CN108036284A - Adaptive heat dissipation equipment - Google Patents
Adaptive heat dissipation equipment Download PDFInfo
- Publication number
- CN108036284A CN108036284A CN201711243225.XA CN201711243225A CN108036284A CN 108036284 A CN108036284 A CN 108036284A CN 201711243225 A CN201711243225 A CN 201711243225A CN 108036284 A CN108036284 A CN 108036284A
- Authority
- CN
- China
- Prior art keywords
- heat
- radiating subassembly
- heat dissipation
- conducting plate
- dissipation equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
A kind of adaptive heat dissipation equipment, including：Shell, radiating subassembly, heat-conducting plate and installing plate, shell are provide with radiating subassembly, and radiating subassembly is connected with heat-conducting plate, and installing plate is arranged on heat-conducting plate；Heat-conducting plate is cuboid structure；Heat-conducting plate has the mounting surface of well-regulated planar structure, and mounting surface is backwards to radiating subassembly；Installing plate offers multiple slide slots；The side wall of slide slot offers limit card slot, and multiple slide slots and limit card slot are provided commonly for connection mounted LED lamp.Above-mentioned adaptive heat dissipation equipment is simple and reasonable.It can realize quickly installation and replace the efficiency of LED light, and the dismounting to radiating subassembly need not be carried out in installation process, it is not easy to damage radiating subassembly；Meanwhile can meet the radiating requirements to high-powered LED lamp under the effect such as shell, radiating subassembly, heat-conducting plate, the heat that LED lamp produces can rapidly give out outside, improve radiating efficiency.
Description
Technical field
The present invention relates to household electrical appliance technical field of heat dissipation, more particularly to a kind of adaptive heat dissipation equipment.
Background technology
With the development of science and technology and social economy, scientific and technological progress active influence the economy of society and changes people
Life style.Particularly under the fast development of LED (Light Emitting Diode, light emitting diode), LED can be applied
Environment it is more and more wider, and heat caused by its work not only have impact on the light efficiency of LED, more influence the service life of LED.
However, traditional radiator and the connection mode of LED light are integral type, such as LED circuit board is directly fitted
On radiator, this mode generally requires to be replaced LED light when LED light is damaged, but is difficult under the mounting means
LED light is rapidly replaced, and is easily damaged radiator.
The content of the invention
Based on this, it is necessary to which for replacing, LED light efficiency is low and be easily damaged the technical problem of radiator, there is provided it is a kind of from
Adapt to heat dissipation equipment.
A kind of adaptive heat dissipation equipment, including：Shell, radiating subassembly, heat-conducting plate and installing plate, the shell are provide with institute
Radiating subassembly is stated, the radiating subassembly is connected with the heat-conducting plate, and the installing plate is arranged on the heat-conducting plate；The heat conduction
Plate is cuboid structure；The heat-conducting plate has the mounting surface of well-regulated planar structure, and the mounting surface is backwards to the heat dissipation group
Part；The installing plate offers multiple slide slots；The side wall of the slide slot offers limit card slot, multiple slide slots with
And the limit card slot is provided commonly for connection mounted LED lamp.
In one of the embodiments, multiple slide slots are in a row parallel is opened in the installing plate.
In one of the embodiments, the slide slot is rectangular configuration.
In one of the embodiments, the quantity of the slide slot is five.
In one of the embodiments, five slide slots are in a row is uniformly opened in the installing plate.
In one of the embodiments, the two of the slide slot of the installing plate central region are located in five slide slots
Side wall offers the limit card slot.
In one of the embodiments, the limit card slot is semicircular arc structure.
In one of the embodiments, the limit card slot is rectangular configuration.
In one of the embodiments, the length of the limit card slot is less than the length of the slide slot.
In one of the embodiments, at least one side wall offers the limiting card in the two side of the slide slot
Groove.
