CN113763822B - Bonding alignment compensation method and compensation device thereof - Google Patents
Bonding alignment compensation method and compensation device thereof Download PDFInfo
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- CN113763822B CN113763822B CN202111211175.3A CN202111211175A CN113763822B CN 113763822 B CN113763822 B CN 113763822B CN 202111211175 A CN202111211175 A CN 202111211175A CN 113763822 B CN113763822 B CN 113763822B
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Abstract
The embodiment of the application discloses a bonding alignment compensation method and a compensation device thereof. In one embodiment, the method comprises: acquiring coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards; calculating to obtain the alignment coordinates of the first circuit board according to the average value of the coordinates of the at least four first alignment marks, and calculating to obtain the alignment coordinates of the display panel according to the average value of the coordinates of the at least four second alignment marks; and calculating according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel to obtain the offset of the first circuit board and the display panel in the first direction on the bonding station, and performing alignment compensation of the offset distance in the first direction according to the offset distance. According to the embodiment, the influence of the warping of the board, which is caused by the high-temperature process for many times in the production process, of the first circuit board can be effectively reduced, the bonding offset is reduced, and the bonding quality is improved.
Description
Technical Field
The application relates to the technical field of bonding compensation. And more particularly, to a bonding alignment compensation method and a compensation device thereof.
Background
At present, soft and hard combined board PCBA is often used in the design of display panel products, and because the soft and hard combined board PCBA is connected with a flexible circuit board FPC and a printed circuit board PCB, the soft and hard combined board PCBA can reduce a FOB (FPC ON PCB, the flexible circuit board is connected with the printed circuit board) bonding procedure.
However, the PCBA of the flexible printed circuit board is subjected to a plurality of high temperature processes in the surface mount technology (SMT, surface Mounted Technology) production process, so that slight warpage deformation of the PCB board can be generated, thereby causing offset of positioning of the FPC ON the PCBA of the flexible printed circuit board, and causing difficulty in positioning and alignment of the FPC and the display panel in the bonding process of the FOG (FPC ON GLASS, flexible circuit board and GLASS substrate).
Disclosure of Invention
The application aims to provide a bonding alignment compensation method and a compensation device thereof, which are used for solving at least one of the problems existing in the prior art.
In order to achieve the above purpose, the application adopts the following technical scheme:
the first aspect of the present application provides a bonding alignment compensation method for bonding alignment of a first circuit board and a display panel, where the first circuit board includes a printed circuit board and a plurality of flexible circuit boards arranged side by side, the flexible circuit board is provided with a first alignment mark, and the display panel is provided with a plurality of second alignment marks corresponding to the plurality of flexible circuit boards, and the method includes:
acquiring coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards, wherein the at least four flexible circuit boards comprise two flexible circuit boards positioned at the middle position and two flexible circuit boards positioned at the edge positions;
calculating to obtain the alignment coordinates of the first circuit board according to the average value of the coordinates of the at least four first alignment marks, and calculating to obtain the alignment coordinates of the display panel according to the average value of the coordinates of the at least four second alignment marks;
and calculating according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel to obtain the offset of the first circuit board and the display panel in the first direction on the bonding station and performing alignment compensation of the offset distance of the first direction according to the offset distance, wherein the first direction is the direction of the first circuit board towards the display panel on the bonding station.
According to the bonding alignment compensation method provided by the first aspect of the application, the alignment coordinates of the first circuit board are obtained by obtaining the coordinates of the first alignment marks of at least four flexible circuit boards in the first circuit board and the coordinates of at least four second alignment marks in the display panel corresponding to the at least four flexible circuit boards, the alignment coordinates of the first circuit board are obtained by calculating according to the average value of the coordinates of the at least four first alignment marks, the alignment coordinates of the display panel are obtained by calculating according to the average value of the coordinates of the at least four second alignment marks, and then the alignment compensation of the first circuit board and the display panel on the bonding station is obtained by calculating according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel and the alignment compensation of the offset distance of the first direction is carried out according to the offset distance of the first circuit board and the display panel, so that the influence of the warpage of the board, caused by a plurality of high-temperature processes in the production process, on the bonding offset of the first circuit board and the display panel in the first direction can be effectively reduced, and bonding quality is improved.
Optionally, the method further comprises:
and calculating according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel to obtain the offset of the first circuit board and the display panel in the second direction on the bonding station and performing alignment compensation of the offset distance in the second direction according to the offset distance, wherein the second direction is the arrangement direction of the flexible circuit boards on the bonding station.
In the alternative mode, the offset of the first circuit board and the display panel in the second direction on the bonding station can be calculated, and the alignment compensation of the offset distance in the second direction is carried out on the offset distance, so that the influence of the warping of the board, caused by the repeated high-temperature process in the production process, on the bonding alignment of the first circuit board and the display panel in the second direction can be effectively reduced, the bonding offset is reduced, and the bonding quality is improved.
Optionally, the method further comprises:
and calculating to obtain the angular offset of the first circuit board and the display panel on the bonding station according to the alignment coordinates of the first circuit board, the alignment coordinates of the display panel and the coordinate distances of the first alignment marks of the two flexible circuit boards positioned at the edge positions, and performing alignment compensation of the offset angle according to the angular offset.
