CN113692125A - Production process of S-shaped infinite-length single-sided flexible circuit board - Google Patents
Production process of S-shaped infinite-length single-sided flexible circuit board Download PDFInfo
- Publication number
- CN113692125A CN113692125A CN202110903362.1A CN202110903362A CN113692125A CN 113692125 A CN113692125 A CN 113692125A CN 202110903362 A CN202110903362 A CN 202110903362A CN 113692125 A CN113692125 A CN 113692125A
- Authority
- CN
- China
- Prior art keywords
- film
- dry film
- copper
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000011324 bead Substances 0.000 claims abstract description 10
- 238000007650 screen-printing Methods 0.000 claims abstract description 10
- 238000005520 cutting process Methods 0.000 claims abstract description 9
- 238000005530 etching Methods 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 239000011889 copper foil Substances 0.000 claims description 18
- 239000003814 drug Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention aims to provide the production process of the S-shaped infinite-length single-sided flexible circuit board, which can cut circuit boards with various length specifications so as to greatly improve the delivery efficiency. The invention comprises the following steps: a. selecting materials; b. opening a hole; c. pasting a dry film, d, film alignment, e and exposure; f. developing; g. etching; h. demoulding; i. silk-screen printing; j. welding lamp beads; K. and (6) cutting. The invention is applied to the technical field of circuit board production.
Description
Technical Field
The invention relates to a production process of a circuit board, in particular to a production process of an S-shaped infinite-length single-sided flexible circuit board.
Background
The flexible circuit board is a printed circuit board, called a flexible printed circuit board or an FPC for short, which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility, and has the characteristics of high wiring density, light weight and thin thickness. At present, in the production process of flexible circuit boards, most of the flexible circuit boards are manufactured according to designed length specifications, but when customers demand other flexible circuit boards with different length specifications, the customers need to design and manufacture corresponding circuit boards again, or the previously manufactured circuit boards are spliced together, so that the production process is complicated, and the delivery efficiency is slow. If the production process of the S-shaped infinite-length single-sided flexible circuit board can be designed, which can cut circuit boards with various length specifications, thereby greatly improving the delivery efficiency, the problems can be well solved.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides the production process of the S-shaped infinite-length single-sided flexible circuit board, which can cut circuit boards with various length specifications so as to greatly improve the delivery efficiency.
The technical scheme adopted by the invention is as follows: the invention comprises the following steps:
a. selecting materials: the selected copper-clad plate, the selected dry film and the selected film negative plate are coiled materials, the copper-clad plate is formed by laminating copper foils and base materials, and the copper-clad plate, the selected dry film and the selected film negative plate are respectively fed by three uncoilers;
b. opening a hole: continuously forming a plurality of S-shaped through holes which are arranged in an array on the copper-clad plate;
c. pasting a dry film: continuously pasting the dry film on the copper foil;
d. film alignment: transferring the graph of the flexible circuit board to the film negative through optical drawing equipment, and continuously pasting the film negative on the dry film;
e. exposure: irradiating the film negative by utilizing an ultraviolet ray, wherein the film negative is provided with a light-tight part, a plurality of first light-transmitting parts and a plurality of second light-transmitting parts, the left end and the right end of each second light-transmitting part are respectively connected with the two first light-transmitting parts, and the light transmitted by the second light-transmitting parts enables the corresponding dry film part to be subjected to photosensitive change, so that the graph on the film negative is transferred to the dry film;
f. and (3) developing: removing the exposed film, and dissolving the dry film which is not sensitive by using a developing solution, wherein the sensitive dry film is still attached to the copper foil;
g. etching: dissolving the copper foil without the dry film protection by using etching liquid medicine, so that the copper foil with the dry film protection is kept on the base material, the kept copper foil is divided into two parts, namely a circuit structure and a connecting disc structure, and the left end and the right end of each connecting disc structure are respectively connected with the two circuit structures;
h. demoulding: dissolving the residual dry film by using a film removing liquid medicine;
i. and (3) silk-screen printing: and (3) carrying out silk-screen printing on the front surface of the copper-clad plate by using a full-automatic silk-screen printing machine, and drying the copper-clad plate through a tunnel furnace.
Further, the production process of the S-shaped infinite-length single-sided flexible circuit board further comprises the following steps: j. welding lamp beads: and a plurality of lamp beads are respectively matched in the S-shaped through holes, and pins of the lamp beads are welded on the circuit structure.
Further, the production process of the S-shaped infinite-length single-sided flexible circuit board further comprises the following steps: K. cutting: and cutting a plurality of single plates along the width direction of the copper-clad plate and the middle position of the connecting disc structure.
The invention has the beneficial effects that: the infinite-length single-sided flexible circuit board can be prepared in advance, a plurality of coiled materials are manufactured by cutting and collected, and then the prepared coiled materials are cut into circuit boards with corresponding length specifications in time according to the requirements of different customers, so that the product delivery efficiency is greatly improved, and the infinite-length single-sided flexible circuit board is suitable for large-scale production of factories.
