CN113811071B

CN113811071B - Self-heat-dissipation integrated circuit board

Info

Publication number: CN113811071B
Application number: CN202111115199.9A
Authority: CN
Inventors: 田建
Original assignee: Woxin Electronic Technology Jiangsu Co ltd
Current assignee: China Kaida Construction Engineering Shanghai Co ltd
Priority date: 2021-09-23
Filing date: 2021-09-23
Publication date: 2022-04-29
Anticipated expiration: 2041-09-23
Also published as: CN113811071A

Abstract

The invention discloses a self-radiating integrated circuit board, which belongs to the technical field of network safety and solves the problem of damage of large capacitors caused by overheating, and comprises a radiating plate, wherein the radiating plate is provided with a plurality of uniformly distributed conductive circuits, the radiating plate is provided with a plurality of conductive holes communicated with the conductive circuits, a plurality of radiating assemblies are arranged on two sides of the radiating plate, a plurality of supporting frames are arranged, two driving pins are arranged on the lower side of each supporting frame, a rotating cylinder is rotatably connected to the upper side of each supporting frame, two conductive mechanisms are arranged on the inner side of each supporting frame, a corner mechanism is arranged on the upper side of each rotating cylinder, the conductive circuits of the used circuit board radiating plate are communicated through the conductive mechanisms and the corner mechanisms, the large capacitors are installed on two sides of the radiating plate by using the radiating assemblies, the installation of the large capacitors can be completed, the installation is convenient, the possibility of errors is reduced, and the radiating assemblies are utilized to radiate the large capacitors, avoiding damage caused by overheating.

Description

Self-heat-dissipation integrated circuit board

Technical Field

The invention relates to the technical field of network security, in particular to a self-radiating integrated circuit board.

Background

The circuit board has the name: ceramic Circuit Board, alumina ceramic Circuit Board, aluminum nitride ceramic Circuit Board, PCB Board, aluminum substrate, high frequency Board, thick copper Board, impedance Board, PCB, ultra-thin Circuit Board, Printed (copper etching technology) Circuit Board, etc., the Circuit Board miniaturizes and visualizes the Circuit, plays an important role in mass production of fixed circuits and optimizing the layout of electric appliances, the Circuit Board can be called Printed Circuit Board or Printed Circuit Board, the english name (Printed Circuit Board) PCB, (Flexible Printed Circuit Board) FPC Circuit Board (FPC Circuit Board is also called Flexible Circuit Board) is made of polyimide or polyester film as the base material, has high reliability, excellent Flexible Printed Circuit Board, has the characteristics of high wiring density, light weight, thin thickness and good bending property), and Soft and hard combination Board (Soft and hard combination Board) -the birth and development of FPC and PCB, the new product of the soft and hard combined board is promoted. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like.

The capacitor is often needed to be used in the using process of the circuit board, but the capacitor is often lack of cooling measures for the capacitor, the distance between the installation position of some large capacitors and other workpieces is extremely short, on one hand, the capacitor is inconvenient to install, on the other hand, the capacitor is not favorable for heat dissipation, the capacitor is installed at a place where the heat dissipation is not good or close to a heating source, the capacitor is not good in wiring, poor in contact and the like, and burning is easily caused, and therefore the self-heat-dissipation integrated circuit board is provided.

Disclosure of Invention

The present invention is directed to a self-dissipating integrated circuit board, which facilitates the installation of a large capacitor and also dissipates heat from the large capacitor to avoid damage caused by overheating, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the invention provides the following technical scheme:

the utility model provides a from heat dissipation type integrated circuit board, includes the heating panel, the heating panel is equipped with a plurality of evenly distributed's conducting wire, the heating panel is opened has a plurality of electrically conductive holes that are linked together with the conducting wire, the heating panel both sides are equipped with a plurality of radiator unit, the support frame is equipped with a plurality ofly, the support frame downside is equipped with two initiative pins, the support frame upside is rotated and is connected with the rotation cylinder, the support frame inboard is equipped with two electrically conductive mechanism, it is equipped with corner mechanism to rotate the cylinder upside.