According to the method, the angle offset of the first circuit board and the display panel on the bonding station can be obtained, and the alignment compensation of the offset angle can be carried out according to the angle offset, so that the influence of the plate warpage of the first circuit board on the alignment of the angle offset of the first circuit board and the display panel caused by the high-temperature process for many times in the production process can be effectively reduced, the bonding offset is reduced, and the bonding quality is improved.
Optionally, the obtaining the coordinates of the first alignment marks of the at least four flexible circuit boards and the coordinates of the at least four second alignment marks corresponding to the at least four flexible circuit boards includes:
moving the first circuit board to an image acquisition station, acquiring first images of at least four flexible circuit boards by using a movable image acquisition device or at least four image acquisition devices, and acquiring coordinates of first alignment marks of the at least four flexible circuit boards according to the first images;
moving the first circuit board to a bonding station in a first stroke;
moving the display panel to an image acquisition station, acquiring second images of areas of at least four second alignment marks of the display panel corresponding to the at least four flexible circuit boards by using a movable image acquisition device or at least four image acquisition devices, and acquiring coordinates of the at least four second alignment marks according to the second images;
and moving the display panel to the bonding station in the first travel.
In the alternative mode, the image acquisition device is used for completing the acquisition of the first image of the first circuit board and the second image of the display panel, and the first circuit board and the display panel are moved to the bonding station by the same stroke, so that the bonding alignment of the first circuit board and the display panel can be ensured not to be influenced by the stroke.
Optionally, obtaining the coordinates of the first alignment marks of the at least four flexible circuit boards and the coordinates of the at least four second alignment marks corresponding to the at least four flexible circuit boards includes: and acquiring the coordinates of the first alignment marks of all the flexible circuit boards and the coordinates of all the second alignment marks corresponding to all the flexible circuit boards.
In this alternative manner, the accuracy of bonding alignment of the first circuit board and the display panel can be made higher by acquiring the coordinates of the first alignment marks of all the flexible circuit boards and the coordinates of all the second alignment marks in the display panel corresponding to the flexible circuit boards.
The second aspect of the present application provides a bonding alignment compensation device for bonding alignment of a first circuit board and a display panel, where the first circuit board includes a printed circuit board and a plurality of flexible circuit boards arranged side by side, the flexible circuit board is provided with a first alignment mark, and the display panel is provided with a plurality of second alignment marks corresponding to the plurality of flexible circuit boards, the device includes:
the device comprises an acquisition unit, a display unit and a display unit, wherein the acquisition unit is used for acquiring coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards, wherein the at least four flexible circuit boards comprise two flexible circuit boards positioned at middle positions and two flexible circuit boards positioned at edge positions;
the computing unit is used for computing the alignment coordinates of the first circuit board according to the average value of the coordinates of the at least four first alignment marks, and computing the alignment coordinates of the display panel according to the average value of the coordinates of the at least four second alignment marks;
and the compensation unit is used for calculating and obtaining the offset of the first circuit board and the display panel in the first direction on the bonding station according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel and carrying out alignment compensation of the offset distance in the first direction according to the offset distance, wherein the first direction is the direction of the first circuit board facing the display panel on the bonding station.
According to the bonding alignment compensation device provided by the second aspect of the application, the coordinates of the first alignment marks of at least four flexible circuit boards in the first circuit board and the coordinates of at least four second alignment marks in the display panel corresponding to the at least four flexible circuit boards are obtained through the obtaining unit, the alignment coordinates of the first circuit board are obtained through calculation according to the average value of the coordinates of the at least four first alignment marks through the calculating unit, the alignment coordinates of the display panel are obtained through calculation according to the average value of the coordinates of the at least four second alignment marks, and then the alignment compensation of the offset distance between the first circuit board and the display panel in the first direction on the bonding station is obtained through calculation according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel through the compensating unit and the offset distance of the offset distance in the first direction is carried out according to the offset distance.
Optionally, the compensation unit is further configured to calculate, according to the alignment coordinate of the first circuit board and the alignment coordinate of the display panel, obtain an offset between the first circuit board and the display panel in a second direction on the bonding station, and perform alignment compensation of an offset distance in the second direction according to the offset between the first circuit board and the display panel, where the second direction is an arrangement direction of the plurality of flexible circuit boards on the bonding station.
In the alternative mode, the offset in the second direction of the first circuit board and the display panel on the bonding station can be obtained through calculation by the calculation unit, and the offset distance in the second direction is aligned and compensated by the compensation unit, so that the influence of the warping of the board, caused by the repeated high-temperature process in the production process, of the first circuit board on the bonding alignment in the second direction of the first circuit board and the display panel can be effectively reduced, the bonding offset is reduced, and the bonding quality is improved.
Optionally, the compensation unit is further configured to calculate, according to the alignment coordinates of the first circuit board, the alignment coordinates of the display panel, and the coordinate distances of the first alignment marks of the two flexible circuit boards located at the edge positions, obtain an angular offset between the first circuit board and the display panel at the bonding station, and perform alignment compensation of the offset angle according to the angular offset.