Above-mentioned adaptive heat dissipation equipment is simple and reasonable, by offering multiple slide slots in installing plate, and passes through
Limit card slot is offered in the side wall of slide slot, connection mounted LED lamp is provided commonly for, can so realize Fast Installation and more
LED light is changed, and the disassembling section to radiating subassembly need not be carried out in installation process, it is not easy to damages radiating subassembly；Meanwhile
It can meet the radiating requirements to high-powered LED lamp, the heat that LED lamp produces under the effects such as shell, radiating subassembly, heat-conducting plate
Outside can be rapidly given out, improves radiating efficiency.
Brief description of the drawings
Fig. 1 is the structure diagram of adaptive heat dissipation equipment in one embodiment；
Fig. 2 is the structure diagram at another visual angle of adaptive heat dissipation equipment in embodiment illustrated in fig. 1；
Fig. 3 is the structure diagram at another visual angle of adaptive heat dissipation equipment in one embodiment；
Fig. 4 is the schematic cross-sectional view of the A-A of adaptive heat dissipation equipment in embodiment illustrated in fig. 3；
Fig. 5 is the schematic cross-sectional view of adaptive heat dissipation equipment in another embodiment；
Fig. 6 is the enlarged structure schematic diagram of adaptive heat dissipation equipment part A under heating status in embodiment illustrated in fig. 5；
Fig. 7-1 and Fig. 7-2 be respectively in one embodiment structure diagram of the thrermostatic bimetal-plate under normal temperature state and
Structure diagram under heating status；
Fig. 8 is the structure diagram of lighting device in one embodiment；
Fig. 9 is the disassemblying structure schematic diagram of lighting device in one embodiment；
Figure 10 is the structure diagram of LED lamp component in one embodiment.
Embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Embodiment be described in detail.Many details are elaborated in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case of running counter to intension of the present invention, therefore the present invention is from the limitation of following public specific embodiment.
In the description of the present invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be based on orientation shown in the drawings or
Position relationship, is for only for ease of and describes the present invention and simplify description, rather than indicates or imply that signified device or element must
There must be specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include at least one this feature.In the description of the present invention, " multiple " are meant that at least two, such as two, three
It is a etc., unless otherwise specifically defined.
In the present invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be that machinery connects
Connect or be electrically connected；It can be directly connected, can also be indirectly connected by intermediary, can be in two elements
The connection in portion or the interaction relationship of two elements, unless otherwise restricted clearly.For those of ordinary skill in the art
For, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature can be with "above" or "below" second feature
It is that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature are directly over second feature or oblique upper, or be merely representative of
Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be
One feature is immediately below second feature or obliquely downward, or is merely representative of fisrt feature level height and is less than second feature.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be with
It is directly to another element or may be simultaneously present centering elements.Term as used herein " vertically ", " level
", " on ", " under ", "left", "right" and similar statement for illustrative purposes only, be not offered as being uniquely to implement
Mode.
Referring to Fig. 1, adaptive heat dissipation equipment 10 includes：Shell 100, radiating subassembly 200, heat-conducting plate 300 and installation
Plate 400, the shell 100 are provide with the radiating subassembly 200, and the radiating subassembly 200 is connected with the heat-conducting plate 300, described
Installing plate 400 is arranged on the heat-conducting plate 300；The heat-conducting plate 300 is cuboid structure；The heat-conducting plate 300 has rule
The mounting surface 310 of planar structure then, the mounting surface 310 is backwards to the radiating subassembly 200.
Shell 100 is used to playing the role of installation to exterior, dust-proof and uniform appearance etc..For example, shell 100 is aluminium profiles
Material.For example, the shell has host cavity, the radiating subassembly is embedded in the host cavity.For example, the radiating subassembly passes through
It is fixed on the mode of shell welding in the host cavity；And for example, the radiating subassembly is spirally connected by screw and the shell
Mode be fixed in the host cavity.
Radiating subassembly 200 is used to play the role of heat absorption, heat conduction and heat dissipation, by what is be transmitted to by heat-conducting plate 300
Heat absorption is simultaneously conducted to exterior so as to distribute heat into the air outside radiating subassembly 200, then by air flowing by heat
Amount thoroughly gives out radiator.For example, the radiating subassembly is aluminium section bar.
