CN113717676A - Flame-retardant hot melt adhesive, flame-retardant hot melt adhesive film and flexible wire rod - Google Patents
Flame-retardant hot melt adhesive, flame-retardant hot melt adhesive film and flexible wire rod Download PDFInfo
- Publication number
- CN113717676A CN113717676A CN202110980149.0A CN202110980149A CN113717676A CN 113717676 A CN113717676 A CN 113717676A CN 202110980149 A CN202110980149 A CN 202110980149A CN 113717676 A CN113717676 A CN 113717676A
- Authority
- CN
- China
- Prior art keywords
- flame
- melt adhesive
- retardant
- hot melt
- thermoplastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 97
- 239000003063 flame retardant Substances 0.000 title claims abstract description 97
- 239000004831 Hot glue Substances 0.000 title claims abstract description 62
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 46
- 239000000945 filler Substances 0.000 claims abstract description 12
- 230000009477 glass transition Effects 0.000 claims abstract description 12
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000002156 mixing Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 15
- 229910052698 phosphorus Inorganic materials 0.000 claims description 13
- 239000011574 phosphorus Substances 0.000 claims description 13
- 229920001169 thermoplastic Polymers 0.000 claims description 13
- 239000004416 thermosoftening plastic Substances 0.000 claims description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 239000007789 gas Substances 0.000 claims description 9
- 229920001225 polyester resin Polymers 0.000 claims description 9
- 239000004645 polyester resin Substances 0.000 claims description 9
- 229920006395 saturated elastomer Polymers 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 229910000000 metal hydroxide Inorganic materials 0.000 claims description 7
- 150000004692 metal hydroxides Chemical class 0.000 claims description 7
- 229910044991 metal oxide Inorganic materials 0.000 claims description 7
- 150000004706 metal oxides Chemical class 0.000 claims description 7
- 229920006267 polyester film Polymers 0.000 claims description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000002002 slurry Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- PAAZPARNPHGIKF-UHFFFAOYSA-N 1,2-dibromoethane Chemical compound BrCCBr PAAZPARNPHGIKF-UHFFFAOYSA-N 0.000 claims description 3
- BSWXAWQTMPECAK-UHFFFAOYSA-N 6,6-diethyloctyl dihydrogen phosphate Chemical class CCC(CC)(CC)CCCCCOP(O)(O)=O BSWXAWQTMPECAK-UHFFFAOYSA-N 0.000 claims description 3
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 3
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical class [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 239000001913 cellulose Chemical class 0.000 claims description 3
- 229920002678 cellulose Chemical class 0.000 claims description 3
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 3
- 125000004494 ethyl ester group Chemical group 0.000 claims description 3
- 239000000194 fatty acid Substances 0.000 claims description 3
- 229930195729 fatty acid Natural products 0.000 claims description 3
- 150000004665 fatty acids Chemical class 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000002209 hydrophobic effect Effects 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 229920002401 polyacrylamide Polymers 0.000 claims description 3
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 239000008096 xylene Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 229920001522 polyglycol ester Polymers 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 6
- 239000000377 silicon dioxide Substances 0.000 claims 3
- QXLPXWSKPNOQLE-UHFFFAOYSA-N methylpentynol Chemical class CCC(C)(O)C#C QXLPXWSKPNOQLE-UHFFFAOYSA-N 0.000 claims 1
- 239000000454 talc Substances 0.000 claims 1
- 229910052623 talc Inorganic materials 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- -1 dibromophenylglycidyl ether ethyl brominated flame retardant Chemical class 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- QNVRIHYSUZMSGM-UHFFFAOYSA-N hexan-2-ol Chemical class CCCCC(C)O QNVRIHYSUZMSGM-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 150000007974 melamines Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- RJIMJFFEGGMQPW-UHFFFAOYSA-N (2-tert-butylphenyl) phosphono hydrogen phosphate Chemical compound P(O)(=O)(OP(=O)(O)O)OC1=C(C=CC=C1)C(C)(C)C RJIMJFFEGGMQPW-UHFFFAOYSA-N 0.000 description 1
- REZAIYDMQVPNCA-UHFFFAOYSA-N (3-hydroxyphenyl) dihydrogen phosphate Chemical compound OC1=CC=CC(OP(O)(O)=O)=C1 REZAIYDMQVPNCA-UHFFFAOYSA-N 0.000 description 1
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 description 1