According to the method, the angle offset of the first circuit board and the display panel on the bonding station can be obtained through the calculating unit, and the alignment compensation of the offset angle is carried out through the compensating unit according to the angle offset, so that the influence of the warping of the board, caused by the repeated high-temperature process in the production process, on the alignment of the angle offset of the first circuit board and the display panel can be effectively reduced, the bonding offset is reduced, and the bonding quality is improved.
Optionally, the method further comprises: the image acquisition unit comprises a movable image acquisition device or at least four image acquisition devices;
the displacement mechanism is used for moving the first circuit board to the image acquisition station;
the image acquisition unit is used for acquiring first images of at least four flexible circuit boards of a first circuit board positioned at the image acquisition station;
the acquisition unit is used for acquiring coordinates of first alignment marks of at least four flexible circuit boards according to the first image;
the displacement mechanism is also used for moving the first circuit board to the bonding station in a first stroke;
the displacement mechanism is also used for moving the display panel to the image acquisition station;
the image acquisition unit is further used for acquiring second images of areas of at least four second alignment marks corresponding to the at least four flexible circuit boards of the display panel positioned at the image acquisition station;
the acquisition unit is further used for acquiring coordinates of at least four second alignment marks according to the second image;
the displacement mechanism is also used for moving the display panel to the bonding station in the first travel.
In the alternative mode, the image acquisition unit is used for completing the acquisition of the first image of the first circuit board and the second image of the display panel, and the first circuit board and the display panel are moved to the bonding station by the same travel through the displacement mechanism, so that the bonding alignment of the first circuit board and the display panel can be ensured not to be influenced by the travel.
Optionally, the acquiring unit is configured to acquire coordinates of the first alignment marks of all the flexible circuit boards and coordinates of all the second alignment marks corresponding to all the flexible circuit boards.
In this alternative manner, the acquiring unit acquires the coordinates of the first alignment marks of all the flexible circuit boards and the coordinates of all the second alignment marks in the display panel corresponding to the flexible circuit boards, so that the bonding alignment accuracy of the first circuit boards and the display panel is higher.
The beneficial effects of the application are as follows:
according to the technical scheme, the coordinates of the first alignment marks of at least four flexible circuit boards in the first circuit board and the coordinates of at least four second alignment marks in the display panel corresponding to the at least four flexible circuit boards are obtained, the alignment coordinates of the first circuit board are obtained according to the average value calculation of the coordinates of the at least four first alignment marks, the alignment coordinates of the display panel are obtained according to the average value calculation of the coordinates of the at least four second alignment marks, and then the alignment compensation of the first bonding circuit board and the display panel on the positioning station is obtained according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel, and the alignment compensation of the offset distance of the first bonding circuit board and the display panel in the first direction is carried out according to the offset distance of the first bonding circuit board and the display panel in the first bonding station, so that the influence of the first circuit board on bonding alignment of the first circuit board and the display panel due to plate warpage caused by a plurality of high-temperature processes in the production process can be eliminated.
Drawings
The following describes the embodiments of the present application in further detail with reference to the drawings.
Fig. 1 shows a schematic view of a soft and hard combined board PCBA producing slight PCB board warp deformation.
Fig. 2 shows a schematic diagram of a rigid-flex printed circuit board PCBA with 6 FPCs.
FIG. 3 is a schematic diagram illustrating a prior art method of bonding offsets that exceed regulatory specifications.
Fig. 4 is a flowchart illustrating a bonding alignment compensation method according to an embodiment of the present application.
Fig. 5 shows a schematic diagram of a first acquisition station provided by an embodiment of the present application.
Fig. 6 shows a schematic diagram of a second acquisition station provided by an embodiment of the present application.
Fig. 7 is a schematic diagram showing a result of bonding alignment compensation performed by collecting 6 FPC images according to the bonding alignment compensation method provided by the embodiment of the present application.
Fig. 8 is a schematic diagram of a bonding alignment compensation device according to an embodiment of the application.
Detailed Description
In order to more clearly illustrate the present application, the present application will be further described with reference to examples and drawings. Like parts in the drawings are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and that this application is not limited to the details given herein.
At present, a soft and hard combined board PCBA is often used in the design of a display panel product, and because the soft and hard combined board PCBA is well connected with a flexible circuit board FPC and a printed circuit board PCB, the soft and hard combined board PCBA is used only by a FOG (FPC ON GLASS, the flexible circuit board is connected with a GLASS substrate) bonding process, and the bonding process of the FOB (FPC ON PCB, the flexible circuit board is connected with the printed circuit board) is reduced, so that the process is shortened, and the product yield is also improved.
However, the PCBA of the rigid-flex board undergoes multiple high temperature processes in the surface mount technology (SMT, surface Mounted Technology) production process, which can generate slight warpage deformation of the PCB board, as shown in fig. 1, thereby causing positioning offset of the FPC on the PCBA of the rigid-flex board, and making positioning and alignment of the FPC and the display panel difficult in the FOG bonding process.
