CN113724594A - Display device and wearable display apparatus - Google Patents
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- CN113724594A CN113724594A CN202110997297.3A CN202110997297A CN113724594A CN 113724594 A CN113724594 A CN 113724594A CN 202110997297 A CN202110997297 A CN 202110997297A CN 113724594 A CN113724594 A CN 113724594A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
Abstract
The application discloses display device and wearable display equipment relates to and shows technical field, can promote wearable display equipment's radiating effect. The display device comprises a display module, a mainboard, a central processing unit, a heat insulation layer, a middle frame and an insulation heat conductor. The mainboard is arranged on the backlight side of the display module and is electrically connected with the display module. The central processing unit is arranged on one side of the mainboard close to the display module and is electrically connected with the mainboard. The insulating layer sets up in the mainboard and keeps away from one side of display module assembly. The center frame is arranged around the display module, the mainboard, the heat insulation layer and the central processing unit. The insulating heat conductor includes a first heat conduction portion and a second heat conduction portion. Along the first direction, first heat-conducting portion and second heat-conducting portion are located the both sides of central processing unit respectively. One end of the first heat conducting part is connected with the central processing unit, and the other end of the first heat conducting part is connected with the middle frame. One end of the second heat conduction part is connected with the central processing unit, and the other end of the second heat conduction part is connected with the middle frame. The application is used for manufacturing the display device.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display device and a wearable display apparatus.
Background
With the progress of flexible display technology, wearable display devices have been developed. The wearable display device may be a portable display device, such as a wrist-band handset, that can be attached directly to the user's skin, or integrated into the user's clothing or accessories. Wearable display device integrates the degree height, and is small, and the heat that the during operation produced takes place the gathering easily, leads to the temperature higher. Therefore, the heat dissipation design of the wearable display device is particularly important.
Disclosure of Invention
The embodiment of the disclosure provides a display device and a wearable display device, which can improve the heat dissipation effect of the wearable display device.
In order to achieve the purpose, the embodiment of the disclosure adopts the following technical scheme:
in one aspect, embodiments of the present disclosure provide a display device. The display device comprises a display module, a mainboard, a central processing unit, a heat insulation layer, a middle frame and an insulation heat conductor. The mainboard is arranged on the backlight side of the display module and is electrically connected with the display module. The central processing unit is arranged on one side of the mainboard close to the display module and is electrically connected with the mainboard. The insulating layer sets up in the mainboard and keeps away from one side of display module assembly. The center frame is arranged around the display module, the mainboard, the heat insulation layer and the central processing unit. The insulating heat conductor includes a first heat conduction portion and a second heat conduction portion. Along the first direction, first heat-conducting portion and second heat-conducting portion are located the both sides of central processing unit respectively. One end of the first heat conducting part is connected with the central processing unit, and the other end of the first heat conducting part is connected with the middle frame. One end of the second heat conduction part is connected with the central processing unit, and the other end of the second heat conduction part is connected with the middle frame.
In some embodiments, at least one of the first and second thermally conductive portions extends in a first direction.
In some embodiments, the first heat-conducting portion and the second heat-conducting portion have a dimension less than or equal to a dimension of the cpu along the second direction. Wherein the second direction is perpendicular to the first direction.
In some embodiments, the middle frame is rectangular, the first direction is a width direction of the middle frame, and the second direction is a length direction of the middle frame.
In some embodiments, the insulating thermal conductor further comprises a connecting portion. The connecting part is arranged on one side of the central processing unit, which is far away from the mainboard, and is directly connected with the central processing unit. One end of the connecting part is connected with the first heat conducting part, and the other end of the connecting part is connected with the second heat conducting part.
In some embodiments, the insulated thermal conductor further comprises a first contact portion and a second contact portion. The first contact part is arranged between the first heat conduction part and the middle frame, one side of the first contact part is connected with one end of the first heat conduction part, which is far away from the central processing unit, and the other side of the first contact part is connected with the middle frame; and along the second direction, the size of the first contact part is larger than that of the first heat conduction part. The second contact part is arranged between the second heat conduction part and the middle frame, one side of the second contact part is connected with one end of the second heat conduction part, which is far away from the central processing unit, and the other side of the second contact part is connected with the middle frame; the size of the second contact portion is larger than that of the second heat conduction portion along the second direction.
