CN113793828B - Method for taking and placing granular chips - Google Patents
Method for taking and placing granular chips Download PDFInfo
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- CN113793828B CN113793828B CN202111067695.1A CN202111067695A CN113793828B CN 113793828 B CN113793828 B CN 113793828B CN 202111067695 A CN202111067695 A CN 202111067695A CN 113793828 B CN113793828 B CN 113793828B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention relates to the technical field of bulk chip picking and placing equipment, in particular to a bulk chip picking and placing method, which comprises the following specific operation steps: s1: firstly, the rocking disc is connected with vacuum equipment through a rocking disc vacuum interface, then the chip is poured into the rocking disc and rocked back and forth, the forward chip can automatically fall into the die cavity and be sucked by vacuum, after the reverse chip falls into the die cavity, the periphery of the die cavity is also inclined due to the inclined surface of the upper surface of the chip, the chip can not be clamped in the die cavity and can not slide out, the invention can ensure that the position accuracy of the chip can reach 0.05mm by the cooperation of the devices, ensure that the solder paste point can be completely at the center of the chip, and improve the yield and the stability of products.
Description
Technical Field
The invention relates to the technical field of bulk chip picking and placing equipment, in particular to a bulk chip picking and placing method.
Background
In electronics, a way to miniaturize circuits (mainly including semiconductor devices, as well as passive components, etc.) is often fabricated on the surface of a semiconductor wafer. The foregoing integrated circuits in which circuits are fabricated on the surface of a semiconductor chip are also called thin film integrated circuits. Another thick film hybrid integrated circuit is a miniaturized circuit comprised of separate semiconductor devices and passive components integrated into a substrate or wiring board. The present disclosure relates to monolithic integrated circuits, i.e., thin film integrated circuits.
At present, the taking and placing of the shot chips are all adhesive, the size of the solder paste points in the mode is difficult to control, the chips are easy to short, the adhesive needle is easy to deform, the replacement is tedious, and the adjustment is troublesome.
Therefore, a method for picking and placing the shot chips is necessary.
Disclosure of Invention
Therefore, the invention provides a method for taking and placing the shot chips, which aims to solve the problems that the existing shot chips are viscose, the solder paste point size is difficult to control, the chips are easy to short, viscose needles are easy to deform, the replacement is complicated and the adjustment is troublesome.
In order to achieve the above object, the present invention provides the following technical solutions: a method for taking and placing a shot chip comprises the following specific operation steps:
s1: firstly, connecting a rocking disc with vacuum equipment through a rocking disc vacuum interface, then pouring chips into the rocking disc, rocking back and forth, enabling forward chips to automatically fall into a die cavity and be sucked by vacuum, and after reverse chips fall into the die cavity, enabling the periphery of the die cavity to be inclined surfaces due to the fact that the upper surfaces of the chips are inclined surfaces, enabling the chips to be unable to be clamped in the die cavity and slide out, enabling other forward chips to continuously slide into the die cavity, and filling all the die cavities;
s2: after the shake disc shakes up the chip, the shake disc is placed on a shake disc placing rack above a shake disc placing table, the shake disc placing rack is provided with two positions, and one shake disc chip is automatically switched to the other shake disc after being used up;
s3: after the rocking disc is placed on the rocking disc placing rack, starting a motor a, wherein the motor a drives a screw rod to rotate, and a rocking disc placing table arranged during rotation of the screw rod drives the rocking disc to move to the position right below a main fixing plate;
s4: then the motor c on the Z-axis manipulator drives the electric slide rail b to enable the sliding fixing frame to drive the main fixing plate to move downwards, then the vacuum chamber in the suction nozzle fixing plate is vacuumized through the vacuum equipment, then the suction nozzle fixing plate can suck the chip through the rubber suction nozzle, and before the rubber suction nozzle is contacted with the chip, the angle of the suction nozzle fixing plate is finely adjusted through the X-direction rotating adjusting block, the Y-direction rotating adjusting block and the horizontal direction adjusting block, so that the rubber suction nozzle can be completely attached to the chip on the rocking disc;
s5: after the rubber suction nozzle is completely attached, the vacuum flow sensor detects the vacuum value at the suction nozzle fixing plate, when the vacuum value measured by the vacuum flow sensor does not reach a set value, the vacuum flow sensor stops alarming, prompting, checking and confirming, if the vacuum value measured by the vacuum flow sensor reaches the set value, the Z-axis manipulator controls the main fixing plate to move upwards, and the motor b in the Y-axis manipulator moves the fixing assembly to the right side through the electric sliding rail a, so that the suction nozzle fixing plate moves to the right above the welding plate;
s6: the Z-axis manipulator can control the main fixing plate to move downwards, so that the rubber suction nozzle is contacted with the upper end part of the welding disc, then the vacuum equipment is closed, and the chip can fall onto the welding disc from the rubber suction nozzle.
