CN113787240A - Manufacturing method of LED lamp string - Google Patents

Manufacturing method of LED lamp string Download PDF

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Publication number
CN113787240A
CN113787240A CN202111011837.2A CN202111011837A CN113787240A CN 113787240 A CN113787240 A CN 113787240A CN 202111011837 A CN202111011837 A CN 202111011837A CN 113787240 A CN113787240 A CN 113787240A
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CN
China
Prior art keywords
metal wire
welding
wire core
solder paste
wrapping sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111011837.2A
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Chinese (zh)
Inventor
尹华平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Huacaiwei Technology Co ltd
Original Assignee
Dongguan Huacaiwei Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Huacaiwei Technology Co ltd filed Critical Dongguan Huacaiwei Technology Co ltd
Priority to CN202111011837.2A priority Critical patent/CN113787240A/en
Publication of CN113787240A publication Critical patent/CN113787240A/en
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

The invention discloses a manufacturing method of an LED lamp string, which comprises the following steps: s001: preparing a lead and an LED device, and peeling off a rubber sheet of the lead to expose the metal wire core; s002: tin dispensing is carried out on the metal wire core and/or the welding leg of the LED device; s003: mounting a welding leg of the LED device on the metal wire core, then performing high-temperature welding to fixedly connect the welding leg with the metal wire core, and continuously repeating the steps S001-S003 to manufacture and form the LED lamp string; after the welding feet of the LED device are attached to the metal wire core, the solder paste attached between the metal wire core and the welding feet is preheated to 180 ℃ for 100 ℃, and then high-temperature welding is carried out, so that all the solder paste is completely melted and cooled and solidified, even if the wire is a thick wire with a large diameter, the size of the solder paste is wide, the solder paste is preheated, so that all the solder paste can be completely melted by high-temperature heating in a short time at a later stage, the rubber cannot be melted, the appearance attractiveness of the LED lamp string is ensured, the phenomenon of 'holes' cannot occur after welding, and the welding structure is firm.

