CN113725057A - Semiconductor processing equipment - Google Patents
Semiconductor processing equipment Download PDFInfo
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- CN113725057A CN113725057A CN202111014444.7A CN202111014444A CN113725057A CN 113725057 A CN113725057 A CN 113725057A CN 202111014444 A CN202111014444 A CN 202111014444A CN 113725057 A CN113725057 A CN 113725057A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 238000012545 processing Methods 0.000 title claims description 31
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- 238000010008 shearing Methods 0.000 description 3
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
Abstract
The application discloses semiconductor process equipment, which comprises a process cavity and an upper electrode structure, wherein the process cavity comprises a cover plate, the upper electrode structure comprises a connecting assembly, an air outlet disc, a driving assembly, a transmission assembly and a guide assembly, the air outlet disc is arranged in the process cavity, the connecting assembly penetrates through the cover plate to be connected with the air outlet disc, the driving assembly is installed on the cover plate and used for driving the connecting assembly to lift along the vertical direction through the transmission assembly so as to drive the air outlet disc to lift, and the guide assembly is installed on the cover plate and used for limiting the lifting direction of the connecting assembly to be the vertical direction; the transmission assembly comprises a lead screw and a movable sliding block arranged on the lead screw, the lead screw is rotatably arranged on the cover plate along the vertical direction, the movable sliding block is connected with the connecting assembly, and the driving assembly is used for driving the lead screw to rotate so that the movable sliding block moves along the lead screw to drive the connecting assembly to lift. The technical scheme can solve the problems of high difficulty in adjusting the upper electrode structure in the vertical direction and poor adjustment precision in the conventional semiconductor process equipment.
Description
Technical Field
The application belongs to the technical field of semiconductor processing, and particularly relates to semiconductor process equipment.
Background
The edge etcher is a semiconductor processing device for processing wafers, and the edge of the wafers can be etched by the edge etcher. The process only etches the edge of the wafer, so that the distance between the wafer and the air outlet disc of the upper electrode is required to meet a certain condition, and the central area of the wafer is prevented from being etched by mistake. At present, as shown in fig. 1, in an edge etching machine, there are generally disposed wedge-shaped blocks 10 butted up and down, one of the wedge-shaped blocks butted up and down is fixed with an upper electrode 20, and the other is fixed with a driving device 30, so that an air outlet disc of the upper electrode is indirectly driven to move in a vertical direction by driving the wedge-shaped blocks 10 butted up and down to move relatively, thereby adjusting a vertical distance between the air outlet disc and a wafer. However, in the working process of the edge etching machine, when the air outlet disc is adjusted by the wedge blocks 10, the friction between the wedge blocks 10 is relatively large under the influence of the self weight of the upper electrode structure, which results in large adjustment difficulty and relatively poor adjustment precision.
Disclosure of Invention
The application discloses semiconductor process equipment, which aims to solve the problems that the adjustment difficulty of an upper electrode structure in the vertical direction is high and the adjustment precision is poor in the existing semiconductor process equipment.
In order to solve the above problem, the embodiments of the present application are implemented as follows:
the embodiment of the application provides semiconductor process equipment, which comprises a process cavity and an upper electrode structure, wherein the process cavity comprises a cavity body and an cover plate arranged at the top of the cavity body, the upper electrode structure comprises a connecting assembly, an air outlet disc, a driving assembly, a transmission assembly and a guiding assembly, the air outlet disc is arranged in the process cavity, the connecting assembly penetrates through the cover plate to be connected with the air outlet disc, the driving assembly is arranged on the cover plate and used for driving the connecting assembly to lift along the vertical direction through the transmission assembly so as to drive the air outlet disc to lift, and the guiding assembly is arranged on the cover plate and used for limiting the lifting direction of the connecting assembly to be the vertical direction;
the transmission assembly comprises a lead screw and a movable sliding block arranged on the lead screw, the lead screw is rotatably arranged on the cover plate along the vertical direction, the movable sliding block is connected with the connecting assembly, the driving assembly is used for driving the lead screw to rotate, so that the movable sliding block is moved along the lead screw to drive the connecting assembly to lift.
The embodiment of the application provides semiconductor process equipment which comprises a process chamber and an upper electrode structure, wherein a cover plate of the process chamber is arranged on a chamber body in a covering mode. Go up electrode structure and include coupling assembling, go out the gas dish, drive assembly and direction subassembly, it sets up in process cavity to go out the gas dish, coupling assembling passes the apron and is connected with the dish of giving vent to anger, drive assembly installs in the apron, under drive assembly's effect in order to guarantee, the coupling assembling that is connected through drive assembly and drive assembly can lap the axial motion along the apron relatively, adjust out the relative position of gas dish and apron, then make the interval between this internal wafer of gas dish and cavity can be changed.
And in the upper electrode structure, the transmission assembly comprises a lead screw and a movable sliding block connected with the lead screw, the lead screw is connected with the driving assembly, and the movable sliding block is connected with the connecting assembly so that the movable sliding block can drive the air outlet disc to move along the vertical direction relative to the cover plate through the connecting assembly under the condition that the driving assembly drives the lead screw to rotate. The transmission stability and reliability of the transmission assembly are relatively high, and the adjustable range of the air outlet disc is relatively large.
