CN113845863A - Conductive adhesive, preparation method thereof and conductive film - Google Patents
Conductive adhesive, preparation method thereof and conductive film Download PDFInfo
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- CN113845863A CN113845863A CN202111201909.XA CN202111201909A CN113845863A CN 113845863 A CN113845863 A CN 113845863A CN 202111201909 A CN202111201909 A CN 202111201909A CN 113845863 A CN113845863 A CN 113845863A
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- 239000000853 adhesive Substances 0.000 title claims abstract description 81
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 81
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000002105 nanoparticle Substances 0.000 claims abstract description 69
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 61
- 239000002904 solvent Substances 0.000 claims abstract description 28
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 30
- 239000011701 zinc Substances 0.000 claims description 25
- 239000003960 organic solvent Substances 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- 238000001035 drying Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 19
- -1 polyethylene Polymers 0.000 claims description 15
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 14
- 239000000725 suspension Substances 0.000 claims description 14
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 13
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 12
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 12
- 229910052725 zinc Inorganic materials 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 238000004729 solvothermal method Methods 0.000 claims description 10
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 claims description 9
- 239000012046 mixed solvent Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 238000000926 separation method Methods 0.000 claims description 7
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 claims description 6
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims description 6
- 239000004312 hexamethylene tetramine Substances 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 5
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 5
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 3
- 229920002319 Poly(methyl acrylate) Polymers 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000001308 synthesis method Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 44
- 239000004332 silver Substances 0.000 abstract description 44
- 230000009471 action Effects 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 43
- 230000000052 comparative effect Effects 0.000 description 16
- 239000000243 solution Substances 0.000 description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 13
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 13
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 12
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 11
- 239000004810 polytetrafluoroethylene Substances 0.000 description 11
- 239000002244 precipitate Substances 0.000 description 11
- 239000000047 product Substances 0.000 description 9
- 230000002194 synthesizing effect Effects 0.000 description 7
- 238000005406 washing Methods 0.000 description 6
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- 239000013078 crystal Substances 0.000 description 5
- 239000008367 deionised water Substances 0.000 description 5
- 229910021641 deionized water Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229960004011 methenamine Drugs 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
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- 239000011231 conductive filler Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
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- 238000002441 X-ray diffraction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003574 free electron Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000005325 percolation Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
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- 238000000576 coating method Methods 0.000 description 2
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- 239000000806 elastomer Substances 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
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- 238000009825 accumulation Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
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- 230000026058 directional locomotion Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
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- 238000011049 filling Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Substances OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 239000002159 nanocrystal Substances 0.000 description 1
- 239000002077 nanosphere Substances 0.000 description 1
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- 230000005641 tunneling Effects 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
The application provides a conductive adhesive, a preparation method thereof and a conductive film, wherein the conductive adhesive comprises the following components in percentage by mass of 100% of the total mass of the conductive adhesive: 1-10% of AZO nano particles, 22-42% of adhesive and 50-70% of silver powder. The conductive adhesive is composed of AZO nanoparticles, an adhesive and silver powder, wherein the spherical AZO nanoparticles are good in dispersibility in different solvents and have good affinity with silver, Ag and the AZO nanoparticles are mutually crosslinked and stacked together under the action of the adhesive, the AZO can connect the silver and the silver with each other like a bridge, and meanwhile, electrons are enabled to be rapidly transferred between the silver and the silver based on the good conductivity of the AZO, so that the resistance of the conductive adhesive can be greatly reduced, and the conductivity of the conductive adhesive can be improved.
Description
Technical Field
The application relates to the technical field of adhesive materials, in particular to a conductive adhesive, a preparation method thereof and a conductive film.
Background
Conductive paste is a bonding solution proposed as a substitute for conventional tin-lead solder. Compared with the traditional lead material connection method, the conductive adhesive is used as an adhesive with certain conductive performance after being cured or dried, and the adhesion process has the remarkable advantages of mild conditions, simple process, less pollution, low cost and the like.