In some embodiments, a portion of the first contact portion connected to the first heat conduction portion passes through a center of the first contact portion; the second contact portion is connected with the second heat conduction portion through the center of the second contact portion.
In some embodiments, the first contact portion extends along a side of the middle frame to which it is connected; the second contact portion extends along a side of the middle frame to which it is connected.
In some embodiments, the length of the first contact part is less than or equal to the length of the side of the main board where the first contact part is located; the length of the second contact part is less than or equal to that of the side edge of the main board where the second contact part is located.
In some embodiments, the insulating thermal conductor further comprises two third thermal conductive portions and two fourth thermal conductive portions. Along the second direction, the two third heat conduction parts are respectively positioned at two sides of the central processor. Along the second direction, the two fourth heat conduction parts are respectively positioned at two sides of an area occupied by the two third heat conduction parts and the central processor. One end of each third heat conduction part is connected with the central processing unit, and the other end of each third heat conduction part is connected with the part between the two ends of one fourth heat conduction part. The first contact portion, the second contact portion and the two fourth heat conduction portions are connected to form a frame shape.
In some embodiments, a dimension of the third heat-conducting portion in the first direction is less than or equal to a dimension of the cpu in the first direction.
In some embodiments, the material of the insulating thermal conductor comprises thermally conductive silicone grease.
In some embodiments, the display device further comprises a heat dissipating graphite sheet. The heat dissipation graphite sheet is arranged on one side, away from the mainboard, of the central processing unit and the insulating heat conductor, and the two sides of the heat dissipation graphite sheet along the first direction are connected with the middle frame and are configured to dissipate heat of the mainboard.
The display device that this disclosed embodiment provided, along display device's thickness direction, mainboard and central processing unit's both sides are equipped with insulating layer and display module respectively, all do not benefit to display device's heat dissipation design. The central processor is connected with the middle frame through the insulating heat conductor, and heat generated by the central processor can be transferred to the middle frame through the insulating heat conductor and is radiated by the middle frame, so that the radiating effect of the display device is improved; meanwhile, the electrical insulation property of the insulating heat conductor can prevent parts in contact with the insulating heat conductor from being short-circuited, and the safety of the display device is improved.
On the other hand, the embodiment of the present disclosure also provides a wearable display device. The wearable display device comprises the display device and the wearing auxiliary piece in any embodiment. The wearing aid is configured to wear the display device on a part of a human body to be worn.
The wearable display device provided by the embodiment of the disclosure can realize the same beneficial effects as the display device due to the adoption of the display device in the embodiment, and the description is omitted here.
Drawings
In order to more clearly illustrate the technical solutions in the present disclosure, the drawings needed to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to the drawings. Furthermore, the drawings in the following description may be regarded as schematic and are not intended to limit the actual size of products to which embodiments of the disclosure relate.
Fig. 1A is a schematic view of a wearable display device in a rolled state according to some embodiments of the present disclosure;
fig. 1B is a schematic view of a wearable display device in a flattened state according to some embodiments of the present disclosure;
FIG. 2 is a cross-sectional view taken along section line A-A of FIG. 1A;
FIG. 3 is a block diagram of an insulated heat conductor according to some embodiments of the present disclosure;
FIG. 4 is another block diagram of an insulated thermal conductor according to some embodiments of the present disclosure;
FIG. 5 is yet another block diagram of an insulated thermal conductor according to some embodiments of the present disclosure;
FIG. 6 is yet another block diagram of an insulated thermal conductor according to some embodiments of the present disclosure;
FIG. 7 is yet another block diagram of an insulated thermal conductor according to some embodiments of the present disclosure;
FIG. 8 is yet another block diagram of an insulated thermal conductor according to some embodiments of the present disclosure;
fig. 9 is a line graph of temperature change of a display device under different insulated thermal conductors of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
Throughout the specification and claims, the term "comprising" is to be interpreted in an open, inclusive sense, i.e., as "including, but not limited to," unless the context requires otherwise. In the description herein, the terms "one embodiment," "some embodiments," "exemplary" or "such as" are intended to indicate that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.
