CN113701613A - Silicon wafer box detection clamping frame - Google Patents
Silicon wafer box detection clamping frame Download PDFInfo
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- CN113701613A CN113701613A CN202111279994.1A CN202111279994A CN113701613A CN 113701613 A CN113701613 A CN 113701613A CN 202111279994 A CN202111279994 A CN 202111279994A CN 113701613 A CN113701613 A CN 113701613A
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- box body
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- detection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/30—Measuring arrangements characterised by the use of mechanical techniques for measuring the deformation in a solid, e.g. mechanical strain gauge
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a silicon wafer box detection clamping frame, which belongs to the technical field of silicon wafer box detection, and comprises a first box body and a second box body, and further comprises: the first detection plate and the guide rod are connected in the second box body in a lifting manner; the supporting frame is fixedly connected to the top of the first box body; the fixed cylinder is fixedly connected to the support frame and is used for being inserted into the through hole of the silicon wafer box body; a clamping mechanism capable of clamping the silicon wafer box body through a guide rod is arranged in the fixed cylinder; compared with the existing detection device in the current market, the silicon wafer box detection clamping frame can effectively prevent the silicon wafer box body from displacing, can automatically remove surrounding dust and improve the detection precision in the detection process.
Description
Technical Field
The invention relates to the technical field of silicon wafer box detection, in particular to a silicon wafer box detection clamping frame.
Background
At present, solar cells are increasingly widely used as new green energy sources, and the most widely used solar cells are crystalline silicon solar cells, namely, crystalline silicon wafers are used as base materials for manufacturing the solar cells, and the crystalline silicon wafers are required to be placed in a silicon wafer box for storage after being processed.
When the silicon chip box is stored, the silicon chips are directly inserted into the silicon chip box, and once the inside of the silicon chip box deforms, the surface of the silicon chip is scratched and damaged, so that the silicon chip box is scrapped.
The existing silicon wafer box detection device in the current market is easy to displace when detecting a silicon wafer box, so that the detection result is not accurate and misjudgment is easy to generate.
Disclosure of Invention
The invention aims to solve the problem that a silicon wafer box is easy to displace and the like in the prior art, and provides a silicon wafer box detection clamping frame.
In order to achieve the purpose, the invention adopts the following technical scheme:
silicon wafer box detects holding frame, including first box and second box, still include: the first detection plate and the guide rod are connected in the second box body in a lifting manner; the supporting frame is fixedly connected to the top of the first box body; the fixed cylinder is fixedly connected to the support frame and is used for being inserted into the through hole of the silicon wafer box body; a clamping mechanism capable of clamping the silicon wafer box body through a guide rod is arranged in the fixed cylinder; the pressing plate is connected to the first box body in a sliding mode and is matched with the upper surface of the silicon wafer box body; a pressing mechanism capable of controlling the pressing plate to move downwards is arranged in the first box body; the inner wall of the top of the second box body is provided with an air cylinder, the output end of the air cylinder is connected with a moving plate, and the first detection plate is connected to the bottom of the moving plate; a third box body is arranged at the top of the second box body, a first motor is arranged in the third box body, the output end of the first motor is connected with a first gear, the top of the second box body is rotatably connected with a first threaded sleeve, the first threaded sleeve is fixedly connected with a second gear which is meshed with the first gear, and a first threaded rod is connected in the first threaded sleeve in a threaded manner; the guide rod is fixedly connected to the bottom of the first threaded rod, and the moving plate slides on the guide rod.
In order to realize carrying out the centre gripping through the guide bar to silicon chip box body, preferably, fixture includes slider and push rod, be equipped with the second recess in the solid fixed cylinder, slider sliding connection is in the second recess, it has the third slide still to slide connection in the second recess, be connected with the second spring between third slide and the slider, the push rod is connected at the third slide lateral wall, the push rod offsets with the through-hole inner wall, the slider offsets with the guide bar lateral wall.
