CN113828614B - Dissolving type high-pressure bag disassembling device and disassembling method thereof - Google Patents

Dissolving type high-pressure bag disassembling device and disassembling method thereof Download PDF

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Publication number
CN113828614B
CN113828614B CN202111012592.5A CN202111012592A CN113828614B CN 113828614 B CN113828614 B CN 113828614B CN 202111012592 A CN202111012592 A CN 202111012592A CN 113828614 B CN113828614 B CN 113828614B
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dissolving
voltage
package
sliding
resin
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CN113828614A (en
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岳喜龙
宦新亚
樊飞
樊启鸿
李静
林伟
朱炳龙
周品
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Jiangsu Ningda Environmental Protection Co ltd
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Jiangsu Ningda Environmental Protection Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B09DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09BDISPOSAL OF SOLID WASTE
    • B09B3/00Destroying solid waste or transforming solid waste into something useful or harmless
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/82Recycling of waste of electrical or electronic equipment [WEEE]

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Processing Of Solid Wastes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The invention discloses a dissolving type high-pressure bag disassembling device and a disassembling method thereof. The inside of the disassembling device main body is provided with a wire cutting mechanism, a clamping claw, a cutting mechanism, a digging mechanism, a dissolving device, a drying device and a wire winding mechanism; the dissolving device comprises a dissolving area and a filtering area, a water outlet is formed between the filtering area and the filtering area, a seal is arranged at the upper end of the water outlet, a filter screen is arranged in the filtering area, a resin dissolving agent is filled in the dissolving area, and the dissolving area is provided with an ultrasonic oscillation mechanism.

Description

Dissolving type high-pressure bag disassembling device and disassembling method thereof
Technical Field
The invention relates to the field of waste electric appliance recovery, in particular to a dissolving type high-voltage pack disassembling device and a disassembling method thereof.
Background
The high voltage package is commonly known as a line output transformer, which is the most important component in an electrical appliance using a picture tube as display equipment. The high-voltage pulse generator provides various voltages required by a picture tube and pulse signals required by other circuits, the picture tube television gradually exits the market, the high-voltage packet is used as a part of the high-voltage pulse generator, the current recovery path is not clear, the high-voltage pulse generator is mostly subjected to small workshop type simple incineration recovery processing, the recovery utilization rate is extremely low, and secondary pollution to the environment is easily caused in the recovery process.
Disclosure of Invention
The invention aims to provide a dissolving type high-pressure package disassembling device and a disassembling method thereof aiming at the defects of the prior art.
The technical scheme for solving the problems comprises the following steps: the dissolving type high-pressure package disassembling device comprises a high-pressure package and a disassembling device main body. The high-voltage package comprises a high-voltage package shell and an electronic component, wherein resin is filled between the high-voltage package shell and the electronic component. The electronic component comprises a high-voltage outgoing line, a magnetic core, a low-voltage winding, a high-voltage winding and a diode.
The disassembling device main part includes the roof, sets up the guide rail on the roof, and the slip sets up three sliding mechanism of group on the guide rail, and three sliding mechanism of group are first sliding mechanism, second sliding mechanism, third sliding mechanism respectively, and every group sliding mechanism includes, and the slip sets up the slider on the guide rail, fixed connection is in the telescopic link of slider lower extreme.
The inside thread trimming mechanism that is provided with of detaching device main part gets claw, cutting mechanism, digs and gets mechanism, dissolving device, drying device, winding mechanism.
The end part of the wire cutting mechanism is connected with the first sliding mechanism, and the wire cutting mechanism comprises a wire cutting clamp and a wire stripping clamp. The wire-stripping clamp is used for removing the high-voltage outgoing wire from the high-voltage package, and the wire-stripping clamp is used for stripping the insulating outer skin of the high-voltage outgoing wire.
The cutting mechanism comprises a cutting mechanism base, a cutting machine arranged above the cutting mechanism base and a fixing mechanism used for fixing the high-pressure bag.
The cutting machine comprises a connecting seat, a shell connected with the connecting seat and a saw blade arranged inside the shell.
The fixing mechanism comprises a mounting seat, a first sliding groove (not shown) formed in the front end of the mounting seat, a movable block movably connected inside the first sliding groove, a mounting plate fixedly connected with the movable block, a second sliding groove (not shown) formed in the front end of the mounting plate, a connecting rod movably connected inside the second sliding groove, and a fixing plate fixedly connected with the connecting rod. There are 2 connecting rods.