Preferably, electrically conductive mechanism includes flexible conducting strip, flexible conducting strip one end is fixed in the support frame inboard, and is linked together with initiative pin one end, flexible conducting strip distal end is fixed with the movable rod, the movable rod outside is rotated and is connected with a plurality of rolling cylinders, the movable rod distal end is equipped with two fixed blocks, the support frame inboard is equipped with fixed subassembly, and flexible conducting strip is located and is rotated the cylinder outside, rotates the cylinder and can rotate inside the support frame.

Preferably, the fixing component comprises a fixing frame fixed in the supporting frame, one end of the fixing frame is provided with a fixing telescopic rod, the far end of the fixing telescopic rod is fixed with a pressing block connected in the fixing frame in a sliding manner, the outer side of the fixing telescopic rod is provided with a fixing spring, two ends of the fixing spring are respectively connected and fixed with the pressing block and one end of the fixing frame, one side of the fixing frame is provided with a movable opening connected with the movable rod in a sliding manner, the inner side of the movable opening is provided with a fixed groove with the same size as the fixed block, the far end of the fixing frame is provided with a pressing opening with the same size as the outer side of the pressing block, the pressing block is enabled to press and fix the movable rod under the extension action of the fixing telescopic rod and the fixing spring under normal conditions, when the flexible conducting strip is dragged to enable the movable rod to be dragged, the movable rod can move under the rolling action of the rolling cylinder and enable the fixed block to enter the fixed groove, and meanwhile, the fixing spring extends to enable the pressing block to press the rotating cylinder through the pressing opening to be fixed, and the fixing block is fixed in the fixing groove, so that one end of the flexible conducting strip is fixed.

Preferably, corner mechanism includes that two are fixed in the corner pole that rotates the cylinder upside, the corner pole is opened there is the groove that opens and shuts, the inslot sliding connection that opens and shuts has the piece that opens and shuts, the piece downside that opens and shuts is equipped with conductive cylinder, rotate the cylinder both sides open have with the same conductive groove of conductive cylinder size, corner pole upside is equipped with the subassembly that opens and shuts, it is equipped with the corner subassembly to rotate the cylinder upside, and the rotation cylinder rotates and drives the corner pole and rotate, can control the piece that opens and shuts after rotating to required position and remove for conductive cylinder presses flexible conducting strip and gets into conductive inslot portion, can accomplish the intercommunication of conductive cylinder and initiative pin, accomplishes simultaneously and presses the piece to rotating cylindrical to press fixedly.

Preferably, the opening and closing assembly comprises an opening and closing rod which is slidably connected to the upper side of the corner rod, one end of the opening and closing rod is fixedly connected with the opening and closing block, passive sawtooth structures are arranged on two sides of the opening and closing rod, a plurality of one-way telescopic rods are fixedly arranged on two sides of the corner rod, an active sawtooth structure meshed with the passive sawtooth structures is fixedly arranged at the far ends of the one-way telescopic rods, one-way springs are arranged on the outer sides of the one-way telescopic rods, two ends of each one-way spring are fixedly connected with two ends of each one-way telescopic rod respectively, a conductive block communicated with a conductive cylinder is fixedly arranged at the far ends of the opening and closing rods, the opening and closing blocks are driven by the movement of the opening and closing rods to complete movement, and the opening and closing rods can only move in one direction under the meshing action of the active sawtooth structures and the passive sawtooth structures and the contraction and restoration action of the one-way springs.