In order to realize that the clamp plate moves down, preferably, the pushing mechanism includes second motor and second threaded rod, the second motor is located the first box, second threaded rod fixed connection is in the clamp plate bottom, threaded connection has the second thread bush on the second threaded rod, second thread bush bottom fixedly connected with sixth gear, first box internal rotation is connected with first pivot and second pivot, fixedly connected with and the fifth gear that sixth gear meshing is connected in the second pivot, be equipped with the fourth gear on the first pivot, the output of second motor is connected with the third gear who is connected with fourth gear meshing, be equipped with the automatic mechanism of skidding between first pivot and the second pivot.
In order to prevent that the clamp plate from excessively pushing down silicon chip box body, furtherly, the automatic mechanism of skidding includes square concave cylinder and circular slab, square concave cylinder fixed connection is at first pivot top, circular slab fixed connection is in second pivot bottom, be equipped with the third spring in the square concave cylinder, third spring top is equipped with square board, be equipped with spherical lug on the square board, spherical lug and circular slab mutually support.
In order to suck away surrounding dust, preferably, the output end of the second motor is connected with a ratchet wheel and a fan, the top of the first box body is connected with a protective net, the ratchet wheel and the fan are located at the bottom of the protective net, an air outlet is formed in the top of the first box body, and a pipeline is connected to the bottom of the air outlet.
In order to realize automatic detection, preferably, a first groove is formed in the moving plate, a first sliding plate and a second sliding plate are connected in the first groove in a sliding mode, a first spring is connected between the first sliding plate and the second sliding plate, the first detection plate is fixedly connected to the bottom of the first sliding plate, a conducting strip is arranged on the second sliding plate, and the first groove is provided with two electrode plates which are separated from each other.
In order to prevent the first detection plate and the silicon wafer box body from being staggered, preferably, the moving plate is connected with a second detection plate in a sliding mode, the side wall of the moving plate is connected with a fixed screw in a threaded mode, and one end of the fixed screw is connected with the clamping plate in a rotating mode.
Compared with the prior art, the invention provides a silicon wafer box detection clamping frame, which has the following beneficial effects: this silicon chip box detects holding frame, before the detection, through manual this internal with the second pick-up plate insert silicon chip box, prevent silicon chip box body and first pick-up plate damage, through mutually supporting of guide bar and clamp plate, can prevent effectively that silicon chip box body from producing the displacement in the testing process, improve and detect the accuracy.
Compared with the existing detection device in the current market, the silicon wafer box detection clamping frame can effectively prevent the silicon wafer box body from displacing, can automatically remove surrounding dust and improve the detection precision in the detection process.
Drawings
FIG. 1 is a schematic structural view of a silicon wafer cassette inspection holder according to the present invention;
FIG. 2 is a first schematic view of a partial structure of a wafer cassette inspection holder according to the present invention;
FIG. 3 is an enlarged view of the portion A of the wafer cassette inspection holder of FIG. 2 according to the present invention;
FIG. 4 is an enlarged view of the portion B of the wafer cassette inspection holder of FIG. 2 according to the present invention;
FIG. 5 is a schematic view of a partial structure of a silicon wafer cassette detection holder according to the present invention;
FIG. 6 is an enlarged view of the portion C of the wafer cassette inspection holder of FIG. 5 according to the present invention;
FIG. 7 is a schematic structural diagram of a first detecting plate of a silicon wafer cassette detecting and clamping rack according to the present invention;
fig. 8 is a schematic structural diagram of a silicon wafer box body of the silicon wafer box detection clamping frame provided by the invention.
