be formed directly on the first package layer 13 of the package substrate 1a by vertically punching, and the conductor 16 can be formed in the through hole 15 by electroplating, without changing the existing structural form of the package substrate 1a, which is beneficial to simplifying the process and reducing the cost.

As shown in fig. 1 and 4, the arrangement of the connection pads 3 may be set according to the specific position of the first functional module 40, and the connection pads 3 may be uniformly distributed on the surface of the electrical connection layer 2 in an array arrangement. The shape and size of the connecting pad 3 are not limited, and may be circular, as shown in fig. 4, or may be other shapes, such as rectangle, triangle, long strip with a certain length-diameter ratio, or other irregular shapes. According to the method, the position, the size and the shape of the connecting pad 3 can be reasonably set according to the actual layout area of the lead-out circuit of the electric connection layer 2, so that the layout area of the connecting pad 3 is reduced, and the space utilization rate of the packaging module 10 is improved; meanwhile, the positions of the connecting pads 3 can be reasonably set according to the actually connected connecting positions of the first functional modules 40, so that the flexibility of connection between the first functional modules 40 and the packaging module 10 is improved.

The connecting pads 3 may be regularly and uniformly arranged, and as shown in fig. 4, the connecting pads 3 may be arranged in an array. In other embodiments, the connecting pads 3 may be arranged irregularly or non-uniformly. As shown in fig. 5, the connection pads 3 may be in the shape of a long strip with different length-diameter ratios or in the shape of a circle. Thus, when different first functional modules 40 need to be connected, the arrangement of the connecting pads 3 can be distinguished conveniently, and connection errors of different first functional modules 40 can be prevented.

As shown in fig. 1, the connection pad 3 is electrically connected to the first functional module 40 through a connection layer (not shown), the connection layer may be anisotropic conductive adhesive or solder paste, and the electrical connection between the first functional module 40 and the connection pad 3 is realized by attaching anisotropic conductive adhesive or solder paste, so as to facilitate operation, and the anisotropic conductive adhesive or solder paste has a relatively small thickness, and does not occupy too large space, thereby being beneficial to reducing the total thickness of the board-to-board connection structure 100. Moreover, the first functional module 40 is disposed on the connecting pad 3 by pasting a conductive adhesive or solder in different directions, so that the connection stability is high, and the problem of reliability reduction can not occur when the board-to-board connection structure 100 is bent or shaken. In addition, the process of pasting the anisotropic conductive adhesive or soldering tin is simple, the efficiency is high, and the cost is low.

As shown in fig. 1 and 3, the first package layer 13 and the electrical connection layer 2 are plastically packaged by the second package layer 5, the second package layer 5 is to package the first package layer 13 and the electrical connection layer 2 into a whole, so that the bonding force between the electrical connection layer 2 and the first package layer 13 is improved, and the stability of the electrical connection between the board and the board connection structure 100 is improved.

The material of the second encapsulant layer 5 may be selected from any thermosetting material or photo-curing material with filling and protecting functions, such as a cover film (CVL), ink, pure glue, ABF resin, and prepreg (PP). Specifically, the material of the second encapsulation layer 5 may be ink.

As shown in fig. 1 and fig. 3, the board-to-board connection structure 100 further includes a second functional module 50 disposed on a side of the substrate 11 away from the electronic component 12, and the second functional module 50 is electrically connected to the package base 1 a. Specifically, a plurality of solder balls 4 are disposed on a side of the substrate 11 away from the electronic component 12, and the package base 1a and the second module 50 are electrically connected through the plurality of solder balls 4. The functional module 4 may be a SIP module, a POP module, or another circuit board different from the first functional module 40. In this embodiment, the second functional module 50 is another circuit board different from the first functional module 40.

In the board-to-board connection structure 100 provided in this embodiment, the electrical connection between the electrical connection layer 2 and the connection pad 3 and the first functional module 40 is realized by disposing the package module 10, which completely omits the layout area of the BTB, facilitates weight reduction, and realizes light weight, thinness, shortness and miniaturization of the electronic product, compared with directly soldering the BTB on the package substrate 1 a. Moreover, the manufacturing process of the electric connection layer 2 and the connecting pad 3 is simple, the structural form of the existing packaging base body 1 does not need to be changed, the cost is low, and the mass production is convenient.

