CN113809257A - Display module, manufacturing method thereof and terminal equipment - Google Patents
Display module, manufacturing method thereof and terminal equipment Download PDFInfo
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- CN113809257A CN113809257A CN202010534671.1A CN202010534671A CN113809257A CN 113809257 A CN113809257 A CN 113809257A CN 202010534671 A CN202010534671 A CN 202010534671A CN 113809257 A CN113809257 A CN 113809257A
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Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The disclosure relates to a display module and a manufacturing method thereof, and a terminal device, wherein the display module comprises: a substrate; the cover plate is connected with the base plate, a closed installation cavity is formed between the base plate and the cover plate, and inert gas is filled in the installation cavity; the organic light-emitting device layer is arranged in the mounting cavity and is connected with the substrate; the packaging layer is arranged in the mounting cavity, is respectively connected with the organic light-emitting device layer and the substrate, and is used for packaging the organic light-emitting device layer between the substrate and the packaging layer; and the touch layer is arranged in the mounting cavity and is connected with one side of the packaging layer, which is far away from the substrate. The Touch layer is arranged In the mounting cavity formed by the substrate and the cover plate and arranged on the packaging layer In a Touch In-cell (internal Touch) mode, so that the problem of scratching of the Touch layer arranged on the surface layer is avoided, and the Touch sensitivity and accuracy are high.
Description
Technical Field
The disclosure relates to the field of terminal equipment, in particular to a display module and a manufacturing method thereof, and the terminal equipment.
Background
With the progress of science and technology and the improvement of living standard, terminal equipment, such as mobile phones, tablet computers and the like, is more and more popular. The functions of the terminal equipment are more and more abundant, which depends on the improvement of hardware such as a display screen. In the related art, the technology of a rigid OLED (organic light emitting device) display screen is more and more mature, but the Touch layer is arranged On the surface layer of the display screen and is in a Touch On-cell (surface layer Touch) form, the Touch layer is easily scratched in the production process, and the Touch sensitivity and accuracy are to be improved.
Disclosure of Invention
In order to overcome the problems in the related art, embodiments of the present disclosure provide a display module, a manufacturing method thereof, and a terminal device, so as to solve the defects in the related art.
According to a first aspect of the embodiments of the present disclosure, a display module is provided, including:
a substrate;
the cover plate is connected with the base plate, a closed installation cavity is formed between the base plate and the cover plate, and inert gas is filled in the installation cavity;
the organic light-emitting device layer is arranged in the mounting cavity and is connected with the substrate;
the packaging layer is arranged in the mounting cavity, is respectively connected with the organic light-emitting device layer and the substrate, and is used for packaging the organic light-emitting device layer between the substrate and the packaging layer;
and the touch layer is arranged in the mounting cavity and is connected with one side of the packaging layer, which is far away from the substrate.
In one embodiment, the mounting structure further comprises a rubber frame, wherein the rubber frame is connected between the cover plate and the base plate, and the mounting cavity is formed among the cover plate, the base plate and the rubber frame;
wherein, the rubber frame is formed by curing photosensitive rubber.
In one embodiment, the touch layer is integrated on a main control layer, and the main control layer is disposed in the mounting cavity and connected to the encapsulation layer.
In one embodiment, the substrate is low temperature poly-silicon glass.
In one embodiment, the organic light emitting device layer includes an array sub-layer and an organic sub-layer connected to each other, and a side of the array sub-layer away from the organic sub-layer is connected to the substrate.
In one embodiment, further comprising an anode integrated within the array sub-layer.
In one embodiment, a cathode is further included, the cathode being disposed between the organic sublayer and the encapsulation layer.
According to a second aspect of the embodiments of the present disclosure, a method for manufacturing a display module is provided, including:
manufacturing an organic light-emitting device layer on one side of a substrate;
manufacturing an encapsulation layer on one side of the substrate and one side of the organic light-emitting device layer far away from the substrate, so that the organic light-emitting device layer is encapsulated between the substrate and the encapsulation layer;
manufacturing a touch layer on one side of the packaging layer, which is far away from the substrate;
and connecting the substrate and the cover plate in an inert gas environment to encapsulate the organic light-emitting device layer, the encapsulation layer, the touch layer and the inert gas in an installation cavity between the substrate and the cover plate.
In one embodiment, the connecting the substrate and the cover plate under an inert gas atmosphere includes:
coating photosensitive glue on one side of the substrate in an inert gas environment so that the coated photosensitive glue surrounds the organic light-emitting device layer, the packaging layer and the touch layer;
and placing the cover plate on one side of the photosensitive adhesive far away from the base plate, and curing the photosensitive adhesive by using a curing medium of the photosensitive adhesive so as to connect the cover plate and the floor.
