CN113798037B - Raw material pretreatment process suitable for chip packaging materials with different properties - Google Patents
Raw material pretreatment process suitable for chip packaging materials with different properties Download PDFInfo
- Publication number
- CN113798037B CN113798037B CN202111069101.0A CN202111069101A CN113798037B CN 113798037 B CN113798037 B CN 113798037B CN 202111069101 A CN202111069101 A CN 202111069101A CN 113798037 B CN113798037 B CN 113798037B
- Authority
- CN
- China
- Prior art keywords
- raw materials
- chip packaging
- packaging material
- materials
- raw material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C21/00—Disintegrating plant with or without drying of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
- B01J2/20—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic by expressing the material, e.g. through sieves and fragmenting the extruded length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C1/00—Magnetic separation
- B03C1/02—Magnetic separation acting directly on the substance being separated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Food Science & Technology (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a raw material pretreatment process suitable for chip packaging materials with different properties, which comprises the following raw materials in parts by weight: raw materials of the chip packaging material, an accelerator, a diluent, a coupling agent, a thixotropic agent and conductive adhesive. The raw material pretreatment process for the chip packaging material with different properties is characterized in that the raw material granularity of the chip packaging material after the pretreatment can be finer, the granularity distribution is narrow, the chemical composition is accurate and uniform, the chemical degree is high, the particles are nearly spherical, the surface area of the raw material is increased, the surface activity is high, the molecules are diffused, the dynamic process of the prepared chip packaging material is greatly influenced, the usability of the chip is improved, the original impurities in the raw material can be removed through the impurity removal treatment of the raw material, if the impurities are not removed, the processing efficiency of the raw material is influenced, the ball milling time is prolonged, and the defects of the product are easily caused.
Description
Technical Field
The invention relates to the field of raw material pretreatment of chip packaging materials, in particular to a raw material pretreatment process applicable to chip packaging materials with different properties.
Background
The raw material pretreatment of the chip packaging material refers to the preparation process carried out before the final processing is completed, the chip packaging refers to the shell for mounting the semiconductor integrated circuit chip, the shell is a bridge for communicating the world inside the chip with an external circuit, the contacts on the chip are connected to pins of the packaging shell through wires, the pins are connected with other devices through wires on a printed board, the existing chip has different effects, the matched requirements on heat resistance and electric conduction are different, and the material for adapting the chip packaging material needs to be selected when the chip packaging material is selected.
Disclosure of Invention
The invention mainly aims to provide a raw material pretreatment process suitable for chip packaging materials with different properties, which can effectively solve the problems in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows: comprises the following raw materials in parts by weight: the chip packaging material comprises 55% -64% of raw materials of the chip packaging material, 1% -3% of an accelerator, 3% -5% of a diluent, 1% -6% of a coupling agent, 1% -3% of a thixotropic agent and 30% -44% of conductive adhesive.
Preferably, the chip packaging material has a proportion of 56%, the accelerator has a proportion of 2%, the diluent has a proportion of 4%, the coupling agent has a proportion of 2%, the thixotropic agent has a proportion of 2%, and the conductive adhesive has a proportion of 34%.
Preferably, the chip packaging material has a proportion of 60%, the accelerator has a proportion of 2.6%, the diluent has a proportion of 3.5%, the coupling agent has a proportion of 2.3%, the thixotropic agent has a proportion of 1.6%, and the conductive paste has a proportion of 30%.
Preferably, the chip packaging material raw material is pre-crushed: the method comprises the steps of processing raw materials, putting the massive raw materials into a jaw crusher for crushing, enabling the massive raw materials to be crushed to 3-5mm, putting the raw materials with the size of 3-5mm into a Raymond mill for further grinding after crushing, enabling the raw materials to be crushed to 0.1-3mm, and standing for later use.
Preferably, the homogenization treatment of the chip packaging material raw material: the raw materials which are crushed to 0.1-3mm are put into a stirring granulator for working, the stirring impeller and the scraper of the granulator stir and mix the raw materials, meanwhile, pug is extruded into particles, the particles are discharged out of the granulator, and the discharged raw material particles are transferred into a stale bin for storage.