Preferably, the corner component comprises a conductive rod which is connected to the upper side of the rotating cylinder in a sliding mode, two passive pins are arranged at two ends of the conductive rod respectively, two rigid conductive sheets which are communicated with the two passive pins are arranged on two sides of the conductive rod respectively, after the conductive rod is rotated and moved to a required position, the opening and closing rod is controlled to move, so that the conductive block is in contact with and presses the rigid conductive sheets to fix the conductive rod, meanwhile, the active pins and the passive pins are communicated, the active pins are welded into welding holes of the circuit board, and the passive pins are welded into the conductive holes of the heat dissipation plate to enable the conductive lines to be communicated with circuits of the circuit board.

Preferably, the heat dissipation assembly comprises a hollow heat dissipation cylinder, a heat dissipation fan is arranged at one end of the heat dissipation cylinder, the far end of the heat dissipation cylinder is fixed on one side of the heat dissipation plate in an existing bolt connection mode, a large capacitor to be installed is placed inside the heat dissipation cylinder, and the pin of the large capacitor is inserted into the conductive hole to complete welding, and the heat dissipation cylinder is installed, so that the heat dissipation fan can be controlled to conduct heat scattering operation on the large capacitor.

Preferably, one end of the opening and closing rod is provided with a finger pressing block, so that the opening and closing rod can be conveniently controlled by fingers to move.

Compared with the prior art, the invention has the beneficial effects that:

the conducting circuits of the circuit board heating panel used by the conducting mechanism and the corner mechanism are communicated, the large capacitor installed by the heat dissipation assembly is installed on two sides of the heating panel, the installation of the large capacitor can be completed, the possibility of error occurrence is conveniently reduced by installation, and meanwhile, the heat dissipation assembly is utilized to dissipate heat of the large capacitor, so that damage caused by overheating is avoided.

Drawings

FIG. 1 is a schematic view of a single heat sink assembly and a single support structure of the present invention;

FIG. 2 is a schematic view of a heat sink assembly according to the present invention;

FIG. 3 is a schematic view of the interior of the stand according to the present invention;

FIG. 4 is a schematic view of the present invention completing the fixing of the conductive rod;

FIG. 5 is a schematic bottom view of a rotating cylinder according to the present invention;

FIG. 6 is an enlarged view of area A of FIG. 3;

FIG. 7 is an enlarged view of area B of FIG. 3;

fig. 8 is an enlarged view of region C in fig. 4.

In the figure: 1-a heat sink; 2-conductive lines; 3-a conductive via; 4-a heat dissipation assembly; 5-a support frame; 6-active pin; 7-rotating the cylinder; 8-a conductive mechanism; 9-a corner turning mechanism; 10-a flexible conductive sheet; 11-a movable rod; 12-a rolling cylinder; 13-fixing block; 14-a fixed component; 15-a fixed frame; 16-fixing the telescopic rod; 17-pressing block; 18-a fixed spring; 19-a movable port; 20-a fixed groove; 21-a pressing opening; 22-corner posts; 23-opening and closing the groove; 24-a folding block; 25-a conductive cylinder; 26-a conductive slot; 27-an opening and closing assembly; 28-corner assembly; 29-opening and closing rod; 30-a passive saw tooth structure; 31-one-way telescopic rod; 32-active saw tooth structure; 33-a one-way spring; 34-a conductive block; 35-a conductive rod; 36-passive pins; 37-a rigid conductive sheet; 38-heat dissipation cylinder; 39-radiator fan; 40-refers to briquetting.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

Referring to fig. 1, fig. 3, fig. 4, fig. 6 and fig. 8, the present invention provides a self-heat dissipation integrated circuit board for facilitating large capacitor installation and simultaneously dissipating heat of a large capacitor to avoid damage caused by overheating, which includes a heat dissipation plate 1, the heat dissipation plate 1 is provided with a plurality of conductive traces 2 uniformly distributed, the heat dissipation plate 1 is provided with a plurality of conductive holes 3 communicated with the conductive traces 2, two sides of the heat dissipation plate 1 are provided with a plurality of heat dissipation assemblies 4, a support frame 5 is provided with a plurality of support frames 5, two active pins 6 are provided at a lower side of the support frame 5, an upper side of the support frame 5 is rotatably connected with a rotating cylinder 7, two conductive mechanisms 8 are provided at an inner side of the support frame 5, and a corner mechanism 9 is provided at an upper side of the rotating cylinder 7.

