CN113759620B - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN113759620B CN113759620B CN202110957518.4A CN202110957518A CN113759620B CN 113759620 B CN113759620 B CN 113759620B CN 202110957518 A CN202110957518 A CN 202110957518A CN 113759620 B CN113759620 B CN 113759620B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
Abstract
The invention discloses a display panel and a display device, wherein the display panel comprises a display part and a binding part, and the display part is provided with a first side which is oppositely arranged and a second side which is oppositely arranged; the binding part comprises a first flip-chip film binding region and a gate electrode driving region, the first flip-chip film binding region is positioned on one first side and one second side, the gate electrode driving regions are distributed on two first sides, and the gate electrode driving regions positioned on the first sides and the first flip-chip film binding region are arranged in the direction from the center of the display part to the first side. The display panel of the technical scheme of the invention can solve the technical problem of high production cost of the ultra-narrow frame.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
With the development of display technology, liquid crystal displays have become the most common flat panel display devices, and tiled screens commonly used for commercial display have also been developed greatly. The liquid crystal spliced screen is a screen assembly formed by combining a plurality of display screens, and is widely applied to outdoors or indoors in markets, banks and the like. Currently, in the technical field of spliced screens, the frame width of a single display screen has a direct influence on the splicing seam of a subsequent spliced screen, and the overall display effect can be influenced. Therefore, the spliced screen has higher requirements on the frame.
In order to pursue better tiled display effect, a seamless stitching technology or a structure with two-sided multi-Chip On Film (COF) is generally adopted to reduce the frame, so as to provide better visual experience. Because the spliced screen belongs to the mass market, if the spliced screen is designed aiming at an ultra-narrow frame, a two-side multi-chip COF structure is required, the number of COFs required by a Data line side (Data side) and a scanning line side (Gate side) is large, and the cost of the display panel is relatively high.
Disclosure of Invention
The invention mainly aims to provide a display panel, which aims to solve the problem of high cost of producing a display panel with an ultra-narrow frame.
In order to achieve the above object, a display panel according to the present invention includes:
a display portion having a first side disposed opposite and a second side disposed opposite; and
the binding part comprises a first flip-chip film binding region and a gate electrode driving region, wherein the first flip-chip film binding region is positioned on one first side and one second side, the gate electrode driving regions are distributed on two first sides, and the gate electrode driving regions positioned on the first sides and the first flip-chip film binding region are arranged in the direction from the center of the display part to the first side.
In an alternative embodiment, the gate driving region and the first flip chip film binding region on the first side are in an integrated structure.
In an alternative embodiment, a separable line is disposed between the gate driving region and the first flip chip bonding region.
In an alternative embodiment, the gate driving region on the first side is connected to the first flip chip film binding region by an adhesive manner.
In an alternative embodiment, the semiconductor device further comprises a driving part, wherein the driving part comprises a driving circuit board, and the driving circuit board is electrically connected with the first flip chip film binding region and/or the gate electrode driving region.
In an optional embodiment, the driving part further includes a plurality of flip chip thin film pieces, and the driving circuit board is connected with the binding bits of the first flip chip thin film binding region in a one-to-one correspondence manner through the plurality of flip chip thin film pieces; or alternatively, the first and second heat exchangers may be,
the driving part comprises a gateless driving circuit, and the driving circuit board is connected with the gate driving area through the gate driving circuit.
In an optional embodiment, the binding portion further includes a second flip chip film binding region, where the second flip chip film binding region is disposed on the second side and is located outside the first flip chip film binding region; the first flip chip film binding region comprises N binding bits, and the second flip chip film binding region comprises M binding bits, wherein M is less than N.
In an alternative embodiment, the ratio of the number M of binding bits of the second flip chip film binding region to the number N of binding bits of the first flip chip film binding region is i, where the numerical range of i is 1/5-1/2.
