CN113692182A - Heat dissipation device and electronic equipment - Google Patents
Heat dissipation device and electronic equipment Download PDFInfo
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- CN113692182A CN113692182A CN202110897197.3A CN202110897197A CN113692182A CN 113692182 A CN113692182 A CN 113692182A CN 202110897197 A CN202110897197 A CN 202110897197A CN 113692182 A CN113692182 A CN 113692182A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 210
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
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- 239000004519 grease Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses heat abstractor and electronic equipment. The heat dissipation device comprises a heat dissipation base and heat dissipation fins. The radiating base is used for connecting a heat source, and the radiating fins are arranged on the radiating base; the heat dissipation base transfers heat energy of the heat source to the heat dissipation fins, and the heat dissipation fins can vibrate, so that air is driven to flow, and the heat dissipation efficiency of the heat dissipation fins is improved. In this way, the radiating fin of this application can cause the air vibration through the vibration, and the air vibration forms the air current to accelerate radiating fin's rate of heat dissipation, thereby promote heat abstractor's radiating efficiency.
Description
Technical Field
The present application relates to the field of heat dissipation technologies, and in particular, to a heat dissipation device and an electronic apparatus.
Background
Heat dissipation is a very important link in electronic devices, and particularly, in the current environment of electronic devices with increased functions, increased power consumption and increased integration level along with technological development, the heat dissipation capability can determine whether the electronic devices can fully exert all the performances thereof. If the heat dissipation performance of the electronic device is not good, the electronic device may also operate in a high temperature environment for a long time, which may not only affect the performance of the electronic device, but also shorten the service life of the electronic device.
In order to achieve the purpose of thinner and lighter electronic devices, the integration level of the electronic devices is higher and higher, and the heat flux density is also increased. However, the existing heat dissipation scheme cannot simultaneously achieve heat dissipation and volume, so that the heat dissipation performance is poor. A new heat dissipation structure is needed to solve the problem of poor heat dissipation of electronic devices.
Disclosure of Invention
The technical problem that this application mainly solved provides heat abstractor and electronic equipment, can effectively improve electronic equipment's radiating efficiency.
In order to solve the technical problem, the application adopts a technical scheme that: provided is a heat dissipation device including: heat dissipation base and radiating fin. The heat dissipation base is used for being connected with a heat source, and the heat dissipation fins are installed on the heat dissipation base; the heat dissipation base transfers the heat energy of the heat source to the heat dissipation fins, and the heat dissipation fins can vibrate to drive air to flow, so that the heat dissipation efficiency of the heat dissipation fins is improved.
In order to solve the above technical problem, another technical solution adopted by the present application is: provided is an electronic device including: the application provides a heat abstractor, and circuit board, the circuit board with heat abstractor connects, heat abstractor is used for right the circuit board dispels the heat.
The beneficial effect of this application is: be different from prior art's condition, the heat abstractor's of this application radiating base can derive the heat of heat source, and radiating fin installs on radiating base, and radiating base transmits the heat to radiating fin on. The radiating fins can vibrate, so that air nearby is driven to flow. The air flow is generated by the air flow, the heat dissipation is accelerated under the action of the air flow, and the heat dissipation efficiency of the heat dissipation fins is improved. Therefore, the heat dissipation device is high in heat dissipation efficiency.
Drawings
FIG. 1 is a front view of an embodiment of an electronic device of the present application;
FIG. 2 is a schematic structural diagram of an embodiment of an electronic device of the present application;
FIG. 3 is an exploded view of an embodiment of the heat sink of the present application;
FIG. 4 is an exploded view of an embodiment of a heat dissipation device of the present application;
FIG. 5 is a top view of an embodiment of a heat dissipation device of the present application as installed in an electronic device;
FIG. 6 is a schematic structural view of a heat sink fin and a fixing base in an embodiment of the heat sink device of the present application;
FIG. 7 is a schematic view of a heat sink fin according to another embodiment of the present application;
fig. 8 is a schematic structural view of a heat dissipation fin according to another embodiment of the heat dissipation device of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The application provides a heat dissipation device and an electronic device embodiment. The electronic device may be a Smart Phone (Smart Phone), a PDA (Personal Digital Assistant or tablet Computer), a PC (Personal Computer or Computer), a massager, or an intelligent wearable device such as VR glasses (Virtual Reality), Smart Watch (Smart Watch), Smart bracelet (Smart bracelet), etc. The heat dissipation device is a device for dissipating heat in electronic equipment.
