CN220652386U - Terminal connection structure and electrical equipment - Google Patents

Abstract

The application discloses a terminal connection structure and electrical equipment. The terminal connection structure includes a terminal body, a conductive portion, and an insulating layer. The terminal body is used for being connected with the circuit board. One end of the conductive part is connected with the terminal body, and the other end of the conductive part extends in a direction away from the terminal body. The insulating layer is coated on the conductive part, and extends along the length direction of the conductive part. Wherein, the insulating layer is close to and remains to be equipped with thermal-insulated clearance between the one end of terminal body and the terminal body. According to the embodiment of the application, the heat insulation gap is formed between the insulating layer and the terminal body, and the heat insulation gap can prevent the high temperature of the terminal body from being transferred to the insulating layer due to the fact that the wave soldering time is short and a certain time is needed for heat transfer, so that the insulating layer is prevented from being melted and damaged due to the high temperature. By adopting the structure, the insulating layer can be prevented from being damaged when wave soldering is performed, and meanwhile, the original production cost of the product is maintained, and the market competitiveness of the product is improved.

Description

Terminal connection structure and electrical equipment

Technical Field

The application relates to the technical field of electrical equipment, in particular to the technical field of terminal connection, and specifically relates to a terminal connection structure and electrical equipment.

Background

The internal connection line used in electrical equipment such as a switching power supply is typically a UL1007 PVC (Polyvinyl chloride ) line. Such a connection wire has advantages in that it is convenient to process and has low cost, but has disadvantages in that it can only withstand high temperatures of 80 degrees celsius. In the use process, the insulating skin of UL1007 PVC line is easy to melt, especially when wave soldering is passed, the insulating layer of UL1007 PVC line is easy to be scalded and melt by the hardware terminal connected to the PCB board. The molten insulating skin may fall onto the PCB (Printed Circuit Board, circuit board) to affect the appearance of the PCB. The conventional way to solve the above problems is to replace UL1007 PVC wire with more high temperature resistant PVC wire, but this leads to a dramatic increase in production cost.

Disclosure of Invention

The application aims at providing a terminal connection structure and electrical equipment, through reserving thermal-insulated clearance between insulating layer and terminal body, can prevent the heat transfer of terminal body to the insulating layer when crossing wave soldering to can prevent that the insulating layer from melting down under the condition that does not increase manufacturing cost.

The embodiment of the application provides a terminal connection structure, including:

the terminal body is used for connecting the circuit board;

one end of the conductive part is connected with the terminal body, and the other end of the conductive part extends in a direction away from the terminal body;

an insulating layer which is coated on the conductive part and extends along the length direction of the conductive part;

and a heat insulation gap is reserved between one end, close to the terminal body, of the insulating layer and the terminal body.

In some embodiments, the length of the insulating gap is 4 millimeters to 8 millimeters.

In some embodiments, the terminal connection structure further comprises:

and the heat-shrinkable sleeve is sleeved on the terminal body, the conductive part positioned in the heat insulation gap and the insulating layer.

In some embodiments, the terminal body comprises:

a first connection part for connecting the circuit board;

a second connection part for connecting the conductive part;

and the transition connecting part is connected between the first connecting part and the second connecting part, wherein the transition connecting part is gradually expanded along the direction from the first connecting part to the second connecting part.

In some embodiments, the heat shrink sleeve is sleeved on the terminal body at the transition connection portion and the second connection portion.

In some embodiments, the second connection portion, the transition connection portion, and the first connection portion are respectively configured with a connection channel, and the conductive portion sequentially penetrates through the connection channel of the second connection portion, the connection channel of the transition connection portion, and the connection channel of the first connection portion.

In some embodiments, the second connection portion is adapted to be riveted to an outer surface of the conductive portion.

In some embodiments, an outer surface of the first connection portion is configured with barbs adapted to connect with the circuit board for preventing the terminal body from falling off the circuit board.

In some embodiments, the heat shrink is a flexible insulating sleeve adapted to shrink by heating to conform to an outer surface of the terminal body, an outer surface of the conductive portion at the insulating gap, and an outer surface of the insulating layer.

The embodiment of the application provides an electrical device, which comprises a terminal connection structure.