In the figure: 1. a first case; 101. a second case; 102. a third box body; 2. a cylinder; 201. moving the plate; 202. a first detection board; 203. a first groove; 3. a first slide plate; 301. a first spring; 302. a second slide plate; 303. a conductive sheet; 304. an electrode sheet; 4. a second detection board; 401. fixing the screw rod; 402. a clamping plate; 5. a first motor; 501. a first gear; 502. a second gear; 503. a first threaded sleeve; 504. a first threaded rod; 505. a guide bar; 6. a silicon wafer box body; 601. a support frame; 602. a fixed cylinder; 603. a through hole; 7. a second groove; 701. a slider; 702. a second spring; 703. a third slide plate; 704. a push rod; 8. pressing a plate; 801. a second threaded rod; 9. a second motor; 901. a third gear; 902. a first rotating shaft; 903. a fourth gear; 10. a square concave cylinder; 1001. a third spring; 1002. a square plate; 1003. a spherical bump; 11. a second rotating shaft; 1101. a circular plate; 12. a fifth gear; 1201. a sixth gear; 1202. a second threaded sleeve; 13. a ratchet wheel; 1301. a fan; 1302. a protective net; 14. an air outlet; 1401. a pipeline.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Example 1: referring to fig. 1 to 8, the silicon wafer cassette detection clamping frame includes a first box 1 and a second box 101, and further includes: the first detection plate 202 and the guide rod 505 are connected in the second box 101 in a lifting way; the supporting frame 601 is fixedly connected to the top of the first box body 1; the fixed cylinder 602 is fixedly connected to the support frame 601 and is used for being inserted into the through hole 603 of the silicon wafer box body 6; a clamping mechanism capable of clamping the silicon wafer box body 6 through the guide rod 505 is arranged in the fixed cylinder 602; the pressing plate 8 is connected to the first box body 1 in a sliding mode and is matched with the upper surface of the silicon wafer box body 6; a pressing mechanism capable of controlling the pressing plate 8 to move downwards is arranged in the first box body 1.
During detection, the silicon wafer box body 6 is placed on the supporting frame 601, the through hole 603 is sleeved on the fixing cylinder 602, the guide rod 505 is moved downwards, the silicon wafer box body 6 is fixed through the clamping mechanism, and the silicon wafer box body 6 is prevented from displacing.
Then the silicon wafer box body 6 is fixed again through a pressing mechanism in the first box body 1.
The through hole 603 is a hole reserved in the manufacturing process of the silicon wafer box body 6, and is convenient to fix during detection.
The inner wall of the top of the second box 101 is provided with a cylinder 2, the output end of the cylinder 2 is connected with a moving plate 201, and a first detection plate 202 is connected to the bottom of the moving plate 201.
During detection, the air cylinder 2 is started, the air cylinder 2 drives the first detection plate 202 to move through the moving plate 201, and the silicon wafer cassette body 6 is detected through the first detection plate 202.
The top of the second box 101 is provided with a third box 102, a first motor 5 is arranged in the third box 102, the output end of the first motor 5 is connected with a first gear 501, the top of the second box 101 is rotatably connected with a first threaded sleeve 503, the first threaded sleeve 503 is fixedly connected with a second gear 502 meshed with the first gear 501, the first threaded sleeve 503 is internally connected with a first threaded rod 504, a guide rod 505 is fixedly connected to the bottom of the first threaded rod 504, and the moving plate 201 slides on the guide rod 505.
The clamping mechanism comprises a sliding block 701 and a push rod 704, a second groove 7 is formed in the fixed cylinder 602, the sliding block 701 is connected into the second groove 7 in a sliding mode, a third sliding plate 703 is further connected into the second groove 7 in a sliding mode, a second spring 702 is connected between the third sliding plate 703 and the sliding block 701, the push rod 704 is connected to the side wall of the third sliding plate 703, the push rod 704 abuts against the inner wall of the through hole 603, and the sliding block 701 abuts against the side wall of the guide rod 505.
When the first motor 5 is started, the first motor 5 drives the first threaded sleeve 503 to rotate through the first gear 501 and the second gear 502, the first threaded sleeve 503 drives the first threaded rod 504 to move downwards, the first threaded rod 504 drives the guide rod 505 to move downwards, the guide rod 505 slides in the moving plate 201, and when the guide rod 505 stops moving, the moving plate 201 can improve the smoothness of downward sliding through the guide rod 505.
The first thread bushings 503 are two in bilateral symmetry design, the first threaded rods 504 are connected to the two first thread bushings 503 through threads, and the second gears 502 are fixedly connected to the two first thread bushings 503 and meshed with the first gears 501.
