CN113799277B - Crystal multi-line cutting method - Google Patents
Crystal multi-line cutting method Download PDFInfo
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- CN113799277B CN113799277B CN202110913050.9A CN202110913050A CN113799277B CN 113799277 B CN113799277 B CN 113799277B CN 202110913050 A CN202110913050 A CN 202110913050A CN 113799277 B CN113799277 B CN 113799277B
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- 238000005520 cutting process Methods 0.000 title claims abstract description 155
- 239000013078 crystal Substances 0.000 title claims abstract description 112
- 238000000034 method Methods 0.000 title claims abstract description 12
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 81
- 239000010959 steel Substances 0.000 claims abstract description 81
- 239000004570 mortar (masonry) Substances 0.000 claims abstract description 72
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 16
- 229910002804 graphite Inorganic materials 0.000 claims description 16
- 239000010439 graphite Substances 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 11
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 230000002596 correlated effect Effects 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 235000012431 wafers Nutrition 0.000 description 20
- 239000003082 abrasive agent Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to the technical field of wafer production and manufacturing, and discloses a crystal multi-line cutting method, which gradually reduces the feeding speed of a workbench when a steel wire contacts a crystal until reaching the depth of the radius of the crystal, so that the feeding speed of the workbench is always in negative correlation with the cutting length L of the steel wire and the crystal, and simultaneously increases the supply of mortar flow, so that the mortar flow is always in positive correlation with the cutting length L of the crystal; in the stage from the radius depth of the crystal to the full crystal cutting of the steel wire, after the radius depth of the crystal is exceeded by the cutting depth of the steel wire, the feeding speed of the workbench is gradually increased, so that the feeding speed of the workbench always has a negative correlation trend with the cutting length L of the steel wire and the crystal, and meanwhile, the supply of mortar flow is reduced, so that the mortar flow always has a positive correlation trend with the cutting length L of the crystal. The invention can reduce the total thickness variation and warping degree deviation of the wafer, thereby achieving the production target of consistent wafer surface quality and ensuring that the wafer quality meets the production requirement.
Description
Technical Field
The invention relates to the technical field of wafer production and manufacturing, in particular to a crystal multi-line cutting method.
Background
In the field of wafer production and manufacturing, with the advent and development of multi-wire cutting technology, the conventional inner circle slicing method has been fully replaced, and multi-wire cutting has become the most commonly used wafer manufacturing method. The multi-wire cutting technology is to wind the steel wires or diamond wires on the wire guide wheel in sequence to form a wire net, grind and plow the crystal under the action of oil-based mortar or water-based cutting fluid, and finally form the wafer.
At present, the traditional multi-wire cutting technology is not fully mature, the surface quality of a wafer is difficult to be ensured when the wafer is cut, surface defects such as saw marks and the like are easy to occur, particularly, obvious lines are easy to occur at the positions of a feed port and a cutting edge of the wafer, so that TTV (total thickness variation) and Warp (Warp) of the wafer are large in equivalent, the production requirement is difficult to meet, and meanwhile, the wafer is also a common problem to be solved urgently in the industry.
Disclosure of Invention
Therefore, the invention aims to provide a crystal multi-line cutting method, by dynamically adjusting the cutting speed and the mortar flow, when the steel wire is cut to different depths of the crystal, the cutting length of the steel wire is adjusted to achieve dynamic balance with the number of free SiC particles generating a grinding plow effect in a wire bow and mortar formed by cutting the crystal by the steel wire, the total thickness change and the warping degree deviation of a wafer are reduced, so that the production target with consistent wafer surface quality is achieved, and the wafer quality is ensured to meet the production requirement.
The invention solves the technical problems by the following technical means:
When the crystal is cut, the feeding speed of the workbench is gradually reduced until the steel wire contacts the crystal and reaches the depth of the radius of the crystal, so that the feeding speed of the workbench is always in negative correlation with the cutting length L of the steel wire and the crystal, and meanwhile, the supply of mortar flow is increased, so that the mortar flow is always in positive correlation with the cutting length L of the crystal;
In the stage from the radius depth of the crystal to the full crystal cutting of the steel wire, after the radius depth of the crystal is exceeded by the cutting depth of the steel wire, the feeding speed of the workbench is gradually increased, so that the feeding speed of the workbench is always in negative correlation with the cutting length L of the steel wire and the crystal, and meanwhile, the supply of mortar flow is reduced, so that the mortar flow is always in positive correlation with the cutting length L of the crystal.
