CN113789043A - Heat-conducting junction box material and preparation method and application thereof - Google Patents

Heat-conducting junction box material and preparation method and application thereof Download PDF

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CN113789043A
CN113789043A CN202111153954.2A CN202111153954A CN113789043A CN 113789043 A CN113789043 A CN 113789043A CN 202111153954 A CN202111153954 A CN 202111153954A CN 113789043 A CN113789043 A CN 113789043A
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junction box
ppo
heat
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胡求学
王磊
闫烁
韩晓航
陈洪野
吴小平
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Cybrid Technologies Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
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    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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    • C08L2203/20—Applications use in electrical or conductive gadgets

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Abstract

The invention discloses a heat-conducting junction box material and a preparation method and application thereof. The heat-conducting junction box material comprises the following components in percentage by weight: 50-80% of matrix resin, 20-50% of heat-conducting filler, 0-6% of compatilizer, 0.2-1.5% of antioxidant and 1-5% of black master batch, wherein the matrix resin is an alloy formed by any one or a mixture of at least two of PPO, PC, PP, PA, PS, PE, PBT or ABS. The heat-conducting junction box material disclosed by the invention has the advantages that the heat-conducting property and the electric conductivity are improved, and meanwhile, the mechanical property of the material is ensured, so that the material is particularly suitable for preparing the heat-conducting junction box.

Description

Heat-conducting junction box material and preparation method and application thereof
Technical Field
The invention relates to the technical field of junction box materials, relates to a junction box material and a preparation method and application thereof, and particularly relates to a heat-conducting junction box material and a preparation method and application thereof.
Background
At present, most of the materials of the junction boxes used in the market are polyphenylene oxide (PPO) materials or modified alloy materials thereof. The PPO material has good mechanical property, creep resistance, water resistance, high temperature resistance and other properties, and is widely applied to the fields of electronic appliances and the like due to the excellent properties of the PPO material. The heat-conducting property of the existing product in actual use can not completely meet the use requirement, so a material with high heat-conducting property is developed.
CN102977603A discloses a high-temperature-resistant high-thermal-conductivity PPS/PPO alloy and a preparation method thereof, belonging to the technical field of high polymer materials. The PPS/PPO alloy consists of the following raw materials in percentage by weight: PPS 20-50%, PPO 8-10%, toughening compatilizer 5-8%, heat conducting agent 5-48%, carbon fiber 20-30%, antioxidant 0.2-0.5% and processing aid 0.8-1.5%. The high-temperature-resistant high-thermal-conductivity PPS/PPO alloy disclosed by the invention has the characteristics of high thermal conductivity, high strength, high impact, good processability and the like.
CN103436000A discloses a heat-conducting reinforced PPO/PA alloy and a preparation method thereof, belonging to the technical field of high polymer materials. The alloy comprises the following raw materials in parts by weight: 60-90 parts of polyphenyl ether, 50-80 parts of nylon, 2-4 parts of silicon carbide whiskers, 6-8 parts of carbon fibers, 12-16 parts of silicon micropowder, 2-5 parts of nano aluminum oxide, 10-20 parts of melamine pyrophosphate, 0.5-1 part of antioxidant, 0.5-1 part of lubricant TAF, 7-11 parts of toughening agent and 1-3 parts of maleic anhydride grafted ethylene-1-octene copolymer. The product prepared by the invention has good mechanical property, high stability, good flame retardant property and heat conductivity, and the alloy can replace part of metal raw materials to produce parts and shells.
The alloy material of the above patent adds carbon fiber as heat conductive material, and although the heat conductive property is improved and the electric conductivity of the material is also improved, the mechanical property of the material is also reduced, which limits the application of the material.