Referring to fig. 6 and 7, a plate-to-plate connection structure 200 according to another embodiment of the present application is different from the plate-to-plate connection structure 100 according to the previous embodiment in that: the electrical connection layer 6 in the package module 20 in this embodiment is disposed on the sidewall of the package substrate 1, and the specific structure of the electrical connection layer 6 is different from that of the electrical connection layer 2 in the previous embodiment.

The first encapsulation layer 13 of the encapsulation base 1b further includes a side surface 133 connecting the first surface 131 and the second surface 132. The substrate 11 includes a substrate surface 111 disposed adjacent to the first encapsulation layer 13, and the first circuit layer 14 is disposed on the substrate surface 111. The substrate 11 is disposed beyond the side surface 133 of the first package layer 13, the side surface 133 and the substrate surface 111 enclose an accommodating space 17, the first circuit layer 14 extends to the accommodating space 17, and the electrical connection layer 6 is accommodated in the accommodating space 17 and electrically connected to the first circuit layer 14. The connecting pad 3 is disposed on a surface of the electrical connection layer 6 away from the side surface 133, and the first functional module 40 is electrically connected to the connecting pad 3. Through will the electric connection layer 6 sets up the side surface 133 of first encapsulation layer 13, need not to increase the thickness of encapsulation base member 1b, make full use of simultaneously the side space of encapsulation base member 1b is favorable to improving the space utilization of encapsulation module 20 reduces simultaneously the thickness of encapsulation module 20, and then reduces the total thickness of board to board connection structure 200. In addition, the electrical connection layer 6 is disposed on the side surface of the first package layer 13, and the connection pads 3 are led out from the side surface, so that the first functional module 40 is connected to the side surface of the package module 20, another possibility is provided for the connection of the first functional module 40, and the application range of the board-to-board connection structure 200 is expanded.

As shown in fig. 7 and 8, the electrical connection layer 6 includes a second circuit layer 61, a third circuit layer 62 disposed on a side of the second circuit layer 61 close to the substrate 11, and a dielectric layer 64, and the second circuit layer 61 is embedded in the dielectric layer 64. The second circuit layer 61 is electrically connected to the third circuit layer 62, and the third circuit layer 62 is electrically connected to the first circuit layer 14, so as to electrically connect the electrical connection layer 6 to the first circuit layer 14. The second circuit layer 61 includes a first conductive line 611 disposed substantially perpendicular to the side surface 133 and a second conductive line 612 disposed substantially parallel to the side surface 133, the second conductive line 612 electrically connects the first conductive line 611 and the third circuit layer 62, and an end of the first conductive line 611 facing away from the second conductive line 612 is exposed from a surface of the dielectric layer 64 facing away from the side surface 133. The connecting pad 3 is electroplated on the end surface of the first conducting wire 611 exposed out of the dielectric layer 64. In this embodiment, the electrical connection layer 6 further includes a fourth circuit layer 63 disposed on a side of the second circuit layer 61 away from the third circuit layer 62, the third circuit layer 62 is electrically connected to the fourth circuit layer 63, and the electrical connection layer 6 may be a double-sided board. In this embodiment, the structure of the conventional package substrate 1b (e.g., an SIP module) does not need to be changed, the electrical connection layer 6 only needs to be added to the side surface of the package substrate 1b, and the manufacturing method of the electrical connection layer 6 is implemented by using a conventional circuit board forming method, which is beneficial to simplifying a board-to-board connection process, reducing cost, and having strong adaptability. It is understood that, in other embodiments, the electrical connection layer 6 may also be a single panel, and only the electrical connection between the second circuit layer 61 and the first circuit layer 14 is achieved, and the electrical connection may be specifically designed according to actual needs.

As shown in fig. 6 and 7, the electrical connection layer 6 may be disposed on any side of the package substrate 1b according to actual requirements. In other embodiments, it is understood that a plurality of the electrical connection layers 6 may be disposed on different sides of the package substrate 1, and the electrical connection layers 6 may be disposed on the upper surface or the lower surface of the package substrate 1 b. Therefore, in this embodiment, the connection pads 3 may be disposed on different surfaces of the package substrate 1b, so as to connect the first functional module 40 to any surface of the package substrate 1b, which is beneficial to improving the flexibility of the structural design of the board-to-board connection structure 200.