The conductive paste may be classified into an isotropic conductive paste (ICA) and an anisotropic conductive paste (ACA) according to a conductive direction. ACA and ICA are distinguished by whether the percentage of filler exceeds the percolation threshold, which is about 10-20% of the volume fraction of the conductive adhesive in silver conductive adhesives commonly available on the market. For isotropic conductive pastes, the conductive filler loading exceeds the percolation threshold (typically between 20-60%) and is thus conductive in the x, y and z directions. In contrast, the loading of the conductive filler used in anisotropic conductive adhesives is well below the percolation threshold (typically between 5-10%), and is insufficient to achieve mutual contact between the conductive particles and impair the conductivity in the x-y plane. Under the heating and pressurizing state, the conductive fillers are mutually contacted under the action of external force, so that the capability of conducting electricity in a single direction in the vertical direction is obtained.
For isotropic conductive adhesives, the conductivity is one of the important criteria for evaluating the quality of the conductive adhesives. In order to improve the conductivity of conductive adhesives, researchers often choose to have a conductivity of approximately 106S/m nano metal material with extremely high conductivity, such as silver nano crystal and the like, is used as the conductive filler. However, the conductive adhesive of this scheme has high production cost, and thus is not suitable for industrial production.
Disclosure of Invention
The application aims to provide a conductive adhesive with high conductivity and low silver content, a preparation method thereof and a conductive film.
In order to achieve the above purpose, the invention provides the following technical scheme:
a conductive paste comprising, based on 100% of the total mass of the conductive paste: 1-10% of AZO (aluminum-doped zinc oxide) nano particles, 22-42% of adhesive and 50-70% of silver powder.
In some embodiments, the adhesive comprises at least one of TPU (thermoplastic polyurethane elastomer), epoxy, polyvinyl alcohol, polyethylene, polyvinyl chloride, and polymethyl acrylate.
In some embodiments, the silver powder has a particle size of 1 to 3 μm.
In some embodiments, the method of synthesizing AZO nanoparticles comprises:
mixing components including a zinc source, an aluminum source and a solvent, and carrying out a solvothermal reaction;
and carrying out solid-liquid separation on the product after the solvothermal reaction.
In some embodiments, the solvothermal reaction is carried out at a temperature of 180-220 ℃ for a period of 24-48 h;
preferably, the synthesis method further comprises drying the solid obtained by solid-liquid separation.
In some embodiments, the zinc source comprises Zn (CH)3COO)2·2H2O and Zn (NO)3)2·6H2At least one of O;
preferably, the aluminum source comprises AlCl3、Al(CH3CO2)3And Al (NO)3)3·9H2At least one of O;
preferably, the solvent is a mixed solvent of a first organic solvent and water, and the first organic solvent includes diethylene glycol or hexamethylenetetramine;
preferably, the mass ratio of the zinc source to the aluminum source is 1 (0.006-0.024);
preferably, the zinc source and solvent are used in an amount of 1: (50-70) g/ml.
The application also provides a preparation method of the conductive adhesive, wherein the conductive adhesive is the conductive adhesive;
the preparation method comprises the following steps: the components including AZO nanoparticles, a binder, and silver powder were mixed.
In some embodiments, the method of making comprises: dissolving the adhesive in a second organic solvent at 60-100 ℃ to obtain a mixed solution;
dispersing AZO nano particles in the mixed solution to obtain a suspension;
dispersing silver powder in the suspension to obtain conductive adhesive;
preferably, the second organic solvent comprises at least one of 1, 4-dioxane, acetone, and ethyl acetate;
preferably, the dosage ratio of the adhesive to the second organic solvent is (0.22-0.42) g/(15-30) ml;
preferably, the preparation method further comprises adjusting the viscosity of the conductive adhesive;
preferably, the viscosity of the conductive adhesive is adjusted by heating and evaporating, and more preferably, the heating and evaporating temperature is 70-100 ℃ and the time is 1-3 h.
The application also provides a conductive film, which is obtained by coating the conductive adhesive on a substrate and drying.
In some embodiments, the drying temperature is 120-170 ℃ for 1-4 h.