Preferably, the chip packaging material raw material is subjected to impurity removal treatment: the method comprises the steps of removing massive impurities or massive raw materials with concentrated impurities from raw materials in a manual selection mode, then removing magnetic coloring oxides such as iron from the raw materials by using magnetic force, only placing permanent magnets in the raw materials in a magnetic separation process, then taking out and cleaning the raw materials by manpower at fixed time, placing the raw materials in a calciner with the temperature of 1200-1300 ℃ for calcination after the magnetic separation, crushing and screening, and removing graphite lamellar rock in the raw materials, wherein the principle can be used for manufacturing the raw materials of chip packaging materials.
Preferably, the treatment of the accelerator: taking out a certain amount of imidazole and its salt, phosphorus-containing compound, guanidine derivative and organic urea, placing into a culture dish, sealing and preserving, and standing for use after all the reactions are combined together.
Preferably, the treatment of the diluent: taking out 10% of isopropanol, 40% of toluene and 50% of butanone, placing the mixture into a reagent bottle, completely sealing the mixture, shaking the mixture to completely fuse the mixture together, and placing the mixture for later use.
Preferably, the treatment of the coupling agent: taking out a certain amount of amino, mercapto, vinyl, epoxy, cyano and methacryloxy, placing the mixture in a test tube, stirring the mixture, and standing the mixture for later use after the stirring is completed.
Preferably, the thixotropic agent is treated: a certain amount of silicon tetrachloride and air are burned, thereby obtaining the silicon dioxide thixotropic agent.
Preferably, the treatment of the epoxy resin and bisphenol a-epichlorohydrin type epoxy resin: placing a certain amount of epoxy resin, bisphenol A-epichlorohydrin type epoxy resin and accelerator together, uniformly stirring, grinding the epoxy resin and the accelerator by using a grinder, adding the ground material into a diluent, stirring and mixing the materials, adding a coupling agent, stirring and mixing the materials, adding the coupling agent and a thixotropic agent, stirring and mixing the materials, and placing the obtained materials for later use.
Preferably, the pretreatment of the chip packaging material raw material comprises the following steps: and mixing the mixed material with a chip packaging material raw material to manufacture the chip package.
Compared with the prior art, the invention has the following beneficial effects: according to the invention, the particle size of the raw materials of the chip packaging material after the pre-crushing treatment can be finer, the particle size distribution is narrow, the chemical composition is accurate and uniform, the chemical degree is high, the particles are close to the sphere, the surface area of the raw materials is increased, the surface activity is high, the surface and interface properties are greatly changed, the molecules are diffused, the dynamic process of the prepared chip packaging material is greatly influenced, the service performance of the chip is improved, the original impurities in the raw materials can be removed by the impurity removal treatment of the raw materials, if the impurities are not removed, the processing efficiency of the raw materials is influenced, the ball milling time is prolonged, the defects of the product are easily caused, the curing temperature is reduced, the curing rate is controlled, the operability of the conductive adhesive coated on the chip packaging material is improved by coating the thinner, the service life of the conductive adhesive is met, the bonding strength and the shearing strength of the chip packaging material after curing in the crystal fixing process are improved, the service durability is improved, and the thixotropic adhesive coated on the chip packaging material can be kept in a certain state in the process, and the product can not be stored in a certain state.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
First embodiment: the invention relates to a raw material pretreatment process suitable for chip packaging materials with different properties, which comprises the following raw materials in parts by weight: the chip packaging material comprises 55% -64% of raw materials, 1% -3% of accelerator, 3% -5% of diluent, 1% -6% of coupling agent, 1% -3% of thixotropic agent and 30% -44% of conductive adhesive.
The chip packaging material has a raw material content of 56%, an accelerator content of 2%, a diluent content of 4%, a coupling agent content of 2%, a thixotropic agent content of 2% and a conductive paste content of 34%.