Heat-conducting plate 300 is used to play the role of quickly conducting heat.For example, the heat-conducting plate is connected with the radiating subassembly
Both contact surfaces are bonded completely afterwards.For example, heat-conducting plate 300 is aluminium section bar.And for example, the heat-conducting plate and the radiating subassembly it
Between also by the larger heat conduction gemel connection of thermal conductivity factor, to improve heat transfer efficiency.Heat-conducting glue can be superhigh temperature heat-conducting glue, organic
The one or more of silicon heat-conducting glue, epoxy resin AB glue, polyurethane adhesive, polyurethane guide thermal conducting glue, heat-conducting silicone grease etc..
Installing plate 400 is used to play the role of connecting mounted LED lamp.That is, LED light is pacified by the mounting assembly
Dress on a heat sink, causes the stable and firm mounting surface 310 with the heat-conducting plate 300 of LED light fully to support after particularly installing
Connect.For example, installing plate 400 is aluminium section bar.
The installing plate 400 offers multiple slide slots 410；The side wall of the slide slot 410 offers limit card slot
411, the slide slot 410 and the limit card slot 411 are provided commonly for connection mounted LED lamp.That is, multiple cunnings
Row groove 410 and be arranged on 410 side wall of slide slot multiple limit card slots 411 be provided commonly for connection mounted LED lamp.
Above-mentioned adaptive heat dissipation equipment 10 is simple and reasonable.By offering multiple slide slots 410 in installing plate 400,
And by offering limit card slot 411 in the side wall of slide slot 410, connection mounted LED lamp is provided commonly for, can so be realized
Fast Installation and the work for replacing LED light, and radiating subassembly 200 need not be dismantled in installation process, so as to not allow
Fragile radiating subassembly 200；Meanwhile it can meet to big work(under the effect such as shell 100, radiating subassembly 200, heat-conducting plate 300
The radiating requirements of rate LED light, the heat that LED lamp produces can rapidly give out outside, improve radiating efficiency.
For example, multiple slide slots 410 are in a row parallel to be opened in the installing plate 400.For example, the slide slot
410 be rectangular configuration.For example, the quantity of the slide slot 410 is five.For example, five slide slots 410 are in a row uniformly
It is opened in the installing plate 400.For example, it is located at the slide slot of 400 central region of installing plate in five slide slots 410
410 two side offers the limit card slot 411.For example, the limit card slot 411 is semicircular arc structure.For example, institute
It is rectangular configuration to state limit card slot 411.For example, the length of the limit card slot 411 is less than the length of the slide slot 410.Example
Such as, at least one side wall offers the limit card slot 411 in the two side of the slide slot 410.It is in this way, parallel by a row
The multiple slide slots 410 set, the installation that can preferably complete with LED light are connected.
In order to improve radiating efficiency, Fig. 3 and Fig. 4 are referred to, for example, shell 100 is the hollow cuboid of a side opening.
Four side walls of shell 100 offer multiple ventilation holes 101 respectively.For example, the central region difference of four side walls of shell 100
Offer multiple ventilation holes 101.For example, multiple ventilation holes 101 are arranged in arrays.And for example, the opposite two side walls of shell 100
Multiple ventilation holes 101 correspond.Ventilation hole 101 is circular hole or square hole.In this way, the air of the outside of shell 100 can be with
Enter from multiple ventilation holes 101 inside shell 100 so that shell 100 is internally formed the air of relative flow, so that preferably
Heat in shell 100 is distributed to outside.
Outside is flowed out to accelerate the air inside shell 100, for example, being provided with shell 100 in cross-shaped configuration
Air duct 102.Air duct 102 has four ports, four ports ventilation hole with four side walls of shell 100 respectively
101 connections.In this way, since air duct 102 does not have clear stop, air flow is not obstructed, and ensure that certain air stream
Dynamic speed, so that the air accelerated inside shell 100 flows out to outside.Further, with reference to Fig. 4 and Fig. 5, for example, shell 100
Inside is divided into four radiating areas 103 by air duct 102.Some heat sinks 201 are provided with each radiating area 103.
