CN113696604A - Method for manufacturing PCB with same panel with high carbon resistance/low carbon resistance - Google Patents
Method for manufacturing PCB with same panel with high carbon resistance/low carbon resistance Download PDFInfo
- Publication number
- CN113696604A CN113696604A CN202110889903.XA CN202110889903A CN113696604A CN 113696604 A CN113696604 A CN 113696604A CN 202110889903 A CN202110889903 A CN 202110889903A CN 113696604 A CN113696604 A CN 113696604A
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- Prior art keywords
- carbon
- pcb
- printing
- resistance
- screen
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Links
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 112
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 108
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims description 13
- 238000007639 printing Methods 0.000 claims abstract description 48
- 238000007650 screen-printing Methods 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000009835 boiling Methods 0.000 claims abstract description 4
- 238000007790 scraping Methods 0.000 claims abstract description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 30
- 239000003623 enhancer Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000010023 transfer printing Methods 0.000 claims description 4
- 238000003756 stirring Methods 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/12—Machines with auxiliary equipment, e.g. for drying printed articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F23/00—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing
- B41F23/04—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing by heat drying, by cooling, by applying powders
- B41F23/044—Drying sheets, e.g. between two printing stations
- B41F23/0463—Drying sheets, e.g. between two printing stations by convection
- B41F23/0466—Drying sheets, e.g. between two printing stations by convection by using heated air
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
Abstract
The invention belongs to the field of circuit board processing and production, and provides a high carbon resistance/low carbon resistance manufacturing method for a PCB (printed circuit board) with a panel, which comprises the following steps: manufacturing a screen printing plate: arranging a printing surface of an area A and a printing surface of an area B on a PCB substrate, and manufacturing a screen printing plate; boiling oil: fully stirring the carbon ink to reach the required viscosity; adjusting the net support alignment: adjusting the screen distance to align the graphic area on the screen plate with the carbon ink graphic to be printed on the PCB; and (3) silk-screen printing: carrying out initial silk-screen printing on the PCB; printing ink: pouring the prepared carbon ink on a non-graphic area of the screen printing plate, and scraping and printing the carbon ink on the PCB by using a scraper to determine the carbon resistance value; baking by a heat transfer machine: and placing the PCB of the carbon ink in a thermal transfer machine for thermal transfer baking to dry and solidify the carbon ink so as to prepare the carbon film conductive layer. The PCB manufactured by the PCB board can realize compatibility of high carbon resistance/low carbon resistance on the same panel, and can meet the requirements of high carbon resistance and low carbon resistance.
Description
Technical Field
The invention belongs to the field of circuit board processing and production, and particularly relates to a high carbon resistance/low carbon resistance manufacturing method for a PCB (printed circuit board) with a panel.
Background
The carbon oil Printed Circuit Board (PCB) is a PCB having a carbon film conductive pattern formed by coating a carbonaceous conductive ink (referred to as carbon ink for short) on a PCB substrate and curing the carbon ink. The carbon oil has good conductivity, so the carbon oil PCB is widely used in the electronic industry, and is used for household appliance switches, automobile keys, military remote control explosion devices, aerospace engineering and myriameter high altitude control automatic key devices. However, the carbon oil PCB produced by the existing production technology only produces a high-carbon resistance plate or only produces a low-carbon resistance plate, while the carbon oil produced in Europe, America, Japan and Korean has the low resistance ink less than or equal to 50 omega +/-15 percent, and the high-carbon resistance ink only has 2 types of 3000 omega and 5000 omega +/-20 percent, so that the carbon oil PCB cannot be used if the high-carbon resistance value reaches 7500 omega or more.
Disclosure of Invention
The invention aims to provide a method for manufacturing a PCB with a high carbon resistance/a low carbon resistance on the same panel, and aims to solve the problem that the high carbon resistance and the low carbon resistance cannot be simultaneously produced on the same panel in the prior art, so that the limitation of the carbon resistance of the PCB on the use performance is broken through.