The method comprises the following manufacturing steps: s1: pre-crushing the chip packaging material raw material: the method comprises the steps of processing raw materials, putting the massive raw materials into a jaw crusher for crushing, enabling the massive raw materials to be crushed to 3-5mm, putting the raw materials with the size of 3-5mm into a Raymond mill for further grinding after crushing, enabling the raw materials to be crushed to 0.1-3mm, and standing for later use.
S2: homogenizing the chip packaging material raw material: the raw materials which are crushed to 0.1-3mm are put into a stirring granulator for working, the stirring impeller and the scraper of the granulator stir and mix the raw materials, meanwhile, pug is extruded into particles, the particles are discharged out of the granulator, and the discharged raw material particles are transferred into a stale bin for storage.
S3: impurity removal treatment of chip packaging material raw materials: the method comprises the steps of removing massive impurities or massive raw materials with concentrated impurities from raw materials in a manual selection mode, then removing magnetic coloring oxides such as iron from the raw materials by using magnetic force, only placing permanent magnets in the raw materials in a magnetic separation process, then taking out and cleaning the raw materials by manpower at fixed time, placing the raw materials in a calciner with the temperature of 1200-1300 ℃ for calcination after the magnetic separation, crushing and screening, and removing graphite lamellar rock in the raw materials, wherein the principle can be used for manufacturing the raw materials of chip packaging materials.
S4: treatment of the accelerator: taking out a certain amount of imidazole and its salt, phosphorus-containing compound, guanidine derivative and organic urea, placing into a culture dish, sealing and preserving, and standing for use after all the reactions are combined together.
S5: treatment of the diluent: taking out 10% of isopropanol, 40% of toluene and 50% of butanone, placing the mixture into a reagent bottle, completely sealing the mixture, shaking the mixture to completely fuse the mixture together, and placing the mixture for later use.
S6: treatment of the coupling agent: taking out a certain amount of amino, mercapto, vinyl, epoxy, cyano and methacryloxy, placing the mixture in a test tube, stirring the mixture, and standing the mixture for later use after the stirring is completed.
S7: treatment of thixotropic agent: a certain amount of silicon tetrachloride and air are burned, thereby obtaining the silicon dioxide thixotropic agent.
S8: treatment of epoxy resins and bisphenol a-epichlorohydrin type epoxy resins: placing a certain amount of epoxy resin, bisphenol A-epichlorohydrin epoxy resin and accelerator together, uniformly stirring, grinding the epoxy resin and the accelerator by using a grinder, adding the ground material into a diluent, stirring and mixing the materials, adding a coupling agent, stirring and mixing the materials, adding the coupling agent and a thixotropic agent, stirring and mixing the materials, and placing the obtained materials for later use.
S9: pretreatment of chip packaging material raw materials: and mixing the mixed materials with chip packaging material raw materials to manufacture the chip package.
Specific embodiment II: on the basis of the first embodiment, the invention relates to a raw material pretreatment process suitable for chip packaging materials with different properties, which comprises the following raw materials in parts by weight: the chip packaging material comprises 55% -64% of raw materials, 1% -3% of accelerator, 3% -5% of diluent, 1% -6% of coupling agent, 1% -3% of thixotropic agent and 30% -44% of conductive adhesive.
The chip packaging material comprises 60% of raw materials, 2.6% of promoters, 3.5% of diluents, 2.3% of coupling agents, 1.6% of thixotropic agents and 30% of conductive adhesives.
The method comprises the following manufacturing steps: s1: pre-crushing the chip packaging material raw material: the method comprises the steps of processing raw materials, putting the massive raw materials into a jaw crusher for crushing, enabling the massive raw materials to be crushed to 3-5mm, putting the raw materials with the size of 3-5mm into a Raymond mill for further grinding after crushing, enabling the raw materials to be crushed to 0.1-3mm, and standing for later use.
S2: homogenizing the chip packaging material raw material: the raw materials which are crushed to 0.1-3mm are put into a stirring granulator for working, the stirring impeller and the scraper of the granulator stir and mix the raw materials, meanwhile, pug is extruded into particles, the particles are discharged out of the granulator, and the discharged raw material particles are transferred into a stale bin for storage.