Further, the crystal multi-line cutting specifically comprises the following steps,
S1, preparation: the bottom of the crystal is connected with a pressing bar, and the top of the crystal is connected with a graphite strip;
S2, starting the following steps: spraying mortar on the surface of a steel wire, and cutting the steel wire into pressing strips connected with the bottom of a crystal;
S3, feeding: gradually reducing the feeding speed of the workbench until the steel wire contacts the crystal and reaches the depth of the radius of the crystal, so that the feeding speed of the workbench is always in negative correlation with the cutting length L of the steel wire and the crystal, and simultaneously increasing the supply of mortar flow so that the mortar flow is always in positive correlation with the cutting length L of the crystal;
S4, a cutter discharging step: in the stage from the radius depth of the crystal to the full crystal cutting of the steel wire, after the depth of the crystal cut by the steel wire exceeds the radius depth of the crystal, gradually increasing the feeding speed of the workbench to ensure that the feeding speed of the workbench is always inversely related to the cutting length L of the steel wire and the crystal; simultaneously reducing the mortar flow supply to ensure that the mortar flow is always positively correlated with the cutting length L of the crystal;
s5, ending: and in the stage from the completion of crystal cutting to the completion of graphite strip cutting of the steel wire, the steel wire is fed at a constant workbench feeding speed and a constant grinding wheel flow rate, and the final graphite strip cutting is completed.
Further, in the step S2, the relationship between the cutting speed and the cutting depth of the steel wire is: v=v 0
Wherein: v is the instantaneous cutting speed, v 0 is the initial cutting speed; the relation between the instant mortar supply amount and the cutting depth is as follows: ω=ω 0, wherein: omega is the instantaneous supply of mortar; omega 0 is the initial supply of mortar.
Further, in the step S3, the relationship between the cutting speed and the cutting depth of the steel wire at different cutting depths is:
Wherein: v is the cutting speed; r is the crystal radius; x is the cutting depth x epsilon (0, r); v 0 is the initial cutting speed; k is the precut depth;
the relation between the instantaneous mortar supply amount and the cutting depth is as follows:
Wherein: omega is the instantaneous supply of mortar; r is the crystal radius; x is the cutting depth x epsilon (0, r); omega 0 is the initial supply of mortar; k is the precut depth.
With the increase of the cutting depth, the feeding speed of the workbench is reduced, so that the wire bow formed by the steel wires and the crystals is almost kept stable, the feeding speed of the workbench is dynamically adjusted, and meanwhile, the quantity of mortar is required to be increased to ensure that the quantity of free abrasive materials of the grinding plow is consistent in unit length because the cutting length of the steel wires is increased, thereby being beneficial to reducing the wire breakage risk and improving the surface quality of the wafer.
Further, in the step S4, the relationship between the cutting speed and the cutting depth of the steel wire at different cutting depths is:
Wherein: v is the cutting speed; r is the crystal radius; x is the cutting depth x epsilon (r, 2 r); v 0 is the initial cutting speed; k is the precut depth;
the relation between the instantaneous mortar supply amount and the cutting depth is as follows:
Wherein: omega is the instantaneous supply of mortar; r is the crystal radius; x is the depth of cut, x e (r, 2 r); omega 0 is the initial supply of mortar; k is the precut depth.
Further, in the step S5, the relationship between the cutting speed and the cutting depth of the steel wire at different cutting depths is: v=v 0, wherein: v is the instantaneous cutting speed; v 0 is the initial cutting speed. The relation between the instant mortar supply amount and the cutting depth is as follows: ω=ω 0, wherein: omega is the instantaneous supply of mortar; omega 0 is the initial supply of mortar.
At this time, the steel wire has completely cut the crystal, and the steel wire only cuts the graphite rod in step S5, so that the constant feeding speed of the table and the constant feeding amount of the mortar can be maintained until the cutting process is completely finished because the cutting does not require the surface quality of the graphite rod.