The cutting mechanism is used for cutting the high-pressure package. The end part of the clamping claw is connected with the second sliding mechanism, and the clamping claw is used for transporting the cut high-pressure ladle shell to the dissolving device.
The dissolving device comprises a dissolving area and a filtering area, a water outlet is formed between the dissolving area and the filtering area, a seal is arranged at the upper end of the water outlet, a filter screen is arranged in the filtering area, a resin dissolving agent is filled in the dissolving area, and an ultrasonic oscillation mechanism is arranged in the dissolving area. The ultrasonic oscillation mechanism enables the resin dissolving agent to be fully contacted with the high-pressure bag after cutting is completed, and the dissolving time is shortened.
The digging mechanism is used for transporting scattered electronic components in the high-voltage package after the resin is dissolved.
The digging mechanism is connected with the third sliding mechanism; the digging mechanism comprises a bucket, a bucket cover matched with the bucket, and a connecting shaft for connecting the bucket, the bucket cover and the third sliding mechanism; and a plurality of water leaching grooves are formed in the bottom of the excavator bucket. The water draining tank is used for draining the resin dissolving agent brought by the bucket when the electronic components are dug.
The drying device is characterized in that a feeding hole is formed in the upper end of the drying device, an inclined downward slope is arranged inside the drying device, a discharging hole is formed in the tail end of the slope, a fan is arranged inside the drying device, and the drying device is used for air-drying electronic components.
The wire winding mechanism comprises a base, a motor is arranged in the base, a wire winding disc is connected to the upper end of the base, and an output shaft of the motor is connected with the wire winding disc. And the winding mechanism is used for recovering copper wires of the winding.
Preferably, a driving motor is arranged in the connecting seat, and an infrared emitter is arranged at the front end of the shell.
Preferably, a signal receiver is arranged at a position, to the right, in the middle of the mounting plate.
Preferably, the fan is arranged on the side of the drying device opposite to the discharge opening.
Preferably, the resin dissolving agent comprises 1 to 20 parts of diethylenetriamine, 5 to 20 parts of toluene, 20 to 40 parts of dichloromethane, 20 to 60 parts of ethylene glycol monomethyl ether and 0.5 to 1.5 parts of sodium oxide.
The dissolving type high-pressure package disassembling method comprises the following steps:
step 1: the high-voltage outgoing line is cut off from the high-voltage package by the wire cutting clamp, the insulating sheath of the high-voltage lead is peeled by the wire stripping clamp, and the metal IV in the high-voltage lead is recycled by a worker.
And 2, step: inside putting into fixed establishment with the high-pressure package, the infrared emitter on the cutting machine shell, transmission infrared signal, signal receiver received signal on the mounting panel moves in the second spout, and the infrared emitter that makes and transmission infrared signal are on same water flat line, because signal receiver is located the position of leaning to the right in the middle of the mounting panel, when the cutting machine cuts the high-pressure package, can cut into 2 big one little parts with the high-pressure package, furthest guarantees electronic components's integrality.
And step 3: press from both sides the high-pressure package that the claw will cut the completion and transport to dissolving device, high-pressure package cuts the back, and the cutting plane can expose and encapsulate inside resin and the electronic components of high-pressure package, and resin solution in the dissolving device dissolves the resin in to high-pressure package, and ultrasonic oscillation mechanism makes resin dissolving agent fully contact with the high-pressure package that the cutting was accomplished, shortens the dissolving time.
And 4, step 4: after the dissolution is finished, the digging mechanism transports the electronic components scattered in the resin dissolving agent to the drying device.
And 5: after dissolving many times, open the head in the dissolving device, filter the resin dissolving agent, but the resin dissolving agent reutilization that filters the completion.
Step 6: the fan air-dries electronic components, and because of the effect on slope, electronic components after air-drying can gather in the discharge opening, and the staff goes out at the discharge opening and classifies the recovery to electronic components.
And 7: winding the winding to a low-voltage winding, a high-voltage winding wire spool and a motor to move, driving the wire spool to move and recycling the copper wire.
The invention has the following beneficial effects:
the invention provides a dissolving type high-pressure bag disassembling device and a disassembling method thereof.