Preferably, the outer wall fixedly connected with backup pad of electronic slide rail a bottom, the backup pad bottom end is fixed with the support column through bolted connection's mode, electronic slide rail a right side end is fixed with motor b through the mode of rotating connection, motor b bottom and backup pad fixed connection.
Preferably, the bottom of the outer wall of the left side end of the rocking disc placing table is provided with a motor a, the right side end of the motor a is fixedly provided with a screw rod in a rotating connection mode, the bottom end of the rocking disc placing table is connected with the screw rod in a sleeving manner in a threaded connection mode, the top end of the rocking disc placing table is provided with rocking disc placing racks, the rocking disc placing racks are provided with two groups, and the rocking disc placing racks are connected with the rocking disc in a clamping manner.
Preferably, the edge of the outer wall of the top end of the rocking disc is fixedly connected with a rocking disc flange, the outer wall of the top end of the rocking disc is provided with a mould cavity, and the periphery of the mould cavity is provided with inclined planes.
Preferably, a rocking disc vacuum interface is fixed on the outer wall of the front end of the rocking disc, a vacuum hole is formed in the bottom end of the mold cavity, and the vacuum hole is connected with the rocking disc vacuum interface.
Preferably, the Z-axis manipulator comprises an electric slide rail b, a motor c is fixedly connected to the top end of the electric slide rail b, the sliding fixing frame is connected with the electric slide rail b in a sliding connection mode, a Y-direction rotating adjusting block is fixed to the bottom end of the sliding fixing frame in a rotating connection mode, a Y-direction rotating adjusting block is arranged at the bottom end of the Y-direction rotating adjusting block, and a horizontal-direction adjusting block is arranged at the left end of the Y-direction rotating adjusting block.
Preferably, the Y is to rotatory piece bottom fixedly connected with X to rotatory piece of transferring, X is to rotatory piece bottom and main fixed plate top outer wall connection of transferring, main fixed plate bottom is provided with the suction nozzle fixed plate through bolted connection's mode, be provided with the vacuum chamber in the suction nozzle fixed plate, the suction nozzle fixed plate is provided with the sealing washer in the junction with main fixed plate.
Preferably, the bottom end part of the suction nozzle fixing plate is provided with rubber suction nozzles in an array mode.
Preferably, the front end part of the Z-axis manipulator is provided with a fixing assembly, a vacuum flow sensor is fixedly connected to the fixing assembly, and the vacuum flow sensor is matched with the vacuum chamber for use.
The beneficial effects of the invention are as follows: the invention can ensure that the position accuracy of the chip placement can reach 0.05mm through the cooperation of the devices, ensure that the solder paste point can be completely at the center of the chip, and improve the yield and the stability of the product.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention in front view;
FIG. 2 is a schematic side view of the present invention;
FIG. 3 is an enlarged schematic view of the structure of FIG. 2A according to the present invention;
FIG. 4 is a schematic top view of the present invention;
FIG. 5 is a schematic top view of a rocker plate of the present invention;
FIG. 6 is a schematic cross-sectional side view of a rocker plate of the present invention;
fig. 7 is an enlarged schematic view of the structure of fig. 6B according to the present invention.