The present invention also proposes a display panel comprising:
a display portion having a first side disposed opposite and a second side disposed opposite; and, a step of, in the first embodiment,
the binding part comprises a first flip-chip film binding region and a gate electrode driving region, the first flip-chip film binding region is positioned on one first side and one second side, the gate electrode driving regions are distributed on two first sides, and the gate electrode driving regions positioned on the first sides and the first flip-chip film binding region are arranged in the direction from the center of the display part to the first side;
the binding part further comprises a second flip-chip film binding region, and the second flip-chip film binding region is arranged on the second side and is positioned on the outer side of the first flip-chip film binding region; the first flip chip film binding region comprises N binding bits, and the second flip chip film binding region comprises M binding bits, wherein M is less than N;
a separable line is arranged between the gate electrode driving region at the first side and the first flip chip film binding region; and a separable line is arranged between the second flip chip film binding region and the first flip chip film binding region.
The invention also provides a display device which comprises the display panel and the backlight module.
The display panel comprises a display part and a binding part arranged on the peripheral side of the display part, wherein the binding part comprises a first flip-chip film binding region and a gate electrode driving region, the first flip-chip film binding region and the gate electrode driving region are distributed on one first side of the display part at the same time, the gate electrode driving region is distributed on the other first side of the display part, and the first flip-chip film binding region is distributed on one second side of the display part. When the narrow frame is required, the two relatively arranged gate driving areas can be cut off, so that only the first flip chip film binding area distributed on the first side and the second side is left, and after binding of a plurality of flip chip films is carried out, the display screen with the ultra-narrow frame can be used. When the ultra-narrow frame is not required, the gate electrode driving area can be reserved, and the normal display screen is used through the connection of the gate electrode driving circuit, so that the use of a plurality of flip chip films can be omitted, and the cost is effectively reduced. Therefore, the display panel comprising two connection modes and frames with different sizes can be prepared by using one photomask, so that the sharing of the ultra-narrow frame and the normal frame is realized, the use of photomask materials and the illumination times are reduced, and the production cost is further saved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a display panel according to an embodiment of the invention;
FIG. 2 is a schematic diagram of another embodiment of a display panel according to the present invention;
fig. 3 is a schematic structural diagram of a display panel according to another embodiment of the invention.
Reference numerals illustrate:
the achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
In the present invention, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
The present invention provides a display panel 100.
Referring to fig. 1, in the embodiment of the present invention, a display panel 100 includes a display portion 10 and a binding portion 30, wherein the display portion 10 has two oppositely disposed first sides 11 and two oppositely disposed second sides 13;
the binding portion 30 includes a first flip-chip film binding region 31 and a gate driving region 33, the first flip-chip film binding region 31 is located at one of the first sides 11 and one of the second sides 13, the gate driving regions 33 are distributed at two of the first sides 11, and the gate driving regions 33 located at the first sides 11 and the first flip-chip film binding region 31 are arranged in a direction from the center of the display portion 10 to the first sides 11.
It can be understood that, structurally, in a direction perpendicular to the surface of the display panel 100, the display panel 100 includes an array substrate, a color film substrate, and a liquid crystal layer sandwiched therebetween, and the common electrode of the color film substrate and the pixel electrode of the array substrate form parallel capacitors when the circuits are turned on, so as to drive the liquid crystal molecules together, thereby allowing light to pass therethrough to display a desired image. In this embodiment, the display panel 100 includes a display portion 10 and a binding portion 30, wherein the display portion 10 is a region of the middle portion of the display panel 100 capable of displaying images by light, and is generally rectangular, and thus has two opposite first sides 11 and two opposite second sides 13; the binding portion 30 is a region for connecting the driving unit, which is located at the peripheral side of the display portion 10, so as to supply the display portion 10 with a desired picture signal and power. Here, the first side 11 is a scanning line side (Gate side), and the second side 13 is a Data line side (Data side).
The display panel 100 according to the present invention includes a display portion 10 and a binding portion 30 disposed on a peripheral side of the display portion 10, wherein the binding portion 30 includes a first flip-chip thin film binding region 31 and a gate driving region 33, the first flip-chip thin film binding region 31 and the gate driving region 33 are simultaneously distributed on a first side 11 of the display portion 10, the gate driving region 33 is distributed on another first side 11 of the display portion 10, and the first flip-chip thin film binding region 31 is distributed on a second side 13 of the display portion 10. When the narrow frame is required, the two gate driving areas 33 can be cut off, so that only the first flip chip film binding area 31 with the first side 11 and the second side 13 distributed is left, and the binding of a plurality of flip chip films is performed, so that the display screen with the ultra-narrow frame can be used. When no ultra-narrow frame is required, the gate driving area 33 can be reserved, and the normal display screen is used by the connection of the gate driving circuit, so that the use of a plurality of flip chip films can be omitted, and the cost is effectively reduced. Therefore, the display panel 100 comprising two connection modes and frames with different sizes can be prepared by using one photomask, so that the sharing of the ultra-narrow frame and the normal frame is realized, the use of photomask materials and the illumination times are reduced, and the production cost is further saved.