Drawings
FIG. 1 is a process flow diagram of the present invention.
Detailed Description
As shown in fig. 1, in the present embodiment, the present invention includes the following steps:
a. selecting materials: the selected copper-clad plate, the selected dry film and the selected film negative plate are coiled materials, the copper-clad plate is formed by laminating copper foils and base materials, and the copper-clad plate, the selected dry film and the selected film negative plate are respectively fed by three uncoilers;
b. opening a hole: continuously forming a plurality of S-shaped through holes which are arranged in an array on the copper-clad plate;
c. pasting a dry film: continuously pasting the dry film on the copper foil;
d. film alignment: transferring the graph of the flexible circuit board to the film negative through optical drawing equipment, and continuously pasting the film negative on the dry film;
e. exposure: irradiating the film negative by utilizing an ultraviolet ray, wherein the film negative is provided with a light-tight part, a plurality of first light-transmitting parts and a plurality of second light-transmitting parts, the left end and the right end of each second light-transmitting part are respectively connected with the two first light-transmitting parts, and the light transmitted by the second light-transmitting parts enables the corresponding dry film part to be subjected to photosensitive change, so that the graph on the film negative is transferred to the dry film;
f. and (3) developing: removing the exposed film, and dissolving the dry film which is not sensitive by using a developing solution, wherein the sensitive dry film is still attached to the copper foil;
g. etching: dissolving the copper foil without the dry film protection by using etching liquid medicine, so that the copper foil with the dry film protection is kept on the base material, the kept copper foil is divided into two parts, namely a circuit structure and a connecting disc structure, and the left end and the right end of each connecting disc structure are respectively connected with the two circuit structures;
h. demoulding: dissolving the residual dry film by using a film removing liquid medicine;
i. and (3) silk-screen printing: performing silk-screen printing on the front surface of the copper-clad plate by using a full-automatic silk-screen printing machine, and drying the copper-clad plate through a tunnel furnace;
j. welding lamp beads: a plurality of lamp beads are respectively matched in a plurality of S-shaped through holes, and pins of the lamp beads are welded on the circuit structure;
K. cutting: and cutting a plurality of single plates along the width direction of the copper-clad plate and the middle position of the connecting disc structure.
In this embodiment, the infinite-length single-sided flexible circuit board of the present invention can be prepared in advance, and a plurality of coils are manufactured by cutting and collected, and then the prepared coils are cut into circuit boards with corresponding length specifications in time according to the requirements of different customers, so that the product delivery efficiency is greatly improved, and the present invention is suitable for large-scale production in factories.
Claims (3)
- The production process of the S-shaped infinite-length single-sided flexible circuit board is characterized by comprising the following steps of: it comprises the following steps:a. selecting materials: the selected copper-clad plate, the selected dry film and the selected film negative plate are coiled materials, the copper-clad plate is formed by laminating copper foils and base materials, and the copper-clad plate, the selected dry film and the selected film negative plate are respectively fed by three uncoilers;b. opening a hole: continuously forming a plurality of S-shaped through holes which are arranged in an array on the copper-clad plate;c. pasting a dry film: continuously pasting the dry film on the copper foil;d. film alignment: transferring the graph of the flexible circuit board to the film negative through optical drawing equipment, and continuously pasting the film negative on the dry film;e. exposure: irradiating the film negative by utilizing an ultraviolet ray, wherein the film negative is provided with a light-tight part, a plurality of first light-transmitting parts and a plurality of second light-transmitting parts, the left end and the right end of each second light-transmitting part are respectively connected with the two first light-transmitting parts, and the light transmitted by the second light-transmitting parts enables the corresponding dry film part to be subjected to photosensitive change, so that the graph on the film negative is transferred to the dry film;f. and (3) developing: removing the exposed film, and dissolving the dry film which is not sensitive by using a developing solution, wherein the sensitive dry film is still attached to the copper foil;g. etching: dissolving the copper foil without the dry film protection by using etching liquid medicine, so that the copper foil with the dry film protection is kept on the base material, the kept copper foil is divided into two parts, namely a circuit structure and a connecting disc structure, and the left end and the right end of each connecting disc structure are respectively connected with the two circuit structures;h. demoulding: dissolving the residual dry film by using a film removing liquid medicine;i. and (3) silk-screen printing: and (3) carrying out silk-screen printing on the front surface of the copper-clad plate by using a full-automatic silk-screen printing machine, and drying the copper-clad plate through a tunnel furnace.
- 2. The production process of the S-shaped infinite length single-sided flexible circuit board according to claim 1, characterized in that: the production process of the S-shaped infinite-length single-sided flexible circuit board further comprises the following steps: j. welding lamp beads: and a plurality of lamp beads are respectively matched in the S-shaped through holes, and pins of the lamp beads are welded on the circuit structure.