The invention has the beneficial effects that:
According to the invention, through dynamically regulating and controlling the feeding speed of the workbench and the mortar flow rate at different stages of cutting, the steel wire can meet the conditions that the steel wire bow is consistent and the number of free SiC abrasive materials participating in grinding and plough is consistent at different stages of cutting crystals, so that the stability of the cutting state of the crystal is formed when the crystal is cut, the total thickness change of the wafer and the deviation of the warping degree are smaller, the surface quality of the wafer is improved, and the occurrence of surface defects such as saw lines and the like is reduced.
Drawings
Fig. 1 is a schematic view of the structure of a crystal multi-wire saw steel wire and a crystal according to the present invention;
Fig. 2 is a plot of the crystal cutting process versus feed rate and feed rate.
Wherein, the contact stress length of steel wire 1, steel wire and crystal is 2, layering 3, graphite strip 4, crystal 5.
Detailed Description
The invention will be described in detail below with reference to the attached drawings:
before multi-line cutting of the crystal in the embodiment, a pressing bar 3 is bonded at the bottom of the crystal 5, and a graphite strip 4 is bonded at the top of the crystal 5 and fixed on a workbench. In this example, the diameter of the crystal 5 is 100mm, the thickness of the pressing bar 3 is 5mm, and the thickness of the graphite strip 4 is 10mm.
In the preparation stage, each cutting parameter is correctly set, a mortar supply system is started, so that mortar is uniformly sprayed on the surface of the steel wire 1 to form a mortar film; the cutting system is started, the workbench with the crystal 5 fixed is slowly fed into the steel wire 1, and the steel wire 1 is cut to the pressing bar 3 adhered to the bottom of the crystal 5 in advance. In the section of the wire 1 where the bead 3 is cut, the table always adopts a constant feed speed until the wire 1 starts to cut to the crystal 5.
Starting from the cutting of the steel wire 1 to the crystal 5, the feeding speed of the workbench and the feeding amount of mortar are kept consistent with the feeding amount when the pressing bar 3 is cut, along with the increase of the cutting depth, the contact stress length of the steel wire 1 and the crystal 5 is increased, under the action of the original feeding speed of the workbench, the wire bow of the steel wire 1 is increased, the risk of wire breakage is increased, and when the cutting depth is increased, the contact stress length of the steel wire 1 and the crystal 5 is increased, the relation is as follows:
wherein L is the cutting length of the steel wire 1 and the crystal 5; r is the radius of the crystal 5; x is the depth of cut.
Therefore, as the cutting depth increases, the feeding speed of the workbench is reduced, so that the wire bow formed by the steel wire 1 and the crystal 5 is almost kept stable, the feeding speed of the workbench is dynamically adjusted, and meanwhile, as the cutting length of the steel wire 1 is increased, the mortar quantity is required to be increased so as to ensure that the quantity of free abrasive materials for effectively grinding and plowing is consistent in unit length, thereby being beneficial to reducing the wire breakage risk and improving the surface quality of the wafer.
When the cutting depth of the crystal 5 reaches half of the diameter of the crystal 5, the contact stress length of the steel wire 1 and the crystal 5 is reduced along with the continuous increase of the cutting depth, and the feeding speed of the workbench is increased at the moment, so that the wire bow formed by the steel wire 1 and the crystal 5 is kept stable, and the mortar supply amount is gradually reduced, thereby being beneficial to improving the cutting stability.
When the cutting depth completely reaches the diameter of the crystal 5, the steel wire 1 cuts the graphite strips 4 adhered above the crystal 5, the feeding speed of the workbench is kept stable, and the mortar supply amount is kept constant, so that the residual height graphite strips 4 are cut stably. The details are shown in the following table 1 and fig. 1:
TABLE 1 cutting process and feed speed and mortar supply gauges
The crystal 5 is adhered to an accurate iron plate and fixed on a cutting workbench, initial cutting parameters are set, the feeding speed of the initial workbench is 8mm/h, the mortar feeding speed is 25L/min, the complete cutting depth is 115mm, the radius of the cut crystal 5 is 50mm, the depth of the cut crystal 5 is 100mm, the thickness of the pressing bar 3, namely the front cutting depth is 5mm, and the graphite strips are 10mm.
Starting a mortar spraying system, conveying mortar from the mortar tank to a mortar pipe through a pump, stably flowing out of the surface of the steel wire 1 to form a mortar film, starting a cutting system after the inspection is finished, and starting high-speed reciprocating rotation of the steel wire 1.
