CN113843706A - Quartz base slot hole machining method - Google Patents
Quartz base slot hole machining method Download PDFInfo
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- CN113843706A CN113843706A CN202111226023.0A CN202111226023A CN113843706A CN 113843706 A CN113843706 A CN 113843706A CN 202111226023 A CN202111226023 A CN 202111226023A CN 113843706 A CN113843706 A CN 113843706A
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- quartz
- long
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- groove
- plate
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- 239000010453 quartz Substances 0.000 title claims abstract description 164
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 164
- 238000000034 method Methods 0.000 title claims description 29
- 238000003754 machining Methods 0.000 title description 4
- 238000003466 welding Methods 0.000 claims abstract description 10
- 238000003672 processing method Methods 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims abstract description 5
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000000428 dust Substances 0.000 description 6
- 239000002775 capsule Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention discloses a quartz base long hole processing method which comprises the following steps of a, taking a cake-shaped quartz plate (1), processing an exhaust hole (2) and two air inlet holes (3) on the top surface of the quartz plate (1) to obtain a product A, B, processing two long grooves (4) on the bottom surface of the product A, connecting one ends of the two long grooves (4) with the exhaust hole (2), respectively connecting the other ends of the two long grooves (4) with the two air inlet holes (3) to obtain a product B, C, cutting according to the length of the long grooves (4) to obtain two quartz tubes (5), respectively placing the two quartz tubes (5) into the two long grooves (4) of the product B to obtain a product C, d, manufacturing two quartz cover plates (6) matched with the long grooves (4), respectively covering the two quartz cover plates (6) on the two quartz tubes (5), and welding the quartz cover plates (6) and the quartz plate (1) of the product C into a whole, and obtaining a finished product. The invention has the advantages of high processing efficiency, high processing success rate and low reject ratio.
Description
Technical Field
The invention belongs to the field of semiconductor processing.
Background
The quartz susceptor is a part used in a semiconductor gate oxidation process, and is used for introducing hydrogen and oxygen into a matched quartz pot in the gate oxidation process as shown in fig. 5 and 6. The quartz susceptor had a diameter of about 260mm and a thickness of about 9 mm.
The structure of quartz base, including the finish machining preparation, the quartz plate of cake form, the middle part of quartz plate is equipped with the exhaust hole of being connected with the quartz capsule, the inside of quartz plate is equipped with two slot holes all of being connected with the exhaust hole, slot hole diameter 4mm, be equipped with respectively on the quartz plate with two inlet ports of being connected of slot hole, two inlet ports all are located the outside of quartz capsule, hydrogen and oxygen enter into corresponding slot hole from two inlet ports respectively, enter into the quartz capsule through the exhaust hole.
The existing quartz base processing method comprises the steps of processing an exhaust hole in the middle of a quartz plate, drilling holes in the side wall of the quartz plate aiming at the exhaust hole, processing two long holes, processing two air inlets corresponding to the long holes, and sealing the long holes on the side wall of the quartz plate.
In the actual processing process, the long hole to be processed is long (more than 12cm) and small in diameter (4mm), so that the long hole can only be drilled by a slender drill, but the quartz material is hard and brittle, so that the long hole is very difficult to process, the drill is required to drill at a very low feeding speed, the processing efficiency is low, but the quartz plate cannot be broken in the drilling process, and the processing success rate of the quartz base is still low. Because the drill bit is too thin and too long, the drill bit shakes a large amount in the drilling process, so that the processed long hole pattern is irregular, the requirements of customers are difficult to achieve, and the reject ratio of the obtained quartz base is high.
Therefore, the existing method for processing the quartz base has the defects of low processing efficiency, low processing success rate and high reject ratio.
Disclosure of Invention
The invention aims to provide a method for processing a long hole of a quartz base. The invention has the advantages of high processing efficiency, high processing success rate and low reject ratio.