As shown in fig. 6, the second functional module 50 is a POP module, so that the board-to-board connection structure 200 is convenient for multi-functionalization.

As shown in fig. 9 and fig. 6, the connecting pad 3 is a strip-shaped structure with a certain length-diameter ratio, and the strip-shaped connecting pad 3 can improve the stability of the electrical connection with the first functional module 40.

Compared with the previous embodiment, in the package module 20 of the present embodiment, the electrical connection layer 6 is disposed on the side wall of the package substrate 1b, so that the thickness of the package substrate 1b does not need to be increased, the lateral space of the package substrate 1b can be fully utilized, the space utilization rate of the package module 20 is improved, the thickness of the package module 20 is reduced, the total thickness of the board-to-board connection structure 200 is further reduced, and the board-to-board connection structure 200 is light, thin, short and small; moreover, lines can be led out to different surfaces of the first package layer 13 to form the connection pads 3 according to actual needs, so that the connection between the package module 20 and the first functional module 40 is facilitated, another possibility is provided for the connection of the first functional module 40, the application range of the board-to-board connection structure 200 is expanded, the purpose that the first functional module 40 is connected to any surface of the package substrate 1b can be realized, and the flexibility of the structural design of the board-to-board connection structure 200 is improved.

Referring to fig. 10, the plate-to-plate connecting structure 300 according to another embodiment of the present application is substantially identical to the plate-to-plate connecting structure 100 provided in the previous embodiment, except that: the substrate 11 is further provided with the electrical connection layer 6 on the side surface of the package base 1c, and for details of the structure of the electrical connection layer 6 and how to arrange the electrical connection layer on the side surface of the package base 1c, please refer to the method for arranging the electrical connection layer 6 in the board-to-board link structure 200 in the foregoing embodiment, which is not described herein again.

In the present embodiment, by combining the package module 10 provided by the foregoing embodiment with the package module 20 provided by the foregoing embodiment, the electrical connection layer 2 is disposed on the upper surface of the package substrate 1c (i.e., the second surface 132 of the first package layer 13), and the electrical connection layer 6 is disposed on the side surface of the package substrate 1c (i.e., the side surface 133 of the first package layer 13), so that the purpose of connecting the first functional module 40 to any surface of the package substrate 1 can be achieved, which is beneficial to improving the flexibility of the structural design of the board-to-board connection structure 300.

An embodiment of the present application also provides a method for manufacturing the board-to-board connection structure 100, which includes the following steps.

S11: as shown in fig. 11, a package base 1a is provided, where the package base 1a includes a substrate 11, an electronic component 12 disposed on the substrate 11, a first package layer 13 located on the substrate 11 and encapsulating the electronic component 12, and a first circuit layer 14 disposed on a surface of the substrate 11 close to the electronic component 12. The first encapsulation layer 13 includes a first surface 131 disposed adjacent to the substrate 11 and a second surface 132 disposed away from the substrate 11. The first packaging layer 13 is divided into a packaging area a for packaging the electronic component 12 and a marginal area B located at the periphery of the packaging area a according to the distribution position of the electronic component 12, wherein the electronic component 12 is not arranged in the marginal area B.

S12: as shown in fig. 12, the edge region B is perforated to form a plurality of through holes 15 penetrating the first surface 131 and the second surface 132.

The through holes 15 are formed by laser drilling or mechanical drilling, and a plurality of through holes 15 are distributed on the periphery of the packaging area a in a circle.

S13, as shown in fig. 13, a conductor 16 is disposed in the through hole 15, one end of the conductor 16 is electrically connected to the first circuit layer 14, and the other end of the conductor 16 is exposed from the second surface 132.

The conductor 16 is formed in the through hole 15 by plating or filling a conductive paste.

S14, as shown in fig. 14, a second circuit layer 21 is formed on the second surface 132, the second circuit layer 21 includes a first conductive line 211 disposed substantially parallel to the second surface 132 and a second conductive line 212 disposed substantially perpendicular to the second surface 132, one end of the first conductive line 211 is electrically connected to one of the conductors 16, and the other end is electrically connected to the second conductive line 212.