In the description of the present application, reference to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, mechanism, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, mechanisms, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
As shown in fig. 1, fig. 1 is a front view of an embodiment of an electronic device according to the present application, and in the embodiment, the electronic device 10 is VR glasses, that is, a virtual reality glasses device, and is a product using a combination of various technologies such as a simulation technology and a computer graphics man-machine interface technology. In order to enhance the user experience, the user can carry and use the VR glasses conveniently, and the manufacturer often makes the VR glasses lighter and thinner. However, devices such as a circuit board, a battery, and a chip are disposed in the VR glasses, and the thinner and thinner VR glasses have smaller heat dissipation space, and the heat dissipation performance is not good. Poor can seriously influence the running state of VR glasses of heat dispersion to the user also can experience the temperature sensation when wearing VR glasses, influences greatly and uses experience.
Referring to fig. 2, fig. 2 is a schematic structural diagram of an embodiment of an electronic device according to the present application, in the embodiment, the electronic device 10 includes a heat dissipation device 100 and a circuit board 200, and of course, the electronic device 10 may further include a battery (not shown), a system-on-chip (not shown), a display device (not shown), and the like. The heat dissipation device 100 is connected to the circuit board 200, and the heat dissipation device 100 can dissipate heat from the circuit board 200, thereby reducing the temperature of the circuit board 200, maintaining the circuit board 200 at a good working temperature for a long time, and enabling the electronic device 10 to fully exert its performance. And the circuit board 200 is electrically connected to the battery, the circuit board 200 can provide operating power to the heat sink 100. Therefore, the electronic device 10 in the present embodiment can dissipate heat through the heat dissipation device 100 to effectively improve heat dissipation performance, and please refer to the following description of the embodiments of the heat dissipation device 100 of the present application.
Referring to fig. 3, fig. 3 is an exploded schematic view of an embodiment of a heat dissipation device of the present application, wherein the heat dissipation device 100 includes heat dissipation fins 110 and a heat dissipation base 120. The heat dissipation base 120 is used to connect an external heat source, which is a heat generating source outside the heat dissipation device 100, and may be, for example, a battery, a chip, or other circuit components such as an inductor and a capacitor on a circuit board in an electronic device. The heat dissipation fins 110 are mounted on the heat dissipation base 120, and particularly, the heat dissipation fins 110 may be mounted in the fin grooves 121 of the heat dissipation base 120.
In this embodiment, the heat dissipation apparatus 100 may further include a fixing base 130, and the fixing base 130 fixes the heat dissipation fin 110 to the heat dissipation base. Specifically, the fixing base 130 is fixed in the fin slot 121 of the heat sink base 120, the heat sink fin 110 is inserted into the fixing base 130, and the heat sink fin 110 and the fixing base 130 are held in a fixed connection state and are accommodated in the fin slot 121. Alternatively, the fixing base 130 may be fixed in the heat dissipation base 120 by welding, bonding, or the like.
In the present embodiment, the heat dissipation base 120 is connected to a heat source, the heat of the heat source can be transferred to the heat dissipation base 120, and the heat dissipation base 120 transfers the heat to the heat dissipation fins 110. Alternatively, in order to accelerate the heat transfer, the heat dissipation base 120 may be made of a material with high thermal conductivity, such as a metal material, e.g., stainless steel, aluminum, etc.
In the related art, in order to quickly dissipate heat of the heat dissipation base 120 and the heat dissipation fins 110 and to increase heat dissipation efficiency, a fan is often disposed near the heat dissipation device 100. The fan blows air to the heat dissipation fins 110, and the flow of air near the heat dissipation fins 110 is accelerated, so that the heat dissipation efficiency is accelerated. However, the fan needs to occupy a certain installation space, and when the fan is applied to the electronic device, the fan occupies a space of the electronic device, so that the weight of the electronic device is increased, which is contrary to the trend of thinning the electronic device.
