CN113702668A - High-voltage-resistant testing mechanism for semiconductor chip - Google Patents
High-voltage-resistant testing mechanism for semiconductor chip Download PDFInfo
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- CN113702668A CN113702668A CN202111279248.2A CN202111279248A CN113702668A CN 113702668 A CN113702668 A CN 113702668A CN 202111279248 A CN202111279248 A CN 202111279248A CN 113702668 A CN113702668 A CN 113702668A
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- plate
- supporting
- semiconductor chip
- pressing plate
- bottom plate
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Abstract
The embodiment of the application provides a high-voltage resistance testing mechanism for a semiconductor chip, and relates to the technical field of semiconductor chips. This semiconductor chip high pressure resistant accredited testing organization includes: support body supporting component, push down the subassembly, recoil clearance subassembly, pin plug-in components and check out test set. The support body supporting assembly comprises a bottom plate, a top plate, supporting columns and supporting seats, wherein the top plate is arranged above the bottom plate, two ends of each supporting column are respectively and fixedly connected with the bottom plate and the top plate, the supporting seats are installed at the top of the bottom plate, vertical slotted holes are formed in the tops of the supporting seats, and transverse slotted holes communicated with the vertical slotted holes are formed in the side faces of the supporting seats. Before detection, air is compressed by the starting air pump and then enters the air inlet through hole through the connecting pipe. The air inside the air inlet through hole is finally discharged from the vertical slotted hole, and the discharged air discharges the dust inside the vertical slotted hole to the outside due to the high circulation speed, so that the slotted hole blockage caused by the accumulated dust inside the slotted hole is avoided.
Description
Technical Field
The application relates to the technical field of semiconductor chips, in particular to a high-voltage-resistant testing mechanism for a semiconductor chip.
Background
The semiconductor chip industry is the foundation of the electronic information technology industry. Chip design is mainly based on the design purpose of chip to make logic design and rule, and according to design drawing to make mask for use in the following photoetching step. The semiconductor chip industry chain links include IC design, wafer fabrication and processing, packaging, testing, and the like.
In the production process of the semiconductor chip, a plurality of tests are required, wherein one test is to perform a high voltage resistance test on the semiconductor chip. In the related technology, the chip is positioned on the template for testing in the high-voltage resistance test of the semiconductor chip, dust is easily accumulated inside the jack correspondingly positioning the semiconductor chip on the template, the situation that the jack is blocked easily due to long-term accumulation is caused, and the situation is difficult to clean.
Disclosure of Invention
The present application is directed to solving at least one of the problems in the prior art. Therefore, the application provides a semiconductor chip high voltage resistance testing mechanism to solve the problems that in the related art, the chip is positioned on the template to be tested in the semiconductor chip high voltage resistance testing, dust is easily accumulated inside the jack correspondingly positioning the semiconductor chip on the template, the jack is easily blocked due to long-term accumulation, and the jack is difficult to clean.
According to this application embodiment's high voltage resistance accredited testing organization of semiconductor chip includes: support body supporting component, push down the subassembly, recoil clearance subassembly, pin plug-in components and check out test set.
The frame body supporting assembly comprises a bottom plate, a top plate, a supporting column and a supporting seat, wherein the top plate is arranged above the bottom plate, two ends of the supporting column are respectively and fixedly connected with the bottom plate and the top plate, the supporting seat is arranged at the top of the bottom plate, a vertical groove hole is formed in the top of the supporting seat, a transverse groove hole communicated with the vertical groove hole is formed in the side surface of the supporting seat, an air inlet through hole communicated with the vertical groove hole is formed in the end part of the supporting seat, the pressing assembly comprises an electric push rod and a first pressing plate, the electric push rod is arranged at the bottom of the top plate, the first pressing plate is arranged above the supporting seat, the output end of the electric push rod is connected to the top of the first pressing plate, the recoil cleaning assembly comprises an air pump and a connecting pipe, the air pump is arranged above the bottom plate, two ends of the connecting pipe are respectively communicated with an air outlet port of the air pump and the air inlet through hole, the pin inserting assembly is arranged in the vertical slotted hole and the transverse slotted hole, the detection equipment comprises a high-voltage detection device and a detection fixing clamp, the detection fixing clamp is connected with the high-voltage detection device through a lead, and the detection fixing clamp is clamped and fixed on the pin inserting assembly.
