CN113829914A - Power module protection system based on temperature collecting plate and charging equipment - Google Patents
Power module protection system based on temperature collecting plate and charging equipment Download PDFInfo
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- CN113829914A CN113829914A CN202111008759.0A CN202111008759A CN113829914A CN 113829914 A CN113829914 A CN 113829914A CN 202111008759 A CN202111008759 A CN 202111008759A CN 113829914 A CN113829914 A CN 113829914A
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- 238000009434 installation Methods 0.000 abstract description 6
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L53/00—Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles
- B60L53/30—Constructional details of charging stations
- B60L53/302—Cooling of charging equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L53/00—Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles
- B60L53/30—Constructional details of charging stations
- B60L53/31—Charging columns specially adapted for electric vehicles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/7072—Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T90/00—Enabling technologies or technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02T90/10—Technologies relating to charging of electric vehicles
- Y02T90/12—Electric charging stations
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a power module protection system and charging equipment based on a temperature collecting plate, which are applied to a power module with a power semiconductor and comprise a radiator, the temperature collecting plate and a processing module, wherein the radiator is provided with an installation structure matched with the installation of the temperature collecting plate, the temperature collecting plate is arranged on the installation structure, a temperature collecting circuit used for acquiring real-time temperature is arranged on the temperature collecting plate, the processing module determines a power limiting value according to the real-time temperature so that the power module can work according to the power limiting value, and the temperature collecting circuit and the radiator meet safety insulation requirements. The invention can be applied to a radiator connected with the ground, can provide protection for the power module with the power semiconductor, controls the output power of the power semiconductor in a safe range, avoids the continuous rise of temperature, and ensures that the power module can not be damaged or cause danger under severe conditions (high temperature).
Description
Technical Field
The invention belongs to the technical field of charging of new energy vehicles, and particularly relates to a power module protection system based on a temperature collecting plate and charging equipment.
Background
At present, with the development of new energy vehicles, high-power super charging piles are produced, the problems of difficulty and complication of heat treatment are brought by high power and small volume of a power module, and the power module is more labored in thermal design and heat treatment.
Although new heat dissipation methods such as air duct isolation and water cooling are rapidly developed, it is a challenge to control the modules more complicated. Modules including isolated air ducts, water cooling, and other heat dissipation methods such as natural cooling are also partially adopted, and a large-area contact between a radiator and a power module is utilized to provide a heat dissipation path.
For example, in the conventional water-cooling module temperature-limited power system shown in fig. 1, 1) the water temperature at the water inlet and the water outlet is collected by adhering a conventional NTC to a temperature collection point, and an electric signal is transmitted to a DSP through a cable with poor insulation performance and poor reliability; 2) processing the water temperature collected to the DSP by the NTC, and calculating a power limiting value according to the water temperature of the water inlet and a water temperature limit power curve; 3) comparing the water temperature limit power with the given value of the current normally output by the voltage ring and externally input, and taking the minimum value as the given value of the current limiting ring; 4) and obtaining a current loop given value through the current limiting loop operation, thereby controlling the current and the power output by the power module.
The water-cooling module temperature limit power system has the following problems: 1) the traditional NTC collects water temperature, the NTC is a conductor, is in contact with a radiator or a water cooling plate connected with the ground, and transmits electric signals through a cable with poor insulation performance and poor reliability, so that the method is difficult to meet the safety regulation requirement, the complex dispensing technology is involved in the process treatment, and the problems of cable protection and insulation are involved; 2) if the water inlet and the water outlet are closer, the heat exchange is more violent, the heat balance is difficult or the error of the collected water temperature is larger even if the heat balance is reached. Just because there are above-mentioned two problems, it is big according to the degree of difficulty of water temperature limit power, and the security is low, and the reliability is low.
Therefore, the prior art is to be improved.
Disclosure of Invention
The invention mainly aims to provide a power module protection system and charging equipment based on a temperature collection plate, which can be suitable for a radiator connected with the ground (can meet the requirement of higher-level safety regulation insulation), and at least solve the technical problem of low reliability of a mode based on water temperature limit power mentioned in the background technology.
In a first aspect of the present invention, a power module protection system based on a thermal plate is provided, which is applied to a power module having a power semiconductor, and the power module protection system based on the thermal plate includes:
the radiator is provided with a mounting structure matched with the temperature collecting plate;
the temperature collecting plate is arranged on the mounting structure and used for acquiring real-time temperature;
the processing module determines a power limit value according to the real-time temperature so that the power module can work according to the power limit value;
the temperature acquisition circuit and the radiator meet the safety insulation requirement.