In one embodiment, the fabricating a touch layer on a side of the encapsulation layer away from the substrate includes:
and manufacturing a touch layer at the same time of manufacturing the main control layer on one side of the packaging layer far away from the substrate so as to integrate the manufactured touch layer on the manufactured main control layer.
In one embodiment, the fabricating an organic light emitting device layer on one side of a substrate includes:
manufacturing an array sublayer on one side of the substrate;
and manufacturing an organic sub-layer on one side of the array sub-layer far away from the substrate.
According to a third aspect of the embodiments of the present disclosure, a terminal device is provided, which includes the display module set in any one of the first aspect.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
according to the display module, the substrate and the cover plate are connected with each other to form the main body structure of the display module, and the installation cavity filled with inert gas is formed between the substrate and the cover plate, so that the organic light-emitting device layer arranged in the installation cavity cannot be corroded by air and moisture, and the organic light-emitting device layer is prevented from being oxidized; meanwhile, the organic light-emitting device layer is packaged between the substrate and the packaging layer by the packaging layer, so that the organic light-emitting device layer is further prevented from being oxidized and corroded; moreover, the Touch layer is arranged In the mounting cavity formed by the substrate and the cover plate and arranged on the packaging layer In a Touch In-cell (internal Touch) mode, so that the scratch problem of the Touch layer arranged on the surface layer is avoided, and the Touch sensitivity and accuracy are high.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural diagram of a display module according to an exemplary embodiment of the disclosure;
fig. 2 is a schematic structural diagram of a display module according to another exemplary embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a display module according to another exemplary embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a display module according to another exemplary embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a display module according to another exemplary embodiment of the present disclosure;
fig. 6 is a flowchart illustrating a method for manufacturing a display module according to an exemplary embodiment of the disclosure;
FIG. 7 is a flow chart illustrating one manner of connecting the base plate and the cover plate in accordance with an exemplary embodiment of the present disclosure.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.
With the progress of science and technology and the improvement of living standard, terminal equipment, such as mobile phones, tablet computers and the like, is more and more popular. The functions of the terminal equipment are more and more abundant, which depends on the improvement of hardware such as a display screen. In the related art, the technology of a rigid OLED (organic light emitting device) display screen is more and more mature, but the Touch layer is arranged On the surface layer of the display screen and is in a Touch On-cell (surface layer Touch) form, the Touch layer is easily scratched in the production process, and the Touch sensitivity and accuracy are to be improved.
In view of the above, in a first aspect, at least one embodiment of the present disclosure provides a display module, please refer to fig. 1, which schematically illustrates a structure of the display module.
The display module can be a display screen, and can be applied to terminal equipment such as mobile phones, tablet computers and computers. The display module assembly can be used for interacting with the user, and it not only can be used for showing the page, can also gather the operation that the user passes through touch display module assembly and input.
This display module assembly includes:
the gas-liquid separation device comprises a base plate 101 and a cover plate 102, wherein the cover plate 102 is connected with the base plate 101, a closed installation cavity 103 is formed between the base plate 101 and the cover plate 102, and inert gas is filled in the installation cavity 103.
The substrate 101 may be LTPS Glass (low temperature poly-silicon Glass), the cover plate 102 may be Enacp Glass (encapsulating Glass), and the cover plate 102 and the substrate 101 are arranged in parallel, and may be connected and encapsulated by Frit glue. The inert gas in the installation cavity 103 can be one or more selected from helium, neon, argon, krypton, xenon and radon.
In this embodiment, the substrate 101 and the cover plate 102 are connected to each other to form a main structure of the display module, and a mounting cavity 103 filled with inert gas is formed therebetween, so that an absolutely dry and absolutely oxygen-free environment is formed in the mounting cavity 103, which is suitable for mounting a module structure (such as the organic light emitting device layer 104, the encapsulation layer 105, and the touch layer 106, which will be mentioned below) requiring air and moisture isolation.
And the organic light-emitting device layer 104 is arranged in the mounting cavity and is connected with the substrate.
The organic light-emitting device layer is an organic light-emitting semiconductor layer and an organic electroluminescent display layer; the organic light emitting device layer 104 is a layer capable of emitting light in the display module, and the display module can complete display by emitting light through the organic light emitting device layer 104.
In this embodiment, the organic light emitting device layer 104 is disposed in the installation cavity 103 filled with the inert gas, and is not eroded by air and moisture, so as to prevent the organic light emitting device layer 104 from being oxidized, and improve the structural stability and the functional stability of the organic light emitting device layer 104.