The beneficial effect of this application:
(1) the conductive adhesive is composed of AZO nano-particles, an adhesive and silver powder, wherein the spherical AZO nano-particles have good dispersibility in different solvents and have good affinity with silver, Ag and the AZO nano-particles are mutually crosslinked and stacked together under the action of the adhesive, the AZO can mutually connect the silver and the silver like a bridge, and meanwhile, electrons are promoted to be quickly transferred between the silver and the silver based on the good conductivity of the AZO, so that the resistance of the conductive adhesive can be greatly reduced, and the conductivity of the conductive adhesive can be improved; the conductive adhesive can be widely applied to the fields of conductive connection, flexible circuit construction, electromagnetic shielding device construction and the like.
(2) The conductive adhesive prepared by the preparation process is simple in preparation process and low in production cost, is excellent in conductivity and the like, and is suitable for industrial mass production.
Drawings
To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments are briefly described below, and it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope of the present application.
FIG. 1 is an XRD pattern of AZO nanoparticles prepared in example 1 and commercially available ZnO nanoparticles;
FIG. 2a is an SEM topography of AZO nanoparticles;
FIG. 2b is a graph of the particle size distribution of AZO nanoparticles;
FIG. 3 is a diagram of a colloidal suspension of AZO nanoparticles in water and an organic solvent;
FIG. 4 is an SEM topography of the conductive film prepared in example 1;
FIG. 5a is a comparative statistical chart of the resistivity of the conductive films prepared in examples 3, 6 to 7 and 1 to 3 after heat treatment at 100 ℃;
fig. 5b is a linear graph of the resistivity of the conductive film with different doping amounts of AZO nanoparticles.
Detailed Description
The terms as used herein:
"prepared from … …" is synonymous with "comprising". The terms "comprises," "comprising," "includes," "including," "has," "having," "contains," "containing," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion. For example, a composition, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such composition, process, method, article, or apparatus.
The conjunction "consisting of … …" excludes any unspecified elements, steps or components. If used in a claim, the phrase is intended to claim as closed, meaning that it does not contain materials other than those described, except for the conventional impurities associated therewith. When the phrase "consisting of … …" appears in a clause of the subject matter of the claims rather than immediately after the subject matter, it defines only the elements described in the clause; other elements are not excluded from the claims as a whole.
When an amount, concentration, or other value or parameter is expressed as a range, preferred range, or as a range of upper preferable values and lower preferable values, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are separately disclosed. For example, when the range "1 ~ 5" is disclosed, the ranges described should be construed to include the ranges "1 ~ 4", "1 ~ 3", "1 ~ 2 and 4 ~ 5", "1 ~ 3 and 5", and the like. When a range of values is described herein, unless otherwise stated, the range is intended to include the endpoints thereof and all integers and fractions within the range.
In these examples, the parts and percentages are by mass unless otherwise indicated.
"part by mass" means a basic unit of measure indicating a mass ratio of a plurality of components, and 1 part may represent any unit mass, for example, 1g or 2.689 g. If we say that the part by mass of the component A is a part by mass and the part by mass of the component B is B part by mass, the ratio of the part by mass of the component A to the part by mass of the component B is a: b. alternatively, the mass of the A component is aK and the mass of the B component is bK (K is an arbitrary number, and represents a multiple factor). It is unmistakable that, unlike the parts by mass, the sum of the parts by mass of all the components is not limited to 100 parts.
"and/or" is used to indicate that one or both of the illustrated conditions may occur, e.g., a and/or B includes (a and B) and (a or B).
The application provides a conductive adhesive, which comprises the following components in percentage by mass based on the total mass of the conductive adhesive as 100 percent:
AZO (aluminum doped zinc oxide) nanoparticles 1-10%, such as 1%, 2%, 4%, 6%, 8%, or 10%, etc.;
binder 22-42%, such as 22%, 25%, 30%, 33%, 35%, 39%, or 42%, etc.;
50-70% of silver powder, such as 50%, 55%, 60%, 65%, 68% or 70%.