In an alternative embodiment, the gate driving region 33 on the first side 11 and the first flip chip bonding region 31 are formed integrally.
Here, since the array substrate and the color film substrate both include a glass substrate, the first film bonding region and the gate driving region 33 are both formed on the glass substrate by etching through a photomask. Optionally, the first film binding region and the gate driving region 33 are both disposed on the glass substrate of the array substrate. For convenience in processing, the glass substrate where the first flip chip film binding region 31 is located on the first side 11 and the glass substrate where the gate driving region 33 is located can be set to be an integrally formed structure, so that the assembly process can be reduced, and the processing efficiency can be improved; meanwhile, the deposition of the photoresist in two areas can be carried out through one photomask, so that the number of times of photoetching is reduced, and the cost and the working procedure are further saved.
In an alternative embodiment, a separation line 35 is disposed between the gate driving region 33 and the first flip chip bonding region 31 at the first side 11.
It will be appreciated that when the display panel 100 is an ultra-narrow frame display panel 100, the gate driving region 33 needs to be cut away from the display panel 100 to connect the flip-chip thin film sheets. Therefore, in this embodiment, in order to facilitate separation of the gate driving region 33 from the first flip-chip bonding region 31, a separation line 35 is provided between the gate driving region 33 on the first side 11 and the first flip-chip bonding region 31, and the separation line 35 may be a continuous line or an intermittent line etched on the surface of the glass substrate, so that the process of peeling the gate driving region 33 can be more labor-saving and faster. Of course, the parting line 35 may also consist of a plurality of elongated slits drilled in the glass substrate, so that the gate drive region 33 can be cut off by simple application of force.
In addition, in order to facilitate the separation of the gate driving region 33 located on the other first side 11 from the display portion 10, a separation line 35 is also disposed between the display portion 10 and the gate driving region 33 on the first side 11, and the structure of the separation line 35 can refer to the above-mentioned arrangement of the separation line 35, which is not described herein.
In an alternative embodiment, the gate driving region 33 on the first side 11 is connected to the first flip chip bonding region 31 by adhesion.
In this embodiment, in order to further facilitate the separation of the gate driving region 33 of the first side 11 and the first flip chip film binding region 31, the glass substrate of the first flip chip film binding region 31 of the deposited gate driving region 33 may be set to be a split structure, and the two are connected by bonding, so that when the display panel 100 with a narrow frame is required, the gate driving region 33 can be separated without tools, thereby ensuring the application of the display panel 100 with a narrow frame.
In an alternative embodiment, the driving part 50 further includes a driving circuit board (not shown), and the driving circuit board is electrically connected to the first flip chip bonding area 31 and/or the gate driving area 33.
In this embodiment, the display panel 100 further includes a driving portion 50, and the driving portion 50 includes a driving circuit board, so that a control and driving circuit can be provided for the display panel 100, so as to realize the display of the display portion 10 of the display panel 100.
Because the display panel 100 includes two types of frames with two sizes, when the narrow frame is not needed, the gate driving region 33 on the outer side and the gate driving region 33 on the other first side 11, and the first flip-chip film binding region 31 on the second side 13 are all electrically connected with the driving circuit board, so that a plurality of flip-chip film pieces 51 on the first side 11 can be saved, the material cost and the assembly procedure can be effectively saved, and the production efficiency can be improved. When a narrow frame is required, the two gate driving regions 33 which are relatively arranged are separated from the side edges of the display portion 10, so that the driving circuit board is connected with the two first flip chip film binding regions 31, the frame of the display panel 100 can be greatly reduced, and a good spliced display effect can be obtained when the display panel is applied to a spliced screen. The display panel 100 with the structure can simultaneously meet the frame requirements of two different requirements, and can be manufactured through one-time photoetching process, so that the production cost can be effectively reduced while the working procedures are saved.