Both first threaded rods 504 are turned in the same direction.
When the guide rod 505 moves downwards into the fixed cylinder 602, the sliding block 701 is pushed to extrude the second spring 702, the second spring 702 pushes the third sliding plate 703 to move after being extruded, and the third sliding plate 703 abuts against the inner wall of the through hole 603 through the push rod 704, so that the fixing effect is realized.
Example 2: referring to fig. 1 to 6, on the basis of embodiment 1, the pressing mechanism further includes a second motor 9 and a second threaded rod 801, the second motor 9 is located in the first box 1, the second threaded rod 801 is fixedly connected to the bottom of the pressing plate 8, a second threaded sleeve 1202 is threadedly connected to the second threaded rod 801, a sixth gear 1201 is fixedly connected to the bottom of the second threaded sleeve 1202, a first rotating shaft 902 and a second rotating shaft 11 are rotatably connected to the first box 1, a fifth gear 12 meshed with the sixth gear 1201 is fixedly connected to the second rotating shaft 11, a fourth gear 903 is arranged on the first rotating shaft 902, a third gear 901 meshed with the fourth gear 903 is connected to an output end of the second motor 9, and an automatic slipping mechanism is arranged between the first rotating shaft 902 and the second rotating shaft 11.
The second threaded rods 801 and the pressing plate 8 are fixed left and right, and the two second threaded rods 801 are connected with second threaded sleeves 1202 in a threaded mode and driven to rotate through a second motor 9.
The two second threaded rods 801 are rotated in the same direction.
The automatic slip mechanism includes square concave cylinder 10 and circular plate 1101, and square concave cylinder 10 fixed connection is at first pivot 902 top, and circular plate 1101 fixed connection is in 11 bottoms of second pivots, is equipped with third spring 1001 in the square concave cylinder 10, and third spring 1001 top is equipped with square board 1002, is equipped with spherical lug 1003 on the square board 1002, and spherical lug 1003 mutually supports with circular plate 1101.
The bottom of the square plate 1002 is provided with a hemispherical groove, and the spherical bump 1003 is propped against the hemispherical groove through a third spring 1001.
And starting the second motor 9, wherein the second motor 9 drives the first rotating shaft 902 to rotate, the first rotating shaft 902 drives the second rotating shaft 11 to rotate, the second rotating shaft 11 drives the second threaded sleeve 1202 to rotate, and the second threaded sleeve 1202 drives the second threaded rod 801 to move downwards, so that the pressing plate 8 is tightly attached to the upper surface of the silicon wafer box body 6.
When the pressing plate 8 is tightly attached to the upper surface of the silicon wafer box body 6, the torque borne between the square plate 1002 and the circular plate 1101 is increased, the spherical bump 1003 moves downwards under the action of the torque and is separated from the circular plate 1101, the square concave cylinder 10 and the square plate 1002 idle rotate, the circular plate 1101 is stationary, and the pressing plate 8 stops moving.
In the process of descending the pressing plate 8, or the pressing plate 8 becomes loose in the process of pressing the silicon wafer box body 6 downwards, the spherical bump 1003 is in contact with the circular plate 1101 under the action of the third spring 1001, the circular plate 1101 is driven to rotate, and the pressing plate 8 is used for pressing the silicon wafer box body 6 in real time.
Example 3: referring to fig. 1 to 6, on the basis of embodiment 2, further, an output end of the second motor 9 is connected with a ratchet 13 and a fan 1301, a protective net 1302 is connected to a top of the first box 1, the ratchet 13 and the fan 1301 are both located at a bottom of the protective net 1302, an air outlet 14 is arranged at the top of the first box 1, and a pipeline 1401 is connected to the bottom of the air outlet 14.
The second motor 9 drives the fan 1301 to rotate, negative pressure is formed at the protective net 1302, dust is sucked into the air outlet 14, the dust around the detection frame is discharged through the pipeline 1401 through the fan 1301, and the detection result is prevented from being affected by the dust.
Since the fan 1301 is directly below the detection shelf, the airflow does not affect the first detection plate 202.