In some embodiments, the adhesive includes, but is not limited to, at least one of TPU (thermoplastic polyurethane elastomer), epoxy, polyvinyl alcohol, polyethylene, polyvinyl chloride, and polymethyl acrylate.
In some embodiments, the particle size of the silver powder is 1-3 μm, that is, the adopted micro silver sheet enables AZO nanoparticles to be well distributed on the micro silver sheet and play a role of a bridge, the thickness of the insulating layer is reduced, and the transmission of electrons between the micro silver sheets can be well promoted, so that the conductivity of the conductive adhesive is improved.
In some embodiments, the method of synthesizing AZO nanoparticles comprises:
s10, mixing components including a zinc source, an aluminum source and a solvent, and carrying out a solvothermal reaction;
s20, carrying out solid-liquid separation on the product after the solvothermal reaction.
In some embodiments, the solvothermal reaction is carried out at a temperature of 180-220 ℃ for a period of 24-48 h;
preferably, the synthesis method further comprises drying the solid obtained by solid-liquid separation.
In some embodiments, the zinc source comprises Zn (CH)3COO)·2H2O and Zn (NO)3)2·6H2At least one of O; the aluminum source comprises AlCl3、Al(CH3CO2)3And Al (NO)3)3·9H2At least one of O; the solvent is a mixed solvent of a first organic solvent and water, and the first organic solvent comprises diethylene glycol or hexamethylenetetramine.
In some embodiments, the mass ratio of the zinc source to the aluminum source is 1 (0.006-0.024); the dosage of the zinc source and the solvent is 1: (50-70) g/ml.
When the first organic solvent is diethylene glycol, the volume ratio of diethylene glycol to water is (7-9): (1-3); when the first organic solvent is hexamethylenetetramine, the volume ratio of the hexamethylenetetramine to the water is 50: (1-20), and the molar mass of the Zn source is the same as that of the hexamethylene tetramine.
The solid-liquid separation process comprises the following steps: and (3) carrying out centrifugal washing on the product after the solvothermal reaction by adopting water and ethanol, and collecting the precipitate.
The application also provides a preparation method of the conductive adhesive, wherein the conductive adhesive is the conductive adhesive;
the preparation method comprises the following steps: the components including AZO nanoparticles, a binder, and silver powder were mixed.
In some embodiments, the method of making comprises:
s100, dissolving the adhesive in a second organic solvent at 60-100 ℃ to obtain a mixed solution; preferably, the second organic solvent comprises 1, 4-dioxane; the dosage ratio of the adhesive to the second organic solvent is as follows;
s200, dispersing AZO nano particles in the mixed solution to obtain a suspension;
and S300, dispersing silver powder in the suspension to obtain the conductive adhesive.
In some embodiments, the method further comprises adjusting the viscosity of the conductive paste to achieve a desired optimal viscosity; preferably, the viscosity of the conductive adhesive is adjusted by heating and evaporating, and more preferably, the heating and evaporating temperature is 70-100 ℃ and the time is 1-3 h.
The application also provides a conductive film, which is obtained by coating the conductive adhesive on a substrate such as a polytetrafluoroethylene plate and drying.
In some embodiments, the drying temperature is 120-170 ℃ for 1-4 h.
It should be noted that the inventors of the present application found that the conductivity of the conductive paste depends on the degree of closeness of the silver micro-scale plate; when the solvent remains in the conductive film, the micro silver flakes will be dispersed in the binder and the conductive path cannot be formed; as the solvent evaporates and the adhesive cures, the gaps (insulating layers) between the silver flakes decrease, tunneling occurs, which makes it possible for the free electrons in the silver flakes to penetrate the insulating layers, so that directional motion occurs, i.e., the film begins to exhibit electrical conductivity; however, due to the difficulty of eliminating the insulating layer, resistance is always present in the conductive thin film, in other words, the conductivity of the conductive film is closely related to the thickness of the insulating layer, the moving speed of free electrons increases with the attenuation of the insulating layer, and finally one conductive layer is formed. According to the method, the thickness of the insulating layer is reduced by filling gaps of the micro silver sheets with the AZO nano particles, and the AZO nano particles are used as a bridge to promote the transfer of free electrons between the micro silver sheets; based on this, the conductive performance of the conductive film is greatly improved.