CN103289367A discloses a high-temperature-resistant heat-conducting PA/PPO/PP composite material, which is composed of the following components in parts by weight: PA15-30 parts, PPO45-70 parts, PP20-35 parts, anti-aging agent 2-8 parts, plasticizer 3-8 parts, titanium dioxide 6-10 parts, calcium carbonate 2-6 parts, dibutyltin maleate 3-7 parts and toughening agent 3-8 parts. Titanium dioxide and calcium carbonate are added into the composite material, but the two fillers have low self-thermal conductivity and low filling amount, so that the thermal conductivity of the material cannot be well improved when the filler is filled into the material.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a heat-conducting junction box material and a preparation method and application thereof.
One of the objectives of the present invention is to provide a heat conductive junction box material, and to achieve the objective, the present invention adopts the following technical scheme:
a heat-conducting junction box material comprises the following components in percentage by weight:
Figure BDA0003288077080000021
wherein the matrix resin is an alloy formed by any one or a mixture of at least two of PPO, PC, PP, PE, PA, PS, PBT or ABS.
The heat-conducting junction box material takes the alloy formed by any one or at least two mixtures of PPO, PC, PP, PA, PS, PBT or ABS as matrix resin, and the mechanical property of the material is ensured while the heat-conducting property and the electric conductivity are improved by adding the heat-conducting filler.
Specifically, the heat-conducting junction box material comprises the following components in percentage by weight:
the weight percentage of the matrix resin is 50-80%, for example, 50%, 55%, 60%, 65%, 70%, 75%, or 80%.
The weight percentage of the heat conductive filler is 20-50%, for example, 20%, 25%, 30%, 35%, 40%, 45%, 50%, or the like.
The weight percent of the compatibilizer is 0-6%, such as 1%, 2%, 3%, 4%, 5%, or 6%, and the like.
The antioxidant is 0.2 to 1.5% by weight, for example, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 1.1%, 1.2%, 1.3%, 1.4%, or 1.5%.
The weight percentage of the black master batch is 1-5%, for example, 1%, 2%, 3%, 4%, or 5%.
In the invention, the matrix resin is preferably PPO or PPO alloy.
In the invention, the PPO alloy is an alloy formed by PPO and any one or at least two of PS, PA, PPS, PBT and PP.
In the invention, the mass content of the PPO in the PPO alloy is 60-80%, for example, the mass content of the PPO is 60%, 65%, 70%, 75% or 80%. This is because the PPO material itself has excellent dielectric properties, water resistance, dimensional stability and the like, but also has problems of stress cracking, difficulty in processing and the like. So that the material is modified to have higher PPO content and better heat resistance.
In the invention, the PS is HIPS.
In the invention, the PA is any one or a mixture of at least two of PA6, PA66 and PA 12.
In the invention, the heat-conducting filler is any one or a mixture of at least two of aluminum oxide, magnesium oxide, zinc oxide, calcium oxide, nickel oxide, aluminum nitride, boron nitride, silicon carbide, beryllium oxide, zirconium diboride, zirconium carbide, high-heat-conductivity composite ceramic powder, carbon fiber, carbon black and graphite. Many fillers improve the thermal conductivity and the electrical conductivity of the material, but the addition of the fillers can reduce the mechanical properties of the material. The addition of the heat-conducting filler greatly improves the heat-conducting property of the material, and simultaneously also considers other properties of the material.
The compatilizer is any one or a mixture of at least two of N, N, N, N, -tetraglycidyl-4, 4-diaminobenzene methane, citric acid, styrene grafted maleic anhydride, polyphenyl ether grafted maleic anhydride, styrene-glycidyl methacrylate, styrene-butadiene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, ethylene propylene diene monomer, styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride and acrylonitrile-butadiene-styrene copolymer grafted maleic anhydride.
