CN113793825A - Automatic production equipment for semiconductor circuit - Google Patents
Automatic production equipment for semiconductor circuit Download PDFInfo
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- CN113793825A CN113793825A CN202111116180.6A CN202111116180A CN113793825A CN 113793825 A CN113793825 A CN 113793825A CN 202111116180 A CN202111116180 A CN 202111116180A CN 113793825 A CN113793825 A CN 113793825A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses an automatic production device of a semiconductor circuit, which comprises: the first conveying line is used for conveying the semiconductor circuit which is subjected to plastic package molding; the curing fixture is arranged at the tail end of the first conveying line and used for loading the plurality of the semiconductor circuits which are subjected to plastic package molding; the driving mechanism is arranged on the first conveying line and used for driving the curing clamp to move so as to load the semiconductor circuit at the tail end of the first conveying line into the curing clamp; the baking oven is used for post-curing baking of the semiconductor circuit which is formed by plastic package; and the second conveying line is butted with the first conveying line and is used for conveying the curing clamp filled with the semiconductor circuit into the baking box. The invention adopts a full-automatic mode to carry out post-curing on the semiconductor circuit which is formed by plastic package, thereby greatly improving the production efficiency of the semiconductor circuit and simultaneously improving the production quality of the semiconductor circuit.
Description
Technical Field
The invention relates to the field of power semiconductors, in particular to automatic production equipment of a semiconductor circuit.
Background
The semiconductor circuit is a power driving product combining power electronics and integrated circuit technology, integrates an intelligent control IC, high-power devices for power output such as an IGBT, a MOSFET and an FRD and some resistance-capacitance elements, and the devices are welded on an aluminum substrate through tin-based solder.
The production of the semiconductor circuit comprises two processes of plastic package forming and post-curing baking, wherein a semi-finished product is obtained after the plastic package forming, and then the semi-finished product is baked by an oven to obtain a finished product. Specifically, the staff toasts case power inspection earlier, ensures to toast the case and is in the outage state, then opens the oven door to the case is toasted in the platform truck pull-out that will be equipped with the postcure shelf. Then the cartridge clip loaded with the semi-finished product is placed into a curing fixture, the cartridge clip must be placed into the upper positioning pin and the lower positioning pin, then the nut can be tightened, the fixture is placed according to the regulations from left to right and from top to bottom, and the fixture nut is tightened to enable the module to be compressed.
Whether each clamp is fastened or not is checked, and the clamps are put in place and need to be checked one by one after being put, so that omission is avoided, and quality accidents are avoided. Impel the case of toasting with the postcure shelf, need certainly to the interface with the platform truck right, must pin the platform truck positioning lock and open postcure shelf positioning lock when pushing away the postcure shelf, need help alone to withstand the platform truck when pushing away the postcure shelf, the postcure shelf must lock the positioning lock of shelf after entering.
And closing the oven door, sequentially opening an oven power switch, a heating switch and a timing switch, confirming that the automatic constant temperature is 175 ℃, the overtemperature protection temperature is 195 ℃, timing is 4H, automatically stopping heating the oven after the constant temperature is finished for 4 hours, opening the oven door, and naturally cooling the semiconductor circuit. And after cooling to 60 ℃, closing a power switch, pushing out the oven frame, loosening the clamp nut, taking out the cartridge clip, and completing the post-curing and baking production link.
It is known that the conventional semiconductor circuit production requires manual work to place the cartridges loaded with the semi-finished products one by one in the curing jig, and also requires a large amount of manual work in the post-curing process, and therefore, the degree of automation is low, resulting in low production efficiency of the semiconductor circuit.
Disclosure of Invention
The invention mainly aims to provide automatic production equipment of a semiconductor circuit, and aims to solve the technical problem of low production efficiency of the conventional semiconductor circuit.
In order to achieve the above object, the present invention provides an automated manufacturing apparatus for a semiconductor circuit, comprising:
the first conveying line is used for conveying the semiconductor circuit which is subjected to plastic package molding;
the curing fixture is arranged at the tail end of the first conveying line and used for loading the plurality of the semiconductor circuits which are subjected to plastic package molding;
the driving mechanism is arranged on the first conveying line and used for driving the curing clamp to move so as to load the semiconductor circuit at the tail end of the first conveying line into the curing clamp;
the baking oven is used for post-curing baking of the semiconductor circuit which is formed by plastic package;
and the second conveying line is butted with the first conveying line and is used for conveying the curing clamp filled with the semiconductor circuit into the baking box.
