CN113843549A - Silver soldering paste sintering aid and preparation method and application thereof - Google Patents
Silver soldering paste sintering aid and preparation method and application thereof Download PDFInfo
- Publication number
- CN113843549A CN113843549A CN202111369192.XA CN202111369192A CN113843549A CN 113843549 A CN113843549 A CN 113843549A CN 202111369192 A CN202111369192 A CN 202111369192A CN 113843549 A CN113843549 A CN 113843549A
- Authority
- CN
- China
- Prior art keywords
- silver
- sintering aid
- acid
- soldering paste
- tert
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 114
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 100
- 239000004332 silver Substances 0.000 title claims abstract description 100
- 238000005245 sintering Methods 0.000 title claims abstract description 81
- 238000005476 soldering Methods 0.000 title claims abstract description 52
- 238000002360 preparation method Methods 0.000 title abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 23
- 238000003756 stirring Methods 0.000 claims abstract description 20
- 239000002243 precursor Substances 0.000 claims abstract description 17
- 239000002904 solvent Substances 0.000 claims abstract description 15
- 150000001412 amines Chemical class 0.000 claims abstract description 14
- 238000007710 freezing Methods 0.000 claims abstract description 13
- 230000008014 freezing Effects 0.000 claims abstract description 13
- 238000004108 freeze drying Methods 0.000 claims abstract description 12
- 239000003446 ligand Substances 0.000 claims abstract description 12
- 239000012141 concentrate Substances 0.000 claims abstract description 8
- 238000009777 vacuum freeze-drying Methods 0.000 claims abstract description 5
- 150000001875 compounds Chemical class 0.000 claims abstract description 3
- 239000000203 mixture Substances 0.000 claims abstract description 3
- 239000002994 raw material Substances 0.000 claims abstract description 3
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 claims description 68
- 239000002245 particle Substances 0.000 claims description 45
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 38
- 239000003960 organic solvent Substances 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 239000011259 mixed solution Substances 0.000 claims description 15
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 9
- 239000008367 deionised water Substances 0.000 claims description 9
- 229910021641 deionized water Inorganic materials 0.000 claims description 9
- -1 silver amine Chemical class 0.000 claims description 9
- XNGYKPINNDWGGF-UHFFFAOYSA-L silver oxalate Chemical compound [Ag+].[Ag+].[O-]C(=O)C([O-])=O XNGYKPINNDWGGF-UHFFFAOYSA-L 0.000 claims description 9
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 8
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 claims description 8
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 6
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 claims description 6
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 claims description 6
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 6
- 239000002105 nanoparticle Substances 0.000 claims description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 6
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 claims description 6
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 5
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 229940116411 terpineol Drugs 0.000 claims description 5
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 claims description 4
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 4
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 4
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 claims description 4
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 claims description 4
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 claims description 4
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 claims description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 4
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 claims description 4
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 claims description 4
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 claims description 4
- UYXTWWCETRIEDR-UHFFFAOYSA-N Tributyrin Chemical compound CCCC(=O)OCC(OC(=O)CCC)COC(=O)CCC UYXTWWCETRIEDR-UHFFFAOYSA-N 0.000 claims description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 4
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 claims description 4
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 claims description 4
- KBPLFHHGFOOTCA-UHFFFAOYSA-N caprylic alcohol Natural products CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 claims description 4
- 150000004985 diamines Chemical class 0.000 claims description 4
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 claims description 4
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 claims description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 claims description 4
- LIWAQLJGPBVORC-UHFFFAOYSA-N ethylmethylamine Chemical compound CCNC LIWAQLJGPBVORC-UHFFFAOYSA-N 0.000 claims description 4
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 claims description 4
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 claims description 4
- GVWISOJSERXQBM-UHFFFAOYSA-N n-methylpropan-1-amine Chemical compound CCCNC GVWISOJSERXQBM-UHFFFAOYSA-N 0.000 claims description 4
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 claims description 4
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 claims description 4
- DPBLXKKOBLCELK-UHFFFAOYSA-N pentan-1-amine Chemical compound CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 claims description 4
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 claims description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 4
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 4
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 claims description 4
- JMSVCTWVEWCHDZ-UHFFFAOYSA-N syringic acid Chemical compound COC1=CC(C(O)=O)=CC(OC)=C1O JMSVCTWVEWCHDZ-UHFFFAOYSA-N 0.000 claims description 4
- URAYPUMNDPQOKB-UHFFFAOYSA-N triacetin Chemical compound CC(=O)OCC(OC(C)=O)COC(C)=O URAYPUMNDPQOKB-UHFFFAOYSA-N 0.000 claims description 4
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 claims description 4
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 claims description 4
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 3
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 3
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 3
- 239000005642 Oleic acid Substances 0.000 claims description 3
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 3
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 claims description 3
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 3
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 3
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 claims description 3
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 claims description 3
- 229940071536 silver acetate Drugs 0.000 claims description 3
- 229910001923 silver oxide Inorganic materials 0.000 claims description 3
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 claims description 3
- ZXSQEZNORDWBGZ-UHFFFAOYSA-N 1,3-dihydropyrrolo[2,3-b]pyridin-2-one Chemical compound C1=CN=C2NC(=O)CC2=C1 ZXSQEZNORDWBGZ-UHFFFAOYSA-N 0.000 claims description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 claims description 2
- 229940035437 1,3-propanediol Drugs 0.000 claims description 2
- FJLUATLTXUNBOT-UHFFFAOYSA-N 1-Hexadecylamine Chemical compound CCCCCCCCCCCCCCCCN FJLUATLTXUNBOT-UHFFFAOYSA-N 0.000 claims description 2
- JPZYXGPCHFZBHO-UHFFFAOYSA-N 1-aminopentadecane Chemical compound CCCCCCCCCCCCCCCN JPZYXGPCHFZBHO-UHFFFAOYSA-N 0.000 claims description 2
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 2
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 claims description 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 2
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 claims description 2
- YKSSRNAGQDAYQH-UHFFFAOYSA-N 2,4-dimethylhexan-1-amine Chemical compound CCC(C)CC(C)CN YKSSRNAGQDAYQH-UHFFFAOYSA-N 0.000 claims description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 claims description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- BDLXTDLGTWNUFM-UHFFFAOYSA-N 2-[(2-methylpropan-2-yl)oxy]ethanol Chemical compound CC(C)(C)OCCO BDLXTDLGTWNUFM-UHFFFAOYSA-N 0.000 claims description 2
