CN112351634A - Heat dissipation device and electronic equipment - Google Patents
Heat dissipation device and electronic equipment Download PDFInfo
- Publication number
- CN112351634A CN112351634A CN201910727071.4A CN201910727071A CN112351634A CN 112351634 A CN112351634 A CN 112351634A CN 201910727071 A CN201910727071 A CN 201910727071A CN 112351634 A CN112351634 A CN 112351634A
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- Prior art keywords
- heat
- heat dissipating
- heat dissipation
- inverse piezoelectric
- elastic sheet
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 58
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 239000000919 ceramic Substances 0.000 claims description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 14
- 229910021389 graphene Inorganic materials 0.000 claims description 14
- 239000011162 core material Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D33/00—Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Abstract
The application discloses heat abstractor and electronic equipment. The heat dissipating double-fuselage includes: the heat dissipation structure comprises a heat conduction block and heat dissipation blades, wherein the first ends of the heat dissipation blades are installation ends, the second ends of the heat dissipation blades are free ends, and inverse piezoelectric elastic sheets are installed on the first ends of the heat dissipation blades. The root of the first end of the radiating blade and the root of the inverse piezoelectric elastic sheet are fixedly arranged on the heat conducting block, so that the radiating blade vibrates under the driving of the inverse piezoelectric elastic sheet. The heat dissipation device of the invention uses the inverse piezoelectric elastic sheet to drive the heat dissipation blades to vibrate at high frequency, improves the convection heat transfer coefficient so as to realize high-efficiency heat dissipation, and does not comprise mechanical components such as bearings and the like, thereby having longer service life.
Description
Technical Field
The application relates to the field of electronic components, in particular to a heat dissipation device. The application also relates to an electronic device comprising such a heat sink.
Background
Electronic equipment generates heat during use, which causes performance degradation of the electronic equipment, and heat dissipation of the electronic equipment is required for this purpose. For example, a fan with a conventional motor to drive a rotating pattern of blades may be used to force air cool the electronic device. However, such a conventional fan is limited by mechanical members such as bearings and has a short service life.
Disclosure of Invention
In order to solve the above problems, the present invention provides a heat dissipation device. The heat dissipation device of the invention uses the inverse piezoelectric elastic sheet to drive the heat dissipation blades to vibrate at high frequency, improves the convection heat transfer coefficient so as to realize high-efficiency heat dissipation, and does not comprise mechanical components such as bearings and the like, thereby having longer service life.
The heat dissipating device according to the first aspect of the present invention comprises: the radiating fin comprises a heat conducting block and a radiating fin, wherein the first end of the radiating fin is a mounting end, the second end of the radiating fin is a free end, and an inverse piezoelectric elastic sheet is mounted on the first end of the radiating fin and generates vibration under the action of current, wherein the root of the first end of the radiating fin and the root of the inverse piezoelectric elastic sheet are fixedly mounted on the heat conducting block, so that the radiating fin vibrates under the driving of the inverse piezoelectric elastic sheet.
In one embodiment, the heat dissipation fin is a laminated structure of an elastic heat-conducting metal sheet and a graphene layer.
In one embodiment, the thermally conductive metal sheet is a core material, and graphene layers are formed on both surfaces of the thermally conductive metal sheet.
In one embodiment, the inverse piezoelectric elastic sheet includes an elastic metal sheet body as a core material and inverse piezoelectric ceramic sheets disposed on both surfaces of the elastic metal sheet body, the inverse piezoelectric ceramic sheets receiving an alternating current to be deformed to vibrate the inverse piezoelectric elastic sheet.
In one embodiment, the heat dissipation device further comprises a lead electrically connected with the inverse piezoelectric ceramic plate to provide alternating current for the inverse piezoelectric ceramic plate.
In one embodiment, the inverse piezoelectric elastic pieces are mounted on both surfaces of the first end of the heat dissipating fin.
In one embodiment, the heat dissipating device has a plurality of heat dissipating fins, and the plurality of heat dissipating fins are dispersedly mounted on the heat conductive block and vibrate in the same plane.
In one embodiment, the number of the heat dissipation blades is two, and the two heat dissipation blades are arranged on two sides of the heat conduction block in a facing manner or in a staggered manner.
In one embodiment, the number of the heat dissipation blades is more than two, and the heat dissipation blades are arranged on two sides of the heat conduction block in a staggered mode or in a facing mode.
An electronic device according to a second aspect of the present invention includes a circuit board, a heat generating member on the circuit board, and the heat dissipating device according to the above, wherein the heat dissipating device is mounted on the circuit board in such a manner that the heat conducting block is closely attached to the heat generating member.