In the description of the present disclosure, it is to be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present disclosure and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present disclosure.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present disclosure, "a plurality" means two or more unless otherwise specified.
In the description of the present disclosure, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present disclosure can be understood in specific instances by those of ordinary skill in the art.
The use of "configured to" herein means open and inclusive language that does not exclude devices that are suitable or configured to perform additional tasks or steps.
Some embodiments of the present disclosure provide a wearable display apparatus 100, referring to fig. 1A and 1B, the wearable display apparatus may include a display device 110 and a wearing aid 120, the display device 110 being configured to display image information, and the wearing aid being configured to wear the display device 110 on a part to be worn of a human body. For example, the wearable display device 100 may be a smart watch or a wrist-band phone, etc. It is to be understood that fig. 1A illustrates the wearable display device 100 as a wrist-band mobile phone.
The wearable display device 100 generates a large amount of heat when operating. For example, the wrist band mobile phone comprises a mobile phone level SoC (system on chip), the heating value of the system on chip is higher when the wrist band mobile phone works, the local temperature is higher, and the wearable device needs to be subjected to heat dissipation design for reducing the influence of high temperature on the mainboard and the display module of the wrist band mobile phone.
In some embodiments, along the thickness direction of the wearable display apparatus 100, one side of the wearable display apparatus 100 directly or indirectly contacts with a human body, the human body is sensitive to temperature, and the high temperature may affect the comfort level of the wearing part, so that the side of the wearable display apparatus 100 close to the human body is not suitable for setting a heat dissipation structure. Wearable display device keeps away from one side of human body and is provided with display module assembly, and high temperature environment is unfavorable for display module assembly long-term stable work equally, can wear display device 100 and keep away from one side of human body also not be suitable for setting up heat radiation structure. For the above reasons, heat dissipation can be performed only through the circumferential direction of the wearable display apparatus 100.
In some embodiments, taking the wearable display apparatus 100 as a wrist band mobile phone as an example, referring to fig. 2, the display device 110 includes a display module 10, a main board 20, a central processing unit 30, a heat insulation layer 40, a middle frame 50 and an insulating heat conductor 60.
The display module 10 may be a rigid display module or a flexible display module. For example, in the case that the wearable display apparatus is a wrist band mobile phone, the display module 10 may be a flexible display module, so that the display device 110 may be bent to meet the requirements of different bending degrees in the wearing process of the display device 110.
For example, the display module 10 may include one or more of a display panel, a touch structure, an encapsulant, a polarizer, and a glass cover plate. When the display device 110 is operated, the display module 10 displays a screen. Wherein, the side of the display module 10 that displays the image is the light-emitting side, and the side that deviates from the light-emitting side of the display module 10 is the backlight side.
The main board 20 is disposed on the backlight side of the display module 10, electrically connected to the display module 10, and configured to receive, convert, and process various electrical signals to control the display module 10 to display images. The motherboard 20 may also be referred to as a motherboard, a system board, a logic board, a motherboard, a backplane, etc. For example, a power interface, a data interface, a sensor, a multi-function chip, a Central Processing Unit (CPU) 30, and the like may be disposed on the motherboard 20.
The cpu 30 is disposed on the motherboard 20 and electrically connected to the motherboard 20. When the display device 110 is in operation, the cpu 30 generates a large amount of heat.
The heat insulation layer 40 is configured to reduce heat dissipation of the main board 20 to a side away from the display module 10, thereby reducing the temperature of the backlight side of the display device 110; display device 110 is kept away from one side of display module assembly 10 along thickness direction and is not carried out the heat dissipation design promptly to reduce wearable display device operating temperature and dress the influence at position to the user, promote user's wearing and experience. It should be understood that the display device 110 can also be applied to other display devices that are not favorable for disposing a heat dissipation structure along the thickness direction.
The middle frame 50 surrounds the display module 10, the main board 20, the central processing unit 30 and the heat insulation layer 40. For covering the edge of the display module 10 along the circumferential direction and protecting the above structures. When the display device 110 is used in a display apparatus such as a wrist-band mobile phone, which can be rolled or folded, the display module 10 is a flexible display module, and the middle frame 50 can also be bent or rolled along with the bending or rolling of the display module 10.