The terminal connection structure provided by the embodiment of the application comprises a terminal body, a conductive part and an insulating layer. The terminal body is used for being connected with the circuit board. One end of the conductive part is connected with the terminal body, and the other end of the conductive part extends in a direction away from the terminal body. The insulating layer is coated on the conductive part, and extends along the length direction of the conductive part. Wherein, the insulating layer is close to and remains to be equipped with thermal-insulated clearance between the one end of terminal body and the terminal body. According to the embodiment of the application, the heat insulation gap is formed between the insulating layer and the terminal body, when wave soldering is performed, the wave soldering time is short and a certain time is needed for heat transfer, so that the heat insulation gap can prevent the high temperature of the terminal body from being transferred to the insulating layer, and the insulating layer is prevented from being damaged due to high temperature. By adopting the structure, the insulating layer can be prevented from being damaged when wave soldering is performed, and meanwhile, the original production cost of the product is maintained, and the market competitiveness of the product is improved.

Drawings

Technical solutions and other advantageous effects of the present application will be made apparent from the following detailed description of specific embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of a terminal connection structure according to an embodiment of the present application.

Fig. 2 is a second schematic structural diagram of a terminal connection structure according to an embodiment of the present disclosure.

Reference numerals:

10-terminal body, 110-first connecting portion, 120-second connecting portion, 130-transition connecting portion, 140-barb, 20-conductive portion, 30-insulating layer, 40-heat insulation gap, 50-heat shrinkage bush.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.

Specifically, referring to fig. 1 to 2, a terminal connection structure is provided in an embodiment of the present application. The terminal connection structure includes a terminal body 10, a conductive portion 20, and an insulating layer 30. The terminal body 10 is used for connecting a circuit board. One end of the conductive portion 20 is connected to the terminal body 10, and the other end of the conductive portion 20 extends in a direction away from the terminal body 10. The insulating layer 30 is coated on the conductive portion 20, and the insulating layer 30 extends along the length direction of the conductive portion 20. Wherein, a thermal insulation gap 40 is left between one end of the insulating layer 30 close to the terminal body 10 and the terminal body 10.

In the embodiment of the application, by forming the insulation gap 40 between the insulating layer 30 and the terminal body 10, during wave soldering, the insulation gap 40 can prevent the high temperature of the terminal body 10 from being transferred to the insulating layer 30 due to the short wave soldering time and the certain time required for heat transfer, thereby preventing the insulating layer 30 from being melted and damaged due to the high temperature. By adopting the structure, the insulating layer 30 can be prevented from being damaged when wave soldering is performed, and meanwhile, the original production cost of the product is maintained, and the market competitiveness of the product is improved.

It will be appreciated that during wave soldering, the temperature of the tin oven will reach 270 c (degrees celsius) and the temperature of the terminal body 10 will rise rapidly at the moment of tin consumption. If the insulating gap 40 is not formed, the high temperature of the terminal body 10 is directly transferred to the insulating layer 30, resulting in melting loss of the insulating layer 30. Based on forming thermal insulation gap 40 between insulating layer 30 and terminal body 10 in this application, because the wave soldering time is shorter and because heat transfer needs certain time, make the high temperature of eating tin terminal body 10 can not transmit to insulating layer 30 in the twinkling of an eye, the temperature of insulating layer 30 department will be far lower than its heat-resisting temperature to the loss of melting does not take place.

The terminal body 10 may be a hardware terminal. The conductive portion 20 is a core of UL1007 PVC wire. The insulating layer 30 is a PVC insulating skin of UL1007 PVC wire.

Wherein the insulating gap 40 may be formed by: the insulating layer 30 is entirely coated on the conductive portion 20. Before the conductive portion 20 is connected to the terminal body 10, the insulating layer 30 on the outer surface of the conductive portion 20 is stripped a distance. The exposed conductive portion 20 is then inserted into the terminal body 10, and the exposed conductive portion 20 extends a distance beyond one end of the terminal body 10, so that the outer surface of the conductive portion 20 forms a thermal insulation gap 40 not covered with the insulating layer 30.

Wherein the insulating gap 40 may also be formed by: when the insulating layer 30 covers the conductive portion 20, the insulating layer 30 is made to incompletely cover one end of the conductive portion 20. At this time, the conductive portion 20 directly generates a bare area of the insulating layer 30. The exposed conductive portion 20 is then inserted into the terminal body 10, and the exposed conductive portion 20 extends a distance beyond one end of the terminal body 10, so that the outer surface of the conductive portion 20 forms a thermal insulation gap 40 not covered with the insulating layer 30.

In some embodiments, the length of the insulating gap 40 is 4mm to 8mm (millimeters). It will be appreciated that the length of the insulating gap 40 may be set to a specific value of 4mm, 5mm, 6mm, 7mm, 8mm or any two thereof, as desired, and is not limited in this application. By setting the length of the heat insulating gap 40 to be between 4 and 8mm, it is possible to make the temperature of the insulating layer 30 lower than the high temperature limit (80 ℃) thereof even if the temperature rise occurs due to the heat transferred from the terminal body 10 at the time of wave soldering, and therefore, no melting loss occurs. That is, the PVC insulation skin of the UL1007 PVC cord can be prevented from being melt damaged. Based on the design, the problem of melting loss of the insulating layer 30 can be solved without replacing the UL1007 PVC wire with the UL1430 PVC wire, so that the production cost is greatly reduced, and the market competitiveness of the product is improved.

Referring to fig. 2, the terminal connection structure further includes a heat shrink 50. The heat shrinkage bush 50 is sleeved on the terminal body 10, the conductive part 20 positioned in the heat insulation gap 40 and the insulating layer 30. Specifically, the heat shrinkage bush 50 is sleeved on a partial region of the terminal body 10 near one end of the conductive part 20. The heat shrinkage bush 50 is sleeved on the whole area of the conductive part 20 positioned in the heat insulation gap 40. The heat shrinkage sleeve 50 is sleeved on a partial area of the insulating layer 30 near one end of the conductive part 20. Based on the structural design of the heat shrinkage bush 50, the connection among the terminal body 10, the conductive part 20 and the insulating layer 30 is more compact, stable and firm, and the insulating protection effect can be achieved.

In other embodiments of the present application, the heat shrink 50 may also be sleeved over the entire area of the terminal body, the entire area of the conductive portion 20 located in the insulating gap 40, and the entire area of the insulating layer 30.

In some embodiments, as shown in fig. 1 and 2, the terminal body 10 includes a first connection portion 110, a second connection portion 120, and a transition connection portion 130 connected between the first connection portion 110 and the second connection portion 120. The first connection portion 110 is used for connecting a circuit board. The second connection portion 120 is used for connecting the conductive portion 20. The transition connection portion 130 is gradually expanded along the direction from the first connection portion 110 to the second connection portion 120. The transition connection 130 of the gradually-expanding shape can prevent the heat-conducting sleeve from moving axially after the heat-conducting sleeve is sleeved and heat-shrunk.

It will be appreciated that the outer diameter of the first connection portion 110 is smaller than the outer diameter of the second connection portion, i.e. the first connection portion 110 is narrower than the second connection portion 120. At this time, when the two ends of the transition connection portion 130 are respectively abutted against the first connection portion 110 and the second connection portion 120, the transition connection portion 130 can form a gradually expanding structure.

In some embodiments, the heat shrinkage sleeve 50 is sleeved on the terminal body 10 and the transition connection portion 130 and the second connection portion 120. The transition connection 130 is gradually expanded from the first connection 110 to the second connection 120, i.e. the outer diameter of the transition connection 130 gradually increases from the first connection 110 to the second connection 120. After the heat shrink 50 passes through the first connection portion 110 and is sleeved to the transition connection portion 130, the second connection portion 120, the conductive portion 20 positioned in the insulation gap 40, and the insulation layer 30, the heat shrink 50 can be prevented from moving axially based on the shape of the transition connection portion 130. And because the conductive part 20 is inserted into the second connecting part 120, that is, there is also an outer diameter difference between the conductive part 20 and the second connecting part 120, and the outer diameter of the conductive part 20 is smaller than that of the second connecting part 120, axial movement between the conductive part 20 and the second connecting part 120 after the heat shrinkage fit of the heat shrinkage sleeve 50 is avoided. The reliability of the fixing of the heat shrink 50 is ensured.

In some embodiments, an anti-slip structure may also be configured on the outer surfaces of the transition connection 130, the second connection 120, and the insulating layer 30.

For example, a plurality of cleats are formed on the outer surfaces of the transition joint 130, the second joint 120, and the insulating layer 30, and the cleats are formed corresponding to the material of the transition joint 130, the second joint 120, and the insulating layer 30 based on the material thereof. When the heat shrinkage bush 50 is in heat shrinkage fit with the transition connecting part 130, the second connecting part 120 and the insulating layer 30, the anti-slip protrusions can increase friction force between the heat shrinkage bush 50 and the transition connecting part 130, the second connecting part 120 and the insulating layer 30, so that the heat shrinkage bush 50 is prevented from axially moving in the using process, and the heat shrinkage bush 50 is ensured to play a structural protection and insulating protection role.

For example, annular grooves are formed on the outer surfaces of the transition connection portion 130, the second connection portion 120 and the insulating layer 30, a rubber ring is inserted into the annular grooves, and an outer ring of the rubber ring protrudes from the annular grooves. When the heat shrinkage bush 50 is in heat shrinkage fit with the transition connecting part 130, the second connecting part 120 and the insulating layer 30, the rubber ring can increase friction force between the heat shrinkage bush 50 and the transition connecting part 130, the second connecting part 120 and the insulating layer 30, so that the heat shrinkage bush 50 is prevented from axially moving in the using process, and the heat shrinkage bush 50 is ensured to play a structural protection and insulating protection role. It should be noted that, in this way, the rubber ring with better heat resistance is needed to avoid melting loss during wave soldering.

In some embodiments, a stabilizing structure may also be added between the transition piece 130, the second piece 120, and the insulating layer 30 and heat shrink 50.

For example, after the heat shrinkage bush 50 is sleeved on the transition connection part 130, the second connection part 120 and the insulating layer 30, a rubber ring is sleeved outside the transition connection part 130, the second connection part 120 and the insulating layer 30, and the heat shrinkage bush 50 is wrapped on the outer surfaces of the transition connection part 130, the second connection part 120 and the insulating layer 30 through the rubber ring, so that the heat shrinkage bush 50 is firmly connected. It should be noted that, in this way, the rubber ring with better heat resistance is needed to avoid melting loss during wave soldering.

For example, after the heat shrinkage bush 50 is sleeved on the transition connection part 130, the second connection part 120 and the insulating layer 30, a clamp is sleeved outside the transition connection part 130, the second connection part 120 and the insulating layer 30, and the heat shrinkage bush 50 is wrapped on the outer surfaces of the transition connection part 130, the second connection part 120 and the insulating layer 30 through the clamp, so that the heat shrinkage bush 50 is firmly connected.

In some embodiments, the second connection portion 120, the transition connection portion 130, and the first connection portion 110 are configured with connection channels, and the conductive portion 20 sequentially passes through the connection channels of the second connection portion 120, the transition connection portion 130, and the first connection portion 110. The conductive part 20 is sequentially inserted into the connection channel of the second connection part 120, the connection channel of the transition connection part 130 and the connection channel of the first connection part 110, so that the end of the conductive part 20 can be directly connected with the circuit board to perform a conductive effect. The terminal body 10 mainly plays a role in stabilizing the connection between the circuit board and the conductive part 20, so as to prevent the conductive part 20 from falling off from the circuit board.

In some embodiments, the second connection portion 120 is adapted to be riveted to the outer surface of the conductive portion 20 to achieve a stable connection between the conductive portion 20 and the second connection portion 120. Specifically, after the conductive portion 20 is sequentially inserted into the connection channel of the second connection portion 120, the connection channel of the transition connection portion 130, and the connection channel of the first connection portion 110, a force of riveting is applied to the position of the second connection portion 120, so that the second connection portion 120 is deformed to a certain extent in the direction of the conductive portion 20, and the mutual fixation between the second connection portion 120 and the conductive portion 20 is completed.

In some embodiments, a plurality of engaging members may be configured on the inner surface of the second connecting portion 120, and the plurality of conductive portions 20 may be respectively engaged in the corresponding engaging members, so as to not only facilitate wiring, but also realize mutual fixation between the conductive portions 20 and the second connecting portion 120.

In some embodiments, a clip may be further configured on the outer surface of the second connection portion 120, and after the plurality of conductive portions 20 are inserted into the connection channels of the second connection portion 120, the clip is engaged with the outer side of the second connection portion 120, and the second connection portion 120 is deformed to a certain extent in the direction of the conductive portions 20 by the clip. Under the combined action of the deformation of the second connecting portion 120 and the clamping engagement of the clamping band, the mutual fixation between the conductive portion 20 and the second connecting portion 120 is realized.

In some embodiments, the outer surface of the first connection portion 110 is configured with barbs 140, the barbs 140 being adapted for connection with a circuit board for preventing the terminal body 10 from falling out of the circuit board. Based on the structural design of the barb 140, a relatively stable connection can be formed between the terminal body 10 and the circuit board, and disconnection of the conductive part 20 and the circuit board caused by falling of the terminal body 10 and the circuit board is avoided.

The barbs 140 on the outer surface of the first connecting portion 110 can be axially symmetrically arranged to be two, so that the functions of stable connection and balanced stress can be better achieved. The barbs 140 on the outer surface of the first connecting portion 110 may be at least three in central symmetry, which also can play a role in stable connection and balanced stress.