Compared with the prior art, the invention has the following beneficial effects: (1) the heat dissipation device of the invention uses the inverse piezoelectric elastic sheet to drive the heat dissipation blades to vibrate at high frequency, improves the convection heat transfer coefficient so as to realize high-efficiency heat dissipation, and does not comprise mechanical components such as bearings and the like, thereby having longer service life. (2) The heat dissipation device of the invention has smaller volume and smaller mass, and is particularly suitable for being used on small electronic products with limited heat dissipation area.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 schematically shows the structure of a heat dissipating device according to an embodiment of the present invention.
Fig. 2 is an enlarged view of a portion a of fig. 1.
Fig. 3 schematically shows the structure of a heat dissipating fin of the heat dissipating device.
Fig. 4 schematically shows the structure of the reverse piezoelectric elastic sheet of the heat dissipating device.
Fig. 5 schematically shows the structure of a heat dissipating device according to another embodiment of the present invention.
Fig. 6 schematically shows the structure of a heat dissipating device according to still another embodiment of the present invention.
Fig. 7 schematically shows a variation of the heat sink shown in fig. 5.
Fig. 8 schematically shows a variation of the heat sink shown in fig. 6.
Fig. 9 schematically shows an electronic device according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 1 schematically shows the structure of a heat dissipating device 1 according to an embodiment of the present invention. As shown in fig. 1, the heat sink 1 includes a heat conduction block 100 and a heat dissipation blade 200 mounted on the heat conduction block 100. The first end 201 of the heat dissipating fin 200 is a mounting end, and the second end 202 is a free end. The reverse piezoelectric elastic sheet 300 is attached to the first end 201 of the radiating fin 200. The root 203 of the first end 201 of the heat dissipating fin 200 and the root 303 of the inverse piezoelectric elastic sheet 300 are fixedly mounted on the heat conducting block 100, so that the heat dissipating fin 200 vibrates under the driving of the inverse piezoelectric elastic sheet 300.
The heat conduction block 100 may be used as a base of the heat dissipation device 1, for example, when the heat dissipation device 1 is used, the heat conduction block 100 is attached to a device to be dissipated, thereby completing the installation of the heat dissipation device 1. When the device to be heat-dissipated is heat-dissipated, the heat conduction block 100 receives heat generated by the device to be heat-dissipated and transfers the heat to the heat dissipation blade 200. Under the driving of the inverse piezoelectric elastic sheet 300, the heat dissipation blade 200 vibrates at a high frequency and stirs the air around the heat dissipation blade 200, which increases the heat convection coefficient between the heat dissipation blade 200 and the surrounding air, so that the heat dissipation blade 200 can quickly dissipate heat to the surrounding air. This achieves a rapid heat dissipation effect of the heat dissipation device 1. In one embodiment, the heat conducting block 100 is an aluminum alloy to improve its heat transfer capability.
In addition, since such a heat sink 1 does not use a mechanical member such as a bearing, its service life is long. In addition, the heat dissipation device 1 has small volume and small mass, and is particularly suitable for being used on small electronic products with limited heat dissipation area.
Fig. 2 is an enlarged view of a portion a of fig. 1, schematically showing a mounting structure of a heat dissipating fin 200 on the heat conductive block 100. As shown in fig. 2, a mounting groove 101 is configured on a side surface of the heat conduction block 100, and the heat radiating fin 200 is fixedly mounted in the mounting groove 101 together with the inverse piezoelectric elastic sheet 300 mounted thereon. Specifically, the root 203 of the first end 201 of the cooling fin 200 (the root 303 of the counter-piezoelectric elastic piece 300 coincides with the root 203) is fixedly mounted in the mounting groove 101. It should be understood that the root 203 of the heat dissipating blade 200 is smaller as long as the heat dissipating blade 200 can be fixedly installed in the installation groove 101, so that the amplitude of the second end 202 of the heat dissipating blade 200 is larger, thereby contributing to the improvement of the heat dissipating capability of the heat dissipating device 1.
Preferably, the inverse piezoelectric elastic sheet 300 is mounted on both surfaces of the first end 201 of the radiating fin 200. Thus, the vibration driving force of the heat dissipating fins 200 is greater, thereby contributing to an improvement in the heat dissipating capability of the heat dissipating device 1.
In one embodiment, the heat sink 1 has a plurality of heat radiating fins 200, and the plurality of heat radiating fins 200 are dispersedly mounted on the heat conducting block 100 and vibrate in the same plane. In this way, the plurality of heat dissipating fins 200 each perform a heat dissipating function, so that the heat dissipating capability of the heat dissipating device 1 can be greatly improved. It should be noted that the number of the heat dissipating fins 200 may be two or more.