- OZHJEQVYCBTHJT-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-methylbenzene Chemical compound CC1=C(Br)C(Br)=C(Br)C(Br)=C1Br OZHJEQVYCBTHJT-UHFFFAOYSA-N 0.000 description 1
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 description 1
- OUCSIUCEQVCDEL-UHFFFAOYSA-N 2,3,4-tribromophenol Chemical class OC1=CC=C(Br)C(Br)=C1Br OUCSIUCEQVCDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004114 Ammonium polyphosphate Substances 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 229920002907 Guar gum Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- LAUIXFSZFKWUCT-UHFFFAOYSA-N [4-[2-(4-phosphonooxyphenyl)propan-2-yl]phenyl] dihydrogen phosphate Chemical compound C=1C=C(OP(O)(O)=O)C=CC=1C(C)(C)C1=CC=C(OP(O)(O)=O)C=C1 LAUIXFSZFKWUCT-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- XBJJRSFLZVLCSE-UHFFFAOYSA-N barium(2+);diborate Chemical compound [Ba+2].[Ba+2].[Ba+2].[O-]B([O-])[O-].[O-]B([O-])[O-] XBJJRSFLZVLCSE-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical class C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 239000001177 diphosphate Substances 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000665 guar gum Substances 0.000 description 1
- 229960002154 guar gum Drugs 0.000 description 1
- 235000010417 guar gum Nutrition 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N phthalic anhydride Chemical class C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- BMPBPTNLNBRGOT-UHFFFAOYSA-N tris(4-ethylphenyl) phosphate Chemical compound C1=CC(CC)=CC=C1OP(=O)(OC=1C=CC(CC)=CC=1)OC1=CC=C(CC)C=C1 BMPBPTNLNBRGOT-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/255—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/04—Flexible cables, conductors, or cords, e.g. trailing cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/18—Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
- H01B7/29—Protection against damage caused by extremes of temperature or by flame
- H01B7/295—Protection against damage caused by extremes of temperature or by flame using material resistant to flame
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The application relates to a flame-retardant hot melt adhesive which comprises the following components, by weight, 30-40 parts of thermoplastic resin A, 10-20 parts of thermoplastic resin B, 10-20 parts of thermoplastic resin C, 5-15 parts of a flame retardant, 15-35 parts of a filler and 0.1-5 parts of an auxiliary agent; the glass transition temperature point of the thermoplastic resin A is 10-20 ℃, and the tensile strength is 200-300g/cm2(ii) a The glass transition temperature point of the thermoplastic resin B is 50-80 ℃, and the tensile strength is 600-800g/cm2(ii) a The glass transition temperature point of the thermoplastic resin A is 50-80 ℃, and the tensile strength is 200-300g/cm2. Three thermoplastic resins with different glass transition temperatures and tensile strengths are matched, so that the flame-retardant hot melt adhesive has very strong tensile strength and tensile multiplying power.
Description
Technical Field
The application belongs to the technical field of hot melt adhesives, and relates to a flame-retardant hot melt adhesive, and a flame-retardant hot melt adhesive film and a flexible wire rod which are made of the flame-retardant hot melt adhesive.
Background
FFC (Flexible Flat Cable) is one kind with PET insulating material and very thin tin-plated Flat copper line, through the novel data Cable that high-tech automation equipment production line pressfitting formed, has advantages such as softness, bending folding at will, thickness is thin, small, connect simply, dismantle the convenience, solve electromagnetic shield (EMI) easily.
The flame-retardant hot melt adhesive film is prepared by coating flame-retardant hot melt adhesive on a polyester film, and can be compounded on an article needing flame retardance to block combustion, so that a flame-retardant protective film is provided for various materials needing flame retardance. The composite flame-retardant hot melt adhesive films on the two sides of the FFC wire rod can protect metal and also have a flame-retardant effect, and the flame-retardant hot melt adhesive films are usually directly compounded on the metal, so that the hot melt adhesive is required to have good adhesive strength with the metal.
Disclosure of Invention
The application aims at providing the flame-retardant hot melt adhesive, and the thermoplastic resin with three different glass transition temperatures and tensile strengths is matched, so that the flame-retardant hot melt adhesive has strong tensile strength and tensile multiplying power.
The present application is achieved by the following technical means.
