CN113725647A

CN113725647A - Electric connector and electronic equipment

Info

Publication number: CN113725647A
Application number: CN202010453923.8A
Authority: CN
Inventors: 徐宏涛; 周建波; 张�林
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2020-05-26
Filing date: 2020-05-26
Publication date: 2021-11-30

Abstract

The present disclosure relates to an electrical connector and an electronic device. The electric connector comprises a plug pin, and the plug pin comprises: a substrate comprising a conductive region; the composite anti-corrosion film layer is formed on the surface of the base material and comprises a metal titanium layer, and the metal titanium layer and the conductive region are stacked.

Description

Electric connector and electronic equipment

Technical Field

The present disclosure relates to the field of terminal technologies, and in particular, to an electrical connector and an electronic device.

Background

Currently, electronic devices are usually provided with one or more functional interfaces, for example, a charging interface, an earphone interface, or a transmission interface, and each interface may be connected to an external device through a data line, so as to further implement a corresponding function of the electronic device.

When the functional interface is plugged with the opposite terminal, the conductive surface is rubbed, and the conductive surface needs to be exposed in the air for a long time due to the need of electrically connecting with the opposite terminal. Therefore, for electrical connectors, increasing wear and corrosion resistance is an effective way to extend the useful life of the electrical connector.

Disclosure of Invention

The present disclosure provides an electrical connector and an electronic device to solve the disadvantages of the related art.

According to a first aspect of the embodiments of the present disclosure, there is provided an electrical connector including a plug pin, the plug pin including:

a substrate comprising a conductive region;

the composite anti-corrosion film layer is formed on the surface of the base material and comprises a metal titanium layer, and the metal titanium layer and the conductive region are stacked.

Optionally, the composite anticorrosive film layer includes:

the base layer is formed on the surface of the base material, and the metal titanium layer is formed on the surface of the base layer and is laminated with the conductive region.

Optionally, the primer layer includes a metallic nickel layer or a metallic nickel compound layer.

Optionally, the composite anticorrosive film layer further includes:

the first metal layer is formed on the surface of the metal titanium layer.

Optionally, the first metal layer includes:

at least one material selected from metallic gold, metallic gold alloy, metallic rhodium alloy, metallic silver alloy, metallic palladium alloy, metallic ruthenium and metallic ruthenium alloy.

Optionally, the substrate further includes a welding region, the primer layer is further formed on a surface of the welding region, and the composite anti-corrosion film layer further includes:

a second metal layer formed on a surface of the underlying layer disposed corresponding to the land.

Optionally, the electrical connector comprises a USB connector.

According to a second aspect of the embodiments of the present disclosure, there is provided a process for manufacturing an insertion pin, including:

forming a substrate comprising a conductive region;

and forming a composite anti-corrosion film layer on the surface of the base material, wherein the composite anti-corrosion film layer comprises a metal titanium layer, and the metal titanium layer and the conductive region are stacked.

Optionally, the forming of the composite anticorrosive film layer on the surface of the substrate includes:

forming a primer layer on the surface of the base material;

and forming the metal titanium layer on the surface of the bottom layer which is laminated with the conductive region.

Optionally, the method further includes:

and forming a first metal layer on the surface of the metal titanium layer.

Optionally, the substrate includes a welding zone, and the processing process further includes:

and forming a second metal layer on the surface of the base layer, which is laminated with the conductive region.

According to a third aspect of embodiments of the present disclosure, there is provided an electronic device comprising an electrical connector as described in any one of the embodiments above.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

as can be seen from the above embodiments, in the present disclosure, the area corresponding to the conductive area on the substrate is plated with the titanium layer, so as to utilize the physical and chemical properties of titanium element, so that it can be plated by physical vapor deposition, thereby simplifying the process, and compared with the technical scheme of related art that adopts rhodium-palladium plating, the high conductivity and better corrosion resistance of the titanium layer can be utilized, so that the production cost can be reduced while the good conductivity and corrosion resistance can be maintained.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic diagram illustrating the construction of an electrical connector according to an exemplary embodiment.

Fig. 2 is a schematic diagram illustrating a structure of a socket pin according to an exemplary embodiment.

Fig. 3 is a schematic diagram of another plug pin configuration according to an exemplary embodiment.

Fig. 4 is a schematic diagram illustrating a structure of another plug pin according to an exemplary embodiment.