In addition, the guide assembly in the upper electrode structure is arranged on the cover plate, the lifting direction of the connecting assembly can be limited to be the vertical direction through the guide assembly, the precision of the moving direction of the connecting assembly can be further improved, and the shearing force applied to the lead screw can be greatly reduced under the action of the guide assembly, so that the lead screw basically can only provide a transmission effect, and the reliability and the service life of the transmission assembly and the whole upper electrode structure are further improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic view of a structure of a semiconductor device in the related art;
FIG. 2 is a schematic diagram of a semiconductor processing apparatus according to an embodiment of the present disclosure;
FIG. 3 is an enlarged schematic view of detail A of FIG. 2;
FIG. 4 is a schematic view of a semiconductor processing apparatus disclosed in an embodiment of the present application in another orientation;
FIG. 5 is a schematic diagram of a portion of a structure in a semiconductor processing apparatus as disclosed in an embodiment of the present application;
FIG. 6 is a schematic cross-sectional view of a portion of a structure in a semiconductor processing apparatus as disclosed in an embodiment of the present application;
FIG. 7 is a schematic cross-sectional view of another embodiment of a semiconductor processing apparatus;
FIG. 8 is an enlarged schematic view of a portion of the structure of FIG. 7;
FIG. 9 is a schematic view of a distribution of positions of distance detecting members in the semiconductor processing apparatus according to the embodiment of the present disclosure;
FIG. 10 is a schematic diagram of a state of the semiconductor processing apparatus disclosed in an embodiment of the present application;
fig. 11 is a schematic view of another state of the semiconductor processing apparatus disclosed in the embodiments of the present application.
Description of reference numerals:
10-wedge-shaped block, 20-upper electrode, 30-driving device,
110-support frame, 111-top plate, 112-frame body, 120-horizontal adjusting mechanism, 121-positioning block, 122-adjusting screw, 130-connecting mechanism, 131-limiting plate, 132-transition block, 133-connecting block, 134-threaded connecting piece,
200-an air outlet disc,
310-cover plate, 320-chamber body, 330-bottom electrode,
400-drive assembly, 410-drive source, 420-worm, 430-worm gear,
510-lead screw, 520-movable slide block, 530-lead screw seat,
610-distance detecting part, 620-light-transmitting part, 630-sealing ring, 640-fixing part,
710-mounting plate, 720-guide sliding block, 730-guide sliding rail,
800-wafer,
910-an opening and closing driving source, 920-an opening and closing worm wheel, 930-an opening and closing worm, 940-a transmission shaft, 951-a first hinge rod, 952-a second hinge rod, 960-a bearing and 970-a motor base.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings.
As shown in fig. 2-11, embodiments of the present application disclose a semiconductor processing apparatus including a process chamber and an upper electrode structure.
The process chamber includes a chamber body 320 and a cover plate 310, wherein the chamber body 320 is a main structure of the process chamber and is provided with a cavity, the wafer 800, the lower electrode 330 and the like can be accommodated in the cavity, and the size and the shape of the chamber body 320 are not limited herein. The cover plate 310 is disposed on the top of the chamber body 320 to provide a sealing function to the chamber body 320, and the shape and size of the cover plate 310 may be adaptively designed corresponding to the chamber body 320.
The upper electrode structure includes a connection assembly, an outlet plate 200, a drive assembly 400, a transmission assembly, and a guide assembly. The gas outlet disk 200 is disposed in the process chamber, the gas outlet disk 200 is a component for outputting the process gas in the upper electrode structure, and the distribution of the process gas in the process chamber can be adjusted by controlling the position of the gas outlet disk 200.
Go out gas dish 200 and apron 310 and all with coupling assembling interconnect, coupling assembling sets up in the apron 310 one side that deviates from gas dish 200, and coupling assembling passes apron 310 and is connected with gas dish 200 to make coupling assembling provide the mounting effect for gas dish 200, indirectly link together gas dish 200 and apron 310. Specifically, the connection assembly and the air outlet disc 200 may be fixedly connected by welding or connecting members, or the like, and of course, the connection assembly and the air outlet disc may be only in a relatively fixed relationship in the vertical direction, and in a relatively movable or relatively fixed relationship in the direction perpendicular to the vertical direction.
In order to adjust the position of the gas outlet tray 200, the gas outlet tray 200 further needs to have a capability of moving relative to the cover plate 310, and based on this, the upper electrode structure includes a driving assembly 400, the driving assembly 400 is installed on the cover plate 310, and the driving assembly 400 can drive the connecting assembly to lift along the vertical direction through the transmission assembly, so as to drive the gas outlet tray 200 to lift. Illustratively, the outlet disc 200 is also in a coupling relationship with the drive assembly 400 via a coupling assembly and a transmission assembly. Specifically, the drive assembly 400 may be directly secured to the cover plate 310 via a threaded connection or the like, or the drive assembly 400 may be indirectly secured to the cover plate 310 via other components and in a relatively fixed relationship with the cover plate 310. It should be noted that the vertical direction is the axial direction of the process chamber.
The guide assembly is installed in apron 310, can be spacing for vertical direction with coupling assembling's lifting direction with the help of the guide assembly to promote drive assembly's transmission reliability, and then promote the lift precision of air disk 200. The guide assembly may be a shaft hole type structure assembly, and of course, the guide assembly may also adopt other specific structure forms.
The transmission assembly includes a lead screw 510 and a moving slider 520, wherein the moving slider 520 is disposed on the lead screw 510 to drive the moving slider 520 to move along an axial direction of the lead screw 510 in case that the lead screw 510 rotates. And, the moving slider 520 is connected with the connecting assembly to in-process that the moving slider 520 moved can drive the connecting assembly to move together, simultaneously, as described above, the connecting assembly is connected with the air outlet disc 200, and this makes the air outlet disc 200 driven by the moving slider 520 together and goes up and down in the vertical direction. Based on the above embodiment, under the action of the driving assembly 400, the driving assembly 400 can drive the lead screw 510 to rotate, and the movable slider 520 moves along the lead screw 510, so as to drive the connecting assembly to move up and down, and finally drive the air outlet disc 200 to move up and down along the vertical direction relative to the cover plate 310.
Specifically, the driving assembly 400 may include a rotating motor, and the driving assembly 400 may drive the lead screw 510 to rotate by connecting the lead screw 510 to an output shaft of the rotating motor, and the movable slider 520 may be screwed on the lead screw 510, and the movable slider 520 and the connecting assembly may be fixedly connected by welding or the like, or the movable slider 520 may be fixed on the connecting assembly by a screw connection or the like. Of course, the two corresponding to each other may form a transmission connection relationship in other manners, and is not limited herein.