The technical scheme of the invention is as follows: a method for processing a long hole of a quartz base comprises the following steps,
a. taking a wafer-shaped quartz plate, processing an exhaust hole and two air inlet holes on the top surface of the quartz plate to obtain a product A,
b. processing two long grooves on the bottom surface of the product A, wherein one ends of the two long grooves are connected with the exhaust hole, the other ends of the two long grooves are respectively connected with the two air inlet holes to obtain a product B,
c. cutting according to the length of the long groove to obtain two quartz tubes, respectively placing the two quartz tubes into the two long grooves of the product B to obtain a product C,
d. and manufacturing two quartz cover plates matched with the long grooves, covering the two quartz cover plates on the two quartz tubes respectively, and welding the quartz cover plates and the quartz plate of the product C into a whole to obtain a finished product.
In the step C, the diameter of the quartz tube is the same as the width of the long groove, the bottom surface of the long groove is attached to the quartz tube, and the two ends of the quartz tube are provided with notches facing the top surface of the product C.
In the processing method of the long hole of the quartz base, in the step b, the cross section of the long groove is rectangular, a first groove matched with the quartz tube is arranged in the middle of the bottom surface of the long groove, the cross section of the first groove is semicircular, and a chamfer is arranged on the contour edge of the long groove connected with the bottom surface of the quartz plate; in the step d, a part of the quartz cover plate is tightly embedded into the long groove, a second groove matched with the quartz tube is arranged on the quartz cover plate, and the section of the second groove is semicircular; and welding the quartz plate and the quartz cover plate together along the chamfer, and grinding the quartz cover plate to be flush with the quartz plate after welding to obtain a finished product.
In the aforementioned processing method of the quartz base long hole, in the step b, the device for grinding the quartz cover plate to be flush with the quartz plate includes a horizontal bottom plate, a grinding mechanism is arranged above the bottom plate, two parallel guide beams are arranged above the grinding mechanism, the guide beams are connected with the bottom plate through upright posts, a slide rail is arranged at the bottom of each guide beam, and a slide block connected with the grinding mechanism is arranged on each slide rail.
In the quartz base long hole processing method, the grinding mechanism comprises a square frame, a connecting rod connected with a corresponding sliding block is arranged on the frame, a plurality of grinding rollers which are horizontally arranged side by side are arranged in the frame, the diameters of the grinding rollers are gradually increased, a belt wheel mechanism is arranged between every two adjacent grinding rollers, and one of the grinding rollers is connected with a motor.
In the method for processing the long hole of the quartz base, the grinding roller is provided with a spiral groove.
In the method for processing the long hole of the quartz base, the helical angle of the groove is 48-55 °
In the method for processing the long hole of the quartz substrate, the helix angle of the groove is 52 °.
In the processing method of the long hole of the quartz base, the cross section of the groove is in an isosceles trapezoid shape, and the length of the bottom edge of the outer side of the isosceles trapezoid is smaller than that of the bottom edge of the inner side of the isosceles trapezoid.
In the processing method of the quartz base long hole, a water gun connected with one of the guide beams is arranged above the bottom plate.
Compared with the prior art, the invention adopts a slotting mode to open a relatively wide long groove at the bottom of the quartz base, then embed the quartz tube in the long groove, then cover the long groove with the quartz cover plate, and form the long hole in the quartz base. According to the invention, the quartz tube is embedded, and the long hole is formed in the quartz base by the inner hole of the quartz tube, so that the surface of the obtained long hole is smooth and regular in hole pattern, the requirements of customers can be easily met, and the defect rate of processing the quartz base is low.
The quartz base is thin, the diameter of a long hole to be processed is large, and the quartz tube has a certain wall thickness, so that the quartz cover plate embedded into the long groove is thin, the quartz cover plate is easy to break after direct processing, and the yield is low. According to the invention, the thicker quartz cover plate is manufactured firstly, the quartz cover plate is prevented from being broken in the manufacturing process, then the quartz cover plate is welded, the part of the quartz cover plate, which exceeds the bottom surface of the quartz base, is ground by using the device, the grinding rollers with different diameters are arranged on the device, the grinding amount of single grinding is reduced, the quartz cover plate is prevented from being broken in the grinding process, the low reject ratio of the quartz base processing is ensured, the whole grinding process can be completed by moving the device once, and the processing efficiency of the quartz base is improved.