The technical scheme provides a flame-retardant hot melt adhesive which comprises the following components, by weight, 30-40 parts of thermoplastic resin A, 10-20 parts of thermoplastic resin B, 10-20 parts of thermoplastic resin C, 5-15 parts of a flame retardant, 15-35 parts of a filler and 0.1-5 parts of an auxiliary agent;
the glass transition temperature point of the thermoplastic resin A is 10-20 ℃, and the tensile strength is 200-300g/cm2(ii) a The glass transition temperature point of the thermoplastic resin B is 50-80 ℃, and the tensile strength is 600-800g/cm2(ii) a The glass transition temperature point of the thermoplastic resin A is 50-80 ℃, and the tensile strength is 200-300g/cm2。
The flame-retardant hot melt adhesive has simple components and simple and convenient preparation process, and when the tensile strength of the thermoplastic resin B is 600-800g/cm based on the trend of the relationship between the strength of the thermoplastic resin and the performance of the adhesive metal2The stretching ratio is 300-500%, and the flame-retardant hot melt adhesive has excellent metal adhesion performance.
In one embodiment of the technical scheme, the flame retardant comprises one or a mixture of more of a brominated flame retardant, a phosphorous flame retardant, a nitrogen flame retardant, a metal hydroxide flame retardant, a metal oxide flame retardant and a metal boride flame retardant.
Brominated flame retardants such as polybrominated diphenyl ethers, tribromophenols, brominated phthalic anhydrides, brominated bisphenol A, brominated alcohols, brominated polymers, and other brominated flame retardants such as pentabromotoluene, hexabromocyclododecane, decabromodiphenylethane, dibromophenylglycidyl ether ethyl brominated flame retardant monomers, and the like.
The phosphorus flame retardant can be inorganic phosphorus flame retardant or organic phosphorus flame retardant; wherein the inorganic phosphorus flame retardant can be red phosphorus or ammonium polyphosphate; the organic phosphorus flame retardant can be phosphate or a phosphorus heterocyclic compound; examples of the phosphoric acid esters include triphenyl phosphate, ethylphenyl phosphate, t-butylphenyl diphosphate, tetraarylarylene diphosphate, resorcinol phosphate, tetraphenyl bisphenol A-diphosphate, etc.; the phosphorus heterocyclic compound may be, for example, a monocyclic phosphorus heterocyclic compound, a phosphorus spiro compound and a cage-type phosphorus compound.
The nitrogen flame retardant can be melamine, cyanuric acid, melamine derivatives, dicyandiamide, urea and derivatives thereof; derivatives of melamine such as melamine polyphosphate, melamine phosphate, melamine cyanurate.
The metal hydroxide flame retardant may be aluminum hydroxide or magnesium hydroxide.
The metal oxide may be antimony trioxide, antimony oxide, iron oxide, tin oxide, etc.
The metal boride flame retardant can be zinc borate or barium borate.
The flame retardant used in the flame-retardant hot melt adhesive can be one or a mixture of more of the above flame retardants, preferably a brominated flame retardant or a phosphorus flame retardant.
In one embodiment of the technical solution, the thermoplastic resin A is an amorphous saturated polyester resin, the softening point is 90-120 degrees, the stretch ratio is 700-800%, and the molecular weight is 20000-35000.
In one embodiment of the technical solution, the thermoplastic resin B is any one of a crystalline or amorphous saturated polyester resin, a thermoplastic acrylic resin, a thermoplastic epoxy resin and a thermoplastic rubber, and has a softening point of 120-150 ℃, a stretch ratio of 50-100% and a molecular weight of 10000-25000.
In one embodiment of the technical scheme, the thermoplastic resin C is any one of saturated polyester resin, thermoplastic acrylic resin, thermoplastic epoxy resin and thermoplastic rubber, the softening point is 150 ℃ at 120-.
In an embodiment of the technical scheme, the filler is one or more of hydrophobic gas silicon, semi-hydrophobic gas silicon, hydrophilic gas silicon, titanium dioxide, talcum powder, calcium carbonate, barium sulfate, metal oxide and metal hydroxide.
In an embodiment of the technical scheme, the auxiliary agent is one of triethylhexyl phosphoric acid, sodium dodecyl sulfate, methyl amyl alcohol, cellulose derivatives, polyacrylamide, guar gum and fatty acid polyethylene glycol ester.