On the basis of the first aspect, each of the mounting structures includes:
the mounting structure comprises a mounting end face, wherein a first mounting hole is formed in the surface of the mounting end face inwards.
On the basis of the first aspect, a second mounting hole penetrating through the other side of the temperature collecting plate from one side of the temperature collecting plate is formed in the temperature collecting plate, and the size of the second mounting hole is matched with that of the first mounting hole.
On the basis of the first aspect, the temperature collecting plate is a PCB with a multilayer structure, the multilayer structure comprises a copper sheet heat-conducting layer and a topological layer provided with a temperature collecting chip and an auxiliary electronic element, and a first insulating layer is arranged between the copper sheet heat-conducting layer and the topological layer.
On the basis of the first aspect, the method further comprises the following steps:
one end of the heat conducting element penetrates through the second mounting hole from the side, provided with the topological layer, of the temperature collecting plate and then is connected with the first mounting hole of the radiator;
on the basis of the first aspect, the heat conducting element includes a bolt, and the first mounting hole is a threaded hole corresponding to the bolt.
On the basis of the first aspect, the heat conducting element includes a screw, a connector is disposed in the first mounting hole, and a free end of the screw is inserted into the connector.
On the basis of the first aspect, the copper sheet heat conduction layer comprises a first copper sheet and a second copper sheet, and a second insulation layer is arranged between the first copper sheet and the second copper sheet.
On the basis of the first aspect, the temperature control device further comprises a heat dissipation assembly, wherein the temperature collecting plate is arranged on the heat dissipation assembly, and the heat dissipation assembly comprises a water cooling plate and/or an air duct.
In the power module protection system based on the temperature collecting plate according to the first aspect of the present invention, on the basis that the temperature collecting circuit and the heat sink satisfy the safety insulation requirement, compared with the conventional protection system adopting an NTC water temperature collecting manner (the water temperature generally refers to the temperature of the flowing water at the water inlet and the water outlet of the cooling plate), the real-time temperature corresponding to the mounting structure on the heat sink is collected in the temperature collecting manner by using the temperature collecting plate, and the real-time temperature is based on the high thermal stability of the heat sink itself, so that the reliability and the accuracy of the real-time temperature are higher than the temperature value obtained by collecting (conventionally) the temperature of the flowing water, that is, the reliability of the original collected data depended on in the subsequent processing module execution process is high, and the power limit value P determined by the processing module is highMINIs accurate, the power limit value PMINWill be transmitted to the power module according to the power value PMINAnd executing the work. Namely, the power module protection system based on the temperature collecting plate is reliable and stable in protection performance provided by the power module, so that the power module can be ensured to normally work under severe conditions (high temperature).
In a second aspect of the present invention, there is provided a charging apparatus comprising the power module protection system based on a thermal plate as in the first aspect, thereby enabling the charging apparatus to be reliably protected against various severe conditions (high temperatures) without being damaged or causing danger under the severe conditions as much as possible.
Drawings
FIG. 1 is a functional block diagram of a prior art power module protection system as referred to in the background art;
FIG. 2 is a schematic block diagram of a temperature panel-based power module protection system of the present invention;
FIG. 3 is a schematic view of an angle at which a mounting structure and a temperature plate are coupled in a heat sink according to the present invention;
FIG. 4 is a schematic view of another angle at which a mounting structure and a thermal plate are coupled in a heat sink of the present invention;
FIG. 5 is a schematic structural view of the temperature collecting plate of the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. It is noted that relative terms such as "first," "second," and the like may be used to describe various components, but these terms are not intended to limit the components. These terms are only used to distinguish one component from another component. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present invention. The term "and/or" refers to a combination of any one or more of the associated items and the descriptive items.
In the traditional NTC water temperature collection method mentioned in the background art, the NTC is a conductor and is difficult to meet the safety requirements when contacting with a radiator or a water cooling plate connected to the ground. Since the european standard specifies a minimum creepage distance between the NTC (charged electronic component) and the ground, this results in that the measurement of the temperature of the heat sink (which is in turn connected to the ground) directly by the existing NTC (charged electronic component) does not meet the creepage distance requirement.