The invention is realized in such a way that a method for manufacturing a PCB with a panel with high carbon resistance/low carbon resistance comprises the following steps:
manufacturing a screen printing plate: arranging a printing surface of an area A and a printing surface of an area B on a PCB substrate, curing a solder resist on the PCB substrate, manufacturing a carbon ink pattern to be printed on the PCB cured with the solder resist, mounting the carbon ink pattern on a screen printing machine, manufacturing a screen printing plate, mounting the screen printing plate on the screen printing machine, and sealing a frame of the screen printing plate and a non-pattern area on the screen printing plate by using glue;
boiling oil: the carbon ink is sufficiently stirred to achieve the desired viscosity while different amounts of the friction enhancer are added, wherein the amount of the friction enhancer is in the range of: 15g-150 g;
adjusting the net support alignment: adjusting the screen distance, adjusting the stroke of a scraper to ensure that the scraper stroke can cover the graphic area on the screen plate during silk-screen printing, and adjusting the relative position of the screen plate to align the graphic area on the screen plate with the carbon ink graphic to be printed on the PCB;
and (3) silk-screen printing: carrying out initial-stage silk-screen printing on the PCB obtained by adjusting the alignment of the frame net;
printing ink: pouring the prepared carbon ink on a non-graphic area of the screen printing plate, and scraping and printing the carbon ink on the PCB by using a scraper to determine a carbon resistance value;
baking by a heat transfer machine: and placing the PCB printed with the carbon ink in a thermal transfer printing machine for thermal transfer printing and baking to dry and solidify the carbon ink to prepare the carbon film conductive layer.
In the manufacturing of the screen printing plate, the printing surface in the area A is printed with high-resistance carbon oil, the carbon resistance value of the high-resistance carbon oil is 5000 omega +/-15%, and the printing surface in the area B is printed with low-resistance carbon oil, the carbon resistance value of the low-resistance carbon oil is 50 omega +/-10%.
And adjusting the screen frame to be aligned, wherein the screen distance is adjusted to be 3.5-4.5 mm, so that the stroke of the scraper can cover the graphic area on the screen plate during silk-screen printing.
And in the silk-screen printing process, the printing surfaces of the area A and the area B on the PCB are subjected to preliminary trial printing so as to ensure that the functions of the printing surfaces of the area A and the area B are realized.
The ink is printed, and the carbon resistance value base PoCalculated as: poWhere R represents carbon oil sheet resistance, L represents carbon oil printing length, T: carbon oil printing width, W: the printing thickness of the carbon oil, the value range of T: t is more than or equal to 12 mu m and less than or equal to 25 mu m.
Baking by the heat transfer machine, wherein the baking temperature is 130-150 ℃; the baking time is as follows: 30-60 min.
Compared with the prior art, the high carbon resistance/low carbon resistance manufacturing method for the same-panel PCB can realize compatibility of high carbon resistance/low carbon resistance on the same panel of the PCB manufactured by the same-panel PCB, so that the resistance value of a carbon film can be well controlled, and the manufactured carbon oil PCB can meet the requirements of high carbon resistance and low carbon resistance.
Drawings
FIG. 1: the embodiment of the invention provides a method for manufacturing a PCB with a high carbon resistance/a low carbon resistance
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The present invention improves the prior art, and the specific process is shown in fig. 1, which mainly comprises the following steps:
manufacturing a screen printing plate: the method comprises the steps of arranging an area A printing surface and an area B printing surface on a PCB substrate, printing high-resistance carbon oil on the area A printing surface, enabling the carbon resistance value of the high-resistance carbon oil to be 5000 omega +/-15%, printing low-resistance carbon oil on the area B printing surface, enabling the carbon resistance value of the low-resistance carbon oil to be 50 omega +/-10%, enabling the high-low carbon resistance value of the high-resistance carbon oil to be compatible with the high-low carbon resistance value of the area A, then curing a PCB board with solder resist to manufacture a carbon ink pattern to be printed, then installing the carbon ink pattern on a screen printing machine, manufacturing a screen printing plate, installing the screen printing plate on the screen printing machine, and sealing the frame of the screen printing plate and a non-pattern area on the screen printing plate with glue.
Boiling oil: the carbon ink is fully stirred to reach the required viscosity, and meanwhile, the resistance increasing agents with different contents are added into the carbon ink to finish debugging of two types of carbon oil with high carbon resistance and low carbon resistance, so that the condition of single carbon resistance is avoided, and the compatibility of high carbon resistance/low carbon resistance of the PCB and a panel is guaranteed.
Adjusting the net support alignment: adjusting the screen distance, adjusting the stroke of a scraper to ensure that the scraper stroke can cover the graphic area on the screen plate during silk-screen printing, and adjusting the relative position of the screen plate to align the graphic area on the screen plate with the carbon ink graphic to be printed on the PCB.
And (3) silk-screen printing: and carrying out preliminary trial printing on the printing surfaces of the area A and the area B on the PCB to ensure the function realization of the printing surfaces of the area A and the area B.
Printing ink: pouring the prepared carbon ink into a non-graphic area of the screen printing plate, scraping and printing the carbon ink on the PCB by using a scraper, and simultaneously determining the printing length and the printing thickness of the carbon ink according to the requirements of a client, wherein the value range of the printing width of the carbon ink is as follows: 12-25 μm.
