CN113784513A - Circuit board forming method - Google Patents
Circuit board forming method Download PDFInfo
- Publication number
- CN113784513A CN113784513A CN202110936124.0A CN202110936124A CN113784513A CN 113784513 A CN113784513 A CN 113784513A CN 202110936124 A CN202110936124 A CN 202110936124A CN 113784513 A CN113784513 A CN 113784513A
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- Prior art keywords
- laser
- circuit board
- composite board
- board
- film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a circuit board forming method, which comprises the steps of adhering a circuit board to be formed on a bearing film to form a composite board; performing laser on the composite board at a preset laser depth; cleaning the laser composite board; separating the cleaned composite board into single circuit boards; after the circuit board to be molded is adhered to the bearing film to form the composite board before laser, laser is carried out on the composite board according to the preset laser depth, the circuit boards after laser are separated from each other, the bearing film is still kept complete, and all the circuit boards are still adhered to the bearing film after laser step, so that all the circuit boards on the composite board can be cleaned when the circuit boards are cleaned, and finally the circuit boards are peeled from the bearing film after the cleaning is finished to obtain a single circuit board.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a circuit board forming method.
Background
The circuit board forming technology of the LCP material generally comprises a laser step and a cleaning step. Because a large amount of carbon powder can be generated in the laser process, the effect of the circuit board is influenced. Therefore, the circuit board needs to be cleaned after the laser step is completed.
As shown in fig. 1, each LCP material can generally laser out a plurality of circuit boards, and the laser plurality of circuit boards are separated from the single LCP material, which makes it difficult to clean the whole LCP material. In order to improve the efficiency of cleaning the circuit board, the laser is usually performed in a manner of reserving connection points in the first laser process, so that the whole LCP material is not separated from each circuit board. And after cleaning, performing secondary laser to cut off the reserved points, thereby realizing the primary cleaning of the whole plate LCP material.
However, although the cleaning efficiency is improved by adopting the secondary laser forming mode, a primary laser process is additionally added, and the forming process of the circuit board is still prolonged. Moreover, as shown in fig. 2, the secondary laser has a tolerance accumulation problem, so that the product subjected to the secondary laser has a tolerance, which is not beneficial to the rear-section processing and positioning.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the circuit board forming method is provided, and the forming efficiency of the circuit board is improved.
In order to solve the technical problems, the invention adopts the technical scheme that:
a circuit board forming method comprises the following steps:
adhering a circuit board to be molded on the bearing film to form a composite board;
performing laser on the composite board at a preset laser depth;
cleaning the laser composite board;
and separating the cleaned composite board into single circuit boards.
The invention has the beneficial effects that: after the circuit board to be molded is adhered to the bearing film to form the composite board before laser, laser is carried out on the composite board according to the preset laser depth, the circuit boards after laser are separated from each other, the bearing film is still kept complete, and all the circuit boards are still adhered to the bearing film after laser step, so that all the circuit boards on the composite board can be cleaned when the circuit boards are cleaned, and finally the circuit boards are peeled from the bearing film after the cleaning is finished to obtain a single circuit board.
Drawings
FIG. 1 is a flow chart of the steps of a circuit board forming method in the prior art;
FIG. 2 is a schematic diagram of laser migration in the prior art;
FIG. 3 is a flowchart illustrating steps of a circuit board forming method according to an embodiment of the present invention;
FIG. 4 is a schematic side view of a circuit board forming method according to an embodiment of the present invention;
FIG. 5 is a schematic top view of a circuit board forming method according to an embodiment of the present invention;
description of reference numerals:
1. a circuit board; 2. and (3) carrying the film.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1, a circuit board forming method includes the steps of:
adhering a circuit board to be molded on the bearing film to form a composite board;
performing laser on the composite board at a preset laser depth;
cleaning the laser composite board;
and separating the cleaned composite board into single circuit boards.
As can be seen from the above description, the beneficial effects of the present invention are: after the circuit board to be molded is adhered to the bearing film to form the composite board before laser, laser is carried out on the composite board according to the preset laser depth, the circuit boards after laser are separated from each other, the bearing film is still kept complete, and all the circuit boards are still adhered to the bearing film after laser step, so that all the circuit boards on the composite board can be cleaned when the circuit boards are cleaned, and finally the circuit boards are peeled from the bearing film after the cleaning is finished to obtain a single circuit board.
Further, one side of the bearing film is provided with viscosity;
the circuit board that will treat the shaping adheres on the carrier film, forms the composite sheet and includes:
and adhering the circuit board to be molded on the sticky side of the bearing film.
As can be seen from the above description, by adopting the sticky carrier film, the LCP plate to be molded can be conveniently adhered to the sticky side of the carrier film without adopting a gluing mode on the LCP plate or the carrier film to adhere the LCP plate and the carrier film, thereby greatly improving the production efficiency.
Further, the carrier film is a UV (ultraviolet) adhesive reducing film;
the separating of the cleaned composite board into the single circuit boards comprises:
carrying out UV irradiation on the cleaned composite board;
and separating the composite board after UV irradiation into single circuit boards.
According to the description, the UV anti-sticking film is used as the bearing film, so that effective bonding between the bearing film and the circuit board can be realized, the circuit board cannot fall off in the cleaning process, the composite board is irradiated by UV after cleaning, the viscosity of the UV anti-sticking film is reduced, the bearing film and the circuit board can be easily separated, the problem that effective bonding cannot be realized due to the adoption of the low-viscosity bearing film is avoided, or the circuit board and the bearing film are not easily separated due to the use of the high-viscosity bearing film, the circuit board is deformed after separation, and the like is solved.
Further, the cleaning of the laser-irradiated composite board comprises:
placing the laser composite board on a cleaning carrier;
and carrying out dry ice spraying cleaning on the composite plate on the cleaning carrier.
According to the above description, the composite board after laser is cleaned in a dry ice spraying mode, dry ice particles are sprayed to the surface of the circuit board, and after the dry ice contacts with a product, the dry ice particles are directly volatilized due to the fact that reaction is formed due to temperature difference change.
Furthermore, the bearing film is prepared from a polytetrafluoroethylene material.
According to the description, the polytetrafluoroethylene material is adopted to form the bearing film, and the polytetrafluoroethylene material has certain resistance to laser, so that the circuit board to be molded in the laser process can be cut into a plurality of separated circuit board products, the bearing film still keeps complete, the laser-cut circuit boards are still bonded on the bearing film although being separated from each other, and the whole board cleaning can be realized.
Further, the gram weight of the carrier film is larger than a preset gram weight value.
According to the description, the gram weight of the carrier film is set to be larger than the preset gram weight value, so that the carrier film has higher gram weight, the carrier film is prevented from being separated from the circuit board due to the impact force of cleaning jet in the cleaning process, and the bonding stability between the carrier film and the circuit board is improved.
Further, the gram weight of the carrier filmGreater than 1kg/m2。
As can be seen from the above description, by making the grammage of the carrier film larger than 1kg/m2When the bonding stability between the carrier film and the circuit board in the cleaning process is ensured, the gram weight of the carrier film subjected to UV irradiation can be reduced to 5g/m2The irradiated bearing film and the circuit board are separated more easily, and the circuit board is prevented from deforming due to overlarge bonding force in the separation process.
Further, the thickness of the carrier film is larger than a preset thickness value.
According to the description, the thickness of the bearing film is set to be larger than the preset thickness value, so that the bearing film cannot be divided by laser in the laser process, and the bearing film after laser still has the effect of connecting the circuit board.
Further, the thickness range of the carrier film is as follows: 0.1mm-0.2 mm.
According to the description, the thickness range of the carrier film is set to be 0.1mm-0.2mm, so that the laser carrier film still has the effect of connecting the circuit board, and the cutting quality in the laser process is guaranteed.
Further, the preset laser depth is larger than the thickness of the circuit board to be molded and smaller than the thickness of the composite board.
According to the description, the preset laser depth is set to be larger than the thickness of the circuit board to be molded and smaller than the thickness of the composite board, so that the circuit boards can be separated in the laser process, and the composite board is not separated integrally.
The above-mentioned circuit board forming method of the present invention can be applied to the forming of various types of LCP circuit boards, and is explained below by specific embodiments:
example one
Referring to fig. 3, a circuit board forming method includes the steps of:
s1, adhering the circuit board 1 to be molded on the carrier film 2 to form a composite board;
one side of the bearing film 2 has viscosity; adhering the circuit board 1 to be molded to one side of the carrier film 2 with viscosity, and forming the composite board after adhesion;
s2, performing laser on the composite board at a preset laser depth;
the preset laser depth is larger than the thickness of the circuit board 1 to be molded and smaller than the thickness of the composite board;
s3, cleaning the laser composite board;
specifically, the laser composite board is placed on a cleaning carrier; carrying out dry ice spraying cleaning on the composite board on the cleaning carrier; the dry ice particles are sprayed to the surface of a product to be cleaned by using the strong pressure gas of the air compressor through dry ice cleaning equipment, and after the dry ice is contacted with the surface of the product to be cleaned, due to the temperature difference between the cleaning equipment and the circuit board product, the dry ice is contacted with an object to be contacted, and then forms sublimation reaction due to the temperature difference, so that the dry ice is directly volatilized, and no wastewater pollution is caused;
s4, separating the cleaned composite board into single circuit boards 1;
specifically, the circuit board 1 separated from the composite board is torn off from the carrier film 2, and the single circuit board 1 is obtained.
Example two
The difference between the present embodiment and the first embodiment is that the type of the carrier film 2 is defined;
the bearing film 2 is a UV visbreaking film; the bearing film 2 is made of Polytetrafluoroethylene (PTFE) material, and laser attacks the PTFE less and is not easy to cut through; currently, polyethylene terephthalate (PET) materials are generally adopted for preparation, and the PET materials do not resist laser;
the step S4 of separating the cleaned composite board into the single circuit boards 1 includes:
s41, carrying out UV irradiation on the cleaned composite board; separating the composite board irradiated by the UV into single circuit boards 1;
wherein the gram weight of the bearing film 2 is larger than a preset gram weight value, and the gram weight value is optionalIn one embodiment, the grammage of the carrier film 2 is greater than 1kg/m2(ii) a The thickness of the carrier film 2 is greater than a preset thickness value, and in an optional embodiment, the thickness of the carrier film 2 is: 0.1mm-0.2 mm;
specifically, please refer to fig. 4 and 5;
referring to fig. 4, a represents a side view of the product after step S1, and fig. 5, a represents a top view of the product after step S1, a layer of the UV adhesion reducing film is adhered to the surface of the circuit board 1 to be molded, and the circuit board 1 to be molded is tightly adhered to the UV adhesion reducing film to form the composite board;
if B in fig. 4 represents a side view of the product after step S2, and B in fig. 5 represents a top view of the product after step S2, the composite board is subjected to laser cutting, and in the laser cutting process, since the UV anti-adhesive film is made of PTFE material and has a thickness of 0.1mm-0.2mm, the attack of the laser on the UV anti-adhesive film is reduced, and the UV anti-adhesive film is not easily cut through, so that the circuit board 1 is protected from being separated;
referring to fig. 4, C represents a side view of the product after step S3, and C represents a top view of the product after step S3, the laser-cut composite board is cleaned, and the gram weight of the UV-reduced adhesive film is up to 1kg/m during the cleaning process2Therefore, the circuit board 1 and the UV anti-adhesive film cannot be separated due to the impact force of substances sprayed by cleaning equipment in the cleaning process, and the bonding stability between the circuit board 1 and the UV anti-adhesive film can be guaranteed;
referring to fig. 4, D indicates a side view of the product after step S41, and D indicates a top view of the product after step S41, the cleaned composite board is irradiated with UV light, and the grammage of the UV-curable film is greatly reduced to 5g/m during the irradiation process2(ii) a Therefore, the bonding effect between the circuit board 1 and the UV anti-adhesive film is greatly reduced along with the reduction of the gram weight of the UV anti-adhesive film, and the circuit board 1 and the UV anti-adhesive film are more favorably separated;
as shown in fig. 4, E represents a side view of the product after step S4, and fig. 5, E represents a top view of the product after step S4, the circuit board 1 on the composite board after irradiation is separated from the UV anti-adhesive film, and the single circuit board 1 is obtained.
In summary, in the circuit board forming method provided by the invention, the UV anti-adhesive film made of PTFE material is used as the carrier film of the circuit board, the circuit board to be formed is adhered to the UV anti-adhesive film before laser to form the composite board, then the composite board is laser at the preset laser depth, so that the circuit boards after laser are separated from each other and the UV anti-adhesive film is still kept complete, and each circuit board is still adhered to the UV anti-adhesive film after the laser step, thereby cleaning all the circuit boards on the composite board when cleaning the circuit board, and the gram weight of the UV anti-adhesive film in the cleaning process is up to 1kg/m2The product can not be separated in the cleaning process, the composite board is irradiated by UV after being cleaned, and the gram weight of the UV anti-sticking board is reduced to 5g/m2So that the product is easy to drop; and the dry ice is adopted for cleaning in the cleaning process, no cleaning wastewater is generated, the product is molded in an improved mode, the product has no break difference, the cleaning efficiency of the circuit board is improved, the laser efficiency is also improved, and only one laser operation is needed, so that the integral molding efficiency of the circuit board is improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (10)
1. A circuit board forming method is characterized by comprising the following steps:
adhering a circuit board to be molded on the bearing film to form a composite board;
performing laser on the composite board at a preset laser depth;
cleaning the laser composite board;
and separating the cleaned composite board into single circuit boards.
2. The circuit board molding method according to claim 1, wherein one side of the carrier film has an adhesive property;
the circuit board that will treat the shaping adheres on the carrier film, forms the composite sheet and includes:
and adhering the circuit board to be molded on the sticky side of the bearing film.
3. The method of claim 2, wherein the carrier film is a UV-adhesive-reducing film;
the separating of the cleaned composite board into the single circuit boards comprises:
carrying out UV irradiation on the cleaned composite board;
and separating the composite board after UV irradiation into single circuit boards.
4. The method of claim 3, wherein the cleaning the laser-irradiated composite board comprises:
placing the laser composite board on a cleaning carrier;
and carrying out dry ice spraying cleaning on the composite plate on the cleaning carrier.
5. The method of claim 1, wherein the carrier film is made of polytetrafluoroethylene.
6. The method of claim 1, wherein the grammage of the carrier film is greater than a predetermined grammage value.
7. The method as claimed in claim 6, wherein the grammage of the carrier film is greater than 1kg/m2。
8. The method of claim 1, wherein the thickness of the carrier film is greater than a predetermined thickness.
9. The method of claim 8, wherein the carrier film has a thickness of: 0.1mm-0.2 mm.
10. The method of claim 1, wherein the predetermined laser depth is greater than the thickness of the circuit board to be formed and less than the thickness of the composite board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110913683X | 2021-08-10 | ||
| CN202110913683 | 2021-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113784513A true CN113784513A (en) | 2021-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110936124.0A Pending CN113784513A (en) | 2021-08-10 | 2021-08-16 | Circuit board forming method |
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| Country | Link |
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| CN (1) | CN113784513A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5110388A (en) * | 1988-07-21 | 1992-05-05 | Lintec Corporation | Method of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tape |
| CN1816908A (en) * | 2003-07-03 | 2006-08-09 | Xsil技术有限公司 | Die bonding |
| CN108346612A (en) * | 2017-01-25 | 2018-07-31 | 元太科技工业股份有限公司 | The manufacturing method of flexible electronic device |
-
2021
- 2021-08-16 CN CN202110936124.0A patent/CN113784513A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5110388A (en) * | 1988-07-21 | 1992-05-05 | Lintec Corporation | Method of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tape |
| CN1816908A (en) * | 2003-07-03 | 2006-08-09 | Xsil技术有限公司 | Die bonding |
| CN108346612A (en) * | 2017-01-25 | 2018-07-31 | 元太科技工业股份有限公司 | The manufacturing method of flexible electronic device |
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