CN113814237B - High-efficiency cleaning machine for diode production and operation method thereof - Google Patents
High-efficiency cleaning machine for diode production and operation method thereof Download PDFInfo
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- CN113814237B CN113814237B CN202110954180.7A CN202110954180A CN113814237B CN 113814237 B CN113814237 B CN 113814237B CN 202110954180 A CN202110954180 A CN 202110954180A CN 113814237 B CN113814237 B CN 113814237B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
- B08B7/026—Using sound waves
- B08B7/028—Using ultrasounds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Abstract
The invention discloses a cleaning machine for producing a high-efficiency diode and an operation method thereof.A through pipe sprays argon gas into an inner cavity of a cleaning vertical cylinder, so that the diode in a cleaning mechanism is filled with the argon gas, the diode cannot generate chemical reaction with external gas in the cleaning process by filling the argon gas, the surface of the diode is resonated by generating ultrasonic waves by penetrating through an inner ring, an inner serial ring is a component made of synthetic rubber, the vibration frequency between the penetrating inner ring and the inner ring can be enhanced, the vibration speed of different frequencies can be achieved between the penetrating inner ring and the inner ring, so that the diode is cleaned efficiently, impurities and burrs of the vibrated diode can vertically fall into an inner cavity of an assembly cross bar, and then the impurities and the burrs are collected by an auxiliary cavity, so that a device returns to a quasi-working state, and the diode is taken out to finish cleaning.
Description
Technical Field
The invention relates to the technical field of diode production, in particular to a high-efficiency cleaning machine for diode production and an operation method thereof.
Background
A diode is an electronic device made of semiconductor material (silicon, selenium, germanium, etc.). It has one-way conducting performance, that is, when positive voltage is applied to the anode and cathode of the diode, the diode is conducted. When a reverse voltage is applied to the anode and the cathode, the diode is turned off.
Patent No. CN202010795296.6 discloses an ultrasonic cleaning process of an axial diode, comprising the steps of soaking, namely, firstly, putting the axial diode to be cleaned into deionized water, heating to 40-50 ℃ until the temperature is increased, and keeping the time for 10-20min to obtain the axial diode in which scaling powder components are primarily dissolved; and step two, performing primary ultrasonic cleaning, namely putting the obtained axial diode with the soldering flux components dissolved preliminarily into an ultrasonic cleaning tank, wherein a primary cleaning solution filled in the ultrasonic cleaning tank is deionized water, the water temperature is increased to 45-50 ℃, the power is controlled within the range of 1500-1800w, the frequency is controlled within the range of 20-30KHZ, the water flow speed is controlled within the range of 15-17L/min, the resistance is greater than 12 omega m, the ultrasonic cleaning time is 80-100s, and then performing high-pressure cleaning to obtain the axial diode with the stubborn soldering flux removed. The problem that the diode can not be completely cleaned in the cleaning process is solved, but the problem that the diode can not be subjected to chemical reaction with air in the cleaning process and the vibration frequency of ultrasonic cleaning can not be solved.
Therefore, a cleaning machine for producing high-efficiency diodes and an operation method thereof are provided to solve the problems.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a cleaning machine for producing high-efficiency diodes and an operation method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme: a cleaning machine for producing high-efficiency diodes comprises a mounting mechanism and a cleaning mechanism, wherein the mounting mechanism comprises a mounting box, a mounting cavity, adjusting rods, pressing slats, auxiliary boxes, auxiliary cavities and a material passing channel, the mounting cavity is formed in two sides of the side end of the mounting box, the adjusting rods are formed in two sides of the inner cavity of the mounting cavity, the pressing slats are mounted between the adjusting rods, the auxiliary boxes are mounted at the side end of the mounting box, the auxiliary cavities are formed in the inner cavity of the auxiliary boxes, the material passing channel is mounted at the side end of the auxiliary cavities, the cleaning mechanism is mounted at the side end of the mounting box and comprises an assembling mechanism and a mounting connecting rod, and the assembling mechanisms are connected through the mounting connecting rod;
the assembling mechanism comprises a mounting substrate, a material passing cavity, a linkage box, a cleaning mechanism, mounting blocks, a movable transverse shaft and a processing mechanism, wherein the material passing cavity is formed in the upper end face of the mounting substrate, the linkage box is mounted at the upper end of the mounting substrate, the cleaning mechanism is arranged at each of two ends of the linkage box, the mounting blocks are arranged on the inner cavity walls at each of two ends of the mounting substrate, the movable transverse shaft is mounted between the mounting blocks, and the processing mechanism is mounted on the side end wall of the movable transverse shaft;
the processing mechanism comprises a processing movable box, a groove, a bottom opening cavity, a through pipe and a contact frame, wherein the groove is formed in the upper end of the processing movable box, the bottom opening cavity is formed in the bottom end of the processing movable box, the through pipe is arranged on one side of the inner cavity of the bottom opening cavity, and the contact frame is arranged on the outer ring of the bottom end of the bottom opening cavity;
the cleaning mechanism comprises an assembling transverse bar, cleaning vertical cylinders, supporting side plates and a top supporting plate, the cleaning vertical cylinders are arranged at the upper end of the assembling transverse bar in a penetrating manner, and two sides of the upper end of the assembling transverse bar are connected with the top supporting plate through the supporting side plates;
wash the vertical cylinder and include barrel, interior serial ring and run through the inner ring, the inner chamber of barrel is arranged and has been seted up interior serial ring, through running through inner ring through connection between the interior serial ring.