In the present embodiment, the heat dissipation fins 110 can vibrate themselves, and the heat dissipation fins 110 promote the air flow near the heat dissipation fins 110 and the heat dissipation base 120 to form an air flow. The heat in the heat dissipation fins 110 and the heat dissipation base 120 is dissipated faster under the flowing of the air flow, so the heat dissipation rate of the heat dissipation fins 110 is increased, and the heat dissipation efficiency of the heat dissipation device 100 is further increased. Compared with the existing fan, the heat dissipation device 100 of the embodiment not only has a good heat dissipation effect, but also occupies a small space and is light in weight.
In this embodiment, the heat dissipation fins 110 are made of piezoelectric ceramic, which is an electronic ceramic material capable of converting electrical energy into mechanical energy, and the spontaneous polarization vector generated by the ferroelectric crystal grains in the piezoelectric ceramic is disoriented and oriented along the electric field direction after the direct current is applied. Therefore, when the direct current is applied to the heat dissipation fins 110, the heat dissipation fins 110 are deformed by the influence of the electric field. If alternating current is applied to the heat dissipation fins 110, the heat dissipation fins 110 will repeatedly deform in two different directions along with the alternating change of the electric field, and further generate vibration. Wherein the vibration frequency and vibration amplitude of the heat dissipating fins 110 are related to the alternating current.
Optionally, the number of the heat dissipation fins 110 is multiple, and the plurality of heat dissipation fins 110 are parallel to each other and are inserted into the fixing base 130 at intervals in the vibration direction. The heat dissipation efficiency of the heat dissipation device 100 can be further improved by adding a plurality of heat dissipation fins 110.
Optionally, the number of the heat dissipation fins 110 is multiple, the heat dissipation fins 110 are parallel to each other, and are inserted into the fixing base 130 at intervals in the vibration direction, and the vibration directions of two adjacent heat dissipation fins 110 at the same time are opposite. At the same time, two adjacent heat dissipation fins 110 are close to each other or far away from each other at the same time, so that the relative speed of the two adjacent heat dissipation fins 110 is twice the vibration speed of one heat dissipation fin 110, and the heat dissipation effect is improved.
Optionally, the surface of the heat dissipating fin 110 may be sprayed with a heat conducting paint, and the heat conducting paint may not only radiate heat away from the heat dissipating fin 110, but also prevent the heat dissipating fin 110 from being affected by water vapor, and may also prevent corrosion and abrasion.
In other embodiments, the heat dissipation fins 110 may also be made of other electrostrictive materials, and the electrostrictive materials are physically deformed under the action of an electric field. The electrostrictive material may be, for example, lead zirconate titanate, barium titanate, lead niobate, or the like. The heat radiating fins 110 may also be made of a magnetostrictive material, such as a nickel-based alloy and an iron-based alloy. When the magnetostrictive material is magnetized in a magnetic field, the magnetostrictive material is elongated or shortened in the magnetization direction, so that the heat dissipation fin 110 can be vibrated by the alternating magnetic field. The above embodiments are only some embodiments in which the heat dissipation fins 110 can vibrate, and all other embodiments in which the heat dissipation efficiency is improved by vibrating the heat dissipation fins 110 are included in the scope of the present application.
Referring to fig. 4, fig. 4 is a schematic diagram of an explosion structure of the heat dissipation device of the present application when applied to an electronic device. The heat dissipation base 120 is connected to the circuit board 200, the circuit board 200 is located on a side of the heat dissipation base 120 facing the heat dissipation fins 110, and the circuit board 200 is a heat source.
Optionally, in order to further increase the heat conduction rate between the heat dissipation base 120 and the circuit board 200, the surface of the circuit board 200 is attached to the heat dissipation base 120, so as to increase the contact area between the heat dissipation base 120 and the circuit board 200.
In the present embodiment, the circuit board 200 and the heat dissipating fins 110 are located on the same side of the heat dissipating base 120, and the circuit board 200 and the heat dissipating fins 110 are disposed adjacently. When the vibration of the heat dissipation fins 110 causes the vibration of the air near the heat dissipation fins 110, the vibration of the air near the circuit board 200 is also driven, and the heat dissipation of the circuit board is accelerated. Meanwhile, the heat of the circuit board 200 may also be transferred to the heat dissipation fins 110 by means of contact.