In the power module protection system based on the temperature collecting plate according to the first aspect of the present invention, the heat sink 10 and the temperature collecting circuit on the temperature collecting plate satisfy the safety insulation requirement, that is, there is a safe creepage distance between the heat sink 10 and the temperature collecting circuit, for example, 10mm creepage distance, thereby achieving higher safety standards such as european standard.
As shown in fig. 2-3, the thermal plate-based power module protection system of the first aspect of the present invention includes a heat sink 10, a thermal plate 20, and a processing module.
The radiator 10 has a mounting structure matched with the temperature collecting plate 20, and the mounting structure is matched with the temperature collecting plate to realize the fixation of the two. The heat sink 10 in this embodiment is grounded.
The temperature collecting plate 20 is arranged on the mounting structure, and the temperature collecting plate 20 is used for obtaining real-time temperature. In the present embodiment, the thermal plate 20 has a shape including, but not limited to, a plate shape to fit the mounting structure on the heat sink 10.
The processing module determines a power limit value according to the real-time temperature so that the power module can work according to the power limit value. In this embodiment, the processing module determines the power limit value according to the real-time temperature obtained by the temperature collecting plate 20, and specifically may determine the corresponding power limit value from the mapping relationship according to the real-time temperature. A mapping is stored in a memory of the processing module, the mapping including a plurality of real-time temperatures and a plurality of power limit values, one power limit value for each real-time temperature. After the processing module determines the power limit value, the processing module sends the power limit value to the power module so that the power module works according to the power limit value.
Wherein the power module represents an electric device that performs electric energy conversion using a power semiconductor 40 including a mos tube; the power semiconductor 40 is disposed on the heat sink 10, so that heat generated by the power semiconductor 40 is transferred through direct connection (interference) with the heat sink 10, thereby protecting the power semiconductor 40 from being damaged.
Compared with the traditional mode of acquiring water temperature by using an NTC (negative temperature coefficient) (the water temperature generally refers to the temperature of water flowing at the water inlet and the water outlet of a cooling plate), the power module protection system based on the temperature acquisition plate acquires the real-time temperature corresponding to the mounting structure on the radiator 10 by using the temperature acquisition plate 20, and the real-time temperature is based on heat dissipationThe thermal stability of the heater itself is high, so that the reliability and accuracy thereof are higher than the temperature value obtained by collecting (traditionally) the temperature of flowing water, namely, the reliability of the original collected data depended on in the execution process of the subsequent processing module is high, and then the limited power value P determined by the processing module is highMINIs accurate, the power limit value PMINWill be transmitted to the power module so that the power module will be in accordance with the power value PMINAn operation is performed, i.e., the output power of the power module is effectively controlled. The power module protection system based on the temperature collecting plate is reliable and stable in protection performance provided by the power module, so that the power module can be guaranteed to normally work under severe conditions (high temperature). And because the radiator 10 is grounded and the temperature collecting plate 20 is provided with an insulator, the safe creepage distance between the temperature collecting circuit on the temperature collecting plate 20 and the radiator can be ensured, and higher safety standards such as European standard can be realized.
In other embodiments of this embodiment, the number of the mounting structures may be multiple, and the number of the corresponding temperature collecting plates may also be multiple, so that one temperature collecting plate may be mounted on each mounting structure. Thereby forming a power module protection system of the multi-temperature collecting plate. Therefore, each temperature collecting plate can obtain a plurality of real-time temperatures (T1-TN) corresponding to a plurality of mounting structures; the temperature conditions of different parts of the radiator are comprehensively reflected by a plurality of real-time temperatures. Specifically, the processing module selects a maximum temperature according to the plurality of real-time temperatures (T1-TN), and the processing module determines a power limit value P according to the maximum temperatureMIN. Wherein the highest temperature means a highest one of the real-time temperatures (T1-TN). Determination of the power limiting value P by the maximum temperatureMINEnsuring the determined power limit value PMINIs the minimum, minimum power limiting value PMINIs determined based on the highest temperature of the heat sink, thereby avoiding that the power module still performs at high power in case of high temperature.
In other embodiments of this embodiment, the processing module calculates an average temperature based on the plurality of real-time temperatures (T1-TN), and the processing module determines the power limit value based on the calculated average temperature PMIN. The average temperature represents an average value of a plurality of real-time temperatures (T1-TN), that is, a limit power value P determined from the average temperature, which can stably reflect the heat generation of the radiator 10MINIt can be more accurate.