Based on the above embodiment, in the upper electrode structure, the driving assembly 400 can drive the gas outlet disc 200 to move along the vertical direction through the transmission assembly driving connection assembly, so as to change the distance between the gas outlet disc 200 and the cover plate 310 in the vertical direction, and further change the distance between the gas outlet disc 200 and the wafer 800 in the chamber body 320 in the vertical direction, so as to drive the gas outlet disc 200 to move under the matching of the driving assembly 400 and the transmission assembly under the condition that the distance between the gas outlet disc 200 and the wafer 800 needs to be adjusted. Of course, in order to ensure that the air outlet disc 200 can be driven to move along the axial direction of the cover plate 310 under the action of the driving assembly 400 and the transmission assembly, the transmission assembly needs to have a corresponding transmission direction, and particularly, the extending direction of the lead screw 510 needs to be parallel to the vertical direction.
The present embodiment provides a semiconductor processing apparatus, which includes a process chamber and an upper electrode structure, wherein a cover plate 310 of the process chamber is disposed on a chamber body 320. The upper electrode structure comprises a connecting assembly, an air outlet disc 200, a driving assembly 400, a transmission assembly and a guide assembly, wherein the air outlet disc 200 is arranged in the process chamber, the connecting assembly penetrates through the cover plate 310 to be connected with the air outlet disc 200, the driving assembly 400 is installed on the cover plate 310, so that under the action of the driving assembly 400, the connecting assembly connected with the driving assembly 400 through the transmission assembly can move relative to the cover plate 310 along the axial direction of the cover plate 310, the relative positions of the air outlet disc 200 and the cover plate 310 are adjusted, and then the distance between the air outlet disc 200 and a wafer 800 in the chamber body 320 can be changed.
In addition, in the upper electrode structure, the transmission assembly includes a lead screw 510 and a movable slider 520 connected to the lead screw 510, the lead screw 510 is connected to the driving assembly 400, and the movable slider 520 is connected to the connection assembly, so that when the driving assembly 400 drives the lead screw 510 to rotate, the movable slider 520 can drive the air outlet disc 200 to move in the vertical direction relative to the cover plate 310 through the connection assembly. The transmission stability and reliability of the transmission assembly are relatively high, and the adjustable range of the air outlet disc 200 is relatively large.
In addition, the guide assembly in the upper electrode structure is installed on the cover plate 310, the lifting direction of the connecting assembly can be limited to the vertical direction through the guide assembly, the precision of the moving direction of the connecting assembly can be further improved, and the shearing force applied to the lead screw 510 can be greatly reduced under the action of the guide assembly, so that the lead screw 510 can basically only provide a transmission effect, and the reliability and the service life of the transmission assembly and the whole upper electrode structure are further improved.
As described above, the drive assembly may include a rotary motor, and the lead screw 510 may be directly connected to the rotary motor to drive the lead screw 510 to rotate via the rotary motor. In another embodiment of the present application, the driving assembly includes a driving source 410, a worm 420, and a worm wheel 430.
The driving source 410 may be a rotating motor, and the worm 420 is in transmission connection with the driving source 410 so that the driving force of the driving source 410 can be transmitted to the worm 420. Correspondingly, the worm wheel 430 is engaged with the worm 420, the worm wheel 430 is sleeved on the lead screw 510, and the movable sliding block 520 is in transmission connection with the lead screw 510, so that the driving source 410 drives the worm 420 to rotate, and drives the worm wheel 430 to rotate, and further drives the lead screw 510 to rotate, and the movable sliding block 520 drives the connecting assembly to move along the vertical direction.
Specifically, the worm 420 may be fixedly connected to the output shaft of the driving source 410 by welding, or the like, or the worm 420 and the output shaft of the driving assembly 400 may be sleeved with each other, and the relative rotation between the worm 420 and the output shaft is limited by a pin or the like; the worm gear 430 and the lead screw 510 can be fixedly connected in a welding manner, or the lead screw 510 is arranged in a wheel hole of the worm gear 430 in a penetrating manner, and a key connection relationship is formed between the two.
Meanwhile, in the above embodiment, the spiral angle of the worm 420 is smaller than the friction angle between the worm 420 and the worm wheel 430, and in this case, the worm wheel 430 and the worm 420 have a self-locking capability, so that in the working process of the upper electrode structure, the self-locking effect of the worm 420 and the worm wheel 430 can be utilized to reliably lock the position of the gas disk 200, and further, in this case, the self-locking function of the driving assembly is not required to be utilized to provide a position locking function for the gas disk 200, so that the service life of the driving assembly 400 is prolonged, and even if the band-type brake of the driving assembly 400 fails, the accidental action of the gas disk 200 cannot be caused, the yield of the wafer 800 is increased, and the semiconductor process equipment is prevented from being damaged.
As described above, the gas outlet plate 200 has the capability of moving along the axial direction of the cover plate 310, or the axial direction of the process chamber, i.e. the vertical direction, relative to the cover plate 310, and it is generally required to ensure a high concentricity between the gas outlet plate 200 and the wafer 800 in order to accurately process the edge region of the wafer 800 during the operation of the upper electrode structure, and therefore, in this embodiment, the upper electrode structure can also have the capability of moving along the direction perpendicular to the axial direction of the cover plate 310, i.e. the horizontal direction, relative to the cover plate 310.
Based on this, optionally, the connecting assembly includes a support frame 110, a horizontal adjusting mechanism 120 and a connecting mechanism 130, and in this embodiment, the guiding assembly may be specifically connected with the support frame 110. The supporting frame 110 is connected with the movable sliding block 520, the horizontal adjusting mechanism 120 and the connecting mechanism 130 are both arranged on the supporting frame 110, and the horizontal adjusting mechanism 120 is connected with the connecting mechanism 130. Specifically, the horizontal adjustment mechanism 120 and the connection mechanism 130 are both supported by the support frame 110, and the horizontal adjustment mechanism 120 can be used to adjust the relative position of the connection mechanism 130 and the support frame 110 on a horizontal plane, i.e., a plane perpendicular to the vertical direction.