In some embodiments of the present application, a second pressing plate is disposed below the first pressing plate, and an elastic connector is disposed between the first pressing plate and the second pressing plate.
In some embodiments of the present application, the elastic connection member includes a first spring, and both ends of the first spring are respectively connected to the first pressing plate and the second pressing plate.
In some embodiments of the present application, a supporting sleeve is fixedly disposed on the top of the second pressing plate, and the first spring is sleeved outside the supporting sleeve.
In some embodiments of the present application, a support sleeve rod is fixedly disposed at the bottom of the first pressing plate, the bottom end of the support sleeve rod is slidably inserted into the support sleeve, and the first spring is sleeved outside the support sleeve rod.
In some embodiments of the present application, the bottom of the second pressure plate is provided with an elastic gasket.
In some embodiments of the present application, the support seat is fixedly connected with connecting strips on both sides.
In some embodiments of the present application, the connection strip plate is far away from the support seat side fixedly connected with connection lug plate fixedly connected with the bottom plate.
In some embodiments of the present application, the bottom plate has a positioning groove at the top, and the bottom of the connection ear plate is clamped inside the positioning groove.
In some embodiments of the present application, a fixing bolt is disposed between the connection lug plate and the base plate.
When the pins of the semiconductor chip in the related technology are detected, the pin connection part is not stable enough, the poor contact condition is easy to occur, and the normal high-voltage resistance test of the semiconductor chip is influenced.
In some embodiments of the present application, the pin plug-in component includes a limiting sleeve, a supporting block, a guide rod, V-shaped reeds, a slider and a second spring, two of the V-shaped reeds are respectively disposed on two sides above the supporting block, two sides of the top of the supporting block are both provided with a sliding groove, the slider is slidably disposed inside the sliding groove, and the top of the slider is fixedly connected to the bottom of the V-shaped reed, the supporting block and the V-shaped reeds are both disposed inside the vertical groove hole, the second spring is disposed inside the sliding groove and close to one side of the inner wall of the vertical groove hole, the limiting sleeve is inserted inside the horizontal groove hole, and one end of the guide rod runs through the limiting sleeve screwed into the supporting block.
In some embodiments of the present application, the vertical slot, the horizontal slot, the limiting sleeve and the supporting block are all of matched rectangular parallelepiped structures.
Inserting a pin of a semiconductor chip into a gap between two V-shaped reeds in a pin plug-in assembly; the V-shaped spring plate has good elasticity for clamping and fixing the pin. Because the opposite sides of the two V-shaped reeds are provided with the inclined surfaces, the insertion gap is larger, and the pins of the semiconductor chip are inserted in alignment more easily. When the pin is inserted, the two V-shaped reeds are respectively extruded and slide together with the sliding block at the bottom, and the second spring at one side of the sliding block is compressed, so that the V-shaped reeds have better elastic force to clamp and fix the pin. The condition of poor contact of the pins during detection can be effectively reduced. And after the detection is finished, the detection fixing clamp clamped at the end part of the guide rod is detached, the electric push rod drives the first pressing plate to move upwards, and the semiconductor chip above the supporting seat is pulled out.
The pin plug-in component is also convenient to install, disassemble and replace. The V-shaped reed and the sliding block as well as the second spring and the sliding block are fixed in advance by welding; the slide block is clamped in the sliding chute, the V-shaped reed, the slide block and the supporting block are placed in the vertical slotted hole together, the limiting sleeve is inserted into the transverse slotted hole, and the limiting sleeve can be made of an insulating rubber material; the guide rod is inserted into the limiting sleeve, and the guide rod is rotated to connect and fix the guide rod and the supporting block, so that the pin inserting assembly is installed on the supporting seat. If the pin inserting components are damaged and need to be detached and replaced, the guide rod can be pulled out from the limiting sleeve by reversely rotating the guide rod, and a new group of pin inserting components can be installed in the vertical slotted holes and the transverse slotted holes in the supporting seat by pouring out the V-shaped reeds, the sliding blocks and the supporting blocks in the vertical slotted holes.