For the above problems, the conventional FOG bonding apparatus uses a camera to capture two pairs of alignment positions, and the influence of the warp deformation of the PCBA of the rigid-flex board on the offset of the FOG bonding in the Y direction (vertical direction) is more obvious, so the Y-direction offset is exemplified as follows.
For example, in the existing product, 6 FPCs are used by using the printed circuit board PCBA, as shown in fig. 2, the coordinates of FCP1 to FPC6 are respectively (Xf 1, yf 1), (Xf 2, yf 2), (Xf 3, yf 3), (Xf 4, yf 4), (Xf 5, yf 5), (Xf 6, yf 6), the coordinates of the corresponding display panels FOG1 to FOG6 are respectively (Xp 1, yp 1), (Xp 2, yp 2), (Xp 3, yp 3), (Xp 4, yp 4), (Xp 5, yp 5), (Xp 6, yp 6), and the alignment is performed by using Mark (anchor point) of FPC2 and FPC5, and the alignment algorithm is as follows:
calculating the midpoint of the PCB as (Xfm, yfm) by using the FPC2 coordinates (Xf 2, yf 2) and the FPC5 coordinates (Xf 5, yf 5), namely:
Xfm＝(Xf2+Xf5)/2；
Yfm＝(Yf2+Yf5)/2；
the midpoint between the display panel FOG2 and FOG5 is calculated as (Xpm, ypm) by the display panel FOG2 coordinates (Xp 2, yp 2) and the display panel FOG5 coordinates (Xp 2, yp 5), namely:
Xpm＝(Xp2+Xp5)/2；
Ypm＝(Yp2+Yp5)/2。
the calculated compensation amount is as follows:
ΔX＝Xfm-Xpm,
ΔY＝Yfm-Ypm,
Δθ＝(Yfm-Ypm)/(Xt+Xfm-Xpm),
wherein DeltaX is the compensation amount in the horizontal direction; Δy is the compensation amount in the vertical direction; delta theta is the compensation quantity of the offset angle of the PCBA and the display panel of the soft and hard combined plate; xt is the spacing between FPC2 and FPC 5.
Assuming that Y-direction offset amounts are 180um, 90um, 75um, 85um, 100um and 190um respectively when FPC1-FPC 6 are aligned due to warpage of a soft and hard combined board PCBA, aligning is carried out by using marks of FPC2 and FPC5 in the prior art, compensating for-95 um, then Y-direction offset amounts are 85um, -5um, -20um, -5um, 10um and 95um respectively after alignment (positive and negative values represent the offset direction of the alignment FPC relative to the Mark of a display panel), and the fact that the offset amount of FPC2/5Mark is 80um can be seen, the offset amounts of FPC1 and FPC6Y exceed the specification, and the product becomes a defective product as shown in figure 3.
Therefore, under the condition that the PCB in the soft and hard combined plate PCBA has buckling deformation, the influence of the buckling deformation on other positioning cannot be accurately identified in the prior art, the condition that the bonding offset exceeds the control specification is easily generated, and particularly for a notebook display screen, the buckling deformation phenomenon is more obvious and the influence on the offset is also more remarkable because the used soft and hard combined plate PCBA is longer.
In view of this, taking bonding alignment applied to a first circuit board (printed circuit board assembly) and a display panel as an example, one embodiment of the present application provides a bonding alignment compensation method, as shown in fig. 4, comprising the following steps:
s10, acquiring coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards.
Wherein the at least four flexible circuit boards include two flexible circuit boards located at intermediate positions and two flexible circuit boards located at edge positions.
In a specific example, the soft and hard combined board PCBA includes a printed circuit board PCB and a plurality of flexible circuit boards arranged side by side, a first alignment mark is disposed on the flexible circuit board, and a plurality of second alignment marks are disposed at positions of the display panel corresponding to the flexible circuit board. The number of the flexible circuit boards is an even number of at least four, for example, 4, 6, 8, 10, 12, etc.
In this embodiment, taking 6 flexible circuit boards shown in fig. 2 as an example, first alignment marks (Xf 1, yf 1), (Xf 2, yf 2), (Xf 3, yf 3), (Xf 4, yf 4), (Xf 5, yf 5), (Xf 6, yf 6) are disposed on each flexible circuit board, and a plurality of second alignment marks (Xp 1, yp 1), (Xp 2, yp 2), (Xp 3, yp 3), (Xp 4, yp 4), (Xp 5, yp 5), (Xp 6, yp 6) are disposed at positions of the display panel corresponding to the flexible circuit boards. The coordinates of the first alignment marks of the four flexible circuit boards and the coordinates of the four corresponding second alignment marks are obtained, so that the FPC positioning and display panel bonding alignment offset can be ensured to meet the requirements of the control specification.
The four flexible circuit boards include two flexible circuit boards located at the middle position and two flexible circuit boards located at the edge positions, in this embodiment, (Xf 1, yf 1), (Xf 3, yf 3), (Xf 4, yf 4), (Xf 5, yf 5), (Xf 6, yf 6) and their corresponding (Xp 1, yp 1), (Xp 3, yp 3), (Xp 4, yp 4), (Xp 6, yp 6) are obtained.