When the heat engine is finished, the workbench starts to feed, at the moment, the steel wire 1 gradually and slowly contacts and cuts the pressing bar 3, at the moment, the feeding speed of the workbench is kept to be 8mm/h, the mortar feeding amount is 25L/min, when the steel wire 1 cuts the pressing bar 3, the S1 stage is ended and enters the S2 stage, the steel wire 1 starts to cut the crystal 5, and the effective cutting length of the steel wire 1 for the crystal 5 is increased along with the increase of the cutting depth, so that the wire bow formed by the crystal 5 and the steel wire 1 is increased when the feeding speed of the workbench is kept to be the same, the wire breakage phenomenon is possibly caused to finally happen, the feeding amount of the workbench is required to be reduced along with the increase of the cutting depth, and the feeding amount of the workbench is set when the cutting depth is changed, and is calculated according to the relation between the cutting speed and the cutting depth:
The feeding speeds of the corresponding working tables are 8.00, 6.88, 6.26, 5.60, 5.14, 4.80, 4.33, 4.08 and 4mm/h when the cutting depths are 5, 7, 10, 15, 20, 25, 35, 45 and 55mm respectively and sequentially set according to the calculation results, meanwhile, the effective cutting length of the steel wire 1 and the crystal 5 diameter is increased along with the increase of the cutting depth, and the free abrasive number in the unit length of the steel wire 1 is reduced, so that the mortar supply amount needs to be increased to ensure that the free abrasive amount is kept relatively stable, and the method is calculated according to the relation between the mortar supply amount and the cutting depth:
The respective mortar supply amounts at the cutting depths of 5, 7, 10, 15, 20, 25, 35, 45, and 55mm were set to 25.00, 29.07, 31.97, 35.71, 38.88, 41.67, 46.15, 49.01, and 50.00L/min in order according to the calculation results, and the cutting steps were performed in order according to the program setting.
After the step S2 is finished, that is, after the depth of the cut crystal 5 reaches 55mm, the cut enters a step S3 (S4), the cut length of the cut crystal 5 of the steel wire 1 is reduced when the cutting length of the cut crystal 5 of the steel wire 1 is lower than the maximum effective cutting length, if the feeding speed of the table is kept unchanged, the bow formed by the crystal 5 and the steel wire 1 is reduced, the tension of the steel wire 1 is reduced, and the stability of the surface quality of the wafer is not facilitated, so that the feeding speed of the table is required to be increased, and when the cutting depth is changed, the feeding amount of the table is set, and the table is calculated according to the relation between the cutting speed and the cutting depth:
According to the calculation results, the feeding speeds of the corresponding working tables are 4.00, 4.08, 4.33, 4.80, 5.14, 5.60, 6.26, 6.88 and 8.00mm/h when the cutting depths are 55, 65, 75, 85, 90, 95, 100, 103 and 105mm respectively and sequentially, meanwhile, as the cutting depths are increased, the effective cutting length of the steel wire 1 and the crystal 5 diameter is reduced, and the number of free abrasive materials in the unit length of the steel wire 1 is increased, so that the mortar supply amount needs to be reduced to ensure that the free abrasive materials are kept relatively stable, and the calculation is carried out according to the relation between the mortar supply amount and the cutting depth:
the respective mortar supply amounts at the cutting depths of 55, 65, 75, 85, 90, 95, 100, 103, and 105mm were set in order from the calculation results to be 50.00, 49.01, 46.15, 41.67, 38.88, 35.71, 31.97, 29.07, and 25.00L/min, and the cutting steps were sequentially performed according to the program setting.
When the cutting depth reaches 105mm, the steel wire 1 just cuts the crystal 5 completely, the S3 stage is finished, the cutting enters the S4 stage, the steel wire 1 only cuts the graphite strips 4, and the cutting has no requirement on the surface quality of the graphite strips 4, so that the constant feeding speed of a workbench and the constant feeding quantity of mortar can be maintained, the feeding speed of the workbench is constant at 8mm/h, and the feeding quantity of mortar is constant at 25L/min until the cutting process is finished completely.