- 229940058020 2-amino-2-methyl-1-propanol Drugs 0.000 claims description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 2
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 claims description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 2
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 claims description 2
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 claims description 2
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 claims description 2
- UNBMPKNTYKDYCG-UHFFFAOYSA-N 4-methylpentan-2-amine Chemical compound CC(C)CC(C)N UNBMPKNTYKDYCG-UHFFFAOYSA-N 0.000 claims description 2
- YPIFGDQKSSMYHQ-UHFFFAOYSA-N 7,7-dimethyloctanoic acid Chemical compound CC(C)(C)CCCCCC(O)=O YPIFGDQKSSMYHQ-UHFFFAOYSA-N 0.000 claims description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 2
- CKLJMWTZIZZHCS-UHFFFAOYSA-N D-OH-Asp Natural products OC(=O)C(N)CC(O)=O CKLJMWTZIZZHCS-UHFFFAOYSA-N 0.000 claims description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 claims description 2
- CKLJMWTZIZZHCS-UWTATZPHSA-N L-Aspartic acid Natural products OC(=O)[C@H](N)CC(O)=O CKLJMWTZIZZHCS-UWTATZPHSA-N 0.000 claims description 2
- ODKSFYDXXFIFQN-BYPYZUCNSA-N L-arginine Chemical compound OC(=O)[C@@H](N)CCCN=C(N)N ODKSFYDXXFIFQN-BYPYZUCNSA-N 0.000 claims description 2
- 229930064664 L-arginine Natural products 0.000 claims description 2
- 235000014852 L-arginine Nutrition 0.000 claims description 2
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 claims description 2
- 239000005639 Lauric acid Substances 0.000 claims description 2
- JGFZNNIVVJXRND-UHFFFAOYSA-N N,N-diisopropylethylamine Substances CCN(C(C)C)C(C)C JGFZNNIVVJXRND-UHFFFAOYSA-N 0.000 claims description 2
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- PLZVEHJLHYMBBY-UHFFFAOYSA-N Tetradecylamine Chemical compound CCCCCCCCCCCCCCN PLZVEHJLHYMBBY-UHFFFAOYSA-N 0.000 claims description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 2
- 235000011037 adipic acid Nutrition 0.000 claims description 2
- 239000001361 adipic acid Substances 0.000 claims description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 claims description 2
- CBTVGIZVANVGBH-UHFFFAOYSA-N aminomethyl propanol Chemical compound CC(C)(N)CO CBTVGIZVANVGBH-UHFFFAOYSA-N 0.000 claims description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 2
- 229960005070 ascorbic acid Drugs 0.000 claims description 2
- 235000010323 ascorbic acid Nutrition 0.000 claims description 2
- 239000011668 ascorbic acid Substances 0.000 claims description 2
- 229960005261 aspartic acid Drugs 0.000 claims description 2
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 claims description 2
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 claims description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 claims description 2
- 229940043279 diisopropylamine Drugs 0.000 claims description 2
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 claims description 2
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 229940031098 ethanolamine Drugs 0.000 claims description 2
- 239000004210 ether based solvent Substances 0.000 claims description 2
- 239000001087 glyceryl triacetate Substances 0.000 claims description 2
- 235000013773 glyceryl triacetate Nutrition 0.000 claims description 2
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 claims description 2
- 229940117955 isoamyl acetate Drugs 0.000 claims description 2
- 229940102253 isopropanolamine Drugs 0.000 claims description 2
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 claims description 2
- YAHRDLICUYEDAU-UHFFFAOYSA-N methylhexaneamine Chemical compound CCC(C)CC(C)N YAHRDLICUYEDAU-UHFFFAOYSA-N 0.000 claims description 2
- 229950000752 methylhexaneamine Drugs 0.000 claims description 2
- XTAZYLNFDRKIHJ-UHFFFAOYSA-N n,n-dioctyloctan-1-amine Chemical compound CCCCCCCCN(CCCCCCCC)CCCCCCCC XTAZYLNFDRKIHJ-UHFFFAOYSA-N 0.000 claims description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
- 229920000166 polytrimethylene carbonate Polymers 0.000 claims description 2
- 229920006395 saturated elastomer Polymers 0.000 claims description 2
- BHRZNVHARXXAHW-UHFFFAOYSA-N sec-butylamine Chemical compound CCC(C)N BHRZNVHARXXAHW-UHFFFAOYSA-N 0.000 claims description 2
- LKZMBDSASOBTPN-UHFFFAOYSA-L silver carbonate Substances [Ag].[O-]C([O-])=O LKZMBDSASOBTPN-UHFFFAOYSA-L 0.000 claims description 2
- 229910001958 silver carbonate Inorganic materials 0.000 claims description 2
- 229940071575 silver citrate Drugs 0.000 claims description 2
- 229910001961 silver nitrate Inorganic materials 0.000 claims description 2
- LMEWRZSPCQHBOB-UHFFFAOYSA-M silver;2-hydroxypropanoate Chemical compound [Ag+].CC(O)C([O-])=O LMEWRZSPCQHBOB-UHFFFAOYSA-M 0.000 claims description 2
- 239000008117 stearic acid Substances 0.000 claims description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- YIBXWXOYFGZLRU-UHFFFAOYSA-N syringic aldehyde Natural products CC12CCC(C3(CCC(=O)C(C)(C)C3CC=3)C)C=3C1(C)CCC2C1COC(C)(C)C(O)C(O)C1 YIBXWXOYFGZLRU-UHFFFAOYSA-N 0.000 claims description 2
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 claims description 2
- 229960002622 triacetin Drugs 0.000 claims description 2
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 claims description 2
- ABVVEAHYODGCLZ-UHFFFAOYSA-N tridecan-1-amine Chemical compound CCCCCCCCCCCCCN ABVVEAHYODGCLZ-UHFFFAOYSA-N 0.000 claims description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 2
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 claims description 2
- RKBCYCFRFCNLTO-UHFFFAOYSA-N triisopropylamine Chemical compound CC(C)N(C(C)C)C(C)C RKBCYCFRFCNLTO-UHFFFAOYSA-N 0.000 claims description 2
- QUTYHQJYVDNJJA-UHFFFAOYSA-K trisilver;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Ag+].[Ag+].[Ag+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QUTYHQJYVDNJJA-UHFFFAOYSA-K 0.000 claims description 2
- QFKMMXYLAPZKIB-UHFFFAOYSA-N undecan-1-amine Chemical compound CCCCCCCCCCCN QFKMMXYLAPZKIB-UHFFFAOYSA-N 0.000 claims description 2
- 238000005303 weighing Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 15
- 239000005022 packaging material Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 15
- PLKATZNSTYDYJW-UHFFFAOYSA-N azane silver Chemical compound N.[Ag] PLKATZNSTYDYJW-UHFFFAOYSA-N 0.000 description 13
- 239000000243 solution Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 8
- 230000009471 action Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004506 ultrasonic cleaning Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 150000003378 silver Chemical class 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000012994 industrial processing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
Abstract
A silver soldering paste sintering aid and a preparation method and application thereof belong to the technical field of device packaging materials. The sintering aid of the silver soldering paste is a concentrate of a silver-amine complex. The raw material components of the silver-amine complex comprise: a complex compound of a silver precursor and an amine ligand, and a freeze-drying solvent. The preparation method of the silver solder paste sintering aid comprises the following steps: and slowly dripping amine ligand into the freeze-drying solvent, slowly adding the silver precursor under uniform electromagnetic stirring, continuously and electromagnetically stirring at a uniform speed until the silver precursor is completely dissolved, freezing completely, placing the mixture into a freeze dryer under the condition of shading, carrying out vacuum freeze drying treatment, and concentrating to obtain the silver soldering paste sintering aid. The silver soldering paste sintering aid disclosed by the invention is simple in process and low in cost, can enhance the sintering interconnection effect of the sintering aid in silver soldering paste, and is designed to be suitable for the sintering aid to exert the maximum auxiliary sintering performance according to the thermal performance of the sintering aid. Under the pressureless condition, the silver soldering paste can be assisted to be sintered to form a uniform and compact connection interface with good bonding degree.