Preferably, the curing jig includes bottom plate and a plurality of locating cartridge clip storehouse on the bottom plate, cartridge clip storehouse sets up along vertical direction, cartridge clip storehouse's inner structure has the cavity, it has a plurality of being used for the clamping to pile up in the cavity semiconductor circuit's cartridge clip, one side in cartridge clip storehouse be equipped with the cavity communicates with each other, is used for supplying semiconductor circuit gets into first opening in the cartridge clip.
Preferably, the curing fixture further comprises a cartridge clip pressing mechanism, the cartridge clip pressing mechanism comprises a top plate arranged above the bottom plate, a pressing plate arranged between the top plate and the bottom plate, a first guide pillar arranged between the pressing plate and the bottom plate, and a second guide pillar arranged between the top plate and the bottom plate, the pressing plate is connected with the top plate through a connecting rod, a locking nut is arranged on the second guide pillar, and the pressing plate can move along the vertical direction.
Preferably, the bottom of the pressure strip is provided with a plurality of pressing blocks for being inserted into the cartridge clip bin, a second opening is arranged above the cartridge clip bin, and the second opening is matched with the pressing blocks.
Preferably, the automatic production equipment of the semiconductor circuit further comprises a telescopic spring sleeved on the connecting rod.
Preferably, the number of the cartridge clip bins is four, and the four cartridge clip bins are respectively positioned in the front, back, left and right directions of the bottom plate.
Preferably, the automatic production equipment for the semiconductor circuit further comprises an electric wrench arranged on one side of the curing clamp, and the electric wrench is used for automatically locking the locking nut.
Preferably, bake out the case and include the box and a plurality of locate bake out the district in the box, it is a plurality of bake out the district and stack gradually the setting along vertical direction, every layer bake out the district and correspond different stoving temperatures, each layer bake out and pass through the third transfer chain conveying between the district solidification anchor clamps.
Preferably, the baking area is set to be three layers, and the three layers of baking area correspond to the heating area, the constant temperature area and the cooling area in sequence.
Preferably, the conveying track of the constant-temperature area is arranged in an S shape.
Compared with the prior art, the embodiment of the invention has the beneficial technical effects that:
according to the invention, the semiconductor circuit on the first conveying line is automatically loaded in the curing fixture through the first driving mechanism, and then the curing fixture is automatically conveyed into the baking oven through the second conveying line, so that the semiconductor circuit loaded in the curing fixture is subjected to post-curing treatment, and finally a semiconductor circuit finished product is obtained. The invention adopts a full-automatic mode to carry out post-curing on the semiconductor circuit which is formed by plastic package, thereby greatly improving the production efficiency of the semiconductor circuit and simultaneously improving the production quality of the semiconductor circuit.
Drawings
FIG. 1 is a schematic diagram of an automated semiconductor circuit manufacturing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of a curing fixture in the embodiment of FIG. 1;
FIG. 3 is a temperature profile of the oven of the embodiment of FIG. 1;
fig. 4 is a schematic structural view of a constant temperature region of a baking oven according to another embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the present invention and should not be construed as limiting the present invention, and all other embodiments that can be obtained by one skilled in the art based on the embodiments of the present invention without inventive efforts shall fall within the scope of protection of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
It will also be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The semiconductor circuit provided by the invention is a circuit module which integrates a power switch device, a high-voltage driving circuit and the like together and is sealed and packaged on the outer surface, and is widely applied to the field of power electronics, such as the fields of frequency converters of driving motors, various inversion voltages, variable frequency speed regulation, metallurgical machinery, electric traction, variable frequency household appliances and the like. The semiconductor circuit herein may be referred to by various other names, such as Modular Intelligent Power System (MIPS), Intelligent Power Module (IPM), or hybrid integrated circuit, Power semiconductor Module, Power Module, etc. In the following embodiments of the present invention, collectively referred to as a Modular Intelligent Power System (MIPS).
Example one
Referring to fig. 1, the present invention provides an automated manufacturing apparatus for a modular smart power system, the automated manufacturing apparatus comprising:
the first conveying line 10 is used for conveying the plastic-packaged modular intelligent power system;
the curing fixture 20 is arranged at the tail end of the first conveying line 10 and used for loading the plurality of modularized intelligent power systems formed by plastic package;
the driving mechanism 30 is arranged on the first conveying line 10 and used for driving the curing fixture 20 to move so as to load the modular intelligent power system at the tail end of the first conveying line 10 into the curing fixture 20;
the baking oven 40 is used for post-curing baking of the plastic-packaged modular intelligent power system;
and the second conveying line 50 is butted with the first conveying line 10 and used for conveying the curing fixture 20 filled with the modular intelligent power system into the baking box 40.