For example, radiating subassembly 200 includes heat sink 201 and four groups of fins 202, each groups of fins 202 is correspondingly arranged in one
In radiating area 103.Heat sink 201 is connected with the side of shell 100.For example, heat sink 201 and the side of shell 100 are welded.Example
Such as, heat sink 201 is connected with the side of shell 100 by the reinforcing prop that radiates.For example, heat sink 201 by radiate reinforcing prop with
The side welding of shell 100.Groups of fins 202 includes some first heat sinks 212 and some second heat sinks 222.Some
One heat sink 212 and some second heat sinks 222 are arranged on heat sink 201.If for example, some first heat sinks 212 and
The 222 alternate setting of dry second heat sink.And for example, after some first heat sinks 212 are uniformly arranged on heat sink 201 in a row, if
Every three the second heat sinks 222 are arranged between two the first heat sinks 212 for one group in dry second heat sink 222.This implementation
In example, the height of the first heat sink 212 is more than the height of second heat sink 222.For example, the first heat sink 212 and second
Heat sink 222 is aluminium section bar.For example, the first heat sink 212 and the second heat sink 222 are the aluminium section bar of tabular.It is in this way, outer
Air inside shell 100 can pass through quickly flows out to outside in the air duct 102 of cross-shaped configuration, while takes away first and dissipate
Heat on 212 and second heat sink 222 of backing.
To further improve radiating efficiency, as shown in Figure 4, Figure 5 and Figure 6, for example, radiating subassembly 200 further includes multiple heat
Bimetal leaf group 203, each thrermostatic bimetal-plate group 203 are correspondingly arranged in two opposite radiating areas 103.For example, heat is double
Sheet metal group 203 includes multiple thrermostatic bimetal-plates 213, and multiple thrermostatic bimetal-plates 213 are distributed in two opposite heat dissipations in a row
In area 103, correspondence connects with multiple second heat sinks 222 in two radiating areas 103 respectively at the both ends of each thrermostatic bimetal-plate 213
Connect.In the present embodiment, correspondence is connected with three the second heat sinks 222 respectively at the both ends of each thrermostatic bimetal-plate 213.For example, dissipate
Hot plate 201 offers multiple straight slots 250, each described straight slot 250, which corresponds to, wears second heat sink 222.Further
Ground, heat-conducting plate 300 offer multiple thermal holes 350, and thermal hole 350 is corresponding with straight slot 250, and each thermal hole 350 corresponds to an institute
Straight slot 250 is stated, second heat sink 222 is embedded in the straight slot 250 after wearing the straight slot 250.In the present embodiment, heat conduction
Plate 300 is hollow cuboid structure.Accommodating cavity is provided with heat-conducting plate 300, the graphite closely set is filled with accommodating cavity
Alkene particle, wherein, the graphene particles are the plastic grain of overcoating graphite ene coatings.Thermal hole 350 is connected with the accommodating cavity,
Second heat sink 222 contacts after being embedded in the straight slot 250 with the graphene particles being filled in accommodating cavity.In this way, heat conduction
The heat assembled on plate 300 can partly will be rapidly conducted to shell 100 from the second heat sink 222, then is taken out of by air
To outside.