The middle frame 50 is usually made of a metal material or an alloy material with good thermal conductivity, so that the middle frame 50 can absorb heat on the insulating heat conductor 60 and quickly dissipate the heat transferred to the middle frame 50 to an external space (air), thereby improving the heat dissipation effect of the display device 110. Illustratively, the material of the middle frame 50 may include one or more of stainless steel, aluminum alloy, aluminum steel composite, and titanium alloy material.
In some embodiments, as shown in fig. 3, the display device 110 is rectangular, such that the middle frame 50 is also rectangular, with the width direction of the middle frame 50 being the first direction M1 (the horizontal direction in fig. 3) and the length direction of the middle frame 50 being the second direction M2 (the vertical direction in fig. 3).
The insulating heat conductor 60 includes a first heat conduction portion 61 and a second heat conduction portion 62. The first heat conduction portion 61 and the second heat conduction portion 62 are located on both sides of the cpu 30 in the first direction M1, respectively.
One end of the first heat conduction portion 61 is connected to the cpu 30, and the other end is connected to the center frame 50. One end of the second heat conduction portion 62 is connected to the cpu 30, and the other end is connected to the center frame 50. In this embodiment, by providing two heat conduction portions (the first heat conduction portion 61 and the second heat conduction portion 62), the number of heat dissipation paths of the display device 110 can be increased, the heat dissipation capability of the display device 110 can be enhanced, the heat dissipation efficiency of the display device 110 can be improved, and the temperatures of the central processing unit 30 and the motherboard 20 when the display device 110 operates can be reduced.
The first heat conducting portion 61 and the second heat conducting portion 62 are disposed on two sides of the central processing unit 30 along the width direction M1 of the middle frame 50, which is beneficial to shortening the length of the heat conducting path of the first heat conducting portion 61 and the second heat conducting portion 62, so as to improve the heat transfer efficiency of the insulating heat conductor 60 and the heat dissipation efficiency of the display device 110.
In the wearable display apparatus 100 provided by the embodiment of the present disclosure, the central processing unit 30 is connected to the middle frame 50 through the insulating heat conductor 60, and the heat generated by the central processing unit 30 can be transmitted to the middle frame 50 through the insulating heat conductor 60, and is dissipated by the middle frame 50, which is beneficial to enhancing the heat dissipation effect of the display device 110. Meanwhile, the electrical insulation property of the insulating heat conductor 60 can prevent short circuit of parts in contact with the insulating heat conductor 60, thereby improving the safety of the display device 110.
The thicknesses of the various structures in fig. 2 are schematic and do not represent the actual thicknesses of the respective structures.
In some embodiments, the thickness (dimension in the vertical direction in fig. 2) of the thermal insulation layer 60 may be 2.0mm to 3.0 mm. Illustratively, the thickness of the thermal barrier layer 60 may be 2.0mm, 2.5mm, or 3 mm.
The thickness of the main plate 20 may be 2.5mm to 3.5 mm. Illustratively, the thickness of the main panel 20 may be 2.5mm, 3.0mm, or 3.5 mm.
The thickness of the insulating heat conductor 60 may be 0.3mm to 0.8 mm. Illustratively, the thickness of the insulating thermal conductor 60 may be 0.3mm, 0.5mm, or 0.8 mm.
The thickness of the display module can be 0.30 mm-0.40 mm. Illustratively, the thickness of the display module may be 0.30mm, 0.34mm or 0.40 mm.
It should be understood that, referring to fig. 4, the insulating thermal conductor 60 may also include only one thermal conductive portion, such that the insulating thermal conductor 60 may be disposed on a side (left side in fig. 4) of the cpu 30 closest to the middle frame 50, one end of the insulating thermal conductor 60 is connected to a side of the cpu 30 close to the middle frame 50, and the other end of the insulating thermal conductor 60 is connected to a portion of the middle frame 50 closest to the side, so as to shorten a length (a thermal path) of the insulating thermal conductor 60, improve a thermal transfer efficiency between the cpu 30 and the middle frame 50, save material consumption of the insulating thermal conductor 60, reduce a manufacturing cost of the insulating thermal conductor 60, and reduce a weight of the display device 110.