Fig. 5 is a flow chart illustrating the processing of a jack pin according to an exemplary embodiment.

Fig. 6 is a schematic structural diagram of an electronic device according to an exemplary embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.

Fig. 1 is a schematic structural view of an electrical connector 100 according to an exemplary embodiment, and fig. 2 is a schematic structural view of a plug pin 1 according to an exemplary embodiment. As shown in fig. 1 and 2, the electrical connector 100 may include a plug pin 1, and the plug pin 1 may be used for making an electrically conductive contact with a counterpart electrical connector to achieve signal conduction between the electrical connector 100 and the counterpart electrical connector, where the signal may include a data signal and an electrical signal. Each electrical connector 100 may include one or more plug pins, which are not limited by this disclosure. For example, as shown in fig. 1, when the electrical connector 100 is a Type-c terminal, it may include 12 plug pins 1 located in an upper row and 12 plug pins 1 located in a lower row; alternatively, when the electrical connector 100 is a Micro USB terminal, it may include 5 plug pins 1; or the electrical connector 100 can also be of a Type-a, a Type-b, or other interface types, which is not described herein again. The electrical connector 100 may be a male plug or a female plug, which is not limited by the present disclosure.

As shown in fig. 2, the plug pin 1 may include a substrate 11 and a composite anti-corrosion film layer 12, the substrate 11 may include a conductive region 111, the composite anti-corrosion film layer 12 may be formed on a surface of the substrate 11, and the composite anti-corrosion film layer 12 may include a metal titanium layer 121, the metal titanium layer 121 is stacked with the conductive region 111 of the substrate 11, that is, the metal titanium layer 121 is disposed corresponding to the conductive region 111 of the substrate 11. Therefore, the physical and chemical properties of the titanium element can be exerted to perform physical vapor deposition coating to obtain the titanium layer 121, and the high conductivity and better corrosion resistance of the titanium layer 212 are utilized, so that compared with the technical scheme of adopting a rhodium-palladium coating in the related art, the production cost can be reduced, and the good conductivity and corrosion resistance can be kept.

In an embodiment, as shown in fig. 3, the composite anti-corrosion film layer 12 may further include a primer layer 122, the primer layer 122 is formed on a surface of the substrate 11, and the metal titanium layer 121 may be formed on a surface of the primer layer 122 stacked with the conductive region 111, that is, the primer layer 122 is located between the metal titanium layer 121 and the substrate 11. The bottom layer 122 may include a nickel metal layer or a nickel metal compound layer, and the bottom layer 122 may fill the small pits on the surface of the conductive region 111 to achieve planarization, so as to improve the connection strength of the titanium metal layer 121 and reduce the risk of dropping the titanium metal layer 121.

In this embodiment, as shown in fig. 4, the composite anti-corrosion film layer 12 may further include a first metal layer 123, and the first metal layer 123 may be formed on the surface of the metal titanium layer 121, that is, the metal titanium layer 121 may be located between the first metal layer 123 and the primer layer 122, so that the metal titanium layer 121 may be protected by the first metal layer 123, and the metal titanium layer 121 is prevented from directly contacting the pin of the opposite terminal connector, which is beneficial to maintain the corrosion resistance of the plug pin 1. The first metal layer 123 may include one or more of metal gold material, metal rhodium, metal silver, and metal ruthenium. For example, the first metal layer 123 may be one of a gold layer, a metal gold alloy layer, a metal rhodium alloy layer, a metal silver alloy layer, a metal palladium alloy layer, a metal ruthenium layer, and a metal ruthenium alloy layer, and may be selected according to production cost and design requirements, which is not limited by the present disclosure.

In the above embodiments, as shown in fig. 3 and 4, the substrate 11 may further include a bonding pad 112, the primer layer 122 may be further formed on a surface of the bonding pad 112, and the composite anti-corrosion film layer 12 may further include a second metal layer 124, and the second metal layer 124 may be formed on a surface of the primer layer 122, which is disposed corresponding to the bonding pad 112, so as to protect the bonding pad 112 from wear and corrosion through the second metal layer 124.