In the embodiment shown in fig. 5, the number of the heat dissipating fins 200 is two, and two heat dissipating fins 200 are arranged oppositely on both sides of the heat conducting block 100. As a whole, the two heat dissipating fins 200 are symmetrically arranged with respect to the heat conducting block 100. In another embodiment, two cooling fins 200 may be arranged in a staggered manner, as shown in fig. 7. In this way, the forces generated by the two heat dissipation fins 200 on both sides of the heat conduction block 100 during vibration can be offset, thereby preventing the heat dissipation device 1 from being damaged. In the case of the staggered arrangement, the accuracy requirement for the assembly position of the heat dissipating blades 200 is low, thereby reducing the manufacturing difficulty of the heat dissipating device 1.
The number of the heat dissipation fins 200 may be more and arranged at both sides of the heat conduction block 200. In one embodiment, the heat dissipating fins 200 are disposed to face each other on both sides of the heat conducting block 100, as shown in fig. 8. In this way, the forces generated by the heat dissipation fins 200 on both sides of the heat conduction block 100 during vibration can be offset, thereby preventing the heat dissipation device 1 from being damaged. In another embodiment, the heat dissipating fins 200 may be disposed on both sides of the heat conducting block 100 in a staggered manner, as shown in fig. 6. Thus, the accuracy requirement for the assembling position of the heat dissipating blades 200 is low, thereby reducing the difficulty in manufacturing the heat dissipating device 1. It should be noted that, in this case, the size of the gap between the heat dissipating blades 200 on the same side as the heat conducting block 100 should be larger than the amplitude of the heat dissipating blades 200 to prevent the heat dissipating blades 200 from interfering when vibrating. In addition, for the embodiment shown in fig. 6 and 8, each cooling fin 200 is driven by a separate anti-piezoelectric elastic sheet 300 to facilitate control and maintenance of each cooling fin 200, respectively.
The heat dissipation fins 200 are a laminated structure of elastic heat conductive metal sheets 204 and graphene layers 205. In the embodiment shown in fig. 3, the elastic heat-conducting metal sheet 204 is a core material and is in direct heat-conducting contact with the heat-conducting block 100; graphene layers 205 are formed on both surfaces of the elastic heat-conductive metal sheet body 204, and the graphene layers 205 are spaced apart from the heat-conductive block 100. Since the elastic heat-conducting metal sheet 204 and the graphene layer 205 both have good heat-conducting properties, the heat of the heat-conducting block 100 can be quickly transferred to the elastic heat-conducting metal sheet 204, and then the heat can be quickly dissipated to the surrounding air by the high-frequency vibration of the heat-dissipating blades 200, so that the quick heat dissipation effect of the heat dissipation device 1 is realized. In one embodiment, the graphene layer 205 is a separate sheet and is attached to the elastic heat-conducting metal sheet 204 by a heat-conducting adhesive. The graphene layer 205 may also be in direct contact with the thermal block 100, so that part of the heat of the thermal block 100 may also be directly transferred to the graphene layer 205, thereby further facilitating heat dissipation. In addition, the elasticity of the graphene layer 205 is good, so that the graphene layer 205 is not damaged in the vibration process of the cooling fin 200.
In one embodiment, the elastic thermal conductive metal sheet 204 is a 0.4mm thick steel sheet, the graphene layer 205 has a thickness of 0.1mm, the total length of the elastic thermal conductive metal sheet 204 is 55mm, the reverse piezoelectric elastic sheet 300 has a length of 25mm, and the root 203 has a length of 5 mm. The inventors have found that the combination of the elastic heat-conducting metal sheet 204 and the inverse piezoelectric elastic sheet 300 enables the heat sink 200 to vibrate with appropriate amplitude and vibration frequency, so that the heat sink 1 has high heat dissipation effect.
Fig. 4 schematically shows the structure of the reverse piezoelectric elastic sheet 300. As shown in fig. 4, the inverse piezoelectric elastic sheet 300 includes an elastic metal sheet 303 as a core material and inverse piezoelectric ceramic sheets 304 respectively provided on both surfaces of the elastic metal sheet 303. The inverse piezoceramic wafer 304 is deformed by the alternating electric field. For example, the heat sink 1 includes a lead 305 electrically connected to the piezoelectric ceramic sheet 304 to supply an alternating current to the piezoelectric ceramic sheet 304, thereby vibrating the piezoelectric ceramic sheet 300. It should be understood that the frequencies of the alternating currents applied to the inverse piezoelectric ceramic plates 304 on both surfaces of the elastic metal sheet body 303 should be matched with each other so that the deformations of the two inverse piezoelectric ceramic plates 304 are matched with each other to generate high-frequency vibrations of the inverse piezoelectric ceramic plates 300.
