CN113840505A - Electronic device with heat radiation structure - Google Patents
Electronic device with heat radiation structure Download PDFInfo
- Publication number
- CN113840505A CN113840505A CN202010580654.1A CN202010580654A CN113840505A CN 113840505 A CN113840505 A CN 113840505A CN 202010580654 A CN202010580654 A CN 202010580654A CN 113840505 A CN113840505 A CN 113840505A
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- CN
- China
- Prior art keywords
- heat dissipating
- limiting
- electronic device
- connecting portion
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000005855 radiation Effects 0.000 title description 2
- 230000017525 heat dissipation Effects 0.000 claims abstract description 31
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An electronic device with a heat dissipation structure is provided. The electronic device comprises a shell, a heat dissipation piece and a limiting piece; the shell comprises a first side wall and a second side wall, wherein the first side wall comprises a first side wall connecting part, and the second side wall comprises a second side wall connecting part; the heat sink comprises a heat sink connecting part which is detachably connected with the first side wall connecting part, and the first side wall connecting part limits the degree of freedom of the heat sink connecting part in a first direction; the limiting piece is arranged on the heat dissipation piece and clamped with the second side wall connecting portion, and the second side wall connecting portion limits the degree of freedom of the limiting piece in the first direction. The invention is easy to assemble, does not need to be stood, and greatly improves the assembly yield.
Description
Technical Field
The present disclosure relates to electronic devices, and particularly to an electronic device with a heat dissipation structure.
Background
In the known electronic devices such as wireless router, the casing material can be metal to improve the heat dissipation effect. The electronic device is provided with a heat dissipation metal member inside, and the heat dissipation metal member is usually fixed to the housing in a dispensing manner. However, the yield of the dispensing method is not good, and the dispensing method needs to be left for several hours to provide the fixing effect. In addition, the heat dissipation metal part fixed by dispensing is difficult to disassemble and separate from the shell, and is difficult to recover.
Therefore, it is desirable to provide an electronic device with a heat dissipation structure to solve the above problems.
Disclosure of Invention
An embodiment of the invention provides an electronic device with a heat dissipation structure to solve the problems of the prior art, including a housing, a heat dissipation member, and a position limiting member. The shell comprises a first side wall and a second side wall, wherein the first side wall comprises a first side wall connecting part, and the second side wall comprises a second side wall connecting part. The heat sink includes a heat sink connecting portion detachably connected to the first sidewall connecting portion, and the first sidewall connecting portion restricts a degree of freedom of the heat sink connecting portion in a first direction. The limiting piece is arranged on the heat dissipation piece and clamped with the second side wall connecting portion, and the second side wall connecting portion limits the degree of freedom of the limiting piece in the first direction.
In one embodiment, the first side wall connection includes a first side wall recess, and the heat sink connection includes a heat sink projection adapted to be inserted into the first side wall recess.
In an embodiment, in a limiting state, the limiting member engages with the heat sink, and the limiting member engages with the second sidewall connecting portion simultaneously.
In an embodiment, the limiting element includes a limiting element hook and a limiting element connecting portion, the heat sink includes a heat sink through hole and a heat sink engaging portion, the limiting element connecting portion passes through the heat sink through hole and is connected to the second sidewall connecting portion, and the limiting element hook engages with the heat sink engaging portion.
In one embodiment, the heat sink includes a bridge portion and a heat sink bottom plate, the heat sink engaging portion is formed on the bridge portion, the bridge portion is formed on the heat sink bottom plate, and the position-limiting member passes through between the bridge portion and the heat sink bottom plate.
In one embodiment, the bridge portion includes a first bridge portion surface and a second bridge portion surface, the first bridge portion surface is opposite to the second bridge portion surface, the heat sink engaging portion is formed on the first bridge portion surface, and the second bridge portion surface faces the heat sink base plate and abuts the position limiting member.
In an embodiment, the position-limiting element further includes a position-limiting element convex hull, the position-limiting element convex hull protrudes toward the heat-dissipating element bottom plate, and the position-limiting element convex hull is adapted to abut against the heat-dissipating element bottom plate.