Moreover, the air outlet disc 200 is fixedly connected with the connecting mechanism 130, so that under the condition that the driving assembly 400 acts, the supporting frame 110 can be driven by the transmission assembly to move along the axial direction (i.e. the vertical direction) of the cover plate 310, and then the horizontal adjusting mechanism 120 and the connecting mechanism 130 drive the air outlet disc 200 to move along the vertical direction relative to the cover plate 310, so as to achieve the purpose of adjusting the axial position of the air outlet disc 200. Meanwhile, under the action of the horizontal adjustment mechanism 120, the relative positions of the gas outlet disc 200 and the cover plate 310 in the direction perpendicular to the axial direction of the cover plate 310 (i.e., the horizontal direction) can be adjusted, so that the purpose of adjusting the concentricity between the gas outlet disc 200 and the wafer 800 is achieved.
Specifically, the horizontal adjustment mechanism 120 may be mounted on the supporting frame 110, so that when the supporting frame 110 moves along the axial direction of the cover plate 310 along with the moving slider 520, the horizontal adjustment mechanism 120 may be driven to move together, and the horizontal adjustment mechanism 120 may include a fixed portion and a movable portion movably connected, so that by connecting the movable portion of the horizontal adjustment mechanism 120 with the connection mechanism 130, the relative position between the connection mechanism 130 and the supporting frame 110 in the horizontal plane may be adjusted during the process of moving the movable portion relative to the fixed portion. The connecting mechanism 130 may be a rod-shaped or block-shaped connecting member, so that the supporting frame 110 and the air outlet disc 200 can be connected to each other through the connecting mechanism 130, and the connecting mechanism 130 may be disposed outside the supporting frame 110. Alternatively, the supporting frame 110 is provided with a cavity, in which case the connecting mechanism 130 connecting the horizontal adjusting mechanism 120 and the air outlet disc 200 may be provided in the cavity to reduce the space occupied by the whole connecting assembly. Specifically, the connecting mechanism 130 includes a connecting block 133, the connecting block 133 is disposed in the cavity of the support frame 110, and the support frame 110 and the air outlet disc 200 are connected through the connecting block 133.
The horizontal adjustment mechanism 120 is adjustably connected to the support bracket 110 in a direction perpendicular to the axial direction of the cover plate 310, so that the horizontal adjustment mechanism 120 has the purpose of adjusting the relative positions of the connection mechanism 130 and the support bracket 110 in the horizontal plane. Specifically, the horizontal adjustment mechanism 120 and the support frame 110 may have the capability of relative movement in a direction perpendicular to the axial direction of the cover plate 310, so as to ensure that the horizontal adjustment mechanism 120 can adjust the positional relationship between the air outlet disc 200 connected to the connection mechanism 130 and the cover plate 310 in the direction perpendicular to the axial direction of the cover plate 310. In addition, the air outlet disc 200 and the cover plate 310 can form a stable relative fixed relationship in the non-adjustment process by the gravity of the air outlet disc 200 acting on the support frame 110, and in this case, a limit structure can not be separately configured for the fixed relationship of the horizontal adjustment mechanism 120 and the cover plate 310 in the vertical direction.
In order to further prevent the gas outlet disc 200 from accidentally acting in the direction perpendicular to the axial direction of the cover plate 310 relative to the cover plate 310 in the non-adjustment process, a detachable fixed relationship can be formed between the support frame 110 and the horizontal adjusting mechanism 120 by means of screws or clamping members, so that when the position of the gas outlet disc 200 in the direction perpendicular to the axial direction of the cover plate 310 needs to be adjusted, the relative movement capability between the horizontal adjusting mechanism 120 and the support frame 110 is restored by opening the screws or the clamping members, and after the adjustment is completed, the screws or the clamping members can be locked to limit the relative movement between the horizontal adjusting mechanism 120 and the support frame 110, and the position of the gas outlet disc 200 in the vertical direction is locked.
In order to reduce the difficulty of adjusting the horizontal adjustment mechanism 120 and improve the adjustment accuracy of the horizontal adjustment mechanism 120, optionally, the horizontal adjustment mechanism 120 includes a plurality of positioning blocks 121 and a plurality of adjustment screws 122, wherein the plurality of positioning blocks 121 are all fixed to the supporting frame 110, the plurality of positioning blocks 121 are disposed around the connection mechanism 130, and the plurality of adjustment screws 122 are in one-to-one threaded fit with the plurality of positioning blocks 121, so that the adjustment screws 122 and the positioning blocks 121 have a relative rotation capability. The axial directions of the adjusting screws 122 are all horizontal, and each adjusting screw 122 passes through the positioning block 121 and is connected with the connecting mechanism 130. Of course, the adjusting screw 122 and the positioning block 121 are relatively fixed in the axial direction of the adjusting screw 122, so that the relative position between the adjusting screw 122 and the positioning block 121 does not change due to the rotation of the adjusting screw 122, and further, the relative position between the adjusting screw 122 and the supporting frame 110 does not change due to the rotation of the adjusting screw 122, thereby ensuring that the horizontal adjusting mechanism 120 has the function of horizontally adjusting the position of the connecting mechanism 130.
Specifically, each positioning block 121 may be made of a hard material such as metal, and may be fixedly connected to the supporting frame 110 by welding, or may be integrally formed between the positioning block 121 and the supporting frame 110. Be provided with the mating holes on the locating piece 121, and adjusting screw 122 stretches into in the mating holes, set up the structure of blockking through the one side that deviates from horizontal adjustment mechanism 120 at the mating holes, can make adjusting screw 122 and locating piece 121 form the relatively fixed relation in adjusting screw 122's axial.