In other embodiments of this embodiment, a multi-temperature-collection-plate manner is adopted to collect real-time temperatures (T1-TN) corresponding to a plurality of mounting structures on a heat sink, and the obtained real-time temperatures (T1-TN) are high based on the thermal stability of the heat sink itself, so that the reliability and accuracy of the temperature-collection-plate manner are higher than temperature values obtained by collecting (traditionally) the temperature of flowing water, that is, the reliability of original collected data relied on in the subsequent processing module execution process is high, and accordingly, the protection performance provided by a power module protection system is reflected to be reliable and stable, thereby ensuring that a power module can work normally under severe conditions (high temperature). More specifically, the processing module in the power module protection system based on the temperature collecting plate can also obtain the water temperature TWater (W)I.e. the treatment module is based on a plurality of real-time temperatures (T1-TN) and the water temperature TWater (W)Determining a power limit value PMIN。
As shown in fig. 3 and 4, the mounting structure includes a mounting end surface 12 on the heat sink 10, and a surface of the mounting end surface 12 is opened with a first mounting hole 11 inward. The first mounting hole 11 is opened to facilitate the installation of the temperature collecting plate 20 in the first mounting hole 11.
The number of the mounting structures can be multiple, and different temperature collecting plates 20 can be mounted at different mounting positions of the radiator 10 through different first mounting holes 11 of different mounting end surfaces 12, that is, a plurality of real-time temperatures (T1-TN) can be obtained, and the plurality of real-time temperatures (T1-TN) can reflect real-time temperatures of different positions of the radiator 10. For example, T1-TN indicates N real-time temperatures, and when N real-time temperatures can be obtained, that is, the number of temperature plates provided on the radiator is also N. If N is 10, 10 temperature collecting plates 20 are disposed on the heat sink 10, so as to obtain 10 real-time temperatures through the 10 temperature collecting plates 20, where the 10 real-time temperatures can reflect the heating conditions of 10 installation positions on the heat sink 10.
As shown in fig. 3 to 5, a second mounting hole 21 is formed on the temperature collecting plate 20 and penetrates from one side of the temperature collecting plate 20 to the other side of the temperature collecting plate 20, and the size of the second mounting hole 21 is matched with that of the first mounting hole 11, so that the same heat conducting element 30 can be fixed between the temperature collecting plate 20 and the heat sink 10 through the second mounting hole 21 and the first mounting hole 11 in sequence.
In one embodiment, the thermal plate 20 is a PCB having a multi-layer structure, the multi-layer structure includes a copper heat conducting layer and a topology layer 28, the topology layer 28 is disposed with thermal circuits and auxiliary electronic components, and the copper heat conducting layer is used for transferring heat of the heat conducting component 30 to the topology layer 28 through the heat conducting structure, so as to facilitate temperature collection by the thermal circuits on the topology layer 28. Wherein the copper-clad heat conducting layer is in this embodiment a layer in contact with the heat sink 10, thereby being able to transfer heat from the heat sink 10 to the topology layer 28. A first insulating layer is disposed between the copper heat conducting layer and the topology layer 28 to provide an insulating space between the copper heat conducting layer and the topology layer 28. The temperature collecting circuit on the copper sheet heat-conducting layer and the temperature collecting plate also meets the safety standard insulation requirement, and can be grounded through the copper sheet heat-conducting layer, so that the safe creepage distance is reserved between the temperature collecting circuit on the temperature collecting plate and the copper sheet heat-conducting layer, and the safety standard requirement is met.
In one embodiment, the multi-layer structure further includes a contact layer 24, and the contact layer 24 is used to contact the mounting end surface 12 of the heat sink 10, so that the thermal plate 20 is as flat and close to the heat sink 10 as possible. In the PCB with the multilayer structure, the contact layer 24, the copper heat conduction layer and the topological layer 28 are arranged in sequence from inside to outside.
