CN220441140U - Novel heat radiation structure of TFT - Google Patents
Novel heat radiation structure of TFT Download PDFInfo
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- CN220441140U CN220441140U CN202321652654.3U CN202321652654U CN220441140U CN 220441140 U CN220441140 U CN 220441140U CN 202321652654 U CN202321652654 U CN 202321652654U CN 220441140 U CN220441140 U CN 220441140U
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- tft
- iron frame
- backlight
- heat dissipation
- frame
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- 230000005855 radiation Effects 0.000 title description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 252
- 229910052742 iron Inorganic materials 0.000 claims abstract description 126
- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 239000012788 optical film Substances 0.000 claims abstract description 19
- 239000002390 adhesive tape Substances 0.000 claims description 13
- 239000006260 foam Substances 0.000 claims description 13
- 239000010408 film Substances 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 3
- 239000000956 alloy Substances 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 11
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 11
- 238000009792 diffusion process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Abstract
A novel heat dissipation structure for a TFT comprising: the TFT display screen, the TFT display screen sets up in a TFT iron stand, the TFT iron stand comprises iron stand and TFT lower iron stand on by the TFT, the PCB board sets up in a backlight board iron stand, backlight board iron stand includes iron stand and backlight board lower iron stand on the backlight board, be provided with the reflectance coating on the plate body of PCB board, be provided with the optical film in the iron stand on the backlight board, be provided with the diffuser plate on the optical film. According to the novel heat dissipation structure of the TFT, through the structural design among the upper iron frame of the TFT, the lower iron frame of the TFT and the TFT display screen, the novel heat dissipation structure of the TFT is made of aluminum alloy materials according to the upper iron frame of the TFT and the lower iron frame of the TFT, so that the iron frames form the TFT display screen and the PCB board which are aligned and fixed by adopting metal fixing pieces with best heat dissipation, the heat conduction speed and the heat dissipation speed are improved, and the novel heat dissipation structure of the TFT can achieve the purpose of rapidly dissipating heat.
Description
Technical Field
The utility model relates to the technical field of TFT heat dissipation, in particular to a novel heat dissipation structure of a TFT.
Background
At present, the content of a TFT (thin film transistor) needs to be projected onto a front windshield through backlight, so that the brightness is required to be several times higher than that of a common instrument TFT, and high power consumption and heat can be generated, but the heat dissipation of the existing vehicle-mounted head-up display (HUD) is simpler, and the heat dissipation efficiency is lower, so that the TFT display module is required to have a good heat dissipation design.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provides a novel heat dissipation structure of a TFT.
The aim of the utility model is realized by the following technical scheme:
a novel heat dissipation structure for a TFT comprising: the TFT display screen, the TFT display screen sets up in a TFT iron stand, the TFT iron stand comprises iron stand and TFT lower iron stand on by TFT, the PCB board sets up in a backlight board iron stand, backlight board iron stand includes iron stand and backlight board lower iron stand on the backlight board, be provided with the reflectance coating on the plate body of PCB board, be provided with the optical film in the iron stand on the backlight board, be provided with the diffuser plate on the optical film, be provided with first drive circuit component and interface connector and second drive circuit component on the plate body of PCB board.
In one embodiment, the TFT display screen is located between the TFT upper iron frame and the TFT lower iron frame, and a foam double faced adhesive tape is arranged between the TFT display screen and the TFT upper iron frame and between the TFT display screen and the TFT lower iron frame and is attached to the TFT upper iron frame and the TFT lower iron frame.
In one embodiment, the left and right sides of the TFT lower frame and the backlight plate upper frame, which are close to each other, are bonded together by foam double faced adhesive tape
In one embodiment, the first driving circuit element, the interface connector and the second driving circuit element are sequentially arranged on the front surface of the PCB board body.
In one embodiment, the TFT upper iron frame and the TFT lower iron frame are fixed by buckles arranged around the frame body, and an opening for exposing the TFT display screen is formed in the middle of the TFT upper iron frame and the TFT lower iron frame.
In one embodiment, the upper iron frame of the backlight plate and the lower iron frame of the backlight plate are fixed by buckles arranged around the frame body, and openings for exposing the first driving circuit element, the interface connector and the second driving circuit element are formed in the middle of the upper iron frame of the backlight plate and the lower iron frame of the backlight plate.
In one embodiment, the PCB is provided with an LED lamp.
In one embodiment, the reflective film is provided with a space for exposing the LED lamp, and the space overlaps with the LED lamp on the PCB.
In one embodiment, the optical film is adhered to the frame body on one side of the upper iron frame of the backlight plate, which is close to the lower iron frame of the backlight plate, and the optical film is adhered to one side of the optical film, which is far away from the upper iron frame of the backlight plate.
In one embodiment, the PCB is attached to the frame body of the lower iron frame of the backlight board by the foam double faced adhesive tape.