Also, the axial direction of the adjustment screw 122 is perpendicular to the axial direction of the cover plate 310, that is, the axial direction of the adjustment screw 122 is the horizontal direction. The adjusting screw 122 is screwed with the connecting mechanism 130, in this case, by screwing the adjusting screw 122, the connecting mechanism 130 can be driven to move relative to the positioning block 121 along the direction perpendicular to the axial direction of the cover plate 310, that is, the connecting mechanism 130 can achieve the purpose of adjusting the relative positions of the air outlet disc 200 and the cover plate 310 in the direction perpendicular to the axial direction of the cover plate 310 through the horizontal adjusting mechanism 120.
Of course, in order to ensure that the horizontal adjustment mechanism 120 can adjust the position of the air outlet disc 200 in any direction perpendicular to the axial direction of the cover plate 310, as described above, the number of the positioning blocks 121 and the adjustment screws 122 is multiple, the adjustment screws 122 are matched with the positioning blocks 121 in a one-to-one correspondence manner, and the positioning blocks 121 are disposed around the connection mechanism 130. Specifically, the number of the positioning blocks 121 and the number of the adjusting screws 122 may be two, and the two adjusting screws 122 are perpendicular to each other in the axial direction, that is, the two adjusting screws 122 may be used to enable the horizontal adjusting mechanism 120 to have the purpose of enabling the connecting mechanism 130 to move relative to the cover plate 310 along any direction in a plane perpendicular to the axial direction of the cover plate 310, and the difficulty and complexity of the adjustment of the horizontal adjusting mechanism 120 with such a structure are relatively low.
Further, the support stand 110 disclosed in the embodiment of the present application includes a top plate 111 and a frame body 112, and the frame body 112 is located above the cover plate 310, so as to ensure that the support stand 110 has the capability of moving relative to the cover plate 310 in the vertical direction. Moving slide 520 and guide assembly all are connected with support body 112 to make moving slide 520 can drive support body 112 along the vertical direction motion, roof 111 supports on support body 112, thereby at support body 112 along with the in-process that moving slide 520 moved, can drive roof 111 along the vertical direction motion in the lump. In the present embodiment, the horizontal adjustment mechanism 120 is disposed on the top plate 111 to provide a relatively larger installation and operation space for the horizontal adjustment mechanism 120 through the top plate 111, and reduce the difficulty of horizontal adjustment of the connection mechanism 130. More specifically, the top plate 111 and the frame body 112 may be integrally formed by metal or the like, or the two may be fixedly connected by welding or the like, which may improve the consistency of the movement between the top plate 111 and the frame body 112. In addition, the housing 112 may be provided with an inner cavity, and the connection mechanism 130 may be received in the inner cavity of the housing 112.
In this embodiment, the connection mechanism 130 includes the limiting plate 131, the transition block 132 and the connection block 133, the limiting plate 131 is disposed on the top plate 111 and connected to the top plate 111, so that the limiting plate 131 can provide a supporting function for the whole connection mechanism 130 in the vertical direction, and then when the top plate 111 moves vertically along with the moving slider 520, the whole connection mechanism 130 can be driven to move in the vertical direction. And one end of the transition block 132 penetrates through the top plate 111 to be connected with the limiting plate 131, the other end of the transition block 132 is connected with one end of the connecting block 133, and the other end of the connecting block 133 penetrates through the cover plate 310 to be connected with the air outlet disc 200, so that the air outlet disc 200 and the limiting plate 131 form a reliable connection relationship in the vertical direction.
Preferably, in order to seal the opening of the cover plate 310, the connecting mechanism 130 may further include a retractable sealing member, such as a bellows, one end of which is connected to the connecting mechanism 130 in a sealing manner, and the other end of which is connected to the cover plate 310 in a sealing manner, so as to seal the opening of the cover plate 310.
In addition, in order to ensure that the horizontal adjustment mechanism 120 can still provide the horizontal adjustment function for the connection mechanism 130, as described above, the horizontal adjustment mechanism 120 may be mounted on the top plate 111, and the horizontal adjustment mechanism 120 may include the positioning block 121, specifically, the positioning block 121 is fixed on the top plate 111, and the positioning block 121 may be sandwiched between the limiting plate 131 and the top plate 111, and the limiting plate 131 and the top plate 111 may be connected to each other by a bolt or the like. Meanwhile, as shown in fig. 6, a fitting hole may be provided on the limiting plate 131, a detachable connection relationship may be formed between the limiting plate 131 and the transition block 132 through the threaded connection member 134, and the adjusting screw 122 of the horizontal adjusting mechanism 120 is connected to the transition block 132, so that when the horizontal position of the air outlet disc 200 needs to be adjusted, the threaded connection member 134 may have a capability of moving in the fitting hole of the limiting plate 131 by loosening the threaded connection member 134 between the limiting plate 131 and the transition block 132, and further, under the effect of the horizontal adjusting mechanism 120, the relative position of the limiting plate 131 and the transition block 132 in the horizontal direction may be changed. Of course, in the above embodiment, the outer diameter of the threaded connector 134 is smaller than the inner diameter of the mating hole to ensure the ability of the threaded connector 134 to move within the mating hole.
As described above, in order to ensure the processing effect of the wafer 800, it is necessary to make the gas outlet disc 200 and the wafer 800 have a required concentricity, and a specific embodiment is that before the wafer 800 is processed, the specific position of the wafer 800 to be transferred is determined based on the real-time position of the center of the circle of the gas outlet disc 200 by measuring the relative positions of the gas outlet disc 200 and the cover plate 310 in the direction perpendicular to the axial direction of the cover plate 310, and the transfer position of the wafer 800 is controlled by a wafer transfer mechanism such as a robot arm, so that the concentricity between the wafer 800 and the gas outlet disc 200 meets the requirement.