Description

Manufacturing method of LED lamp string
The technical field is as follows:
the invention relates to the technical field of LED lamps, in particular to a manufacturing method of an LED lamp string.
Background art:
the LED device is generally referred to as an LED lamp bead or an LED light source, and generally includes a support and an LED chip packaged on the support. The current LED devices using RGB light sources usually have more than two pins because of the need of a built-in control chip unit. The holder of such LED devices usually comprises an insulating body, such as a plastic or ceramic holder. The insulating body is provided with an accommodating cavity, a plurality of conductive terminals are integrally and fixedly connected to the insulating body, and one ends of the conductive terminals extend into the accommodating cavity to form contact ends; the other end of the conductive terminal extends to an outer surface (usually a bottom surface) of the insulating body to form a solder fillet (also called a pad). During production, the LED chip and the control chip unit are fixed in the accommodating cavity and connected with the contact ends of the conductive terminals through the wires, and finally, the transparent plastic material for packaging is poured into the accommodating cavity, so that the packaging is completed, and the LED device is formed.
When the LED device product is used for manufacturing the LED lamp string, firstly, the rubber sheet on the wire is peeled off to expose the metal wire core, and then, the tin is dispensed on the metal wire core and/or the welding leg of the LED device, so that the tin paste is attached to the metal wire core and/or the welding leg of the LED device; and finally, attaching the welding feet of the LED device to the metal wire core, and welding at high temperature to fix the LED device on the lead wire to form an LED lamp string. Because the melting point of the solder paste is far greater than that of the rubber, when the solder paste attached between the metal wire core and the welding leg in the LED device is heated (namely welded), the heating time cannot be too long, otherwise the rubber connected with the exposed metal wire core in the wire can be melted due to too long high-temperature heating time, and the appearance and the quality of the whole LED lamp string are affected. Therefore, the time for heating the solder paste cannot be too long; for the thin wire, the diameter of the metal wire core is smaller than the width of the welding leg, the size of the solder paste between the metal wire core and the welding leg is relatively small, all the solder paste can be completely melted by heating for a short time, the phenomenon of 'holes' cannot occur, but the connection structure of the thin wire is not firm enough; and the diameter of the metal core of the thin wire is small, the resistance value of the thin wire is large, the power consumption of the thin wire is also large, the heat conduction effect is poor, and therefore the quality of the whole LED lamp string can be influenced.
In view of the above, the present inventors propose the following.
The invention content is as follows:
the invention aims to overcome the defects of the prior art and provides a manufacturing method of an LED lamp string.
In order to solve the technical problems, the invention adopts the following technical scheme: the manufacturing method of the LED lamp string comprises the following steps: s001: preparing a lead and an LED device, and peeling off a rubber sheet of the lead to expose the metal wire core; s002: performing tin dispensing on the metal wire core and/or the welding leg of the LED device to enable the metal wire core and/or the welding leg of the LED device to be attached with tin paste; s003: mounting a welding leg of the LED device on the metal wire core, then performing high-temperature welding to fixedly connect the welding leg with the metal wire core, and continuously repeating the steps S001-S003 to manufacture and form the LED lamp string; in step S003, after the solder tail of the LED device is attached to the metal wire core, the solder paste attached between the metal wire core and the solder tail is preheated to 100-.
Further, in the above technical solution, the high temperature welding refers to aligning the metal wire core and the solder tail by using a hot air welding gun, and spraying hot air at a temperature of 240-.
Further, in the above technical scheme, the hot air temperature is 300 ℃.
Further, in the above technical solution, the high temperature welding is microwave welding at a temperature of 240-.
Further, in the above technical solution, the temperature of the microwave welding is 300 ℃.
Further, in the above technical solution, in the step S003, the solder paste is preheated by hot air, and the preheating temperature is 100-.
Further, in the above technical solution, the preheating temperature is 150 ℃.
Further, in the above technical solution, one side of the tail end of the leg in the LED device is rolled or bent to wrap the periphery of the metal wire core in the lead, and is fixed by solder paste.
Furthermore, in the above technical solution, the leg is T-shaped, two sides of the end of the leg are respectively rolled or bent to form a first wrapping sheet and a second wrapping sheet, and the first wrapping sheet and the second wrapping sheet wrap the metal wire core.
Furthermore, in the above technical solution, a gap is formed between the inner sides of the first wrapping sheet and the second wrapping sheet and the outer wall of the metal wire core, and the solder paste is filled in the gap to fix the first wrapping sheet and the second wrapping sheet together with the metal wire core.
After adopting the technical scheme, compared with the prior art, the invention has the following beneficial effects: on the basis of the conventional manufacturing method of the LED lamp string, after the welding feet of the LED device are attached to the metal wire core, the solder paste attached between the metal wire core and the welding feet is preheated to 180 ℃ at the preheating temperature, the rubber is not melted at the preheating temperature, and then high-temperature welding is carried out, so that all the solder paste can be completely melted in a short time, the phenomenon of 'holes' can be effectively prevented, the stability of a welding structure is ensured, the LED device is stably welded and fixed on the lead, and the quality of the whole LED lamp string is improved. Even if the wires are thick wires with larger diameters, after the metal wire cores in the thick wires are contacted with the welding pins, the sizes of the solder pastes between the metal wire cores and the welding pins are wider, but the solder pastes are preheated to 180 ℃, so that all the solder pastes can be completely melted in a short time and the rubber can not be melted in a later period, the appearance attractiveness of the LED lamp string is ensured, a 'hollow' phenomenon can not occur after welding, the welding structure is firm, the resistance of the thick wires is small, the power consumption is small, the heat conduction effect is ideal, and the quality of the whole LED lamp string is further ensured.
Description of the drawings:
FIG. 1 is a front view of an LED light string made in accordance with the present invention;
FIG. 2 is a rear view of an LED light string made in accordance with the present invention;
FIG. 3 is an enlarged view of a portion A of FIG. 1;
FIG. 4 is an assembly view of the metal wire core and the LED device of the present invention;
fig. 5 is a perspective view of an LED device in the present invention.
The specific implementation mode is as follows:
the invention is further illustrated below with reference to specific embodiments and the accompanying drawings.
The invention relates to a manufacturing method of an LED lamp string, which comprises the following steps:
s001: preparing a lead 2 and an LED device 1, and peeling off a rubber sheet 21 of the lead 2 to expose a metal wire core 20;
s002: performing tin dispensing on the metal wire core 20 and/or the solder leg 11 of the LED device 1 to enable the metal wire core 20 and/or the solder leg 11 of the LED device 1 to be attached with tin paste;
s003: attaching the solder leg 11 of the LED device 1 to the metal wire core 20, then performing high-temperature welding to fixedly connect the solder leg 11 with the metal wire core 20, and continuously repeating the steps S001-S003 to manufacture and form an LED lamp string, as shown in FIGS. 1-3;