In one possible implementation, step S10 includes:
and S100, moving the first circuit board to an image acquisition station, acquiring first images of at least four flexible circuit boards by using a movable image acquisition device or at least four image acquisition devices, and acquiring coordinates of first alignment marks of the at least four flexible circuit boards according to the first images.
Continuing with the previous example, the coordinates (Xf 3, yf 3), (Xf 4, yf 4) of the two flexible circuit boards located at the intermediate position, and the coordinates (Xf 1, yf 1), (Xf 6, yf 6) of the two flexible circuit boards located at the edge position, which are obtainable by capturing the first image of the flexible circuit boards with the image capturing device.
In this embodiment, the image acquisition station is provided with two acquisition stations, and first acquisition station department is provided with mobilizable image acquisition device, and as shown in fig. 5, first acquisition station department is provided with the motion control unit and the mobilizable image acquisition device of left and right sides. The left side motion control unit drives the left side movable image acquisition device to acquire a first image of the FPC1-FPC3, and the right side motion control unit drives the right side movable image acquisition device to acquire a first image of the FPC4-FPC6, wherein the image acquisition device is a CCD industrial camera. The first collection station can adapt to and gather the product that includes flexible circuit board of different quantity in the soft or hard combined board PCBA, uses the camera quantity less, practices thrift the cost.
The second acquisition station department is provided with a plurality of fixed image acquisition devices, and image acquisition device such as CCD industry camera, as shown in FIG. 6, and second acquisition station department is provided with 6 fixed counterpoint cameras, corresponds the below position of 6 flexible circuit boards respectively, and every fixed counterpoint camera is responsible for gathering the first image of its flexible circuit board that corresponds. The second collection station can collect the product that the quantity of flexible circuit board is less than the camera quantity in the soft and hard combined board PCBA, uses the camera quantity more, and the cost is higher, can not adjust fixed counterpoint camera position when corresponding different products, but when the quantity of flexible circuit board is less than the product of fixed counterpoint camera quantity in the soft and hard combined board PCBA is gathered, because every camera only needs the image acquisition work of being responsible for a flexible circuit board, consequently efficiency is higher.
The first collecting station has stronger applicability than the second collecting station, and the two collecting stations can collect the first image of the flexible circuit board, so that in practical application, different collecting stations can be selected according to the situation, for example, when the number of the flexible circuit boards in the PCBA is smaller than the number of the fixed alignment cameras, the first collecting station or the second collecting station is selected; when the number of the flexible circuit boards in the soft and hard combined board PCBA is larger than the number of the fixed alignment cameras, a first acquisition station is selected. In this embodiment, the 6 flexible circuit boards may select the first collecting station or the second collecting station when taking the first images of the FPCs 1, 3, 4 and 6.
S102, moving the first circuit board to the bonding station in a first stroke.
Continuing with the above example, after the second pick up station is selected to pick up the first images of FPC1, FPC3, FPC4, and FPC6, the rigid-flex printed circuit board PCBA is moved to the bonding station in a first stroke using the first lead screw.
And S104, moving the display panel to an image acquisition station, acquiring second images of areas of at least four second alignment marks of the display panel corresponding to the at least four flexible circuit boards by using a movable image acquisition device or at least four image acquisition devices, and acquiring coordinates of the at least four second alignment marks according to the second images.
Continuing with the above example, the first alignment mark coordinates (Xf 1, yf 1) of the FPC1, the first alignment mark coordinates (Xf 3, yf 3) of the FPC3, the first alignment mark coordinates (Xf 4, yf 4) of the FPC4, and the first alignment mark coordinates (Xf 6, yf 6) of the FPC6 are obtained by capturing the first images of the FPCs 1, 3, 4, and 6 according to the second capturing station, and the plurality of second alignment marks in the display panel corresponding to (Xf 1, yf 1), (Xf 3, yf 3), (Xf 4, yf 4), (Xf 6, yf 6) can also be captured by the image capturing device.
Moving the display panel to an image acquisition station, and also selecting a second acquisition station to acquire second images of areas of four second alignment marks of the display panel corresponding to the FPC1, the FPC2, the FPC3 and the FPC4, wherein the coordinates of the four second alignment marks acquired according to the second images are respectively as follows: (Xp 1, yp 1), (Xp 3, yp 3), (Xp 4, yp 4), (Xp 6, yp 6).
And S106, moving the display panel to the bonding station by the first travel.
Continuing the above example, after selecting the second collecting station to collect the second images of the areas of the display panel corresponding to the four second alignment marks of FPC1, FPC2, FPC3 and FPC4, the display panel is moved to the bonding station in the first stroke by using the second screw rod.
It should be noted that, use first lead screw to drive soft and hard combined board PCBA and remove to bonding station with first stroke, and use the second lead screw to drive display panel and remove to bonding station with first stroke, wherein, the scope of removal and first stroke all can be adjusted, but soft and hard combined board PCBA and display panel remove to bonding station's route unanimously from the image acquisition station.