In another embodiment of the present application, the upper electrode structure includes a concentricity monitoring assembly, the concentricity monitoring assembly includes at least two distance detection members 610, the at least two distance detection members 610 are disposed on the sidewall of the chamber body 320 at intervals along the circumferential direction of the chamber body 320, each distance detection member 610 can detect the distance between itself and the gas outlet disc 200, so that the relative position of the gas outlet disc 200 and the cover plate 310 in the direction perpendicular to the axial direction of the cover plate 310 is monitored in real time by the distance detected by the at least two distance detection members 610, and by sending the specific position parameter of the gas outlet disc 200 to the wafer conveying mechanism, the wafer conveying mechanism can determine the wafer conveying position of the wafer 800 based on the specific position of the gas outlet disc 200 before the next wafer conveying process, so that the concentricity between the wafer 800 and the gas outlet disc 200 meets the requirement.
Of course, when the wafer 800 is controlled to be transferred into the chamber by a wafer transfer mechanism such as a robot and the concentricity between the wafer 800 and the gas outlet plate 200 is ensured to be high, the wafer transfer mechanism is limited by parameters such as the moving range of the wafer transfer mechanism and the structure of the chamber body 320, and the adjusting capability of the wafer transfer mechanism is limited, and may be about 0.2 mm. Based on this, after the concentricity monitoring component obtains the real-time position parameter of the gas outlet disc 200, if the maximum adjustment amount of the wafer transmission mechanism still can not meet the concentricity requirement of the wafer 800, an alarm is triggered, based on the alarm information, the relative position of the gas outlet disc 200 and the cover plate 310 can be changed in a stop adjustment mode, namely, the relative position of the horizontal adjusting mechanism 120 connected with the gas outlet disc 200 and the cover plate 310 in the direction perpendicular to the axial direction of the cover plate 310 is adjusted, so that the position of the gas outlet disc 200 is relatively more centered, and the concentricity of the wafer 800 transmitted by the wafer transmission mechanism can meet the requirement.
Specifically, the distance detecting member 610 may be an infrared distance measuring device, or may also be an ultrasonic distance measuring device, or the like. The distance detecting members 610 may be installed on the chamber body 320 to which the upper electrode structure is coupled, such that each distance detecting member 610 is substantially located at the outer side of the gas outlet plate 200, which may improve the detection accuracy of the distance detecting member 610 to some extent. More specifically, the distance detection member 610 may be installed within the chamber body 320.
In order to prolong the service life of the distance detection member 610 and prevent the distance detection member 610 from adversely affecting the processing effect of the wafer 800, in another embodiment of the present application, the distance detection member 610 may be disposed outside the chamber body 320, and correspondingly, in order to ensure that the distance detection member 610 can normally operate, a through hole may be disposed on a sidewall of the chamber body 320, so that the distance detection member 610 detects a real-time distance from the gas outlet tray 200 through the through hole. Further, the penetrating hole may be provided with a light-transmitting member 620 in a sealing manner, so that the penetrating hole is sealed by the light-transmitting member 620 and it is ensured that the distance detecting member 610 can normally operate through the light-transmitting member 620. Further, a sealing ring 630 may be disposed on an inner side of the light-transmitting member 620, and the sealing reliability between the light-transmitting member 620 and the through hole may be further improved by the sealing ring 630. Of course, the sealing ring 630 and the light-transmitting member 620 need to be fixed at the through hole, specifically, the light-transmitting member 620 may be fixed at the through hole by means of a screw or the like, optionally, a fixing member 640 for assisting in fixing may be further disposed on the outer side of the light-transmitting member 620, and the screw may be inserted into the fixing member 640, so as to fix the light-transmitting member 620 and the chamber body 320. In addition, the distance detecting element 610 may be fixed to a side of the fixing element 640 away from the light-transmitting element 620, and the fixing connection between the two elements may be an adhesive or a connector, which is not limited herein.
More specifically, the number of the distance detecting members 610 may be two, and an angle between detection directions of the two distance detecting members 610 may be 90 °, thereby ensuring that the monitoring accuracy of the concentricity monitoring assembly is relatively high. In another embodiment of the present application, optionally, the number of the distance detection pieces 610 is three, the three distance detection pieces 610 are uniformly and alternately arranged along the axial direction of the chamber body 320, the detection precision of the position of the gas outlet disc 200 can be further improved under the combined action of the three distance detection pieces 610, and the reliability of the detection result can be improved under the combined action of the three distance detection pieces 610.
In addition, in the above embodiments, the connecting assembly is connected to the cover plate 310 through the guiding assembly, and the guiding assembly may provide a certain limiting effect on the lifting direction of the connecting assembly. Optionally, the guide assembly includes a mounting plate 710, a guide slider 720 and a guide rail 730, wherein the mounting plate 710 is fixed to the cover plate 310, one of the guide slider 720 and the guide rail 730 is fixed to a side of the mounting plate 710 facing the connection assembly, and the other is fixed to a side of the connection assembly facing the mounting plate 710.
Specifically, the mounting plate 710 and the cover plate 310 may be fixed to each other by welding or integral molding; correspondingly, one of the guide sliding block 720 and the guide sliding rail 730 may be fixed to the mounting plate 710, and the other may be fixed to a connecting component, specifically, the connecting component may be connected to the frame body 112 of the supporting frame 110. Through making the guide slider 720 and the guide slide rail 730 slide-fit in the axial direction of the cover plate 310, make to form a stable sliding fit relation between the connecting assembly and the mounting plate 710, in this case, only need to make the driving assembly 400 and the transmission assembly provide the driving action, can prevent on the one hand that the driving assembly 400 and the transmission assembly from receiving the shearing force effect and reducing life or even damaging, on the other hand can promote the cooperation stability between connecting assembly and the cover plate 310. Moreover, the stability and smoothness of the guiding combination mechanism of the guiding sliding block 720 and the guiding sliding rail 730 are relatively high, and the installation difficulty and the cost are relatively low.