In the figure: 100. a rocking disc placing table; 110. a motor a; 120. a screw rod; 130. a rocking disc placing rack; 200. a rocking disc; 210. a rocker vacuum interface; 220. a rocking disc flange; 230. a mold cavity; 231. a vacuum hole; 300. a main fixing plate; 310. a suction nozzle fixing plate; 311. rubber suction nozzle; 320. rotating the adjusting block in the X direction; 330. y-direction rotating adjusting block; 340. adjusting blocks in the horizontal direction; 400. a fixing assembly; 410. a Z-axis manipulator; 420. a vacuum flow sensor; 430. a sliding fixing frame; 440. a support column; 500. a Y-axis manipulator; 510. an electric slide rail a; 520. a motor b; 600. and welding the disc.
Detailed Description
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present invention only, and are not intended to limit the present invention.
Referring to fig. 1-7, the method for picking and placing the granular chips provided by the invention comprises the following specific operation steps:
s1: firstly, the rocking disc 200 is connected with vacuum equipment through the rocking disc vacuum interface 210, then chips are poured into the rocking disc 200 and rock back and forth, forward chips automatically fall into the die cavity 230 and are sucked by vacuum, after reverse chips fall into the die cavity 230, the periphery of the die cavity 230 is also inclined due to the inclined surface of the upper surface of the chips, and the chips cannot be clamped in the die cavity and slide out, and other forward chips continuously slide into the die cavity 230, so that all the die cavities 230 are filled;
s2: after the shake disc 200 shakes up the chip, the shake disc is placed on a shake disc placing rack 130 above the shake disc placing table 100, the shake disc placing rack 130 is designed with two positions, and one shake disc chip is automatically switched to the other shake disc 200 after being used up;
s3: after the rocking disc 200 is placed on the rocking disc placing frame 130, the motor a110 is started, the motor a110 drives the screw rod 120 to rotate, and the rocking disc placing table 100 arranged during rotation of the screw rod 120 drives the rocking disc 200 to move to the position right below the main fixing plate 300;
s4: then, the motor c on the Z-axis manipulator 410 drives the electric slide rail b to enable the sliding fixing frame 430 to drive the main fixing plate 300 to move downwards, then the vacuum chamber in the suction nozzle fixing plate 310 is vacuumized through vacuum equipment, then the suction nozzle fixing plate 310 can suck the chip through the rubber suction nozzle 311, and before the rubber suction nozzle 311 contacts with the chip, the angle of the suction nozzle fixing plate 310 is finely adjusted through the X-direction rotating adjusting block 320, the Y-direction rotating adjusting block 330 and the horizontal direction adjusting block 340, so that the rubber suction nozzle 311 can be completely attached to the chip on the rocking disc 200;
s5: after the rubber suction nozzle 311 is completely attached, the vacuum flow sensor 420 detects the vacuum value at the suction nozzle fixing plate 310, when the vacuum value measured by the vacuum flow sensor 420 does not reach the set value, the machine is stopped, alarming, prompting, checking and confirming are carried out, if the vacuum value measured by the vacuum flow sensor 420 reaches the set value, the Z-axis manipulator 410 controls the main fixing plate 300 to move upwards, and the motor b520 in the Y-axis manipulator 500 moves the fixing assembly 400 to the right side through the electric sliding rail a510, so that the suction nozzle fixing plate 310 moves to the right above the welding disk 600;
s6: the provided Z-axis robot 410 controls the main fixing plate 300 to move downward so that the rubber suction nozzle 311 contacts the upper end of the bonding pad 600, and then the vacuum apparatus is turned off, and the chip falls onto the bonding pad 600 from the rubber suction nozzle 311.