In this embodiment, the first conveying line 10 is used to convey the plastic-encapsulated modular intelligent power system from the plastic-encapsulated molding device to the curing fixture 20, and the curing fixture 20 is located at the end position of the first conveying line 10, so as to load the modular intelligent power system conveyed by the first conveying line 10. The first conveying line 10 can be conveyed by a synchronous belt or by a roller, including but not limited to this, and a person skilled in the art can design the first conveying line according to actual situations.
Preferably, a photoelectric sensor may be disposed at the end position of the first conveying line 10, and when the modular intelligent power system to be plastically molded passes through the photoelectric sensor, an optical signal emitted by the photoelectric sensor will be blocked by the modular intelligent power system, so as to generate a signal change, so that the driving mechanism 30 can control the movement of the curing fixture 20 accordingly.
Further, the curing jig 20 is used for clamping the modular intelligent power system to be cured, and can clamp a plurality of modular intelligent power systems at a time. The curing jigs 20 are disposed in plural at the end position of the first conveyor line 10, so that after the first curing jig 20 is filled with the modular smart power system, the second curing jig 20 is mounted on the first conveyor line 10, and after the first curing jig 20 is filled with the modular smart power system, the curing jig 20 is conveyed into the baking oven 40 through the second conveyor line 50. In the process of conveying the curing fixture 20 by the second conveying line 50, the first conveying line 10 continuously conveys the plastic package molded modular intelligent power system to the empty curing fixture 20, so that the non-stop work can be ensured, and the production efficiency of the modular intelligent power system is further improved.
The second conveyor line 50 interfaces with the first conveyor line 10 for transporting the curing fixture 20 full of the modular smart power system into the bake chamber 40. A photo sensor may also be provided on the second conveyor line 50 to control the opening of the oven 40 when the photo sensor detects the curing jig 20, which is merely exemplary and not limiting.
Further, the driving mechanism 30 of the present embodiment can drive the curing jig 20 to move in the vertical direction and the horizontal direction, specifically, up, down, front, back, left, and right. That is, the curing jig 20 may be moved in a plurality of directions by the driving mechanism 30 so that the modular smart power system conveyed by the first conveyor line 10 is filled with the curing jig 20.
Preferably, the plastic-encapsulated modular smart power system provided in the present embodiment needs to be baked at a high temperature of 175 ℃ for 4 hours after being placed in the baking oven 40, which is merely exemplary and not limiting.
Example two
Referring to fig. 2, a curing jig 20 provided in this embodiment includes a bottom plate 21 and a plurality of magazine magazines 22 disposed on the bottom plate 21, the magazine magazines 22 are disposed along a vertical direction, a hollow cavity is formed inside the magazine 22, a plurality of magazines 23 for clamping the modular smart power system are stacked in the hollow cavity, and a first opening is disposed on one side of the magazine 22, the first opening being communicated with the hollow cavity and being used for allowing the modular smart power system to enter the magazine 23. In this embodiment, the curing jig 20 includes a bottom plate 21 serving as a mounting base, the bottom plate 21 is horizontally disposed, a plurality of cartridge clip bins 22 are disposed on the bottom plate 21 along a vertical direction, a hollow cavity for stacking the cartridge clips 23 is configured inside the cartridge clip bins 22, and the shape and size of the hollow cavity are matched with those of the cartridge clips 23. The cartridge clips 23 are used for clamping the modularized intelligent power system formed by plastic package, each cartridge clip 23 is provided with one modularized intelligent power system, and one side of the cartridge clip bin 22 is provided with a first opening communicated with the hollow cavity. When the modular intelligent power system is clamped, the modular intelligent power system enters the cartridge clip 23 from the first opening, and automatic clamping of the modular intelligent power system is achieved.
Specifically, the plastic-encapsulated modular intelligent power system is conveyed to the curing fixture 20 through the first conveying line 10, the modular intelligent power system is conveyed into the first cartridge clip 23 through the first opening, then the driving mechanism 30 drives the curing fixture 20 to integrally move up or down, so that the first cartridge clip 23 on which the modular intelligent power system is mounted moves up or down for a preset distance, the second cartridge clip 23 adjacent to the first cartridge clip 23 is aligned with the first conveying line 10, then the modular intelligent power system on the first conveying line 10 is conveyed into the second cartridge clip 23 through the first opening, and the steps are repeated in this way until the curing fixture 20 is filled with the modular intelligent power system.