And the encapsulation layer 105 is arranged in the installation cavity 103, is respectively connected with the organic light-emitting device layer 104 and the substrate 101, and is used for encapsulating the organic light-emitting device layer 104 between the substrate 101 and the encapsulation layer 105.
The encapsulation layer 105 is a TFE encapsulation (thin film encapsulation), covers the organic light emitting device layer 104, and has an edge that crosses the edge of the organic light emitting device layer 104 and then is connected to the substrate 101, and because the encapsulation layer is dense and thin, the transition between the organic light emitting device layer 104 and the substrate 101 is easy, the encapsulation effect is good, the pixel fluorescent powder and the whole circuit of the organic light emitting device layer 104 can be better protected, and the organic light emitting device layer 104 is further prevented from being oxidized and corroded.
And the touch layer 106 is arranged in the mounting cavity 103 and connected with one side of the packaging layer 105 far away from the substrate 101.
The Touch layer (Touch layer) is an interactive component of the display module, a user can input operation based on the Touch layer 106, the Touch layer 106 can collect the operation of the user, and the Touch layer 106 is matched with the organic light emitting device layer 104, so that the display and the operation of the display module are realized. The touch layer 106 is implemented by an FPC (flexible circuit) bonded on the encapsulation layer 105.
In the embodiment, the Touch layer 106 is disposed In the mounting cavity 103 formed by the substrate 101 and the cover plate 102 and disposed on the encapsulation layer 105 In the form of Touch In-cell (internal Touch), which not only avoids the scratch problem of the Touch layer 106 disposed on the surface layer, but also has high Touch sensitivity and accuracy.
The base plate and the cover plate are connected and encapsulated by using the Frit glue (molten glass glue), although a good encapsulation effect can be obtained, the Frit glue is solidified into glass, so that the base plate, the cover plate and the Frit glue therebetween form a complete glass box body, and the structural strength of the display module in the encapsulation mode can be greatly reduced because the glass is brittle. And the Frit glue is cracked easily after colliding with the display module assembly, leads to the display module assembly layering, and then the encapsulation inefficacy arouses black screen scheduling problem.
Referring to fig. 2, in some embodiments of the present disclosure, the display module further includes a rubber frame 207, the rubber frame 207 is connected between the cover plate 202 and the base plate 201, and the mounting cavity 203 is formed between the cover plate 202, the base plate 201, and the rubber frame 207; wherein, the rubber frame 207 is formed by curing a photosensitive rubber.
The arrangement positions and the connection relations of the substrate 201, the cover plate 202, the organic light emitting device layer 204, the encapsulation layer 205, and the touch layer 206 shown in fig. 2 are the same as those shown in fig. 1, and are not repeated here.
The rubber frame 207 is arranged at the edge positions of the substrate 201 and the cover plate 202, so that the connection stability between the substrate 201 and the cover plate 202 is improved, and the volume of the mounting cavity 203 is enlarged. The photosensitive glue is UV type glue, and seal glue is preferred.
In this embodiment, adopt photosensitive glue to form gluey frame 207, encapsulate base plate 201 and apron 202, thereby form installation cavity 203, the bonding firmness of base plate 201 and apron 202 increases, display module's peel off data performance is excellent, and because photosensitive glue has certain elasticity after the solidification, consequently avoided the lower problem of Frit (glass meltwater) encapsulation back display module intensity, that is to say, gluey frame 207 that photosensitive glue formed has further improved display module's intensity, and avoided the layering that display module collided with and leads to, encapsulation inefficacy and black screen scheduling problem.
Referring to fig. 3, in some embodiments of the present disclosure, the touch layer is integrated on a main control layer, and the main control layer is disposed in the mounting cavity 303 and connected to the encapsulation layer 305.
The arrangement positions and the connection relationships of the substrate 301, the cover plate 302, the organic light emitting device layer 304 and the encapsulation layer 305 shown in fig. 3 are the same as those shown in fig. 1 and fig. 2, and are not repeated here; the position and connection relationship of the rubber frame 307 shown in fig. 3 and the rubber frame shown in fig. 2 are the same, and the description is not repeated here.
The Main control layer is formed by Bonding a Main FPC (flexible circuit) to the packaging layer 305, the Touch layer is integrated on the Main control layer, namely the Touch FPC of the Touch layer is integrated on the Main control layer, and the two flexible circuits are bonded to the packaging layer 305 at one time, so that a composite layer 306 formed by the Main control layer and the Touch layer is formed, the Touch layer is prevented from being arranged on the surface of the cover plate 302 and needing an independent Bonding process, the production efficiency is improved, and the Touch layer is further prevented from being scratched.