Further, the outer wall of the bottom end of the electric slide rail a510 is fixedly connected with a supporting plate, the bottom end of the supporting plate is fixedly connected with a supporting column 440 in a bolt connection manner, the right end of the electric slide rail a510 is fixedly connected with a motor b520 in a rotating connection manner, the bottom end of the motor b520 is fixedly connected with the supporting plate, the electric slide rail a510 and the electric slide rail b are respectively composed of a screw rod and a straight slide rail, and the Y-axis manipulator 500 is arranged for moving the main fixing plate 300 adsorbed with the chip from above the rocking disc placing table 100 to above the welding disc 600;
further, a motor a110 is arranged at the bottom of the outer wall of the left side end of the rocking disc placing table 100, a screw rod 120 is fixed at the right side end of the motor a110 in a rotating connection manner, the bottom end of the rocking disc placing table 100 is connected with the screw rod 120 in a sleeving manner in a threaded connection manner, a rocking disc placing rack 130 is arranged at the top end of the rocking disc placing table 100, two groups of rocking disc placing racks 130 are arranged, the rocking disc placing racks 130 are connected with the rocking disc 200 in a clamping manner, specifically, the motor a110 is arranged to drive the screw rod 120 to rotate, and the screw rod 120 can drive the rocking disc placing table 100 to move left and right when rotating, so that a main fixing plate 300 can absorb chips of rocking discs 200 fixed on the two groups of rocking disc placing racks 130;
further, a rocking disc flange 220 is fixedly connected to the edge of the outer wall of the top end of the rocking disc 200, a mold cavity 230 is formed in the outer wall of the top end of the rocking disc 200, inclined planes are formed around the mold cavity 230, specifically, the rocking disc flange 220 is arranged to prevent a chip from being separated from the rocking disc 200 when a user rocks the rocking disc 200, the arranged mold cavity 230 is 0.1mm larger than the chip, the depth is equal to the depth of the chip, an inclined plane of 60 degrees is designed around the mold cavity 230, and inclined planes are formed on the back surface of the chip, so that only the front surface of the chip falls into the mold cavity 230 and can be sucked and fixed, and the back surface of the chip slides away from the mold cavity 230 when falling into the mold cavity 230, so that the front surface of the chip falls into the mold cavity 230 is ensured;
further, a hand-shake vacuum interface 210 is fixed on the outer wall of the front end of the hand-shake pan 200, a vacuum hole 231 is formed at the bottom end of the mold cavity 230, the vacuum hole 231 is connected with the hand-shake pan vacuum interface 210, specifically, a vacuum chamber a is processed at the bottom of the hand-shake pan 200, and the vacuum chamber a is communicated with the vacuum hole 231 and the hand-shake pan vacuum interface 210, so that the vacuum equipment can absorb and fix the chip through the vacuum chamber a and the vacuum hole 231;
further, the Z-axis manipulator 410 includes an electric slide rail b, a motor c is fixedly connected to the top end of the electric slide rail b, a sliding fixing frame 430 is connected to the electric slide rail b in a sliding connection manner, a Y-direction rotating adjustment block 330 is fixed to the bottom end of the sliding fixing frame 430 in a rotating connection manner, a Y-direction rotating adjustment block 330 is arranged at the bottom end of the Y-direction rotating adjustment block 330, a horizontal adjustment block 340 is arranged at the left end of the Y-direction rotating adjustment block 330, specifically, the Z-axis manipulator 410 is configured to adjust the height of the main fixing plate 300 through the sliding fixing frame 430, and the X-direction rotating adjustment block 320, the Y-direction rotating adjustment block 330 and the horizontal adjustment block 340 are configured to fine-tune the angle of the main fixing plate 300, so as to ensure that the main fixing plate 300 can adsorb all chips on the rocker 200 at one time;