According to the invention, the modular intelligent power system on the first conveying line is automatically loaded in the curing fixture through the first driving mechanism, and then the curing fixture is automatically conveyed into the baking oven through the second conveying line, so that the modular intelligent power system loaded in the curing fixture is subjected to post-curing treatment, and finally a finished product of the modular intelligent power system is obtained. The invention adopts a full-automatic mode to carry out post-curing on the modularized intelligent power system which is formed by plastic package, thereby greatly improving the production efficiency of the modularized intelligent power system and simultaneously improving the production quality of the modularized intelligent power system.
EXAMPLE III
Referring to fig. 2, the curing jig 20 of the present embodiment further includes a clip pressing mechanism 24, the clip pressing mechanism 24 includes a top plate 241 disposed above the bottom plate 21, a pressing plate 242 disposed between the top plate 241 and the bottom plate 21, a first guide post 243 disposed between the pressing plate 242 and the bottom plate 21, and a second guide post 244 disposed between the top plate 241 and the bottom plate 21, the pressing plate 242 and the top plate 241 are connected by a connecting rod 245, the second guide post 244 is provided with a lock nut 246, and the pressing plate 242 is movable in a vertical direction. In the present embodiment, a clip pressing mechanism 24 is provided above the base plate 21 in order to hold the clip 23 in a pressed state in the clip magazine 22. The clip pressing mechanism 24 includes a top plate 241, a pressing plate 242, a first guide post 243 and a second guide post 244, the top plate 241 is disposed opposite to the bottom plate 21 and above the bottom plate 21, the first guide post 243 is disposed between the bottom plate 21 and the pressing plate 242, the pressing plate 242 is movable on the first guide post 243 relative to the bottom plate 21, the second guide post 244 is disposed between the bottom plate 21 and the top plate 241, the top plate 241 is movable on the second guide post 244 relative to the bottom plate 21, and the second guide post 244 is disposed between the two first guide posts 243.
Further, the top plate 241 is connected to the pressing plate 242 by a connecting rod 245, and when the top plate 241 moves downward relative to the bottom plate 21, the pressing plate 242 is driven downward relative to the bottom plate 21 by the connecting rod 245. Furthermore, the second guide post 244 is provided with a lock nut 246, after the top plate 241 moves downward to a preset position, that is, the pressing plate 242 presses the cartridge clip 23 in the cartridge clip bin 22, and the pressing plate 242 is locked by the lock nut 246, which can be manually locked or locked by a robot, and those skilled in the art can design according to actual situations.
Example four
Referring to fig. 2, the bottom of the pressing plate 242 of the present embodiment is provided with a plurality of pressing blocks 247 for being inserted into the magazine 22, and a second opening is provided above the magazine 22 and is matched with the pressing blocks 247. In this embodiment, a plurality of pressing blocks 247 are disposed at the bottom of the pressing plate 242, and each pressing block 247 corresponds to one cartridge magazine 22. That is, the number of the pressing blocks 247 proposed in the present embodiment may be designed according to the number of the magazine 22, for example, if the magazine 22 is provided with three pressing blocks on the bottom plate 21, three pressing blocks 247 may be provided corresponding to the magazine 22, and all three pressing blocks 247 are provided on the bottom plate 21 of the pressing plate 242 to move together with the pressing plate 242. Further, a second opening is disposed above the magazine 22, and the cartridge clip 23 can be put into the magazine 22 through the second opening, and meanwhile, the pressing block 247 can be pressed into the hollow cavity through the second opening to press the cartridge clip 23 in the magazine 22.
EXAMPLE five
Referring to fig. 2, the automated manufacturing apparatus of the modular smart power system of the present embodiment further includes a retractable spring sleeved on the connecting rod 245. In this embodiment, when the top plate 241 drives the pressing plate 242 to move downward, the contact between the pressing plate 242 and the cartridge clip 23 is flexible contact, rather than rigid contact, so that the risk of damaging the cartridge clip 23 can be reduced, and the service life of the cartridge clip 23 can be prolonged.