Description
Technical Field
The invention belongs to the technical field of device packaging materials, and particularly relates to a silver solder paste sintering aid and a preparation method and application thereof.
Background
With the rapid development of new electronic fields such as electronic automobiles, aerospace, oil exploration and efficient energy utilization, people have further promoted the high-reliability packaging, high-density packaging, high-temperature service performance and the requirements for the electric and thermal conductivity of packaging materials. However, the conventional silicon-based semiconductor is difficult to function in a high-temperature, high-pressure and high-corrosion environment due to the limited forbidden band width, and compared with the conventional silicon-based semiconductor, a third-generation semiconductor represented by silicon carbide and gallium nitride has higher breakdown voltage, thermal conductivity, and high electron mobility and current density due to the higher forbidden band width, so that the application requirement of a chip under extreme regulation can be met. In addition, the conventional tin-based solder is difficult to meet the high-temperature service requirement of more than 250 ℃, and is easy to melt at high temperature, so that a series of chip failure phenomena such as cracking of a packaging interconnection structure, large holes, warping of a chip and the like are caused, and therefore, the development of a new advanced welding material becomes a problem to be solved urgently in the field of third-generation semiconductor application at present.
Silver materials have received much attention in the third generation semiconductor packaging field due to their high thermal conductivity and high reliability at high temperatures. In industry, silver particles are often mixed with an organic solvent, a sintering aid, and a binder to prepare a silver paste, and the silver paste is sintered to form a strong solder joint. The silver material is divided into micron-sized silver particles and nano-sized silver particles, the micron-sized silver particles are easy to process, produce and store and are not easy to agglomerate, but the micron-sized silver particles are large in size and have higher melting points, so that the micron-sized silver particles can be melted at higher temperature to complete welding, and the requirement of industrial actual production is not met. The nano particles are diffused through the crystal boundary, and compared with the traditional crystal lattice diffusion, the activation energy is required to be less and faster, and the sintering temperature is required to be relatively lower, so that the nano particles are favored in the industry at present. The nano silver soldering paste generally reduces the sintering temperature of the soldering paste by synthesizing smaller nano silver, so as to meet the industrial processing conditions, but due to the size effect, the synthesis process steps of the extremely small nano particles are complex, and the nano silver soldering paste is easy to agglomerate and difficult to store in the storage and transportation processes, so that a large amount of cost is consumed. Therefore, in the industrial preparation of the solder paste, the stability of a solder system is enhanced by methods of preparing a solvent, adding a sintering aid and the like, and the mechanical property of a sintered joint is enhanced by reducing the sintering temperature.
The traditional silver soldering paste has the advantages that the wetting angle is small during coating, the contact performance with a substrate is poor, the density of space stacking is low after coating, a large number of cavities are generated due to solvent volatilization during sintering, collapse and damage of a sintering structure can be caused, the mechanical strength of a chip is reduced, the reliability of the chip during use is influenced, although the density and the mechanical performance of a bonding joint can be enhanced to a certain extent due to the addition of sintering aids such as adhesives, the adhesives such as polymers are difficult to remove in the sintering process due to the high melting point, the conductive and heat-conducting performance of the chip can be remained in a system, and the problems of poor reliability and the like occur during high-temperature service. Research suggests that silver salts such as silver oxide, silver oxalate and silver acetate are added into a solder paste system as sintering aids, and the silver salts are heated and decomposed to form silver nanoparticles to reinforce a sintering interconnection structure, but the sintering aids have high decomposition temperature and are difficult to promote the interconnection of the sintering structure at low temperature.
Disclosure of Invention
Aiming at the problems in the prior art, the invention aims to design and provide a silver solder paste sintering aid and a preparation method and application thereof. The sintering aid is essentially a concentrate obtained by complexing reaction of a silver precursor and amine in a solution, the silver precursor and the amine reagent are fully reacted in a freeze-drying solvent, the frozen solution is concentrated to prepare the sintering aid through a freeze-drying process, the influence of the solvent on later use is avoided, finally, the sintering aid, silver particles and an organic solvent carrier are mixed through a high-speed mixer to prepare silver soldering paste, and the silver soldering paste is enabled to fully play a role in the silver soldering paste through a segmented sintering bonding process. The silver solder paste sintering aid enables the shear strength of a sintered joint in the silver solder paste to reach 50-100 MPa, and is simple in preparation process and easy to control.
The silver solder paste sintering aid is characterized by being a concentrate of a silver-amine complex.
The silver soldering paste sintering aid is characterized in that the raw material components of the silver-amine complex comprise: a complex compound of a silver precursor and an amine ligand, and a freeze-drying solvent.
The silver soldering paste sintering aid is characterized in that the mass ratio of a complex of a silver precursor and an amine ligand to a freeze-drying solvent is 1-5: 5-10, and the number ratio of silver atoms to nitrogen atoms in the complex of the silver precursor and the amine ligand is 1-10: 1-10.