When the second motor 9 rotates in reverse, the fan 1301 is stationary via the ratchet 13.
Example 4: referring to fig. 1 to 8, on the basis of embodiment 3, further, a first groove 203 is disposed in the moving plate 201, a first sliding plate 3 and a second sliding plate 302 are slidably connected to the first groove 203, a first spring 301 is connected between the first sliding plate 3 and the second sliding plate 302, the first detection plate 202 is fixedly connected to the bottom of the first sliding plate 3, a conductive plate 303 is disposed on the second sliding plate 302, and two electrode plates 304 separated from each other are disposed in the first groove 203.
The moving plate 201 is connected with a second detection plate 4 in a sliding mode, the side wall of the moving plate 201 is connected with a fixed screw 401 in a threaded mode, and one end of the fixed screw 401 is rotatably connected with a clamping plate 402.
During detection, the first detection plate 202 moves downwards and is inserted into the silicon wafer box body 6, when detection is carried out, if the silicon wafer box body 6 is internally deformed, the first detection plate 202 can be influenced, friction can occur between the first detection plate 202 and the silicon wafer box body 6, so that the first detection plate 202 moves upwards, the first detection plate 202 drives the second sliding plate 302 to move upwards through the first sliding plate 3, the conducting plate 303 is made to be in contact with the two electrode plates 304, the circuits of the two electrode plates 304 are conducted, alarm is achieved, and whether deformation occurs in the silicon wafer box body 6 or not can be automatically judged.
The two electrode plates 304 are externally connected with an alarm circuit, and when the conducting plate 303 is contacted with the two electrode plates 304, the alarm circuit is conducted.
Before detection, the second detection plate 4 can be manually slid and inserted into the silicon wafer box body 6, so that the silicon wafer box body 6 and the first detection plate 202 are prevented from being mutually dislocated and damaging the silicon wafer box body 6 and the first detection plate 202.
If the second detection plate 4 can be inserted into the silicon wafer box body 6, the silicon wafer box body 6 and the first detection plate 202 are aligned with each other, the test can be carried out, and then the second detection plate 4 is pulled out for the test.
If the second detection plate 4 can not be inserted into the silicon wafer box body 6, the mutual dislocation between the silicon wafer box body 6 and the first detection plate 202 is shown, and the position of the silicon wafer box body 6 is continuously readjusted until the silicon wafer box body can be inserted.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (7)
1. Silicon chip box detects holding frame, including first box (1) and second box (101), its characterized in that still includes:
the first detection plate (202) and the guide rod (505) are connected in the second box body (101) in a lifting manner;
the supporting frame (601) is fixedly connected to the top of the first box body (1);
the fixed cylinder (602) is fixedly connected to the support frame (601) and is used for being inserted into a through hole (603) of the silicon wafer box body (6);
a clamping mechanism capable of clamping the silicon wafer box body (6) through a guide rod (505) is arranged in the fixed cylinder (602);
the pressing plate (8) is connected to the first box body (1) in a sliding mode and is matched with the upper surface of the silicon wafer box body (6);
a pressing mechanism capable of controlling the pressing plate (8) to move downwards is arranged in the first box body (1);
an air cylinder (2) is arranged on the inner wall of the top of the second box body (101), the output end of the air cylinder (2) is connected with a moving plate (201), and the first detection plate (202) is connected to the bottom of the moving plate (201);
a third box body (102) is arranged at the top of the second box body (101), a first motor (5) is arranged in the third box body (102), the output end of the first motor (5) is connected with a first gear (501), the top of the second box body (101) is rotatably connected with a first threaded sleeve (503), a second gear (502) meshed with the first gear (501) is fixedly connected onto the first threaded sleeve (503), and a first threaded rod (504) is connected with the first threaded sleeve (503) in a threaded manner;
the guide rod (505) is fixedly connected to the bottom of the first threaded rod (504), and the moving plate (201) slides on the guide rod (505).