Refer to Fig. 7-1 and Fig. 7-2, its be respectively in one embodiment structure of the thrermostatic bimetal-plate under normal temperature state show
Intention and the structure diagram under heating status.As shown in Fig. 7-1, in the present embodiment, each thrermostatic bimetal-plate 213 corresponds to
It is connected with three the second heat sinks 222.For example, the middle part of thrermostatic bimetal-plate 213 is fixed on the heat sink of 102 bottom of air duct
On 201.For example, the middle part of thrermostatic bimetal-plate 213 is welded on the heat sink 201 of 102 bottom of air duct；And for example, the double gold of heat
The middle part for belonging to piece 213 is screwed onto on the heat sink 201 of 102 bottom of air duct.The both ends of thrermostatic bimetal-plate 213 are stretched into opposite
In two radiating areas 103, the both ends of thrermostatic bimetal-plate 213 correspond to and three the second heat sinks in two radiating areas 103 respectively
222 connections.For example, the end of thrermostatic bimetal-plate 213 is welded with three the second heat sinks 222 respectively；And for example, three second heat dissipations
Connected between piece 222 with connecting rod.The end of thrermostatic bimetal-plate 213 is connected with connecting rod.As shown in Fig. 7-2, for example, the double gold of heat
Belong to the both ends of thrermostatic bimetal-plate 213 when piece 213 is thermally deformed in the upward arc shape of bending.In this way, thrermostatic bimetal-plate 213 is heated
During deformation, three 222 equal stress of the second heat sink positioned at 213 end of thrermostatic bimetal-plate straighten.At this time the second heat sink 222 from
Groove 250 and thermal hole 350 are opened, 300 part of heat-conducting plate is exposed, so as to quickly transmit heat-conducting plate under the flowing of air
In heat to shell 100 in 300, so as to improve the radiating efficiency of heat-conducting plate 300.
It is noted that the present invention also provides a kind of lighting device, Fig. 8 to Figure 10 is referred to, which includes：
Adaptive heat dissipation equipment and LED lamp component 500；The adaptive heat dissipation equipment includes：Shell 100, radiating subassembly 200, heat conduction
Plate 300 and installing plate 400, the shell 100 are provide with the radiating subassembly 200, the radiating subassembly 200 and the heat-conducting plate
300 connections, the installing plate 400 are arranged on the heat-conducting plate 300；The heat-conducting plate 300 is cuboid structure；The heat conduction
Plate 300 has the mounting surface 310 of well-regulated planar structure, and the mounting surface 310 is backwards to the radiating subassembly 200.
Shell 100 is used to playing the role of installation to exterior, dust-proof and uniform appearance etc..For example, shell 100 is aluminium profiles
Material.For example, the shell has host cavity, the radiating subassembly is embedded in the host cavity.For example, the radiating subassembly passes through
It is fixed on the mode of shell welding in the host cavity；And for example, the radiating subassembly is spirally connected by screw and the shell
Mode be fixed in the host cavity.
Radiating subassembly 200 is used to play the role of heat absorption, heat conduction and heat dissipation, by what is be transmitted to by heat-conducting plate 300
Heat absorption is simultaneously conducted to exterior so as to distribute heat into the air outside radiating subassembly 200, then by air flowing by heat
Amount thoroughly gives out radiator.For example, the radiating subassembly is aluminium section bar.
Heat-conducting plate 300 is used to play the role of quickly conducting heat.For example, the heat-conducting plate is connected with the radiating subassembly
Both contact surfaces are bonded completely afterwards.For example, heat-conducting plate 300 is aluminium section bar.And for example, the heat-conducting plate and the radiating subassembly it
Between also by the larger heat conduction gemel connection of thermal conductivity factor, to improve heat transfer efficiency.Heat-conducting glue can be superhigh temperature heat-conducting glue, organic
The one or more of silicon heat-conducting glue, epoxy resin AB glue, polyurethane adhesive, polyurethane guide thermal conducting glue, heat-conducting silicone grease etc..
Installing plate 400 is used to play the role of connecting mounted LED lamp.That is, LED light is pacified by the mounting assembly
Dress on a heat sink, causes the stable and firm mounting surface 310 with the heat-conducting plate 300 of LED light fully to support after particularly installing
Connect.For example, installing plate 400 is aluminium section bar.
The installing plate 400 offers multiple slide slots 410；The side wall of the slide slot 410 offers limit card slot
411, the slide slot 410 and the limit card slot 411 are provided commonly for connection mounted LED lamp.That is, multiple cunnings
Row groove 410 and be arranged on 410 side wall of slide slot multiple limit card slots 411 be provided commonly for connection mounted LED lamp.