- 3. The production process of the S-shaped infinite length single-sided flexible circuit board according to claim 2, characterized in that: the production process of the S-shaped infinite-length single-sided flexible circuit board further comprises the following steps: K. cutting: and cutting a plurality of single plates along the width direction of the copper-clad plate and the middle position of the connecting disc structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110903362.1A CN113692125A (en) | 2021-08-06 | 2021-08-06 | Production process of S-shaped infinite-length single-sided flexible circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110903362.1A CN113692125A (en) | 2021-08-06 | 2021-08-06 | Production process of S-shaped infinite-length single-sided flexible circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113692125A true CN113692125A (en) | 2021-11-23 |
Family
ID=78579112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110903362.1A Pending CN113692125A (en) | 2021-08-06 | 2021-08-06 | Production process of S-shaped infinite-length single-sided flexible circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113692125A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116347781A (en) * | 2023-05-05 | 2023-06-27 | 苏州东山精密制造股份有限公司 | Single-sided circuit board, multi-layer board and manufacturing method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992020489A1 (en) * | 1991-05-21 | 1992-11-26 | Elf Technologies, Inc. | Methods and systems of preparing extended length flexible harnesses |
JP2003332392A (en) * | 2002-05-13 | 2003-11-21 | Kisho Kagi Kofun Yugenkoshi | Method for mass producing tape type flexible printed circuit |
CN101572992A (en) * | 2008-04-28 | 2009-11-04 | 王定锋 | Continuous double-sided flexible printed circuit board and LED strip |
-
2021
- 2021-08-06 CN CN202110903362.1A patent/CN113692125A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992020489A1 (en) * | 1991-05-21 | 1992-11-26 | Elf Technologies, Inc. | Methods and systems of preparing extended length flexible harnesses |
JP2003332392A (en) * | 2002-05-13 | 2003-11-21 | Kisho Kagi Kofun Yugenkoshi | Method for mass producing tape type flexible printed circuit |
CN101572992A (en) * | 2008-04-28 | 2009-11-04 | 王定锋 | Continuous double-sided flexible printed circuit board and LED strip |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116347781A (en) * | 2023-05-05 | 2023-06-27 | 苏州东山精密制造股份有限公司 | Single-sided circuit board, multi-layer board and manufacturing method thereof |
CN116347781B (en) * | 2023-05-05 | 2023-09-12 | 苏州东山精密制造股份有限公司 | Single-sided circuit board, multi-layer board and manufacturing method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101170874B (en) | Method for forming transcription circuit and method for manufacturing circuit board | |
JP4386929B2 (en) | TAB tape carrier manufacturing method | |
US9226410B2 (en) | Method of making a flexible circuit | |
CN109348637B (en) | Film alignment method for preventing incomplete etching of negative plate circuit | |
WO2017105530A1 (en) | Transparent conductive component with interconnect circuit tab comprising cured organic polymeric material | |
US8227173B2 (en) | Method of manufacturing multi-layer circuit board | |
CN113692125A (en) | Production process of S-shaped infinite-length single-sided flexible circuit board | |
CN110012605A (en) | A kind of thickness copper hollow out window FPC production method | |
CN108495486A (en) | A kind of production method and High speed rear panel of High speed rear panel | |
CN101146406B (en) | Shaping method for flexible printing line circuit | |
KR102137278B1 (en) | Method of manufacturing roll to roll FPCB with high speed punching | |
JP2011066147A (en) | Wired-circuit-board assembly sheet and method of manufacturing the same | |
TW521554B (en) | Master flexible wiring plate, photomask for the exposure in photolithography process, manufacturing method of multilayer flexible wiring plate | |
CN103687330B (en) | A kind of manufacture method of large scale butt-joint process flexible printed-circuit board | |
JP2017118037A (en) | Wiring circuit board | |
JP2006114631A (en) | Method of manufacturing wiring circuit board | |
KR20100038705A (en) | Fabricating method of printed circuit board and fabricating method of camera module using the same | |
JP5469737B2 (en) | Method for manufacturing printed circuit board assembly sheet | |
CN111901963B (en) | Method for forming welding pad on LED carrier plate | |
KR20050090341A (en) | A manufacturing method of flexible printed circuit board(fpcb) and structure of raw material therefore | |
US8268537B2 (en) | Method for manufacturing printed circuit board | |
CN114630514B (en) | Method for realizing PCB core board positioning through magnetic field | |
CN104168715A (en) | Soft board photosensitive film attaching method | |
JP3621059B2 (en) | Method of manufacturing film carrier tape for mounting multi-strip electronic component and exposure processing apparatus therefor | |
JP3154398B2 (en) | Method of manufacturing strip-shaped connecting member of lead frame for semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211123 |