The antioxidant is beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid pentaerythritol ester, beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid octadecyl ester, N-bis [ beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionyl ] -1, 6-ethylenediamine, N-bis [ beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionyl ] hydrazine, 1,3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) 1,3, 5-triazine-2, 4,6- (1H,3H,5H) -trione, triethylene glycol ether-bis (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate, Any one or a mixture of at least two of 2, 2-ethylene-bis (4, 6-di-tert-butylphenol), tris (2, 4-di-tert-butylphenol) phosphite, dioctadecyl alcohol pentaerythritol diphosphite, bis (3, 5-di-tert-butylphenyl) pentaerythritol diphosphite and 3, 3-thiopropionic acid stearyl ester.
In the invention, the black master batch is a mixture of toner and matrix resin.
Preferably, the black master batch is a mixture of toner and matrix resin, wherein the matrix resin is an alloy formed by any one or at least two of PPO, PC, PP, PE, PA, PS, PBT or ABS.
Preferably, the mass ratio of the toner to the matrix resin is (20-40) to (60-80).
Preferably, the toner is carbon black.
The second purpose of the invention is to provide a preparation method of the heat-conducting junction box material, which comprises the following steps: and stirring and mixing the matrix resin, the heat-conducting filler, the compatilizer and the antioxidant according to the proportion, and performing extrusion granulation and drying to obtain the heat-conducting junction box material.
The invention also aims to provide application of the heat-conducting junction box material, and the heat-conducting junction box material is used for preparing a heat-conducting junction box.
Compared with the prior art, the invention has the beneficial effects that:
the heat-conducting junction box material disclosed by the invention has the advantages that the heat-conducting property and the electric conductivity are improved, and meanwhile, the mechanical property of the material is ensured. Specifically, the thermal conductivity coefficient of the thermal conductive junction box material prepared by the invention is 0.37-0.67W/DEG C.m, and the bulk resistance is 4.9 multiplied by 1015-8.9×1015Tensile strength of 31.7-75MPa and impact strength of 2.9-7.2KJ/m2。
Detailed Description
The technical solution of the present invention is further explained by the following embodiments.
Unless otherwise specified, various starting materials of the present invention are commercially available or prepared according to conventional methods in the art.
Example 1
The heat-conducting junction box material comprises the following components in percentage by weight: 72% of PPO resin, 15% of aluminum nitride, 5% of zirconium diboride, 4.5% of styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride, 0.5% of beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid pentaerythritol ester and 3% of black master batch, wherein the black master batch is a mixture of carbon black and PPO resin in a mass ratio of 20: 80.
The preparation method of the heat-conducting junction box material comprises the following steps: PPO, aluminum nitride, styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride and beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid pentaerythritol ester are mixed uniformly by a high-speed mixer according to the proportion, and after extrusion granulation, the temperature of each section of the extruder is as follows: drying at 150 deg.C in the first region, 220 deg.C in the second region, 250 deg.C in the third region, 255 deg.C in the fourth region, 260 deg.C in the fifth region, 265 deg.C in the sixth region, 270 deg.C in the seventh region, 275 deg.C in the eighth region, 275 deg.C in the ninth region and 275 deg.C in the tenth region, to obtain the final product.
Example 2
The heat-conducting junction box material comprises the following components in percentage by weight: 67% of PPO resin, 20% of boron nitride, 5% of zirconium diboride, 4.5% of styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride, 0.5% of beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid pentaerythritol ester and 3% of black master batch, wherein the black master batch is a mixture of carbon black and PPO resin in a mass ratio of 20: 80.
The preparation method of the heat-conducting junction box material comprises the following steps: PPO, boron nitride, styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride and beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid pentaerythritol ester are mixed uniformly by a high-speed mixer according to the proportion, and after extrusion granulation, the temperature of each section of the extruder is as follows: drying at 150 deg.C in the first region, 220 deg.C in the second region, 250 deg.C in the third region, 255 deg.C in the fourth region, 260 deg.C in the fifth region, 265 deg.C in the sixth region, 270 deg.C in the seventh region, 275 deg.C in the eighth region, 275 deg.C in the ninth region and 275 deg.C in the tenth region, to obtain the final product.