In some embodiments, at least one of the first heat conduction portion 61 and the second heat conduction portion 62 extends along the first square shape M1, which is beneficial to shorten the heat transfer path of the first heat conduction portion 61 and the second heat conduction portion 62 and improve the heat dissipation efficiency of the display device 110.
For example, the first heat conduction part 61 (or the second heat conduction part 62) may extend along the first direction M1, and the second heat conduction part 62 (or the first heat conduction part 61) may extend along the other direction (having an angle with the first direction M1); or both the first heat conduction portion 61 and the second heat conduction portion 62 extend along the first square M1 (as shown in fig. 3).
In some embodiments, the dimensions of the first and second heat conduction portions 61 and 62 along the second direction M2 are less than or equal to the dimensions of the central processor 30. Illustratively, as shown in fig. 3, the size of the first heat conduction portion 61 and the second heat conduction portion 62 in the second direction M2 is equal to the size of the cpu 30 in the second direction M2. And along the second direction M2, the two ends of the first heat conducting portion 61 and the second heat conducting portion 62 are flush or substantially flush with the two ends of the cpu 30, respectively, which is beneficial to improving the heat dissipation efficiency of the display device 110.
In some embodiments, referring to fig. 5, the insulating thermal conductor 60 further includes a connecting portion 63. The connecting portion 63 is disposed on a side of the cpu 30 away from the motherboard 20, and directly contacts the cpu 30, that is, the connecting portion 63 is directly attached to a surface of the cpu 30 away from the motherboard 20. One end of the connection portion 63 is connected to the first heat conduction portion 61 and the other end is connected to the second heat conduction portion 62 along the first direction M1. The connecting portion 63 can increase the contact area between the insulating heat conductor 60 and the cpu 30, improve the heat transfer efficiency between the cpu 30 and the insulating heat conductor 60, particularly improve the heat transfer efficiency between the insulating heat conductor 60 and the central region of the cpu 30 along the first direction M1, facilitate the cpu 30 to transfer heat to the insulating heat conductor 60 quickly, and improve the heat dissipation efficiency of the cpu 30.
In some embodiments, referring to fig. 6, the insulating thermal conductor 60 further includes a first contact portion 64 and a second contact portion 65. The first contact portion 64 is disposed between the first heat conducting portion 61 and the middle frame 50, one side of the first contact portion 64 is connected to one end of the first heat conducting portion 61 away from the central processing unit 30, and the other side is connected to the middle frame 50; and the size of the first contact portion 64 is larger than the size of the first heat conduction portion 61 in the second direction M2. Like this, be connected first heat-conducting portion 61 and center 50 indirectly through first contact site 64, can increase the area of contact between first heat-conducting portion 61 and the center 50, promote the heat transfer efficiency between insulating heat-conducting body 60 and the center 50, be favorable to with the heat on the insulating heat-conducting body 60 fast transfer to center 50 on, promote the radiating efficiency of insulating heat-conducting body 60.
The second contact portion 65 is disposed between the second heat conduction portion 62 and the middle frame 50, and has one side connected to one end of the second heat conduction portion 62 away from the cpu 30 and the other side connected to the middle frame 50; the size of the second contact portion 65 is larger than the size of the second heat conduction portion 62 in the second direction M2. The second contact portion 65 has the same effect as the first contact portion 64, and will not be described in detail.
The first contact portion 64 is connected to the first heat conduction portion 61 at a position passing through the center of the first contact portion 64, that is, the first contact portion 64 is disposed symmetrically with respect to a center line L1 of the first heat conduction portion 61 extending in the first direction M1. In this way, the heat distribution of the portions of the first contact portion 64 located on both sides of the center line L1 can be made uniform, the risk of heat accumulation at the first contact portion 64 can be reduced, and the occurrence of a region with a higher temperature (compared with other regions) can be avoided.
The portion where the second contact portion 65 is connected to the second heat conduction portion 62 passes through the center of the second contact portion 65, that is, the second contact portion 65 is symmetrically disposed with respect to a center line L2 of the second heat conduction portion 62 extending in the first direction M1. The heat distribution of the portions of the second contact portion 65 located on both sides of the center line L2 can be made uniform, reducing the risk of heat accumulation at the second contact portion 65. Exemplarily, a center line L2 of the second heat conduction portion 62 extending along the first direction M1 substantially coincides with a center line L1 of the first heat conduction portion 61 extending along the first direction M1.