The silver soldering paste sintering aid is characterized in that the silver precursor comprises one of silver oxide, silver nitrate, silver acetate, silver oxalate, silver lactate, silver citrate or silver carbonate;
the amine ligand comprises one or more of monoamine, diamine and alcohol amine; the monoamine comprises one or more of ethylamine, N-propylamine, isopropylamine, N-butylamine, sec-butylamine, tert-butylamine, N-pentylamine, 1, 3-dimethylbutylamine, 1, 3-dimethylpentylamine, N-octylamine, N-decylamine, N-hexylamine, N-octylamine, N-decylamine, undecylamine, dodecylamine, tridecylamine, tetradecylamine, pentadecylamine, hexadecylamine, octadecyl saturated aliphatic hydrocarbon monoamine, dimethylamine, methylethylamine, diethylamine, methylpropylamine, dipropylamine, diisopropylamine, dibutylamine, piperidine, trimethylamine, N-dimethylethylamine, triethylamine, N-diisopropylethylamine, triisopropylamine, tri-N-butylamine and tri-N-octylamine; the diamine includes ethylenediamine, N-dimethylethylenediamine, N-diethylethylenediamine, propylenediamine, 2-dimethyl-1, 3-propylenediamine, N ' -diethyl-1, 3-propylenediamine, 1, 4-butanediamine, N-dimethyl-1, 4-butanediamine, N ' -dimethyl-1, 4-butanediamine, N-diethyl-1, 4-butanediamine, N ' -diethyl-1, 4-butanediamine, 1, 5-pentanediamine, 1, 5-diamino-2-methylpentane, and the like, One or more of 1, 6-hexamethylenediamine, N-dimethyl-1, 6-hexamethylenediamine, N' -dimethyl-1, 6-hexamethylenediamine, 1, 7-heptamethylenediamine, hexamethylenediamine, piperazine, triethylenediamine and 2, 4-dimethylhexylamine; the alcohol amine comprises one or more of ethanolamine, isopropanolamine, 2-amino-2-methyl-1-propanol and N, N-diethyl-1, 3-propanediol diamine;
the freeze-drying solvent comprises one or more of a mixed solution of tert-butyl alcohol and deionized water, a mixed solution of tert-butyl alcohol and ethanol, and a mixed solution of tert-butyl alcohol, ethanol and water, wherein the mass ratio of tert-butyl alcohol to deionized water in the mixed solution of tert-butyl alcohol and deionized water is 10: 1-10, the mass fraction of ethanol in the mixed solution of tert-butyl alcohol and ethanol is 1% -20%, and the mass ratio of tert-butyl alcohol to ethanol and water in the mixed solution of tert-butyl alcohol, ethanol and water is 10: 1-5.
The preparation method of any silver solder paste sintering aid is characterized by comprising the following steps: and slowly dripping amine ligand into the freeze-drying solvent, slowly adding the silver precursor under uniform electromagnetic stirring, continuously and electromagnetically stirring at a uniform speed until the silver precursor is completely dissolved, freezing completely, placing the mixture into a freeze dryer under the condition of shading, carrying out vacuum freeze drying treatment, and concentrating to obtain the silver soldering paste sintering aid. So that the freeze-dried solvent is sublimated rapidly, and the concentrated solute silver-ammonia complex is purified.
The preparation method is characterized in that the rotation speed of the electromagnetic stirring is 100-1000 rpm, and the freezing condition is as follows: the freezing temperature is-30 to-10 ℃, and the conditions of the vacuum freeze drying treatment are as follows: the vacuum degree is 1-10 Pa, and the temperature is-30-0 ℃.
Any silver solder paste sintering aid is applied to be used as a sintering aid of silver solder paste.
A silver solder paste, characterized in that the silver solder paste is prepared from the silver solder paste sintering aid as claimed in any one of claims 1 to 4, silver particles and an organic solvent carrier.
The silver soldering paste is characterized in that the silver particles comprise one or more of micron-sized silver particles or nano-sized silver particles, the micron-sized silver particles comprise flaky silver with the length of 2-8 mu m and the thickness of 50-200 nm or spherical silver with the particle size of 0.5-9 mu m, and the thickness of the nano silver is preferably 20-100 nm;
the organic solvent carrier comprises ethylene glycol, diethylene glycol, 3-methoxybutanol, n-hexanol, n-propanol, diethylene glycol, n-butanol, triethylene glycol, n-dodecanol, cyclohexanol, n-heptanol, n-pentanol, n-octanol, terpineol, ethanol, methanol, isopropanol, butanediol, propylene glycol, triethylene glycol monomethyl ether, ethylene glycol butyl ether, ethylene glycol tert-butyl ether, diethylene glycol butyl ether, dipropylene glycol methyl ether, triethylene glycol dimethyl ether, ethylene glycol propyl ether, diethylene glycol dimethyl ether, ethylene glycol ethyl ether, ethylene glycol methyl ether, tetraethylene glycol dimethyl ether in alcohol ether solvents, esters comprising ethyl acetate, butyl acetate, diethyl carbonate, isoamyl acetate, vinyl acetate, ethylene glycol butyl ether acetate, diethylene glycol butyl ether acetate, methyl methacrylate, r-butyrolactone, glyceryl triacetate, glyceryl tributyrate, one or more of n-decanoic acid, oleic acid, suberic acid, glutaric acid, stearic acid, acrylic acid, neodecanoic acid, adipic acid, sebacic acid, lauric acid, L-arginine, L-aspartic acid, dodecanedioic acid, n-octanoic acid, n-butyric acid, n-hexanoic acid, syringic acid, malonic acid, L-tartaric acid and ascorbic acid. The organic solvent carrier with the boiling point of 50-100 ℃ comprises methanol, isopropanol, n-propanol, tert-butanol and ethanol.
The preparation method of the silver soldering paste is characterized by comprising the following steps: weighing silver particles with the solid content of 60-95%, silver soldering paste sintering aid with the solid content of 10-30% and organic solvent carrier with the solid content of 10-15%, placing the silver particles and the organic solvent carrier into a high-speed mixer, stirring at 500-100 rpm for 1-3 min, stirring at 1000-2000 rpm for 1-3 min, and stirring at 2000-2500 rpm for 1-3 min for full mixing.
The sintering process of the silver soldering paste comprises the following steps: preheating is carried out on a hot plate at the temperature of 65-80 ℃, the temperature is slowly increased to the temperature range of 90-180 ℃ at the temperature increase rate of 10-30 ℃/min, bonding is continuously carried out at the temperature for 1-15 min at the bonding pressure of 0-10 MPa, the temperature is slowly increased to 180-250 ℃ at the temperature increase rate of 0-30 ℃/min, and the temperature is continuously maintained for 1-5 min at the pressure of 0-10 MPa. The silver soldering paste is bonded under the control of different temperature rise rates in different temperature areas, so that different sintering aids are guaranteed to play the best role in corresponding sintering processes.
The sintering bonding process of the silver soldering paste comprises the following steps: firstly, coating silver soldering paste on different substrates by a screen printing process, preheating the coated substrates on a hot plate at a temperature of 65-80 ℃ (drying the soldering paste to prevent a large amount of gas generated in the later bonding process from being difficult to volatilize), then placing two DBC substrates in a sandwich structure to simulate a chip interconnection structure, placing the simulated chip on a hot press, slowly heating to a temperature range of 90-180 ℃ at a heating rate of 10-30 ℃/min, continuously bonding for 1-15 min at the temperature at a bonding pressure of 0-10 MPa (in the temperature range, the silver-ammonia complex concentrate in the silver soldering paste sintering aid is decomposed to generate tiny nano-silver particles which can promote diffusion interconnection of larger-sized silver particles in the original silver soldering paste, a compact three-dimensional network structure is formed), the temperature is slowly increased to 180-250 ℃ at the temperature increase rate of 0-30 ℃/min, and the temperature is continuously maintained for 1-5 min under the pressure of 0-10 MPa (redundant impurities in the soldering paste are volatilized, and the formation of an interconnection structure among particles is further promoted). The optimal action interval of the silver soldering paste sintering aid is controlled by utilizing the temperature interval, so that the silver-ammonia complex is fully decomposed and diffused, the silver-ammonia complex is fully interconnected with the original silver particles, the decomposition temperature is reduced, and the mechanical strength of the bonding joint is enhanced.