Example 3
The heat-conducting junction box material comprises the following components in percentage by weight: 57% of PPO resin, 30% of silicon carbide, 5% of high-thermal-conductivity composite ceramic powder, 4.5% of styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride, 0.5% of beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate pentaerythritol ester and 3% of black master batch, wherein the black master batch is a mixture of carbon black and PPO resin in a mass ratio of 20: 80.
The preparation method of the heat-conducting junction box material comprises the following steps: PPO, silicon carbide, styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride and beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid pentaerythritol ester are mixed uniformly by a high-speed mixer according to the proportion, and after extrusion granulation, the temperature of each section of the extruder is as follows: drying at 150 deg.C in the first region, 220 deg.C in the second region, 250 deg.C in the third region, 255 deg.C in the fourth region, 260 deg.C in the fifth region, 265 deg.C in the sixth region, 270 deg.C in the seventh region, 275 deg.C in the eighth region, 275 deg.C in the ninth region and 275 deg.C in the tenth region, to obtain the final product.
Example 4
The heat-conducting junction box material comprises the following components in percentage by weight: 47% of PPO resin, 35% of aluminum oxide, 10% of zirconium diboride, 4.5% of styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride, 0.5% of beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid pentaerythritol ester and 3% of black master batch, wherein the black master batch is a mixture of carbon black and PPO resin in a mass ratio of 20: 80.
The preparation method of the heat-conducting junction box material comprises the following steps: PPO, alumina, styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride and beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid pentaerythritol ester are mixed uniformly by a high-speed mixer according to the proportion, and after extrusion granulation, the temperature of each section of the extruder is as follows: drying at 150 deg.C in the first region, 220 deg.C in the second region, 250 deg.C in the third region, 255 deg.C in the fourth region, 260 deg.C in the fifth region, 265 deg.C in the sixth region, 270 deg.C in the seventh region, 275 deg.C in the eighth region, 275 deg.C in the ninth region and 275 deg.C in the tenth region, to obtain the final product.
Example 5
The heat-conducting junction box material comprises the following components in percentage by weight: 47% of PPO resin, 45% of a mixture of aluminum oxide, zirconium diboride and boron nitride (the mass ratio is 4:2:3), 4.5% of styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride, 0.5% of beta (3, 5-di-tert-butyl-4-hydroxyphenyl) pentaerythritol propionate and 3% of black master batch, wherein the black master batch is a mixture of carbon black and PPO resin with the mass ratio of 20: 80.
The preparation method of the heat-conducting junction box material comprises the following steps: PPO, alumina, styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride and beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid pentaerythritol ester are mixed uniformly by a high-speed mixer according to the proportion, and after extrusion granulation, the temperature of each section of the extruder is as follows: drying at 150 deg.C in the first region, 220 deg.C in the second region, 250 deg.C in the third region, 255 deg.C in the fourth region, 260 deg.C in the fifth region, 265 deg.C in the sixth region, 270 deg.C in the seventh region, 275 deg.C in the eighth region, 275 deg.C in the ninth region and 275 deg.C in the tenth region, to obtain the final product.
Example 6
The heat-conducting junction box material comprises the following components in percentage by weight: 47% of PPO alloy resin (wherein the mass ratio of PPO to PA is 7:3), 20% of aluminum oxide, 10% of boron nitride, 8% of zirconium diboride, 7% of high-thermal-conductivity composite ceramic powder, 4.5% of styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride, 0.5% of beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid pentaerythritol ester and 3% of black master batch, wherein the black master batch is a mixture of carbon black and the PPO alloy resin in a mass ratio of 20: 80.