In one embodiment of the technical scheme, the preparation method of the flame-retardant hot melt adhesive comprises the following steps,
step S1, mixing the thermoplastic resins A and B, and adding C; or mixing A and C and then adding B; or A, B and C are mixed simultaneously to obtain mixed glue, the mixing mode is that solvent is used for heating and stirring, and the solid content in the prepared mixed glue is 40-50%;
step S2, adding the flame retardant, the filler and the auxiliary agent into a solvent, dispersing and mixing for 1 hour at a high speed, and filtering by adopting a 400-mesh filter screen to obtain slurry with the solid content of 40-50%;
step S3, mixing the mixed glue and the slurry, stirring, dispersing and mixing at high speed for half an hour to obtain the flame-retardant hot melt adhesive coating;
the solvent is organic solvent, and is one or more of toluene, xylene, butanone, acetone, ethyl ester, butyl ester, DBE, isopropanol, cyclohexane and cyclohexanone.
The preparation method of the thermoplastic flame-retardant hot melt adhesive in the technical scheme has the advantages of convenience in process formula adjustment, few steps, simple process, high production safety and strong operability.
The other technical scheme of the application is to provide a flame-retardant hot melt adhesive film, wherein the flame-retardant hot melt adhesive coating in the technical scheme is coated on a polyester film, the coating thickness is controlled to be 15-100 mu m, and the flame-retardant hot melt adhesive film is obtained by drying.
In one embodiment of this embodiment, the polyester film is a transparent PET film.
The third technical scheme of this application is to provide a flexible wire, use as in above technical scheme fire-retardant hot melt adhesive membrane hot pressing complex at flat metallic conductor's surface.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Detailed Description
Preferred embodiments of the present application will be described in more detail below. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The embodiment of the application is a flame-retardant hot melt adhesive which comprises the following components, by weight, 30-40 parts of thermoplastic resin A, 10-20 parts of thermoplastic resin B, 10-20 parts of thermoplastic resin C, 5-15 parts of a flame retardant, 15-35 parts of a filler and 0.1-5 parts of an auxiliary agent;
the thermoplastic resin A has a glass transition temperature (TG point) of 10-20 ℃, a softening point of 90-120 ℃ and a tensile strength of 200-300g/cm2The stretching ratio is 700-800%, and the molecular weight is 20000-35000; the thermoplastic resin A is an amorphous saturated polyester resin.
The TG point of the thermoplastic resin B is 50-80 ℃, the softening point is 120-150 ℃, and the tensile strength is 600-800g/cm2The stretching magnification is 50-100%, and the molecular weight is 10000-25000. The thermoplastic resin B is one of a crystalline or amorphous saturated polyester resin, a thermoplastic acrylic resin, a thermoplastic epoxy resin and a thermoplastic rubber.
The TG point of the thermoplastic resin C is 50-80 ℃, the softening point is 120-150 ℃, and the tensile strength is 200-300g/cm2The stretching magnification is 300-500%, and the molecular weight is 15000-25000. The thermoplastic resin C is one of a crystalline or amorphous saturated polyester resin, a thermoplastic acrylic resin, a thermoplastic epoxy resin and a thermoplastic rubber.
The flame retardant comprises one or more of a brominated flame retardant, a phosphorus flame retardant, a nitrogen flame retardant, a metal hydroxide flame retardant, a metal oxide flame retardant and a metal boride flame retardant.
The filler is one or more of hydrophobic gas silicon, semi-hydrophobic gas silicon, hydrophilic gas silicon, titanium dioxide, talcum powder, calcium carbonate, barium sulfate, metal oxide, metal hydroxide and the like.
The auxiliary agent is one of triethyl hexyl phosphoric acid, sodium dodecyl sulfate, methyl amyl alcohol, cellulose derivatives, polyacrylamide, Gule gum, fatty acid polyglycol ester and the like.
The flame-retardant hot melt adhesive is used for preparing a flame-retardant hot melt adhesive film and a flame-retardant hot melt adhesive bare film. Examples X1-X9 flame retardant hot melt adhesive films and bare flame retardant hot melt adhesive films were prepared according to the different raw material components and ratios in table 1, as shown in table 1, where the components are in parts by weight.