in step S003, after the solder tail 11 of the LED device 1 is attached to the metal wire core 20, the solder paste attached between the metal wire core 11 and the solder tail 20 is preheated to 100-.
On the basis of the conventional manufacturing method of the LED lamp string, after the welding feet of the LED device are attached to the metal wire core, the solder paste attached between the metal wire core and the welding feet is preheated to 180 ℃ at the preheating temperature, the rubber is not melted at the preheating temperature, and then high-temperature welding is carried out, so that all the solder paste can be completely melted in a short time, the phenomenon of 'holes' can be effectively prevented, the stability of a welding structure is ensured, the LED device is stably welded and fixed on the lead, and the quality of the whole LED lamp string is improved. Even if the wires are thick wires with larger diameters, after the metal wire cores in the thick wires are contacted with the welding pins, the sizes of the solder pastes between the metal wire cores and the welding pins are wider, but the solder pastes are preheated to 180 ℃, so that all the solder pastes can be completely melted in a short time and the rubber can not be melted in a later period, the appearance attractiveness of the LED lamp string is ensured, a 'hollow' phenomenon can not occur after welding, the welding structure is firm, the resistance of the thick wires is small, the power consumption is small, the heat conduction effect is ideal, and the quality of the whole LED lamp string is further ensured.
The high-temperature welding refers to aligning the metal wire core 20 and the welding leg 11 by using a hot air welding gun, and spraying hot air with the temperature of 240-300 ℃ to completely melt all solder paste attached between the metal wire core 20 and the welding leg 11; preferably, the hot air temperature is 300 ℃. Or, the high-temperature welding is microwave welding at the temperature of 240-300 ℃, so that all solder paste attached between the metal wire core and the welding leg is completely melted; preferably, the temperature of the microwave welding is 300 ℃.
In step S003, the solder paste is preheated by hot air at a preheating temperature of 100-. Preferably, the preheating temperature is 150 ℃.
As shown in fig. 4-5, one side of the tail end of the solder leg 11 in the LED device 1 is rolled or bent to wrap the periphery of the metal wire core 20 in the wire 2, and is fixed by solder paste, so that the contact area between the solder leg and the metal wire core 20 is increased, enough solder paste can be accommodated, and the firmness of the connection structure can be further ensured after re-soldering, thereby preventing the LED device 1 from being separated from the metal wire core 20 due to infirm soldering or insufficient soldering, better ensuring the quality of the whole LED light string, and the method can also be applied to thick wires.
The fillet 11 is in a T shape, two sides of the tail end of the fillet 11 are respectively rolled or bent to form a first wrapping sheet 101 and a second wrapping sheet 102, and the first wrapping sheet 101 and the second wrapping sheet 102 wrap the metal wire core 20. The first wrapping sheet 101 and the second wrapping sheet 102 wrap the metal wire core 20 in the following forms:
the first method comprises the following steps: the first wrapping sheet 101 and the second wrapping sheet 102 are relatively large in size, so that the first wrapping sheet 101 and the second wrapping sheet 102 can completely wrap the outer surface of the metal wire core 20, positioning can be achieved, strength can be improved, later-stage welding is facilitated, and welding quality is improved; and the solder paste on the inner sides of the solder leg 11 and the first wrapping sheet 101 and the second wrapping sheet 102 is in contact with the outer surface of the metal wire core 20, the contact area is extremely large, the solder paste can be melted and solidified through hot air welding or microwave welding or other welding modes, so that the solder leg 11 and the first wrapping sheet 101 and the second wrapping sheet 102 are stably connected with the metal wire core 20, and the structure is extremely firm, thereby improving the quality of the whole LED lamp string.
And the second method comprises the following steps: the first wrapping sheet 101 and the second wrapping sheet 102 wrap half or more of the outer surface of the metal wire core 20, but do not completely surround; at this moment, an interval can be formed between the end parts of the first wrapping sheet 101 and the second wrapping sheet 102, the first wrapping sheet 101 and the second wrapping sheet 102 also have the positioning effect with the metal wire core 20, the later-period welding quality is favorably ensured, the solder tails 11 and the solder paste on the inner sides of the first wrapping sheet 101 and the second wrapping sheet 102 are in contact with the outer surface of the metal wire core 20, the contact area is large, the solder paste can be melted and solidified through hot air welding or microwave welding or other welding modes, the solder tails 11 and the first wrapping sheet 101 and the second wrapping sheet 102 are stably connected with the metal wire core 20, and the structure is extremely firm, so that the quality of the whole LED lamp string is improved.
And the third is that: the first wrapping sheet 101 and the second wrapping sheet 102 wrap a small half of the outer surface of the metal wire core 20 (1/3 circumference or less than 1/3 circumference), the first wrapping sheet 101 and the second wrapping sheet 102 play a role in limiting and facilitating welding, surface contact is formed between the first wrapping sheet 101 and the second wrapping sheet 102, and the contact area is enlarged relative to point contact, so that after the first wrapping sheet 101 and the second wrapping sheet 102 are fixed by solder paste in a welding mode, the welding feet 11, the first wrapping sheet 101 and the second wrapping sheet 102 are stably connected with the metal wire core 20, the structure of the first wrapping sheet 101 and the structure of the second wrapping sheet 102 are extremely firm, and the quality of the whole LED lamp string is improved.
Gaps are formed between the inner sides of the first wrapping sheet 101 and the second wrapping sheet 102 and the outer wall of the metal wire core 20, and the solder paste is filled in the gaps to fix the first wrapping sheet 101 and the second wrapping sheet 102 with the metal wire core 20. Specifically, the inner sides of the first and second wrapping sheets 101 and 102 are coated with solder paste, so that when the first and second wrapping sheets 101 and 102 wrap the outer surface of the metal core 20, the solder paste is filled between the first and second wrapping sheets 101 and 102 and the outer surface of the metal core 20.
In summary, on the basis of the conventional LED light string manufacturing method, after the solder leg of the LED device is attached to the metal wire core, the solder paste attached between the metal wire core and the solder leg is preheated to 180 ℃ with the preheating temperature not causing melting of the rubber, and then high-temperature soldering is performed, so that all the solder paste can be completely melted in a short time, thereby effectively preventing the occurrence of "voids", ensuring the stability of the soldering structure, and stably soldering the LED device on the lead wire, thereby improving the quality of the whole LED light string. Even if the wires are thick wires with larger diameters, after the metal wire cores in the thick wires are contacted with the welding pins, the sizes of the solder pastes between the metal wire cores and the welding pins are wider, but the solder pastes are preheated to 180 ℃, so that all the solder pastes can be completely melted in a short time and the rubber can not be melted in a later period, the appearance attractiveness of the LED lamp string is ensured, a 'hollow' phenomenon can not occur after welding, the welding structure is firm, the resistance of the thick wires is small, the power consumption is small, the heat conduction effect is ideal, and the quality of the whole LED lamp string is further ensured.
It should be understood that the above description is only exemplary of the present invention, and is not intended to limit the scope of the present invention, which is defined by the appended claims.