S3: impurity removal treatment of chip packaging material raw materials: the method comprises the steps of removing massive impurities or massive raw materials with concentrated impurities from raw materials in a manual selection mode, then removing magnetic coloring oxides such as iron from the raw materials by using magnetic force, only placing permanent magnets in the raw materials in a magnetic separation process, then taking out and cleaning the raw materials by manpower at fixed time, placing the raw materials in a calciner with the temperature of 1200-1300 ℃ for calcination after the magnetic separation, crushing and screening, and removing graphite lamellar rock in the raw materials, wherein the principle can be used for manufacturing the raw materials of chip packaging materials.
S4: treatment of the accelerator: taking out a certain amount of imidazole and its salt, phosphorus-containing compound, guanidine derivative and organic urea, placing into a culture dish, sealing and preserving, and standing for use after all the reactions are combined together.
S5: treatment of the diluent: taking out 10% of isopropanol, 40% of toluene and 50% of butanone, placing the mixture into a reagent bottle, completely sealing the mixture, shaking the mixture to completely fuse the mixture together, and placing the mixture for later use.
S6: treatment of the coupling agent: taking out a certain amount of amino, mercapto, vinyl, epoxy, cyano and methacryloxy, placing the mixture in a test tube, stirring the mixture, and standing the mixture for later use after the stirring is completed.
S7: treatment of thixotropic agent: a certain amount of silicon tetrachloride and air are burned, thereby obtaining the silicon dioxide thixotropic agent.
S8: treatment of epoxy resins and bisphenol a-epichlorohydrin type epoxy resins: placing a certain amount of epoxy resin, bisphenol A-epichlorohydrin epoxy resin and accelerator together, uniformly stirring, grinding the epoxy resin and the accelerator by using a grinder, adding the ground material into a diluent, stirring and mixing the materials, adding a coupling agent, stirring and mixing the materials, adding the coupling agent and a thixotropic agent, stirring and mixing the materials, and placing the obtained materials for later use.
S9: pretreatment of chip packaging material raw materials: and mixing the mixed materials with chip packaging material raw materials to manufacture the chip package.
According to the invention, the particle size of the raw materials of the chip packaging material after the pre-crushing treatment can be finer, the particle size distribution is narrow, the chemical composition is accurate and uniform, the chemical degree is high, the particles are close to the sphere, the surface area of the raw materials is increased, the surface activity is high, the surface and interface properties are greatly changed, the molecules are dispersed, the dynamic process of the prepared chip packaging material is greatly influenced, the service performance of the chip is improved, the original impurities in the raw materials can be removed by the impurity removal treatment of the raw materials, if the impurities are not removed, the processing efficiency of the raw materials is prolonged, the ball milling time is prolonged, defects are easily caused, the curing temperature is reduced, the curing rate is controlled, the operability of the conductive adhesive coated on the chip packaging material is improved by coating the thinner, the service life of the conductive adhesive is also prolonged, the adhesive strength and the shearing strength of the chip packaging material after curing in the crystal fixing process are improved, the service durability is improved, and the thixotropic adhesive coated on the chip packaging material can be kept in a certain state in the process of being stored, and the thixotropic material can not be kept in a certain state.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (3)
1. A raw material pretreatment process suitable for chip packaging materials with different attributes is characterized in that: comprises the following raw materials in parts by weight: the chip packaging material comprises 55% -64% of raw materials of the chip packaging material, 1% -3% of an accelerator, 3% -5% of a diluent, 1% -6% of a coupling agent, 1% -3% of a thixotropic agent and 30% -44% of conductive adhesive;
the method comprises the following steps:
s1: pre-crushing the chip packaging material raw material: processing raw materials, putting the massive raw materials into a jaw crusher for crushing, crushing the massive raw materials to 3-5mm, putting the raw materials with the size of 3-5mm into a Raymond mill for further grinding after crushing, crushing the raw materials to 0.1-3mm, and standing for later use;
s2: homogenizing the chip packaging material raw material: putting the raw materials which are crushed to 0.1-3mm into a stirring granulator for working, stirring and mixing the raw materials by a stirring impeller and a scraper of the granulator, extruding the pug into particles, discharging the particles out of the granulator, and transferring the discharged raw material particles into a stale bin for storage;
s3: impurity removal treatment of chip packaging material raw materials: removing massive impurities or massive raw materials with concentrated impurities in the raw materials by using a manual selection mode, then sucking iron in the raw materials by using magnetic force, in the magnetic separation process, only placing permanent magnets in the raw materials, then taking out and cleaning the raw materials by manpower at fixed time, after the magnetic separation is finished, placing the raw materials in a calciner with the temperature of 1200-1300 ℃ for calcination, crushing and screening, removing graphite lamellar rock in the raw materials, and manufacturing the raw materials of the chip packaging materials;
s4: treatment of the accelerator: taking out a certain amount of imidazole and its salt, phosphorus-containing compound, guanidine derivative and organic urea, placing them into a culture dish, sealing and storing until all the reactions are combined together, and placing them for standby;
s5: treatment of the diluent: taking out 10% of isopropanol, 40% of toluene and 50% of butanone, placing the mixture into a reagent bottle, completely sealing the mixture, shaking the mixture to completely fuse the mixture together, and placing the mixture for later use;
s6: treatment of the coupling agent: taking out a certain amount of amino, mercapto, vinyl, epoxy, cyano and methacryloxy, placing the mixture in a test tube, stirring the mixture, and standing the mixture for later use after the stirring is completed;
s7: treatment of thixotropic agent: burning a certain amount of silicon tetrachloride and air, thereby obtaining a silicon dioxide thixotropic agent;
s8: and (3) treating conductive adhesive: preparing 100 parts of bisphenol A epoxy resin, 85 parts of 4-methyl hexahydrophthalic anhydride curing agent and 1 part of imidazole catalyst to form matrix resin, firstly uniformly mixing the epoxy resin and the anhydride curing agent, then adding the surface-treated micro silver flakes and uniformly mixing, finally adding the curing catalyst, continuously stirring until the materials are uniformly mixed, and standing for later use;
s9: pretreatment of chip packaging material raw materials: mixing the accelerator, the diluent, the coupling agent, the thixotropic agent and the raw materials of the chip packaging material according to the proportion, and then coating the conductive adhesive on the surface of the chip packaging material.
2. The raw material pretreatment process applicable to chip packaging materials with different properties according to claim 1, wherein: the chip packaging material comprises 56% of raw materials, 2% of accelerators, 4% of diluents, 2% of coupling agents, 2% of thixotropic agents and 34% of conductive adhesives.
3. The raw material pretreatment process applicable to chip packaging materials with different properties according to claim 1, wherein: the chip packaging material comprises 60% of raw materials, 2.6% of accelerators, 3.5% of diluents, 2.3% of coupling agents, 1.6% of thixotropic agents and 30% of conductive adhesives.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111069101.0A CN113798037B (en) | 2021-09-13 | 2021-09-13 | Raw material pretreatment process suitable for chip packaging materials with different properties |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111069101.0A CN113798037B (en) | 2021-09-13 | 2021-09-13 | Raw material pretreatment process suitable for chip packaging materials with different properties |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113798037A CN113798037A (en) | 2021-12-17 |
| CN113798037B true CN113798037B (en) | 2023-06-06 |
Family