Preferably, the opening width of the groove is consistent with that of the pressing strip plate.
Preferably, the lower end surface of the mounting substrate penetrates through the top end of the material passage.
Preferably, the opening width of the contact frame is larger than the opening width of the two groups of top supporting plates.
Preferably, an included angle of 60 degrees exists between the inner end of the processing movable box and the mounting substrate, the upper ends of the processing movable boxes are in a contact state, and two ends of the linkage box are not in contact with the inner end of the processing movable box.
The invention provides another technical scheme that: the operation method of the cleaning machine for producing the high-efficiency diode comprises the following steps:
s1: the working personnel hold the right end of the pressing batten to enable the pressing batten to rotate anticlockwise by taking the adjusting rod as a fulcrum, the assembling mechanism can be adjusted at the moment, the machining mechanism is pulled to rotate by taking the movable transverse shaft as the fulcrum, the whole machining movable box and the mounting substrate are kept in a parallel state, and the diode to be cleaned is placed into the cleaning vertical cylinder;
s2: the processing mechanism returns to a quasi-working state, the contact frame wraps the cleaning mechanism, the pressing batten is pressed to press the groove, the contact frame can completely wrap the cleaning mechanism, the external ventilation mechanism is connected with the through pipe, the through pipe sprays argon gas to the inner cavity of the cleaning vertical cylinder, the diode in the cleaning mechanism is filled with the argon gas, and the diode cannot chemically react with external gas in the cleaning process due to the filling of the argon gas;
s3: the inner ring penetrates through the diode and is connected with an external sound wave mechanism, ultrasonic waves are generated by the inner ring penetrating through the diode to resonate the surface of the diode, the inner serial ring is a component made of synthetic rubber, the vibration frequency between the inner ring penetrating through the diode can be enhanced, the vibration speed of different frequencies can be achieved between the inner ring penetrating through the diode and the inner serial ring, and therefore the diode can be efficiently cleaned;
s4: the impurity and the overlap of the diode after the vibration can fall into the inner chamber of equipment horizontal bar perpendicularly, collect impurity and overlap through supplementary chamber afterwards, make the device return to the state of above-mentioned S, take out the diode, accomplish and wash.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the high-efficiency cleaning machine for producing the diodes, provided by the invention, a worker holds the right end of the pressing batten and enables the pressing batten to rotate anticlockwise by taking the adjusting rod as a fulcrum, the assembling mechanism can be adjusted at the moment, the machining mechanism is pulled to rotate by taking the movable transverse shaft as the fulcrum, the whole machining movable box is kept in a parallel state with the mounting substrate, the diodes to be cleaned are placed into the cleaning vertical cylinder, the machining mechanism returns to a quasi-working state, the contact frame wraps the cleaning mechanism, the pressing batten is pressed to press the groove, the contact frame can completely wrap the cleaning mechanism, the external ventilation mechanism is connected with the through pipe, the through pipe sprays argon gas into the inner cavity of the cleaning vertical cylinder, the diodes in the cleaning mechanism are filled with the argon gas, and the diodes cannot be subjected to chemical reaction with external gas in the cleaning process due to the filling of the argon gas.