Alternatively, a first positioning hole 201 may be formed in the circuit board 200, and a first positioning screw hole 122 may be formed in the heat dissipation base 120, and a screw (not shown) may be inserted through the first positioning hole 201 and engaged with the first positioning screw hole 122 to connect the circuit board 200 and the heat dissipation base 120. Further, the heat dissipation base 120 may further include a first positioning post 123, the circuit board 200 may include a second positioning hole 202, and the first positioning post 123 penetrates through the second positioning hole 202 to further enhance the connection and fixation between the circuit board 200 and the heat dissipation base 120, so as to ensure that the circuit board 200 and the heat dissipation base 120 are maintained in a state of maximum contact area.
Optionally, a second heat source 300 may be further attached to a side of the heat dissipation base 120 facing away from the circuit board 200. When the heat dissipation base 120 is applied to an electronic device, the heat source may be a high heat-generating device such as a chip, a power supply, a camera, etc. in addition to the circuit board 200, and therefore, heat dissipation of the device is also required. The second heat source 300 may be disposed opposite to the heat dissipation fins 110, and the second heat source 300 and the heat dissipation fins 110 are located at two sides of the heat dissipation base 120. The second heat source 300 contacts the heat dissipation base 120 to transfer heat to the heat dissipation base 120, and the heat dissipation base 120 transfers heat to the heat dissipation fins 110 for dissipation.
Optionally, a contact surface of the heat sink base 120 and the circuit board 200 and/or a contact surface of the heat sink base 120 and the second heat source 300 may be coated with a heat conductive silicone grease to accelerate the rate of heat transfer from the circuit board 200 or the second heat source 300 to the heat sink base 120.
As shown in fig. 5, fig. 5 is a top view of the heat dissipation device of the present application when mounted on an electronic device, in this embodiment, in order to keep the contact surface area of the circuit board 200 and the heat dissipation base 120 to be the maximum, the projection of the circuit board 200 on the heat dissipation base 120 completely falls into the heat dissipation base 120. In this embodiment, the number of the fixing bases 130 may be two, and the heat dissipation fins 110 are respectively inserted into each fixing base 130 to further dissipate heat of different areas of the heat dissipation base 120.
Further, as shown in fig. 6, fig. 6 is a schematic structural view of a heat dissipation fin and a fixing base in an embodiment of the heat dissipation device of the present application. In the present embodiment, the heat dissipation fins 110 are made of a piezoelectric ceramic material, and the heat dissipation fins 110 vibrate under the action of an alternating current. The end of the heat sink fin 110 inserted into the fixing base 130 is provided with an electrode terminal 111, and the electrode terminal 111 may include a positive electrode terminal and a negative electrode terminal, and the electrode terminal 111 is used for supplying electricity to the heat sink fin 110. The fixing base 130 may be provided with a wire 131, wherein the wire 131 is electrically connected to the electrode terminal 111 inside the fixing base 130, and is connected to an external power source outside the fixing base 130 to provide power to the heat dissipating fin 110.
Optionally, the heat dissipating device 100 includes a plurality of heat dissipating fins 110, the plurality of heat dissipating fins 110 connected to the fixing base 130 are configured to be controlled together, the voltage of each of the plurality of heat dissipating fins 110 connected to the fixing base 130 is equal, and the vibration amplitude and the vibration frequency of each of the plurality of heat dissipating fins 110 connected to the fixing base 130 are equal. Each of the plurality of heat dissipation fins 110 connected to the fixing base 130 may also be configured to be controlled independently, and the voltage magnitude of each of the plurality of heat dissipation fins 110 connected to the fixing base 130 is not equal, so that the vibration amplitude and the vibration frequency of each of the plurality of heat dissipation fins 110 connected to the fixing base 130 are not equal.
Alternatively, the wires 131 are electrically connected to the circuit board 200 in fig. 5, and a DC-AC conversion circuit (not shown) may be provided on the circuit board 200. And the circuit board 200 is electrically connected to a battery of the electronic device, the DC-AC conversion circuit can convert direct current in the battery into alternating current, and the circuit board 200 inputs the alternating current into the heat dissipation fins 110 through the wires 131 to cause the heat dissipation fins 110 to vibrate periodically.