Referring to fig. 6, in the figure, the conductive mechanism 8 includes a flexible conductive sheet 10, one end of the flexible conductive sheet 10 is fixed inside the support frame 5 and is communicated with one end of the active pin 6, a movable rod 11 is fixed at a far end of the flexible conductive sheet 10, a plurality of rolling cylinders 12 are rotatably connected outside the movable rod 11, two fixed blocks 13 are arranged at a far end of the movable rod 11, a fixed assembly 14 is arranged inside the support frame 5, the flexible conductive sheet 10 is arranged outside the rotating cylinders 7, and the rotating cylinders 7 can rotate inside the support frame 5.

Referring to fig. 8, in the figure, the fixing assembly 14 includes a fixing frame 15 fixed in the supporting frame 5, one end of the fixing frame 15 is provided with a fixing telescopic rod 16, a pressing block 17 slidably connected inside the fixing frame 15 is fixed at the far end of the fixing telescopic rod 16, a fixing spring 18 is arranged outside the fixing telescopic rod 16, two ends of the fixing spring 18 are respectively connected and fixed with the pressing block 17 and one end of the fixing frame 15, one side of the fixing frame 15 is provided with a movable opening 19 slidably connected with the movable rod 11, a fixing groove 20 with the same size as the fixed block 13 is formed inside the movable opening 19, the far end of the fixing frame 15 is provided with a pressing opening 21 with the same size as the outside of the pressing block 17, the pressing block 17 is normally used for pressing and fixing the movable rod 11 under the extending action of the fixing telescopic rod 16 and the fixing spring 18, when the flexible conductive sheet 10 is dragged by the movable rod 11, the fixing assembly can move under the rolling action of the rolling cylinder 12 and the fixed block 13 can enter the fixing groove 20, meanwhile, the fixing spring 18 extends to enable the pressing block 17 to press and fix the rotating cylinder 7 through the pressing opening 21, and the fixing block 13 is fixed inside the fixing groove 20, so that one end of the flexible conducting strip 10 is fixed.

Install big electric capacity alone to carry out alone the heat dissipation and reduce the principle that the damage appears: the connection between the active pin 6 and the passive pin 36 is completed by the conductive mechanism 8 and the corner mechanism 9 inside the support frame 5, the active pin 6 is installed in a circuit of a used circuit board, the passive pin 36 is welded inside the conductive circuit 2, and the large capacitor is welded inside the conductive hole 3, so that the installation can be completed, and the heat dissipation operation is completed by the heat dissipation assembly 4.

Example 2

Referring to fig. 3-8, this embodiment further illustrates embodiment 1, in which the present invention provides a self-dissipating integrated circuit board that facilitates large capacitor installation and simultaneously dissipates heat of a large capacitor to avoid damage caused by overheating, the self-dissipating integrated circuit board includes a heat dissipation plate 1, the heat dissipation plate 1 is provided with a plurality of conductive traces 2 that are uniformly distributed, the heat dissipation plate 1 is provided with a plurality of conductive holes 3 that are communicated with the conductive traces 2, two sides of the heat dissipation plate 1 are provided with a plurality of heat dissipation assemblies 4, a support frame 5 is provided with a plurality of support frames 5, two active pins 6 are provided at a lower side of the support frame 5, an upper side of the support frame 5 is rotatably connected with a rotating cylinder 7, two conductive mechanisms 8 are provided at an inner side of the support frame 5, and a corner mechanism 9 is provided at an upper side of the rotating cylinder 7.