The 100 wafers cut in the above examples were subjected to measurement of each quality index, and the following results as shown in table 2 were obtained:
TABLE 2 comparison of quality data of crystal cut products of the invention with the prior art
From the experimental data, the wafer cut by the method of the embodiment is superior to the prior art in indexes such as thickness deviation, total thickness change, bending degree, warping degree and the like, and the method ensures that the steel wire 1 meets the conditions that the wire bow of the steel wire 1 is consistent and the number of free SiC abrasive materials participating in grinding and scratching plow is consistent at different stages of the cutting crystal 5 by dynamically regulating and controlling the feeding speed of a workbench and the flow of mortar at different stages of cutting, thereby forming the stable cutting state of the crystal 5, being beneficial to improving the surface quality of the wafer and reducing the occurrence of surface defects such as saw lines and the like.
The above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solution of the present invention, which is intended to be covered by the scope of the claims of the present invention. The technology, shape, and construction parts of the present invention, which are not described in detail, are known in the art.
Claims (3)
1. A crystal multi-line cutting method is characterized in that: comprises the steps of,
S1, preparation: the bottom of the crystal is connected with a pressing bar, and the top of the crystal is connected with a graphite strip;
S2, starting the following steps: spraying mortar on the surface of a steel wire, and cutting the steel wire into pressing strips connected with the bottom of a crystal;
S3, feeding: at the stage that the cut steel wire contacts the crystal until reaching the depth of the radius of the crystal, gradually reducing the feeding speed of the workbench, enabling the feeding speed of the workbench to be always in negative correlation with the cutting length L of the steel wire and the crystal, simultaneously increasing the mortar flow supply, enabling the mortar flow to be always in positive correlation with the cutting length L of the crystal, and when the cutting depths are different, enabling the relation between the cutting speed of the steel wire and the cutting depth to be:
Wherein: v is the cutting speed; r is the crystal radius; x is the cutting depth x epsilon (0, r); v 0 is the initial cutting speed; k is the precut depth;
the relation between the instantaneous mortar supply amount and the cutting depth is as follows:
wherein: omega is the instantaneous supply of mortar; r is the crystal radius; x is the cutting depth x epsilon (0, r); omega 0 is the initial supply of mortar; k is the precut depth;
S4, a cutter discharging step: in the stage from the radius depth of the crystal to the full crystal cutting of the cut steel wire, after the depth of the crystal cut by the steel wire exceeds the radius depth of the crystal, gradually increasing the feeding speed of the workbench to ensure that the feeding speed of the workbench is always in negative correlation with the cutting length L of the steel wire and the crystal; simultaneously, the mortar flow is reduced, so that the mortar flow is always positively correlated with the cutting length L of the crystal, and when the cutting depths are different, the relation between the cutting speed and the cutting depth of the steel wire is as follows:
Wherein: v is the cutting speed; r is the crystal radius; x is the cutting depth x epsilon (r, 2 r); v 0 is the initial cutting speed; k is the precut depth;
the relation between the instantaneous mortar supply amount and the cutting depth is as follows:
wherein: omega is the instantaneous supply of mortar; r is the crystal radius; x is the cutting depth x epsilon (r, 2 r); omega 0 is the initial supply of mortar; k is the precut depth;
s5, ending: and in the stage from the completion of crystal cutting to the completion of graphite strip cutting of the steel wire, the steel wire is fed at a constant workbench feeding speed and a constant grinding wheel flow rate, and the final graphite strip cutting is completed.
2. A method of multi-wire sawing of crystals as claimed in claim 1, wherein: in the step S2, the relationship between the cutting speed and the cutting depth of the steel wire is: v=v 0, wherein: v is the instantaneous cutting speed, V 0 is the initial cutting speed; the relation between the instant mortar supply amount and the cutting depth is as follows: ω=ω 0, wherein: omega is the instantaneous supply of mortar; omega 0 is the initial supply of mortar.
3. A method of multi-wire sawing of crystals as claimed in claim 1, wherein: in the step S5, when the cutting depths are different, the relation between the cutting speed and the cutting depth of the steel wire is: v=v 0, wherein: v is the instantaneous cutting speed; v 0 is the initial cutting speed; the relation between the instant mortar supply amount and the cutting depth is as follows: ω=ω 0, wherein: omega is the instantaneous supply of mortar; omega 0 is the initial supply of mortar.
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