2. The invention provides a high-efficiency cleaning machine for diode production, which is characterized in that a penetrating inner ring is connected with an external sound wave mechanism, ultrasonic waves are generated by the penetrating inner ring to resonate the surface of a diode, an inner series ring is a component made of synthetic rubber, the vibration frequency between the penetrating inner ring and the penetrating inner ring can be enhanced, the vibration speed of different frequencies between the penetrating inner ring and the penetrating inner ring can be achieved, the diode is cleaned efficiently, impurities and flash of the vibrated diode can vertically fall into an inner cavity of an assembly cross bar, then the impurities and flash are collected through an auxiliary cavity, the device returns to a quasi-working state, the diode is taken out, and cleaning is completed.
Drawings
FIG. 1 is an overall structural view of a cleaning machine for producing high-efficiency diodes according to the present invention;
FIG. 2 is a schematic structural view of the mounting mechanism;
FIG. 3 is a schematic view of the cleaning mechanism;
FIG. 4 is a schematic view of an assembly mechanism;
FIG. 5 is a schematic view of a processing mechanism;
FIG. 6 is a schematic view of the cleaning mechanism;
FIG. 7 is a schematic view of the cleaning column structure.
In the figure: 1. an installation mechanism; 11. mounting a box; 12. a mounting cavity; 13. an adjusting lever; 14. pressing the ribbon board; 15. an auxiliary box; 16. an auxiliary chamber; 17. a material passage; 2. a cleaning mechanism; 21. an assembly mechanism; 211. a mounting substrate; 212. a material passing cavity; 213. a linkage box; 214. a cleaning mechanism; 2141. assembling the transverse strips; 2142. cleaning the vertical cylinder; 21421. a cylinder body; 21422. an inner series ring; 21423. penetrating through the inner ring; 2143. supporting the side plate; 2144. a top support plate; 215. mounting blocks; 216. a movable cross shaft; 217. a processing mechanism; 2171. processing the movable box; 2172. a groove; 2173. the bottom is provided with a cavity; 2174. a penetration tube; 2175. a contact frame; 22. and installing a connecting rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example 1
Referring to fig. 1-7, a high efficiency cleaning machine for diode production comprises a mounting mechanism 1 and a cleaning mechanism 2, the mounting mechanism 1 comprises a mounting box 11, a mounting cavity 12, an adjusting rod 13, a pressing slat 14, an auxiliary box 15, an auxiliary cavity 16 and a material passage 17, the mounting cavity 12 is formed on both sides of the side end of the mounting box 11, the adjusting rod 13 is formed on both sides of the inner cavity of the mounting box 12, the pressing slat 14 is mounted between the adjusting rods 13, the auxiliary box 15 is mounted on the side end of the mounting box 11, the auxiliary cavity 16 is formed in the inner cavity of the auxiliary box 15, the material passage 17 is mounted in the auxiliary cavity 16, the cleaning mechanism 2 is mounted on the side end of the mounting box 11, the cleaning mechanism 2 comprises an assembling mechanism 21 and a mounting connecting rod 22, the assembling mechanism 21 is connected by the mounting connecting rod 22, the assembling mechanism 21 comprises a mounting base plate 211, a material passage cavity 212, a linkage box 213, a cleaning mechanism 214, a mounting block 215, a movable transverse shaft 216 and a processing mechanism 217, the upper end of the mounting box 2172 is formed on the upper end of the mounting base plate 2172, the mounting box 2172, the bottom 2173 is formed on the bottom end of the bottom 2173, the movable frame 2173, the bottom end 2173 and the bottom end 2173 are formed on the bottom end 2173, the bottom end 2173 and the bottom end of the movable frame 2173, the bottom end 2173 are formed on the bottom end 2173, the cleaning vertical tubes 2142 are arranged at the upper ends of the assembly horizontal bars 2141 in a penetrating manner, both sides of the upper ends of the assembly horizontal bars 2141 are connected with the top supporting plate 2144 through supporting side plates 2143, a worker holds the right end of the pressing strip plate 14 to rotate counterclockwise with the adjusting rod 13 as a fulcrum, the assembly mechanism 21 can be adjusted at this time, the machining mechanism 217 is pulled to rotate with the movable horizontal shaft 216 as a fulcrum, the whole machining movable box 2171 and the mounting substrate 211 are kept in a parallel state, and the diodes to be cleaned are placed into the cleaning vertical tubes 2142.