Drawings
FIG. 1 is a schematic view of the present invention;
FIG. 2 is an enlarged view of part A of FIG. 1;
FIG. 3 is a schematic view of a cutting mechanism;
FIG. 4 is a schematic view of a securing mechanism;
FIG. 5 is an enlarged view of part B of FIG. 1;
FIG. 6 is a bottom schematic view of the bucket;
in the figure: 1-disassembling a device body, 2-a top plate, 3-a guide rail, 4-a sliding block, 5-a telescopic rod, 6-a wire shearing mechanism, 61-a wire shearing clamp, 62-a wire stripping clamp, 7-a clamping claw, 8-a cutting mechanism, 81-a cutting mechanism base, 82-a shell, 83-a saw blade, 84-a connecting seat, 85-a driving motor, 86-a mounting seat, 87-a sliding block, 88-a mounting plate, 89-a connecting rod, 810-a fixing plate, 811-a signal receiver, 812-an infrared emitter, 9-a digging mechanism, 91-a connecting shaft, 92-a digging bucket, 93-a bucket cover, 94-a water draining tank, 10-a dissolving device, 101-a dissolving region, 102-a filtering region, 103-an ultrasonic oscillation mechanism, 104-a water outlet, 105-a seal, 106-a filtering screen, 11-a drying device, 111-a fan, 112-a slope, 113-a discharging opening, 12-a wire winding mechanism, 121-a base, 122-a motor and 123-a wire winding disc.
Detailed Description
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
As shown in fig. 1-6, a dissolving type high-pressure bag disassembling device and a disassembling method thereof, the dissolving type high-pressure bag disassembling device comprises a high-pressure bag and a disassembling device main body 1.
The high-voltage package comprises a high-voltage package shell and an electronic component, wherein resin is filled between the high-voltage package shell and the electronic component. The electronic component comprises a high-voltage outgoing line, a magnetic core, a low-voltage winding, a high-voltage winding and a diode.
As shown in fig. 1, the disassembling device main body 1 includes a top plate 2, a guide rail 3 disposed on the top plate 2, and three sets of sliding mechanisms slidably disposed on the guide rail 3, where the three sets of sliding mechanisms are respectively a first sliding mechanism, a second sliding mechanism, and a third sliding mechanism, and each set of sliding mechanism includes a sliding block 4 slidably disposed on the guide rail 3, and an expansion link 5 fixedly connected to a lower end of the sliding block 4.
The inside of the disassembling device main body 1 is provided with a thread cutting mechanism 6, a clamping claw 7, a cutting mechanism 8, a digging mechanism 9, a dissolving device 10, a drying device 11 and a winding mechanism 12.
As shown in fig. 2, the end of the thread trimming mechanism 6 is connected to the first sliding mechanism, and the thread trimming mechanism 6 includes a thread trimming clamp 61 and a thread stripping clamp 62. The wire cutting clamp 61 is used for removing the high-voltage lead wires from the high-voltage package, and the wire stripping clamp 62 is used for stripping the insulating outer skins of the high-voltage lead wires.
As shown in fig. 3 to 4, the cutting mechanism 8 includes a cutting mechanism base 81, a cutting machine disposed above the cutting mechanism base 81, and a fixing mechanism for fixing the high-pressure bag.
The cutting machine includes a coupling base 84, a housing 82 coupled to the coupling base 84, and a saw blade 83 disposed inside the housing 82.
The connecting base 84 is internally provided with a driving motor 85, and the front end of the shell 82 is provided with an infrared emitter 812.
The fixing mechanism comprises a mounting seat 86, a first sliding groove (not shown) arranged at the front end of the mounting seat 86, a connecting block 87 movably connected inside the first sliding groove, a mounting plate 88 fixedly connected with the connecting block 87, a second sliding groove (not shown) arranged at the front end of the mounting plate 88, a connecting rod 89 movably connected inside the second sliding groove, and a fixing plate 810 fixedly connected with the connecting rod 89. There are 2 of the connecting rods 89.
A signal receiver 811 is arranged at a position slightly to the right in the middle of the mounting plate 88. The cutting mechanism 8 is used for cutting the high-pressure packets. Infrared emitter 812 on the shell 82 transmits infrared signal, signal receiver 811 on the mounting panel 88 receives signal, moves in the second spout for infrared emitter 812 and transmission infrared signal are on same water flat line, because signal receiver 811 is located the position of the middle oblique right of mounting panel 88, when the cutting machine cuts high-pressure package, can cut into 2 parts big one little, furthest guarantees electronic components's integrality.