Referring to fig. 1 and fig. 2, in an alternative embodiment, the driving portion 50 further includes a plurality of flip chip thin film pieces 51, and the driving circuit board is connected to the binding bits of the first flip chip thin film binding region 31 in a one-to-one correspondence manner through the plurality of flip chip thin film pieces 51; or alternatively, the first and second heat exchangers may be,
the driving part 50 includes a gateless driving circuit 53 through which the driving circuit board is connected to the gate driving region 33.
In this embodiment, the driving portion 50 includes a plurality of flip chip film members 51, i.e. COF chips, and when the ultra-narrow frame is required, the gate driving regions 33 on both sides are cut off, and the COF chips are sequentially connected to the corresponding binding positions. Generally, for a frame of 1.8mm to 2.0mm, 10 COFs are required on the first side 11, 20 COFs are required on the second side 13, and the plurality of flip chip thin film devices 51 are electrically connected to the driving circuit board, so that the ultra-narrow frame is assembled, and necessary driving power and driving signals are provided for the display portion 10.
Of course, when there is no need for a narrow frame, a Gate-less driving circuit 53 (GDL) is mounted in the Gate-less driving region, and the Gate-less driving circuit 53 is electrically connected to the driving circuit board, and simultaneously, the plurality of flip-chip thin film pieces 51 are connected to the first flip-chip thin film bonding region 31 of the second side 13, so as to realize display of the display portion 10. In this way, COF sheets on the first side 11 can be saved, reducing assembly process and material costs. Specifically, the gateless driving circuit 53 generally includes a boost circuit and a shift circuit connected to each other, the shift circuit may be disposed on the driving circuit board, and output a boosted driving signal to the shift circuit, and the shift circuit may be connected to the gateless driving area, and provide a scanning signal to the scanning line of the display panel 100, so that the size of the driving circuit board may be reduced, and the frame size of the display panel 100 may be reduced; meanwhile, due to the small occupied area of the shift circuit, the display panel 100 using the GDL architecture can also achieve a certain degree of narrow frame. Of course, in other embodiments, the shift circuit may be disposed on the driving circuit board together with the boost circuit.
Referring to fig. 3, in an alternative embodiment, the bonding portion 30 further includes a second flip chip film bonding region 37, where the second flip chip film bonding region 37 is disposed on the second side 13 and is located outside the first flip chip film bonding region 31; the first flip chip bonding region 31 includes N bonding bits, and the second flip chip bonding region 37 includes M bonding bits, where M < N.
In this embodiment, in order to further save the number of the flip chip film pieces 51, a second flip chip film binding region 37 is further disposed on the second side 13 of the display portion 10, the second flip chip film binding region 37 is located outside the first flip chip film binding region 31, and the width of the second flip chip film binding region 37 in the extending direction perpendicular to the second side 13 is greater than the width of the second flip chip film binding region 37 in the extending direction perpendicular to the second side 13, so, when the COF is connected to the second flip chip film binding region 37, there may be enough space to perform the concentrated pull wire, so that the binding location of the second flip chip film binding region 37 may be reduced, and driving can be achieved by using fewer COF chips. Here, in the case of the display part 10 of the same size, when the first flip-chip thin film binding region 31 has N binding bits, there are M binding bits in the second flip-chip thin film binding region 37, and M < N can be made due to the increased width dimension of the second flip-chip thin film binding region 37, so that the use and binding of the flip-chip thin film member 51 are further reduced, the cost is further saved, and the mounting efficiency is improved.
Of course, when the ultra-narrow frame is required, the second flip-chip film binding region 37 is cut off, and the N flip-chip film pieces 51 are connected to the first flip-chip film binding region 31 on the second side 13. Thus, the use and binding process of the flip chip thin film member 51 can be further saved under different requirements, and the cost can be further saved.
In an alternative embodiment, the ratio of the number M of binding bits of the second flip chip film binding region 37 to the number N of binding bits of the first flip chip film binding region 31 is i, where the numerical range of i is 1/5-1/2.