In one embodiment, in the position-limiting state, the position-limiting member hook is located on one side of the bridge portion, and the position-limiting member convex hull is located on the other side of the bridge portion.
In one embodiment, the bottom plate of the heat sink includes a bottom plate rib adapted to abut against the protrusion of the position-limiting member.
In one embodiment, the heat sink bottom plate includes two heat sink guiding portions, and the position-limiting member includes two position-limiting member sliding portions adapted to slide along the heat sink guiding portions, respectively.
In one embodiment, the bottom plate of the heat sink includes a bottom plate convex hull, the heat sink guiding portions are respectively located at two sides of the bottom plate convex hull, and the bottom plate convex rib is formed on the bottom plate convex hull.
In an embodiment, the heat sink includes a heat sink through hole and a heat sink hook, the heat sink through hole is connected to the second sidewall connecting portion, and the heat sink hook is engaged with the protrusion of the heat sink.
In an embodiment, a first side of the limiting member is connected to the second sidewall connecting portion, a second side of the limiting member is limited by the hook of the heat dissipating member, and the first side is opposite to the second side.
In one embodiment, the heat sink bottom plate includes a bottom plate convex hull and two heat sink guiding portions, the position-limiting member includes two position-limiting member sliding portions, the protruding direction of the position-limiting member sliding portions is opposite to the protruding direction of the position-limiting member protruding portions, the position-limiting member sliding portions are adapted to respectively slide along the heat sink guiding portions, and the heat sink guiding portions are respectively located at two sides of the bottom plate convex hull.
In one embodiment, the heat sink hook is formed on the convex hull of the bottom plate.
In an embodiment, the position-limiting element is integrally formed on the heat-dissipating element, and the position-limiting element includes a cantilever, one end of the cantilever is connected to the heat-dissipating element, and the other end of the cantilever is adapted to engage with the second sidewall connecting portion.
In one embodiment, the second sidewall connecting portion includes a second sidewall recess, and the cantilever extends into and engages the second sidewall recess.
In one embodiment, the position-limiting member includes a holding portion formed on the cantilever, and the cantilever is rotated to be separated from the second sidewall groove by pulling the holding portion.
By applying the electronic device of the embodiment of the invention, the heat sink and the shell are fixedly connected in a manner of clamping the limiting piece, so the electronic device is easy to assemble, does not need to stand, and greatly improves the assembly yield. In addition, the heat sink can be simply disassembled and separated from the shell, and is easy to recover.
Drawings
Fig. 1A is an exploded view of an electronic device with a heat dissipation structure according to a first embodiment of the invention.
Fig. 1B is a combination diagram of an electronic device with a heat dissipation structure according to a first embodiment of the invention.
FIG. 2A shows a cross-sectional view taken along line 2A-2A of FIG. 1B.
FIG. 2B shows a cross-sectional view taken along line 2B-2B of FIG. 1B.
Fig. 2C shows an enlarged view of a portion 2C of fig. 1B.
Fig. 3 shows an assembly process of the electronic device according to the first embodiment of the invention.
Fig. 4A is an exploded view of an electronic device with a heat dissipation structure according to a second embodiment of the invention.
Fig. 4B is a combination diagram of an electronic device with a heat dissipation structure according to a second embodiment of the invention.
Fig. 4C shows an enlarged view of the portion 4C in fig. 4B.
FIG. 4D shows a cross-sectional view in the direction 4D-4D of FIG. 4B.
Fig. 4E shows a combination of the position-limiting elements according to the second embodiment of the invention.
Fig. 5A is an exploded view of an electronic device with a heat dissipation structure according to a third embodiment of the invention.
Fig. 5B is a combination diagram of an electronic device with a heat dissipation structure according to a second embodiment of the invention.
FIG. 5C shows a cross-sectional view 5C-5C of FIG. 5B.