Referring to fig. 4, in some embodiments of the present disclosure, the organic light emitting device layer includes an array sub-layer 404 and an organic sub-layer 405, which are connected to each other, and a side of the array sub-layer 404 away from the organic sub-layer 405 is connected to the substrate 401.
The arrangement positions and the connection relationships of the substrate 401 and the cover plate 402 shown in fig. 4 are the same as those shown in fig. 1, fig. 2, and fig. 3, and are not repeated here; the position and connection relationship of the rubber frame 408 shown in fig. 4 are the same as those of the rubber frames shown in fig. 2 and 3, and the description is not repeated here; the position and connection relationship between the composite layer 407 composed of the main control layer and the touch layer shown in fig. 4 and the composite layer shown in fig. 3 are the same, and are not repeated here.
In which an anode is integrated in an Array sublayer (Array)404, the Array sublayer 404 is disposed on the substrate 401, and the anode is disposed at the same time. The anode is used to inject holes into the organic sublayer (OLED)405, and needs a high work function (work function), and the material of the anode may be Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), gold (Au), platinum (Pt), silicon (Si), or the like. The organic sub-layer (OLED)405 is disposed on the array sub-layer 404, and forms an organic light emitting device layer through the organic sub-layer and the array sub-layer, thereby realizing the display functions of the light emitting and display module.
Referring to fig. 5, in some embodiments of the present disclosure, a cathode 508 is further included, and the cathode 508 is disposed between the organic sub-layer 505 and the encapsulation layer 506.
Wherein, the arrangement positions and the connection relationships of the substrate 501, the cover plate 502 and the encapsulation layer 506 shown in fig. 5 are consistent with those shown in fig. 1, fig. 2, fig. 3 and fig. 4, and are not repeated herein; the position and connection relationship of the rubber frame 509 shown in fig. 5 are the same as those of the rubber frames shown in fig. 2, 3 and 4, and the description is not repeated here; the composite layer 507 composed of the main control layer and the touch layer shown in fig. 5 is consistent with the composite layer shown in fig. 3 and 4 in position and connection relationship, and is not repeated here; the array sub-layer 504 and the organic sub-layer 505 shown in fig. 5 are consistent with the positions and connection relationships shown in fig. 4, and are not repeated here.
The cathode 508 is used for injecting electrons into the organic sublayer (OLED)505, and needs a low work function (work function), and the material of the cathode may be silver (Ag), aluminum (Al), lithium (Li), magnesium (Mg), calcium (Ca), indium (In), or an alloy such as magnesium aluminum alloy and lithium aluminum alloy. The cathode 508 and the anode are respectively arranged on two sides of the organic sub-layer (OLED)505, and electrons and holes are respectively injected into the organic sub-layer (OLED)505, so that the organic sub-layer can emit light and display, the cathode 508 is arranged under the packaging layer 506, the touch signal of the touch layer is prevented from being shielded, and the touch sensitivity and accuracy of the touch layer are further improved.
In a second aspect, at least one embodiment of the disclosure provides a method for manufacturing a display module, please refer to fig. 6, which shows a flowchart of the manufacturing method, and specifically includes steps S601 to S604.
In step S601, an organic light emitting device layer is formed on one side of the substrate.
In this step, an organic light emitting device layer is formed on the substrate by evaporation, physical deposition, etching, and the like.
In one example, the organic light emitting device layers are fabricated in the following specific manner:
firstly, manufacturing an array sublayer on one side of the substrate; and then, manufacturing an organic sub-layer on one side of the array sub-layer, which is far away from the substrate. The two sub-layers are also manufactured in one of evaporation, physical deposition, etching and the like.
In step S602, an encapsulation layer is formed on one side of the substrate and one side of the organic light emitting device layer away from the substrate, so that the organic light emitting device layer is encapsulated between the substrate and the encapsulation layer.
In the step, the packaging layer is manufactured by adopting an evaporation or physical deposition mode, the thickness of the packaging layer is controlled by controlling the process, and the tight packaging is ensured and the larger thickness is avoided.
In step S603, a touch layer is formed on a side of the package layer away from the substrate.
In this step, the encapsulation layer is kept away from make the Touch-control layer in the time of one side preparation master control layer of base plate to make the Touch-control layer of accomplishing of preparation integrate on the master control layer of accomplishing of preparation, just also with the Main FPC of master control layer and Touch FPC common Bonding of Touch-control layer to the encapsulation layer, realize the preparation of Touch-control layer, avoided Touch FPC to bond alone the process waste that causes, improved display module's production efficiency, practiced thrift manufacturing cost.