In one embodiment, the copper thermal conductive layer includes a first copper sheet 25 and a second copper sheet 27, the copper sheets representing structures made of copper. A second insulating layer 26 is provided between the first copper sheet 25 and the second copper sheet 27. The temperature collecting plate 20 is provided with the first copper sheet 25 and the second copper sheet 27, so that better heat conduction efficiency is ensured, and the heat of the heat conduction element 30 is transferred to the temperature collecting plate 20 through the two copper sheets. The second insulating layer 26 can be a plate, the effect of play is that the electrical isolation between contact layer 24 and the topological layer 28 is realized, and second copper sheet 27, the temperature collection circuit on the temperature collection board also satisfies the insulating requirement of ann rule, can pass through second copper sheet 27 ground connection, make and have safe creepage distance between temperature collection circuit on the temperature collection board and the second copper sheet 27, fine having satisfied the insulating requirement of ann rule on the one hand, on the other hand can guarantee that the heat conduction of two copper sheets does not interfere with each other to the heat conduction process of PCB board.
Specifically, the first copper sheet 25 and the second copper sheet 27 transfer heat generated by the heat conducting element 30 to the topology layer 28, so that the temperature of the bonding position of the temperature acquisition chip on the topology layer 28 is acquired by the temperature acquisition chip of the temperature acquisition circuit, that is, the real-time temperature is the temperature of the bonding position of the temperature acquisition chip on the topology layer 28, and can also be understood as the temperature at the bonding pad of the temperature acquisition chip.
Specifically, a third insulating layer (not shown) is disposed between the first copper sheet 25 and the contact layer 24, and a fourth insulating layer (not shown) is disposed between the second copper sheet 27 and the topology layer 28. In the present embodiment, the fourth insulating layer disposed between the second copper sheet 27 and the topology layer 28 further improves the insulating effect between the contact layer 24 and the topology layer 28, and the fourth insulating layer is designed to satisfy the minimum creepage distance between the topology layer 28 and the ground, such as 10mm, so as to satisfy the minimum creepage distance between the NTC (charged electronic component) and the ground specified by the european standard to satisfy the safety requirement of higher specification.
As shown in fig. 3, 4, and 5, the heat sink further includes a heat conducting element 30, and one end of the heat conducting element 30 passes through the second mounting hole 21 from the side of the thermal plate 20 having the topology layer 28 and then is connected to the first mounting hole 11 of the heat sink 10. The heat conducting element 30 can fix the temperature collecting plate 20 and the heat sink 10, and can also conduct heat. That is, the heat generated by the temperature in the first hole of the first mounting hole 11 of the heat sink 10 is transferred to the first copper sheet 25 and the second copper sheet 27 of the temperature collecting plate 20 through the heat conducting element 30, so that the received heat is diffused to the temperature collecting plate 20 through the first copper sheet 25 and the second copper sheet 27, and finally the real-time temperature is obtained by the temperature collecting chip on the topology layer 28. Under the condition that the heat conducting element 30, the second copper sheet 27 and the heat sink 10 are all grounded, and the fourth insulating layer is arranged between the second copper sheet 27 and the topology layer 28, the creepage distances between the temperature collecting circuit on the topology layer 28 and the heat conducting element 30, the second copper sheet 27 and the heat sink 10 are respectively ensured, namely the minimum creepage distance between an NTC (negative temperature coefficient) and the ground specified by the European standard is met, and the safety requirement of higher specification is met.
Wherein, the multilayer structure in the temperature collecting plate 20 is formed with a second mounting hole 21 (each layer structure is penetrated by the second mounting hole 21). Namely, the contact layer 24, the first copper sheet 25, the second insulating layer 26, the second copper sheet 27 and the topology layer 28 are sequentially distributed on the inner wall of the second mounting hole 21 from inside to outside in the axial direction. When the heat conducting element 30 is inserted into the second mounting hole 21, the heat on the heat conducting element 30 is transferred to the temperature collection plate 20 through the first copper sheet 25 and the second copper sheet 27, so that the temperature collection chip on the topology layer 28 can obtain the real-time temperature conveniently. Note that "inner" in the inner-to-outer direction indicates a side of the temperature control plate 20 close to the heat sink 10, and "outer" in the inner-to-outer direction indicates another side of the temperature control plate 20 opposite to the side close to the heat sink 10.
In other embodiments of this embodiment, the heat sink includes, but is not limited to, a cast aluminum heat sink, a thermally conductive silicone grease structure, and a thermally conductive ceramic. A cast aluminum heat sink means a heat sink made of cast aluminum, which has an advantage of less thermal resistance and is very easy to thermally stabilize. The heat conductive silicone grease denotes a structure coated with heat conductive silicone grease on the surface. The thermally conductive ceramic represents a ceramic structure. Therefore, the reliability of real-time temperature obtained by collecting the temperature of a plurality of installation parts of the radiator is higher than the temperature value of flowing water temperature (in the traditional way).