S15, as shown in fig. 15, a dielectric layer 22 is formed on the second surface 132, the second circuit layer 21 is embedded in the dielectric layer 22, and an end of the second conductive line 212 facing away from the first conductive line 211 is exposed from a surface of the dielectric layer 22 facing away from the second surface 132.

The electrical connection Layer 2 is formed by using Redistribution Layer (RDL), and a part of the dielectric Layer 22 is polished by polishing, so that the second conductive line 212 is exposed from the surface of the dielectric Layer 22, and a connection pad 3 is subsequently arranged.

S16, as shown in fig. 3, a connecting pad 3 is formed on the end surface of the second conductive line 212 exposed from the dielectric layer 22.

The connecting pad 3 is formed on the end surface of the second conductive line 212 by copper electroplating.

S17, as shown in fig. 1, the first functional module 40 is disposed on the connecting pad 3, thereby obtaining the board-to-board connecting structure 100.

The first functional module 40 may be a circuit board, specifically, an FPC.

The first functional module 40 is connected to the connecting pad 3 by attaching anisotropic conductive adhesive or solder.

In this embodiment, as shown in fig. 1 and fig. 3, the preparation method may further include: a second functional module 50 is connected to the package module 10, the second functional module 50 is disposed on a side of the substrate 11 away from the electronic component 12, and the second functional module 50 is electrically connected to the package base 1a through a solder ball 4. Specifically, the second functional module 50 may be another circuit board different from the first functional module 40.

In this embodiment, as shown in fig. 1 and fig. 3, after the forming the electrical connection layer 2, the preparation method may further include: and forming a second packaging layer 5 on the surface of the substrate 11, wherein the first packaging layer 13 and the electrical connection layer 2 are embedded in the second packaging layer 5.

Another embodiment of the present application also provides a method for manufacturing a board-to-board connection structure 200, and the method for manufacturing the board-to-board connection structure 200 of the present embodiment is different from the method for manufacturing the board-to-board connection structure 100 of the previous embodiment in the following steps:

s21, as shown in fig. 16 and 17, the first package layer 13 of the package substrate 1b includes the first surface 131, the second surface 132, and a side surface 133 connecting the first surface 131 and the second surface 132, and an electrical connection layer 6 is disposed on the side surface 133.

The substrate 11 includes a substrate surface 111 disposed adjacent to the first encapsulation layer 13, and the first circuit layer 14 is disposed on the substrate surface 111. The substrate 11 is disposed beyond the side surface 133 of the first package layer 13, the side surface 133 and the substrate surface 111 enclose an accommodating space 17, and the first circuit layer 14 extends to the accommodating space 17. The electrical connection layer 6 is disposed on the side surface 133 and accommodated in the accommodating space 17, and the electrical connection layer 6 is electrically connected to the first circuit layer 14.

The electrical connection layer 6 and the first circuit layer 14 are electrically connected by means of soldering.

The specific manufacturing method of the electrical connection layer 6 is manufactured by using a conventional manufacturing method of a circuit board, and will not be described in detail herein.

S22, as shown in fig. 7, a connecting pad 3 is formed on the electrical connection layer 6.

S23, as shown in fig. 6, the first functional module 40 is attached to the connection pad 3 to form the board-to-board connection structure 200.

Referring to fig. 10 in combination, yet another embodiment of the present application further provides a method for manufacturing a board-to-board connection structure 300, and the method for manufacturing the board-to-board connection structure 300 of this embodiment is different from the methods for manufacturing the board-to-board connection structure 100 and the board-to-board connection structure 200 of the previous embodiments in the following steps:

s31, the first encapsulation layer 13 of the package base 1c includes the first surface 131, the second surface 132, and a side surface 133 connecting the first surface 131 and the second surface 132, the substrate 11 includes a substrate surface 111 disposed close to the first encapsulation layer 13, and the first circuit layer 14 is disposed on the substrate surface 111. The substrate 11 is disposed beyond the side surface 133 of the first package layer 13, the side surface 133 and the substrate surface 111 enclose an accommodating space 17, and the first circuit layer 14 extends to the accommodating space 17. Disposing an electrical connection layer 2 on the second surface 132, wherein the electrical connection layer 2 is electrically connected to the first circuit layer 14; another electrical connection layer 6 is disposed on the side surface 133, and the electrical connection layer 6 is accommodated in the accommodating space 17 and electrically connected to the first circuit layer 14.