In step S604, the substrate and the cover plate are connected in an inert gas environment to encapsulate the organic light emitting device layer, the encapsulation layer, the touch layer and the inert gas in a mounting cavity between the substrate and the cover plate.
In this step, since the operation is performed in an inert gas atmosphere, the mounting cavity formed between the base plate and the lid plate is filled with inert gas without moisture and air.
Referring to fig. 7, in some embodiments of the present disclosure, the substrate and the cover plate may be connected in the following manner, specifically including step S701 and step S702.
In step S701, a photosensitive adhesive is coated on one side of the substrate in an inert gas environment, so that the coated photosensitive adhesive surrounds the organic light emitting device layer, the encapsulation layer, and the touch layer.
In the step, the photosensitive adhesive is coated on one side of the substrate, and the height of the photosensitive adhesive can be controlled to be higher than that of the touch layer, so that the formed mounting cavity can accommodate all layers manufactured in the steps.
In step S702, the cover plate is placed on a side of the photosensitive adhesive away from the substrate, and the photosensitive adhesive is cured by using a curing medium of the photosensitive adhesive, so that the cover plate and the floor are connected.
In the step, the photosensitive adhesive can be cured by using curing media such as ultraviolet rays, and the cured photosensitive adhesive has high strength and good packaging effect.
In a second aspect, at least one embodiment of the present disclosure provides a terminal device, which is characterized by including the display module in any one of the first aspects.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (12)
1. A display module, comprising:
a substrate;
the cover plate is connected with the base plate, a closed installation cavity is formed between the base plate and the cover plate, and inert gas is filled in the installation cavity;
the organic light-emitting device layer is arranged in the mounting cavity and is connected with the substrate;
the packaging layer is arranged in the mounting cavity, is respectively connected with the organic light-emitting device layer and the substrate, and is used for packaging the organic light-emitting device layer between the substrate and the packaging layer;
and the touch layer is arranged in the mounting cavity and is connected with one side of the packaging layer, which is far away from the substrate.
2. The display module assembly according to claim 1, further comprising a rubber frame, wherein the rubber frame is connected between the cover plate and the substrate, and the cover plate, the substrate and the rubber frame form the mounting cavity therebetween;
wherein, the rubber frame is formed by curing photosensitive rubber.
3. The display module of claim 1, wherein the touch layer is integrated on a main control layer, and the main control layer is disposed in the mounting cavity and connected to the encapsulation layer.
4. The display module of claim 1, wherein the substrate is low temperature poly-silicon glass.
5. The display module according to claim 1, wherein the organic light emitting device layer comprises an array sub-layer and an organic sub-layer which are connected with each other, and a side of the array sub-layer far away from the organic sub-layer is connected with the substrate.
6. The display module of claim 5, further comprising an anode integrated within the array sub-layer.
7. The display module of claim 5, further comprising a cathode disposed between the organic sublayer and the encapsulation layer.
8. A manufacturing method of a display module is characterized by comprising the following steps:
manufacturing an organic light-emitting device layer on one side of a substrate;
manufacturing an encapsulation layer on one side of the substrate and one side of the organic light-emitting device layer far away from the substrate, so that the organic light-emitting device layer is encapsulated between the substrate and the encapsulation layer;
manufacturing a touch layer on one side of the packaging layer, which is far away from the substrate;
and connecting the substrate and the cover plate in an inert gas environment to encapsulate the organic light-emitting device layer, the encapsulation layer, the touch layer and the inert gas in an installation cavity between the substrate and the cover plate.
9. The method of claim 8, wherein the connecting the substrate and the cover plate in an inert gas environment comprises:
coating photosensitive glue on one side of the substrate in an inert gas environment so that the coated photosensitive glue surrounds the organic light-emitting device layer, the packaging layer and the touch layer;
and placing the cover plate on one side of the photosensitive adhesive far away from the base plate, and curing the photosensitive adhesive by using a curing medium of the photosensitive adhesive so as to connect the cover plate and the floor.
10. The method of claim 8, wherein fabricating a touch layer on a side of the encapsulation layer away from the substrate comprises:
and manufacturing a touch layer at the same time of manufacturing the main control layer on one side of the packaging layer far away from the substrate so as to integrate the manufactured touch layer on the manufactured main control layer.
11. The method of claim 8, wherein fabricating the organic light emitting device layer on the side of the substrate comprises:
manufacturing an array sublayer on one side of the substrate;
and manufacturing an organic sub-layer on one side of the array sub-layer far away from the substrate.
12. A terminal device, characterized by comprising the display module set of any one of claims 1 to 7.
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