Embodiments of the present application will be described in detail below with reference to specific examples, but those skilled in the art will appreciate that the following examples are only illustrative of the present application and should not be construed as limiting the scope of the present application. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
Example 1
(1) Synthesis of AZO nanoparticles: 1g of Zn (CH)3COO)2·2H2O and 0.006g AlCl3Dissolving in a mixed solvent of 45ml of diethylene glycol and 5ml of deionized water, and then carrying out solvent heating at 180 ℃ for 48 hours; and then, centrifugally washing the product after the solvent thermal reaction by water and ethanol in sequence, collecting the precipitate, and drying the precipitate overnight to obtain the AZO nano-particles.
(2) Synthesizing a conductive adhesive: 0.28g of TPU was dissolved well in 20ml of 1, 4-dioxane solution at 60 ℃, then 0.02g of AZO nanoparticles was dispersed ultrasonically in the above solution, then 0.70g of silver micro-flakes (diameter 1-3 μm) were added to the suspension under vigorous stirring, and then heated at 70 ℃ for 2 hours to remove part of the solvent to adjust the viscosity, to obtain a conductive adhesive.
(3) Preparing a conductive film: and pouring the conductive adhesive onto a polytetrafluoroethylene plate, drying at 120 ℃ for 2h, and removing the obtained flexible film, namely the conductive film, from the polytetrafluoroethylene plate.
Example 2
(1) Synthesis of AZO nanoparticles: 1g of Zn (CH)3COO)2·2H2O and 0.012g AlCl3Dissolving in a mixed solvent of 48ml of diethylene glycol and 12ml of deionized water, and then carrying out solvent heating at 200 ℃ for 36 h; and then, centrifugally washing the product after the solvent thermal reaction by water and ethanol in sequence, collecting the precipitate, and drying the precipitate overnight to obtain the AZO nano-particles.
(2) Synthesizing a conductive adhesive: 0.31g of TPU was dissolved well in 24ml of 1, 4-dioxane solution at 70 ℃, then 0.04g of AZO nanoparticles were dispersed ultrasonically in the above solution, then 0.65g of silver micro-flakes (diameter 1-3 μm) were added to the suspension under vigorous stirring, then heated at 80 ℃ for 1.5h to remove part of the solvent to adjust the viscosity, and conductive paste was obtained.
(3) Preparing a conductive film: and pouring the conductive adhesive onto a polytetrafluoroethylene plate, drying at 150 ℃ for 1.5h, and removing the obtained flexible film, namely the conductive film, from the polytetrafluoroethylene plate.
Example 3
(1) Synthesis of AZO nanoparticles: 1g of Zn (CH)3COO)2·2H2O and 0.024g AlCl3Dissolving in a mixed solvent of 42ml of diethylene glycol and 18ml of deionized water, and then carrying out solvent heating for 30h at 200 ℃; and then, centrifugally washing the product after the solvent thermal reaction by water and ethanol in sequence, collecting the precipitate, and drying the precipitate overnight to obtain the AZO nano-particles.
(2) Synthesizing a conductive adhesive: 0.42g of TPU was dissolved well in 30ml of 1, 4-dioxane solution at 60 ℃, then 0.08g of AZO nanoparticles was dispersed ultrasonically in the above solution, then 0.50g of silver micro-flakes (diameter 1-3 μm) were added to the suspension under vigorous stirring, and then heated at 90 ℃ for 1 hour to remove part of the solvent to adjust the viscosity, to obtain a conductive adhesive.
(3) Preparing a conductive film: and pouring the conductive adhesive onto a polytetrafluoroethylene plate, drying at 150 ℃ for 1.5h, and removing the obtained flexible film, namely the conductive film, from the polytetrafluoroethylene plate.