2. The silicon wafer cassette detection clamping frame as claimed in claim 1, wherein the clamping mechanism comprises a sliding block (701) and a push rod (704), a second groove (7) is formed in the fixed cylinder (602), the sliding block (701) is slidably connected in the second groove (7), a third sliding plate (703) is further slidably connected in the second groove (7), a second spring (702) is connected between the third sliding plate (703) and the sliding block (701), the push rod (704) is connected to the side wall of the third sliding plate (703), the push rod (704) abuts against the inner wall of the through hole (603), and the sliding block (701) abuts against the side wall of the guide rod (505).
3. The silicon wafer box detection clamping frame according to claim 1, wherein the pressing mechanism comprises a second motor (9) and a second threaded rod (801), the second motor (9) is positioned in the first box body (1), the second threaded rod (801) is fixedly connected to the bottom of the pressing plate (8), a second threaded sleeve (1202) is connected to the second threaded rod (801) in a threaded manner, a sixth gear (1201) is fixedly connected to the bottom of the second threaded sleeve (1202), a first rotating shaft (902) and a second rotating shaft (11) are rotatably connected to the first box body (1), a fifth gear (12) meshed with the sixth gear (1201) is fixedly connected to the second rotating shaft (11), a fourth gear (903) is arranged on the first rotating shaft (902), and a third gear (901) meshed with the fourth gear (903) is connected to the output end of the second motor (9), an automatic slipping mechanism is arranged between the first rotating shaft (902) and the second rotating shaft (11).
4. The silicon wafer cassette detection clamping frame as claimed in claim 3, wherein the automatic slipping mechanism comprises a square concave cylinder (10) and a circular plate (1101), the square concave cylinder (10) is fixedly connected to the top of the first rotating shaft (902), the circular plate (1101) is fixedly connected to the bottom of the second rotating shaft (11), a third spring (1001) is arranged in the square concave cylinder (10), a square plate (1002) is arranged on the top of the third spring (1001), a spherical bump (1003) is arranged on the square plate (1002), and the spherical bump (1003) is matched with the circular plate (1101).
5. The silicon wafer box detection clamping frame according to claim 3, wherein the output end of the second motor (9) is connected with a ratchet wheel (13) and a fan (1301), the top of the first box body (1) is connected with a protective net (1302), the ratchet wheel (13) and the fan (1301) are both positioned at the bottom of the protective net (1302), the top of the first box body (1) is provided with an air outlet (14), and the bottom of the air outlet (14) is connected with a pipeline (1401).
6. The silicon wafer cassette detection clamping frame as claimed in claim 1, wherein a first groove (203) is formed in the moving plate (201), a first sliding plate (3) and a second sliding plate (302) are slidably connected in the first groove (203), a first spring (301) is connected between the first sliding plate (3) and the second sliding plate (302), the first detection plate (202) is fixedly connected to the bottom of the first sliding plate (3), a conducting plate (303) is arranged on the second sliding plate (302), and two electrode plates (304) which are separated from each other are arranged in the first groove (203).
7. The silicon wafer cassette detection clamping frame as claimed in claim 1, wherein a second detection plate (4) is slidably connected in the moving plate (201), a fixed screw (401) is threadedly connected to the side wall of the moving plate (201), and a clamping plate (402) is rotatably connected to one end of the fixed screw (401).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111279994.1A CN113701613A (en) | 2021-11-01 | 2021-11-01 | Silicon wafer box detection clamping frame |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111279994.1A CN113701613A (en) | 2021-11-01 | 2021-11-01 | Silicon wafer box detection clamping frame |
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| CN113701613A true CN113701613A (en) | 2021-11-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111279994.1A Pending CN113701613A (en) | 2021-11-01 | 2021-11-01 | Silicon wafer box detection clamping frame |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117228165A (en) * | 2023-11-14 | 2023-12-15 | 山东天合京工新材料科技有限公司 | Storage equipment for engineering plastic parts and application method thereof |
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| CN117228165B (en) * | 2023-11-14 | 2024-03-08 | 山东天合京工新材料科技有限公司 | Storage equipment for engineering plastic parts and application method thereof |
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