The preparation method of the heat-conducting junction box material comprises the following steps: PPO, PA, silicon carbide, styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride and beta (3, 5-di-tert-butyl-4-hydroxyphenyl) pentaerythritol propionate are mixed uniformly by a high-speed mixer according to the proportion, and after extrusion granulation, the temperature of each section of the extruder is as follows: drying at 150 deg.C in the first region, 220 deg.C in the second region, 250 deg.C in the third region, 255 deg.C in the fourth region, 260 deg.C in the fifth region, 265 deg.C in the sixth region, 270 deg.C in the seventh region, 275 deg.C in the eighth region, 275 deg.C in the ninth region and 275 deg.C in the tenth region, to obtain the final product.
Example 7
The heat-conducting junction box material comprises the following components in percentage by weight: 47% of PPO alloy resin (wherein the mass ratio of PPO to PS is 7:3), 35% of silicon carbide, 10% of high-thermal-conductivity composite ceramic powder, 4.5% of styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride, 0.5% of beta (3, 5-di-tert-butyl-4-hydroxyphenyl) pentaerythritol propionate and 3% of black master batch, wherein the black master batch is a mixture of carbon black and the PPO alloy resin in a mass ratio of 20: 80.
The preparation method of the heat-conducting junction box material comprises the following steps: PPO, PA, silicon carbide, styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride and beta (3, 5-di-tert-butyl-4-hydroxyphenyl) pentaerythritol propionate are mixed uniformly by a high-speed mixer according to the proportion, and after extrusion granulation, the temperature of each section of the extruder is as follows: drying at 150 deg.C in the first region, 220 deg.C in the second region, 250 deg.C in the third region, 255 deg.C in the fourth region, 260 deg.C in the fifth region, 265 deg.C in the sixth region, 270 deg.C in the seventh region, 275 deg.C in the eighth region, 275 deg.C in the ninth region and 275 deg.C in the tenth region, to obtain the final product.
Example 8
This example is different from example 6 in that the PPO alloy has a PPO content of 40% by weight, and the other examples are the same as those of example 6.
Example 9
This example is different from example 6 in that the PPO alloy has 90% by weight of PPO, and the other examples are the same as those of example 6.
Example 10
This example differs from example 6 in that the PPO alloy was replaced with polycarbonate, and the rest was the same as example 6.
Example 11
This example is different from example 2 in that the heat conductive filler, boron nitride, was replaced with silica, and the others were the same as those of example 2.
Comparative example 1
The preparation method of the heat-conducting junction box material of the comparative example comprises the following steps: uniformly mixing 99.5% of PPO and 0.5% of beta (3, 5-di-tert-butyl-4-hydroxyphenyl) pentaerythritol propionate by a high-speed mixer, and performing extrusion granulation at the temperature of each section of the extruder: drying at 150 deg.C in the first region, 220 deg.C in the second region, 250 deg.C in the third region, 255 deg.C in the fourth region, 260 deg.C in the fifth region, 265 deg.C in the sixth region, 270 deg.C in the seventh region, 275 deg.C in the eighth region, 275 deg.C in the ninth region and 275 deg.C in the tenth region, to obtain the final product.
Comparative example 2
This comparative example differs from example 6 in that the amount of PPO alloy was 40% and the amount of reduced PPO alloy was increased on average to the other components to ensure that the total amount remained the same, all other things being equal to example 6.
Comparative example 3
This comparative example differs from example 6 in that the PPO alloy is used in an amount of 95% and the amount of PPO alloy added is on average subtracted from the other components to ensure that the total amount remains the same, all other things being equal to example 6.
Comparative example 4
This comparative example differs from example 6 in that the amount of the heat conductive filler was 1%, and the amount of the reduced heat conductive filler alloy was added on average to the other components to ensure that the total amount was constant, which were otherwise the same as those of example 6.
Comparative example 5
This comparative example is different from example 2 in that the amount of the heat conductive filler was 60%, and the amount of the heat conductive filler added was subtracted from the other components on average to ensure that the total amount was constant, which was otherwise the same as example 2.