Example 4
(1) Synthesis of AZO nanoparticles: 1g of Zn (NO)3)2·6H2O and 0.018g Al (CH)3CO2)3Dissolving in a mixed solvent of 45ml of diethylene glycol and 5ml of deionized water, and then carrying out solvent heating at 220 ℃ for 24 hours; and then, centrifugally washing the product after the solvent thermal reaction by water and ethanol in sequence, collecting the precipitate, and drying the precipitate overnight to obtain the AZO nano-particles.
(2) Synthesizing a conductive adhesive: 0.32g of polyvinyl alcohol was sufficiently dissolved in 20ml of an ethyl acetate solution at 90 ℃, then 0.06g of AZO nanoparticles was ultrasonically dispersed in the above solution, then 0.62g of a micro silver plate (diameter 1 to 3 μm) was added to the suspension under strong stirring, and then heated at 100 ℃ for 1 hour to remove a part of the solvent to adjust the viscosity, to obtain a conductive adhesive.
(3) Preparing a conductive film: and pouring the conductive adhesive onto a polytetrafluoroethylene plate, drying at 170 ℃ for 1h, and then removing the obtained flexible film, namely the conductive film, from the polytetrafluoroethylene plate.
Example 5
(1) Synthesis of AZO nanoparticles: 1g of Zn (NO)3)2·6H2O and 0.038g Al (CH)3CO2)3Dissolving in a mixed solvent of 49ml of diethylene glycol and 14ml of deionized water, and then carrying out solvent heating for 38 hours at 180 ℃; and then, centrifugally washing the product after the solvent thermal reaction by water and ethanol in sequence, collecting the precipitate, and drying the precipitate overnight to obtain the AZO nano-particles.
(2) Synthesizing a conductive adhesive: 0.38g of polyvinyl alcohol was sufficiently dissolved in 28ml of an ethyl acetate solution at 100 ℃, then 0.1g of AZO nanoparticles was ultrasonically dispersed in the above solution, then 0.52g of a micro silver plate (diameter 1 to 3 μm) was added to the suspension under strong stirring, and then heated at 70 ℃ for 2 hours to remove a part of the solvent to adjust the viscosity, to obtain a conductive paste.
(3) Preparing a conductive film: and pouring the conductive adhesive onto a polytetrafluoroethylene plate, drying at 120 ℃ for 2h, and removing the obtained flexible film, namely the conductive film, from the polytetrafluoroethylene plate.
Example 6
The present embodiment 6 differs from embodiment 3 in that: in the step (2): replacing 0.42g of TPU with 0.32g, and replacing 0.50g of micron silver sheet with 0.60 g; otherwise, the same procedure as in example 1 was repeated.
Example 7
The present embodiment 7 differs from embodiment 3 in that: in the step (2): replacing 0.42g of TPU with 0.22g, and replacing 0.50g of micron silver sheet with 0.70 g; otherwise, the same procedure as in example 1 was repeated.
Comparative example 1
Comparative example 1 differs from example 3 in that: in the step (2): AZO nanoparticles are not added (namely the using amount of the AZO nanoparticles is 0), and 0.42g of TPU is replaced by 0.50 g; otherwise, the same procedure as in example 1 was repeated.
Comparative example 2
Comparative example 2 differs from example 3 in that: in the step (2): AZO nano particles are not added (namely the dosage of the AZO nano particles is 0), 0.42g of TPU is replaced by 0.40g, and 0.50g of micro silver sheet is replaced by 0.60 g; otherwise, the same procedure as in example 1 was repeated.
Comparative example 3
Comparative example 3 differs from example 3 in that: in the step (2): the AZO nano particles are not added (namely the dosage of the AZO nano particles is 0), the dosage of the TPU is 0.42g instead of 0.30g, and the dosage of the micro silver sheet is 0.50g instead of 0.70 g; otherwise, the same procedure as in example 1 was repeated.