As shown in fig. 6, the heat dissipating fins 110 are driven by the electric field to generate wave-like vibration in the thickness direction thereof, so as to drive the air nearby to vibrate, thereby improving the heat dissipating efficiency of the heat dissipating fins 110. Optionally, the amplitude of the vibration of the heat dissipating fins 110 may be controlled by controlling the voltage applied to the heat dissipating fins 110, so as to adjust the heat dissipating rate of the heat dissipating fins 110. For example, the voltage value applied to the heat dissipating fins 110 is increased, so that the vibration amplitude of the heat dissipating fins 110 is increased, the air flow rate near the heat dissipating fins 110 is increased, and the heat dissipating rate of the heat dissipating fins 110 is increased.
Optionally, the heat dissipation device 100 is electrically connected to the circuit board 200 in fig. 5, and a temperature sensor (not shown) and a control circuit (not shown) may be further disposed on the circuit board 200. The temperature sensor is used for detecting the temperature of the circuit board 200 or the heat dissipation device 100, the temperature sensor sends the detected temperature data of the circuit board 200 or the heat dissipation device 100 to the control circuit, and the control circuit dynamically adjusts the filtering of the heat dissipation fins 110 according to the temperature data to adjust the vibration amplitude of the heat dissipation fins 110, so as to adjust the heat dissipation rate of the heat dissipation device 100.
In the present embodiment, the number of the heat dissipation fins 110 is plural, and may be 6, 7, 8, or the like, for example. Increasing the number of the heat dissipation fins 110 can improve the heat dissipation efficiency of the heat dissipation device 100. However, when the heat dissipation device 100 is applied to an electronic device, the space inside the electronic device is limited and cannot accommodate too many heat dissipation fins 110. Meanwhile, the heat dissipation fins 110 also need a certain vibration space, and too narrow intervals may cause the heat dissipation fins 110 to collide with each other during working, and the heat dissipation space is small; too large a space may make it difficult to form an air flow and the heat dissipation effect may be poor. Therefore, in the embodiment, the spacing distance of each of the heat dissipation fins 110 is equal, and the spacing is greater than the vibration amplitude of the heat dissipation fins 110, so that the heat dissipation fins 110 do not collide with each other, and the heat dissipation effect is the best.
In practical applications, the heat dissipation device 100 dissipates heat through vibration of the heat dissipation fins 110. However, the vibration generated by the heat dissipation fins 110 inevitably generates noise, which affects the user experience. Therefore, in other embodiments, as shown in fig. 7, the heat dissipating fins 110 include a plurality of heat dissipating fins 110, each of the heat dissipating fins 110 has a non-uniform spacing, wherein a pair of adjacent heat dissipating fins 110 has a spacing size of L1, another pair of adjacent heat dissipating fins 110 has a spacing size of L2, L1 is not equal to L2, and the spacing sizes are all larger than the vibration amplitude of the heat dissipating fins 110. The sizes of the intervals between the heat dissipation fins 110 are not equal, so that the amplitudes of the noise generated between the adjacent heat dissipation fins 110 are different in the process of reciprocating vibration of the plurality of heat dissipation fins 110, thereby reducing the noise.
Alternatively, in still another embodiment of the present application, as shown in fig. 8, the heat dissipating fins 110 include a plurality of heat dissipating fins 110, and the vibration phase of each of the heat dissipating fins 110 is different. Therefore, in the process of reciprocating vibration of the heat dissipation fins 110, the positive and negative amplitudes of the noise generated at the adjacent heat dissipation fins 110 are not completely the same at the same time, and further, the positive and negative amplitudes of the noise generated at different heat dissipation fins 110 are mutually offset at the same time, so as to reduce the noise. The vibration phase of the heat dissipating fins 110 can be controlled by adjusting the frequency of each current flowing through the heat dissipating fins 110.
In further embodiments of the present disclosure, the plurality of heat dissipation fins 110 may further have different thicknesses, or the plurality of heat dissipation fins 110 are not parallel to each other, so that amplitudes of noise generated by different heat dissipation fins 110 at the same time are different, and the amplitudes of noise generated by different heat dissipation fins 110 are mutually offset to reduce the noise, which is not limited in the present disclosure.