Baking by a heat transfer machine: setting the temperature of the thermal transfer printer to be 130-150 ℃, and setting the baking time to be: drying and curing the carbon ink for 30-60min to obtain the carbon film conductive layer.
During silk-screen printing, once the screen printing plate is stuck on a printing stock, the printing quality is seriously influenced, and in order to avoid the screen printing plate being stuck on a bearing object, a certain distance must be kept between the screen printing plate and the printing stock. The screen distance is larger, the scraper is larger in pressure when the scraper scrapes and prints, the scraper is deformed, the thickness of a printed carbon film is inconsistent, the screen distance is too small, a silk screen cannot be immediately bounced off a PCB, and the pattern is blurred. Meanwhile, the screen distance is set to be 3.5-4.5 mm, so that the thickness of the carbon ink for silk screen printing is ensured, the tension and the screen distance of the screen printing plate are well balanced, the carbon ink printed on the PCB is ensured to be uniform in thickness on the basis of sufficient thickness, and the accurate control of the carbon resistance is further ensured.
In order to ensure the thickness of the carbon ink for screen printing, the viscosity of the carbon ink needs to be stirred to a certain range during oil supply, in the invention, the viscosity of the carbon ink is preferably within the range of 350-400 dpa.s, so that the carbon ink can be well scraped and printed on a PCB (printed circuit board) by a scraper, the tension, the mesh spacing and the viscosity of a screen printing plate are well balanced, and meanwhile, in order to realize compatibility of high carbon resistance and low carbon resistance on the same panel, in the invention, different doses of resistance increasing agents are preferably added into the carbon ink, and the addition amount of the resistance increasing agents is within the range: 15g-150g, and by adding a proper amount of the resistance increasing agent, the added amount of the resistance increasing agent is large, the carbon resistance value can be doubled and increased, and meanwhile, the viscosity of the ink can be kept unchanged.
Preferably, in a specific implementation, the carbon resistance values involved in the addition of the friction enhancer are as shown in table 1 below:
| resistance increasing agent (g) | 0 | 15 | 30 | 50 | 60 | 100 | 150 |
| Carbon resistance value (omega) | 30 | 300 | 900 | 1500 | 3000 | 5000 | 8000 |
For screen alignment adjustment, in the present embodiment, specifically, when the scraper scrapes on the screen, the scraper angle is an included angle of 40 to 55 degrees, which is an angle measured between the scraper and the screen in the printing direction. The scraper angle is too small, the scraper is easy to deform, the scraper is not suitable for large-area screen printing, the carbon ink extrusion amount is large, the scraper angle is too large, and the carbon ink extrusion amount is small.
Further, in the step of printing ink, the PCB determines the printing length and the printing thickness of the carbon oil according to the customer requirements, and in this embodiment, specifically, the range of the printing width of the carbon oil is: 12-25 μm.
Specifically, in the step of baking the heat transfer machine, the temperature of the heat transfer machine is set to be 130-150 ℃, and the baking time is set as follows: and (3) drying the carbon ink on the PCB for 30-60min by using an intermittent hot air circulation oven or a continuous tunnel oven to solidify the carbon ink into a carbon film conductive layer. Thereby manufacturing the qualified carbon oil PCB.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. A manufacturing method of a PCB with a panel having high carbon resistance/low carbon resistance is characterized by comprising the following steps:
manufacturing a screen printing plate: arranging a printing surface of an area A and a printing surface of an area B on a PCB substrate, curing a solder resist on the PCB substrate, manufacturing a carbon ink pattern to be printed on the PCB cured with the solder resist, and mounting the carbon ink pattern on a screen printing machine to manufacture a screen printing plate;
boiling oil: the carbon ink is sufficiently stirred to achieve the desired viscosity while different amounts of the friction enhancer are added, wherein the amount of the friction enhancer is in the range of: 15g-150 g;
adjusting the net support alignment: adjusting the screen distance, adjusting the stroke of a scraper to ensure that the scraper stroke can cover the graphic area on the screen plate during silk-screen printing, and adjusting the relative position of the screen plate to align the graphic area on the screen plate with the carbon ink graphic to be printed on the PCB;
and (3) silk-screen printing: carrying out initial-stage silk-screen printing on the PCB obtained by adjusting the alignment of the frame net;
printing ink: pouring the prepared carbon ink on a non-graphic area of the screen printing plate, and scraping and printing the carbon ink on the PCB by using a scraper to determine a carbon resistance value;
baking by a heat transfer machine: and placing the PCB printed with the carbon ink in a thermal transfer printing machine for thermal transfer printing and baking to dry and solidify the carbon ink to prepare the carbon film conductive layer.