The DBC substrate is a ceramic plate such as aluminum oxide and the like which is processed by copper plating, nickel plating, gold plating or silver plating technology.
Compared with the prior art, the invention has the following beneficial effects:
the preparation method of the sintering aid provided by the invention is simple in process and low in cost, can effectively enhance the sintering interconnection effect of the sintering aid in the silver solder paste, and simultaneously designs the suitable sintering aid according to the thermal property of the sintering aid to play the maximum auxiliary sintering property, so that the silver solder paste sintered with the assistance of the sintering aid can be well applied to the field of electronic packaging of high-temperature service under pressure and pressure-free low-temperature welding. Under the condition of certain pressure assistance, the silver solder paste sintered with the assistance of the sintering aid can reach the shear force of 80MPa at most, has high shear strength, and can be well applied to the packaging interconnection of electronic devices.
Drawings
FIG. 1 is a schematic structural view of a copper-clad ceramic substrate;
FIG. 2 is a schematic diagram of a package interconnect structure;
fig. 3 is an SEM image of the spherical nano silver particles used in example 2.
Detailed Description
For a better understanding of the present invention, the following examples are given to illustrate the present invention, but the present invention is not limited to the following examples.
Example 1:
firstly, mixing tert-butyl alcohol and deionized water according to the weight ratio of 9: 1, slowly adding 0.48g of n-propylamine into a mixed solution of tert-butyl alcohol and deionized water dropwise, slowly adding 0.3g of silver oxalate under the condition that the electromagnetic stirring rotation speed is 800rpm, stopping stirring after the silver oxalate is completely dissolved, putting the prepared freeze-dried solution into a refrigerator with the temperature of-30 ℃, freezing for 6 hours, after complete freezing, putting the freeze-dried solution into a freeze dryer, drying at the temperature of-30 ℃ under the vacuum degree of 2Pa, purifying and concentrating to prepare the sintering aid.
Then mixing ethylene glycol, terpineol, triethylene glycol monomethyl ether and n-decanoic acid in a ratio of 3: 3: 3: 1, preparing an organic solvent carrier, and then mixing nano silver particles with the particle size of 60nm, a sintering aid and the organic solvent carrier according to the mass ratio of 8: 1: 1 to prepare silver solder paste.
The silver solder paste prepared by the method is applied to a packaging interconnection structure of an electronic device. The first master and the second master in the package interconnection structure are both selected as DBC substrates, a schematic structural diagram of the DBC substrate is shown in fig. 1, and a schematic structural diagram of the package interconnection structure is shown in fig. 2.
Firstly, the DBC ceramic wafer is subjected to ultrasonic cleaning for 5min, and then the silver solder paste prepared in the example is uniformly printed on the cleaned DBC ceramic wafer, so that the structure shown in figure 2 is obtained.
Finally, the coated sandwich structure is placed on a hot plate at the temperature of 70 ℃ for preheating for 3min (drying the soldering paste to prevent a large amount of gas generated in the later bonding process of the soldering paste from being difficult to volatilize), then two DBC substrates are placed to be in a sandwich structure to simulate a chip interconnection structure, the simulated chip is placed on a hot press, the temperature is slowly increased to a temperature range of 120 ℃ at the temperature rate of 10 ℃/min, the bonding is continuously carried out for 5min at the temperature at the bonding pressure of 5MPa (mostly, the action range of a silver soldering paste sintering aid is in the temperature range, a silver-ammonia complex concentrate in the silver soldering paste sintering aid is decomposed to generate tiny nano silver particles which can promote the diffusion interconnection of larger-sized silver particles in the original silver soldering paste to form a compact three-dimensional network structure at the temperature range of 10 ℃/min), and then the temperature is slowly increased to 190 ℃, and keeping the temperature for 1min under the pressure of 0-10 MPa (volatilizing redundant impurities in the soldering paste to further promote the formation of an interconnection structure among the particles). The optimal action interval of the silver soldering paste sintering aid is controlled by utilizing the temperature interval, so that the silver-ammonia complex is fully decomposed and diffused, the silver-ammonia complex is fully interconnected with the original silver particles, the decomposition temperature is reduced, and the mechanical strength of the bonding joint is enhanced.
The shear force after the test was 60MPa (average of 10 samples).
It should be noted that the specific examples of the shear fracture test performed on the connection layer are as follows: fixing the sample on a fixing clamp of a shear force tester, controlling the tester to push and compress the sample at a speed of 100 microns per second to perform a shear fracture test, and reading from the shear force tester to obtain corresponding shear force when the sample is fractured.
Example 2:
firstly, mixing tert-butyl alcohol and ethanol according to the proportion of 7: 3, slowly adding 0.148g of propylene diamine into the mixed solution of tert-butyl alcohol and deionized water dropwise, slowly adding 0.15g of silver oxalate under the condition that the electromagnetic stirring rotation speed is 600rpm, stopping stirring after the silver oxalate is completely dissolved, putting the prepared freeze-dried solution into a refrigerator at the temperature of-30 ℃, freezing for 12 hours, after complete freezing, putting the freeze-dried solution into a freeze dryer, drying at the temperature of-20 ℃ under the vacuum degree of 1Pa, purifying and concentrating to prepare the sintering aid.
Then the propylene glycol, terpineol, tetraethylene glycol dimethyl ether, methyl methacrylate are mixed in a ratio of 3: 3: 3: 1, then mixing 100nm nano silver particles, a sintering aid and the organic solvent carrier according to a mass ratio of 8: 1: 1 to prepare silver solder paste. The SEM image of the spherical nano silver particles used is shown in fig. 3.
The silver solder paste prepared by the method is applied to a packaging interconnection structure of an electronic device. The first master and the second master in the package interconnection structure are both selected as DBC substrates, a schematic structural diagram of the DBC substrate is shown in fig. 1, and a schematic structural diagram of the package interconnection structure is shown in fig. 2.
Firstly, the DBC ceramic wafer is subjected to ultrasonic cleaning for 3min, and then the silver solder paste prepared in the example is uniformly printed on the cleaned DBC ceramic wafer, so that the structure shown in figure 2 is obtained.