When the pins of the semiconductor chip in the high-voltage resistance testing mechanism of the semiconductor chip are in contact with the V-shaped reeds, the two parts are mainly in single-point or single-side contact, the contact area is small, and the heat at the positions of the contact points is high.
In some embodiments of this application, the inside U type reed that is provided with of V type reed, two the equal equidistance in the relative one side of V type reed is seted up the first strip of multiunit and is led to groove and constitute the bar multiunit, the bar is kept away from U type reed one side is provided with a plurality of groups of arc lug, U type reed is kept away from bar one side with V type reed fixed connection, U type reed is close to bar one side has been seted up two second bars and has been led to groove and constitute the backup pad, the backup pad with be provided with a plurality of groups of elastic support spare between the U type reed inner wall.
In some embodiments of the present application, the elastic support comprises a third spring, and the third spring is connected to the inner wall of the U-shaped spring and the supporting plate, respectively.
In some embodiments of the present application, a limiting rod is fixedly connected to each of the opposite sides of the U-shaped spring and the supporting plate, and the third springs are respectively sleeved outside the limiting rods.
The U-shaped reed inside the V-shaped reed is used for supporting a plurality of groups of strip-shaped rods on the inner side of the V-shaped reed. The third spring among the elastic support piece makes the backup pad on the U type reed receive elasticity and incline to the outside, drives the multiunit bar slope in the backup pad outside promptly. The pins of the semiconductor chip are inserted into the arc-shaped convex blocks outside the multiple groups of bar-shaped rods to be contacted, the multiple groups of bar-shaped rods and the arc-shaped convex blocks surround the pins of the chip, the contact area between the pins of the chip and the V-shaped reed is increased, the condition that the temperature of the contact point area is too low and too high can be effectively reduced, and the current conduction efficiency is improved. The friction force between the V-shaped reed and the chip pin is increased by the multiple groups of strip-shaped rods and the convex blocks, so that the stability of fixing the chip pin is increased when the semiconductor chip is detected.
The beneficial effect of this application is: this application obtains through above-mentioned design a semiconductor chip high pressure resistant accredited testing organization, during the use, through inside the connecting pipe gets into air inlet hole after starting the air pump with air compression before detecting. The air inside the air inlet through hole is finally discharged from the vertical slotted hole, and the discharged air discharges the dust inside the vertical slotted hole to the outside due to the high circulation speed, so that the slotted hole blockage caused by the accumulated dust inside the slotted hole is avoided. Subsequently, the semiconductor chip is placed above the supporting seat, the pins are aligned and clamped into the vertical slotted holes, the pins can be smoothly inserted, and the blocking condition can not occur. The chip pins inserted into the vertical slotted holes are contacted with the pin plug-in components, and the electric push rod pushes the first pressing plate to press and hold the semiconductor chip, so that the contact between the semiconductor chip pins and the pin plug-in components is more stable, and the problem of poor contact is avoided. And clamping the detection fixing clamp on the corresponding pin plug-in assembly, and carrying out high-voltage detection on the semiconductor chip through a high-voltage detection device.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
FIG. 1 is a schematic structural diagram of a high voltage endurance testing mechanism of a semiconductor chip according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of a hold-down assembly according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a support pedestal, a recoil cleaning assembly, and a pin insertion assembly according to an embodiment of the present disclosure;
FIG. 4 is a schematic view of a supporting seat structure according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram of a pin receptacle assembly according to an embodiment of the present application;
FIG. 6 is a schematic diagram of a stop collar and guide rod configuration according to an embodiment of the present application;
FIG. 7 is a schematic structural diagram of a support block, a V-shaped spring, a slider and a U-shaped spring according to an embodiment of the present application;
FIG. 8 is a schematic diagram of a V-shaped spring, a slider and a U-shaped spring according to an embodiment of the present application;
figure 9 is a schematic view of a U-shaped spring and resilient support according to an embodiment of the present application.