It should be noted that, in the above embodiment, the structures of the composite anticorrosive film layer 12 corresponding to the conductive region 111 and the land 112 of the substrate 11 may be the same as that shown in fig. 3, that is, both structures are two-layer structures. Alternatively, in other embodiments, as shown in fig. 4, the structures of the conductive region 111 of the substrate 11 and the composite anti-corrosion film layer 12 corresponding to the bonding region 112 may be different, for example, in fig. 4, the composite anti-corrosion film layer 12 corresponding to the conductive region 111 may have three layers, and the composite anti-corrosion film layer 12 corresponding to the bonding region 112 may have two layers, wherein the first metal layer 123 and the second metal layer 124 may use different metal materials, or the first metal layer 123 and the second metal layer 124 may use the same material, so as to simplify the process.

Based on the technical scheme of the present disclosure, as shown in fig. 5, the present disclosure further provides a process for manufacturing an insertion pin, which may include the following steps:

in step 501, a substrate is formed, which may include a conductive region.

In this embodiment, the substrate may include a copper material, and a predetermined area on the copper material may be determined as a conductive area, and the conductive area may be subsequently conducted with the pin of the opposite terminal connector to realize signal transmission. The signals may include data signals and electrical signals.

In step 502, a composite anti-corrosion film layer is formed on a surface of a substrate, the composite anti-corrosion film layer includes a metal titanium layer, and the metal titanium layer and the conductive region are stacked.

In this embodiment, the titanium metal layer may be formed over the conductive region by physical vapor deposition. In an embodiment, a primer layer may be formed on the surface of the substrate, and then a metal titanium layer is formed on the surface of the primer layer, which is stacked with the conductive region, so that unevenness of the substrate can be filled up by the primer layer, and planarization is achieved, thereby improving the connection strength of the metal titanium layer and reducing the risk of dropping the metal titanium layer.

Further, a first metal layer may be formed on the surface of the metal titanium layer, and the metal titanium layer is protected by the first metal layer, and in this embodiment, the substrate may also protect the bonding pad, a primer layer may be formed on the surface of the bonding pad, and a second metal layer may be formed on the surface of the primer layer corresponding to the bonding pad, and the bonding pad may be protected by the second metal layer. The first metal layer and the second metal layer may be formed in the same process step, or may be formed in different process steps, which is not limited in this disclosure.

Based on the electrical connector 100 described in any one of the above embodiments, the electrical connector 100 may be applied to the electronic device 200 shown in fig. 6, the electronic device 200 includes a motherboard and the electrical connector 100 described in any one of the above embodiments, the electrical connector 100 may be electrically connected to the motherboard to implement the corresponding function of the electronic device 200 through the electrical connector 100, and as shown in fig. 6, the electrical connector 100 may be located at the bottom of the electronic device 200 (i.e., an end of the electronic device facing the ground when a user holds the electronic device in a normal state) to serve as a charging interface, an earphone interface, a data transmission interface, and the like of the electronic device 200; the electronic device 200 may include a mobile phone, a tablet computer, an electronic reader, a wearable device, a smart home, a sound box, and the like, which is not limited by the disclosure.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electrical connector comprising a plug pin, the plug pin comprising:

a substrate comprising a conductive region;

2. The electrical connector of claim 1, wherein the composite corrosion protection film layer comprises:

3. The electrical connector of claim 2, wherein the primer layer comprises a metallic nickel layer or a metallic nickel compound layer.

4. The electrical connector of claim 2, wherein the composite corrosion protection film layer further comprises:

the first metal layer is formed on the surface of the metal titanium layer.

5. The electrical connector of claim 4, wherein the first metal layer comprises:

6. The electrical connector of claim 2, wherein the substrate further comprises a solder pad, the primer layer is further formed on a surface of the solder pad, and the composite corrosion protection film layer further comprises:

7. The electrical connector of claim 1, wherein the electrical connector comprises a USB connector.

8. The machining process of the plug pin is characterized by comprising the following steps of:

forming a substrate comprising a conductive region;

9. The process of claim 8, wherein forming a composite anticorrosion film layer on the surface of the substrate comprises:

forming a primer layer on the surface of the base material;

10. The process of claim 9, further comprising:

and forming a first metal layer on the surface of the metal titanium layer.

11. The process of claim 9, wherein the substrate includes a weld zone, the process further comprising:

and forming a second metal layer on the surface of the bottom layer which is laminated with the conductive region.

12. An electronic device comprising an electrical connector according to any one of claims 1-7.