S32, forming the connecting pads 3 on the electrical connection layer 2 and the electrical connection layer 6, respectively.

S33, connecting the two first functional modules 40 to the connecting pads 3 respectively on the electrical connection layer 2 and the electrical connection layer 6.

It is understood that, in other embodiments, the connection pads 3 may be formed directly on the electrical connection layer 2 and connected to the first functional module 40 after the formation of the electrical connection layer 2 is completed; after which the electrical connection layer 6 and the connection pads 3 located on the electrical connection layer 6 are arranged. The forming sequence of the electric connection layer 2 and the electric connection layer 6 can be changed according to actual needs.

It should be noted that the above is only a specific embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and all should be covered by the scope of the present application; in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A package module, comprising:

a package substrate comprising:

a substrate;

the first circuit layer is arranged on the substrate;

the electronic component is arranged on the substrate and is electrically connected with the first circuit layer;

the first packaging layer is positioned on the substrate and packages the electronic component and the first circuit layer, and comprises a first surface arranged close to the substrate, a second surface arranged away from the first surface and a side surface connecting the first surface and the second surface;

the electric connection layer is arranged on the second surface and/or the side surface and is electrically connected with the first circuit layer; and

and the connecting pad is arranged on the surface of the electric connection layer deviating from the first packaging layer and is electrically connected with the electric connection layer.

2. The package module according to claim 1, wherein the electrical connection layer is disposed on the second surface, the package substrate further comprises a through hole disposed through the first surface and the second surface, a conductor is disposed in the through hole, one end of the conductor is electrically connected to the first circuit layer, and the other end of the conductor is exposed on the second surface and electrically connected to the electrical connection layer.

3. The package module according to claim 2, wherein the first package layer includes a package region for packaging the electronic component and an edge region located at a periphery of the package region, and the via and the conductor are located at the edge region.

4. The package module according to claim 2, wherein the electrical connection layer comprises a second circuit layer and a dielectric layer, the second circuit layer is embedded in the dielectric layer, the second circuit layer comprises a first conductive wire and a second conductive wire, two ends of the first conductive wire are electrically connected to the conductor and the second conductive wire respectively, and one end of the second conductive wire, which is away from the first conductive wire, is exposed on a surface of the dielectric layer, which is away from the package substrate and electrically connected to the connection pad.

5. The package module according to claim 1, wherein the substrate includes a substrate surface disposed adjacent to the first package layer, the first circuit layer is disposed on the substrate surface, the substrate is disposed beyond the side surface of the first package layer, the side surface and the substrate surface together define a receiving space, the first circuit layer extends to the receiving space, and the electrical connection layer is disposed on the side surface and received in the receiving space.

6. The package module according to claim 5, wherein the electrical connection layer comprises a second circuit layer, a third circuit layer disposed on a side of the second circuit layer adjacent to the substrate, and a dielectric layer, the second circuit layer is embedded in the dielectric layer, the third circuit layer is electrically connected to the first circuit layer, and the second circuit layer is electrically connected to the third circuit layer.

7. The package module according to claim 6, wherein the second circuit layer comprises a first conductive trace and a second conductive trace, the second conductive trace is electrically connected to the third circuit layer and the first conductive trace, respectively, and an end of the first conductive trace facing away from the second conductive trace is exposed from a surface of the dielectric layer facing away from the first package layer and is electrically connected to the connecting pad.

8. The package module according to claim 1, wherein the number of the electrical connection layers is at least two, one of the electrical connection layers is disposed on the second surface, the package substrate further includes a through hole disposed through the first surface and the second surface, a conductor is disposed in the through hole, one end of the conductor is electrically connected to the first circuit layer, and the other end of the conductor is exposed at the second surface and electrically connected to the electrical connection layer;

the side surface is provided with another electric connection layer, the substrate comprises a substrate surface which is close to the first packaging layer, the first circuit layer is arranged on the substrate surface, the substrate is arranged beyond the side surface of the first packaging layer, the side surface and the substrate surface jointly enclose an accommodating space, the first circuit layer extends to the accommodating space, and the other electric connection layer is arranged on the side surface and accommodated in the accommodating space.