Referring to fig. 7, the opening and closing assembly 27 shown in the figure includes an opening and closing rod 29 slidably connected to the upper side of the corner rod 22, one end of the opening and closing rod 29 is fixedly connected to the opening and closing block 24, passive saw tooth structures 30 are disposed on two sides of the opening and closing rod 29, a plurality of one-way telescopic rods 31 are fixed on two sides of the corner rod 22, active saw tooth structures 32 engaged with the passive saw tooth structures 30 are fixed on distal ends of the one-way telescopic rods 31, one-way springs 33 are disposed on outer sides of the one-way telescopic rods 31, two ends of the one-way springs 33 are respectively fixedly connected to two ends of the one-way telescopic rods 31, conductive blocks 34 communicated with the conductive cylinders 25 are fixed on distal ends of the opening and closing rod 29, the opening and closing rod 24 is driven by movement of the opening and closing rod 29 to complete movement, and the opening and closing rod 29 can only perform one-way movement under the engagement action of the active saw tooth structures 32 and the passive saw tooth structures 30 and the contraction and the retraction and the reset action of the one-way springs 33.

Referring to fig. 4, the illustrated corner transferring assembly 28 includes a conductive rod 35 slidably connected to the upper side of the rotating cylinder 7, two passive pins 36 are respectively disposed at two ends of the conductive rod 35, two rigid conductive sheets 37 respectively connected to the two passive pins 36 are disposed at two sides of the conductive rod 35, after the conductive rod 35 is rotated and moved to a desired position, the opening/closing rod 29 is controlled to move so that the conductive block 34 contacts and presses the rigid conductive sheets 37 to fix the conductive rod 35, and simultaneously the active pin 6 is connected to the passive pins 36, the active pin 6 is welded into a welding hole of a circuit board, and the passive pins 36 are welded into a conductive hole 3 of the heat dissipating plate 1 so that the conductive circuit 2 is connected to a circuit of the circuit board.

In the scheme, the active pins 6 and the passive pins 36 are communicated, and the circuit of the used circuit board can be communicated with the conductive circuit 2 after the installation is finished.

Example 3

Referring to fig. 2, this embodiment further illustrates embodiment 2, and the present invention provides a self-heat dissipation integrated circuit board which is convenient for mounting a large capacitor and dissipating heat of the large capacitor to avoid damage caused by overheating, and the self-heat dissipation integrated circuit board includes a heat dissipation plate 1, the heat dissipation plate 1 is provided with a plurality of conductive traces 2 which are uniformly distributed, the heat dissipation plate 1 is provided with a plurality of conductive holes 3 communicated with the conductive traces 2, two sides of the heat dissipation plate 1 are provided with a plurality of heat dissipation assemblies 4, a support frame 5 is provided with a plurality of support frames 5, two active pins 6 are provided at a lower side of the support frame 5, a rotation cylinder 7 is rotatably connected to an upper side of the support frame 5, two conductive mechanisms 8 are provided at an inner side of the support frame 5, and a rotation angle mechanism 9 is provided at an upper side of the rotation cylinder 7.

Referring to fig. 2, in the figure, the heat dissipation assembly 4 includes a hollow heat dissipation cylinder 38, one end of the heat dissipation cylinder 38 is provided with a heat dissipation fan 39, the far end of the heat dissipation cylinder 38 is fixed to one side of the heat dissipation plate 1 by using the existing bolt connection method, the large capacitor to be mounted is placed inside the heat dissipation cylinder 38, the pin of the large capacitor is inserted into the conductive hole 3 to complete welding, and the heat dissipation cylinder 38 is mounted, so that the heat dissipation fan 39 can be controlled to perform heat dissipation operation on the large capacitor.

In this scheme, the heat dissipation cylinder 38 is used to complete the installation of the large capacitor, and the heat dissipation of the large capacitor can be completed under the action of the heat dissipation fan 39.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A self-dissipating integrated circuit board, comprising:

the radiating plate (1) is provided with a plurality of uniformly distributed conductive circuits (2), the radiating plate (1) is provided with a plurality of conductive holes (3) communicated with the conductive circuits (2), and a plurality of radiating assemblies (4) are arranged on two sides of the radiating plate (1);

support frame (5), support frame (5) are equipped with a plurality ofly, support frame (5) downside is equipped with two initiative pins (6), support frame (5) upside is rotated and is connected with rotation cylinder (7), support frame (5) inboard is equipped with two electrically conductive mechanism (8), rotation cylinder (7) upside is equipped with corner mechanism (9).