Claims (10)

1. A manufacturing method of an LED lamp string comprises the following steps:
s001: preparing a lead and an LED device, and peeling off a rubber sheet of the lead to expose the metal wire core;
s002: performing tin dispensing on the metal wire core and/or the welding leg of the LED device to enable the metal wire core and/or the welding leg of the LED device to be attached with tin paste;
s003: mounting a welding leg of the LED device on the metal wire core, then performing high-temperature welding to fixedly connect the welding leg with the metal wire core, and continuously repeating the steps S001-S003 to manufacture and form the LED lamp string;
the method is characterized in that: in step S003, after the solder tail of the LED device is attached to the metal wire core, the solder paste attached between the metal wire core and the solder tail is preheated to 100-.
2. The method of claim 1 wherein the steps of: the high-temperature welding refers to aligning the metal wire core and the welding leg by adopting a hot air welding gun, and spraying hot air with the temperature of 240-300 ℃ to completely melt all solder paste attached between the metal wire core and the welding leg.
3. The method of claim 2 wherein the steps of: the temperature of the hot air is 300 ℃.
4. The method of claim 1 wherein the steps of: the high-temperature welding is microwave welding at the temperature of 240-300 ℃, so that all solder paste attached between the metal wire core and the welding leg is completely melted.
5. The method of claim 4 wherein the steps of: the temperature of the microwave welding is 300 ℃.
6. The method of any one of claims 1-5 wherein the steps of: in step S003, the solder paste is preheated by hot air at a preheating temperature of 100-.
7. The method of claim 6 wherein the steps of: the preheating temperature was 150 ℃.
8. The method of claim 6 wherein the steps of: one side of the tail end of the welding leg in the LED device is rolled or bent to wrap the periphery of the metal wire core in the lead, and the LED device is fixed by soldering with solder paste.
9. The method of claim 7 in which the steps of: the welding leg is T-shaped, two sides of the tail end of the welding leg are respectively rolled or bent to form a first wrapping sheet and a second wrapping sheet, and the first wrapping sheet and the second wrapping sheet wrap the metal wire core.
10. The method of claim 8 in which the steps of: gaps are formed between the inner sides of the first wrapping sheet and the second wrapping sheet and the outer wall of the metal wire core, and the solder paste is filled in the gaps and fixes the first wrapping sheet and the second wrapping sheet together with the metal wire core.
CN202111011837.2A 2021-08-31 2021-08-31 Manufacturing method of LED lamp string Pending CN113787240A (en)

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Application Number Priority Date Filing Date Title
CN202111011837.2A CN113787240A (en) 2021-08-31 2021-08-31 Manufacturing method of LED lamp string

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Application Number Priority Date Filing Date Title
CN202111011837.2A CN113787240A (en) 2021-08-31 2021-08-31 Manufacturing method of LED lamp string

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CN101016979A (en) * 2006-10-09 2007-08-15 刘昌贵 Lamp string, lamp strap using same and manufacture method of the lamp string
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CN213300981U (en) * 2020-09-22 2021-05-28 东莞市安林电子有限公司 SMD leg wire terminal of electron detonator PCB circuit board
CN112902044A (en) * 2021-02-05 2021-06-04 珠海博杰电子股份有限公司 Production method of three-wire point-control LED color lamp string

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Application publication date: 20211214

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