In summary, the present application provides a heat dissipation apparatus and an electronic device, in which the heat dissipation fins drive nearby air to flow through vibration. The air flow is generated by the air flow, and the heat is quickly dissipated under the action of the air flow, so that the heat dissipation efficiency of the heat dissipation device is improved. Benefits that can be achieved include, but are not limited to: the heat dissipation effect of the heat dissipation device is obvious, and the heat dissipation efficiency is high; the heat dissipation device occupies small space and meets the requirements of light and thin electronic equipment; the vibration amplitude of the radiating fins can be adjusted to adjust the radiating rate of the radiating device; the distance and the vibration phase of the radiating fins can be adjusted to adjust the noise generated by heat radiation, reduce the noise and the like.
The embodiments of the present application may be subject to various modifications and alterations without departing from the spirit and scope of the present invention. Therefore, it should be understood that the embodiments of the present application should not be limited to the exemplary embodiments described above, but should be controlled by the limitations set forth in the claims and any equivalents thereof. All the equivalent structures or equivalent processes performed by using the contents of the specification and the drawings of the present application, or directly or indirectly applied to other related technical fields, are included in the scope of protection of the present application.
Claims (10)
1. A heat dissipating device, comprising:
the heat dissipation base is used for being connected with a heat source;
the radiating fins are arranged on the radiating base;
the heat dissipation base transfers the heat energy of the heat source to the heat dissipation fins, and the heat dissipation fins can vibrate to drive air to flow, so that the heat dissipation efficiency of the heat dissipation fins is improved.
2. The heat dissipating device of claim 1,
the material of the radiating fin is piezoelectric ceramics, and the piezoelectric ceramics vibrate when electrified.
3. The heat dissipating device of claim 2,
the heat dissipation device further comprises a fixed seat, the heat dissipation fins are inserted into the fixed seat, and the fixed seat is fixedly connected with the heat dissipation base so as to install the heat dissipation fins on the heat dissipation base.
4. The heat dissipating device of claim 3,
the fixing seat is provided with a lead, the part of the heat dissipation fin inserted in the fixing seat is provided with an electrode terminal, the electrode terminal is connected with the lead, and the lead is used for connecting a power supply to supply power to the heat dissipation fin.
5. The heat dissipating device of claim 1,
the heat dissipation device comprises a plurality of heat dissipation fins which are arranged in parallel and at intervals.
6. The heat dissipating device of claim 5,
the plurality of radiating fins are equal in interval.
7. The heat dissipating device of claim 5,
the interval sizes of the plurality of radiating fins are not completely equal.
8. The heat dissipating device of claim 5,
among the plurality of radiating fins, the vibration phases of two adjacent radiating fins are different.
9. The heat dissipating device according to any one of claims 1 to 8,
and heat-conducting paint is sprayed on the surfaces of the radiating fins.