Example 2
Referring to fig. 4, 5 and 6, in the high-efficiency diode production cleaning machine, the processing mechanism 217 returns to a quasi-working state, the contact frame 2175 wraps the cleaning mechanism 214, the pressing strip plate 14 is pressed to press the groove 2172, the contact frame 2175 can completely wrap the cleaning mechanism 214, the external ventilation mechanism is connected with the through pipe 2174, the through pipe 2174 sprays argon gas into the inner cavity of the cleaning vertical barrel 2142, the diode in the cleaning mechanism 214 receives argon gas filling, and the diode cannot generate chemical reaction with external gas in the cleaning process due to the filling of the argon gas.
Example 3
Referring to fig. 1 and 7, a cleaning machine for high efficiency diode production, wherein a cleaning shaft 2142 includes a cylinder 21421, inner serial rings 21422 and a through inner ring 21423, the inner cavity of the cylinder 21421 is arranged with the inner serial rings 21422, the inner serial rings 21422 are connected through the through inner ring 21423, a groove 2172 is formed with a width identical to that of the pressing strip 14, the lower end surface of the mounting base plate 211 is penetrated through the top end of the material passage 17, the contact frame 2175 is formed with a width larger than that of the two sets of top support plates 2144, the inner end of the processing movable box 2171 is formed with an angle of 60 degrees to the mounting base plate 211, the upper end of the processing movable box 2171 is in a contact state, both ends of the link box 213 are not in contact with the inner end of the processing movable box 2171, the through inner ring 21423 is connected with an external acoustic wave mechanism, the diode surface is resonated by generating an ultrasonic wave through the through inner ring 21423, the inner serial rings 21422 is a ring made of a synthetic rubber material, which can reinforce the frequency between the inner ring 21423, the through which can reach different frequencies, the frequency, the diode can be cleaned, the diode can be collected by a high efficiency vibration, and the diode can be taken out, and the diode can be collected by a horizontal vibration, and the diode can be collected by a device, and a diode flying bar collecting device can be taken out.
In order to better demonstrate an operation method of a cleaning machine for producing high-efficiency diodes, the embodiment now proposes an operation method of a cleaning machine for producing high-efficiency diodes, which includes the following steps:
s1: the worker holds the right end of the pressing slat 14 and rotates it counterclockwise about the adjusting lever 13 as a fulcrum, at this time, the assembling mechanism 21 can adjust, pulls the processing mechanism 217 to rotate about the movable horizontal shaft 216 as a fulcrum, so that the whole processing movable box 2171 and the mounting substrate 211 are kept in a parallel state, and the diode to be cleaned is placed in the cleaning column 2142;
s2: the machining mechanism 217 returns to a quasi-working state, the contact frame 2175 wraps the cleaning mechanism 214, the pressing strip plate 14 is pressed to press the groove 2172, the contact frame 2175 can completely wrap the cleaning mechanism 214, the external ventilation mechanism is connected with the through pipe 2174, the through pipe 2174 sprays argon gas into the inner cavity of the cleaning vertical barrel 2142, the diode in the cleaning mechanism 214 is filled with the argon gas, and the diode cannot generate chemical reaction with external gas in the cleaning process due to the filling of the argon gas;
s3: the inner ring 21423 penetrates through the outer ring and is connected with an external sound wave mechanism, ultrasonic waves are generated by the inner ring 21423 penetrating through the outer ring to resonate the surface of the diode, the inner series ring 21422 is a component made of synthetic rubber, the vibration frequency between the inner ring 21423 and the inner series ring can be enhanced, the vibration speed of different frequencies can be achieved between the inner ring 21423 and the outer series ring, and therefore the diode can be cleaned efficiently;
s4: impurities and burrs of the vibrated diode vertically fall into the inner cavity of the assembling cross bar 2141, and then the impurities and the burrs are collected through the auxiliary cavity 16, so that the device returns to the state of S1, the diode is taken out, and cleaning is completed.