Comparative example 6
This comparative example differs from example 2 in that the amount of the reduced heat conductive filler alloy was added on average to the other components to ensure that the total amount was constant, without adding the heat conductive filler, and the others were the same as in example 2.
Wherein, the PPO powder (the melt index is 4-40g/10min) manufacturers adopted in the above examples and comparative examples are Sabik in America, the high thermal conductivity composite ceramic powder manufacturers are Shanghai Shenyi New Material science and technology Co., Ltd, the junction box materials prepared in examples 1-11 and comparative examples 1-6 are subjected to performance tests, and the test results are shown in Table 1.
Wherein the test standard for thermal conductivity is performed in accordance with ASTM D5470; the test standard of the volume resistivity is carried out according to the GB/T1410-2006 standard; the test standard for tensile properties is carried out with reference to GB/T1040; the test standard for impact properties is carried out with reference to ISO 179.
TABLE 1
Figure BDA0003288077080000111
Figure BDA0003288077080000121
As can be seen from table 1, the thermally conductive junction box materials of examples 1 to 7 have good thermal conductivity and mechanical properties while maintaining good insulation properties. As the content of the heat-conducting filler is gradually increased, the heat conductivity coefficient of the PPO material is gradually increased, and the mechanical property is reduced. Compared with comparative example 1, the heat conductivity coefficient of all PPO materials added with the heat-conducting filler is improved.
Examples 6 and 7 show a better improvement in the processability of the material compared with example 5.
Too little weight percentage of the PPO alloy in example 8 results in a reduction of the mechanical properties of the material produced.
Too much weight percent of the PPO alloy in example 9 makes the forming of the resulting material difficult.
In the embodiment 10, the PPO alloy is replaced by PC resin, so that the mechanical property of the prepared material is reduced, and meanwhile, the mechanical property of the prepared composite material is reduced to a large extent by adding the inorganic filler.
The replacement of the thermally conductive filler in example 11 with silica did not significantly improve the thermal conductivity of the resulting material.
The pure PPO in the comparative example 1 has good mechanical property, but the heat conductivity is not high, so the pure PPO needs to be modified to improve the heat conductivity of the material.
Too little PPO alloy in comparative example 2 resulted in a reduction in the mechanical properties of the material produced.
Too much PPO alloy in comparative example 3 resulted in insufficient thermal conductivity of the resulting material.
The amount of the thermally conductive filler in comparative example 4 is too small, which results in a material having low thermal conductivity and is insufficient for improving the thermal conductivity of the material.
The comparative example 5, in which the amount of the heat conductive filler was too large, resulted in a better improvement in the heat conductive properties of the resulting material, but the material was severely deteriorated in mechanical properties due to the excessive addition of the inorganic substance.
The comparative example 6, in which no heat conductive filler is added, makes the obtained material have better mechanical properties and processability, but the application field of the material is limited due to poor heat conductive property in practical application.
The present invention is illustrated by the above-mentioned examples, but the present invention is not limited to the above-mentioned detailed process equipment and process flow, i.e. it is not meant to imply that the present invention must rely on the above-mentioned detailed process equipment and process flow to be practiced. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.

Claims (10)

1. The heat-conducting junction box material is characterized by comprising the following components in percentage by weight:
Figure FDA0003288077070000011
wherein the matrix resin is an alloy formed by any one or a mixture of at least two of PPO, PC, PP, PE, PA, PS, PBT or ABS.
2. The thermally conductive junction box material of claim 1, wherein the matrix resin is PPO or PPO alloy;
preferably, the PPO alloy is an alloy of PPO with any one or at least two of PS, PA, PPS, PBT and PP.
3. The material of claim 1 or 2, wherein the mass content of the PPO in the PPO alloy is 60-80%.
4. The thermally conductive junction box material of claim 2, wherein the PS is HIPS.
5. The thermally conductive junction box material of claim 2, wherein the PA is any one of PA6, PA66, and PA12 or a mixture of at least two thereof.