Compared with the prior art, the utility model has at least the following advantages:
according to the novel heat dissipation structure of the TFT, through the structural design between the upper iron frame and the lower iron frame of the TFT and the TFT display screen, the upper iron frame and the lower iron frame of the TFT are made of aluminum alloy materials, so that heat generated during the operation of the TFT display screen can be quickly transferred to the iron frame through a heat transfer effect by the upper iron frame and the lower iron frame of the TFT, and simultaneously, heat generated during the operation of the PCB can be quickly transferred out through the iron frame according to the structural design between the upper iron frame and the lower iron frame of the backlight, therefore, the iron frame forms that the TFT display screen and the PCB are all fixed by adopting metal fixing pieces with best heat dissipation, the heat conduction speed and the heat diffusion speed are improved, and the novel heat dissipation structure of the TFT achieves the purpose of quick heat dissipation.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram showing an internal cross-sectional structure of a novel heat dissipation structure of a TFT according to the present utility model.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the utility model. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
In the description of the present application, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Unless specifically stated or limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and may be, for example, fixedly connected or detachably connected or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, a novel heat dissipation structure of a TFT includes: the TFT display 1, TFT display 1 is set up in a TFT iron stand, TFT iron stand is by TFT upper iron stand 11 and TFT lower iron stand 12 constitution, PCB board 2 sets up in a backlight board iron stand, backlight board iron stand includes backlight board upper iron stand 21 and backlight board lower iron stand 22, be provided with reflective film 25 on the plate body of PCB board 2, be provided with optical film 23 in the backlight board upper iron stand 21, be provided with diffuser plate 24 on the optical film 23, be provided with first drive circuit component 27 and interface connector 28 and second drive circuit component 29 on the plate body of PCB board 2.
It should be noted that, the TFT iron stand and the backlight iron stand are made of aluminum alloy materials, the TFT upper iron stand 11 and the TFT lower iron stand 12 form the TFT iron stand, the front width and length of the TFT upper iron stand and the TFT lower iron stand are matched with the front width and length of the TFT display screen 1, and the length and width of the backlight iron stand combined by the backlight upper iron stand 21 and the backlight lower iron stand 22 are matched with the front length and width of the PCB 2, so that when the TFT display screen 1 works, the heat generated by the TFT display screen 1 can be transferred to the TFT upper iron stand 11 and the TFT lower iron stand 12, and the heat generated by the PCB 2 works can be transferred to the backlight upper iron stand 21 and the backlight lower iron stand 22, thereby accelerating the heat transfer speed and efficiency.
As shown in fig. 1, in an embodiment, the TFT display screen 1 is located between the TFT upper iron frame 11 and the TFT lower iron frame 12, and a foam double faced adhesive tape 26 is disposed between the TFT display screen 1 and the TFT upper iron frame 11 and the TFT lower iron frame 12 and is attached together.
It should be noted that, the left and right sides at the top and the left and right sides at the bottom of the TFT display screen 1 panel are provided with foam double faced adhesive tapes 26, and one side of the foam double faced adhesive tapes 26 far away from the TFT display screen 1 panel is attached to the inner sides of the TFT upper iron frame 11 and the TFT lower iron frame 12.
As shown in fig. 1, in one embodiment, the TFT lower frame 12 and the backlight upper frame 21 are attached together by a foam double faced adhesive tape 26 on both sides.
The tops of the left and right sides of the frame body of the upper iron frame 21 of the backlight plate are bonded with the lower iron frame 12 of the TFT through foam double faced adhesive tape 26.
As shown in fig. 1, in one embodiment, the first driving circuit element 27, the interface connector 28 and the second driving circuit element 29 are sequentially arranged on the front surface of the PCB 2.
The first driving circuit element 27 and the second driving circuit element 29 are driving circuit elements of the same type and different specifications.
As shown in fig. 1, in an embodiment, the TFT upper iron frame 11 and the TFT lower iron frame 12 are fixed by buckles arranged around the frame body, and an opening for exposing the TFT display screen 1 is formed in the middle of the TFT upper iron frame 11 and the TFT lower iron frame 12.
The shape and size of the TFT upper iron frame 11 and the shape and size of the TFT lower iron frame 12 are matched with each other, and the length and width of the front surface of the TFT display screen 1 and the length and width of the front surfaces of the TFT upper iron frame 11 and the TFT lower iron frame 12 are matched with each other.
As shown in fig. 1, in an embodiment, the upper backlight chassis 21 and the lower backlight chassis 22 are fixed by the buckles provided around the chassis, and the middle of the upper backlight chassis 21 and the lower backlight chassis 22 is provided with openings for exposing the first driving circuit element 27, the interface connector 28 and the second driving circuit element 29.
The shape and size of the front face of the upper back plate iron frame 21 and the shape and size of the front face of the lower back plate iron frame 22 are matched, and the length and width of the front faces of the upper back plate iron frame 21 and the lower back plate iron frame 22 are matched with the length and width of the front face of the PCB 2.
As shown in fig. 1, in one embodiment, an LED lamp is disposed on a PCB board 2.