The working principle is as follows: the worker holds the right end of the pressing slat 14 to rotate counterclockwise with the adjusting rod 13 as a fulcrum, the assembling mechanism 21 can be adjusted, the machining mechanism 217 is pulled to rotate with the movable transverse shaft 216 as a fulcrum, the whole machining movable box 2171 and the mounting substrate 211 are kept in a parallel state, a diode to be cleaned is placed into the cleaning vertical tube 2142, the machining mechanism 217 returns to a quasi-working state, the contact frame 2175 wraps the cleaning mechanism 214, the pressing slat 14 is pressed to press the groove 2172, the contact frame 2175 can completely wrap the cleaning mechanism 214, the external ventilation mechanism is connected with the through tube 2174, the through tube 2174 sprays argon gas out of the inner cavity of the cleaning vertical tube 2142, the diode in the cleaning mechanism 214 is filled with argon gas, the filling of the argon gas enables the diode not to chemically react with external gas in the cleaning process, the internal ring 21423 is connected with the external acoustic wave mechanism, ultrasonic waves are generated by penetrating through the internal ring 21423 to resonate the surface of the diode, the internal ring 21422 is a synthetic rubber component, the internal ring 23 can be made of a high-frequency synthetic rubber material, the internal ring can be made of the internal ring 21423, the internal ring 23 can be made of a high-frequency, the diode can be made of the diode can be made to pass through the vibration frequency, the internal ring, the diode can be collected by the diode, the diode can be collected by the device, and the diode can be collected by the diode, and the diode can be collected by the device after the diode can be collected by the diode, and the diode can be collected by the device, and the device after the diode can be collected by the diode can be carried out device, and the device can be carried out.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a cleaning machine is used in production of high efficiency diode, includes installation mechanism (1) and wiper mechanism (2), its characterized in that, installation mechanism (1) includes installation box (11), installation cavity (12), adjusting lever (13), presses slat (14), supplementary box (15), supplementary cavity (16) and leads to material way (17), installation cavity (12) have been seted up to the side both sides of installation box (11), adjusting lever (13) have been seted up to the inner chamber both sides of installation cavity (12), install between adjusting lever (13) and press slat (14), supplementary box (15) are installed to the side of installation box (11), supplementary cavity (16) have been seted up to the inner chamber of supplementary box (15), it leads to material way (17) to install the side of supplementary cavity (16), wiper mechanism (2) are installed to the side of installation box (11), wiper mechanism (2) includes equipment mechanism (21) and installation connecting rod (22), connect through installation connecting rod (22) between equipment mechanism (21);
the assembling mechanism (21) comprises a mounting substrate (211), a material passing cavity (212), a linkage box (213), a cleaning mechanism (214), a mounting block (215), a movable transverse shaft (216) and a processing mechanism (217), the material passing cavity (212) is formed in the upper end face of the mounting substrate (211), the linkage box (213) is mounted at the upper end of the mounting substrate (211), the cleaning mechanism (214) is formed in each of two ends of the linkage box (213), the mounting blocks (215) are formed in the inner cavity walls of the two ends of the mounting substrate (211), the movable transverse shaft (216) is mounted between the mounting blocks (215), and the processing mechanism (217) is mounted on the side end wall of the movable transverse shaft (216);
the machining mechanism (217) comprises a machining movable box (2171), a groove (2172), a bottom opening cavity (2173), a through pipe (2174) and a contact frame (2175), wherein the groove (2172) is formed in the upper end of the machining movable box (2171), the bottom opening cavity (2173) is formed in the bottom end of the machining movable box (2171), the through pipe (2174) is arranged on one side of an inner cavity of the bottom opening cavity (2173), and the contact frame (2175) is arranged on the outer ring of the bottom end of the bottom opening cavity (2173);
the cleaning mechanism (214) comprises an assembling transverse bar (2141), cleaning vertical cylinders (2142), supporting side plates (2143) and a top supporting plate (2144), the cleaning vertical cylinders (2142) are arranged at the upper end of the assembling transverse bar (2141) in a penetrating manner, and two sides of the upper end of the assembling transverse bar (2141) are connected with the top supporting plate (2144) through the supporting side plates (2143);
wash upright tube (2142) including barrel (21421), interior serial ring (21422) and run through inner ring circle (21423), inner serial ring (21422) have been seted up to the inner chamber range of barrel (21421), through running through inner ring circle (21423) through connection between interior serial ring (21422).