S20, calculating to obtain the alignment coordinates of the first circuit board (PCBA) according to the average value of the coordinates of the at least four first alignment marks, and calculating to obtain the alignment coordinates of the display panel according to the average value of the coordinates of the at least four second alignment marks.
Continuing the above example, the alignment coordinates (midpoint coordinates) (Xfm 1, yfm) of the rigid-flex board PCBA are calculated from the average of the obtained first alignment mark coordinates (Xf 1, yf 1), (Xf 3, yf 3), (Xf 4, yf 4), (Xf 6, yf 6) of FPC1, FPC3, FPC4, and FPC6, as:
Xfm1＝(Xf1+Xf3+Xf4+Xf6)/4,
Yfm1＝(Yf1+Yf3+Yf4+Yf6)/4。
the alignment coordinates (midpoint coordinates) (Xpm, ypm 1) of the display panel are obtained by calculating the average value of the obtained coordinates (Xp 1, yp 1), (Xp 3, yp 3), (Xp 4, yp 4), (Xp 6, yp 6) of the four second alignment marks, and are:
Xpm1＝(Xp1+Xp3+Xp4+Xp6)/4,
Ypm1＝(Yp1+Yp3+Yp4+Yp6)/4。
s30, calculating to obtain offset in a first direction (Y direction) between the first circuit board and the display panel on the bonding station according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel, and performing alignment compensation of offset distance in the first direction according to the offset distance, wherein the first direction is the direction of the first circuit board facing the display panel on the bonding station.
Continuing the above example, because of the warp deformation of the PCB board, the deformation of the PCBA of the rigid-flex board in the vertical direction is most serious, and the offset between the PCBA of the rigid-flex board and the display panel in the vertical direction on the bonding station is calculated according to (Xfm 1, yfm 1) (Xpm, ypm 1): Δy1= Yfm1 to Ypm1, and the offset distance in the vertical direction is compensated for by Δy1.
In one possible implementation, the method further includes:
and S40, calculating according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel to obtain the offset of the first circuit board and the display panel in the second direction on the bonding station and performing alignment compensation of the offset distance in the second direction according to the offset distance, wherein the second direction (X direction) is the arrangement direction of the flexible circuit boards on the bonding station.
Continuing the above example, because of the warp deformation of the PCB board, the horizontal direction of the PCBA of the rigid-flex board is slightly deformed, and the offset between the PCBA of the rigid-flex board and the horizontal direction of the display panel on the bonding station is calculated according to (Xfm 1, yfm 1) (Xpm, ypm 1): Δx1=xfm1-Xpm 1, and the offset distance in the horizontal direction is compensated for by Δx1.
In one possible implementation, the method further includes:
and S50, calculating to obtain the angular offset of the first circuit board and the display panel on the bonding station according to the alignment coordinates of the first circuit board, the alignment coordinates of the display panel and the coordinate distances of the first alignment marks of the two flexible circuit boards positioned at the edge positions, and performing alignment compensation of the offset angle according to the angular offset.
Continuing the above example, because of the warp deformation of the PCB board, the PCBA of the rigid-flex board and the display panel also have a slight offset angle, and according to the alignment coordinates (Xfm 1, yfm 1) of the rigid-flex board, the alignment coordinates (Xpm, ypm 1) of the display panel, and the coordinate distance Xt1 of the first alignment marks of the two flexible circuit boards located at the edge positions, the angular offset between the PCBA of the rigid-flex board and the display panel on the bonding station is calculated as: Δθ1= (Yfm 1-Ypm 1)/(x1+xfm1-Xpm 1), where x1 is the pitch of FPC1 and FPC 6.
In one possible implementation, obtaining the coordinates of the first alignment marks of the at least four flexible circuit boards and the coordinates of the at least four second alignment marks corresponding to the at least four flexible circuit boards includes: and acquiring the coordinates of the first alignment marks of all the flexible circuit boards and the coordinates of all the second alignment marks corresponding to all the flexible circuit boards.
In a specific example, as shown in fig. 7, the PCBA with 6 FPCs is provided, an image acquisition device is used to acquire a first image of the 6 FPCs and a second image of a region of the display panel corresponding to the 6 flexible circuit boards, the PCBA with the display panel is moved to a bonding station in a first stroke, coordinates of the first alignment marks of the 6 FPCs are obtained according to the acquired first image, center point coordinates of the PCBA with the display panel are obtained by calculating according to an average value of the coordinates of the 6 first alignment marks and an average value of the coordinates of the 6 second alignment marks, and center point coordinates of the PCBA with the display panel are obtained by calculating according to the center point coordinates of the PCBA with the display panel and center point coordinates of the display panel, and alignment compensation of the PCBA with the display panel in a vertical direction, a horizontal direction and an offset angle is performed according to the offset.
According to the implementation mode, the accuracy of bonding alignment of the first circuit board and the display panel is higher by acquiring the coordinates of the first alignment marks of all the flexible circuit boards and the coordinates of all the second alignment marks in the display panel corresponding to the flexible circuit boards.