Finally, the coated sandwich structure is placed on a hot plate at the temperature of 90 ℃ for preheating for 5min (drying soldering paste to prevent a large amount of gas generated in the later bonding process of the soldering paste from being difficult to volatilize), then two DBC substrates are placed to form a sandwich structure to simulate a chip interconnection structure, a simulation chip is placed on a hot press, the temperature is slowly increased to a temperature range of 160 ℃ at the temperature rate of 12 ℃/min, the bonding is continuously carried out for 3min at the temperature at the bonding pressure of 8MPa (mostly, the action range of a silver soldering paste sintering aid is in the temperature range, a silver-ammonia complex concentrate in the silver soldering paste sintering aid is decomposed to generate tiny nano silver particles which can promote the diffusion interconnection of large-size silver particles in the original silver soldering paste to form a compact three-dimensional network structure at the temperature range of 12 ℃/min), and then the temperature is slowly increased to 200 ℃, the holding time was continued for 2min at a pressure of 8MPa (excess impurities present in the solder paste were volatilized, further promoting the formation of an interconnected structure between the particles). The optimal action interval of the silver soldering paste sintering aid is controlled by utilizing the temperature interval, so that the silver-ammonia complex is fully decomposed and diffused, the silver-ammonia complex is fully interconnected with the original silver particles, the decomposition temperature is reduced, and the mechanical strength of the bonding joint is enhanced.
The shear force after the test was 80MPa (average of 10 samples).
It should be noted that the specific examples of the shear fracture test performed on the connection layer are as follows: fixing the sample on a fixing clamp of a shear force tester, controlling the tester to push and compress the sample at a speed of 100 microns per second to perform a shear fracture test, and reading from the shear force tester to obtain corresponding shear force when the sample is fractured.
Example 3:
firstly, mixing tert-butyl alcohol, ethanol and water according to the ratio of 8: 1: 1, slowly dripping 0.12g of ethylenediamine into the mixed solution of tert-butyl alcohol, slowly adding 0.15g of silver oxalate under the condition that the electromagnetic stirring speed is 500rpm, stopping stirring after the silver oxalate is completely dissolved, putting the prepared freeze-dried solution into a refrigerator with the temperature of-30 ℃, freezing for 10 hours, after complete freezing, putting the freeze-dried solution into a freeze dryer, drying at the temperature of-10 ℃ under the vacuum degree of 2Pa, purifying and concentrating to prepare the sintering aid.
Then mixing butanediol, terpineol, tetraethylene glycol dimethyl ether and oleic acid in a ratio of 3: 3: 3: 2, preparing an organic solvent carrier, and mixing 5-micron long flaky silver particles, a sintering aid and the organic solvent carrier according to a mass ratio of 7: 1.5: 1.5 to prepare the silver solder paste.
The silver solder paste prepared by the method is applied to a packaging interconnection structure of an electronic device. Fig. 2 shows a schematic structural diagram of a package interconnection structure, a first master and a second master in the package interconnection structure are both selected as DBC substrates, and a schematic structural diagram of the DBC substrate is shown in fig. 1.
Firstly, the DBC ceramic wafer is subjected to ultrasonic cleaning for 3min, and then the silver solder paste prepared in the example is uniformly printed on the cleaned DBC ceramic wafer, so that the structure shown in figure 2 is obtained.
Finally, the coated sandwich structure is placed on a hot plate at the temperature of 80 ℃ for preheating for 3min (drying the soldering paste to prevent a large amount of gas generated in the later bonding process of the soldering paste from being difficult to volatilize), then two DBC substrates are placed to be in a sandwich structure to simulate a chip interconnection structure, the simulated chip is placed on a hot press, the temperature is slowly increased to a temperature range of 150 ℃ at the temperature rate of 15 ℃/min, the bonding is continuously carried out for 6min at the temperature at the bonding pressure of 2MPa (mostly, the action range of a silver soldering paste sintering aid is in the temperature range, the silver-ammonia complex concentrate in the silver soldering paste sintering aid is decomposed to generate tiny nano silver particles which can promote the diffusion interconnection of larger-sized silver particles in the original silver soldering paste to form a compact three-dimensional network structure at the temperature range of secondary temperature, the temperature is slowly increased to 200 ℃ at the temperature rate of 15 ℃/min, the holding time was continued for 2min at a pressure of 5MPa (excess impurities present in the solder paste were volatilized, further promoting the formation of an interconnected structure between the particles). The optimal action interval of the silver soldering paste sintering aid is controlled by utilizing the temperature interval, so that the silver-ammonia complex is fully decomposed and diffused, the silver-ammonia complex is fully interconnected with the original silver particles, the decomposition temperature is reduced, and the mechanical strength of the bonding joint is enhanced.
The post-test shear force was 78.9MPa (average of 10 samples).
It should be noted that the specific examples of the shear fracture test performed on the connection layer are as follows: fixing the sample on a fixing clamp of a shear force tester, controlling the tester to push and compress the sample at a speed of 100 microns per second to perform a shear fracture test, and reading from the shear force tester to obtain corresponding shear force when the sample is fractured.
The above description is only a specific embodiment of the present invention, and not all embodiments, and any equivalent modifications of the technical solutions of the present invention, which are made by those skilled in the art through reading the present specification, are covered by the claims of the present invention.
Claims (10)
1. The silver solder paste sintering aid is characterized by being a concentrate of a silver-amine complex.
2. The silver solder paste sintering aid according to claim 1, wherein the raw material components of the silver amine complex comprise: a complex compound of a silver precursor and an amine ligand, and a freeze-drying solvent.
3. The silver solder paste sintering aid according to claim 2, wherein the mass ratio of the complex of the silver precursor and the amine ligand to the freeze-drying solvent is 1-5: 5-10, and the number ratio of silver atoms to nitrogen atoms in the complex of the silver precursor and the amine ligand is 1-10: 1-10.
4. The silver paste sintering aid according to claim 2, wherein the silver precursor comprises one of silver oxide, silver nitrate, silver acetate, silver oxalate, silver lactate, silver citrate, or silver carbonate;
the amine ligand comprises one or more of monoamine, diamine and alcohol amine; the monoamine comprises one or more of ethylamine, N-propylamine, isopropylamine, N-butylamine, sec-butylamine, tert-butylamine, N-pentylamine, 1, 3-dimethylbutylamine, 1, 3-dimethylpentylamine, N-octylamine, N-decylamine, N-hexylamine, N-octylamine, N-decylamine, undecylamine, dodecylamine, tridecylamine, tetradecylamine, pentadecylamine, hexadecylamine, octadecyl saturated aliphatic hydrocarbon monoamine, dimethylamine, methylethylamine, diethylamine, methylpropylamine, dipropylamine, diisopropylamine, dibutylamine, piperidine, trimethylamine, N-dimethylethylamine, triethylamine, N-diisopropylethylamine, triisopropylamine, tri-N-butylamine and tri-N-octylamine; the diamine includes ethylenediamine, N-dimethylethylenediamine, N-diethylethylenediamine, propylenediamine, 2-dimethyl-1, 3-propylenediamine, N ' -diethyl-1, 3-propylenediamine, 1, 4-butanediamine, N-dimethyl-1, 4-butanediamine, N ' -dimethyl-1, 4-butanediamine, N-diethyl-1, 4-butanediamine, N ' -diethyl-1, 4-butanediamine, 1, 5-pentanediamine, 1, 5-diamino-2-methylpentane, and the like, One or more of 1, 6-hexamethylenediamine, N-dimethyl-1, 6-hexamethylenediamine, N' -dimethyl-1, 6-hexamethylenediamine, 1, 7-heptamethylenediamine, hexamethylenediamine, piperazine, triethylenediamine and 2, 4-dimethylhexylamine; the alcohol amine comprises one or more of ethanolamine, isopropanolamine, 2-amino-2-methyl-1-propanol and N, N-diethyl-1, 3-propanediol diamine;
the freeze-drying solvent comprises one or more of a mixed solution of tert-butyl alcohol and deionized water, a mixed solution of tert-butyl alcohol and ethanol, and a mixed solution of tert-butyl alcohol, ethanol and water, wherein the mass ratio of tert-butyl alcohol to deionized water in the mixed solution of tert-butyl alcohol and deionized water is 10: 1-10, the mass fraction of ethanol in the mixed solution of tert-butyl alcohol and ethanol is 1% -20%, and the mass ratio of tert-butyl alcohol to ethanol and water in the mixed solution of tert-butyl alcohol, ethanol and water is 10: 1-5.