6. The material of any one of claims 1 to 5, wherein the thermally conductive filler is any one or a mixture of at least two of alumina, magnesia, zinc oxide, calcium oxide, nickel oxide, aluminum nitride, boron nitride, silicon carbide, beryllium oxide, carbon fiber, zirconium diboride, zirconium carbide, high thermal conductivity composite ceramic powder, carbon black, and graphite.
7. The thermally conductive junction box material of any one of claims 1-6 wherein the compatibilizer is any one or a mixture of at least two of N, N, N, N, -tetraglycidyl-4, 4-diaminodiphenylmethane, citric acid, styrene grafted maleic anhydride, polyphenylene ether grafted maleic anhydride, styrene-glycidyl methacrylate, styrene-butadiene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, ethylene propylene diene monomer, styrene-ethylene-butadiene-styrene block copolymer grafted maleic anhydride, and acrylonitrile-butadiene-styrene copolymer grafted maleic anhydride.
8. The thermally conductive junction box material of any one of claims 1 to 7 wherein the antioxidant is pentaerythritol beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate, octadecyl beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate, N-bis [ beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionyl ] -1, 6-ethylenediamine, N-bis [ beta (3, 5-di-tert-butyl-4-hydroxyphenyl) propionyl ] hydrazine, 1,3, 5-tris (4-tert-butyl-3-hydroxy-2, 6-dimethylbenzyl) 1,3, 5-triazine-2, 4,6- (1H,3H,5H) -any one or a mixture of at least two of triketone, triethylene glycol ether-bis (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate, 2-ethylene-bis (4, 6-di-tert-butylphenol), tris (2, 4-di-tert-butylphenol) phosphite, dioctadecyl alcohol pentaerythritol diphosphite, bis (3, 5-di-tert-butylphenyl) pentaerythritol diphosphite and stearyl 3, 3-thiopropionate;
preferably, the black master batch is a mixture of toner and matrix resin;
preferably, the mass ratio of the toner to the matrix resin is (20-40): (60-80);
preferably, the toner is carbon black.
9. A method of making the thermally conductive junction box material of any of claims 1-8, comprising the steps of: and stirring and mixing the matrix resin, the heat-conducting filler, the compatilizer and the antioxidant according to the proportion, and performing extrusion granulation and drying to obtain the heat-conducting junction box material.
10. Use of a thermally conductive junction box material according to any of claims 1 to 8 for the preparation of a thermally conductive junction box.
CN202111153954.2A 2021-09-29 2021-09-29 Heat-conducting junction box material and preparation method and application thereof Pending CN113789043A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101805509A (en) * 2010-03-26 2010-08-18 北京化工大学 Polyphenyl ether compound used for solar battery connecting box
CN102964803A (en) * 2012-11-19 2013-03-13 宁波瑞祥电器有限公司 Method for manufacturing solar photovoltaic module junction box
CN106589896A (en) * 2016-11-18 2017-04-26 江苏沃特新材料科技有限公司 High-impact-resistant polyphenyl-ether engineering plastic and preparing method and application thereof
CN110982245A (en) * 2019-12-17 2020-04-10 宁波华腾首研新材料有限公司 Modified polyphenyl ether resin material and preparation method and application thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101805509A (en) * 2010-03-26 2010-08-18 北京化工大学 Polyphenyl ether compound used for solar battery connecting box
CN102964803A (en) * 2012-11-19 2013-03-13 宁波瑞祥电器有限公司 Method for manufacturing solar photovoltaic module junction box
CN106589896A (en) * 2016-11-18 2017-04-26 江苏沃特新材料科技有限公司 High-impact-resistant polyphenyl-ether engineering plastic and preparing method and application thereof
CN110982245A (en) * 2019-12-17 2020-04-10 宁波华腾首研新材料有限公司 Modified polyphenyl ether resin material and preparation method and application thereof

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