It will be appreciated by those skilled in the art that although the above steps are described in the order of S10-S50, it is not meant to necessarily be performed in such order, e.g., S50 may be performed first followed by S30, so long as logic is not violated.
Another embodiment of the present application provides a bonding alignment compensation device for bonding alignment of a first circuit board and a display panel, where the first circuit board includes a printed circuit board and a plurality of flexible circuit boards arranged side by side, the flexible circuit board is provided with a first alignment mark, and the display panel is provided with a plurality of second alignment marks corresponding to the plurality of flexible circuit boards, as shown in fig. 8, the device includes:
the device comprises an acquisition unit, a display unit and a display unit, wherein the acquisition unit is used for acquiring coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards, wherein the at least four flexible circuit boards comprise two flexible circuit boards positioned at middle positions and two flexible circuit boards positioned at edge positions;
the computing unit is used for computing the alignment coordinates of the first circuit board according to the average value of the coordinates of the at least four first alignment marks, and computing the alignment coordinates of the display panel according to the average value of the coordinates of the at least four second alignment marks;
and the compensation unit is used for calculating and obtaining the offset of the first circuit board and the display panel in the first direction on the bonding station according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel and carrying out alignment compensation of the offset distance in the first direction according to the offset distance, wherein the first direction is the direction of the first circuit board facing the display panel on the bonding station.
In one possible implementation manner, the compensation unit is further configured to calculate, according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel, to obtain an offset between the first circuit board and the display panel in a second direction at the bonding station, and perform alignment compensation of an offset distance in the second direction according to the offset distance, where the second direction is an arrangement direction of the plurality of flexible circuit boards at the bonding station.
In one possible implementation manner, the compensation unit is further configured to calculate, according to the alignment coordinates of the first circuit board, the alignment coordinates of the display panel, and the coordinate distances of the first alignment marks of the two flexible circuit boards located at the edge positions, obtain an angular offset between the first circuit board and the display panel at the bonding station, and perform alignment compensation of the offset angle according to the angular offset.
In one possible implementation, the method further includes: the image acquisition unit comprises a movable image acquisition device or at least four image acquisition devices;
the displacement mechanism is used for moving the first circuit board to the image acquisition station;
the image acquisition unit is used for acquiring first images of at least four flexible circuit boards of a first circuit board positioned at the image acquisition station;
the acquisition unit is used for acquiring coordinates of first alignment marks of at least four flexible circuit boards according to the first image;
the displacement mechanism is also used for moving the first circuit board to the bonding station in a first stroke;
the displacement mechanism is also used for moving the display panel to the image acquisition station;
the image acquisition unit is further used for acquiring second images of areas of at least four second alignment marks corresponding to the at least four flexible circuit boards of the display panel positioned at the image acquisition station;
the acquisition unit is further used for acquiring coordinates of at least four second alignment marks according to the second image;
the displacement mechanism is also used for moving the display panel to the bonding station in the first travel.
In one possible implementation manner, the acquiring unit is configured to acquire coordinates of the first alignment marks of all the flexible circuit boards and coordinates of all the second alignment marks corresponding to all the flexible circuit boards.
It should be noted that, the principle and the workflow of the bonding alignment compensation device provided in this embodiment are similar to those of the bonding alignment compensation method described above, and the relevant portions may be referred to the above description and will not be repeated here.
In the description of the present application, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present application and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present application. Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
It is further noted that in the description of the present application, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
It should be understood that the foregoing examples of the present application are provided merely for clearly illustrating the present application and are not intended to limit the embodiments of the present application, and that various other changes and modifications may be made therein by one skilled in the art without departing from the spirit and scope of the present application as defined by the appended claims.
Claims (8)
1. The bonding alignment compensation method is characterized by being used for bonding alignment of a first circuit board and a display panel, wherein the first circuit board comprises a printed circuit board and a plurality of flexible circuit boards which are arranged side by side, the flexible circuit boards are provided with first alignment marks, and the display panel is provided with a plurality of second alignment marks corresponding to the plurality of flexible circuit boards, and the method comprises the following steps:
acquiring coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards, wherein the at least four flexible circuit boards comprise two flexible circuit boards positioned at the middle position and two flexible circuit boards positioned at the edge positions;
calculating to obtain the alignment coordinates of the first circuit board according to the average value of the coordinates of the at least four first alignment marks, and calculating to obtain the alignment coordinates of the display panel according to the average value of the coordinates of the at least four second alignment marks;
calculating according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel to obtain the offset of the first circuit board and the display panel in the first direction on the bonding station and performing alignment compensation of the offset distance of the first direction according to the offset of the first circuit board and the display panel, wherein the first direction is the direction of the first circuit board towards the display panel on the bonding station;
and calculating according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel to obtain the offset of the first circuit board and the display panel in the second direction on the bonding station and performing alignment compensation of the offset distance in the second direction according to the offset distance, wherein the second direction is the arrangement direction of the flexible circuit boards on the bonding station.