TABLE 1 Components of the examples in parts by weight
| Components | X1 | X2 | X3 | X4 | X5 | X6 | X7 | X8 | X9 |
| Thermoplastic resin A | 20 | 30 | 40 | 20 | 30 | 40 | 30 | 30 | 30 |
| Thermoplastic resin B | 40 | 30 | 20 | 0 | 0 | 0 | 15 | 10 | 20 |
| Thermoplastic resin C | 0 | 0 | 0 | 40 | 30 | 20 | 15 | 20 | 10 |
| Flame retardant | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| Filler material | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Auxiliary agent | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
The preparation process comprises the following steps:
step 1, mixing thermoplastic resins A, B and C according to the proportion of the components in the table 1, adding a solvent, heating and mixing to obtain a mixed hot melt adhesive with the solid content of 40%;
step 2, dispersing and mixing 10 parts of flame retardant, 28 parts of filler, 2 parts of auxiliary agent and 60 parts of solvent at a high speed, dispersing for 1 hour at a rotating speed of 1500R/min, and filtering by using a 400-mesh filter screen to obtain slurry with the solid content of 40%;
3, mixing and stirring the mixed hot melt adhesive and the slurry, and stirring for half an hour at 500R/min when the dispersion is half an hour at the rotating speed of 1200R/min to obtain the flame-retardant hot melt adhesive coating;
step 4, coating the flame-retardant hot melt adhesive coating on a polyester film, controlling the coating thickness to be 25 +/-2 mu m, and drying at the drying temperature of 130 +/-10 ℃ to obtain a flame-retardant hot melt adhesive film;
step 5, coating the flame-retardant hot melt adhesive coating on a release film, controlling the coating thickness to be 50 +/-2 microns, drying, and controlling the drying temperature to be 130 +/-10 ℃ to obtain a flame-retardant hot melt adhesive bare film; wherein the release film is a 50 mu mPE single silicon release film.
The solvent is one or more of organic solvents such as toluene, xylene, butanone, acetone, ethyl ester, butyl ester, DBE, isopropanol, cyclohexane and cyclohexanone
The thickness of the polyester film is 12-100 mu m, and the polyester film is a transparent PET film.
The following performance tests were performed on the flame-retardant hot melt adhesive films of examples X1 to X9 prepared as described above, and the results are shown in Table 2:
(1) appearance: the surface of the hot melt adhesive film was visually observed to have no bubbles, pinholes, and particles.
(2) Back sticking: the adhesive metal coating of the flame-retardant hot melt adhesive film is flatly attached to the non-corona surface of PET, the specification of the sample plate is 50mmX200mm, a 5kg weight is flatly placed on the sample plate, the stripping force of the sample plate is measured after the sample plate is placed in a 50 ℃ oven for 48 hours, the stripping speed of a tensile machine is 50mm/min, and the stripping value is less than 0.2N/5cm, so that the PET is qualified.
(3) The method for testing the adhesion of the copper wire comprises the following steps: adjusting the upper and lower flat plates of the flat plate pressing machine to 100 ℃, adjusting the pressure to be less than or equal to 0.1Mpas, testing the peeling force of the sample plate within 3 seconds of pressing time, wherein the peeling speed is 50mm/min, and the adhesive force is greater than or equal to 20g/0.3mm, thus obtaining the qualified product.
(4) The test method for adhesion to PET is: adjusting the upper and lower flat plates of the flat plate pressing machine to 100 ℃, adjusting the pressure to be less than or equal to 0.1Mpas, testing the peeling force of the sample plate within 3 seconds of pressing time, wherein the peeling speed is 50mm/min, and the adhesive force is greater than 10N/INCH, thus obtaining the qualified product.
The following performance tests were performed on the flame retardant hot melt adhesive bare films of the above-prepared examples X1-X9, the results of which are shown in Table 2:
(1) the appearance of the hot melt adhesive bare film is visually observed, and the surface of the hot melt adhesive bare film has no bubbles, pinholes or particles.
(2) Cutting the sample into pieces with the breaking strength of 1inchX120mm, testing the maximum value of the strength of the sample in the process of tensile breaking by using a tensile machine, wherein the machine speed of the tensile machine is 100mm/min, the initial length is 100mm, and averaging 3 groups in total;
(3) cutting the sample into pieces with the specification of 1inchX120mm, testing the tensile length of the sample at tensile breaking by using a tensile machine, wherein the machine speed of the tensile machine is 100mm/min, the initial length is 100mm, taking 3 groups in total to calculate the average value, and obtaining the tensile ratio by using the tensile length/the initial length;
table 2 results of performance testing
As can be seen from the data in Table 2:
1. x3 and X6 obtain the optimal metal bonding performance, but back bonding NG, the tensile strength of the metal bonding is low, and the tensile multiplying power is high.
2. The performances of the sticky metals obtained by X1, X2 and X5 can not reach the standard, and the tensile strength and the stretch multiplying power of the sticky metals are higher and lower.
3. The metal bonding performance obtained by X7, X8 and X9 is excellent, all the performances reach the standard, X8 is the optimal solution in the implementation case, the tensile strength is 500-800GF, and the tensile multiplying power is 350-600 percent.