In this embodiment, when the ultra-narrow frame is not needed, the frame of the second side 13 can be enlarged appropriately when the GDL connection structure is used, and of course, the frame of the second side 13 should not be too large or too small, so that the width dimension of the second flip chip film binding region 37 is not too large or too small, and there is a certain range of values for the number of the flip chip film pieces 51, where the value of i is 1/5 to 1/2, for example, 3/10, 1/3, etc., and can be set according to the actual dimension and the requirement of the display panel 100. For example, when the number N of binding bits of the first flip chip bonding region 31 is 20, then the number M of binding bits of the COF can be reduced to 6 or 4 by setting the second flip chip bonding region 37, so that the COF chip can be further saved when the COF chip of the first side 11 is saved, thereby further reducing the production cost.
With reference to fig. 3, the present invention further provides a display panel 100, where the display panel 100 includes a display portion 10 and a binding portion 30, the display portion 10 has two opposite first sides 11 and two opposite second sides 13, the binding portion 30 includes a first flip-chip thin film binding region 31 and a gate driving region 33, the first flip-chip thin film binding region 31 is located at one of the first sides 11 and one of the second sides 13, the gate driving region 33 is distributed at two of the first sides 11, and the gate driving region 33 and the first flip-chip thin film binding region 31 located at the first side 11 are arranged in a direction from a center of the display portion 10 to the first side 11;
the binding portion 30 further includes a second flip chip film binding region 37, where the second flip chip film binding region 37 is disposed on the second side 13 and located outside the first flip chip film binding region 31; the first flip chip film binding region 31 includes N binding bits, and the second flip chip film binding region 37 includes M binding bits, where M < N;
a separable line 35 is arranged between the gate driving region 33 at the first side 11 and the first flip-chip film binding region 31; a separation line 35 is provided between the second flip chip bonding region 37 and the first flip chip bonding region 31.
In this embodiment, the same as the display panel 100 of the above embodiment, the first flip chip bonding region 31 and the gate driving region 33 are formed on the first side 11 of the display portion 10, so that the requirement of ultra-narrow frame can be met through a photolithography process, and the material cost of COF bonding is reduced when the requirement of ultra-narrow frame is not met, so that the material cost and the processing procedure of the photomask are reduced, and the production cost is effectively saved. Specific effects refer to the above description, and are not described herein.
The difference is that, in order to further reduce the number of COFs, the second flip chip film binding region 37 is increased, and the binding position of the second flip chip film binding region 37 is reduced by increasing the width of the frame, so that the number of bound COFs is further reduced, and the assembly efficiency is improved. Meanwhile, in order to facilitate the rapid conversion of the two frame requirements, a separable line 35 can be arranged between the gate driving region 33 of the first side 11 and the first flip chip film binding region 31, a separable line 35 can be arranged between the second flip chip film binding region 37 and the first flip chip film binding region 31, and a separable line 35 can be also arranged between the gate driving region 33 of the first side 11 and the display portion 10, so that when the requirement of an ultra-narrow frame exists, the redundant part can be cut off rapidly, and the assembly efficiency can be ensured.
The present invention also provides a display device (not shown), the display device includes a display panel 100 and a backlight module, the specific structure of the display panel 100 refers to the structure of the display panel 100 in any of the above embodiments, and the structure of the display panel 100 of the display device includes the structure of any of the above display panels 100, so that the following beneficial effects are not repeated here.
The backlight module comprises a backlight source, a light guide plate, a light enhancement sheet or a diffusion sheet, wherein the light guide plate can convert a point light source into a uniform surface light source for emitting, the light enhancement sheet can increase the brightness of emitted light, and the diffusion sheet can increase the emitting angle of the emitted light, so that a uniform and stable light source is provided for the display panel 100. The display panel 100 is disposed directly above the backlight module, so as to better receive the outgoing light of the backlight module.
Of course, the display device further includes a frame and other supporting members for fixing the backlight module and the display panel 100, thereby providing a stable supporting base for the display device.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.