Based on the above embodiment, optionally, the transmission assembly further includes a screw seat 530, one end of the screw 510 away from the cover plate 310 is rotatably connected to the screw seat 530, and the screw seat 530 is fixed to one side of the mounting plate 710 facing the connection assembly, so as to further improve the structural stability of the screw 510 by means of the mounting plate 710 and the screw seat 530, and further improve the motion reliability between the connection assembly and the cover plate 310. Can mutually support through the bearing between lead screw seat 530 and the lead screw 510, guarantee that lead screw 510 can rotate lead screw seat 530 relatively, can form the fixed connection relation through the mode of welding or connecting piece connection between lead screw seat 530 and the mounting panel 710, under the combined action of lead screw seat 530 and removal slider 520, can guarantee that lead screw 510's structural stability is higher relatively. In addition, in the case that the upper electrode structure includes the mounting plate 710, the driving assembly 400 may also be mounted on the mounting plate 710.
During the use of the semiconductor processing equipment, the semiconductor processing equipment generally needs to be repaired, and during the repair, the cover plate 310 needs to be opened to check the internal condition of the chamber body 320. Currently, the cover plate 310 is pivotally connected to the chamber body 320 by a hinge, and when the cavity needs to be opened, the cover plate 310 can be opened from one side of the cover plate 310, which may cause the components mounted on the cover plate 310 to move relative to the cover plate 310, thereby causing a misalignment. In detail, as described above, the cover plate 310 is provided with the connecting assembly and the air outlet disc 200, and during the process of opening and closing the cover plate 310 by lifting, the connecting assembly and the air outlet disc 200 may move relative to the cover plate 310, so that the relative position between the air outlet disc 200 and the cover plate 310 changes, and therefore, after each cavity opening, the position of the air outlet disc 200 needs to be detected, and the position of the air outlet disc 200 is adjusted, which wastes process time.
Based on the above, optionally, the semiconductor processing equipment may further include an opening and closing driving source 910 (such as a motor, a cylinder, etc.), a transmission shaft 940, a first hinge rod 951 and a second hinge rod 952, wherein the opening and closing driving source 910 is installed on the chamber body 320, and the transmission shaft 940 is connected to the opening and closing driving source 910, so that the transmission shaft 940 has a capability of rotating along with the rotation of the driving assembly 400. Specifically, the opening and closing driving source 910 may be installed on the motor base 970 through a connecting member such as a bolt, the motor base 970 is fixed on the chamber body 320, a through hole is structurally formed in the outside of the chamber body 320, and a bearing 960 and other components are disposed in the through hole, so that the transmission shaft 940 can be guaranteed to normally rotate while a stable supporting effect is provided for the transmission shaft 940. One end of the first hinge rod 951 is fixedly connected with the transmission shaft 940, so that the first hinge rod 951 can rotate along with the rotation of the transmission shaft 940, the other end of the first hinge rod 951 is rotatably connected with the cover plate 310, and further the cover plate 310 can be driven to move relative to the chamber body 320, the second hinge rod 952 is spaced from and parallel to the first hinge rod 951, and the two opposite ends of the second hinge rod 952 are respectively hinged to the chamber body 320 and the cover plate 310, so that in the process of moving along with the rotation of the first hinge rod 951, the posture of the cover plate 310 can be always kept unchanged, and further in the process of opening and closing the cover plate 310, the relative position relationship between the component mounted on the cover plate 310 and the cover plate 310 can be basically guaranteed not to change.
Optionally, the semiconductor processing equipment may further include an opening and closing worm 930 and an opening and closing worm wheel 920, the opening and closing worm 930 is in transmission connection with the opening and closing driving source 910, the opening and closing worm wheel 920 is engaged with the opening and closing worm 930, and the opening and closing worm wheel 920 is sleeved on the transmission shaft 940, so that the driving acting force of the opening and closing driving source 910 is transmitted to the transmission shaft 940 by virtue of the transmission action of the opening and closing worm wheel 920 and the opening and closing worm 930, which may reduce the connection difficulty between the transmission shaft 940 and the opening and closing driving source 910, and expand the adaptation range of the relative position between the opening and closing driving source 910 and the transmission shaft 940. In addition, in this embodiment, the expansion helix angle of the opening and closing worm 930 may be smaller than the friction angle between the opening and closing worm wheel 920 and the opening and closing worm 930, so that the opening and closing worm wheel 920 and the opening and closing worm 930 have mutual self-locking capability, and when the cover plate 310 is in an open state, the relative position between the cover plate 310 and the chamber body 320 may be locked by virtue of the self-locking effect of the opening and closing worm wheel 920 and the opening and closing worm 930, thereby prolonging the service life of the opening and closing driving source 910, preventing the cover plate 310 from accidental action due to the failure of the contracting brake of the opening and closing driving source 910, and improving the overall safety performance of the semiconductor processing equipment.
In the embodiments of the present application, the difference between the embodiments is described in detail, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. A semiconductor process device comprises a process chamber and an upper electrode structure, and is characterized in that the process chamber comprises a chamber body and a cover plate arranged at the top of the chamber body, the upper electrode structure comprises a connecting assembly, an air outlet disc, a driving assembly, a transmission assembly and a guide assembly, the air outlet disc is arranged in the process chamber, the connecting assembly penetrates through the cover plate to be connected with the air outlet disc, the driving assembly is arranged on the cover plate and used for driving the connecting assembly to lift along the vertical direction through the transmission assembly so as to drive the air outlet disc to lift, and the guide assembly is arranged on the cover plate and used for limiting the lifting direction of the connecting assembly to be the vertical direction;
the transmission assembly comprises a lead screw and a movable sliding block arranged on the lead screw, the lead screw is rotatably arranged on the cover plate along the vertical direction, the movable sliding block is connected with the connecting assembly, the driving assembly is used for driving the lead screw to rotate, so that the movable sliding block is moved along the lead screw to drive the connecting assembly to lift.
2. The semiconductor processing equipment according to claim 1, wherein the driving assembly comprises a driving source, a worm and a worm gear, the worm gear is sleeved on the lead screw, the worm is meshed with the worm gear, the driving source is used for driving the worm to rotate, driving the worm gear to rotate and further driving the lead screw to rotate, and the unfolding spiral angle of the worm is smaller than the contact friction angle between the worm gear and the worm.