10. An electronic device, comprising:
the heat dissipating device of claims 1-9;
the circuit board is connected with the heat dissipation device, and the heat dissipation device is used for dissipating heat of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110897197.3A CN113692182A (en) | 2021-08-05 | 2021-08-05 | Heat dissipation device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110897197.3A CN113692182A (en) | 2021-08-05 | 2021-08-05 | Heat dissipation device and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN113692182A true CN113692182A (en) | 2021-11-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110897197.3A Pending CN113692182A (en) | 2021-08-05 | 2021-08-05 | Heat dissipation device and electronic equipment |
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| CN (1) | CN113692182A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114584856A (en) * | 2022-05-05 | 2022-06-03 | 中兴通讯股份有限公司 | Heat abstractor, base station equipment |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4210778A (en) * | 1977-06-08 | 1980-07-01 | Sony Corporation | Loudspeaker system with heat pipe |
| JPH0697336A (en) * | 1992-09-17 | 1994-04-08 | Toshiba Corp | Radiating device and semiconductor device using same |
| JPH09324992A (en) * | 1996-06-06 | 1997-12-16 | Fuji Electric Co Ltd | Radiation fins of heat pipe |
| KR20060033452A (en) * | 2004-10-15 | 2006-04-19 | 삼성에스디아이 주식회사 | Plasma display apparatus |
| WO2011105800A2 (en) * | 2010-02-23 | 2011-09-01 | 한국과학기술원 | Heat sink including a heat-dissipation fin capable of vibrating |
| KR20110115796A (en) * | 2010-04-16 | 2011-10-24 | 삼성엘이디 주식회사 | Heat sink |
| JP2015027144A (en) * | 2013-07-25 | 2015-02-05 | 三菱電機株式会社 | Motor drive device |
| CN104881099A (en) * | 2014-02-28 | 2015-09-02 | 联想(北京)有限公司 | Piezoelectric ceramic heat radiation device and electronic equipment comprising same |
| CN105283041A (en) * | 2015-10-26 | 2016-01-27 | 南京航空航天大学 | Piezoelectric driven rapid cooling device |
| CN107806430A (en) * | 2017-11-02 | 2018-03-16 | 北京小米移动软件有限公司 | Piezoelectric fan, radiator and electronic equipment |
| CN112351634A (en) * | 2019-08-07 | 2021-02-09 | 杭州海康威视数字技术股份有限公司 | Heat dissipation device and electronic equipment |
| CN212876500U (en) * | 2020-09-22 | 2021-04-02 | 昆山双仔电子科技有限公司 | High-efficient heat dissipation module |
| CN112954946A (en) * | 2019-11-26 | 2021-06-11 | 杭州海康威视数字技术股份有限公司 | Heat radiation member and electronic device |
| CN113099707A (en) * | 2021-05-21 | 2021-07-09 | 苏州格曼斯温控科技有限公司 | Heat dissipation device and equipment |
-
2021
- 2021-08-05 CN CN202110897197.3A patent/CN113692182A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4210778A (en) * | 1977-06-08 | 1980-07-01 | Sony Corporation | Loudspeaker system with heat pipe |
| JPH0697336A (en) * | 1992-09-17 | 1994-04-08 | Toshiba Corp | Radiating device and semiconductor device using same |
| JPH09324992A (en) * | 1996-06-06 | 1997-12-16 | Fuji Electric Co Ltd | Radiation fins of heat pipe |
| KR20060033452A (en) * | 2004-10-15 | 2006-04-19 | 삼성에스디아이 주식회사 | Plasma display apparatus |
| WO2011105800A2 (en) * | 2010-02-23 | 2011-09-01 | 한국과학기술원 | Heat sink including a heat-dissipation fin capable of vibrating |
| KR20110115796A (en) * | 2010-04-16 | 2011-10-24 | 삼성엘이디 주식회사 | Heat sink |
| JP2015027144A (en) * | 2013-07-25 | 2015-02-05 | 三菱電機株式会社 | Motor drive device |
| CN104881099A (en) * | 2014-02-28 | 2015-09-02 | 联想(北京)有限公司 | Piezoelectric ceramic heat radiation device and electronic equipment comprising same |
| CN105283041A (en) * | 2015-10-26 | 2016-01-27 | 南京航空航天大学 | Piezoelectric driven rapid cooling device |
| CN107806430A (en) * | 2017-11-02 | 2018-03-16 | 北京小米移动软件有限公司 | Piezoelectric fan, radiator and electronic equipment |
| CN112351634A (en) * | 2019-08-07 | 2021-02-09 | 杭州海康威视数字技术股份有限公司 | Heat dissipation device and electronic equipment |
| CN112954946A (en) * | 2019-11-26 | 2021-06-11 | 杭州海康威视数字技术股份有限公司 | Heat radiation member and electronic device |
| CN212876500U (en) * | 2020-09-22 | 2021-04-02 | 昆山双仔电子科技有限公司 | High-efficient heat dissipation module |
| CN113099707A (en) * | 2021-05-21 | 2021-07-09 | 苏州格曼斯温控科技有限公司 | Heat dissipation device and equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114584856A (en) * | 2022-05-05 | 2022-06-03 | 中兴通讯股份有限公司 | Heat abstractor, base station equipment |
| WO2023213235A1 (en) * | 2022-05-05 | 2023-11-09 | 中兴通讯股份有限公司 | Heat dissipation apparatus and base station device |
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