The end of the gripping claw 7 is connected with a second sliding mechanism, and the gripping claw 7 is used for transporting the cut high-pressure bag shell 82 to the dissolving device 10.
As shown in fig. 1, the dissolving device 10 includes a dissolving region 101 and a filtering region 102, a water outlet 104 is disposed between the dissolving region 101 and the filtering region 102, a seal 105 is disposed at an upper end of the water outlet 104, a filter screen 106 is disposed inside the filtering region 102, a resin dissolving agent is filled inside the dissolving region 101, and the dissolving region 101 is provided with an ultrasonic oscillation mechanism 103. The ultrasonic oscillation mechanism 103 enables the resin dissolving agent to be in full contact with the cut high-pressure bag, and the dissolving time is shortened.
The resin solvent comprises 1 to 20 parts of diethylenetriamine, 5 to 20 parts of toluene, 20 to 40 parts of dichloromethane, 20 to 60 parts of ethylene glycol monomethyl ether and 0.5 to 1.5 parts of sodium oxide.
The digging mechanism 9 is used for transporting scattered electronic components in the high-voltage package after the resin is dissolved.
As shown in fig. 5-6, the scooping mechanism 9 is connected to a third sliding mechanism; the excavating mechanism 9 comprises an excavator bucket 92, a bucket cover 93 matched with the excavator bucket 92, and a connecting shaft 91 connecting the excavator bucket 92, the bucket cover 93 and the third sliding mechanism; the bottom of the bucket 92 is provided with a plurality of water leaching grooves 94. The water drain tank 94 drains the resin dissolving agent brought by the bucket 92 when the electronic component is dug.
As shown in fig. 1, a feed inlet is arranged at the upper end of the drying device 11, an inclined downward slope 112 is arranged inside the drying device 11, a discharge opening 113 is formed at the tail end of the slope 112, and a fan 111 is arranged inside the drying device 11, wherein the fan 111 is arranged on one side of the drying device 11 opposite to the discharge opening 113. The drying device 11 is used for air-drying the electronic components.
The wire winding mechanism 12 comprises a base 121, a motor 122 is arranged in the base 121, a wire winding disc 123 is connected to the upper end of the base 121, and an output shaft of the motor 122 is connected with the wire winding disc 123. The winding mechanism 12 is used for recovering copper wires of the winding.
The dissolving type high-pressure package disassembling method comprises the following steps:
step 1: the high-voltage lead wire is cut off from the high-voltage package by the wire cutting clamp 61, the insulating sheath of the high-voltage lead wire is stripped by the wire cutting clamp 62, and metal IV in the high-voltage lead wire is recycled by workers.
Step 2: inside putting into fixed establishment with high-pressure package, infrared emitter 812 on the cutting machine shell 82 transmits infrared signal, and signal receiver 811 on the mounting panel 88 receives the signal, moves in the second spout, and infrared emitter 812 and the transmission infrared signal that make are on same water flat line, because signal receiver 811 is located the position of leaning to the right in the middle of mounting panel 88, when the cutting machine cuts high-pressure package, can cut into 2 parts big one little, furthest guarantees electronic components's integrality.
And 3, step 3: press from both sides and get claw 7 and transport the high-pressure package that the cutting was accomplished to dissolving device 10, and the high-pressure package cuts the back, and the cutting plane can expose resin and electronic components inside the encapsulation high-pressure package, and the resin solution in dissolving device 10 dissolves the resin in the high-pressure package, and ultrasonic oscillation mechanism 103 makes resin dissolving agent fully contact with the high-pressure package that the cutting was accomplished, shortens the dissolution time.
And 4, step 4: after the dissolution is completed, the digging mechanism 9 transports the electronic components scattered in the resin dissolving agent to the drying device 11.
And 5: after the resin is dissolved for many times, the end socket in the dissolving device 10 is opened, the resin dissolving agent is filtered, and the filtered resin dissolving agent can be reused.
Step 6: fan 111 air-dries electronic components, because of the effect of slope 112, electronic components after the air-drying can gather in discharge opening 113, and the staff goes out at discharge opening 113 and classifies the recovery to electronic components.
And 7: the winding is wound to the low-voltage winding, the high-voltage winding wire spool 123 and the motor 122 move to drive the wire spool 123 to move, and the copper wire is recovered.