2. The self-dissipating integrated circuit board of claim 1, wherein: conductive mechanism (8) are including flexible conducting strip (10), flexible conducting strip (10) one end is fixed in support frame (5) inboard, and is linked together with initiative pin (6) one end, flexible conducting strip (10) distal end is fixed with movable rod (11), movable rod (11) outside is rotated and is connected with a plurality of rolling cylinders (12), movable rod (11) distal end is equipped with two fixed blocks (13), support frame (5) inboard is equipped with fixed subassembly (14).

3. The self-dissipating integrated circuit board according to claim 2, wherein: fixed subassembly (14) is including being fixed in mount (15) in support frame (5), mount (15) one end is equipped with fixed telescopic link (16), fixed telescopic link (16) distal end be fixed with sliding connection in mount (15) inside presses piece (17), the fixed telescopic link (16) outside is equipped with fixed spring (18), fixed spring (18) both ends respectively with press piece (17) with mount (15) one end is connected fixedly, mount (15) one side open have with movable rod (11) sliding connection's activity mouth (19), activity mouth (19) inboard open have with fixed block (13) fixed slot (20) that the size is the same, mount (15) distal end is opened has and is pressed mouth (21) with pressing piece (17) outside size the same.

4. The self-dissipating integrated circuit board of claim 1, wherein: corner mechanism (9) are fixed in corner pole (22) of rotating cylinder (7) upside including two, corner pole (22) are opened and are had open and shut groove (23), open and shut groove (23) inside sliding connection have open and shut piece (24), open and shut piece (24) downside is equipped with electrically conductive cylinder (25), rotate cylinder (7) both sides open have with electrically conductive cylinder (25) the same electrically conductive groove (26) of size, corner pole (22) upside is equipped with and opens and shut subassembly (27), it is equipped with corner subassembly (28) to rotate cylinder (7) upside.

5. The self-dissipating integrated circuit board according to claim 4, wherein: open and shut subassembly (27) including sliding connection in pole (29) that opens and shuts of corner pole (22) upside, pole (29) one end that opens and shuts with it is fixed to open and shut piece (24) connection, it is equipped with passive sawtooth structure (30) to open and shut pole (29) both sides, corner pole (22) both sides are fixed with a plurality of one-way telescopic link (31), one-way telescopic link (31) distal end be fixed with initiative sawtooth structure (32) that passive sawtooth structure (30) engaged with, one-way telescopic link (31) outside is equipped with one-way spring (33), one-way spring (33) both ends respectively with one-way telescopic link (31) both ends are connected fixedly, it is fixed with electrically conductive piece (34) that are linked together with electrically conductive cylinder (25) to open and shut pole (29) distal end.

6. The self-dissipating integrated circuit board according to claim 4, wherein: the corner assembly (28) comprises a conductive rod (35) which is connected to the upper side of the rotating cylinder (7) in a sliding mode, two passive pins (36) are arranged at two ends of the conductive rod (35) respectively, and two rigid conductive sheets (37) communicated with the two passive pins (36) are arranged on two sides of the conductive rod (35) respectively.

7. The self-dissipating integrated circuit board of claim 1, wherein: the heat dissipation assembly (4) comprises a hollow heat dissipation cylinder (38), a heat dissipation fan (39) is arranged at one end of the heat dissipation cylinder (38), and the far end of the heat dissipation cylinder (38) is fixed on one side of the heat dissipation plate (1) in a bolt connection mode.

8. The self-dissipating integrated circuit board according to claim 5, wherein: one end of the opening and closing rod (29) is provided with a finger pressing block (40).