2. The method according to claim 1, characterized in that the method further comprises:
and calculating to obtain the angular offset of the first circuit board and the display panel on the bonding station according to the alignment coordinates of the first circuit board, the alignment coordinates of the display panel and the coordinate distances of the first alignment marks of the two flexible circuit boards positioned at the edge positions, and performing alignment compensation of the offset angle according to the angular offset.
3. The method of any of claims 1-2, wherein the obtaining coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards comprises:
moving the first circuit board to an image acquisition station, acquiring first images of at least four flexible circuit boards by using a movable image acquisition device or at least four image acquisition devices, and acquiring coordinates of first alignment marks of the at least four flexible circuit boards according to the first images;
moving the first circuit board to a bonding station in a first stroke;
moving the display panel to an image acquisition station, acquiring second images of areas of at least four second alignment marks of the display panel corresponding to the at least four flexible circuit boards by using a movable image acquisition device or at least four image acquisition devices, and acquiring coordinates of the at least four second alignment marks according to the second images;
and moving the display panel to the bonding station in the first travel.
4. The method of claim 1, wherein obtaining coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards comprises: and acquiring the coordinates of the first alignment marks of all the flexible circuit boards and the coordinates of all the second alignment marks corresponding to all the flexible circuit boards.
5. The utility model provides a nation decides counterpoint compensation arrangement, its characterized in that is used for first circuit board and display panel's nation to counterpoint, first circuit board includes printed circuit board and a plurality of flexible circuit boards of arranging side by side, flexible circuit board is provided with first counterpoint mark, display panel is provided with corresponding a plurality of second counterpoint marks of a plurality of flexible circuit boards, and the device includes:
the device comprises an acquisition unit, a display unit and a display unit, wherein the acquisition unit is used for acquiring coordinates of first alignment marks of at least four flexible circuit boards and coordinates of at least four second alignment marks corresponding to the at least four flexible circuit boards, wherein the at least four flexible circuit boards comprise two flexible circuit boards positioned at middle positions and two flexible circuit boards positioned at edge positions;
the computing unit is used for computing the alignment coordinates of the first circuit board according to the average value of the coordinates of the at least four first alignment marks, and computing the alignment coordinates of the display panel according to the average value of the coordinates of the at least four second alignment marks;
the compensation unit is used for calculating and obtaining offset of the first circuit board and the display panel in a first direction on the bonding station according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel and carrying out alignment compensation of offset distance of the first direction according to the offset distance, wherein the first direction is the direction of the first circuit board facing the display panel on the bonding station; and calculating according to the alignment coordinates of the first circuit board and the alignment coordinates of the display panel to obtain the offset of the first circuit board and the display panel in the second direction on the bonding station and performing alignment compensation of the offset distance in the second direction according to the offset distance, wherein the second direction is the arrangement direction of the flexible circuit boards on the bonding station.
6. The apparatus of claim 5, wherein the compensation unit is further configured to calculate an angular offset between the first circuit board and the display panel at the bonding station according to the alignment coordinates of the first circuit board, the alignment coordinates of the display panel, and the coordinate distances of the first alignment marks of the two flexible circuit boards at the edge positions, and perform alignment compensation of the offset angle according to the angular offset.
7. The apparatus according to any one of claims 5-6, further comprising: the image acquisition unit comprises a movable image acquisition device or at least four image acquisition devices;
the displacement mechanism is used for moving the first circuit board to the image acquisition station;
the image acquisition unit is used for acquiring first images of at least four flexible circuit boards of a first circuit board positioned at the image acquisition station;
the acquisition unit is used for acquiring coordinates of first alignment marks of at least four flexible circuit boards according to the first image;
the displacement mechanism is also used for moving the first circuit board to the bonding station in a first stroke;
the displacement mechanism is also used for moving the display panel to the image acquisition station;
the image acquisition unit is further used for acquiring second images of areas of at least four second alignment marks corresponding to the at least four flexible circuit boards of the display panel positioned at the image acquisition station;
the acquisition unit is further used for acquiring coordinates of at least four second alignment marks according to the second image;
the displacement mechanism is also used for moving the display panel to the bonding station in the first travel.
8. The apparatus of claim 5, wherein the acquiring unit is configured to acquire coordinates of the first alignment marks of all flexible circuit boards and coordinates of all second alignment marks corresponding to all flexible circuit boards.
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| CN115942645B (en) * | 2023-03-15 | 2023-05-16 | 中电科风华信息装备股份有限公司 | Movable large-size PCB pressing table mechanism |
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| CN102902104B (en) * | 2012-10-15 | 2015-11-25 | 京东方科技集团股份有限公司 | The alignment method of polarizer and display panel |
| CN105467631A (en) * | 2016-01-05 | 2016-04-06 | 深圳市华星光电技术有限公司 | Detection and correction system, detection device and correction method for panel pressing |
| CN105607273B (en) * | 2016-03-23 | 2018-03-09 | 武汉华星光电技术有限公司 | The method and manufacturing equipment that a kind of three-dimensional display is stood to hyte |
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| CN112968117B (en) * | 2020-10-27 | 2022-04-19 | 重庆康佳光电技术研究院有限公司 | Chip transfer alignment method and equipment, display panel and storage medium |
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