5. The method for preparing a silver solder paste sintering aid according to any one of claims 1 to 4, characterized by comprising the steps of: and slowly dripping amine ligand into the freeze-drying solvent, slowly adding the silver precursor under uniform electromagnetic stirring, continuously and electromagnetically stirring at a uniform speed until the silver precursor is completely dissolved, freezing completely, placing the mixture into a freeze dryer under the condition of shading, carrying out vacuum freeze drying treatment, and concentrating to obtain the silver soldering paste sintering aid.
6. The method according to claim 5, wherein the rotation speed of the electromagnetic stirring is 100 to 1000rpm, and the freezing condition is: the freezing temperature is-30 to-10 ℃, and the conditions of the vacuum freeze drying treatment are as follows: the vacuum degree is 1-10 Pa, and the temperature is-30-0 ℃.
7. Use of the silver paste sintering aid according to any one of claims 1 to 4 as a sintering aid for silver solder paste.
8. A silver solder paste, characterized in that the silver solder paste is prepared from the silver solder paste sintering aid as claimed in any one of claims 1 to 4, silver particles and an organic solvent carrier.
9. The silver solder paste according to claim 8, wherein the silver particles comprise one or more of micro-sized silver particles or nano-sized silver particles, the micro-sized silver particles comprise flake silver having a length of 2-8 μm and a thickness of 50-200 nm, or spherical silver having a particle size of 0.5-9 μm, and the nano-silver has a thickness of preferably 20-100 nm;
the organic solvent carrier comprises ethylene glycol, diethylene glycol, 3-methoxybutanol, n-hexanol, n-propanol, diethylene glycol, n-butanol, triethylene glycol, n-dodecanol, cyclohexanol, n-heptanol, n-pentanol, n-octanol, terpineol, ethanol, methanol, isopropanol, butanediol, propylene glycol, triethylene glycol monomethyl ether, ethylene glycol butyl ether, ethylene glycol tert-butyl ether, diethylene glycol butyl ether, dipropylene glycol methyl ether, triethylene glycol dimethyl ether, ethylene glycol propyl ether, diethylene glycol dimethyl ether, ethylene glycol ethyl ether, ethylene glycol methyl ether, tetraethylene glycol dimethyl ether in alcohol ether solvents, esters comprising ethyl acetate, butyl acetate, diethyl carbonate, isoamyl acetate, vinyl acetate, ethylene glycol butyl ether acetate, diethylene glycol butyl ether acetate, methyl methacrylate, r-butyrolactone, glyceryl triacetate, glyceryl tributyrate, one or more of n-decanoic acid, oleic acid, suberic acid, glutaric acid, stearic acid, acrylic acid, neodecanoic acid, adipic acid, sebacic acid, lauric acid, L-arginine, L-aspartic acid, dodecanedioic acid, n-octanoic acid, n-butyric acid, n-hexanoic acid, syringic acid, malonic acid, L-tartaric acid and ascorbic acid.
10. A method for preparing a silver paste according to claim 8 or 9, characterized by comprising the steps of: weighing silver particles with the solid content of 60-95%, silver soldering paste sintering aid with the solid content of 10-30% and organic solvent carrier with the solid content of 10-15%, placing the silver particles and the organic solvent carrier into a high-speed mixer, stirring at 500-100 rpm for 1-3 min, stirring at 1000-2000 rpm for 1-3 min, and stirring at 2000-2500 rpm for 1-3 min for full mixing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111369192.XA CN113843549A (en) | 2021-11-18 | 2021-11-18 | Silver soldering paste sintering aid and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111369192.XA CN113843549A (en) | 2021-11-18 | 2021-11-18 | Silver soldering paste sintering aid and preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113843549A true CN113843549A (en) | 2021-12-28 |
Family
ID=78984491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111369192.XA Pending CN113843549A (en) | 2021-11-18 | 2021-11-18 | Silver soldering paste sintering aid and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113843549A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115488545A (en) * | 2022-09-29 | 2022-12-20 | 深圳先进电子材料国际创新研究院 | Surface modified silver soldering paste and preparation method and application thereof |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102002132A (en) * | 2009-09-02 | 2011-04-06 | 陈煜� | Improvement on method for preparing complex of polyvinylpyrrolidone grafted with natural polymer or water-soluble derivate thereof and iodine derivate |
| WO2011126706A2 (en) * | 2010-04-09 | 2011-10-13 | Henkel Corporation | Printable materials and methods of manufacture thereof |
| JP2011236453A (en) * | 2010-05-07 | 2011-11-24 | Toda Kogyo Corp | Silver particulate and method for producing the same, conductive paste containing the silver particulates, conductive film, and electronic device |
| CN102746349A (en) * | 2012-06-27 | 2012-10-24 | 常州方圆制药有限公司 | New synthesis method of Etimicin sulfate intermediate 3, 2', 6'-tri-N-acetyl gentamicin Cla |
| CN102941099A (en) * | 2012-11-22 | 2013-02-27 | 天津大学 | Lanthanum calcium iron cobalt calcium titanium ore type catalyst for oxidizing and reforming ethanol and method for preparing catalyst |
| CN104140717A (en) * | 2013-05-06 | 2014-11-12 | 北京中科纳通电子技术有限公司 | High-solid content jet-printing conductive ink |
| CN105290417A (en) * | 2014-06-17 | 2016-02-03 | 中国科学院大连化学物理研究所 | Synthetic method of nano-silver capable of being highly scattered in organic system |
| CN106311230A (en) * | 2015-06-30 | 2017-01-11 | 中国石油化工股份有限公司 | Preparation method of silver catalyst used for alkene epoxidation, catalyst and application thereof |
| JP2017101330A (en) * | 2017-01-25 | 2017-06-08 | 株式会社ダイセル | Method for producing silver nanoparticles, and silver nanoparticles |
| CN107250292A (en) * | 2015-02-19 | 2017-10-13 | 株式会社大赛璐 | Silver particles coating composition |
| CN108102579A (en) * | 2017-12-26 | 2018-06-01 | 昆明贵金属研究所 | A kind of preparation method and application of high heat-conductivity conducting glue |
| WO2018190397A1 (en) * | 2017-04-14 | 2018-10-18 | 御国色素株式会社 | Method for producing silver nanoparticles having a wide particle size distribution, and silver nanoparticles |
| CN109128211A (en) * | 2018-08-16 | 2019-01-04 | 山东大学 | The method of micro-nano silver particle is prepared in water solution system |