2. The cleaning machine for production of high efficiency diodes as claimed in claim 1, characterized in that said notch (2172) is opened with a width identical to the opening width of the pressing strip (14).
3. The cleaning machine for producing high-efficiency diodes as claimed in claim 1, wherein the lower end surface of the mounting substrate (211) penetrates the top end of the material passage (17).
4. The cleaning machine for high efficiency diode production as claimed in claim 1, wherein said contact frame (2175) has a greater opening width than the two sets of top support plates (2144).
5. The cleaning machine for producing the high-efficiency diode as claimed in claim 1, wherein an included angle of 60 degrees exists between the inner end opening angle of the processing movable box (2171) and the mounting substrate (211), the upper ends of the processing movable box (2171) are in a contact state, and two ends of the linkage box (213) are not in contact with the inner end of the processing movable box (2171).
6. A method for operating a high efficiency diode production cleaning machine according to any one of claims 1 to 5, wherein: the method comprises the following steps:
s1: the worker holds the right end of the pressing batten (14) to enable the pressing batten to rotate anticlockwise with the adjusting rod (13) as a fulcrum, the assembling mechanism (21) can be adjusted at the moment, the machining mechanism (217) is pulled to rotate with the movable transverse shaft (216) as the fulcrum, the whole machining movable box (2171) and the mounting base plate (211) are kept in a parallel state, and the diode to be cleaned is placed into the cleaning vertical barrel (2142);
s2: the processing mechanism (217) returns to a quasi-working state, the contact frame (2175) wraps the cleaning mechanism (214), the pressing batten (14) is pressed to press the groove (2172), the contact frame (2175) can completely wrap the cleaning mechanism (214), the external ventilation mechanism is connected with the through pipe (2174), the through pipe (2174) sprays argon gas to the inner cavity of the cleaning vertical barrel (2142), the diode in the cleaning mechanism (214) receives argon gas filling, and the diode cannot generate chemical reaction with external gas in the cleaning process due to the filling of the argon gas;
s3: the inner penetrating ring (21423) is connected with an external sound wave mechanism, the surface of the diode is resonated by ultrasonic waves generated by the inner penetrating ring (21423), the inner series ring (21422) is a component made of synthetic rubber, the vibration frequency between the inner penetrating ring (21423) can be enhanced, the vibration speed between the inner penetrating ring and the inner series ring can reach different frequencies, and therefore the diode can be efficiently cleaned;
s4: impurities and flashes of the vibrated diode can vertically fall into an inner cavity of the assembling transverse bar (2141), and then the impurities and the flashes are collected through the auxiliary cavity (16), so that the device returns to the state of S1, the diode is taken out, and cleaning is completed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110954180.7A CN113814237B (en) | 2021-08-19 | 2021-08-19 | High-efficiency cleaning machine for diode production and operation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110954180.7A CN113814237B (en) | 2021-08-19 | 2021-08-19 | High-efficiency cleaning machine for diode production and operation method thereof |
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| CN113814237A CN113814237A (en) | 2021-12-21 |
| CN113814237B true CN113814237B (en) | 2023-04-18 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US9108232B2 (en) * | 2009-10-28 | 2015-08-18 | Megasonic Sweeping, Incorporated | Megasonic multifrequency apparatus with matched transducers and mounting plate |
| CN203900031U (en) * | 2014-02-18 | 2014-10-29 | 温州钜源流体设备有限公司 | Ultrasonic cleaning pipe |
| CN105405792B (en) * | 2015-11-24 | 2018-08-03 | 如皋市大昌电子有限公司 | A kind of diode rinse bath |
| CN205362102U (en) * | 2016-02-23 | 2016-07-06 | 山东融创电子科技有限公司 | Diode component ultrasonic wave vibrates to wash uses basket |
| US11237387B2 (en) * | 2016-12-05 | 2022-02-01 | Texas Instruments Incorporated | Ultrasonic lens cleaning system with foreign material detection |
| CN208275875U (en) * | 2018-04-18 | 2018-12-25 | 南阳市农产品质量检测中心 | A kind of ultrasonic washing instrument with denoising device |
| CN111069192A (en) * | 2018-10-22 | 2020-04-28 | 北京北方华创微电子装备有限公司 | In-situ cleaning device and semiconductor processing equipment |
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