In one embodiment, the resilient metal sheet 303 may be a steel sheet. In another embodiment, the inverse piezoelectric ceramic sheet 304 may be a doped or undoped barium titanate-based, lead zirconate titanate-based piezoelectric ceramic material, such as Pb (Mn)1/3Nb2/3)O3It may be a metaniobate-based piezoelectric ceramic such as potassium sodium metaniobate (Na)0.5·K0.5·NbO3)。
Fig. 9 schematically shows an electronic device 7 according to an embodiment of the invention. The electronic device 7 may be a small, heat-dissipation area limited electronic product, such as a door entry, a doorbell, a mobile device (e.g., a law enforcement recorder, a tachograph, a thermal imager), a camera, and the like.
The electronic device 7 comprises a circuit board 700, a heat generating element 701 on the circuit board 700, and a heat sink 1 according to the above. The heat sink 1 is mounted on the circuit board 700 in such a manner that the heat-conducting block 100 is closely attached to the heat generating member 701. The heat generating member 701 may be, for example, a processor.
When the heating member 701 generates heat during operation, the heat conduction block 100 receives the heat generated by the heating member 701 and transfers the heat to the heat dissipation blade 200. Under the driving of the inverse piezoelectric elastic sheet 300, the heat dissipation blade 200 vibrates at a high frequency and stirs the air around the heat dissipation blade to exchange heat with the air around the heat dissipation blade, so that the heat dissipation blade 200 can quickly dissipate the heat into the air around the heat dissipation blade. Thus, the heat sink 1 can quickly dissipate the heat generated from the heat generating member 701.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. A heat dissipating device, comprising:
a heat-conducting block,
a radiating fin, the first end of the radiating fin is a mounting end, the second end is a free end,
a reverse piezoelectric elastic sheet mounted on the first end of the heat dissipating fin, the reverse piezoelectric elastic sheet vibrating under the action of current,
the root of the first end of the radiating blade and the root of the inverse piezoelectric elastic sheet are fixedly arranged on the heat conducting block, so that the radiating blade vibrates under the driving of the inverse piezoelectric elastic sheet.
2. The heat dissipating device of claim 1, wherein the heat dissipating fins are a laminated structure of an elastic heat conductive metal sheet and a graphene layer.
3. The heat dissipating device as claimed in claim 2, wherein the thermally conductive metal sheet is a core material, and graphene layers are formed on both surfaces of the thermally conductive metal sheet.
4. The heat dissipating device as claimed in claim 1, wherein the inverse piezoelectric elastic sheet comprises an elastic metal sheet body as a core material and inverse piezoelectric ceramic sheets disposed on both surfaces of the elastic metal sheet body, the inverse piezoelectric ceramic sheets receiving an alternating current to be deformed to vibrate the inverse piezoelectric elastic sheet.
5. The heat dissipating device of claim 4, further comprising a wire electrically connected to the piezoelectric ceramic sheet to provide alternating current to the piezoelectric ceramic sheet.
6. The heat dissipating device of claim 5, wherein the inverse piezoelectric elastic sheet is mounted on both surfaces of the first end of the heat dissipating fin.
7. The heat dissipating device according to any one of claims 1 to 6, wherein the heat dissipating device has a plurality of heat dissipating fins, and the plurality of heat dissipating fins are dispersedly mounted on the heat conducting block and vibrate in the same plane.
8. The heat dissipating device according to any one of claims 1 to 6, wherein the number of the heat dissipating fins is two, and the two heat dissipating fins are disposed in a facing manner or in a staggered manner on both sides of the heat conducting block.
9. The heat dissipating device as claimed in any one of claims 1 to 6, wherein the number of the heat dissipating fins is greater than two, and the heat dissipating fins are disposed in a staggered manner or in a facing manner on both sides of the heat conducting block.
10. An electronic apparatus, comprising a circuit board, a heat generating member on the circuit board, and the heat dissipating device according to any one of claims 1 to 9,
the heat dissipation device is arranged on the circuit board in a mode that the heat conduction block is tightly attached to the heating piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910727071.4A CN112351634B (en) | 2019-08-07 | 2019-08-07 | Heat dissipation device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910727071.4A CN112351634B (en) | 2019-08-07 | 2019-08-07 | Heat dissipation device and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN112351634A true CN112351634A (en) | 2021-02-09 |
| CN112351634B CN112351634B (en) | 2022-08-23 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910727071.4A Active CN112351634B (en) | 2019-08-07 | 2019-08-07 | Heat dissipation device and electronic equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113692182A (en) * | 2021-08-05 | 2021-11-23 | Oppo广东移动通信有限公司 | Heat dissipation device and electronic equipment |
| CN114584856A (en) * | 2022-05-05 | 2022-06-03 | 中兴通讯股份有限公司 | Heat abstractor, base station equipment |
| CN118143450A (en) * | 2023-08-24 | 2024-06-07 | 东莞市迪奥数控设备有限公司 | Laser engraving and milling machine |
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