As shown in Figure 9 and Figure 10, the LED lamp component 500 includes plate body 510 and LED lamp 520.The plate body 510 is
Cuboid structure.The plate body 510 has the light-emitting area 511 that is disposed opposite to each other and a radiating surface 512, the light-emitting area 511 and described
Radiating surface 512 is the planar structure of rule, and the LED lamp 520 is arranged in the light-emitting area 511.The plate body 510 in
The radiating surface 512 is provided with multiple trolley shoes 530, and the side wall of the trolley shoe 530 is provided with positive stop strip 531, each described
Trolley shoe 530 is corresponded to and is slidably connected with a slide slot 410, and each positive stop strip 531 is correspondingly embedded in a limiting card
In groove 411, and the radiating surface 512 is abutted with the mounting surface 310.
Above-mentioned lighting device, by offering multiple slide slots in installing plate, and is opened up by the side wall in slide slot
Have limit card slot, accordingly, multiple trolley shoes 530 be set in the plate body 510 of LED lamp component 500, and with trolley shoe 530
Side wall is provided with positive stop strip 531, and slide slot and trolley shoe 530 connect mounted LED lamp component 500 jointly, can so realize fast
The installation of speed and the efficiency for replacing LED lamp component 500, and the dismounting to radiating subassembly need not be carried out in installation process, no
It is easily damaged radiating subassembly；Meanwhile it can meet to high-powered LED lamp component under the effect such as shell, radiating subassembly, heat-conducting plate
500 radiating requirements, the heat that LED lamp 520 produces can rapidly give out outside, improve radiating efficiency.
For example, multiple slide slots 410 are in a row parallel to be opened in the installing plate 400.For example, the slide slot
410 be rectangular configuration.For example, the quantity of the slide slot 410 is five.For example, five slide slots 410 are in a row uniformly
It is opened in the installing plate 400.For example, it is located at the slide slot of 400 central region of installing plate in five slide slots 410
410 two side offers the limit card slot 411.For example, the limit card slot 411 is semicircular arc structure.For example, institute
It is rectangular configuration to state limit card slot 411.For example, the length of the limit card slot 411 is less than the length of the slide slot 410.Example
Such as, at least one side wall offers the limit card slot 411 in the two side of the slide slot 410.It is in this way, parallel by a row
The multiple slide slots 410 set, the installation that can preferably complete with LED light are connected.
It is corresponding, it is arranged in parallel in for example, multiple trolley shoes 530 are in a row on the radiating surface 512.For example, institute
It is rectangular configuration to state trolley shoe 530.For example, five trolley shoes 530 are set.For example, five trolley shoes 530 are in a row
It is uniformly arranged on the radiating surface 512.For example, positioned at 512 central region of radiating surface in five trolley shoes 530
The two side of trolley shoe 530 is both provided with the positive stop strip 531.For example, the positive stop strip 531 is semi-cylindrical structure.For example,
The positive stop strip 531 is cuboid structure.For example, the length of the positive stop strip 531 is less than the length of the trolley shoe 530.Example
Such as, at least one side wall is provided with the positive stop strip 531 in the two side of the trolley shoe 530.In this way, by installing plate
400 offer multiple slide slots 410, and by offering limit card slot 411, the company of being provided commonly in the side wall of slide slot 410
Mounted LED lamp is connect, quickly installation can be so realized and replace the efficiency of LED light, and need not be carried out in installation process
Dismounting to radiating subassembly 200, it is not easy to damage radiating subassembly 200；Meanwhile in shell 100, radiating subassembly 200, heat-conducting plate
It can meet the radiating requirements to high-powered LED lamp under 300 grade effects, the heat that LED lamp produces can rapidly give out
Outside, improves radiating efficiency.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, its description is more specific and detailed, but simultaneously
Cannot therefore it be construed as limiting the scope of the patent.It should be pointed out that come for those of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
- A kind of 1. adaptive heat dissipation equipment, it is characterised in that including：Shell, radiating subassembly, heat-conducting plate and installing plate, it is described Shell is provide with the radiating subassembly, and the radiating subassembly is connected with the heat-conducting plate, and the installing plate is arranged at the heat-conducting plate On；The heat-conducting plate is cuboid structure；The heat-conducting plate has the mounting surface of well-regulated planar structure, and the mounting surface is backwards to the radiating subassembly；The installing plate offers multiple slide slots；The side wall of the slide slot offers limit card slot, and multiple slide slots and the limit card slot are provided commonly for connecting Mounted LED lamp.