Description of the main component symbols:
e electronic device
1. 1' shell
11 first side wall
111 first side wall connection
12 second side wall
121. 121' second side wall connection part
201. 202, 203 heat sink
21 heat sink connecting part
22 heat sink through hole
23 bridge portion
231 first bridge surface
232 second bridge surface
239 heat sink engaging part
24. 24' heat sink base plate
241 bottom plate convex rib
242. 242' heat sink guide portion
243. 243' bottom plate convex hull
25 heat sink hook
301. 302, 303 position limiter
31 stopper connecting part
32 position-limiting part trip
33 convex hull of position limiting part
351. 352 stopper slide part
36 stop lug
37 cantilever
371 gripping part
391 first side
392 second side
Z first direction
Detailed Description
Fig. 1A is an exploded view of an electronic device with a heat dissipation structure according to a first embodiment of the invention, and fig. 1B is an assembly view of the electronic device with a heat dissipation structure according to the first embodiment of the invention. Referring to fig. 1A and fig. 1B, an electronic device E with a heat dissipation structure according to a first embodiment of the invention includes a housing 1, a heat dissipation member 201, and a limiting member 301. The housing 1 includes a first sidewall 11 and a second sidewall 12, wherein the first sidewall 11 includes a first sidewall connecting portion 111, and the second sidewall 12 includes a second sidewall connecting portion 121.
Fig. 2A shows a connection situation of the heat dissipation member and the first sidewall according to the embodiment of the invention. Fig. 2B shows a connection situation of the heat dissipation member and the second sidewall according to the embodiment of the invention. Referring to fig. 1A, 1B, 2A and 2B, the heat sink 201 includes a heat sink connecting portion 21, the heat sink connecting portion 21 is detachably connected to the first sidewall connecting portion 111, and the first sidewall connecting portion 111 limits a degree of freedom of the heat sink connecting portion 21 in a first direction Z. The limiting member 301 is disposed on the heat sink 201, the limiting member 301 is engaged with the second sidewall connecting portion 121, and the second sidewall connecting portion 121 limits the degree of freedom of the limiting member 301 in the first direction Z.
With reference to fig. 1A and fig. 2A, in an embodiment, the first sidewall connecting portion 111 is a first sidewall recess (111), the heat sink connecting portion 21 is a heat sink protrusion (21), and the heat sink protrusion (21) is adapted to be inserted into the first sidewall recess (111).
Fig. 2C shows an enlarged view of a portion 2C of fig. 1B. With reference to fig. 2B and fig. 2C, in an embodiment, in a limiting state, the limiting member 301 is engaged with the heat sink 201, and the limiting member 301 is engaged with the second sidewall connecting portion 121 at the same time.
With reference to fig. 2B and fig. 2C, in an embodiment, the limiting element 301 includes a limiting element hook 32 and a limiting element connecting portion 31, the heat sink 201 includes a heat sink through hole 22 and a heat sink engaging portion 239, the limiting element connecting portion 31 passes through the heat sink through hole 22 and is connected to the second sidewall connecting portion 121, and the limiting element hook 32 engages with the heat sink engaging portion 239.
With reference to fig. 2A and 2C, in an embodiment, the heat sink 201 includes a bridge portion 23 and a heat sink bottom plate 24, the heat sink engaging portion 239 is formed on the bridge portion 23, the bridge portion 23 is formed on the heat sink bottom plate 24, and the limiting member 301 passes through between the bridge portion 23 and the heat sink bottom plate 24.
With reference to fig. 2A and 2C, in an embodiment, the bridge portion 23 includes a first bridge portion surface 231 and a second bridge portion surface 232, the first bridge portion surface 231 is opposite to the second bridge portion surface 232, the heat sink engaging portion 239 is formed on the first bridge portion surface 231, and the second bridge portion surface 232 faces the heat sink bottom plate 24 and abuts against the position-limiting member 301.
Referring to fig. 2C, in an embodiment, the position-limiting member 301 further includes a position-limiting member convex hull 33, the position-limiting member convex hull 33 protrudes toward the heat sink bottom plate 24, and the position-limiting member convex hull 33 is adapted to abut against the heat sink bottom plate 24 to absorb the manufacturing tolerance in the first direction Z and prevent the position-limiting member 301 from loosening.
