CN113710079A - Noise suppression sheet - Google Patents
Noise suppression sheet Download PDFInfo
- Publication number
- CN113710079A CN113710079A CN202110892923.2A CN202110892923A CN113710079A CN 113710079 A CN113710079 A CN 113710079A CN 202110892923 A CN202110892923 A CN 202110892923A CN 113710079 A CN113710079 A CN 113710079A
- Authority
- CN
- China
- Prior art keywords
- resin
- rubber
- noise suppression
- suppression sheet
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention relates to the technical field of electromagnetic wave noise suppression, in particular to a noise suppression sheet which is easy to integrate and apply to electronic equipment and electronic components, has good electromagnetic wave noise suppression performance and electromagnetic wave shielding property, does not promote electromagnetic coupling due to electromagnetic wave reflection, and has small volume and light weight; the composite layer is formed by mixing ferromagnetic atomization and a part of the substrate, the metal layer is formed on the support film through physical deposition of metal, and the support film and the metal layer form a conductor layer.
Description
Technical Field
The invention relates to the technical field of electromagnetic wave noise suppression, in particular to a noise suppression sheet.
Background
In recent years, information communication devices using radio waves, such as mobile phones or personal digital assistants, advanced road information systems, and bluetooth, have become widespread, including the use of the internet, and ubiquitous society is accessing. However, with the widespread use of these information devices, malfunction of other electronic devices and influence on the human body caused by electromagnetic waves radiated from these information devices have become problematic. Therefore, it is required that the electronic device emits electromagnetic waves as little as possible, and does not malfunction even if electromagnetic waves from the outside are received, so as not to cause malfunction or affect other electronic devices or human bodies. In addition, electronic devices, particularly portable electronic devices, are required to have multifunction, higher performance, smaller size, and lighter weight, and measures for suppressing electromagnetic noise are also required, and therefore, space and light weight are required.
Disclosure of Invention
In order to solve the above-mentioned technical problems, the present invention provides a noise suppression sheet that is easy to integrate into electronic devices and electronic components, has good electromagnetic wave noise suppression performance and electromagnetic wave shielding characteristics, does not promote electromagnetic coupling due to electromagnetic wave reflection, and is compact and lightweight.
The invention relates to a noise suppression sheet, which comprises a support film, a metal layer, an organic polymer, dielectric powder, conductive filler and a composite layer, wherein the dielectric powder and the conductive filler are dispersed in the organic polymer to form a substrate, the composite layer is arranged at the top end of the substrate, the composite layer is formed by mixing ferromagnetic atomization and a part of the substrate, the metal layer is formed on the support film through physical deposition of metal, and the support film and the metal layer form a conductor layer.
The thickness of the metal layer is 5 to 500 nm.
The organic polymer of the noise suppression sheet of the present invention includes polyolefin resin, polyamide resin, polyester resin, polyether resin, polyketone resin, polyimide resin, polyurethane resin, polysiloxane resin, and phenol resin, and the organic matter includes resins such as epoxy resin and acrylic resin, rubbers such as diene natural rubber, isoprene rubber, butadiene rubber, and styrene-butadiene rubber, and non-diene rubbers such as butyl rubber, ethylene-propylene rubber, polyurethane rubber, and silicone rubber.
In the noise suppressing sheet of the present invention, the particle diameter of the dielectric powder is preferably 5 μm or less.
According to the noise suppression sheet, the conductive filler is one of gold powder, gold fibers, gold-coated particles, carbon particles and carbon nanotubes.
In the noise suppressing sheet of the present invention, the conductive filler preferably has a particle size of 10 μm or less.
The noise suppression sheet comprises a ferromagnetic body and a metal-based soft magnetic material, wherein the metal-based soft magnetic material comprises Fe-Ni, Fe-Co, Fe-Cr, Fe-Si, Fe-Al, Fe-Cr-Si, Fe-Cr-Al and Fe-Al-Si alloy.
The invention has the beneficial effects that: the electromagnetic wave noise suppression device is easy to integrate and apply to electronic equipment and electronic elements, has good electromagnetic wave noise suppression performance and electromagnetic wave shielding property, does not promote electromagnetic coupling due to electromagnetic wave reflection, and is small in size and light.
Drawings
FIG. 1 is a schematic view of the present invention;
in the drawings, the reference numbers: 1. a support film; 2. a metal layer; 3. an organic polymer; 4. a dielectric powder; 5. a conductive filler; 6. and (4) compounding layers.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Example 1
As shown in fig. 1, the noise suppression sheet of the present invention includes a support film 1, a metal layer 2, an organic polymer 3, a dielectric powder 4, a conductive filler 5, and a composite layer 6, wherein the dielectric powder 4 and the conductive filler 5 are dispersed in the organic polymer 3 to form a substrate, the composite layer 6 is disposed on the top of the substrate, the composite layer 6 is formed by mixing ferromagnetic atomized with a portion of the substrate, the metal layer 2 is formed on the support film 1 by physically depositing a metal, and the support film 1 and the metal layer 2 constitute a conductor layer.