FIG. 1 is an XRD pattern of AZO nanoparticles prepared in example 1 and commercially available ZnO nanoparticles; as can be seen from the figure, ZnO shows (100), (002), (101), (102), (110), (103), (200), (112) and (201) crystal planes associated with the hexagonal wurtzite structure at 2 θ of 31 °, 34 °, 36 °, 47 °, 56 °, 62 °, 66 °, 67 ° and 69 °, respectively; the AZO nanoparticles and the ZnO nanoparticles have the same peak position on the spectrum, but the intensity, the half-peak width (FWHM) and the peak position are changed. This is probably due to Al3+(53pm) ion radius ratio Zn2+(74pm) is small, so that the doped Al ions replace the positions of Zn ions in the crystal lattice but do not change the whole structure of the crystal lattice; furthermore, according to the Scherrer formula, the crystal size of the nanoparticles was significantly increased after doping, which reflects that the presence of the foreign atom Al may improve the crystal growth; thus, the results of this XRD demonstrate the successful preparation of AZO nanoparticles.
FIG. 2a is an SEM topography of AZO nanoparticles, and FIG. 2b is a particle size distribution diagram of AZO nanoparticles; as can be seen from fig. 2a and 2 b: AZO nanoparticles appear as nanospheres with an average particle size of about 40.48 nm.
FIG. 3 is a diagram of a colloidal suspension of AZO nanoparticles in water and organic solvent (1-water, 2-methanol, 3-ethanol, 4-acetone, 5-methylisobutylketone, 6-1, 4-dioxane, 7-ethyl acetate); the results of this figure 3 show that: the AZO nano-particles can form stable colloidal suspension in water and most organic solvents, which is beneficial to preparing a conductive adhesive material with high performance.
It should be noted that the XRD patterns and SEM morphology patterns of the AZO nanoparticles prepared in examples 2-5 are substantially the same as those of example 1.
FIG. 4 is an SEM topography of the conductive film prepared in example 1; as can be seen from the figure, the micro silver flakes and AZO nanoparticles are stacked on top of each other under the action of the TPU, and AZO is mainly present in the voids between the silver flakes. This phenomenon indicates that AZO can link adjacent micron silver sheets like a "bridge" and promote the rapid transfer of electrons between different silver sheets based on its own good conductivity.
The SEM topography of the conductive films prepared in examples 2-5 was substantially the same as example 1.
Fig. 5a is a comparative statistical chart of resistivity after heat treatment at 100 ℃ for the conductive films prepared in examples 3 and 6 to 7 (the amount of AZO is 8 wt% and the silver content is 50 wt%, 60 wt%, 70 wt%, respectively) and the conductive films prepared in comparative examples 1 to 3 (the amount of AZO is 0 and the silver content is 50 wt%, 60 wt%, 70 wt%, respectively) (wherein examples with the same silver content are compared with comparative examples, i.e., example 3 is compared with comparative example 1, example 6 is compared with comparative example 2, and example 7 is compared with comparative example 3). As can be seen from fig. 5a, the resistivity of the conductive film prepared in example 3 reached 2338.8 × 10-5Ω · cm, which is about 1/1.02 of the conductive film prepared in comparative example 1 with the same silver content; the resistivity of the conductive film prepared in example 6 reached 8.5 × 10-5Ω · cm, about 1/196 for the conductive film prepared in comparative example 2 with the same silver content; the resistivity of the conductive film prepared in example 7 reached 13.3 × 10-5Ω · cm, is about 1/24 for the conductive film prepared in comparative example 3 with the same silver content. The conductivity test result proves that the bridge action of the AZO can well promote the transmission of electrons between different micron silver sheets, so that the conductivity of the conductive adhesive is improved.