Icon:
10-a frame support assembly; 110-a base plate; 120-a top plate; 130-support column; 140-a support base; 141-vertical slotted holes; 142-a transverse slot; 143-air inlet through holes; 150-connecting the slats; 160-connecting ear plate; 20-pressing the assembly; 210-an electric push rod; 220-a first platen; 230-a second platen; 240-elastic connection; 241-a first spring; 242-a support sleeve; 243-support loop bar; 250-a resilient gasket; 30-a backflush cleaning assembly; 310-an air pump; 320-a connecting tube; 40-pin plug-in components; 410-a limit sleeve; 420-a support block; 421-a chute; 430-a guide rod; 440-V shaped reed; 441-bar-shaped rods; 442-arc-shaped bumps; 450-a slider; 460-a second spring; 470-U-shaped reed; 471-a support plate; 480-a resilient support; 50-a detection device; 510-high voltage detection means; 520-test fixture.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
A semiconductor chip high voltage withstand test mechanism according to an embodiment of the present application is described below with reference to the accompanying drawings.
Referring to fig. 1 to 9, a high voltage endurance testing mechanism for a semiconductor chip according to an embodiment of the present application includes: a rack support assembly 10, a hold-down assembly 20, a recoil cleaning assembly 30, a pin insertion assembly 40, and a detection device 50.
The rack support assembly 10 is used for supporting and mounting the pressing assembly 20, the recoil cleaning assembly 30, the pin inserting assembly 40 and the detection device 50. The hold-down assembly 20 is used to hold the semiconductor chip so that the semiconductor chip is stably fixed and high-voltage tested using the testing apparatus 50. Before detection, the recoil cleaning assembly 30 can be used for cleaning the vertical slot 141 and the horizontal slot 142 on the supporting seat 140 in the pressing assembly 20, so that the slots are prevented from being blocked by dust and impurities.
The magazine support assembly 10 includes a base plate 110, a top plate 120, a support post 130, and a support base 140. The top plate 120 is arranged above the bottom plate 110, two ends of the supporting column 130 are respectively and fixedly connected to the bottom plate 110 and the top plate 120, and the supporting column 130 is fixed with the bottom plate 110 and the top plate 120 by welding; the supporting base 140 is installed on the top of the bottom plate 110, a vertical slot 141 is formed on the top of the supporting base 140, a horizontal slot 142 communicated with the vertical slot 141 is formed on the side surface of the supporting base 140, and an air inlet hole 143 communicated with the vertical slot 141 is formed at the end of the supporting base 140. The supporting base 140 may be made of a ceramic plate having good insulation properties.
The hold-down assembly 20 includes a power push rod 210 and a first pressure plate 220. The electric push rod 210 is arranged at the bottom of the top plate 120, the first pressing plate 220 is arranged above the supporting seat 140, and the output end of the electric push rod 210 is connected to the top of the first pressing plate 220; the output end of the electric push rod 210 and the first pressure plate 220 are fixed by bolts.
The backflush cleaning assembly 30 includes an air pump 310 and a connection tube 320. The air pump 310 is installed above the bottom plate 110, and two ends of the connection pipe 320 are respectively communicated with the air outlet port and the air inlet through hole 143 of the air pump 310. The pin jack assembly 40 is disposed inside the vertical slot 141 and the horizontal slot 142. The sensing apparatus 50 includes a high voltage sensing device 510 and a sensing fixture 520. The detection fixing clip 520 is connected with the high voltage detection device 510 through a wire, and the detection fixing clip 520 is clamped and fixed on the pin plug assembly 40.