Through set up spiral helicine slot on grinding roller, the discharge of the lapping liquid of being convenient for and abrasive dust, further improvement grinding efficiency, improve the machining efficiency of quartz substrate promptly. Through the characteristic of the abrasive dust that combines the in-process production of lapping, the preferred spiral angle of slot, the further discharge effect that improves the abrasive dust, further avoid quartz cover plate cracked in grinding process, guarantee that the defective rate of quartz base processing is low. Set up to isosceles trapezoid through the shape with the slot, make the abrasive dust be difficult to fall out after entering into the slot, avoid reentrant the abrasive surface to can effectually will remain in the abrasive dust on the abrasive surface scrapes into the slot, this also avoids quartz cover plate cracked at the grinding in-process, and the defective rate of guaranteeing quartz base processing is low.
Therefore, the invention has the advantages of high processing efficiency, high processing success rate and low reject ratio.
Drawings
Fig. 1 is a front view of article a.
Fig. 2 is a front view of article B.
FIG. 3 is a schematic front view of a quartz cover plate welded to a quartz plate.
Fig. 4 is a schematic cross-sectional view at a-a of fig. 3.
Fig. 5 is a schematic front view of a conventional quartz cover plate assembled with a quartz pot.
Fig. 6 is a schematic top view of a quartz cover plate.
Fig. 7 is a schematic front view of the device.
Fig. 8 is a schematic top view of the grinding mechanism.
The labels in the figures are: 1-quartz plate, 2-exhaust hole, 3-air inlet hole, 4-long groove, 5-quartz tube, 6-quartz cover plate, 7-notch, 8-first groove, 9-chamfer and 10-second groove; 30-bottom plate, 31-guide beam, 32-upright column, 33-slide rail, 34-slide block, 35-frame, 36-connecting rod, 37-grinding roller, 38-motor, 39-groove, 40-water gun, 41-belt pulley, 42-belt, 43-bearing and 44-electric telescopic rod.
Detailed Description
The invention is further illustrated by the following figures and examples, which are not to be construed as limiting the invention.
Examples are given. A method for processing a long hole of a quartz base comprises the following steps,
a. as shown in figure 1, a round cake-shaped quartz plate 1 is taken, an exhaust hole 2 and two air inlet holes 3 are processed on the top surface of the quartz plate 1 to obtain a product A,
b. as shown in fig. 2, two long grooves 4 are processed on the bottom surface of the article a, one end of each long groove 4 is connected with the exhaust hole 2, the other end of each long groove 4 is connected with the two air inlet holes 3 respectively, the article B is obtained,
c. cutting according to the length of the long groove 4 to obtain two quartz tubes 5, respectively placing the two quartz tubes 5 into the two long grooves 4 of the product B to obtain a product C,
d. as shown in fig. 3, two quartz cover plates 6 matched with the long grooves 4 are manufactured, the two quartz cover plates 6 are respectively covered on the two quartz tubes 5, and the quartz cover plates 6 and the quartz plate 1 of the product C are welded into a whole to obtain a finished product.
In the step C, the diameter of the quartz tube 5 is the same as the width of the long groove 4, the bottom surface of the long groove 4 is attached to the quartz tube 5, notches 7 are formed in two ends of the quartz tube 5, and the notches 7 face the top surface of the product C.
In the step b, the section of the long groove 4 is rectangular, a first groove 8 matched with the quartz tube 5 is arranged in the middle of the bottom surface of the long groove 4, the section of the first groove 8 is semicircular, and a chamfer 9 is arranged on the contour edge of the long groove 4 connected with the bottom surface of the quartz plate 1; in the step d, a part of the quartz cover plate 6 is tightly embedded into the long groove 4, a second groove 10 matched with the quartz tube 5 is arranged on the quartz cover plate 6, and the section of the second groove 10 is semicircular; and (3) supplementing quartz materials along the chamfer angle 9, welding the quartz plate 1 and the quartz cover plate 6 together, and grinding the quartz cover plate 6 to be flush with the quartz plate 1 after welding to obtain a finished product.