3. The semiconductor processing equipment according to claim 1, wherein the connection assembly comprises a support frame, a horizontal adjustment mechanism and a connection mechanism, the support frame is connected with the movable slider, the horizontal adjustment mechanism and the connection mechanism are both arranged on the support frame, the horizontal adjustment mechanism is connected with the connection mechanism, the horizontal adjustment mechanism is used for adjusting the relative position of the connection mechanism and the support frame on a horizontal plane, and the gas outlet disc is connected with the connection mechanism.
4. The semiconductor processing apparatus according to claim 3, wherein the horizontal adjustment mechanism includes a plurality of positioning blocks and a plurality of adjustment screws, the plurality of positioning blocks are all fixed to the support frame and are disposed around the connection mechanism, the plurality of adjustment screws are in one-to-one threaded engagement with the plurality of positioning blocks, an axial direction of the adjustment screws is a horizontal direction, and the adjustment screws penetrate through the positioning blocks and are connected with the connection mechanism.
5. The semiconductor processing apparatus according to claim 3, wherein the support frame comprises a top plate and a frame body, the frame body is located above the cover plate, the movable slider and the guide assembly are connected to the frame body, the top plate is supported by the frame body, and the horizontal adjustment mechanism is disposed on the top plate; the connecting mechanism comprises a limiting plate, a transition block and a connecting block, the limiting plate is arranged on the top plate and connected with the top plate, one end of the transition block penetrates through the top plate and connected with the limiting plate, the other end of the transition block is connected with one end of the connecting block, and the other end of the connecting block penetrates through the cover plate and connected with the air outlet disc.
6. The semiconductor processing apparatus of claim 1, further comprising a concentricity monitoring assembly, the concentricity monitoring assembly comprising at least two distance detection members, the at least two distance detection members being disposed on the sidewall of the chamber body at intervals along a circumferential direction of the chamber body, each distance detection member being configured to detect a distance between itself and the gas outlet plate.
7. The semiconductor processing apparatus of claim 6, wherein the concentricity monitoring assembly comprises three distance detectors evenly spaced around the circumference of the chamber body.
8. The semiconductor processing apparatus according to claim 1, wherein the guide assembly includes a mounting plate, a guide slider, and a guide rail, the mounting plate is fixed to the cover plate, one of the guide slider and the guide rail is fixed to a side of the mounting plate facing the connection assembly, the other is fixed to a side of the connection assembly facing the mounting plate, and the guide slider and the guide rail are slidably fitted in a vertical direction.
9. The semiconductor processing apparatus of claim 8, wherein the transmission assembly further comprises a screw base, wherein an end of the screw facing away from the cover plate is rotatably connected with the screw base, and the screw base is fixed on a side of the mounting plate facing the connection assembly.
10. The semiconductor processing apparatus of claim 9, further comprising a lid opening and closing mechanism, the cover plate opening and closing mechanism comprises an opening and closing driving source, an opening and closing worm wheel, a transmission shaft, a first hinge rod and a second hinge rod, the opening and closing driving source is arranged on the chamber body, is used for driving the opening and closing worm to rotate, the opening and closing worm wheel is sleeved on the transmission shaft and is meshed with the opening and closing worm, the unfolding helical angle of the opening and closing worm is smaller than the friction angle of the contact between the opening and closing worm wheel and the opening and closing worm, one end of the first hinge rod is fixedly connected with the transmission shaft, and the other end with the apron rotates to be connected, the second articulated rod with first articulated rod interval and parallel arrangement, the back of the body both ends of second articulated rod articulate respectively in the cavity body with the apron.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000021917A (en) * | 1998-09-30 | 2000-04-25 | 윤종용 | Process chamber of dry etching equipment |
| KR20060072918A (en) * | 2004-12-24 | 2006-06-28 | 주식회사 에이디피엔지니어링 | Maintenance opening and shutting apparatus for fpd manufacturer |
| KR100768559B1 (en) * | 2006-07-31 | 2007-10-19 | 세메스 주식회사 | Apparatus for opening and closing chamber door |
| DE102017126448A1 (en) * | 2017-11-10 | 2019-05-16 | Aixtron Se | Apparatus and method for readjusting a gas inlet member in a reactor housing |
| CN111863655A (en) * | 2019-04-26 | 2020-10-30 | 北京北方华创微电子装备有限公司 | Uncapping mechanism and semiconductor processing equipment |
| CN112928012A (en) * | 2021-02-09 | 2021-06-08 | 北京北方华创微电子装备有限公司 | Semiconductor device with a plurality of semiconductor chips |
-
2021
- 2021-08-31 CN CN202111014444.7A patent/CN113725057A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000021917A (en) * | 1998-09-30 | 2000-04-25 | 윤종용 | Process chamber of dry etching equipment |
| KR20060072918A (en) * | 2004-12-24 | 2006-06-28 | 주식회사 에이디피엔지니어링 | Maintenance opening and shutting apparatus for fpd manufacturer |
| KR100768559B1 (en) * | 2006-07-31 | 2007-10-19 | 세메스 주식회사 | Apparatus for opening and closing chamber door |
| DE102017126448A1 (en) * | 2017-11-10 | 2019-05-16 | Aixtron Se | Apparatus and method for readjusting a gas inlet member in a reactor housing |
| CN111863655A (en) * | 2019-04-26 | 2020-10-30 | 北京北方华创微电子装备有限公司 | Uncapping mechanism and semiconductor processing equipment |
| CN112928012A (en) * | 2021-02-09 | 2021-06-08 | 北京北方华创微电子装备有限公司 | Semiconductor device with a plurality of semiconductor chips |
Non-Patent Citations (2)
| Title |
|---|
| 安子军等: "机械原理", vol. 4, 国防工业出版社, pages: 161 * |
| 曹晨 等: "机载远程红外预警雷达系统", vol. 1, 31 December 2017, 国防工业出版社, pages: 188 * |
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