further, the bottom end of the Y-direction rotating adjusting block 330 is fixedly connected with an X-direction rotating adjusting block 320, the bottom end of the X-direction rotating adjusting block 320 is connected with the outer wall of the top end of the main fixing plate 300, the bottom end of the main fixing plate 300 is provided with a suction nozzle fixing plate 310 in a bolt connection mode, a vacuum chamber is arranged in the suction nozzle fixing plate 310, and a sealing ring is arranged at the joint of the suction nozzle fixing plate 310 and the main fixing plate 300;
further, the bottom end of the nozzle fixing plate 310 is provided with rubber nozzles 311 in an array manner, specifically, the rubber nozzles 311 are provided to ensure that damage to the chip is reduced when the chip is sucked;
further, a fixed component 400 is arranged at the front end of the Z-axis manipulator 410, a vacuum flow sensor 420 is fixedly connected to the fixed component 400, the vacuum flow sensor 420 is matched with a vacuum chamber, specifically, the vacuum flow sensor 420 is arranged to measure the vacuum value in the vacuum chamber after the rubber suction nozzle 311 adsorbs a chip, and when the value does not reach a set value, the machine is stopped, an alarm prompt is given, and inspection and confirmation are carried out;
the application process of the invention is as follows: firstly, the rocking disc 200 is connected with vacuum equipment through the rocking disc vacuum interface 210, chips are poured into the rocking disc 200 and rock back and forth, a forward chip can automatically fall into the mould cavity 230 and is sucked by vacuum, after a reverse chip falls into the mould cavity 230, as the upper surface of the chip is an inclined surface, the periphery of the mould cavity 230 is also an inclined surface, the chips can not be clamped in the mould cavity and can slide out, other forward chips can continuously slide into the mould cavity 230, so that all the mould cavities 230 are filled, after the rocking disc 200 is rocked into the chips, the chips are placed on the rocking disc placing frame 130 above the rocking disc placing frame 100, after the rocking disc 200 is placed on the rocking disc placing frame 130, the motor a110 is started, the motor a110 can drive the lead screw 120 to rotate, the rocking disc placing frame 100 arranged during rotation of the lead screw 120 can drive the rocking disc 200 to move to the right under the main fixing plate 300, then the motor c on the Z-axis manipulator 410 drives the electric slide rail b to drive the slide fixing frame 430 to drive the main fixing plate 300 to move downwards, then the vacuum chamber in the suction nozzle fixing plate 310 is vacuumized through a vacuum device, then the suction nozzle fixing plate 310 can suck the chip through the rubber suction nozzle 311, before the rubber suction nozzle 311 is contacted with the chip, the angles of the suction nozzle fixing plate 310 are finely adjusted through the arranged X-direction rotating adjusting block 320, Y-direction rotating adjusting block 330 and horizontal direction adjusting block 340, so that the rubber suction nozzle 311 can be completely attached to the chip on the rocking disc 200, after the rubber suction nozzle 311 is completely attached, the vacuum flow sensor 420 is arranged to detect the vacuum value at the suction nozzle fixing plate 310, when the vacuum value measured by the vacuum flow sensor 420 does not reach a set value, the machine is stopped, alarming, prompting, checking and confirming are carried out, if the vacuum value measured by the vacuum flow sensor 420 reaches the set value, the arranged Z-axis manipulator 410 can control the main fixing plate 300 to move upwards, the motor b520 in the provided Y-axis robot 500 moves the fixing assembly 400 to the right through the electric slide rail a510, so that the nozzle fixing plate 310 moves right above the soldering land 600, the provided Z-axis robot 410 controls the main fixing plate 300 to move downward, so that the rubber nozzle 311 contacts with the upper end of the soldering land 600, and then the vacuum apparatus is turned off, and the chip falls onto the soldering land 600 from the rubber nozzle 311.
The above description is of the preferred embodiments of the present invention, and any person skilled in the art may modify the present invention or make modifications to the present invention with the technical solutions described above. Therefore, any simple modification or equivalent made according to the technical solution of the present invention falls within the scope of the protection claimed by the present invention.