In order to further improve the heat transfer efficiency between the first and second contact portions 64 and 65 and the middle frame 50. Referring to fig. 6, the first contact portion 64 extends along the side of the middle frame 50 to which it is connected; the second contact portion 65 extends along the side of the middle frame 50 connected with the second contact portion 65, so that the first contact portion 64 and the second contact portion 65 can be attached to the middle frame 50, the contact area between the first contact portion 64 and the middle frame 50 and the contact area between the second contact portion 65 and the middle frame 50 are increased, and the heat transfer efficiency between the first contact portion 64 and the middle frame 50 and the heat transfer efficiency between the second contact portion 65 and the middle frame 50 are improved. Illustratively, the first contact portion 64 and the second contact portion 65 are formed in a contour structure on a side close to the middle frame 50, so that the first contact portion 64 and the second contact portion 65 can completely fit the middle frame 50.
The length of the first contact part 64 is less than or equal to the length of the side of the main board 20 where the first contact part is located; the length of the second contact portion 65 is less than or equal to the length of the side of the main board 20 on which it is located. The heat dissipation requirements of other parts of the display device 110 except the main board 20 are smaller, and the lengths of the first contact portion 64 and the second contact portion 65 are smaller than or equal to the lengths of the sides of the main board 20 where the first contact portion and the second contact portion are respectively located, so that the consumption of the insulating heat conductor can be reduced on the premise of not reducing the heat dissipation effect of the display device, and the weight of the display device is reduced.
Illustratively, the length of the first contact portion 64 is equal to the length of the side of the main board 20 on which it is located; the length of the second contact portion 65 is equal to the length of the side of the main board 20 where the second contact portion is located; thus, the heat of the main board 20 is advantageously transferred to the middle frame 50.
In some embodiments, referring to fig. 7, the insulating thermal conductor 60 further includes two third thermal conductive portions 66 and two fourth thermal conductive portions 67. In the second direction M2, the two third heat conduction portions 66 are located on both sides of the cpu 30. The two fourth heat conduction portions 67 are located on both sides of the area occupied by the two third heat conduction portions 66 and the cpu 30, respectively, in the second direction M2.
Each of the third heat-transfer portions 66 has one end connected to the cpu 30 and the other end connected to a portion between both ends of one of the fourth heat-transfer portions 67. The first contact portion 64, the second contact portion 65, and the two fourth heat conduction portions 67 are connected to form a frame shape. Therefore, not only can the heat transfer path between the central processing unit 30 and the middle frame 50 be increased, and the heat dissipation efficiency of the central processing unit 30 be improved, but also the heat dissipation capability of other areas of the motherboard 20 can be improved.
The dimension of the third heat conduction portion 66 in the first direction M1 is smaller than or equal to the dimension of the cpu 30 in the first direction M1. Illustratively, the third thermal conduction portion 66 has a size equal to the size of the cpu 30 along the first direction M1. Thus, the heat transfer efficiency between the cpu 30 and the third heat conduction portion 66 can be ensured; meanwhile, the consumable materials of the third heat conduction part 66 can be reduced, the weight of the display device is reduced, and the wearing experience of a user is improved.
In some embodiments, the insulating thermal conductor 60 includes a first thermal conductive portion 61, a second thermal conductive portion 62, a connecting portion 63, a first contact portion 64, a second contact portion 65, a third thermal conductive portion 66, and a fourth thermal conductive portion 67 as an integral structure.
In the above embodiment, the insulating heat conductor 60 is patterned, so that the material consumption of the insulating heat conductor 60 can be reduced, and the cost can be saved. Meanwhile, the weight of the display device 110 can be reduced, so that the weight of the wearable device 100 is reduced, and the wearing experience of a user is improved.
It should be understood that, in other embodiments, referring to fig. 8, the insulating thermal conductor 60 may also be a whole-layer structure, that is, the insulating thermal conductor 60 covers the main board 20, and both sides of the insulating thermal conductor 60 along the first direction M1 are respectively connected to the middle frame 50.