Example 2
As a preference of the above embodiment, the metal layer 2 has a thickness of 5 to 500 nm.
Example 3
As preferable examples of the above embodiment, the organic polymer 3 includes polyolefin resin, polyamide resin, polyester resin, polyether resin, polyketone resin, polyimide resin, urethane resin, polysiloxane resin, and phenol resin, and the organic substance includes resins such as epoxy resin and acrylic resin, rubbers such as diene natural rubber, isoprene rubber, butadiene rubber, and styrene-butadiene rubber, and non-diene rubbers such as butyl rubber, ethylene-propylene rubber, urethane rubber, and silicone rubber.
Example 4
In the above embodiment, the particle diameter of the dielectric powder 4 is preferably 5 μm or less.
Example 5
As a preference of the above embodiment, the conductive filler 5 is one of gold powder, gold fiber, gold-coated fine particles, carbon fine particles, and carbon nanotubes.
Example 6
As a preference of the above embodiment, the size of the conductive filler 5 is preferably 10 μm or less in the case of a granular form.
Example 7
As a preference of the above embodiment, the ferromagnetic body includes a metal-based soft magnetic material including Fe-Ni, Fe-Co, Fe-Cr, Fe-Si, Fe-Al, Fe-Cr-Si, Fe-Cr-Al and Fe-Al-Si alloys.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (7)
1. The noise suppression sheet is characterized by comprising a support film (1), a metal layer (2), an organic polymer (3), dielectric powder (4), conductive filler (5) and a composite layer (6), wherein the dielectric powder (4) and the conductive filler (5) are dispersedly arranged in the organic polymer (3) to form a substrate, the composite layer (6) is arranged at the top end of the substrate, the composite layer (6) is formed by mixing ferromagnetic atomization and a part of the substrate, the metal layer (2) is formed on the support film (1) through physical deposition of metal, and the support film (1) and the metal layer (2) form a conductor layer.
2. A noise suppression sheet according to claim 1, wherein the metal layer (2) has a thickness of 5 to 500 nm.
3. The noise suppression sheet according to claim 1, wherein the organic polymer (3) comprises a polyolefin resin, a polyamide resin, a polyester resin, a polyether resin, a polyketone resin, a polyimide resin, a polyurethane resin, a polysiloxane resin, and a phenol resin, and the organic substance comprises a resin such as an epoxy resin and an acrylic resin, a rubber such as a diene natural rubber, an isoprene rubber, a butadiene rubber, a styrene-butadiene rubber, and a non-diene rubber such as a butyl rubber, an ethylene-propylene rubber, a polyurethane rubber, and a silicone rubber.
4. A noise suppression sheet according to claim 1, wherein the particle diameter of the dielectric powder (4) is preferably 5 μm or less.
5. A noise-suppressing sheet as defined in claim 1, wherein said conductive filler (5) is one of gold powder, gold fiber, gold-coated fine particles, carbon fine particles and carbon nano tubes.
6. A noise-suppressing sheet as defined in claim 5, wherein the size of said conductive filler (5) is preferably 10 μm or less in the case of a granular form.
7. A noise suppression sheet as set forth in claim 1, wherein the ferromagnetic body comprises a metal-based soft magnetic material comprising Fe-Ni, Fe-Co, Fe-Cr, Fe-Si, Fe-Al, Fe-Cr-Si, Fe-Cr-Al, and Fe-Al-Si alloys.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110892923.2A CN113710079A (en) | 2021-08-04 | 2021-08-04 | Noise suppression sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110892923.2A CN113710079A (en) | 2021-08-04 | 2021-08-04 | Noise suppression sheet |
Publications (1)
Publication Number | Publication Date |
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CN113710079A true CN113710079A (en) | 2021-11-26 |
Family
ID=78651548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202110892923.2A Withdrawn CN113710079A (en) | 2021-08-04 | 2021-08-04 | Noise suppression sheet |
Country Status (1)
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CN (1) | CN113710079A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113692209A (en) * | 2021-07-19 | 2021-11-23 | 江苏穗实科技有限公司 | Electromagnetic wave absorption sheet with excellent high-frequency magnetic permeability and manufacturing method thereof |
-
2021
- 2021-08-04 CN CN202110892923.2A patent/CN113710079A/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113692209A (en) * | 2021-07-19 | 2021-11-23 | 江苏穗实科技有限公司 | Electromagnetic wave absorption sheet with excellent high-frequency magnetic permeability and manufacturing method thereof |
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SE01 | Entry into force of request for substantive examination | ||
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WW01 | Invention patent application withdrawn after publication |
Application publication date: 20211126 |
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WW01 | Invention patent application withdrawn after publication |