Claims (9)
1. A method for taking and placing a shot chip is characterized by comprising the following steps: the specific operation steps are as follows:
s1: firstly, connecting a rocking disc (200) with vacuum equipment through a rocking disc vacuum interface (210), then pouring chips into the rocking disc (200), rocking back and forth, enabling forward chips to automatically fall into a die cavity (230) and be sucked by vacuum, enabling reverse chips to fall into the die cavity (230), and enabling the chips to be blocked in the die cavity and slide out due to the fact that the upper surfaces of the chips are inclined surfaces and the periphery of the die cavity (230) is also inclined surfaces, and enabling other forward chips to continuously slide into the die cavity (230), so that all the die cavities (230) are filled;
s2: after the shake disc (200) shakes up the chip, the shake disc is placed on a shake disc placing rack (130) above a shake disc placing table (100), the shake disc placing rack (130) is designed with two positions, and one shake disc chip is automatically switched to the other shake disc (200) after being used up;
s3: after the rocking disc (200) is placed on the rocking disc placing rack (130), the motor a (110) is started, the motor a (110) can drive the screw rod (120) to rotate, and the rocking disc placing table (100) arranged when the screw rod (120) rotates can drive the rocking disc (200) to move to the position right below the main fixing plate (300);
s4: then, the motor c on the Z-axis manipulator (410) drives the electric slide rail b to enable the sliding fixing frame (430) to drive the main fixing plate (300) to move downwards, then the vacuum chamber in the suction nozzle fixing plate (310) is vacuumized through vacuum equipment, then the suction nozzle fixing plate (310) can suck a chip through the rubber suction nozzle (311), and before the rubber suction nozzle (311) is contacted with the chip, the angle of the suction nozzle fixing plate (310) is finely adjusted through the arranged X-direction rotating adjusting block (320), Y-direction rotating adjusting block (330) and horizontal direction adjusting block (340), so that the rubber suction nozzle (311) can be completely attached to the chip on the rocking disc (200);
s5: after the rubber suction nozzle (311) is completely attached, the vacuum flow sensor (420) detects the vacuum value at the suction nozzle fixing plate (310), when the vacuum value measured by the vacuum flow sensor (420) does not reach a set value, the machine stops, alarming, prompting, checking and confirming, if the vacuum value measured by the vacuum flow sensor (420) reaches the set value, the Z-axis manipulator (410) controls the main fixing plate (300) to move upwards, and a motor b (520) in the Y-axis manipulator (500) enables the fixing assembly (400) to move to the right side through the electric sliding rail a (510), so that the suction nozzle fixing plate (310) moves to the right side above the welding plate (600);
s6: the arranged Z-axis mechanical arm (410) can control the main fixing plate (300) to move downwards, so that the rubber suction nozzle (311) is contacted with the upper end part of the welding disc (600), then the vacuum equipment is closed, and the chip can fall onto the welding disc (600) from the rubber suction nozzle (311).
2. The method for picking and placing the bulk chips as defined in claim 1, wherein the method comprises the following steps: the outer wall fixedly connected with backup pad of electronic slide rail a (510), backup pad bottom end is fixed with support column (440) through bolted connection's mode, electronic slide rail a (510) right side end is fixed with motor b (520) through the mode of swivelling joint, motor b (520) bottom end and backup pad fixed connection.
3. The method for picking and placing the bulk chips as defined in claim 1, wherein the method comprises the following steps: the novel rocking disc placing table is characterized in that a motor a (110) is arranged at the bottom of the outer wall of the left side end of the rocking disc placing table (100), a screw (120) is fixed at the right side end of the motor a (110) in a rotating connection mode, the bottom end of the rocking disc placing table (100) is connected with the screw (120) in a sleeving mode in a threaded connection mode, a rocking disc placing rack (130) is arranged at the top end of the rocking disc placing table (100), two groups of rocking disc placing racks (130) are arranged, and the rocking disc placing racks (130) are connected with a rocking disc (200) in a clamping mode.