EXAMPLE six
The cartridge magazine 22 of the present embodiment is provided with four cartridge magazines 22, and the four cartridge magazines 22 are respectively located in four directions of the bottom plate 21. In this embodiment, the left front cartridge magazine 22 is installed first, and during the installation, the driving mechanism 30 drives the curing fixture 20 to move up or down integrally, so as to fill the left front cartridge magazine 22; after the left front cartridge magazine 22 is full, the driving mechanism 30 drives the curing fixture 20 to move integrally to the right so that the right front cartridge magazine 22 is aligned with the modular intelligent power system on the first conveyor line 10, and then the driving mechanism 30 drives the curing fixture 20 to move integrally up or down so as to full the right front cartridge magazine 22; after the right front cartridge magazine 22 is full, the driving mechanism 30 drives the curing fixture 20 to integrally rotate 180 degrees, so that the left rear cartridge magazine 22 is aligned with the modular intelligent power system on the first conveyor line 10, and then the driving mechanism 30 drives the curing fixture 20 to integrally move up or down, so that the left rear cartridge magazine 22 is full; after the magazine 22 at the rear left is full, the driving mechanism 30 drives the curing jig 20 to move integrally to the right so that the curing jig 20 at the rear right is aligned with the modular smart power system on the first conveyor line 10, and then the driving mechanism 30 drives the curing jig 20 to move integrally up or down so as to full the magazine 22 at the rear right.
EXAMPLE seven
Referring to fig. 1, the automated manufacturing apparatus of the modular smart power system of the present embodiment further includes an electric wrench 70 disposed at one side of the curing jig 20, wherein the electric wrench 70 is used for automatically locking the locking nut 246. In this embodiment, in order to further improve the production efficiency of the modular smart power system, after the curing jig 20 is filled with the modular smart power system, the locking nut 246 on the curing jig 20 is locked by the electric wrench 70, so that the cartridge clip 23 in the cartridge clip bin 22 is in a compressed state. Specifically, when the electric wrench 70 receives a signal that the curing fixture 20 is full of the modular smart power system, the electric wrench 70 rotates the locking nut 246 clockwise until a set torque value is reached, and then the electric wrench 70 stops rotating and returns to the start-stop position to wait for the next operation.
Example eight
The case 40 of toasting that this embodiment provided includes that box and a plurality of the district of toasting of locating in the box stack gradually the setting along vertical direction in a plurality of toasting districts, and every layer of toasts the district and corresponds different toasting temperature, toasts and pass through third transfer chain conveying solidification anchor clamps 20 between the district in each layer. In this embodiment, be provided with a plurality of toasting zones that stack gradually along vertical direction in toasting case 40, every layer of toasting zone corresponds different toasting temperature, toasts and passes through third transfer chain conveying solidification anchor clamps 20 between the zone in each layer. Preferably, the curing jig 20 proposed in the present embodiment is in a moving state at all times, that is, the post-curing baking is performed on the modular smart power system in the curing jig 20 while conveying the same. Further, the third conveying line provided by the embodiment is a high-temperature-resistant conveying device.
Example nine
Referring to fig. 3, the baking area provided in this embodiment is set to three layers, and the three layers of baking areas correspond to the heating area, the constant temperature area and the constant temperature area in sequenceAnd (5) a cooling area. In this embodiment, the baking oven 40 is mainly divided into three areas, namely, an elevated temperature area, a constant temperature area and a cooling temperature area, and the modular intelligent power system needs to be baked at a high temperature of 175 ℃ for 4 hours at a constant temperature. Preferably, the heating area of the baking oven 40 proposed in the present embodiment is a single-layer conveying track, and the track length of the whole heating area is LLifting of wineThe transmission time is tLifting of wineAlso the temperature rise time of the oven 40 from 0 ℃ to 175 ℃ and the transport speed VLifting of wine＝LLifting of wine/tLifting of wine。
Example ten
Referring to fig. 4, the conveying track of the constant temperature area provided in this embodiment is disposed in an S-shape. In this embodiment, since the baking time of the single body is 4 hours, which is long, the constant temperature area of the baking oven 40 is designed to have four layers, and the transfer time of each layer is 1 hour. The conveying track of the constant temperature area is S-shaped, so that the transverse occupied space of the baking box 40 can be reduced, and the volume of the baking box 40 is reduced as much as possible. The curing fixture 20 enters a cooling area after being baked for 4 hours in a constant temperature area, the cooling area of the baking box 40 is a single-layer conveying track, and the length of the conveying track of the whole cooling area is LDescendThe transmission time is tDescendThe temperature of the oven 40 is reduced from 175 ℃ to 60 ℃ at a conveying speed VDescend＝LDescend/tDescend。
The above is only a part or preferred embodiment of the present invention, and neither the text nor the drawings should limit the scope of the present invention, and all equivalent structural changes made by the present specification and the contents of the drawings or the related technical fields directly/indirectly using the present specification and the drawings are included in the scope of the present invention.