In addition, by using example 6 in which the addition amount of the micro silver flakes is 60 wt% as a control, after the doping amounts of the AZO nanoparticles (0 wt%, 2 wt%, 5 wt%, and 10 wt%, respectively) are changed, the resistivity of the conductive film of the AZO nanoparticles with different doping amounts, in which the addition amount of the micro silver flakes is 60 wt%, is characterized, and the result is shown in fig. 5 b. From this fig. 5b, it can be understood that when the doping amount of the AZO nanoparticles is 0 wt%, the resistivity of the resulting conductive film is as high as 1638.8 × 10-5Ω·cm,After a small amount of AZO nano-particles are added, the resistivity of the obtained conductive film is reduced sharply, and when the doping amount of the AZO nano-particles is increased to 8 wt%, the resistivity of the obtained conductive film is reduced to 8.5 multiplied by 10-51/196 at about 0% Ω · cm; when the doping amount of the AZO nano particles is further increased by 10%, the resistivity of the conductive film is increased to 50.2 multiplied by 10%-5Ω · cm, which is probably because the excess accumulation of AZO results in larger gaps between silver flakes and voids of varying degrees, resulting in a decrease in conductivity.
Therefore, under the condition of the same silver content, the conductive adhesive is added with AZO with the content of 1-10 wt% and has lower resistivity (namely higher conductivity) compared with a conductive film prepared without AZO; moreover, the doping amount of the AZO nanoparticles is the optimal doping amount at 8 wt%, and the resistivity of the obtained conductive adhesive is the lowest (i.e. the conductivity is the highest).
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Moreover, those skilled in the art will appreciate that while some embodiments herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the application and form different embodiments. For example, in the claims above, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the application and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Claims (10)
1. A conductive paste comprising, based on 100% by mass of the paste: 1-10% of AZO nano particles, 22-42% of adhesive and 50-70% of silver powder.
2. The conductive paste of claim 1, wherein the binder comprises at least one of TPU, epoxy, polyvinyl alcohol, polyethylene, polyvinyl chloride, and polymethyl acrylate.
3. The conductive paste according to claim 1, wherein the silver powder has a particle size of 1 to 3 μm.
4. The conductive paste according to claim 1, wherein the AZO nanoparticles are synthesized by a method comprising:
mixing components including a zinc source, an aluminum source and a solvent, and carrying out a solvothermal reaction;
and carrying out solid-liquid separation on the product after the solvothermal reaction.
5. The conductive adhesive as claimed in claim 4, wherein the temperature of the solvothermal reaction is 180-220 ℃ and the time is 24-48 h;
preferably, the synthesis method further comprises drying the solid obtained by solid-liquid separation.
6. The conductive paste of any one of claims 1-4, wherein the zinc source comprises Zn (CH)3COO)2·2H2O and Zn (NO)3)2·6H2At least one of O;
preferably, the aluminum source comprises AlCl3、Al(CH3CO2)3And Al (NO)3)3·9H2At least one of O;
preferably, the solvent is a mixed solvent of a first organic solvent and water, and the first organic solvent includes diethylene glycol or hexamethylenetetramine;
preferably, the mass ratio of the zinc source to the aluminum source is 1: (0.006-0.024);
preferably, the zinc source and solvent are used in an amount of 1: (50-70) g/ml.
7. A method for preparing a conductive adhesive, characterized in that the conductive adhesive is the conductive adhesive according to any one of claims 1 to 6;
the preparation method comprises the following steps: the components including AZO nanoparticles, a binder, and silver powder were mixed.
8. The method for preparing the conductive paste according to claim 7, comprising: dissolving the adhesive in a second organic solvent at 60-100 ℃ to obtain a mixed solution;
dispersing the AZO nano particles in the mixed solution to obtain a suspension;
dispersing silver powder in the suspension to obtain the conductive adhesive;
preferably, the second organic solvent comprises at least one of 1, 4-dioxane, acetone, and ethyl acetate;
preferably, the dosage ratio of the adhesive to the second organic solvent is (0.22-0.42) g/(15-30) ml;
preferably, the preparation method further comprises adjusting the viscosity of the conductive adhesive;
preferably, the viscosity of the conductive adhesive is adjusted by heating and evaporating, and more preferably, the heating and evaporating temperature is 70-100 ℃ and the time is 1-3 h.
9. A conductive film obtained by applying the conductive paste according to any one of claims 1 to 6 to a substrate and drying the applied conductive paste.
10. The conductive film of claim 9 wherein the drying temperature is 120-170 ℃ for 1-4 h.
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