In the step b, the device for grinding the quartz cover plate 6 to be flush with the quartz plate 1 comprises a horizontal bottom plate 30, a grinding mechanism is arranged above the bottom plate 30, two parallel guide beams 31 are arranged above the grinding mechanism, the guide beams 31 are connected with the bottom plate 30 through upright posts 32, a slide rail 33 is arranged at the bottom of each guide beam 31, and a slide block 34 connected with the grinding mechanism is arranged on each slide rail 33.
Grind mechanism including square frame 35, be equipped with on the frame 35 with correspond connecting rod 36 that slider 34 is connected, be equipped with the grinding roller 37 that a plurality of levels were arranged side by side in the frame 35, grinding roller 37 passes through bearing 43 and frame 35 and rotates and be connected, and a plurality of grinding roller 37's diameter increases gradually, and a plurality of grinding roller 37's material is diamond dust, and granularity 200 meshes is equipped with band pulley mechanism between the adjacent grinding roller 37, band pulley mechanism includes two belt pulleys, and two belt pulleys set up respectively at two adjacent grinding roller 37's homonymy ends, are equipped with the belt between two belt pulleys, are connected with motor 38 on one of them grinding roller 37, and motor 38 is fixed with frame 35, and grinding roller 37 is connected to motor 38's output. The upright post 32 is provided with an electric telescopic rod 44 for pushing the grinding mechanism to move, the electric telescopic rod 44 avoids the water gun 40, and grinding liquid sprayed by the water gun 40 is not directly sprayed onto the electric telescopic rod 44.
The grinding roller 37 is provided with a spiral groove 39. The helix angle of the flutes 39 is 48-55, most preferably 52.
The cross section of the groove 39 is an isosceles trapezoid, and the length of the outer bottom side of the isosceles trapezoid is smaller than that of the inner bottom side.
A water gun 40 connected with one of the guide beams 31 is arranged above the bottom plate 30.
The use of the device: and (3) fixing a blank formed by welding the quartz cover plates 6 and the quartz plates 1 of the products C into a whole on the bottom plate 30, and keeping the angular bisectors of the two quartz cover plates 6 parallel to the slide rails 33. The weld points are facing upward and correspond to the underside of the gun 40. The water gun 40 sprays water aiming at the quartz cover plate 6. The motor 38 is activated and the motor 38 rotates all the grinding rollers 37 in the same direction. The electric telescopic rod 44 drives the grinding mechanism to pass through the quartz cover plate 6, the grinding rollers 37 grind the thin quartz cover plate 6 in sequence until the last grinding roller 37 passes through the quartz cover plate 6, and the quartz cover plate 6 is rubbed to be flush with the quartz plate 1.
The invention has the advantages of high processing efficiency, high processing success rate and low reject ratio.
Claims (10)
1. A quartz base slot hole processing method is characterized in that: comprises the following steps of (a) carrying out,
a. taking a cake-shaped quartz plate (1), processing an exhaust hole (2) and two air inlet holes (3) on the top surface of the quartz plate (1) to obtain a product A,
b. processing two long grooves (4) on the bottom surface of the product A, wherein one ends of the two long grooves (4) are connected with the exhaust hole (2), the other ends of the two long grooves (4) are respectively connected with the two air inlet holes (3) to obtain a product B,
c. cutting according to the length of the long groove (4) to obtain two quartz tubes (5), respectively placing the two quartz tubes (5) into the two long grooves (4) of the product B to obtain a product C,
d. and manufacturing two quartz cover plates (6) matched with the long grooves (4), respectively covering the two quartz cover plates (6) on the two quartz tubes (5), and welding the quartz cover plates (6) and the quartz plate (1) of the product C into a whole to obtain a finished product.
2. The method for processing the long hole of the quartz susceptor as claimed in claim 1, wherein: in the step C, the diameter of the quartz tube (5) is the same as the width of the long groove (4), the bottom surface of the long groove (4) is attached to the quartz tube (5), notches (7) are formed in two ends of the quartz tube (5), and the notches (7) face the top surface of the product C.