Claims (10)
1. A display panel, the display panel comprising:
a display portion having a first side disposed opposite and a second side disposed opposite; and
the binding part comprises a first flip-chip film binding region and a gate electrode driving region, the first flip-chip film binding region is positioned on one first side and one second side, the gate electrode driving regions are distributed on two first sides, and the gate electrode driving regions positioned on the first sides and the first flip-chip film binding region are arranged in the direction from the center of the display part to the first side;
when the narrow frame is required, cutting off the two relatively arranged gate electrode driving areas, only leaving first flip chip film binding areas distributed on the first side and the second side, and then binding a plurality of flip chip films; when no ultra-narrow frame is required, the gate electrode driving area is reserved, and normal display screen use is performed through connection of the gate electrode driving circuit.
2. The display panel of claim 1, wherein the gate driving region on the first side is integrally formed with the first flip-chip thin film bonding region.
3. The display panel of claim 2, wherein a separable line is provided between the gate driving region and the first flip-chip bonding region at the first side.
4. The display panel of claim 1, wherein the gate driving region on the first side is adhesively connected to the first flip-chip film bonding region.
5. The display panel of any one of claims 1 to 4, further comprising a drive portion including a drive circuit board electrically connected to the first flip chip thin film bonding region and/or the gate drive region.
6. The display panel of claim 5, wherein the driving part further comprises a plurality of flip chip thin film pieces, and the driving circuit board is connected with binding positions of the first flip chip thin film binding region in a one-to-one correspondence manner through the plurality of flip chip thin film pieces; or alternatively, the first and second heat exchangers may be,
the driving part comprises a gateless driving circuit, and the driving circuit board is connected with the gate driving area through the gate driving circuit.
7. The display panel of any one of claims 1 to 4, wherein the bonding portion further comprises a second flip-chip thin film bonding region disposed on the second side and outside the first flip-chip thin film bonding region; the first flip chip film binding region comprises N binding bits, and the second flip chip film binding region comprises M binding bits, wherein M is less than N.
8. The display panel of claim 7, wherein the ratio of the number of binding bits M of the second flip-chip thin film binding region to the number of binding bits N of the first flip-chip thin film binding region is i, wherein the value of i ranges from 1/5 to 1/2.
9. A display panel, the display panel comprising:
a display portion having a first side disposed opposite and a second side disposed opposite; and, a step of, in the first embodiment,
the binding part comprises a first flip-chip film binding region and a gate electrode driving region, the first flip-chip film binding region is positioned on one first side and one second side, the gate electrode driving regions are distributed on two first sides, and the gate electrode driving regions positioned on the first sides and the first flip-chip film binding region are arranged in the direction from the center of the display part to the first side;
the binding part further comprises a second flip-chip film binding region, and the second flip-chip film binding region is arranged on the second side and is positioned on the outer side of the first flip-chip film binding region; the first flip chip film binding region comprises N binding bits, and the second flip chip film binding region comprises M binding bits, wherein M is less than N;
a separable line is arranged between the gate electrode driving region at the first side and the first flip chip film binding region; a separable line is arranged between the second flip chip film binding region and the first flip chip film binding region;
when the narrow frame is required, cutting off the two relatively arranged gate electrode driving areas, only leaving first flip chip film binding areas distributed on the first side and the second side, and then binding a plurality of flip chip films; when no ultra-narrow frame is required, the gate electrode driving area is reserved, and normal display screen use is performed through connection of the gate electrode driving circuit.
10. A display device comprising the display panel according to any one of claims 1 to 9 and a backlight module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110957518.4A CN113759620B (en) | 2021-08-19 | 2021-08-19 | Display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107544185A (en) * | 2017-09-25 | 2018-01-05 | 京东方科技集团股份有限公司 | Array base palte, display panel and display device |
| CN110223600A (en) * | 2019-05-14 | 2019-09-10 | 深圳市华星光电技术有限公司 | The binding structure of flip chip |
| CN113178132A (en) * | 2021-04-01 | 2021-07-27 | Tcl华星光电技术有限公司 | Flip chip thin film set, display panel and display module |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107544185A (en) * | 2017-09-25 | 2018-01-05 | 京东方科技集团股份有限公司 | Array base palte, display panel and display device |
| CN110223600A (en) * | 2019-05-14 | 2019-09-10 | 深圳市华星光电技术有限公司 | The binding structure of flip chip |
| CN113178132A (en) * | 2021-04-01 | 2021-07-27 | Tcl华星光电技术有限公司 | Flip chip thin film set, display panel and display module |
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