In other embodiments of this embodiment, the first copper sheet 25 and the second copper sheet 27 may be integrally formed to improve the overall strength and avoid the structural damage of the heat conducting layer when the opening operation of the second mounting hole 21 is performed.
In other embodiments of the present embodiment, when the copper heat conduction layer includes the first copper sheet 25 and the second copper sheet 27, the heat conduction element 30 is preferably a copper bolt or a copper screw to ensure that the heat conduction performance between the heat conduction element and the two heat conduction layers is as close as possible to ensure the stability of heat conduction.
In other embodiments of this embodiment, the first insulating layer 26 may be a resin layer, that is, the contact layer 24 and the topology layer 28 are spaced apart by using the insulating property of the resin layer itself, so as to avoid the electrical connection between the topology layer 28 and the power module, PE (ground), and well meet the safety requirements of the power module.
In other embodiments of the present embodiment, the heat conducting element 30 includes a bolt, and the first mounting hole 11 is a threaded hole corresponding to the bolt. The heat conducting element 30 is connected with the internal thread in the first mounting hole 11 through the external surface thread, thereby forming a threaded connection fitting relationship to lock the thermal plate 20 and the heat sink 10.
In other embodiments of the present embodiment, the heat conducting element 30 includes a screw, a connector is disposed in the first mounting hole 11, and a free end of the screw is inserted into the connector (not shown) to lock the thermal plate 20 and the heat sink 10 by a plug-in connection.
In other embodiments of this embodiment, the processing module further comprises a power limit value determining unit, and the power limit value determining unit determines the power limit value according to a plurality of real-time temperatures (T1-TN) and the temperature T of the water cooling plateWater (W)Determining a power limit value PMIN。
In other embodiments of this embodiment, the power module further includes a voltage ring, a current-limiting ring, and a current ring connected in sequence. The output end of the voltage ring outputs voltage to the current-limiting ring, and the input end of the current-limiting ring receives a power-limiting value P output by the processing moduleMINVoltage and external current, the output end of the current limiting ring outputs a reference current IREFTo the current loop so that the current loop is dependent on the reference current IREFAnd outputting corresponding current. The output power of the power semiconductor 40 in the power module is thus controlled to control the output power of the power semiconductor 40 within a safe range, avoiding a continuous rise in temperature again, so as to ensure that the power module is not damaged or endangered even under as severe conditions (high temperature) as possible.
It should be noted that the voltage ring, the current limiting ring, and the current ring are not modified in the embodiments of the present invention, and the voltage ring, the current limiting ring, and the current ring mentioned in the embodiments are all control loop circuit structures commonly used in the art, and therefore, detailed description thereof is omitted here.
Further, still include radiator unit, adopt the warm board to set up on radiator unit, radiator unit includes water-cooling board and/or wind channel. That is, the power module protection system based on the temperature collecting plate of the present invention further includes a water cooling plate with a water inlet and a water outlet, the temperature collecting plate 20 is fixed on the water cooling plate through the heat conducting element 30, and then the heat is transferred to the topology layer 28 on the temperature collecting plate 20 through the water cooling plate and the heat conducting element 30, so as to be collected by the temperature collecting chip on the topology layer 28, and the collected temperature T is measuredWater (W)Transmitted to the processing module through the lead. The final processing module is based on the temperature TWater (W)Outputting the corresponding power limiting value PMINTo the current-limiting ring, the current-limiting ring outputs a reference current IREFTo the current loop so that the current loop is dependent on the reference current IREFAnd outputting corresponding current. The collected temperature of the power module protection system based on the temperature collecting plate can simultaneously comprise the temperature T of the water cooling plateWater (W)And the real-time temperature T1-TN can switch corresponding use modes aiming at different use environments, so that the practicability is improved.
The charging device provided by the second aspect of the invention comprises the power module protection system based on the temperature collecting plate as the first aspect, so that the charging device cannot be damaged or cause danger under severe conditions (high temperature).
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A temperature plate-based power module protection system is applied to a power module with a power semiconductor, and comprises:
the radiator is provided with a mounting structure matched with the temperature collecting plate;
the temperature collecting plate is arranged on the mounting structure, and a temperature collecting circuit for acquiring real-time temperature is arranged on the temperature collecting plate;
the processing module determines a power limit value according to the real-time temperature so that the power module can work according to the power limit value;
the temperature acquisition circuit and the radiator meet the safety insulation requirement.