Referring to fig. 2C, in the position-limiting state, in an embodiment, the position-limiting element hook 32 is located on one side of the bridge portion 23, and the position-limiting element convex hull 33 is located on the other side of the bridge portion 23.
Referring to fig. 2C, in an embodiment, the heat sink bottom plate 24 includes a bottom plate rib 241, and the bottom plate rib 241 is adapted to abut against the position-limiting member convex hull 33 to absorb the manufacturing tolerance in the first direction Z and prevent the position-limiting member 301 from loosening.
Referring to fig. 2C, in an embodiment, the heat sink bottom plate 24 includes two heat sink guiding portions 242, and the position-limiting member 301 includes two position-limiting member sliding portions 351, wherein the position-limiting member sliding portions 351 are adapted to slide along the heat sink guiding portions 242, respectively.
Referring to fig. 2C, in one embodiment, the heat sink base plate 24 includes a base plate convex hull 243, the heat sink guiding parts 242 are respectively located at two sides of the base plate convex hull 243, and the base plate convex rib 241 is formed on the base plate convex hull 243.
Fig. 3 shows an assembly process of the electronic device according to the first embodiment of the invention. Referring to fig. 1A, 1B and 3, when the electronic device according to the first embodiment of the invention is to be assembled, the heat sink connecting portion 21 on one side of the heat sink 201 is first connected to the first sidewall connecting portion 111 (fig. 1A and 3). Then, the other side of the heat sink 201 is rotated and placed in the housing 1. Then, the limiting member 301 is inserted, the limiting member 301 engages with the heat sink 201, and the limiting member 301 engages with the second sidewall connecting portion 121 at the same time, thereby completing the assembly and fixation of the heat sink 201.
In the first embodiment of the present invention, the limiting member 301 is fixedly connected to the heat sink 201 and the housing 1 in an engaging manner, so that the effects of easy assembly and disassembly and high reliability can be provided.
Fig. 4A is an exploded view of an electronic device with a heat dissipation structure according to a second embodiment of the invention, and fig. 4B is an assembly view of the electronic device with the heat dissipation structure according to the second embodiment of the invention. Fig. 4C shows an enlarged view of the portion 4C in fig. 4B. Fig. 4D shows a connection between the heat dissipation member and the second sidewall according to an embodiment of the invention. With reference to fig. 4A, 4B, 4C and 4D, in an embodiment, the limiting element 302 includes a limiting element protrusion 36 and a limiting element connecting portion 31, the heat dissipating element 202 includes a heat dissipating element through hole 22 and a heat dissipating element hook 25, the limiting element connecting portion passes through the heat dissipating element through hole 22 and is connected to the second sidewall connecting portion 121, and the limiting element protrusion 36 is engaged with the heat dissipating element hook 25.
Referring to fig. 4C, in an embodiment, a first side 391 of the position-limiting member 302 is connected to the second sidewall connecting portion 121, a second side 392 of the position-limiting member 302 is limited by the heat sink hook 25, and the first side 391 is opposite to the second side 392.
Fig. 4E shows a combination of the position-limiting members 302 according to the second embodiment of the invention. With reference to fig. 4E and 4C, in an embodiment, the heat sink bottom plate 24 'includes a bottom plate convex hull 243' and two heat sink guiding portions 242', the position-limiting element 302 includes two position-limiting element sliding portions 352, the protruding direction of the position-limiting element sliding portions 352 is opposite to the protruding direction of the position-limiting element protruding portion 36, the position-limiting element sliding portions 352 are adapted to respectively slide along the heat sink guiding portions 242', and the heat sink guiding portions 242 'are respectively located at two sides of the bottom plate convex hull 243'.
With reference to fig. 4C, 4D and 4E, in an embodiment, the heat sink hook 25 is formed on the bottom plate convex hull 243'. In this embodiment, when the position-limiting member 302 is to be assembled, the first side 391 of the position-limiting member 302 is first connected to the second sidewall connection portion 121. Then, the second side 392 of the position-limiting member 302 is pressed downward to connect to the heat sink hook 25.