For example, the following data shown in table 1 are obtained by performing an experiment on the heat dissipation effect of the wearable device 100, taking a wrist-band phone as an example:
table 1:
in the above table, case1 is the temperature detected at different stages of the display device 110 when the patterned insulating thermal conductor 60 shown in fig. 6 is used; case2 is the temperature detected at different stages of the display device 110 when the entire layer of insulating heat conductor 60 shown in fig. 8 is used; case3 is the temperature detected at different stages of the display device 110 when the insulating heat conductor 60 is not provided. Wherein, the forward direction refers to the side of the motherboard 20 away from the central processing unit 30; the back-facing direction refers to the side of the motherboard 20 close to the cpu 30.
Comparing case1 and case2 with case3 can know, this disclosed embodiment can reduce the operating temperature of each stage of display device 110 through setting up insulating heat conductor 60, promotes display device 110's radiating efficiency, reduces the operating temperature of wrist strap cell-phone, promotes user's use and experiences.
Comparing the case1 and the case2, and referring to fig. 9, it can be seen that the operating temperature of each stage of the display device 110 when the patterned insulating heat conductor 60 shown in fig. 6 is used is less different from the operating temperature of each stage of the display device 110 when the whole layer of insulating heat conductor 60 is used; that is, the patterned insulating thermal conductor 60 can reduce the material consumption of the insulating thermal conductor 60 and reduce the weight of the display device 110 without reducing the heat dissipation efficiency of the display device 110.
It should be understood that fig. 9 is a graph showing the temperature change of the display device (the wristband phone) within 30 minutes when the display device (the wristband phone) is turned on, respectively using the case1 (using the patterned insulating heat conductor 60 as shown in fig. 6) and the case2 (using the entire layer of the insulating heat conductor 60 as shown in fig. 8). As can be seen from fig. 9, the temperature of the wearable display device 100 on both sides in the thickness direction can be controlled to be 37 degrees or less by providing the insulating heat conductor 60, and the influence of the operating temperature of the wearable display device 100 on the wearing part of the user can be effectively avoided.
In some embodiments, the material of the insulating thermal conductor 60 may include a thermal grease, which has good thermal conductivity and is an electrically insulating material that can meet the design requirements. Meanwhile, the heat-conducting silicone grease can be better attached to the mainboard 20, the central processing unit 30, the middle frame 50 and other components, and is beneficial to improving the heat transfer efficiency of the joints of the insulating heat conductor 60 and the mainboard 20, the central processing unit 30 and the middle frame 50. It should be understood that the insulating thermal conductor 60 may also be made of other materials that have good thermal conductivity and are electrically insulating.
In some embodiments, referring to fig. 2, display device 110 further comprises a heat dissipating graphite sheet 70. The heat dissipation graphite sheet 70 is disposed between the cpu 30 and the insulating heat conductor 60 and the display module 10. The heat dissipating graphite sheet 70 is configured to dissipate heat from the motherboard 20. During the operation of the display device 110, the main board 20 also generates heat, and a portion of the heat on the main board 20 is transmitted to the middle frame 10 through the insulating heat conductor 60, and a portion of the heat is dissipated to the heat dissipation graphite sheet 70 to a side close to the display module 60, and is transmitted to the middle frame 10 through the heat dissipation graphite sheet 70, so as to reduce the heat transmitted to the display module 10 and lower the operating temperature of the display module 10. Illustratively, the projection of the heat dissipating graphite sheet 70 onto the motherboard 20 is substantially coincident with the motherboard 20 (as shown in fig. 7).
In some embodiments, the heat dissipating graphite sheet 70 may have a thickness of 0.03mm to 0.08 mm. Illustratively, the heat dissipating graphite sheet 70 may have a thickness of 0.03mm, 0.05mm, or 0.08 mm.
In some embodiments, referring to fig. 2, the display device 110 may further include a support plate 80 disposed between the display module 10 and the heat dissipation graphite sheet 70. The supporting plate 80 is configured to support and protect the display module 10 and to enable the display module 10 (flexible display module) to be maintained in a certain shape.