2. The thermal panel-based power module protection system of claim 1, wherein each of said mounting structures comprises:
the mounting structure comprises a mounting end face, wherein a first mounting hole is formed in the surface of the mounting end face inwards.
3. The thermal plate-based power module protection system of claim 2, wherein the thermal plate is formed with a second mounting hole extending from one side of the thermal plate to the other side of the thermal plate.
4. The thermal plate-based power module protection system of claim 2, wherein the thermal plate is a PCB having a multi-layer structure comprising a copper heat conducting layer and a topology layer provided with a thermal circuit, and a first insulating layer is provided between the copper heat conducting layer and the topology layer.
5. The thermal panel-based power module protection system of claim 3, further comprising:
one end of the heat conducting element penetrates through the second mounting hole from the side, provided with the topological layer, of the temperature collecting plate and then is connected with the first mounting hole of the radiator.
6. The thermal plate-based power module protection system of claim 5, wherein the thermally conductive element comprises a bolt, and the first mounting hole is a threaded hole corresponding to the bolt.
7. The thermal plate-based power module protection system of claim 5, wherein the thermally conductive element comprises a screw, a connector is disposed in the first mounting hole, and a free end of the screw is inserted into the connector.
8. The thermal plate-based power module protection system of claim 4, wherein the copper thermal conductive layer comprises a first copper sheet and a second copper sheet with a second insulating layer disposed therebetween.
9. The thermal plate-based power module protection system of any one of claims 1-8, further comprising a heat dissipation assembly, wherein the thermal plate is disposed on the heat dissipation assembly, and the heat dissipation assembly comprises a water-cooled plate and/or an air duct.
10. A charging device comprising a thermal plate-based power module protection system as claimed in any one of claims 1-9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111008759.0A CN113829914A (en) | 2021-08-30 | 2021-08-30 | Power module protection system based on temperature collecting plate and charging equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111008759.0A CN113829914A (en) | 2021-08-30 | 2021-08-30 | Power module protection system based on temperature collecting plate and charging equipment |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002353385A (en) * | 2001-05-29 | 2002-12-06 | Yaskawa Electric Corp | Servo drive device |
| JP2005278339A (en) * | 2004-03-25 | 2005-10-06 | Denso Corp | Electronic circuit device comprising heat sink |
| US20090024345A1 (en) * | 2005-03-22 | 2009-01-22 | Harald Prautzsch | Device and Method for Determining the Temperature of a Heat Sink |
| CN203194078U (en) * | 2013-04-03 | 2013-09-11 | 联合汽车电子有限公司 | Heat dissipation device |
| CN203454083U (en) * | 2013-08-30 | 2014-02-26 | 宁波新乐生活电器有限公司 | Liquid electrical heating container |
| CN208607653U (en) * | 2018-08-23 | 2019-03-15 | 郑州云海信息技术有限公司 | A kind of temperature acquisition system |
| CN111075747A (en) * | 2019-12-13 | 2020-04-28 | 宁波三星智能电气有限公司 | Fill electric pile fan control circuit |
-
2021
- 2021-08-30 CN CN202111008759.0A patent/CN113829914A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002353385A (en) * | 2001-05-29 | 2002-12-06 | Yaskawa Electric Corp | Servo drive device |
| JP2005278339A (en) * | 2004-03-25 | 2005-10-06 | Denso Corp | Electronic circuit device comprising heat sink |
| US20090024345A1 (en) * | 2005-03-22 | 2009-01-22 | Harald Prautzsch | Device and Method for Determining the Temperature of a Heat Sink |
| CN203194078U (en) * | 2013-04-03 | 2013-09-11 | 联合汽车电子有限公司 | Heat dissipation device |
| CN203454083U (en) * | 2013-08-30 | 2014-02-26 | 宁波新乐生活电器有限公司 | Liquid electrical heating container |
| CN208607653U (en) * | 2018-08-23 | 2019-03-15 | 郑州云海信息技术有限公司 | A kind of temperature acquisition system |
| CN111075747A (en) * | 2019-12-13 | 2020-04-28 | 宁波三星智能电气有限公司 | Fill electric pile fan control circuit |
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