It should be noted that, the LED lamp on the PCB 2 is located at one side of the PCB 2 near the iron stand 21 on the backlight.
As shown in fig. 1, in one embodiment, a space for exposing the LED lamp is formed on the reflective film 25, and the space overlaps with the LED lamp on the PCB 2.
The shape and size of the front surface of the space formed on the reflective film 25 are matched with the shape and size of the front surface of the LED lamp on the PCB 2.
As shown in fig. 1, in one embodiment, the optical film 23 is adhered to the frame body on the side of the upper iron frame 21 of the backlight plate, which is close to the lower iron frame 22 of the backlight plate, and the optical film 23 is adhered to the side of the optical film 23, which is far from the upper iron frame 21 of the backlight plate.
The optical film 23 has the same length as the front surface of the diffusion plate 24, and the optical film 23 is located at the center of the top of the frame body of the iron frame 21 on the backlight plate, and the length is three fourths of the length of the top of the frame body of the iron frame 21 on the backlight plate.
As shown in fig. 1, in one embodiment, the PCB 2 is attached to the frame body of the lower iron frame 22 of the backlight through a foam double faced adhesive tape 26.
It should be noted that, the foam double faced adhesive tape 26 is disposed on the left and right sides of the bottom of the PCB 2, and one side far away from the PCB 2 is attached to the frame body on the top of the lower iron frame 22 of the backlight.
The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (10)
1. A novel heat dissipation structure of a TFT, comprising:
the TFT display screen (1), the TFT display screen (1) is arranged in a TFT iron frame, the TFT iron frame is composed of a TFT upper iron frame (11) and a TFT lower iron frame (12),
PCB board (2), PCB board (2) set up in a backlight board iron stand, backlight board iron stand includes iron stand (21) and backlight board lower iron stand (22) on the backlight board, be provided with reflective film (25) on the plate body of PCB board (2), be provided with optical film (23) in iron stand (21) on the backlight board, be provided with diffuser plate (24) on optical film (23), be provided with first drive circuit element (27) and interface connector (28) and second drive circuit element (29) on the plate body of PCB board (2).
2. The novel heat dissipation structure of a TFT according to claim 1, wherein the TFT display screen (1) is located between the TFT upper iron frame (11) and the TFT lower iron frame (12), and foam double faced adhesive tape (26) is arranged between the TFT display screen (1) and the TFT upper iron frame (11) and the TFT lower iron frame (12) and is attached together.
3. The novel heat dissipation structure of the TFT according to claim 1, wherein the TFT lower iron frame (12) and the backlight plate upper iron frame (21) are attached together by foam double faced adhesive tape (26) on both sides close to each other.
4. The novel heat dissipation structure of a TFT according to claim 1, wherein the first driving circuit element (27), the interface connector (28) and the second driving circuit element (29) are sequentially arranged on the front surface of the PCB board (2).
5. The novel heat dissipation structure of a TFT according to claim 1, wherein the TFT upper iron frame (11) and the TFT lower iron frame (12) are fixed by a buckle arranged around a frame body, and an opening for exposing the TFT display screen (1) is formed between the TFT upper iron frame (11) and the TFT lower iron frame (12).
6. The TFT new heat dissipation structure as set forth in claim 1, wherein the backlight upper chassis (21) and the backlight lower chassis (22) are fixed by a buckle provided around the chassis, and openings for exposing the first driving circuit element (27) and the interface connector (28) and the second driving circuit element (29) are provided in the middle of the backlight upper chassis (21) and the backlight lower chassis (22).
7. The novel heat dissipation structure of a TFT according to claim 1, wherein the PCB board (2) is provided with LED lamps.
8. The novel heat dissipation structure of the TFT according to claim 1, wherein the reflective film (25) is provided with a space for exposing the LED lamp, and the space overlaps with the LED lamp on the PCB (2).
9. The novel heat dissipation structure of TFT according to claim 1, wherein the optical film (23) is adhered to the frame body of the side of the upper iron frame (21) of the backlight plate, which is close to the lower iron frame (22) of the backlight plate, and the optical film (23) is adhered to the side of the optical film (23), which is far away from the upper iron frame (21) of the backlight plate.
10. The novel heat dissipation structure of the TFT according to claim 2, wherein the PCB (2) is attached to the frame body of the lower iron frame (22) of the backlight plate through the foam double faced adhesive tape (26).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321652654.3U CN220441140U (en) | 2023-06-27 | 2023-06-27 | Novel heat radiation structure of TFT |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321652654.3U CN220441140U (en) | 2023-06-27 | 2023-06-27 | Novel heat radiation structure of TFT |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220441140U true CN220441140U (en) | 2024-02-02 |
Family
ID=89698661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321652654.3U Active CN220441140U (en) | 2023-06-27 | 2023-06-27 | Novel heat radiation structure of TFT |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220441140U (en) |
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2023
- 2023-06-27 CN CN202321652654.3U patent/CN220441140U/en active Active
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