| CN110289120A (en) * | 2019-05-09 | 2019-09-27 | 深圳市先进连接科技有限公司 | A kind of preparation and packaging method of complex sintered silver-colored preformed sheet |
| CN113223748A (en) * | 2021-05-12 | 2021-08-06 | 东南大学 | Low-temperature sintered conductive silver paste, and preparation method and application thereof |
| CN113398951A (en) * | 2021-06-16 | 2021-09-17 | 中国科学技术大学 | Intermetallic compound catalyst and method for preparing intermetallic compound catalyst by using bimetallic complex |
-
2021
- 2021-11-18 CN CN202111369192.XA patent/CN113843549A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102002132A (en) * | 2009-09-02 | 2011-04-06 | 陈煜� | Improvement on method for preparing complex of polyvinylpyrrolidone grafted with natural polymer or water-soluble derivate thereof and iodine derivate |
| WO2011126706A2 (en) * | 2010-04-09 | 2011-10-13 | Henkel Corporation | Printable materials and methods of manufacture thereof |
| JP2011236453A (en) * | 2010-05-07 | 2011-11-24 | Toda Kogyo Corp | Silver particulate and method for producing the same, conductive paste containing the silver particulates, conductive film, and electronic device |
| CN102746349A (en) * | 2012-06-27 | 2012-10-24 | 常州方圆制药有限公司 | New synthesis method of Etimicin sulfate intermediate 3, 2', 6'-tri-N-acetyl gentamicin Cla |
| CN102941099A (en) * | 2012-11-22 | 2013-02-27 | 天津大学 | Lanthanum calcium iron cobalt calcium titanium ore type catalyst for oxidizing and reforming ethanol and method for preparing catalyst |
| CN104140717A (en) * | 2013-05-06 | 2014-11-12 | 北京中科纳通电子技术有限公司 | High-solid content jet-printing conductive ink |
| CN105290417A (en) * | 2014-06-17 | 2016-02-03 | 中国科学院大连化学物理研究所 | Synthetic method of nano-silver capable of being highly scattered in organic system |
| CN107250292A (en) * | 2015-02-19 | 2017-10-13 | 株式会社大赛璐 | Silver particles coating composition |
| CN106311230A (en) * | 2015-06-30 | 2017-01-11 | 中国石油化工股份有限公司 | Preparation method of silver catalyst used for alkene epoxidation, catalyst and application thereof |
| JP2017101330A (en) * | 2017-01-25 | 2017-06-08 | 株式会社ダイセル | Method for producing silver nanoparticles, and silver nanoparticles |
| WO2018190397A1 (en) * | 2017-04-14 | 2018-10-18 | 御国色素株式会社 | Method for producing silver nanoparticles having a wide particle size distribution, and silver nanoparticles |
| CN108102579A (en) * | 2017-12-26 | 2018-06-01 | 昆明贵金属研究所 | A kind of preparation method and application of high heat-conductivity conducting glue |
| CN109128211A (en) * | 2018-08-16 | 2019-01-04 | 山东大学 | The method of micro-nano silver particle is prepared in water solution system |
| CN110289120A (en) * | 2019-05-09 | 2019-09-27 | 深圳市先进连接科技有限公司 | A kind of preparation and packaging method of complex sintered silver-colored preformed sheet |
| CN113223748A (en) * | 2021-05-12 | 2021-08-06 | 东南大学 | Low-temperature sintered conductive silver paste, and preparation method and application thereof |
| CN113398951A (en) * | 2021-06-16 | 2021-09-17 | 中国科学技术大学 | Intermetallic compound catalyst and method for preparing intermetallic compound catalyst by using bimetallic complex |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115488545A (en) * | 2022-09-29 | 2022-12-20 | 深圳先进电子材料国际创新研究院 | Surface modified silver soldering paste and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114905184B (en) | Silver soldering paste and preparation method and application thereof | |
| CN108847395B (en) | Preparation and packaging method of presintered nano-network silver film for low-temperature quick connection | |
| Wang et al. | Brief review of nanosilver sintering: manufacturing and reliability | |
| CN113843549A (en) | Silver soldering paste sintering aid and preparation method and application thereof | |
| CN114799615A (en) | Silver powder surface modification method, silver solder paste, and preparation method and application of silver solder paste | |
| TW201606091A (en) | Nickel particle composition, bonding material, and bonding method in which said material is used | |
| CN116550975B (en) | Preparation method of diamond/copper composite material | |
| TWI744372B (en) | Bonding composition and production method thereof, bonding laminate, and cladded silver nanoparticle | |
| JP4248938B2 (en) | Conductive material, conductive molded body, and method for producing conductive molded body | |
| Wu et al. | Rapid and low temperature sintering bonding using Cu nanoparticle film for power electronic packaging | |
| CN113972025B (en) | Preparation and interconnection process of multi-size micro-nano mixed silver paste | |
| Qu et al. | The heat-dissipation sintered interface of power chip and heat sink and its high-temperature thermal analysis | |
| CN114829042B (en) | Silver paste, method for producing same, and method for producing joined body | |
| CN115635212B (en) | Silver soldering paste and preparation method and application thereof | |
| TWI677488B (en) | Manufacturing method of low-temperature sinterable surface-treated copper fine particles | |
| CN115488545A (en) | Surface modified silver soldering paste and preparation method and application thereof | |
| Ma et al. | Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging | |
| TWI758588B (en) | Metal particle agglomerate and method for producing the same, and paste-like metal particle agglomerate composition and method for producing a bonded body using the same | |
| CN110752051B (en) | Preparation method and sintering method of indium-coated diamond doped nano-silver sintering paste | |
| TW201834089A (en) | Method for manufacturing semiconductor device | |
| CN116652447A (en) | Preparation method of copper-based solder paste for one-step bonding and bonding method thereof | |
| JPWO2017208554A1 (en) | Metal bonding material, method of manufacturing the same, and method of manufacturing metal bonding using the same | |
| Shen et al. | Pressureless Sintering Performance Enhancement of Ag Pastes by Modification of Ag Nanoparticles with n-octylamine | |
| TWI840597B (en) | Bondable conductive adhesive and method for manufacturing electronic components | |
| Liu et al. | Low temperature bonding by sintering of Ag nanoparticle paste with the assistance of MOD |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211228 |
|
| RJ01 | Rejection of invention patent application after publication |