Before detection, air is compressed by starting the air pump 310 and then enters the air inlet through hole 143 through the connecting pipe 320. The air inside the air inlet hole 143 is finally discharged from the vertical slot 141, and the discharged air discharges the dust inside the vertical slot 141 to the outside due to the fast circulation speed, thereby avoiding the blockage of the slot caused by the dust accumulated inside the slot. Subsequently, the semiconductor chip is placed on the supporting base 140, and the pins are aligned and clamped into the vertical slots 141 to be smoothly inserted, so that the situation of blockage is avoided. The chip pins inserted into the vertical slots 141 contact the pin plug-in components 40, and the electric push rod 210 pushes the first pressing plate 220 to press and hold the semiconductor chip, so that the contact between the semiconductor chip pins and the pin plug-in components 40 is more stable, and the problem of poor contact is avoided. The test fixture 520 is clamped on the corresponding pin plug assembly 40, and the high voltage test device 510 is used to perform high voltage test on the semiconductor chip.
It should be noted that the specific model specifications of the electric push rod 210 and the air pump 310 need to be determined according to the actual specification of the device, and the specific model selection calculation method adopts the prior art, so detailed description is omitted. The power supply of the electric putter 210 and the air pump 310 and the principle thereof will be apparent to those skilled in the art and will not be described in detail herein.
In some embodiments of the present application, a second pressing plate 230 is disposed below the first pressing plate 220, and an elastic connection 240 is disposed between the first pressing plate 220 and the second pressing plate 230. The elastic connection member 240 includes a first spring 241, and both ends of the first spring 241 are respectively connected to the first pressure plate 220 and the second pressure plate 230. The top of the second pressing plate 230 is fixedly provided with a supporting sleeve 242, and the first spring 241 is sleeved outside the supporting sleeve 242. The bottom of the first pressing plate 220 is fixedly provided with a supporting sleeve rod 243, the bottom end of the supporting sleeve rod 243 is slidably inserted into the supporting sleeve 242, and the supporting sleeve rod 243 is sleeved with the first spring 241. The bottom of the second pressing plate 230 is provided with an elastic gasket 250; the elastic pad 250 is a rubber pad having good elasticity and is used to elastically protect the pressed semiconductor chip. The first spring 241 in the elastic connection 240 between the first pressing plate 220 and the second pressing plate 230 has good elasticity and buffering performance for elastically buffering and protecting the semiconductor chip pressed and held at the bottom. The support sleeve 242 and the support bar 243 both serve to restrain the first spring 241.
In some embodiments of the present application, the connection bar plate 150 is fixedly connected to both sides of the supporting seat 140; the supporting seat 140 and the connecting strip 150 are fixed by welding. One side of the connecting ribbon board 150, which is far away from the supporting seat 140, is fixedly connected with a connecting lug plate 160, and the connecting ribbon board 150 and the connecting lug plate 160 are fixed by bolts; the connection lug 160 is fixedly connected to the base plate 110. The top of the bottom plate 110 is provided with a positioning groove, and the bottom of the connecting ear plate 160 is clamped inside the positioning groove. A fixing bolt is provided between the connection lug plate 160 and the base plate 110. The connecting ear plate 160 is provided to assist in fixing the support base 140. The snap-fit design of the positioning groove and the engaging ear plate 160 is convenient for positioning the mounting seat 140.
When the pins of the semiconductor chip in the related technology are detected, the pin connection part is not stable enough, the poor contact condition is easy to occur, and the normal high-voltage resistance test of the semiconductor chip is influenced.
In some embodiments of the present application, pin receptacle assembly 40 includes a retaining sleeve 410, a support block 420, a guide rod 430, a V-shaped spring 440, a slider 450, and a second spring 460. The two V-shaped reeds 440 are respectively arranged on two sides above the supporting block 420, sliding grooves 421 are respectively arranged on two sides of the top of the supporting block 420, the sliding block 450 is slidably arranged in the sliding grooves 421, and the top of the sliding block 450 is fixedly connected with the bottoms of the V-shaped reeds 440; the sliding block 450 and the V-shaped spring leaf 440 are fixed by welding. The supporting block 420 and the V-shaped spring 440 are disposed inside the vertical slot 141, and the second spring 460 is disposed inside the sliding slot 421 and close to one side of the inner wall of the vertical slot 141. One end of the second spring 460 may be welded to the slider 450. The position-limiting sleeve 410 is inserted into the transverse slot 142, and one end of the guide rod 430 penetrates through the position-limiting sleeve 410 and is screwed with the supporting block 420. One side of the supporting block 420 close to the limiting sleeve 410 is provided with an internal thread, and one end of the guide rod 430 close to the supporting block 420 is provided with an external thread matched with the internal thread. The vertical slot 141, the horizontal slot 142, the limiting sleeve 410 and the supporting block 420 are all of cuboid structures matched with each other. The supporting block 420, the guide rod 430, the V-shaped spring leaf 440 and the slider 450 are made of copper materials with good electric conductivity.