2. The method according to claim 1, wherein in the screen printing step, the printing surface of the area a is printed with high resistance carbon oil with a carbon resistance of 5000 Ω ± 15%, and the printing surface of the area B is printed with low resistance carbon oil with a carbon resistance of 50 Ω ± 10%.
3. The method as claimed in claim 1, wherein in the step of adjusting the screen mesh alignment, the screen distance is adjusted to 3.5mm to 4.5mm, so as to ensure that the scraper stroke can cover the pattern area on the screen during screen printing.
4. The method according to claim 1, wherein in the step of printing with the ink, the carbon resistance substrate P is printed on the PCBoCalculated as: poWhere R represents carbon oil sheet resistance, L represents carbon oil printing length, T: carbon oil printing width, W: the printing thickness of the carbon oil, the value range of T: t is more than or equal to 12 mu m and less than or equal to 25 mu m.
5. The method for manufacturing the same-panel high/low carbon resistance PCB as in claim 1, wherein in the step of baking by the heat transfer machine, the baking temperature is 130-150 ℃.
6. The method for manufacturing the same-panel high/low carbon resistance PCB as in claim 1, wherein in the step of baking by the heat transfer machine, the baking time is as follows: 30-60 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110889903.XA CN113696604A (en) | 2021-08-04 | 2021-08-04 | Method for manufacturing PCB with same panel with high carbon resistance/low carbon resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110889903.XA CN113696604A (en) | 2021-08-04 | 2021-08-04 | Method for manufacturing PCB with same panel with high carbon resistance/low carbon resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113696604A true CN113696604A (en) | 2021-11-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110889903.XA Pending CN113696604A (en) | 2021-08-04 | 2021-08-04 | Method for manufacturing PCB with same panel with high carbon resistance/low carbon resistance |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85202831U (en) * | 1985-07-11 | 1987-05-20 | 朱汉雄 | Printed electric resistance |
| CN2175659Y (en) * | 1993-05-10 | 1994-08-31 | 李兰成 | Multifunction micro electric welding machine |
| US20020007743A1 (en) * | 2000-05-09 | 2002-01-24 | Kimiyuki Yamasaki | Apparatus and method of screen printing |
| CN103694796A (en) * | 2013-12-19 | 2014-04-02 | 电子科技大学 | Method for preparing printed circuit board embedded resistor ink-jet printing ink |
| CN104519671A (en) * | 2013-09-26 | 2015-04-15 | 深圳崇达多层线路板有限公司 | Carbon ink PCB and manufacturing method thereof |
| CN110364322A (en) * | 2019-07-17 | 2019-10-22 | 东莞福哥电子有限公司 | A kind of production method of contact swept resistance piece |
| CN110379576A (en) * | 2019-07-25 | 2019-10-25 | 东莞福哥电子有限公司 | A kind of resistor body printing process of more resistance values |
| CN110650583A (en) * | 2018-06-26 | 2020-01-03 | 深圳市璞瑞达薄膜开关技术有限公司 | Communication circuit layer structure and circuit printing method thereof |
| CN110677985A (en) * | 2019-10-25 | 2020-01-10 | 杭州友成电子有限公司 | Carbon film printed board high-conductivity paste resistance value regulation and control method |
-
2021
- 2021-08-04 CN CN202110889903.XA patent/CN113696604A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85202831U (en) * | 1985-07-11 | 1987-05-20 | 朱汉雄 | Printed electric resistance |
| CN2175659Y (en) * | 1993-05-10 | 1994-08-31 | 李兰成 | Multifunction micro electric welding machine |
| US20020007743A1 (en) * | 2000-05-09 | 2002-01-24 | Kimiyuki Yamasaki | Apparatus and method of screen printing |
| CN104519671A (en) * | 2013-09-26 | 2015-04-15 | 深圳崇达多层线路板有限公司 | Carbon ink PCB and manufacturing method thereof |
| CN103694796A (en) * | 2013-12-19 | 2014-04-02 | 电子科技大学 | Method for preparing printed circuit board embedded resistor ink-jet printing ink |
| CN110650583A (en) * | 2018-06-26 | 2020-01-03 | 深圳市璞瑞达薄膜开关技术有限公司 | Communication circuit layer structure and circuit printing method thereof |
| CN110364322A (en) * | 2019-07-17 | 2019-10-22 | 东莞福哥电子有限公司 | A kind of production method of contact swept resistance piece |
| CN110379576A (en) * | 2019-07-25 | 2019-10-25 | 东莞福哥电子有限公司 | A kind of resistor body printing process of more resistance values |
| CN110677985A (en) * | 2019-10-25 | 2020-01-10 | 杭州友成电子有限公司 | Carbon film printed board high-conductivity paste resistance value regulation and control method |
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Application publication date: 20211126 |
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