The above description is only a preferred embodiment of the present invention, and not intended to limit the present invention in other forms, and any person skilled in the art may apply the above modifications or changes to the equivalent embodiments with equivalent changes, without departing from the technical spirit of the present invention, and any simple modification, equivalent change and change made to the above embodiments according to the technical spirit of the present invention still belong to the protection scope of the technical spirit of the present invention.

Claims (9)

1. Dissolve formula high-pressure package detaching device, its characterized in that: the dissolving type high-pressure package disassembling device comprises a high-pressure package and a disassembling device main body (1); the inside of the disassembling device main body (1) is provided with a wire shearing mechanism (6), a clamping claw (7), a cutting mechanism (8), a digging mechanism (9), a dissolving device (10), a drying device (11) and a wire winding mechanism (12);
the excavating mechanism (9) comprises an excavating bucket (92), a bucket cover (93) matched with the excavating bucket (92), and a connecting shaft (91) for connecting the excavating bucket (92), the bucket cover (93) and the third sliding mechanism; a plurality of water leaching tanks (94) are arranged at the bottom of the bucket (92);
the dissolving device (10) comprises a dissolving area (101) and a filtering area (102), a water outlet (104) is formed between the dissolving area (101) and the filtering area (102), a seal (105) is arranged at the upper end of the water outlet (104), a filter screen (106) is arranged in the filtering area (102), a resin dissolving agent is filled in the dissolving area (101), and an ultrasonic oscillation mechanism (103) is arranged in the dissolving area (101);
the disassembling device main body (1) comprises a top plate (2), a guide rail (3) arranged on the top plate (2), and three groups of sliding mechanisms arranged on the guide rail (3) in a sliding manner, wherein the three groups of sliding mechanisms are respectively a first sliding mechanism, a second sliding mechanism and a third sliding mechanism, each group of sliding mechanisms comprises a sliding block (4) arranged on the guide rail (3) in a sliding manner, and a telescopic rod (5) fixedly connected to the lower end of the sliding block (4); the end part of the wire shearing mechanism (6) is connected with the first sliding mechanism, and the wire shearing mechanism (6) comprises a wire shearing clamp (61) and a wire stripping clamp (62); the end part of the clamping claw (7) is connected with a second sliding mechanism; the digging mechanism (9) is connected with the third sliding mechanism.
2. The dissolved high pressure package disassembling apparatus of claim 1, wherein: the high-voltage package comprises a high-voltage package shell and an electronic component, wherein resin is filled between the high-voltage package shell and the electronic component; the electronic component comprises a high-voltage outgoing line, a magnetic core, a low-voltage winding, a high-voltage winding and a diode.
3. The dissolved high pressure package disassembling apparatus of claim 1, wherein: the cutting mechanism (8) comprises a cutting mechanism base (81), a cutting machine arranged above the cutting mechanism base (81) and a fixing mechanism used for fixing the high-pressure bag; the cutting machine comprises a connecting seat (84), a shell (82) connected with the connecting seat (84), and a saw blade (83) arranged inside the shell (82); a driving motor (85) is arranged in the connecting seat (84).
4. The dissolved high pressure package disassembling apparatus of claim 3, wherein: the fixing mechanism comprises a mounting seat (86), a first sliding groove arranged at the front end of the mounting seat (86), a connecting block (87) movably connected inside the first sliding groove, a mounting plate (88) fixedly connected with the connecting block (87), a second sliding groove arranged at the front end of the mounting plate (88), a connecting rod (89) movably connected inside the second sliding groove, and a fixing plate (810) fixedly connected with the connecting rod (89); the number of the connecting rods (89) is 2.
5. The dissolved high pressure package disassembling apparatus of claim 4, wherein: an infrared emitter (812) is arranged at the front end of the shell (82); and a signal receiver (811) is arranged at the position of the middle of the mounting plate (88) which is slightly to the right.
6. The dissolved high-pressure packet disassembling apparatus according to claim 1, wherein: the resin solvent comprises 1 to 20 portions of diethylenetriamine, 5 to 20 portions of toluene, 20 to 40 portions of methylene dichloride, 20 to 60 portions of ethylene glycol monomethyl ether and 0.5 to 1.5 portions of sodium oxide.