ID=78940876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111069101.0A Active CN113798037B (en) | 2021-09-13 | 2021-09-13 | Raw material pretreatment process suitable for chip packaging materials with different properties |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113798037B (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6495260B1 (en) * | 1999-06-15 | 2002-12-17 | Sumitomo Bakelite Company Limited | Method of producing epoxy for molding semiconductor device, molding material, and semiconductor device |
| JP3310655B2 (en) * | 2000-09-28 | 2002-08-05 | 株式会社環境電磁技術研究所 | Package for semiconductor device |
| CN103101915A (en) * | 2012-03-16 | 2013-05-15 | 江苏融汇石英材料科技有限公司 | Preparation method of fused silica powder for electronic integrated circuit package |
| CN105368003A (en) * | 2015-12-14 | 2016-03-02 | 科化新材料泰州有限公司 | Preparation method of epoxy resin composition for semiconductor packaging |
| CN107286871B (en) * | 2017-06-07 | 2019-06-14 | 江苏泰特尔新材料科技有限公司 | A kind of packaging adhesive film material used for solar batteries |
| CN111978814A (en) * | 2020-08-04 | 2020-11-24 | 天津凯华绝缘材料股份有限公司 | Solvent-resistant halogen-free flame-retardant epoxy powder composition and preparation method thereof |
| CN113265210A (en) * | 2021-05-17 | 2021-08-17 | 北京中天鹏宇科技发展有限公司 | Adhesive with high electric and heat conductivity and preparation method thereof |
| CN113372844B (en) * | 2021-06-08 | 2022-10-14 | 北京中天鹏宇科技发展有限公司 | High-temperature-resistant epoxy resin conductive adhesive and preparation method thereof |
-
2021
- 2021-09-13 CN CN202111069101.0A patent/CN113798037B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN113798037A (en) | 2021-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101503194B (en) | Preparation of active high purity silica flour | |
| CN106883838A (en) | A kind of vitreous china ball proppant of extremely-low density high intensity and preparation method thereof | |
| CN102604439A (en) | Surface modification method of hollow glass beads | |
| CN107971502A (en) | A kind of preparation method of high dispersiveness spherical silver powder | |
| CN108102393A (en) | A kind of preparation method of the electromagnetic wave absorbent material based on ferrite solid waste | |
| WO2019235234A1 (en) | Method for producing glass-coated aluminum nitride particles, and method for producing heat-dissipating resin composition containing said glass-coated aluminum nitride particles | |
| CN109382193A (en) | A kind of preparation method of superfine powdery material | |
| CN110683578A (en) | Production method of high-activity electrofused zirconia | |
| CN113798037B (en) | Raw material pretreatment process suitable for chip packaging materials with different properties | |
| CN105948096A (en) | Method for hydrothermal technology synthesis of calcium sulfate hemihydrates powder particles | |
| CN109761271A (en) | A method of recycling titaniferous fines | |
| CN113666380B (en) | Preparation method of spherical silicon dioxide | |
| CN109929321A (en) | Offset litho printing ink and its preparation process | |
| CN1233736C (en) | Toughened epoxy resin composition and its preparation method | |
| CN108300474A (en) | A method of preparing nano yttrium aluminum garnet fluorescent powder | |
| CN101759820A (en) | Nano-polymer composite material and preparation method thereof | |
| CN107986773B (en) | Manganese-zinc ferrite ball material | |
| CN113801499A (en) | Preparation method of silane quaternary ammonium salt modified nano silicon dioxide | |
| CN110373085A (en) | A kind of surface of steel workpiece Special electromagnetic shielding coating | |
| CN101898894B (en) | Method for preparing beta-Al2O3 precursor powder by spray drying taking water as medium | |
| AU2003212250B8 (en) | Method for producing and treating epoxide resin moulding materials | |
| CN106673666A (en) | Preparation method of high-hardness special ceramic | |
| CN113831760A (en) | Preparation method of modified silica and modified silica | |
| CN109809749A (en) | A kind of construction method of graphite alkenes cement-base composite material | |
| CN112624652A (en) | High-performance concrete admixture and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220610 Address after: 201600 floor 5, building 2, No. 261, sanbang Road, Songjiang District, Shanghai Applicant after: SHANGHAI RELAND PHOTOVOLTAIC MATERIAL Co.,Ltd. Address before: 215500 building 3, No.10, Jindu Road, Southeast street, Changshu City, Suzhou City, Jiangsu Province Applicant before: Suzhou ruilang New Material Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |