CN113776419A - Method and device for measuring thickness of eddy current coating by using bicrystal ultrasonic sensor for auxiliary triggering - Google Patents
Method and device for measuring thickness of eddy current coating by using bicrystal ultrasonic sensor for auxiliary triggering Download PDFInfo
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- 238000005259 measurement Methods 0.000 claims abstract description 11
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- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
- G01B7/10—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance
- G01B7/105—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using magnetic means, e.g. by measuring change of reluctance for measuring thickness of coating
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- G—PHYSICS
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- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
- G01B17/02—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
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Abstract
The invention relates to a thickness measuring method of a triggering eddy current coating by using a bicrystal ultrasonic sensor, which is a non-contact nondestructive detection device for starting the thickness measurement of a finished product, a production process or a surface coating thickness in a repair process of a steel substrate device (1) with an anticorrosion coating (11) by using the bicrystal ultrasonic sensor to assist in triggering the eddy current coating thickness measurement sensor. When the distance Da between the double-crystal ultrasonic sensor and the detection surface is equal to a set value D0, the eddy current thickness measuring sensor is triggered to start to work, and the purpose of rapidly detecting the steel base material coating layer by using the ultrasonic auxiliary eddy current is achieved.
Description
Technical Field
The invention relates to the technical field of nondestructive testing, in particular to a technical method for detecting the thickness of a metal surface coating by ultrasonic and eddy current, and particularly relates to a method and a device for measuring the thickness of an eddy current coating by using a bicrystal ultrasonic sensor for assisting triggering.
Background
The steel base material is widely applied to various fields of high-speed rails, automobiles, bridges, airplanes, ships, aerospace and the like, and the application environment needs to carry out anti-corrosion treatment on the surface of the steel base material by coating paint and the like so as to ensure the safe operation and the service life of steel base material devices. The detection of the thickness defect of the coating is also of great importance, particularly in the field coating process, such as the surface repair of steel substrate devices of bridges, airplanes and the like, the coating is carried out after the steel substrate is polished, the thickness defect detection is required to be carried out under the condition that the coating is not dried, the repair is more convenient under the condition that the thickness does not meet the requirement, and the supplement is not easy to be carried out if the coating is dried completely, so the non-contact nondestructive detection is very necessary.
At present, the thickness of the coating on the surface of the steel substrate is mainly detected by using a thermal imaging technology, such as a product detected by a thermo-optic imaging method of Kelvin, the thermal imaging technology not only needs time for preheating to cause slowness in detection speed, but also a thermal imaging instrument relies on temperature difference imaging, if the temperature difference is not obvious, the resolution ratio is low easily, and the detection accuracy is easily influenced. Particularly, for bridges, aviation airplanes and the like, the repairing process needs to be carried out on the application site, steel base material equipment is huge and is not beneficial to carrying, detection operation is difficult to implement under various complex site environments, repeated detection and long-time detection are difficult, and the detection accuracy can be rapidly achieved at one time.
The electromagnetic induction is quite sensitive to a ferromagnetic material such as a steel substrate, particularly the sensitivity of eddy current skin to the surface of the steel substrate is quite high, and the electromagnetic eddy current induction is not sensitive to a non-metal coating, so that the electromagnetic eddy current induction is very suitable for relevant detection of the coating thickness of a steel substrate device.
Aiming at the problems, the invention adopts the following technical scheme.
Disclosure of Invention
The invention aims to provide a method and a device for measuring thickness of a coating by using a twin-crystal ultrasonic sensor to assist in triggering eddy current, and the technical scheme is as follows:
a thickness measuring method of a vortex coating by using a bicrystal ultrasonic sensor to assist triggering is used for non-contact nondestructive detection of the thickness of a surface coating of a finished steel substrate device with an anticorrosion coating in the production process or the repair process, and is characterized in that the bicrystal ultrasonic sensor is used to assist triggering the vortex coating thickness measuring sensor to start the work of detecting the thickness, and the specific method comprises the following steps:
a. ultrasonic monitoring: starting a detection device, setting a distance value D0 between the lower surface of the detection probe and the detection surface of the coating, and keeping the bimorph ultrasonic sensor in a state of monitoring the distance value Da between the lower surface of the detection probe and the detection surface of the coating;
b. eddy current thickness measurement: when the distance Da between the lower surface of the detection probe and the coating detection surface is detected by the double-crystal ultrasonic sensor in the step a and when Da = D0, triggering the eddy current coating thickness measuring sensor to start a working mode, and detecting a distance value Db between the lower surface of the detection probe and the metal layer surface;
c. and (3) calculating a thickness value: the coating thickness is calculated by subtracting the distance Da between the lower surface of the detection probe and the detection surface of the coating by ultrasonic detection from the distance Db between the lower surface of the detection probe and the metal layer surface of eddy current detection, namely the coating thickness D = Db-Da.
Furthermore, in the ultrasonic monitoring in the step a, the method also comprises an adjusting step that the detection surface of the detection probe is parallel to the surface of the detected coating, the parallelism between the detection surface of the probe of the instrument and the surface of the coating is judged by comparing, analyzing and receiving distances of two wafers which are transmitted and received in pairs of the double-crystal ultrasonic sensor, and when the detection surface of the probe of the instrument is judged to be parallel, the eddy current thickness measuring working mode is triggered to be started. Because the reaction speed of the ultrasonic and the eddy current is very quick, for example, the ultrasonic transmission speed is 340m/s in the air, the distance between the probe and the detection surface is only millimeter, which is negligible reaction time, and the eddy current is also instant reaction speed, the detection can be finished at the instant of parallel alignment of the probe, thereby not only achieving more flexibility when the probe surface of the adjusting instrument is parallel to the coating surface, but also increasing the difficulty of detection operation without long-time alignment, and the detection can be finished quickly only by instant parallel, namely, the detection can be finished quickly by manual hand-held detection or mechanical automatic adjustment detection, which is very convenient for adjusting the flatness of the detection surface and obtaining the detection result quickly.
During adjustment of the parallel of the detection surface of the instrument probe and the surface of the coating, corresponding ultrasonic signals are transmitted and received diagonally through four pairs of transmitting and receiving ultrasonic wafers arranged diagonally, and when the reflection point A is concentrated under the four opposite corners, the detection surface of the instrument probe is parallel to the surface of the coating, and then the working mode of the eddy current thickness measuring sensor is triggered to be started. As is well known to technicians in the industry, the detection of thickness is greatly influenced by whether the surface of a probe of a detector is parallel to the surface of an object to be detected, and errors on detection accuracy are easily caused.
Or the adjustment of the parallel of the detection surface of the instrument probe and the coating surface also comprises a method for adjusting two ultrasonic sensor wafers which are arrayed, parallel and reflected at opposite angles.
Or the adjustment of the parallelism of the detection surface of the instrument probe and the surface of the coating also comprises a method for adjusting four ultrasonic sensor wafers which are arranged in a square array, are parallel and reflect at opposite angles.
And in the adjustment that the detection surface of the instrument probe is parallel to the surface of the coating, two groups of ultrasonic wafers which are arranged in a parallel array form a pair of wafer pairs which are transmitted and received, the midpoint of each pair of wafer pairs is an array of eddy current thickness measuring sensors formed by the eddy current thickness measuring sensors, and when the reflection point of the ultrasonic wafer is positioned right below the eddy current thickness measuring sensors at the midpoint, the working mode of starting the array eddy current thickness measuring sensors is triggered. The whole row of detection is formed, and the detection area of the thickness is expanded by scanning once while the parallel surface is adjusted.
Furthermore, the ultrasonic wafer groups are arranged on four sides which are parallel to each other in a square or rectangular mode, two opposite groups form a pair of wafer pairs which are transmitted and received, the midpoint of each pair of wafer pairs is a row of eddy current sensors which are arrayed by the eddy current thickness measuring sensors, and when the reflection point of the ultrasonic wafer is positioned right below the eddy current thickness measuring sensors at the midpoint, the working mode of the two groups of array eddy current thickness measuring sensors which are arrayed in a crossed mode is triggered to be started. The device for scanning the thickness of the probe in any angle direction is realized while the detection area of the thickness of the probe for scanning in one time is enlarged, namely the detection area of the scanning detection in any direction is the area passed by the probe.
In another mode, in the adjustment that the detection surface of the instrument probe is parallel to the surface of the coating, the ultrasonic wafer groups are circularly arranged on the same circumference, and when the opposite wafer groups are reflected at the midpoint, the working mode of the array eddy current thickness measuring sensor is triggered to be started.
The invention also discloses a detection device for detecting the thickness of the eddy current coating by using the auxiliary triggering of the double-crystal ultrasonic sensor, which is used for starting the work of detecting the thickness of the eddy current coating thickness detection sensor by using the auxiliary triggering of the double-crystal ultrasonic sensor, and is used for the non-contact nondestructive detection device for detecting the thickness of the surface coating of a finished product, a production process or a repair process of a steel substrate device (1) with an anti-corrosion coating (11), and the detection device comprises a control driving part (2) and a detection probe part (3), wherein the detection probe part (3) comprises a double-crystal ultrasonic sensor (31) and an eddy current thickness detection sensor (32), the detection probe part (3) is of a square structure, the ultrasonic wafers which are received and sent in pairs are arranged oppositely, corresponding ultrasonic signals are transmitted and received oppositely, when reflection points of a plurality of groups of ultrasonic wafers are concentrated under the ultrasonic wafers which are received and sent in pairs, and the working mode of starting the eddy current thickness measuring sensor is triggered only when the detection surface of the probe of the judging instrument is parallel to the surface of the coating. The control driving part (2) can be arranged to be a handheld structure, and comprises a handle (21) and a display screen (22), wherein the handle is used for manual operation of an operator, the display screen (22) is arranged in front of the handle (21), and therefore the operator can conveniently focus on a detection result when the double-crystal ultrasonic sensor (31) triggers the eddy current thickness measuring sensor (32) to enter a detection mode. In addition, the control driving part (2) can be provided with an automatic mechanical arm structure which comprises a mechanical arm (23) and a data lead (24), the movement of the detection device is controlled by the automatic mechanical arm (23), and the data lead (24) is connected to a detection data processing center to transmit and store data.
The double-crystal ultrasonic sensor (31) and the eddy current thickness measuring sensor (32) are arranged in a grouped and paired array arrangement mode. For example, two ultrasonic sensor wafers (31) which are arranged in an array and are parallel to each other to form pairwise opposite angle reflection are used for adjusting the detection surface of an instrument probe to be parallel to the surface of a coating, and are matched with a single ultrasonic sensor wafer which is arranged in the middle of each pairwise opposite angle reflection or form an eddy current thickness measuring sensor (31) which is arranged in an array; or four ultrasonic sensor wafers (31) which are arranged in a square array and are parallel to form pairwise opposite angle reflection are used for adjusting the detection surface of an instrument probe to be parallel to the surface of the coating, and are matched with a single or two cross-shaped eddy current thickness measuring sensors (31) which are arranged in the middle of each pair of pairwise opposite angle reflection ultrasonic sensor wafers; or two groups of ultrasonic wafers (31) which are arranged in parallel array form a pair of wafer pairs which are transmitted and received, the center point of each pair of wafer pairs is a row of eddy current thickness measuring sensors (32) which are formed into an array by eddy current thickness measuring sensors, when the reflection point of the ultrasonic wafer is right below the eddy current thickness measuring sensor at the center point, the working mode of the array eddy current thickness measuring sensors is triggered to be started, the whole row of detection is formed, and the detection area of the thickness is detected by scanning once is enlarged while the parallel plane is adjusted; or the ultrasonic wafer groups are arranged on four sides which are parallel in pairs and are square or rectangular, two opposite groups form a pair of wafer pairs which are transmitted and received, the midpoint of each pair of wafer pairs is a row of eddy current sensors which are arrayed by the eddy current thickness measuring sensors, when the reflection point of the ultrasonic wafer is right below the eddy current thickness measuring sensors at the midpoint, the working mode of the two groups of arrayed eddy current thickness measuring sensors which are arrayed in a crossed mode is triggered to be started, the detection area of the thickness in one-time scanning detection is enlarged, meanwhile, the scanning device of the probe in any angle direction can be realized, namely, the detection area of the scanning detection in any direction is the area which the probe passes through.
When the probe structure is circular, the ultrasonic wafer group can also be circularly arranged on the same circumference, and the working mode of the array eddy current thickness measuring sensor is triggered to be started when the opposite wafer group is reflected at the midpoint.
According to the technical scheme, the invention has the following beneficial effects:
the invention discloses a method for measuring the thickness of a coating by utilizing a twin-crystal ultrasonic sensor to assist triggering of a vortex, which is characterized in that when the twin-crystal ultrasonic sensor detects that the distance Da from a detection surface is equal to a set value D0, the vortex thickness measuring sensor is triggered to start to work, so that the purpose of rapidly detecting the thickness of a steel substrate coating by using ultrasonic-assisted vortex is realized, and the ultrasonic detection sensor and the vortex detection sensor are perfectly fused;
secondly, the parallelism between the detection surface of the probe of the instrument and the surface of the coating is judged by comparing, analyzing and receiving distances of two wafers which are transmitted and received in pairs of the double-crystal ultrasonic sensor, and when the parallelism is judged, the eddy current thickness measuring working mode is triggered to be started, so that the condition that the detection probe is inclined is prevented from obtaining a detection result, the inaccuracy of detection data is avoided, and the further improvement of the detection precision is realized;
thirdly, when the double-crystal ultrasonic sensors are adjusted to be parallel, the aim of scanning and detecting the thickness of the array sensor in a large area is fulfilled by combining the double-crystal ultrasonic sensors of the array with the eddy current thickness measuring sensor, the detection surface is increased, and disposable detection in a large area can be realized in handheld or automatic detection;
in the invention, in the combination of the arrayed bimorph ultrasonic sensors and the eddy current thickness measuring sensors, the bimorph ultrasonic sensors are symmetrically arranged, and the eddy current thickness measuring sensors are arranged in a cross shape or a Chinese character 'mi', so that a probe structure of the scanning device in any angle direction is formed, the detection operation is more convenient to implement, the flexibility is suitable for the detection of different directions of various structural surfaces, and the aim of scanning detection is not missed while large-area detection is realized.
Drawings
FIG. 1 is a schematic flow chart of a detection method according to a preferred embodiment of the present invention;
FIG. 2 is a schematic diagram of the detection method calculation and analysis according to the preferred embodiment of the present invention;
FIG. 3 is a schematic view of a sensor structure of a probe detection surface of a detection instrument according to a preferred embodiment of the present invention;
FIG. 4 is a schematic diagram of the diagonal arrangement of the dual-crystal ultrasonic sensor for detecting the usage status of the dual-crystal ultrasonic sensor in accordance with the preferred embodiment of the present invention;
FIG. 5 is a schematic diagram of a structure of a diagonal double-row array arrangement of a bimorph ultrasonic transducer according to the preferred embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a diagonal square array arrangement of a bimorph ultrasonic transducer according to the preferred embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a dual-crystal ultrasonic sensor according to a preferred embodiment of the present invention, which is arranged in two rows of arrays and combined with an array eddy current thickness measuring sensor;
FIG. 8 is a schematic structural view of a eddy current thickness measuring sensor of a scanning device capable of scanning at any angle and direction according to a dual-crystal ultrasonic sensor arranged in a square array and combined with a double-row cross array in accordance with the preferred embodiment of the present invention;
FIG. 9 is a schematic structural view of a eddy current thickness measuring sensor of a scanning device capable of scanning at any angle and direction, which is arranged in a circular array and combined with a double-row cross array of a bimorph ultrasonic sensor according to the best embodiment of the present invention;
FIG. 10 is a schematic structural view of an eddy current thickness measuring sensor of a scanning device capable of scanning in any angle direction and having a circular array arrangement of bimorph ultrasonic sensors and a double-row array in a shape like a Chinese character 'mi' in accordance with the preferred embodiment of the present invention;
FIG. 11 is a schematic structural diagram of a handheld detection device according to a preferred embodiment of the present invention;
FIG. 12 is a schematic structural diagram of a mechanical automated inspection apparatus according to a preferred embodiment of the present invention.
Detailed Description
The invention is further described with reference to the following drawings and detailed description.
As shown in fig. 1 and 2, a method for measuring thickness of a surface coating layer by using a twin-crystal ultrasonic sensor to assist triggering of a vortex coating layer is used for non-contact nondestructive testing of the thickness of a finished product, a production process or a repair process of a steel substrate device with an anti-corrosion coating layer, and is characterized in that the twin-crystal ultrasonic sensor is used to assist triggering of the vortex coating layer thickness measuring sensor to start the thickness detection, and the method comprises the following specific steps:
a. ultrasonic monitoring: starting a detection device, setting a distance value D0 between the lower surface of the detection probe and the detection surface of the coating, and keeping the bimorph ultrasonic sensor in a state of monitoring the distance value Da between the lower surface of the detection probe and the detection surface of the coating;
b. eddy current thickness measurement: when the distance Da between the lower surface of the detection probe and the coating detection surface is detected by the double-crystal ultrasonic sensor in the step a and when Da = D0, triggering the eddy current coating thickness measuring sensor to start a working mode, and detecting a distance value Db between the lower surface of the detection probe and the metal layer surface;
c. and (3) calculating a thickness value: the coating thickness is calculated by subtracting the distance Da between the lower surface of the detection probe and the detection surface of the coating by ultrasonic detection from the distance Db between the lower surface of the detection probe and the metal layer surface of eddy current detection, namely the coating thickness D = Db-Da.
Furthermore, in the ultrasonic monitoring in the step a, the method also comprises an adjusting step that the detection surface of the detection probe is parallel to the surface of the detected coating, the parallelism between the detection surface of the probe of the instrument and the surface of the coating is judged by comparing, analyzing and receiving distances of two wafers which are transmitted and received in pairs of the double-crystal ultrasonic sensor, and when the detection surface of the probe of the instrument is judged to be parallel, the eddy current thickness measuring working mode is triggered to be started. Because the reaction speed of the ultrasonic and the eddy current is very quick, for example, the ultrasonic transmission speed is 340m/s in the air, the distance between the probe and the detection surface is only millimeter, which is negligible reaction time, and the eddy current is also instant reaction speed, the detection can be finished at the instant of parallel alignment of the probe, thereby not only achieving more flexibility when the probe surface of the adjusting instrument is parallel to the coating surface, but also increasing the difficulty of detection operation without long-time alignment, and the detection can be finished quickly only by instant parallel, namely, the detection can be finished quickly by manual hand-held detection or mechanical automatic adjustment detection, which is very convenient for adjusting the flatness of the detection surface and obtaining the detection result quickly.
In the adjustment that the detection surface of the instrument probe is parallel to the surface of the coating, four two pairs of transmitting and receiving ultrasonic wafers are arranged diagonally, as shown in sensor structures in fig. 3 and 4, corresponding ultrasonic signals are transmitted and received diagonally, and when the reflection point A is concentrated under four points of the opposite angle, the detection surface of the instrument probe is parallel to the surface of the coating, and then the working mode of the eddy current thickness measuring sensor is triggered to be started. As is well known to technicians in the industry, the detection of thickness is greatly influenced by whether the surface of a probe of a detector is parallel to the surface of an object to be detected, and errors on detection accuracy are easily caused.
Alternatively, the adjustment of the parallel of the detection surface of the probe of the instrument and the surface of the coating also comprises a method for adjusting two ultrasonic sensor wafers which are arrayed and reflected in a pairwise opposite angle in parallel as shown in FIG. 5.
Alternatively, the adjustment of the parallel of the detection surface of the probe of the instrument and the surface of the coating also comprises a method for adjusting four rows of ultrasonic sensor wafers which are arranged in a square array and are reflected in pairs at opposite angles as shown in fig. 6.
And as shown in fig. 7, in the adjustment that the detection surface of the probe of the instrument is parallel to the surface of the coating, two groups of ultrasonic wafers which are arranged in parallel array form a pair of wafer pairs which are transmitted and received, the center point of each pair of wafer pairs is an array of eddy current sensors formed by the eddy current thickness measuring sensors, and when the reflection point of the ultrasonic wafer is right below the eddy current thickness measuring sensors at the center point, the working mode of starting the array eddy current thickness measuring sensors is triggered. The whole row of detection is formed, and the detection area of the thickness is expanded by scanning once while the parallel surface is adjusted.
Further, as shown in fig. 8, the ultrasonic wafer groups are arranged on four sides of a square or rectangle, two opposite groups form a pair of wafer pairs for receiving and transmitting, the midpoint of each pair of wafer pairs is a row of eddy current sensors of which the eddy current thickness measuring sensors form an array, and when the reflection point of the ultrasonic wafer is right below the eddy current thickness measuring sensors at the midpoint, the working mode of the two sets of array eddy current thickness measuring sensors which are arranged in a cross manner is triggered to be turned on. The device for scanning the thickness of the probe in any angle direction is realized while the detection area of the thickness of the probe for scanning in one time is enlarged, namely the detection area of the scanning detection in any direction is the area passed by the probe.
In another mode, in the adjustment that the detection surface of the instrument probe is parallel to the surface of the coating, the ultrasonic wafer groups are circularly arranged on the same circumference, and when the opposite wafer groups are reflected at the midpoint, the working mode of the array eddy current thickness measuring sensor is triggered to be started. As shown in fig. 9 and 10, the eddy current thickness measuring sensors may be arranged in a cross or a zigzag structure, and any two of the circumferentially arranged array bimorph ultrasonic sensors may be arranged in pairs to form a transceiver pair structure, so that the emitting and receiving directions of the wafer can be adjusted, different detection requirements can be flexibly set, and the detection probe device of the scanning device in any angle and direction can be realized. The perfect integration of the ultrasonic detection sensor and the eddy current detection sensor is realized.
As shown in fig. 3 to 12, the invention also discloses a device for detecting thickness of eddy current coating by using the assistance of a twin-crystal ultrasonic sensor, which is used for a non-contact nondestructive detection device for detecting thickness of a finished product, a production process or a surface coating thickness in a repair process of a steel substrate device (1) with an anticorrosion coating layer 11 by using the assistance of the twin-crystal ultrasonic sensor to trigger the operation of detecting thickness of the eddy current coating, and comprises a control driving part 2 and a detection probe part 3, wherein the detection probe part 3 comprises a twin-crystal ultrasonic sensor 31 and an eddy current thickness measuring sensor 32, the device is characterized in that the detection probe part 3 is of a square structure, the ultrasonic wafers which are received and transmitted in pairs are arranged in a square manner oppositely, corresponding ultrasonic signals are transmitted and received oppositely, when reflection points of a plurality of groups of ultrasonic wafers are concentrated under the ultrasonic wafers which are received and transmitted in pairs, the detection surface of an instrument probe is determined to be parallel to the surface of the coating, the operating mode of the eddy current thickness measuring sensor is triggered to be started. As shown in fig. 11, the control driving part 2 may be configured as a handheld structure, which includes a handle 21 for manual operation of an operator, and a display screen 22 disposed at the front 21 of the handle, so that the operator can pay attention to the detection result when the bimorph ultrasonic sensor 31 triggers the eddy current thickness measuring sensor 32 to enter the detection mode. In addition, the control driving part 2 may be provided with an automatic robot structure including a robot arm 23 and a data wire 24, the movement of the detecting device is controlled by the automatic robot arm 23, and the data wire 24 is connected to a detection data processing center for data transmission and storage.
The bimorph ultrasonic sensor 31 and the eddy current thickness measuring sensor 32 are arranged in a grouped and paired array arrangement. For example, two ultrasonic sensor wafers 31 arranged in an array and parallel to form pairwise opposite angle reflection are used for adjusting the detection surface of an instrument probe to be parallel to the surface of a coating, and are matched with a single eddy current thickness measuring sensor 31 arranged in the middle of each pair of ultrasound sensor wafers reflected in pairwise opposite angles or form an array; or, four ultrasonic sensor wafers 31 which are arranged in a square array and are parallel to form pairwise opposite angle reflection are used for adjusting the detection surface of the instrument probe to be parallel to the surface of the coating, and are matched with a single ultrasonic sensor wafer which is arranged in the middle of each pair of pairwise opposite angle reflection ultrasonic sensor wafers or form two cross-shaped eddy current thickness measuring sensors 31 which are arranged in an array; or, two groups of ultrasonic wafers 31 arranged in parallel array form a pair of wafer pairs for receiving and sending, the center point of each pair of wafer pairs is a row of eddy current thickness measuring sensors 32 formed by eddy current thickness measuring sensors, when the reflection point of the ultrasonic wafer is right below the eddy current thickness measuring sensor at the center point, the working mode of the array eddy current thickness measuring sensors is triggered to be started, the whole row of detection is formed, and the detection area of the thickness for one-time scanning detection is enlarged while the parallel plane is adjusted; or the ultrasonic wafer groups are arranged on four sides which are parallel in pairs and are square or rectangular, two opposite groups form a pair of wafer pairs which are transmitted and received, the midpoint of each pair of wafer pairs is a row of eddy current sensors which are arrayed by the eddy current thickness measuring sensors, when the reflection point of the ultrasonic wafer is right below the eddy current thickness measuring sensors at the midpoint, the working mode of the two groups of arrayed eddy current thickness measuring sensors which are arrayed in a crossed mode is triggered to be started, the detection area of the thickness in one-time scanning detection is enlarged, meanwhile, the scanning device of the probe in any angle direction can be realized, namely, the detection area of the scanning detection in any direction is the area which the probe passes through.
When the probe structure is circular, the ultrasonic wafer group can also be circularly arranged on the same circumference, and the working mode of the array eddy current thickness measuring sensor is triggered to be started when the opposite wafer group is reflected at the midpoint.
The above is one embodiment of the present invention. Furthermore, it is to be understood that all equivalent or simple changes in the structure, features and principles described in the present patent concepts are included in the scope of the present patent.
Claims (10)
1. A method for measuring thickness of a vortex coating by using a bicrystal ultrasonic sensor for assisting triggering is characterized in that the bicrystal ultrasonic sensor is used for assisting in triggering the vortex coating thickness measuring sensor to start the work of thickness detection, and the method comprises the following specific steps:
a. ultrasonic monitoring: starting a detection device, setting a distance value D0 between the lower surface of the detection probe and the detection surface of the coating, and keeping the bimorph ultrasonic sensor in a state of monitoring the distance value Da between the lower surface of the detection probe and the detection surface of the coating;
b. eddy current thickness measurement: when the distance Da between the lower surface of the detection probe and the coating detection surface is detected by the double-crystal ultrasonic sensor in the step a and when Da = D0, triggering the eddy current coating thickness measuring sensor to start a working mode, and detecting a distance value Db between the lower surface of the detection probe and the metal layer surface;
c. and (3) calculating a thickness value: the coating thickness is calculated by subtracting the distance Da between the lower surface of the detection probe and the detection surface of the coating by ultrasonic detection from the distance Db between the lower surface of the detection probe and the metal layer surface of eddy current detection, namely the coating thickness D = Db-Da.
2. The method as claimed in claim 1, wherein the ultrasonic monitoring in step a further comprises an adjustment step of making the detection surface of the detection probe parallel to the surface of the coating to be detected, the parallelism between the detection surface of the probe and the surface of the coating is determined by comparing the distances received and transmitted by two paired transmitting and receiving wafers of the bimorph ultrasonic sensor, and the eddy current thickness measurement mode is triggered to be turned on when the parallelism is determined.
3. The method as claimed in claim 2, wherein the eddy current coating thickness measurement is triggered by the aid of the bimorph ultrasonic sensor, wherein the probe detection surface of the instrument is parallel to the coating surface, corresponding ultrasonic signals are transmitted and received diagonally through four pairs of ultrasonic transmitting and receiving wafers arranged diagonally, and when the reflection point a is concentrated under four opposite corners, the probe detection surface of the instrument is parallel to the coating surface, and the operation mode of the eddy current thickness measurement sensor is triggered to be turned on.
4. The method as claimed in claim 3, wherein the adjustment of the probe detection surface of the instrument to be parallel to the coating surface further comprises adjusting two rows of parallel ultrasonic sensor wafers in an array to reflect at opposite angles.
5. The method as claimed in claim 3 or 4, wherein the adjustment of the probe detection surface of the instrument to be parallel to the coating surface further comprises adjusting four rows of parallel ultrasonic sensor wafers in a square array to reflect at opposite angles.
6. The method as claimed in claim 2, wherein the adjustment of the probe detection surface of the apparatus parallel to the coating surface is performed by arranging two sets of ultrasonic wafers in parallel array, wherein two opposite sets of ultrasonic wafers form a pair of wafer pairs for receiving and transmitting, the center point of each pair of wafer pairs is a row of eddy current sensors of the eddy current thickness measurement sensor array, and when the reflection point of the ultrasonic wafer is right below the eddy current thickness measurement sensor at the center point, the operation mode of the array eddy current thickness measurement sensor is triggered to be turned on.
7. The method as claimed in claim 6, wherein the ultrasonic wafer sets are arranged on four sides of a square or rectangle in pairs, two opposite sets form a pair of wafer pairs for receiving and transmitting, the center point of each pair of wafer pairs is a row of eddy current sensors forming an array with the eddy current thickness measuring sensors, and when the reflection point of the ultrasonic wafer is right below the eddy current thickness measuring sensors at the center point, the operation mode of turning on the two sets of eddy current thickness measuring sensors arranged in a cross manner is triggered.
8. The method as claimed in claim 2, wherein the probe detection surface of the instrument is parallel to the coating surface, and the ultrasonic waferland sets are circularly arranged on the same circumference, and the operation mode of the array eddy current thickness measuring sensor is triggered to be started when the opposite waferland sets are reflected at the midpoint.
9. The utility model provides an utilize bimorph ultrasonic sensor to assist and trigger vortex coating thickness measurement's detection device, includes bimorph ultrasonic sensor, including control drive part (2) and test probe part (3), test probe part (3) are including bimorph ultrasonic sensor (31) and vortex thickness measurement sensor (32), its characterized in that test probe part (3) are square structure, the square relative setting of ultrasonic wafer that receives and dispatches in pairs, relative transmission and receiving corresponding ultrasonic signal, when the reflection point of multiunit ultrasonic wafer is concentrated under the ultrasonic wafer that receives and dispatches in pairs, judge that instrument probe check surface is parallel with the coating surface, just trigger the mode of opening vortex thickness measurement sensor.
10. The device for detecting eddy current coating thickness measurement using the aid of the bimorph ultrasonic transducer according to claim 9, wherein the bimorph ultrasonic transducer (31) and the eddy current thickness measuring transducer (32) are arranged in a grouped pair array.
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