7. The dissolved high pressure package disassembling apparatus of claim 1, wherein: the drying device is characterized in that a feeding hole is formed in the upper end of the drying device (11), an inclined downward slope (112) is arranged inside the drying device (11), a discharging hole (113) is formed in the tail end of the slope (112), a fan (111) is arranged inside the drying device (11), and the fan (111) is arranged on one side, opposite to the discharging hole (113), of the drying device (11).
8. The dissolved high pressure package disassembling apparatus of claim 1, wherein: the winding mechanism (12) comprises a base (121), a motor (122) is arranged in the base (121), a winding disc (123) is connected to the upper end of the base (121), and an output shaft of the motor (122) is connected with the winding disc (123).
9. The dissolution type high-pressure package disassembling apparatus according to any one of claims 1 to 8, comprising the steps of: the high-voltage outgoing line is cut off from the high-voltage package by the wire cutting clamp (61), the insulating sheath of the high-voltage outgoing line is stripped by the wire stripping clamp (62), and a worker recovers the metal wire inside the high-voltage outgoing line;
and 2, step: the high-voltage package is placed in the fixing mechanism, the infrared transmitter (812) on the shell (82) of the cutting machine transmits infrared signals, the signal receiver (811) on the mounting plate (88) receives the signals and moves in the second sliding groove, so that the infrared transmitter (812) and the transmitted infrared signals are on the same horizontal line, and the signal receiver (811) is located at the position, which is far to the right, in the middle of the mounting plate (88), when the cutting machine cuts the high-voltage package, the high-voltage package can be cut into 2 parts, so that the integrity of electronic components is guaranteed to the maximum extent;
and 3, step 3: the clamping claw (7) transports the cut high-voltage package to a dissolving device (10), after the high-voltage package is cut, resin and electronic components inside the packaged high-voltage package are exposed from a cutting surface, resin dissolving liquid in the dissolving device (10) dissolves the resin in the high-voltage package, and an ultrasonic oscillation mechanism (103) enables the resin dissolving agent to be in full contact with the cut high-voltage package, so that the dissolving time is shortened;
and 4, step 4: after the dissolution is finished, the digging mechanism (9) transports the electronic components scattered in the resin dissolving agent to a drying device (11);
and 5: after the resin is dissolved for a plurality of times, opening an end enclosure in the dissolving device (10), and filtering the resin dissolving agent, wherein the filtered resin dissolving agent can be reused;
step 6: the fan (111) air-dries the electronic components, the air-dried electronic components can be accumulated at the discharge opening (113) under the action of the slope (112), and workers sort and recycle the electronic components at the discharge opening (113);
and 7: the winding is wound to the low-voltage winding, the high-voltage winding wire spool (123) and the motor (122) move to drive the wire spool (123) to move, and copper wires are recovered.
CN202111012592.5A 2021-08-31 2021-08-31 Dissolving type high-pressure bag disassembling device and disassembling method thereof Active CN113828614B (en)

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CN202398602U (en) * 2011-11-22 2012-08-29 上海申嘉三和环保科技开发有限公司 Movable CRT (Cathode Ray Tube) display disassembly line
CN213857642U (en) * 2020-09-23 2021-08-03 广东邦普循环科技有限公司 Automatic disassembling equipment for charging pile

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CN204018356U (en) * 2014-05-14 2014-12-17 天津激扬商贸有限公司 Refrigeration compressor disassemble machine
CN204365700U (en) * 2014-12-23 2015-06-03 格林美(武汉)城市矿产循环产业园开发有限公司 A kind of disassembling apparatus
CN207170485U (en) * 2017-05-02 2018-04-03 信丰明新电子科技有限公司 A kind of waste printed circuit board is disassembled, reclaimed, resource comprehensive processing line
CN109904544A (en) * 2017-12-08 2019-06-18 天津猛狮新能源再生科技有限公司 A kind of automation step dismantling of lithium battery and recyclable device
CN109550772A (en) * 2018-12-25 2019-04-02 萧桂颖 A kind of discarded integrated circuit board integration reclaimer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06127348A (en) * 1992-04-11 1994-05-10 Metallges Ag Method and device for disassembling used vehicle
CN202398602U (en) * 2011-11-22 2012-08-29 上海申嘉三和环保科技开发有限公司 Movable CRT (Cathode Ray Tube) display disassembly line
CN213857642U (en) * 2020-09-23 2021-08-03 广东邦普循环科技有限公司 Automatic disassembling equipment for charging pile

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