- 2. adaptive heat dissipation equipment according to claim 1, it is characterised in that the multiple slide slots are in a row parallel to be opened Arranged on the installing plate.
- 3. adaptive heat dissipation equipment according to claim 1, it is characterised in that the slide slot is rectangular configuration.
- 4. adaptive heat dissipation equipment according to claim 1, it is characterised in that the quantity of the slide slot is five.
- 5. adaptive heat dissipation equipment according to claim 4, it is characterised in that five slide slots are in a row uniformly to be opened Arranged on the installing plate.
- 6. adaptive heat dissipation equipment according to claim 5, it is characterised in that be located at the peace in five slide slots The two side of the slide slot of loading board central region offers the limit card slot.
- 7. adaptive heat dissipation equipment according to claim 1, it is characterised in that the limit card slot is semicircular arc knot Structure.
- 8. adaptive heat dissipation equipment according to claim 1, it is characterised in that the limit card slot is rectangular configuration.
- 9. adaptive heat dissipation equipment according to claim 1, it is characterised in that the length of the limit card slot is less than described The length of slide slot.
- 10. adaptive heat dissipation equipment according to claim 1, it is characterised in that in the two side of the slide slot at least There is one side wall to offer the limit card slot.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711243225.XA CN108036284B (en) | 2017-11-30 | 2017-11-30 | Self-adaptive heat dissipation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711243225.XA CN108036284B (en) | 2017-11-30 | 2017-11-30 | Self-adaptive heat dissipation equipment |
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| Publication Number | Publication Date |
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| CN108036284A true CN108036284A (en) | 2018-05-15 |
| CN108036284B CN108036284B (en) | 2020-03-24 |
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| CN201711243225.XA Active CN108036284B (en) | 2017-11-30 | 2017-11-30 | Self-adaptive heat dissipation equipment |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101586742A (en) * | 2008-05-21 | 2009-11-25 | 阳杰科技股份有限公司 | Light source module and maintenance method thereof |
| CN201944805U (en) * | 2010-12-11 | 2011-08-24 | 郭小华 | LED lamp radiating structure for efficient transmission |
| CN202228982U (en) * | 2011-10-11 | 2012-05-23 | 京东方科技集团股份有限公司 | LED component |
| CN204062565U (en) * | 2014-07-31 | 2014-12-31 | 东莞勤上光电股份有限公司 | Integrated LED lamp |
| US20150146422A1 (en) * | 2013-11-25 | 2015-05-28 | Lg Electronics Inc. | Light emitting module |
| CN106051484A (en) * | 2016-06-22 | 2016-10-26 | 东莞市闻誉实业有限公司 | High-power heat dissipation LED lamp |
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2017
- 2017-11-30 CN CN201711243225.XA patent/CN108036284B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101586742A (en) * | 2008-05-21 | 2009-11-25 | 阳杰科技股份有限公司 | Light source module and maintenance method thereof |
| CN201944805U (en) * | 2010-12-11 | 2011-08-24 | 郭小华 | LED lamp radiating structure for efficient transmission |
| CN202228982U (en) * | 2011-10-11 | 2012-05-23 | 京东方科技集团股份有限公司 | LED component |
| US20150146422A1 (en) * | 2013-11-25 | 2015-05-28 | Lg Electronics Inc. | Light emitting module |
| CN204062565U (en) * | 2014-07-31 | 2014-12-31 | 东莞勤上光电股份有限公司 | Integrated LED lamp |
| CN106051484A (en) * | 2016-06-22 | 2016-10-26 | 东莞市闻誉实业有限公司 | High-power heat dissipation LED lamp |
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| Publication number | Publication date |
|---|---|
| CN108036284B (en) | 2020-03-24 |
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