In the second embodiment of the present invention, the position-limiting element 302 is fixedly connected to the heat sink 202 and the housing 1 in a snap-fit manner, so that the effects of easy assembly and disassembly and high reliability can be provided.
Fig. 5A is an exploded view of an electronic device with a heat dissipation structure according to a third embodiment of the invention, and fig. 5B is an assembly view of the electronic device with the heat dissipation structure according to the second embodiment of the invention. FIG. 5C shows a cross-sectional view 5C-5C of FIG. 5B. Referring to fig. 5A, 5B and 5C, in an embodiment, the position-limiting element 303 is formed on the heat-dissipating element 203 in an integrated manner, the position-limiting element 303 includes a cantilever 37, one end of the cantilever 37 is connected to the heat-dissipating element 203, and the other end of the cantilever 37 is adapted to engage with the second sidewall connecting portion 121 'of the housing 1'.
Referring to fig. 5C, in one embodiment, the second sidewall connecting portion 121 'is a second sidewall recess (121'), and the cantilever 37 extends into the second sidewall recess (121') and engages the second sidewall recess (121'). In one embodiment, the position-limiting member 303 includes a holding portion 371, the holding portion 371 is formed on the cantilever 37, and the cantilever 37 can be rotated to be disengaged from the second sidewall groove (121') by pulling the holding portion 371. The assembly process of the electronic device according to the third embodiment of the present invention is the same as that of the previous embodiment, and therefore, the description thereof is omitted.
In the third embodiment of the present invention, the position-limiting member 303 is fixedly connected to the heat sink 203 and the housing 1' in an engaging manner, so that the effect of easy assembly and disassembly and high reliability can be provided.
In an embodiment of the invention, the electronic device may be a wireless router. The disclosure is not limited to the invention, and the electronic device may be an electronic device with other functions.
By applying the electronic device of the embodiment of the invention, the heat sink and the shell are fixedly connected in a manner of clamping the limiting piece, so the electronic device is easy to assemble, does not need to stand, and greatly improves the assembly yield. In addition, the heat sink can be simply disassembled and separated from the shell, and is easy to recover.
Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (18)
1. An electronic device with a heat dissipation structure, the electronic device comprising:
the shell comprises a first side wall and a second side wall, wherein the first side wall comprises a first side wall connecting part, and the second side wall comprises a second side wall connecting part;
a heat sink, the heat sink including a heat sink connecting portion, the heat sink connecting portion detachably connecting to the first sidewall connecting portion, the first sidewall connecting portion restricting a degree of freedom of the heat sink connecting portion in a first direction;
the limiting piece is arranged on the heat dissipation piece and clamped with the second side wall connecting portion, and the second side wall connecting portion limits the degree of freedom of the limiting piece in the first direction.
2. The electronic device with a heat dissipating structure as claimed in claim 1, wherein the first sidewall connecting portion includes a first sidewall recess, and the heat sink connecting portion includes a heat sink protrusion adapted to be inserted into the first sidewall recess.
3. The electronic device with a heat dissipating structure as claimed in claim 1, wherein in a limiting state, the position-limiting element engages with the heat dissipating element, and the position-limiting element engages with the second sidewall connecting portion simultaneously.
4. The electronic device with a heat dissipating structure as claimed in claim 3, wherein the position-limiting element comprises a position-limiting element hook and a position-limiting element connecting portion, the heat dissipating element comprises a heat dissipating element through hole and a heat dissipating element engaging portion, the position-limiting element connecting portion passes through the heat dissipating element through hole and is connected to the second sidewall connecting portion, and the position-limiting element hook engages with the heat dissipating element engaging portion.
5. The electronic device with a heat dissipating structure as claimed in claim 4, wherein the heat dissipating member includes a bridge portion and a heat dissipating member base plate, the heat dissipating member engaging portion is formed on the bridge portion, the bridge portion is formed on the heat dissipating member base plate, and the position limiting member passes through between the bridge portion and the heat dissipating member base plate.