4. The method for picking and placing the bulk chips as defined in claim 1, wherein the method comprises the following steps: the edge of the outer wall of the top end of the rocking disc (200) is fixedly connected with a rocking disc flange (220), a mould cavity (230) is formed in the outer wall of the top end of the rocking disc (200), and inclined planes are formed in the periphery of the mould cavity (230).
5. The method for picking and placing the bulk chips as defined in claim 4, wherein: the outer wall of the front end of the rocking disc (200) is fixedly provided with a rocking disc vacuum interface (210), the bottom end of the die cavity (230) is provided with a vacuum hole (231), and the vacuum hole (231) is connected with the rocking disc vacuum interface (210).
6. The method for picking and placing the bulk chips as defined in claim 1, wherein the method comprises the following steps: the Z-axis manipulator (410) comprises an electric sliding rail b, a motor c is fixedly connected to the top end of the electric sliding rail b, a sliding fixing frame (430) is connected with the electric sliding rail b in a sliding connection mode, a Y-direction rotating adjusting block (330) is fixed to the bottom end of the sliding fixing frame (430) in a rotating connection mode, a Y-direction rotating adjusting block (330) is arranged at the bottom end of the Y-direction rotating adjusting block (330), and a horizontal-direction adjusting block (340) is arranged at the left end of the Y-direction rotating adjusting block (330).
7. The method for picking and placing the bulk chips as defined in claim 6, wherein: the Y is to rotatory piece (330) bottom fixedly connected with X to rotatory piece (320) of transferring, X is to rotatory piece (320) bottom and main fixed plate (300) top outer wall connection of transferring, main fixed plate (300) bottom is provided with suction nozzle fixed plate (310) through bolted connection's mode, be provided with the vacuum chamber in suction nozzle fixed plate (310), suction nozzle fixed plate (310) are provided with the sealing washer in the junction with main fixed plate (300).
8. The method for picking and placing the bulk chips as defined in claim 7, wherein: the bottom end of the suction nozzle fixing plate (310) is provided with rubber suction nozzles (311) in an array mode.
9. The method for picking and placing the bulk chips as defined in claim 1, wherein the method comprises the following steps: the front end part of the Z-axis manipulator (410) is provided with a fixing assembly (400), a vacuum flow sensor (420) is fixedly connected to the fixing assembly (400), and the vacuum flow sensor (420) is matched with the vacuum chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111067695.1A CN113793828B (en) | 2021-09-13 | 2021-09-13 | Method for taking and placing granular chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111067695.1A CN113793828B (en) | 2021-09-13 | 2021-09-13 | Method for taking and placing granular chips |
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| CN113793828A CN113793828A (en) | 2021-12-14 |
| CN113793828B true CN113793828B (en) | 2023-06-23 |
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| CN109473386A (en) * | 2018-12-28 | 2019-03-15 | 乐山希尔电子股份有限公司 | A kind of semiconductor devices assemble method and its production line |
| CN109841546A (en) * | 2019-03-05 | 2019-06-04 | 苏州旭芯翔智能设备有限公司 | A kind of diode rectifier production system |
| CN211803306U (en) * | 2020-02-19 | 2020-10-30 | 江苏新智达新能源设备有限公司 | Automatic punching and tray loading device for soldering lug processing |
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2021
- 2021-09-13 CN CN202111067695.1A patent/CN113793828B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103433585A (en) * | 2013-07-30 | 2013-12-11 | 杭州电子科技大学 | Synchronous pulley type automatic brazing machine |
| CN109473386A (en) * | 2018-12-28 | 2019-03-15 | 乐山希尔电子股份有限公司 | A kind of semiconductor devices assemble method and its production line |
| CN109841546A (en) * | 2019-03-05 | 2019-06-04 | 苏州旭芯翔智能设备有限公司 | A kind of diode rectifier production system |
| CN211803306U (en) * | 2020-02-19 | 2020-10-30 | 江苏新智达新能源设备有限公司 | Automatic punching and tray loading device for soldering lug processing |
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