The barb 140 of the outer surface of the first connection part 110 may be integrally formed with the first connection part 110. Or may be fixed to the outer surface of the first connection portion 110 by welding or the like.

In some embodiments, the heat shrink 50 is a flexible insulating sleeve, and the heat shrink 50 is adapted to shrink by heating to conform to the outer surface of the terminal body 10, the outer surface of the conductive portion 20 located in the insulating gap 40, and the outer surface of the insulating layer 30.

A flexible insulating sleeve is used to ensure that the heat shrink 50 is insulating. After the terminal body 10, the conductive portion 20, the insulating layer 30, and the heat shrinkage bush 50 of the terminal connection structure are mounted, they are placed in a heating furnace and heated, so that the heat shrinkage bush 50 is heat-shrunk and deformed, and the heat shrinkage bush is attached to the outer surface of the terminal body 10, the outer surface of the conductive portion 20 located in the heat insulation gap 40, and the outer surface of the insulating layer 30. To provide structural protection and insulation.

The terminal connection structure provided by the embodiment of the application solves the problem that the PVC wire external insulation layer 30 is melted and damaged when wave soldering is performed on the basis of not replacing the PVC wire model. Maintains the original production cost of the product and improves the market competitiveness of the product.

The embodiment of the application also provides an electrical device, which comprises the terminal connection structure in the embodiment. The electrical equipment in this embodiment includes a circuit board, where the terminal body 10 of the aforementioned terminal structure is inserted into the circuit board, and the mutual fixation between the terminal body 10 and the circuit board is achieved by the wave soldering mating with the barbs 140 of the terminal body 10.

Based on the formation of the insulation gap 40 between the insulation layer 30 and the terminal body 10, during wave soldering, the insulation gap 40 can prevent the high temperature at the terminal body 10 from being transferred to the insulation layer 30 due to the short wave soldering time and the heat transfer time, so as to prevent the insulation layer 30 from being melted and damaged due to the high temperature. By adopting the structure, the insulating layer 30 can be prevented from being damaged when wave soldering is performed, and meanwhile, the original production cost of the electrical equipment is maintained, and the market competitiveness of the electrical equipment is improved.

Wherein the electrical device may be a power switch.

In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.

The above describes in detail a terminal connection structure and an electrical device provided in the embodiments of the present application, and specific examples are applied to describe the principles and embodiments of the present application, where the description of the above embodiments is only for helping to understand the technical solution and core ideas of the present application; those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A terminal connection structure, characterized by comprising:

the terminal body is used for connecting the circuit board;

one end of the conductive part is connected with the terminal body, and the other end of the conductive part extends in a direction away from the terminal body;

an insulating layer which is coated on the conductive part and extends along the length direction of the conductive part;

and a heat insulation gap is reserved between one end, close to the terminal body, of the insulating layer and the terminal body.

2. The terminal connection structure according to claim 1, wherein the length of the heat insulating gap is 4mm to 8 mm.

3. The terminal connection structure according to claim 1 or 2, characterized in that the terminal connection structure further comprises:

and the heat-shrinkable sleeve is sleeved on the terminal body, the conductive part positioned in the heat insulation gap and the insulating layer.

4. The terminal connection structure according to claim 3, wherein the terminal body comprises:

a first connection part for connecting the circuit board;

a second connection part for connecting the conductive part;

and the transition connecting part is connected between the first connecting part and the second connecting part, wherein the transition connecting part is gradually expanded along the direction from the first connecting part to the second connecting part.

5. The terminal connection structure according to claim 4, wherein the heat shrinkage bush is sleeved on the terminal body at the transition connection portion and the second connection portion.

6. The terminal connection structure according to claim 4, wherein the second connection portion, the transition connection portion, and the first connection portion are respectively configured with connection channels, and the conductive portion is sequentially disposed through the connection channels of the second connection portion, the transition connection portion, and the first connection portion.

7. The terminal connection structure of claim 6, wherein the second connection portion is adapted to be swaged to an outer surface of the conductive portion.

8. The terminal connection structure according to claim 7, wherein an outer surface of the first connection portion is configured with a barb adapted to be connected with the circuit board for preventing the terminal body from coming off the circuit board.

9. The terminal connection structure according to claim 3, wherein the heat-shrinkable sleeve is a flexible insulating sleeve adapted to be shrunk by heating to fit to an outer surface of the terminal body, an outer surface of the conductive portion located in the heat-insulating gap, and an outer surface of the insulating layer.

10. An electrical device comprising the terminal connection structure according to any one of claims 1 to 9.