6. The electronic device with a heat dissipating structure as claimed in claim 5, wherein the bridge portion includes a first bridge portion surface and a second bridge portion surface, the first bridge portion surface is opposite to the second bridge portion surface, the heat sink engaging portion is formed on the first bridge portion surface, and the second bridge portion surface faces the heat sink base plate and abuts the position limiter.
7. The electronic device with a heat dissipating structure as claimed in claim 6, wherein the position-limiting member further comprises a position-limiting member convex hull, the position-limiting member convex hull protrudes toward the heat dissipating member bottom plate, and the position-limiting member convex hull is adapted to abut against the heat dissipating member bottom plate.
8. The electronic device with a heat dissipating structure as claimed in claim 7, wherein in the position-limiting state, the position-limiting hook is located on one side of the bridge portion, and the position-limiting protrusion is located on the other side of the bridge portion.
9. The electronic device with a heat dissipating structure of claim 7, wherein the heat sink bottom plate comprises a bottom plate rib, the bottom plate rib is adapted to abut the retainer convex hull.
10. The electronic device with a heat dissipating structure as claimed in claim 9, wherein the heat dissipating member bottom plate includes two heat dissipating member guiding portions, and the position limiter includes two position limiter sliding portions adapted to slide along the heat dissipating member guiding portions, respectively.
11. The electronic device with a heat dissipating structure as claimed in claim 10, wherein the heat dissipating member bottom plate includes a bottom plate convex hull, the heat dissipating member guiding portions are respectively located at two sides of the bottom plate convex hull, and the bottom plate convex rib is formed on the bottom plate convex hull.
12. The electronic device with a heat dissipating structure as claimed in claim 3, wherein the position-limiting element comprises a position-limiting element protrusion and a position-limiting element connecting portion, the heat dissipating element comprises a heat dissipating element through hole and a heat dissipating element hook, the position-limiting element connecting portion passes through the heat dissipating element through hole and is connected to the second sidewall connecting portion, and the position-limiting element protrusion engages with the heat dissipating element hook.
13. The electronic device with a heat dissipating structure as claimed in claim 12, wherein a first side of the position-limiting member is connected to the second sidewall connecting portion, a second side of the position-limiting member is limited by the heat dissipating member hook, and the first side is opposite to the second side.
14. The electronic device with a heat dissipating structure as claimed in claim 13, wherein the heat dissipating member bottom plate includes a bottom plate convex hull and two heat dissipating member guiding portions, the position limiting member includes two position limiting member sliding portions, the protrusion direction of the position limiting member sliding portions is opposite to the protrusion direction of the position limiting member protruding portions, the position limiting member sliding portions are adapted to slide along the heat dissipating member guiding portions, respectively, and the heat dissipating member guiding portions are located on two sides of the bottom plate convex hull, respectively.
15. The electronic device with a heat dissipating structure as claimed in claim 14, wherein the heat sink hook is formed on the bottom plate convex hull.
16. The electronic device with a heat dissipating structure as claimed in claim 1, wherein the position-limiting element is integrally formed on the heat dissipating element, and the position-limiting element includes a cantilever having one end connected to the heat dissipating element and the other end adapted to engage with the second sidewall connecting portion.
17. The electronic device with a heat dissipating structure of claim 16, wherein the second sidewall connecting portion includes a second sidewall recess, the cantilever extends into and engages the second sidewall recess.
18. The electronic device with a heat dissipating structure of claim 16, wherein the position limiting element includes a holding portion formed on the cantilever, and the cantilever is rotated to disengage from the second sidewall recess by pulling the holding portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010580654.1A CN113840505A (en) | 2020-06-23 | 2020-06-23 | Electronic device with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010580654.1A CN113840505A (en) | 2020-06-23 | 2020-06-23 | Electronic device with heat radiation structure |
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| Publication Number | Publication Date |
|---|---|
| CN113840505A true CN113840505A (en) | 2021-12-24 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010580654.1A Pending CN113840505A (en) | 2020-06-23 | 2020-06-23 | Electronic device with heat radiation structure |
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