In some embodiments, the support plate 80 may have a thickness of 0.10mm to 0.20 mm. Illustratively, the thickness of the support plate 80 may be 0.10mm, 0.15mm, or 0.20 mm.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above is only a specific embodiment of the present disclosure, but the scope of the present disclosure is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present disclosure should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (14)
1. A display device, comprising:
a display module;
the main board is arranged on the backlight side of the display module and is electrically connected with the display module;
the central processing unit is arranged on one side of the mainboard close to the display module and is electrically connected with the mainboard;
the heat insulation layer is arranged on one side of the mainboard, which is far away from the display module;
the middle frame is arranged around the display module, the mainboard, the heat insulation layer and the central processing unit;
the insulating heat conductor is arranged on one side of the mainboard close to the display module and comprises a first heat conduction part and a second heat conduction part; along a first direction, the first heat conduction part and the second heat conduction part are respectively positioned at two sides of the central processor; one end of the first heat conducting part is connected with the central processing unit, and the other end of the first heat conducting part is connected with the middle frame; one end of the second heat conducting part is connected with the central processing unit, and the other end of the second heat conducting part is connected with the middle frame.
2. The display device according to claim 1, wherein at least one of the first heat conductive portion and the second heat conductive portion extends in the first direction.
3. The display device according to claim 1, wherein a size of the first heat-conducting portion and the second heat-conducting portion in a second direction is smaller than or equal to a size of the cpu; wherein the second direction is perpendicular to the first direction.
4. The display device according to claim 3, wherein the middle frame is rectangular, the first direction is a width direction of the middle frame, and the second direction is a length direction of the middle frame.
5. The display device according to any one of claims 1 to 4, wherein the insulating heat conductor further comprises a connecting portion disposed on a side of the CPU away from the main board and directly connected to the CPU; one end of the connecting part is connected with the first heat conducting part, and the other end of the connecting part is connected with the second heat conducting part.
6. The display device according to any one of claims 1 to 4, wherein the insulating heat conductor further comprises:
the first contact part is arranged between the first heat conducting part and the middle frame, one side of the first contact part is connected with one end of the first heat conducting part, which is far away from the central processing unit, and the other side of the first contact part is connected with the middle frame; the size of the first contact part is larger than that of the first heat conduction part along a second direction;
the second contact part is arranged between the second heat conduction part and the middle frame, one side of the second contact part is connected with one end of the second heat conduction part, which is far away from the central processing unit, and the other side of the second contact part is connected with the middle frame; the size of the second contact portion is larger than that of the second heat conduction portion in the second direction.
7. The display device according to claim 6, wherein a portion where the first contact portion is connected to the first heat conduction portion passes through a center of the first contact portion;
the second contact portion is connected to the second heat conduction portion at a portion passing through the center of the second contact portion.
8. The display device according to claim 6, wherein the first contact portion extends along a side of the middle frame to which it is connected; the second contact portion extends along a side of the middle frame to which it is connected.
9. The display device according to claim 6, wherein the length of the first contact portion is less than or equal to the length of the side of the main board on which the first contact portion is located; the length of the second contact part is less than or equal to that of the side edge of the main board where the second contact part is located.
10. The display device according to claim 6, wherein the insulating heat conductor further comprises:
two third heat conducting parts respectively positioned at two sides of the central processor along the second direction; one end of each third heat conduction part is connected with the central processing unit;
two fourth heat conduction parts respectively located on two sides of an area occupied by the two third heat conduction parts and the central processing unit along the second direction; the other end of each third heat conduction part is connected with a part between two ends of one fourth heat conduction part, and the first contact part, the second contact part and the two fourth heat conduction parts are connected to form a frame shape.
11. The display device according to claim 10, wherein a dimension of the third heat conduction portion in the first direction is smaller than or equal to a dimension of the cpu in the first direction.
12. The display device according to claim 1, wherein a material of the insulating heat conductor includes a thermally conductive silicone grease.
13. The display device according to claim 1, further comprising:
and the heat dissipation graphite sheet is arranged between the central processing unit and the display module, connected with the middle frame along two sides of the first direction and configured to dissipate heat of the mainboard.
14. A wearable display device, comprising:
a display device according to any one of claims 1 to 13;
a wearing aid configured to wear the display device on a part of a human body to be worn.
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