Inserting the pins of the semiconductor chip into the gap between the two V-shaped reeds 440 in the pin plug assembly 40; v-shaped spring 440 itself has good elasticity for holding the pin. Because the opposite sides of the two V-shaped reeds 440 are inclined, the insertion clearance is larger, and the pins of the semiconductor chip are inserted in alignment more easily. When the pin is inserted, the two V-shaped reeds 440 are respectively pressed and slid together with the slider 450 at the bottom, and the second spring 460 at one side of the slider 450 is compressed, so that the V-shaped reeds 440 have better elasticity to clamp and fix the pin. The condition of poor contact of the pins during detection can be effectively reduced. After the detection is finished, the detection fixing clamp 520 clamped at the end of the guide rod 430 is removed, and the electric push rod 210 drives the first pressing plate 220 to move upwards, so as to pull out the semiconductor chip above the supporting seat 140.
The pin jack assembly 40 is also easy to install and remove for replacement. The V-shaped reed 440 and the sliding block 450 and the second spring 460 and the sliding block 450 are fixed in advance by welding; the slide block 450 is clamped into the slide groove 421, the V-shaped spring leaf 440, the slide block 450 and the supporting block 420 are placed into the vertical slot 141, the limiting sleeve 410 is inserted into the transverse slot 142, and the limiting sleeve 410 can be made of insulating rubber; the guide rod 430 is inserted into the limiting sleeve 410, and the guide rod 430 is rotated to connect and fix the guide rod 430 and the supporting block 420, so that the pin plug assembly 40 is mounted on the supporting base 140. If the pin plug-in components 40 are damaged and need to be disassembled and replaced, the guide rod 430 can be pulled out from the limiting sleeve 410 by rotating the guide rod 430 reversely, and the V-shaped spring 440, the sliding block 450 and the supporting block 420 in the vertical slot 141 can be poured out, so that a new group of pin plug-in components 40 can be installed in the vertical slot 141 and the horizontal slot 142 in the supporting seat 140.
When the pins of the semiconductor chip in the high-voltage resistance testing mechanism of the semiconductor chip are in contact with the V-shaped reed 440, the two parts are mainly in single-point or single-side contact, the contact area is small, and the heat at the position of the contact point is high.
In some embodiments of the present application, a U-shaped spring 470 is disposed inside the V-shaped spring 440, a plurality of groups of first bar-shaped through grooves are equidistantly formed on opposite sides of two V-shaped springs 440, a bar-shaped rod 441 is formed between adjacent first bar-shaped through grooves, a plurality of groups of arc-shaped protrusions 442 are disposed on one side of the bar-shaped rod 441 away from the U-shaped spring 470, the arc-shaped protrusions 442 are made of copper, and the bar-shaped rod 441 and the arc-shaped protrusions 442 are integrally formed. One side of the U-shaped reed 470, which is far away from the bar-shaped rod 441, is fixedly connected with the V-shaped reed 440; namely, one side of the U-shaped spring plate 470 and the inner wall of one side of the V-shaped spring plate 440 are fixed by welding. Two second strip-shaped through grooves are formed in one side, close to the strip-shaped rod 441, of the U-shaped reed 470 to form a supporting plate 471, and a plurality of groups of elastic supporting pieces 480 are arranged between the supporting plate 471 and the inner wall of the U-shaped reed 470. The elastic support 480 includes a third spring, which is connected to the inner wall of the U-shaped spring 470 and the supporting plate 471, respectively. Limiting rods are fixedly connected to the opposite sides of the U-shaped reed 470 and the supporting plate 471, and the U-shaped reed 470, the supporting plate 471 and the limiting rods are fixed through welding; the third springs are respectively sleeved outside the limiting rods.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a semiconductor chip is able to bear or endure high pressure accredited testing organization which characterized in that includes:
the support body supporting assembly (10) comprises a bottom plate (110), a top plate (120), a supporting column (130) and a supporting seat (140), the top plate (120) is arranged above the bottom plate (110), two ends of the supporting column (130) are respectively and fixedly connected to the bottom plate (110) and the top plate (120), the supporting seat (140) is installed at the top of the bottom plate (110), a vertical slotted hole (141) is formed in the top of the supporting seat (140), a transverse slotted hole (142) communicated with the vertical slotted hole (141) is formed in the side face of the supporting seat (140), and an air inlet through hole (143) communicated with the vertical slotted hole (141) is formed in the end portion of the supporting seat (140);
the pressing assembly (20) comprises an electric push rod (210) and a first pressing plate (220), the electric push rod (210) is installed at the bottom of the top plate (120), the first pressing plate (220) is arranged above the supporting seat (140), and the output end of the electric push rod (210) is connected to the top of the first pressing plate (220);
the backflushing cleaning assembly (30), the backflushing cleaning assembly (30) comprises an air pump (310) and a connecting pipe (320), the air pump (310) is installed above the bottom plate (110), and two ends of the connecting pipe (320) are respectively communicated with an air outlet port of the air pump (310) and the air inlet through hole (143);
a pin plug assembly (40), the pin plug assembly (40) being disposed inside the vertical slot (141) and the transverse slot (142);
detection equipment (50), detection equipment (50) include high voltage detection device (510) and detect fixation clamp (520), detect fixation clamp (520) with high voltage detection device (510) pass through the wire and connect, it is fixed in to detect fixation clamp (520) centre gripping pin plug assembly (40).
2. The high voltage resistance testing mechanism of the semiconductor chip according to claim 1, wherein a second pressing plate (230) is disposed under the first pressing plate (220), and an elastic connector (240) is disposed between the first pressing plate (220) and the second pressing plate (230).
3. The high voltage resistance testing mechanism of claim 2, wherein the elastic connector (240) comprises a first spring (241), and two ends of the first spring (241) are respectively connected to the first pressing plate (220) and the second pressing plate (230).
4. The high voltage resistance testing mechanism of claim 3, wherein a supporting sleeve (242) is fixedly disposed on the top of the second pressing plate (230), and the first spring (241) is sleeved outside the supporting sleeve (242).
5. The high voltage resistance testing mechanism of a semiconductor chip according to claim 4, wherein a supporting rod (243) is fixedly disposed at the bottom of the first pressing plate (220), the bottom end of the supporting rod (243) is slidably inserted into the supporting sleeve (242), and the supporting rod (243) is sleeved with the first spring (241).
6. The high voltage resistance testing mechanism of the semiconductor chip according to claim 3, wherein the bottom of the second pressing plate (230) is provided with an elastic gasket (250).
7. The mechanism as claimed in claim 1, wherein the support base (140) is fixedly connected with connection strips (150) at both sides thereof.
8. The mechanism as claimed in claim 7, wherein a connecting ear plate (160) is fixedly connected to a side of the connecting strip (150) away from the supporting base (140), and the connecting ear plate (160) is fixedly connected to the bottom plate (110).
9. The mechanism of claim 8, wherein a positioning groove is formed at the top of the bottom plate (110), and the bottom of the connecting ear plate (160) is engaged with the positioning groove.
10. The high voltage testing mechanism of claim 8, wherein a fixing bolt is disposed between the connecting ear plate (160) and the bottom plate (110).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111279248.2A CN113702668A (en) | 2021-11-01 | 2021-11-01 | High-voltage-resistant testing mechanism for semiconductor chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111279248.2A CN113702668A (en) | 2021-11-01 | 2021-11-01 | High-voltage-resistant testing mechanism for semiconductor chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117129840A (en) * | 2023-10-26 | 2023-11-28 | 华迅信息技术研究(深圳)有限公司 | Integrated circuit chip detection equipment |
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Application publication date: 20211126 |