Claims (10)
1. An automated manufacturing apparatus for semiconductor circuits, comprising:
the first conveying line is used for conveying the semiconductor circuit which is subjected to plastic package molding;
the curing fixture is arranged at the tail end of the first conveying line and used for loading the plurality of the semiconductor circuits which are subjected to plastic package molding;
the driving mechanism is arranged on the first conveying line and used for driving the curing clamp to move so as to load the semiconductor circuit at the tail end of the first conveying line into the curing clamp;
the baking oven is used for post-curing baking of the semiconductor circuit which is formed by plastic package;
and the second conveying line is butted with the first conveying line and is used for conveying the curing clamp filled with the semiconductor circuit into the baking box.
2. The automatic production equipment of the semiconductor circuit according to claim 1, wherein the curing jig comprises a bottom plate and a plurality of cartridge magazine disposed on the bottom plate, the cartridge magazine is disposed along a vertical direction, a hollow cavity is configured inside the cartridge magazine, a plurality of cartridges for clamping the semiconductor circuit are stacked in the hollow cavity, and a first opening communicated with the hollow cavity and used for allowing the semiconductor circuit to enter the cartridge magazine is disposed on one side of the cartridge magazine.
3. The apparatus of claim 2, wherein the curing jig further comprises a clip pressing mechanism, the clip pressing mechanism comprises a top plate disposed above the bottom plate, a pressing plate disposed between the top plate and the bottom plate, a first guide post disposed between the pressing plate and the bottom plate, and a second guide post disposed between the top plate and the bottom plate, the pressing plate is connected to the top plate via a connecting rod, and the second guide post is provided with a lock nut, and the pressing plate is movable in a vertical direction.
4. The apparatus of claim 3, wherein the bottom of the pressing plate is provided with a plurality of pressing blocks for being inserted into the cartridge magazine, and a second opening is provided above the cartridge magazine and is adapted to the pressing blocks.
5. The apparatus of claim 4, further comprising a retractable spring sleeved on the link.
6. The apparatus of any one of claims 1 to 5, wherein the number of the magazine is four, and the four magazine are respectively located in four directions of the bottom plate.
7. The apparatus of claim 5, further comprising a power wrench disposed at one side of the curing jig, wherein the power wrench is configured to automatically lock the lock nut.
8. The automated production equipment of a semiconductor circuit according to claim 1, wherein the baking oven includes a box body and a plurality of baking areas disposed in the box body, the plurality of baking areas are sequentially stacked in a vertical direction, each layer of baking area corresponds to a different baking temperature, and the curing jig is conveyed between the baking areas through a third conveying line.
9. The apparatus of claim 8, wherein the baking area is provided in three layers, and the three layers of baking area correspond to the heating area, the constant temperature area and the cooling area in sequence.
10. The automated manufacturing apparatus for semiconductor circuits according to claim 8, wherein the conveying track of the constant temperature zone is disposed in an S-shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111116180.6A CN113793825A (en) | 2021-09-23 | 2021-09-23 | Automatic production equipment for semiconductor circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111116180.6A CN113793825A (en) | 2021-09-23 | 2021-09-23 | Automatic production equipment for semiconductor circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113793825A true CN113793825A (en) | 2021-12-14 |
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ID=79184287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111116180.6A Pending CN113793825A (en) | 2021-09-23 | 2021-09-23 | Automatic production equipment for semiconductor circuit |
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| Country | Link |
|---|---|
| CN (1) | CN113793825A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114076522A (en) * | 2022-01-19 | 2022-02-22 | 中电科风华信息装备股份有限公司 | Full-automatic pressure curing equipment for semiconductor packaging |
-
2021
- 2021-09-23 CN CN202111116180.6A patent/CN113793825A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114076522A (en) * | 2022-01-19 | 2022-02-22 | 中电科风华信息装备股份有限公司 | Full-automatic pressure curing equipment for semiconductor packaging |
| CN114076522B (en) * | 2022-01-19 | 2022-03-29 | 中电科风华信息装备股份有限公司 | Full-automatic pressure curing equipment for semiconductor packaging |
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