In summary, the thermoplastic resin A accounts for 30-40 parts by weight; the proportion of the thermoplastic resin B is 10-20 parts; the proportion of the thermoplastic resin C is 10-20 parts; the flame retardant, the filler and the assistant are respectively 5-15 parts, 15-35 parts and 0.1-5 parts, the tensile strength of the obtained flame-retardant hot melt adhesive is 500-800gf, and the tensile ratio is 350-600%, so that the flame-retardant hot melt adhesive film with excellent performance can be prepared.
Having described embodiments of the present application, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (10)
1. The flame-retardant hot melt adhesive is characterized by comprising the following components, by weight, 30-40 parts of thermoplastic resin A, 10-20 parts of thermoplastic resin B, 10-20 parts of thermoplastic resin C, 5-15 parts of a flame retardant, 15-35 parts of a filler and 0.1-5 parts of an auxiliary agent;
the glass transition temperature point of the thermoplastic resin A is 10-20 ℃, and the tensile strength is 200-300g/cm2(ii) a The glass transition temperature point of the thermoplastic resin B is 50-80 ℃, and the tensile strength is 600-800g/cm2(ii) a The glass transition temperature point of the thermoplastic resin A is 50-80 ℃, and the tensile strength is 200-300g/cm2。
2. The flame-retardant hot melt adhesive according to claim 1, wherein the flame retardant comprises one or more of a brominated flame retardant, a phosphorus flame retardant, a nitrogen flame retardant, a metal hydroxide flame retardant, a metal oxide flame retardant and a metal boride flame retardant.
3. The flame-retardant hot melt adhesive as claimed in claim 1, wherein the thermoplastic resin A is an amorphous saturated polyester resin having a softening point of 90-120 degrees, a stretch ratio of 700-800%, and a molecular weight of 20000-35000.
4. The flame-retardant hot melt adhesive as claimed in claim 1, wherein the thermoplastic resin B is any one of crystalline or amorphous saturated polyester resin, thermoplastic acrylic resin, thermoplastic epoxy resin and thermoplastic rubber, and has a softening point of 120-150 ℃, a draw ratio of 50-100% and a molecular weight of 10000-25000.
5. The flame-retardant hot melt adhesive according to claim 1, wherein the thermoplastic resin C is any one of saturated polyester resin, thermoplastic acrylic resin, thermoplastic epoxy resin and thermoplastic rubber, and has a softening point of 120-150 ℃, a stretch ratio of 300-500% and a molecular weight of 15000-25000.
6. The flame-retardant hot melt adhesive according to claim 1, wherein the filler is one or more of hydrophobic gas silica, semi-hydrophobic gas silica, hydrophilic gas silica, titanium dioxide, talc, calcium carbonate, barium sulfate, metal oxide and metal hydroxide.
7. The flame-retardant hot melt adhesive according to claim 1, wherein the auxiliary agent is one of triethylhexylphosphoric acid, sodium dodecyl sulfate, methylpentanol, cellulose derivatives, polyacrylamide, Gule gum and fatty acid polyglycol ester.
8. The flame-retardant hot melt adhesive according to any one of claims 1 to 8, characterized in that the preparation method thereof comprises the following steps,
step S1, mixing the thermoplastic resins A and B, and adding C; or mixing A and C and then adding B; or A, B and C are mixed simultaneously to obtain mixed glue, the mixing mode is that solvent is used for heating and stirring, and the solid content in the prepared mixed glue is 40-50%;
step S2, adding the flame retardant, the filler and the auxiliary agent into a solvent, dispersing and mixing for 1 hour at a high speed, and filtering by adopting a 400-mesh filter screen to obtain slurry with the solid content of 40-50%;
s3, mixing the mixed glue and the slurry, stirring, and dispersing and mixing at a high speed for half an hour to obtain the flame-retardant hot melt adhesive coating;
the solvent is organic solvent, and is one or more of toluene, xylene, butanone, acetone, ethyl ester, butyl ester, DBE, isopropanol, cyclohexane and cyclohexanone.
9. A flame-retardant hot-melt adhesive film, characterized in that the flame-retardant hot-melt adhesive coating as claimed in claim 8 is coated on a polyester film, the coating thickness is controlled to be 15 to 100 μm, and dried to obtain a flame-retardant hot-melt adhesive film.
10. A flexible wire rod, which is hot-press-laminated on the outer surface of a flat metal conductor using the flame-retardant hot-melt adhesive film as claimed in claim 9.
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