3. The method for processing the long hole of the quartz susceptor as claimed in claim 1, wherein: in the step b, the section of the long groove (4) is rectangular, a first groove (8) matched with the quartz tube (5) is formed in the middle of the bottom surface of the long groove (4), the section of the first groove (8) is semicircular, and a chamfer (9) is formed in the edge of the outline of the long groove (4) connected with the bottom surface of the quartz plate (1); in the step d, a part of the quartz cover plate (6) is tightly embedded into the long groove (4), a second groove (10) matched with the quartz tube (5) is formed in the quartz cover plate (6), and the section of the second groove (10) is semicircular; and welding the quartz plate (1) and the quartz cover plate (6) together along the chamfer (9), and grinding the quartz cover plate (6) to be flush with the quartz plate (1) after welding to obtain a finished product.
4. The method of claim 3, wherein the quartz susceptor slot processing method comprises: in the step b, the device for grinding the quartz cover plate (6) to be flush with the quartz plate (1) comprises a horizontal bottom plate (30), a grinding mechanism is arranged above the bottom plate (30), two parallel guide beams (31) are arranged above the grinding mechanism, the guide beams (31) are connected with the bottom plate (30) through upright posts (32), a sliding rail (33) is arranged at the bottom of each guide beam (31), and a sliding block (34) connected with the grinding mechanism is arranged on each sliding rail (33).
5. The method for processing the long hole of the quartz susceptor as claimed in claim 4, wherein: grind mechanism including square frame (35), be equipped with on frame (35) with correspond connecting rod (36) that slider (34) are connected, be equipped with a plurality of levels in frame (35) and grind roller (37) of arranging side by side, the diameter of a plurality of grinding roller (37) increases gradually, is equipped with band pulley mechanism between adjacent grinding roller (37), is connected with motor (38) on one of them grinding roller (37).
6. The method of processing a long hole in a quartz susceptor of claim 5, wherein: the grinding roller (37) is provided with a spiral groove (39).
7. The method of claim 6, wherein: the helix angle of the grooves (39) is 48-55 degrees.
8. The method of processing a long hole in a quartz susceptor of claim 7, wherein: the helix angle of the groove (39) is 52 degrees.
9. The method for processing the long hole of the quartz susceptor as claimed in claim 6, 7 or 8, wherein: the cross section of the groove (39) is an isosceles trapezoid, and the length of the outer bottom edge of the isosceles trapezoid is smaller than that of the inner bottom edge.
10. The method for processing the long hole of the quartz susceptor as claimed in claim 4, wherein: a water gun (40) connected with one of the guide beams (31) is arranged above the bottom plate (30).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111226023.0A CN113843706B (en) | 2021-10-21 | 2021-10-21 | Method for machining long holes of quartz base |
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|---|---|---|---|
| CN202111226023.0A CN113843706B (en) | 2021-10-21 | 2021-10-21 | Method for machining long holes of quartz base |
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| CN113843706A true CN113843706A (en) | 2021-12-28 |
| CN113843706B CN113843706B (en) | 2023-08-15 |
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| CN110127993A (en) * | 2019-05-17 | 2019-08-16 | 湖州东科电子石英有限公司 | The welding procedure of opaque quartz plate and suprasil stick |
| CN110238481A (en) * | 2019-06-25 | 2019-09-17 | 湖州东科电子石英有限公司 | A kind of welding procedure of the big pipe of isometrical quartz |
| CN213348927U (en) * | 2020-08-03 | 2021-06-04 | 杭州欧光芯科技有限公司 | Device for preparing vacuum photosensitive bonded microfluidic biochip |
| CN214351312U (en) * | 2020-12-04 | 2021-10-08 | 连云港尚东石英科技有限公司 | Adjustable polishing device for processing inner hole of quartz tube |
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| CN113843706B (en) | 2023-08-15 |
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Denomination of invention: A Method for Machining Long Holes in Quartz Base Granted publication date: 20230815 Pledgee: Nanxun Zhejiang rural commercial bank Limited by Share Ltd. Pledgor: Huzhou dongke electronic quartz Co.,Ltd. Registration number: Y2024980018806 |
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