9. The package module of claim 1, further comprising a second encapsulation layer encapsulating the first encapsulation layer and the electrical connection layer.

10. A board-to-board connection structure, comprising the package module according to any one of claims 1 to 9 and a first functional module, wherein the first functional module is disposed on the connection pad and electrically connected to the package substrate through the connection pad and the electrical connection layer.

11. The board-to-board connection structure of claim 10, wherein a connection layer is disposed between the connection pad and the first functional module, and the connection layer comprises anisotropic conductive adhesive or solder paste.

12. The board-to-board connection structure of claim 10, further comprising a second functional module disposed on a side of the substrate facing away from the electronic component, the second functional module being electrically connected to the package substrate.

13. A terminal comprising a housing and a board-to-board connection structure housed within the housing, the board-to-board connection structure being as claimed in any one of claims 10 to 12.

14. A method for manufacturing a package module includes:

providing a packaging base body, wherein the packaging base body comprises a substrate, a first circuit layer arranged on the substrate, an electronic component arranged on the substrate and electrically connected with the first circuit layer, and a first packaging layer which is positioned on the substrate and packages the electronic component and the first circuit layer, and the first packaging layer comprises a first surface arranged close to the substrate, a second surface arranged away from the first surface, and a side surface connecting the first surface and the second surface;

forming an electrical connection layer on the second surface and/or the side surface, wherein the electrical connection layer is electrically connected with the first circuit layer; and

and arranging a connecting pad on the surface of the electric connecting layer, which is far away from the first packaging layer, wherein the connecting pad is electrically connected with the electric connecting layer, so that the packaging module is obtained.

15. The method for manufacturing a package module according to claim 14, wherein the first package layer includes a package region for packaging the electronic component and an edge region located at a periphery of the package region,

before forming the electrical connection layer, the preparation method further includes the steps of:

punching the edge area to form a through hole, wherein the through hole penetrates through the first surface and the second surface; and

forming a conductor in the through hole, wherein the conductor is electrically connected with the first circuit layer, and one end of the conductor, which is far away from the first circuit layer, is exposed from the second surface;

after the conductor is formed, the preparation method of the electric connection layer comprises the following steps:

forming a second circuit layer on the second surface, wherein the second circuit layer comprises a first conducting wire and a second conducting wire, and two ends of the first conducting wire are respectively electrically connected with the conductor and the second conducting wire; and

and forming a dielectric layer on the second surface, embedding the second circuit layer in the dielectric layer, and exposing one end of the second wire, which is far away from the first wire, from the surface of the dielectric layer so as to obtain the electric connection layer.

16. The method of manufacturing a package module according to claim 14, wherein the substrate includes a substrate surface disposed adjacent to the first package layer, the first circuit layer is disposed on the substrate surface, the substrate is disposed beyond the side surface of the first package layer, the side surface and the substrate surface together define an accommodation space, the first circuit layer extends to the accommodation space, and the electrical connection layer is disposed on the side surface and accommodated in the accommodation space.

17. The method for manufacturing a package module according to claim 14, wherein after the forming the electrical connection layer, the method further comprises:

and forming a second packaging layer on the surface of the substrate, so that the first packaging layer and the electric connection layer are embedded in the second packaging layer.

18. A method of making a board-to-board connection, comprising:

providing the package module of any one of claims 1 to 9;

forming a connection layer on the connection pad; and

providing a first functional module, and arranging the first functional module on the connecting layer, thereby obtaining the board-to-board connecting structure.

19. The method of manufacturing a board-to-board connection structure according to claim 18, wherein the connection layer includes anisotropic conductive paste or solder paste.

20. The method of manufacturing a plate-to-plate connection structure according to claim 18, further comprising:

and arranging a second functional module on one side of the substrate, which is far away from the first circuit layer, wherein the second functional module is electrically connected with the first circuit layer.